Bonding device, bonding system, bonding method, and storage medium

Abstract

To improve the bonding accuracy between substrates in bonding technology. [Solution] The bonding device is a bonding device for bonding substrates together, and comprises a first holding part, a second holding part, a moving part, a housing, a scale member, and a read head. The first holding part holds the first substrate by suction from above. The second holding part holds the second substrate by suction from below. The moving part moves one of the first and second holding parts relative to the other in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction. The housing accommodates the first holding part, the second holding part, and the moving part. The scale member is located inside the housing and has scales indicating positions in the first and second horizontal directions. The read head moves integrally with one of the first and second holding parts and measures the position of the one by reading the scale on the scale member.

Description

Technical Field

[0001] The present disclosure relates to a bonding device, a bonding system, a bonding method, and a storage medium.

Background Art

[0002] Conventionally, in order to meet the demand for high integration of semiconductor devices, it has been proposed to use a three-dimensional integration technology for laminating semiconductor devices three-dimensionally. As a system using this three-dimensional integration technology, for example, a bonding technology for bonding substrates such as semiconductor wafers is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technology capable of improving the bonding accuracy between substrates in a bonding technology for bonding substrates to each other.

Means for Solving the Problems

[0005] A bonding apparatus according to one aspect of the present disclosure is a bonding apparatus for bonding substrates together, comprising a first holding part, a second holding part, a moving part, a housing, a scale member, and a read head. The first holding part holds a first substrate by suction from above. The second holding part holds a second substrate by suction from below. The moving part moves one of the first and second holding parts relative to the other in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction. The housing accommodates the first holding part, the second holding part, and the moving part. The scale member is located inside the housing and has scales indicating positions in the first and second horizontal directions. The read head moves integrally with one of the first and second holding parts and measures the position of the one by reading the scale on the scale member. [Effects of the Invention]

[0006] According to this disclosure, in bonding technology for joining substrates together, the bonding accuracy between substrates can be improved. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic diagram showing the configuration of the joining system according to the embodiment. [Figure 2] Figure 2 is a schematic diagram showing the state of the first substrate and the second substrate before bonding according to the embodiment. [Figure 3] Figure 3 is a plan view of the joining device according to an embodiment. [Figure 4] Figure 4 is a side view of the joining device according to an embodiment. [Figure 5] Figure 5 is a side view of the first and second retaining parts according to the embodiment. [Figure 6] Figure 6 shows the configuration and positional relationship of the scale member, first read head, and second read head according to the embodiment. [Figure 7] Figure 7 is a flowchart showing the procedure of the process performed by the joining system according to the embodiment. [Modes for carrying out the invention]

[0008] The following describes in detail, with reference to the drawings, embodiments for implementing the bonding apparatus, bonding system, bonding method, and storage medium described herein. However, the present disclosure is not limited by these embodiments. Furthermore, each embodiment can be combined as appropriate, provided that the processing content is not inconsistent. Also, the same parts are denoted by the same reference numerals in each of the following embodiments, and redundant descriptions are omitted.

[0009] Furthermore, in the embodiments described below, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not require strict adherence to "constant," "orthogonal," "perpendicular," or "parallel" conditions. In other words, each of the above expressions allows for deviations, for example, in manufacturing accuracy or installation accuracy.

[0010] Furthermore, in the drawings referenced below, for the sake of clarity, mutually orthogonal X, Y, and Z axis directions are sometimes defined, and a Cartesian coordinate system is shown with the positive Z axis as the vertically upward direction. Also, the direction of rotation with the vertical axis as the center of rotation is sometimes referred to as the θ direction.

[0011] In recent years, semiconductor devices have become increasingly integrated. When multiple highly integrated semiconductor devices are arranged horizontally and connected by wiring to create a product, there are concerns that the wiring length will increase, leading to higher wiring resistance and greater wiring delay.

[0012] Therefore, it has been proposed to use 3D integration technology, which stacks semiconductor devices in three dimensions. In this 3D integration technology, for example, two semiconductor wafers (hereinafter referred to as "substrates") are joined using a bonding system described in Patent Document 1.

[0013] In the above bonding device, one substrate (hereinafter referred to as "the first substrate") is held using the first holding part, and while holding the other substrate (hereinafter referred to as "the second substrate") using the second holding part provided below the first holding part, the first substrate and the second substrate are bonded. And before bonding the substrates in this way, the second holding part is moved in the horizontal direction to adjust the horizontal positions of the first substrate and the second substrate, and further the second holding part is moved in the vertical direction to adjust the vertical positions of the first substrate and the second substrate.

[0014] In the bonding device described in the above Patent Document 1, when moving the second holding part in the horizontal direction, the horizontal position of the moving part is measured using a laser interferometer, and the moving part is controlled based on the measurement result, thereby adjusting the horizontal position of the second holding part.

[0015] In the technology of bonding substrates in this way, there is a requirement to improve the bonding accuracy between the substrates. For example, the bonding accuracy can be improved by reducing the horizontal misalignment between the first substrate and the second substrate as much as possible.

[0016] <Configuration of the bonding system> First, the configuration of the bonding system according to the embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic diagram showing the configuration of the bonding system according to the embodiment. Further, FIG. 2 is a schematic diagram showing the state before bonding the first substrate and the second substrate according to the embodiment.

[0017] The bonding system 1 shown in FIG. 1 forms a polymerized substrate T by bonding the first substrate W1 and the second substrate W2 (see FIG. 2).

[0018] The first substrate W1 and the second substrate W2 are single crystal silicon wafers, and a plurality of electronic circuits are formed on the plate surfaces. The first substrate W1 and the second substrate W2 have substantially the same diameter. Note that one of the first substrate W1 and the second substrate W2 may be, for example, a substrate on which no electronic circuit is formed.

[0019] Hereinafter, as shown in FIG. 2, among the plate surfaces of the first substrate W1, the plate surface on the side joined to the second substrate W2 is referred to as "joining surface W1j", and the plate surface on the opposite side of the joining surface W1j is referred to as "non-joining surface W1n". Also, among the plate surfaces of the second substrate W2, the plate surface on the side joined to the first substrate W1 is referred to as "joining surface W2j", and the plate surface on the opposite side of the joining surface W2j is referred to as "non-joining surface W2n".

[0020] As shown in FIG. 1, the bonding system 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 is arranged on the positive Y-axis side of the processing station 3 and is integrally connected to the processing station 3.

[0021] The loading / unloading station 2 includes a mounting table 10 and a transfer area 20. The mounting table 10 includes a plurality of mounting plates 11. On each mounting plate 11, cassettes C1 to C4 for horizontally accommodating a plurality of substrates (for example, 25 substrates) are respectively mounted. Cassette C1 can accommodate a plurality of first substrates W1, cassette C2 can accommodate a plurality of second substrates W2, cassette C3 can accommodate a plurality of polymerized substrates T. Cassette C4 is, for example, a cassette for collecting substrates with defects. Note that the number of cassettes C1 to C4 mounted on the mounting plate 11 is not limited to that shown in the figure.

[0022] The transfer area 20 is arranged adjacent to the negative Y-axis side of the mounting table 10. In the transfer area 20, a transfer path 21 extending in the X-axis direction and a transfer device 22 movable along the transfer path 21 are provided. The transfer device 22 is movable not only in the Y-axis direction but also in the X-axis direction and is rotatable around the Z-axis. The transfer device 22 transfers the first substrate W1, the second substrate W2, and the polymerized substrate T between the cassettes C1 to C4 mounted on the mounting plate 11 and the third processing block G3 of the processing station 3 described later.

[0023] Processing station 3 is provided with, for example, three processing blocks G1, G2, and G3. The first processing block G1 is located on the rear side of processing station 3 (the positive X-axis side in Figure 1). The second processing block G2 is located on the front side of processing station 3 (the negative X-axis side in Figure 1), and the third processing block G3 is located on the loading / unloading station 2 side of processing station 3 (the positive Y-axis side in Figure 1).

[0024] The first processing block G1 is equipped with a surface modification device 30 that modifies the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2. The surface modification device 30 modifies the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 by breaking the SiO2 bonds in the bonding surfaces W1j and W2j to create single-bonded SiO, thereby making them more easily hydrophilized afterward.

[0025] Specifically, in the surface modification apparatus 30, for example, under a reduced pressure atmosphere, oxygen gas or nitrogen gas, which is the processing gas, is excited, plasma-generated, and ionized. Then, these oxygen ions or nitrogen ions are irradiated onto the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2, thereby plasma-treated and modified the bonding surfaces W1j and W2j.

[0026] Furthermore, a surface hydrophilization device 40 is located in the first processing block G1. The surface hydrophilization device 40 hydrophilizes the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 with, for example, pure water, and also cleans the bonding surfaces W1j and W2j. Specifically, the surface hydrophilization device 40 supplies pure water onto the first substrate W1 or the second substrate W2 while rotating the substrate, for example, the first substrate W1 or the second substrate W2 held in a spin chuck. As a result, the pure water supplied onto the first substrate W1 or the second substrate W2 diffuses over the bonding surfaces W1j and W2j of the first substrate W1 or the second substrate W2, and the bonding surfaces W1j and W2j are hydrophilized.

[0027] Here, an example is shown where the surface modification device 30 and the surface hydrophilization device 40 are arranged side by side, but the surface hydrophilization device 40 may be stacked above or below the surface modification device 30.

[0028] A bonding device 41 is located in the second processing block G2. The bonding device 41 bonds the hydrophilized first substrate W1 and the second substrate W2 by intermolecular forces. The specific configuration of the bonding device 41 will be described later.

[0029] A transport area 60 is formed in the region enclosed by the first processing block G1, the second processing block G2, and the third processing block G3. A transport device 61 is arranged in the transport area 60. The transport device 61 has a transport arm that is movable, for example, in the vertical direction, horizontal direction, and around the vertical axis. The transport device 61 moves within the transport area 60 and transports the first substrate W1, the second substrate W2, and the polymer substrate T to predetermined devices in the first processing block G1, the second processing block G2, and the third processing block G3 adjacent to the transport area 60.

[0030] The bonding system 1 also includes a control device 70. The control device 70 controls the operation of the bonding system 1. This control device 70 is, for example, a computer and includes a control unit and a memory unit (not shown). The control unit includes a microcomputer having a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), input / output ports, and various circuits. The CPU of this microcomputer realizes the control described later by reading and executing a program stored in the ROM. The memory unit is realized by, for example, semiconductor memory elements such as RAM and flash memory, or storage devices such as hard disks and optical discs.

[0031] Such a program may have been recorded on a computer-readable recording medium and installed from that medium into the storage unit of the control device 70. Examples of computer-readable recording media include hard disks (HDs), flexible disks (FDs), compact discs (CDs), magnetic optical discs (MOs), and memory cards.

[0032] <Configuration of the joining device> Here, an example of the configuration of the joining device 41 will be described with reference to Figures 3 and 4. Figure 3 is a plan view of the joining device 41 according to the embodiment. Figure 4 is a side view of the joining device 41 according to the embodiment.

[0033] As shown in Figures 3 and 4, the joining device 41 according to this embodiment includes a housing 100, a first holding part 110, a second holding part 120, a moving part 130, a scale member 140, a first lead head 150, and a second lead head 160.

[0034] The housing 100 is, for example, a rectangular box in plan view with open sides, and houses the first holding part 110, the second holding part 120, the moving part 130, the scale member 140, the first read head 150, and the second read head 160.

[0035] The housing 100 comprises, for example, a mounting base 101, a plurality of support columns 102 erected on the upper surface of the mounting base 101, and a ceiling portion 103 supported by the plurality of support columns 102. The upper surface of the mounting base 101 becomes the bottom surface of the housing 100, and the lower surface of the ceiling portion 103 becomes the ceiling surface of the housing 100.

[0036] The first holding part 110 holds the upper surface (non-bonding surface W1n) of the first substrate W1 from above by suction. The lower surface of the first holding part 110 becomes the substrate holding surface for holding the first substrate W1. The first holding part 110 is supported by a lifting part 170 provided on the ceiling part 103 (see Figure 4). The lifting part 170 moves the first holding part 110 along the vertical direction (Z-axis direction). This allows the lifting part 170 to bring the first holding part 110 closer to the second holding part 120.

[0037] The second holding portion 120 is located below the first holding portion 110 and holds the lower surface (non-bonding surface W2n) of the second substrate W2 from below by suction. The upper surface of the second holding portion 120 becomes the substrate holding surface for holding the second substrate W2.

[0038] Here, an example of the configuration of the first retaining part 110 and the second retaining part 120 will be described with reference to Figure 5. Figure 5 is a side view of the first retaining part 110 and the second retaining part 120 according to the embodiment.

[0039] As shown in Figure 5, the first holding portion 110 has a main body portion 111. The main body portion 111 is supported by a support member 112. Through holes 113 are formed in the support member 112 and the main body portion 111, penetrating vertically through the support member 112 and the main body portion 111. The position of the through holes 113 corresponds to the center of the first substrate W1 that is held by the first holding portion 110. The pressing pin 211 of the striker 210, which will be described later, is inserted through the through holes 113.

[0040] The striker 210 is positioned on the upper surface of the support member 112 and comprises a pressing pin 211, an actuator unit 212, and a linear motion mechanism 213. The pressing pin 211 is a cylindrical member extending along the vertical direction and is supported by the actuator unit 212.

[0041] The actuator unit 212 generates a constant pressure in a specific direction (here, vertically downward) using air supplied, for example, from an electro-pneumatic regulator (not shown). The actuator unit 212 can contact the center of the first substrate W1 with the air supplied from the electro-pneumatic regulator and control the pressing load applied to the center of the first substrate W1. Furthermore, the tip of the actuator unit 212 is able to move vertically up and down by the air from the electro-pneumatic regulator through the through hole 113.

[0042] The actuator unit 212 is supported by the linear motion mechanism 213. The linear motion mechanism 213 moves the actuator unit 212 along the vertical direction, for example, by a drive unit that incorporates a motor.

[0043] The striker 210 controls the movement of the actuator section 212 by the linear motion mechanism 213, and the actuator section 212 controls the pressing load on the first substrate W1 by the pressing pin 211. As a result, the striker 210 presses the center of the first substrate W1, which is held by the first holding section 110, and brings it into contact with the second substrate W2.

[0044] The lower surface of the main body 111 is provided with a plurality of pins 114 that contact the upper surface (non-bonding surface) of the first substrate W1. The plurality of pins 114 have, for example, a diameter of 0.1 mm to 1 mm and a height of several tens of micrometers to several hundred micrometers. The plurality of pins 114 are evenly arranged at intervals of, for example, 2 mm.

[0045] The first holding portion 110 is provided with a plurality of suction portions for adsorbing the first substrate W1 in a portion of the area where the plurality of pins 114 are provided. Specifically, the lower surface of the main body portion 111 of the first holding portion 110 is provided with a plurality of outer suction portions 115 and a plurality of inner suction portions 116 for adsorbing the first substrate W1 by vacuuming it. The plurality of outer suction portions 115 and the plurality of inner suction portions 116 have an arc-shaped suction region in a plan view. The plurality of outer suction portions 115 and the plurality of inner suction portions 116 are at the same height as the pins 114.

[0046] Multiple external suction parts 115 are arranged on the outer periphery of the main body 111. The multiple external suction parts 115 are connected to a suction device (not shown), such as a vacuum pump, and attract the outer periphery of the first substrate W1 by vacuuming.

[0047] The multiple inner suction portions 116 are arranged radially inward of the main body portion 111, and aligned along the circumferential direction, compared to the multiple outer suction portions 115. The multiple inner suction portions 116 are connected to a suction device (not shown), such as a vacuum pump, and attract the region between the outer periphery and the center of the first substrate W1 by vacuuming.

[0048] The second holding portion 120 will now be described. The second holding portion 120 has a main body portion 121 having a diameter equal to or larger than that of the second substrate W2. Here, the second holding portion 120 having a diameter larger than that of the second substrate W2 is shown. The upper surface of the main body portion 121 is a facing surface that is opposite to the lower surface (non-bonding surface W2n) of the second substrate W2.

[0049] The upper surface of the main body 121 is provided with a plurality of pins 122 that contact the lower surface (non-bonding surface W2n) of the second substrate W2. The plurality of pins 122 have, for example, a diameter of 0.1 mm to 1 mm and a height of several tens of micrometers to several hundred micrometers. The plurality of pins 122 are evenly arranged at intervals of, for example, 2 mm.

[0050] Furthermore, a lower rib 123 is provided on the upper surface of the main body 121 in an annular shape outside of the multiple pins 122. The lower rib 123 is formed in an annular shape and supports the outer circumference of the second substrate W2 around its entire circumference.

[0051] Furthermore, the main body 121 has a plurality of lower suction ports 124. The plurality of lower suction ports 124 are provided in the suction area surrounded by the lower rib 123. The plurality of lower suction ports 124 are connected to a suction device, such as a vacuum pump (not shown), via a suction pipe (not shown).

[0052] The second holding section 120 reduces the pressure in the adsorption area, which is surrounded by the lower ribs 123, by drawing a vacuum from the multiple lower suction ports 124. As a result, the second substrate W2 placed on the adsorption area is adsorbed and held by the second holding section 120.

[0053] Since the lower rib 123 supports the entire outer circumference of the lower surface of the second substrate W2, the second substrate W2 is properly vacuumed up to its outer circumference. This allows the entire surface of the second substrate W2 to be held by suction. In addition, since the lower surface of the second substrate W2 is supported by multiple pins 122, when the vacuum of the second substrate W2 is released, the second substrate W2 is easily detached from the second holding part 120.

[0054] The bonding device 41 holds the first substrate W1 by suction in the first holding part 110 and the second substrate W2 by suction in the second holding part 120. After releasing the suction hold of the first substrate W1 by the multiple inner suction parts 116, the bonding device 41 lowers the pressing pin 211 of the striker 210 to press down on the center of the first substrate W1. This results in a polymerized substrate T in which the first substrate W1 and the second substrate W2 are bonded. The polymerized substrate T is then transported out of the bonding device 41 by the transport device 61.

[0055] Returning to Figures 3 and 4, the configuration of the moving part 130 will be described. The moving part 130 moves the second holding part 120 in the horizontal direction. Specifically, the moving part 130 comprises a first moving part 131 that moves the second holding part 120 along the X-axis direction (an example of the first horizontal direction) and a second moving part 132 that moves the second holding part 120 along the Y-axis direction (an example of the second horizontal direction).

[0056] The first movable part 131 is attached to a pair of first rails 131a extending along the X-axis direction and is configured to be movable along the pair of first rails 131a. The pair of first rails 131a are provided on the bottom surface of the housing 100 (i.e., the top surface of the mounting base 101). Both ends of the first movable part 131 in the Y-axis direction can be moved independently along each of the pair of first rails 131a by a drive device such as a linear motor.

[0057] The second movable part 132 is attached to a pair of second rails 132a that extend along the Y-axis direction and is configured to be movable along the pair of second rails 132a. The pair of second rails 132a are provided on the upper surface of the first movable part 131.

[0058] The second holding part 120 is attached to the second moving part 132 and moves integrally with the second moving part 132. As described above, the second moving part 132 is attached to the first moving part 131 via a pair of second rails 132a. Therefore, the moving part 130 can move the second holding part 120 along the X-axis direction by moving the first moving part 131, and can move the second holding part 120 along the Y-axis direction by moving the second moving part 132. Here, the stroke (amount of movement) of the first moving part 131 along the X-axis direction is smaller than the stroke (amount of movement) of the second moving part 132 along the Y-axis direction. For example, the stroke (amount of movement) of the first moving part 131 along the X-axis direction may be less than the radius of the second substrate W2, and the stroke (amount of movement) of the second moving part 132 along the Y-axis direction may be greater than or equal to the diameter of the second substrate W. As a result, the size of the movable part 130 along the X-axis direction is reduced, thus enabling miniaturization of the joining device 41.

[0059] Furthermore, the second moving part 132 includes a rotating part (not shown) that rotates the second holding part 120 around a vertical axis.

[0060] In this way, the moving unit 130 moves the second holding unit 120 in the X-axis direction, Y-axis direction, and θ-axis direction to align the first substrate W1 held by the first holding unit 110 with the second substrate W2 held by the second holding unit 120 in the horizontal direction.

[0061] The movable part 130 only needs to be able to move the first holding part 110 and the second holding part 120 relative to each other in the X-axis direction, Y-axis direction, and θ-axis direction. For example, the movable part 130 may move the first holding part 110 in the X-axis direction, Y-axis direction, and θ-axis direction. Alternatively, the movable part 130 may move the second holding part 120 in the X-axis direction and Y-axis direction, while also moving the first holding part 110 in the θ-axis direction. Alternatively, the movable part 130 may move the second holding part 120 in the X-axis direction and Y-axis direction, while also moving the first holding part 110 and the second holding part 120 in the θ-axis direction.

[0062] The scale member 140 is located inside the housing 100 and has markings indicating positions in the X-axis and Y-axis directions.

[0063] The first read head 150 and the second read head 160 move integrally with the second holding part 120, and measure the position of the second holding part 120 by reading the scale on the scale member 140.

[0064] However, in position measurement using a laser interferometer, as in conventional technology, errors may occur due to changes in the temperature and atmospheric pressure of the measurement environment. In other words, when the temperature and atmospheric pressure of the measurement environment change, the refractive index of the air changes, which in turn changes the wavelength of the reference laser light. Therefore, the measurement results obtained by the laser interferometer will always have a fluctuating error.

[0065] In contrast, in position measurement using a linear scale, where the scale markings on the scale member are read by a reader, the scale member and the reader are in close proximity, thus suppressing the influence of changes in temperature, air pressure, and other factors in the measurement environment between the scale member and the reader. Therefore, it is possible to suppress errors in the measurement results obtained by the reader.

[0066] Therefore, in the joining device 41 according to this embodiment, the position of the second holding part 120 is measured by reading the scale of the scale member 140 using the first read head 150 and the second read head 160, which move integrally with the second holding part 120.

[0067] The first read head 150 and the second read head 160 are positioned close to the scale member 140 at a distance that allows the scale markings on the scale member 140 to be read. This close proximity between the first read head 150 and the second read head 160 and the scale member 140 reduces the impact of changes in temperature, atmospheric pressure, and other factors on the scale readings of the first read head 150 and the second read head 160. Therefore, it is possible to suppress errors in the measurement results of the first read head 150 and the second read head 160 due to changes in temperature, atmospheric pressure, and other factors.

[0068] By reducing the error in the measurement results of the first read head 150 and the second read head 160, the positioning accuracy of the second substrate W2 is improved. Therefore, according to the bonding apparatus 41 of this embodiment, the bonding accuracy of the first substrate W1 and the second substrate W2 can be improved.

[0069] Here, the configuration and positional relationship of the scale member 140, the first lead head 150, and the second lead head 160 will be described with reference to Figures 3, 4, and 6. Figure 6 is a diagram showing the configuration and positional relationship of the scale member 140, the first lead head 150, and the second lead head 160 according to the embodiment. Figure 6 shows the scale member 140, the first lead head 150, and the second lead head 160 as viewed from the negative Y-axis direction.

[0070] As shown in Figures 4 and 6, the scale member 140 is positioned in the vertical direction (Z-axis direction) closer to the substrate holding surface 120a of the second holding part 120 than to the bottom surface of the housing 100 (i.e., the top surface of the mounting base 101). Specifically, the scale member 140 is fixed on a riser member 180 provided on the top surface of the mounting base 101, thereby positioning it closer to the substrate holding surface 120a of the second holding part 120 than to the top surface of the mounting base 101. For example, by fixing the scale member 140 on the riser member 180, it is positioned on the same plane as the substrate holding surface 120a of the second holding part 120, or lower than the substrate holding surface 120a of the second holding part 120 and higher than the bottom surface of the second holding part 120.

[0071] In this way, by bringing the scale member 140 closer to the height of the substrate holding surface 120a, the first read head 150 and the second read head 160 can read the scale of the scale member 140 at a height as close as possible to the substrate holding surface 120a. As a result, the error in the measurement results of the first read head 150 and the second read head 160 is reduced compared to when the scale member 140 is positioned away from the substrate holding surface 120a.

[0072] Furthermore, the scale member 140 only needs to be positioned closer to the substrate holding surface 120a of the second holding part 120 than to the upper surface of the mounting base 101, and the member for fixing the position of the scale member 140 is not limited to the raising member 180. For example, the scale member 140 may be positioned closer to the substrate holding surface 120a of the second holding part 120 than to the upper surface of the mounting base 101 by being supported by a support member provided on the lower surface of the ceiling part 103.

[0073] Furthermore, as shown in Figure 3, the scale member 140 has a rectangular shape in plan view, where the length of the side along the X-axis is shorter than the length of the side along the Y-axis. This reduces the size of the scale member 140 along the X-axis, thereby enabling miniaturization of the joining device 41.

[0074] The first lead head 150 and the second lead head 160 are attached to a mounting member 190 provided on the second movable part 132, and move integrally with the second movable part 132 and the mounting member 190.

[0075] As shown in Figure 6, the mounting member 190 is, for example, an inverted L-shaped frame in side view, provided on the side surface 132b of the second movable part 132 located on the positive X-axis side, and is bent and extends in the positive X-axis direction. The first lead head 150 and the second lead head 160 are attached to the lower surface of the extended portion of the mounting member 190 so as to face the scale member 140.

[0076] As shown in Figure 3, the first lead head 150 and the second lead head 160 are mounted on the mounting member 190 with a gap d along the Y-axis. The gap d is less than or equal to the diameter of the second substrate W2.

[0077] Here, if there is a difference in the amount of movement of both ends of the first moving part 131 in the Y-axis direction, the second moving part 132 rotates in the θ direction in the horizontal plane (XY plane), and as a result of this rotation of the second moving part 132, the second holding part 120 unintentionally rotates in the θ direction in the horizontal plane (XY plane). The first lead head 150 and the second lead head 160 are attached to the mounting member 190 with a gap d between them, so that the amount of rotation of the second holding part 120 in the horizontal plane (XY plane) can be measured as the difference in the measurement result with respect to the X-axis direction.

[0078] The amount of movement of both ends of the first moving part 131 in the Y-axis direction is adjusted using the measurement results of the first lead head 150 and the second lead head 160 in the X-axis direction. Specifically, the first lead head 150 and the second lead head 160 each output measurement results in the X-axis direction to the control unit of the control device 70. The control unit of the control device 70 then controls the first moving part 131 to adjust the amount of movement of both ends in the Y-axis direction so that the measurement results of the first lead head 150 and the second lead head 160 in the X-axis direction match. This eliminates the difference in the amount of movement of both ends of the first moving part 131 in the Y-axis direction, and as a result, unintended rotation of the second holding part 120 in the horizontal plane (XY plane) can be suppressed.

[0079] Although not shown in the diagram here, the bonding apparatus 41 includes a transition, a position adjustment mechanism, and a reversal mechanism. The transition temporarily places the first substrate W1, the second substrate W2, and the polymerization substrate T on it. The position adjustment mechanism adjusts the horizontal orientation of the first substrate W1 and the second substrate W2. The reversal mechanism reverses the front and back sides of the first substrate W1.

[0080] <Specific operation of the joining system> Next, the specific operation of the joining system 1 according to the embodiment will be described with reference to Figure 7. Figure 7 is a flowchart showing the procedure of processing performed by the joining system 1 according to the embodiment. The various processes shown in Figure 7 are executed based on control by the control device 70.

[0081] First, cassette C1 containing multiple first circuit boards W1, cassette C2 containing multiple second circuit boards W2, and an empty cassette C3 are placed on a designated mounting plate 11 at the loading / unloading station 2. Then, the transport device 22 removes the first circuit boards W1 from cassette C1 and transports them to the transition device located in the third processing block G3.

[0082] Next, the first substrate W1 is transported by the transport device 61 to the surface modification device 30 of the first processing block G1. In the surface modification device 30, under a predetermined reduced pressure atmosphere, oxygen gas, which is the processing gas, is excited, plasma-generated, and ionized. These oxygen ions are irradiated onto the bonding surface of the first substrate W1, and the bonding surface is plasma-treated. As a result, the bonding surface of the first substrate W1 is modified (step S101).

[0083] Next, the first substrate W1 is transported by the transport device 61 to the surface hydrophilization device 40 of the first processing block G1. In the surface hydrophilization device 40, pure water is supplied onto the first substrate W1 while it is rotated, which is held in a spin chuck. This makes the bonding surface of the first substrate W1 hydrophilic. In addition, the bonding surface of the first substrate W1 is cleaned with the pure water (step S102).

[0084] Next, the first substrate W1 is transported by the transport device 61 to the bonding device 41 of the second processing block G2. The first substrate W1, once loaded into the bonding device 41, is transported via a transition to the position adjustment mechanism, where its horizontal orientation is adjusted (step S103).

[0085] Subsequently, the first substrate W1 is transferred from the position adjustment mechanism to the inversion mechanism, where the inversion mechanism inverts the front and back surfaces of the first substrate W1 (step S104). Specifically, the bonding surface W1j of the first substrate W1 is oriented downwards. Next, the first substrate W1 is transferred from the inversion mechanism to the first holding part 110, where the first substrate W1 is held by suction (step S105).

[0086] The processing of the second substrate W2 is performed in overlap with the processing of the first substrate W1 in steps S101 to S105. First, the transport device 22 removes the second substrate W2 from the cassette C2 and transports it to the transition device located in the third processing block G3.

[0087] Next, the second substrate W2 is transported by the transport device 61 to the surface modification device 30, where the bonding surface W2j of the second substrate W2 is modified (step S106). After that, the second substrate W2 is transported by the transport device 61 to the surface hydrophilization device 40, where the bonding surface W2j of the second substrate W2 is hydrophilized and the bonding surface is cleaned (step S107).

[0088] Subsequently, the second substrate W2 is transported to the bonding device 41 by the transport device 61. The second substrate W2, once loaded into the bonding device 41, is transported to the position adjustment mechanism via a transition. The position adjustment mechanism then adjusts the horizontal orientation of the second substrate W2 (step S108).

[0089] Subsequently, the second substrate W2 is transported to the second holding section 120 and held by the second holding section 120 with the notch facing a predetermined direction (step S109).

[0090] Next, the horizontal position adjustment is performed between the first substrate W1 held by the first holding part 110 and the second substrate W2 held by the second holding part 120 (step S110).

[0091] Specifically, the center position (X and Y coordinates) of the second substrate W2 is determined based on the measurement results of the first read head 150 and the second read head 160. Then, the second substrate W2 is moved using the first moving unit 131 and the second moving unit 132 so that the center position of the second substrate W2 coincides with the center position of the first substrate W1.

[0092] Next, the first substrate W1 and the second substrate W2 are joined together (step S111).

[0093] First, the vertical position of the first substrate W1 held by the first holding part 110 and the second substrate W2 held by the second holding part 120 is adjusted. Specifically, the second substrate W2 is brought closer to the first substrate W1 by lowering the first holding part 110 using the lifting part 170.

[0094] Next, after releasing the suction hold of the first substrate W1 by the multiple internal suction parts 116, the center of the first substrate W1 is pressed down by lowering the pressing pin 211 of the striker 210.

[0095] When the center of the first substrate W1 comes into contact with the center of the second substrate W2, and the centers of the first substrate W1 and the second substrate W2 are pressed together by the striker 210 with a predetermined force, bonding begins between the pressed centers of the first substrate W1 and the second substrate W2. That is, since the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 are modified, van der Waals forces (intermolecular forces) are first generated between the bonding surfaces W1j and W2j, and these bonding surfaces W1j and W2j are joined together. Furthermore, since the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 are hydrophilic, the hydrophilic groups between the bonding surfaces W1j and W2j form hydrogen bonds, and the bonding surfaces W1j and W2j are firmly joined together. In this way, a bonding region is formed.

[0096] Subsequently, a bonding wave is generated between the first substrate W1 and the second substrate W2, in which the bonding region expands from the center outwards of both the first substrate W1 and the second substrate W2. Then, the suction holding of the first substrate W1 by the multiple outer suction parts 115 is released. As a result, the outer periphery of the first substrate W1, which was held by the outer suction parts 115, falls off. Consequently, the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 come into full contact, and a polymerized substrate T is formed.

[0097] Subsequently, the pressing pin 211 is raised to the first holding part 110, releasing the suction holding of the second substrate W2 by the second holding part 120. Then, the polymerized substrate T is discharged from the bonding device 41 by the transport device 61. In this way, the series of bonding processes is completed.

[0098] <Other> In the embodiment described above, an example was given in which the bonding device 41 has two lead heads (a first lead head 150 and a second lead head 160). However, the number of lead heads is not limited to this, and may be one or three or more.

[0099] As described above, the bonding device (for example, bonding device 41) is a bonding device for bonding substrates together, and comprises a first holding part (for example, first holding part 110), a second holding part (for example, second holding part 120), a moving part (for example, moving part 130), a housing (for example, housing 100), a scale member (for example, scale member 140), and a read head (for example, first read head 150 and second read head 160). The first holding part holds the first substrate (for example, first substrate W1) by suction from above. The second holding part holds the second substrate (for example, second substrate W2) by suction from below. The moving part moves one of the first and second holding parts relative to the other in a first horizontal direction (for example, the X-axis direction) and a second horizontal direction perpendicular to the first horizontal direction (for example, the Y-axis direction). The housing accommodates the first holding part, the second holding part, and the moving part. The scale member is positioned inside the housing and has markings indicating positions in a first horizontal direction and a second horizontal direction. The read head moves integrally with one of the first and second holding parts and reads the markings on the scale member to measure the position of the one holding part. Therefore, according to the bonding apparatus of this embodiment, the bonding accuracy between substrates can be improved in bonding technology for bonding substrates together.

[0100] The moving part may include a first moving part that moves one of the first and second holding parts along a first horizontal direction, and a second moving part that moves one of the first and second holding parts along a second horizontal direction. The stroke of the first moving part along the first horizontal direction may be smaller than the stroke of the second moving part along the second horizontal direction. This enables miniaturization of the joining device.

[0101] The first movable part is mounted on a pair of rails extending along a first horizontal direction and is movable along the pair of rails, and both ends of the first movable part in the second horizontal direction may move independently along each of the pair of rails. This allows the amount of movement of both ends of the first movable part in the second horizontal direction to be adjusted independently.

[0102] The joining device according to the embodiment may include a plurality of lead heads (for example, a first lead head 150 and a second lead head 160). The second moving part may be positioned above the first moving part. One of the first and second holding parts may be attached to the second moving part and move integrally with the second moving part. The plurality of lead heads may be attached to a mounting member (for example, a mounting member 190) provided on the second moving part at intervals (for example, interval d) along the second horizontal direction. This allows the plurality of lead heads to measure the amount of rotation of the second holding part in the horizontal plane as the difference in measurement results with respect to the first horizontal direction.

[0103] The above spacing may be less than or equal to the diameter of the second substrate.

[0104] The joining apparatus according to the embodiment may further include a control unit (for example, the control unit of the control device 70) that controls the first moving part to adjust the amount of movement at both ends so that the measurement results for the first horizontal direction of the plurality of lead heads are consistent. This makes it possible to suppress unintended rotation of the second holding part in the horizontal plane.

[0105] The scale member may be positioned in the vertical direction (e.g., the Z-axis direction) closer to the substrate holding surface (e.g., substrate holding surface 120a) of the first and second holding parts than to the bottom surface of the housing. This reduces the error in the readhead measurement results compared to when the scale member is positioned away from the substrate holding surface.

[0106] The scale member may be rectangular in shape, in a plan view, where the length of the side along the first horizontal direction is shorter than the length of the side along the second horizontal direction. This enables miniaturization of the joining device.

[0107] The moving part may include a rotating part that rotates at least one of the first holding part and the second holding part around a vertical axis. This allows the first holding part and the second holding part to move relative to each other in the θ direction.

[0108] The bonding apparatus according to the embodiment may further include a lifting mechanism that brings the other of the first and second holding parts closer to one of the first and second holding parts. This allows for adjustment of the vertical position between the first substrate held by the first holding part and the second substrate held by the second holding part.

[0109] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. Indeed, the embodiments described above can be embodied in a variety of forms. Furthermore, the embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of Symbols]

[0110] 1. Joining System 30 Surface modification apparatus 40 Surface hydrophilization device 41 Joining equipment 70 Control device 100 cabinets 101 Mounting platform 102 Pillar section 103 Ceiling section 110 1st holding part 120 Second holding part 120a Board holding surface 130 Mobile Unit 131 First Mobile Unit 131a First Rail 132 Second Mobile Unit 132a Second rail 140 scale components 150 First Lead Head 160 Second Lead Head 170 Lifting section 180 Raising member 190 Mounting components T Polymerization substrate W1 First Circuit Board W2 Second Board

Claims

[Claim 1] A bonding device for joining substrates together, A first holding unit that holds the first substrate by adsorption from above, A second holding unit that holds the second substrate by adsorption from below, A moving part that moves one of the first holding part and the second holding part relative to the other in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction, A housing that houses the first holding part, the second holding part, and the movable part, A scale member is disposed inside the housing and has markings indicating the position in the first horizontal direction and the second horizontal direction, A read head moves integrally with one of the first and second holding parts, reads the scale markings on the scale member, and measures the position of the one holding part. A joining device equipped with the following features.

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