Method for manufacturing a light-emitting device and a light-emitting device

Abstract

The light-emitting element is sealed using a liquid sealant. [Solution] The light-emitting device 10 comprises a package substrate 14 having an upper surface 32 and a recess 36 provided on the upper surface 32, a light-emitting element 12 provided on the bottom surface 38 of the recess 36, a liquid sealing part 16 provided in the recess 36 and immersing the light-emitting element 12, an affinity layer 20 provided on the side surface 40 of the recess 36 and in contact with the liquid sealing part 16, and a solid sealing part 18 covering the upper surface 32 of the package substrate 14 and the liquid sealing part 16.

Claims

1. Forming an affinity layer on the side surface of a recess provided on the upper surface of the package substrate, The light-emitting element is bonded to the bottom surface of the recess, The light-emitting element in the recess is immersed in a liquid sealing portion having affinity with the affinity layer, Applying a liquid thermosetting resin to cover the upper surface and the liquid sealing portion of the package substrate, The method comprises heating and curing the liquid thermosetting resin to form a solid sealing portion that seals the liquid sealing portion. A method for manufacturing a light-emitting device.

2. The liquid sealing portion is composed of fluorine oil, The affinity layer is made of fluororesin. The manufacturing method according to claim 1.

3. The solid sealing portion is made of silicone resin. The manufacturing method according to claim 2.

4. The affinity layer covers at least the side surface of the recess that is above the upper surface of the light-emitting element. The manufacturing method according to any one of claims 1 to 3.

5. The affinity layer further covers the side surface of the recess that is lower than the upper surface of the light-emitting element. The manufacturing method according to claim 4.

6. The affinity layer further covers the bottom surface of the recess. The manufacturing method according to claim 4.

7. The affinity layer further covers the light-emitting element. The manufacturing method according to any one of claims 1 to 3.

8. The affinity layer is provided so as to avoid at least a portion of the upper surface of the package substrate. The manufacturing method according to any one of claims 1 to 3.

9. A package substrate having an upper surface and a recess provided on the upper surface, A light-emitting element is provided on the bottom surface of the recess, A liquid sealing portion is provided within the recess for immersing the light-emitting element, A affinity layer is provided on the side surface of the recess and in contact with the liquid sealing portion, The package comprises the upper surface of the package substrate and a solid sealing portion that covers the liquid sealing portion, The solid sealing portion is formed by heating and curing a liquid thermosetting resin. The affinity layer has a higher affinity with the liquid sealing portion than the liquid thermosetting resin. Light-emitting device.

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