Thin plate drying equipment

Abstract

The present invention provides a thin sheet drying apparatus that simplifies the structure, securely holds thin sheets with multiple support pins, and improves the reliability of the apparatus. [Solution] The semiconductor wafer drying apparatus 1 for drying thin semiconductor wafers comprises a rotating plate 20 that rotates by rotationally driving a shaft 13, and a plurality of support pins 40 arranged in the circumferential direction of the rotating plate 20 on which semiconductor wafers 2 are placed. Each support pin 40 has a support portion 41 that supports the semiconductor wafer 2 and a weight portion 50 that protrudes downward from the rotating plate 20. Each support pin 40 is provided on the rotating plate 20 so as to be rotatable about an axis, and the weight portion 50 rotates toward the outer circumference of the rotating plate 20 due to the centrifugal force caused by the rotation of the rotating plate 20, and the support portion 41 rotates toward the inner circumference of the rotating plate 20, thereby holding the semiconductor wafer 2 with the support portion 41.

Claims

1. A thin sheet drying apparatus for drying thin sheets, A rotational drive means for rotating the drive shaft, A rotating body connected to the aforementioned drive shaft and rotating by rotationally driving the drive shaft, The rotating body comprises a plurality of support pins arranged in the circumferential direction, on which the thin plate is placed, The support pin has a support portion that protrudes above the rotating body to support the thin plate, and a weight portion that protrudes below the rotating body. A thin sheet drying apparatus characterized in that each of the support pins is provided on the rotating body so as to be rotatable about an axis, and the weight portion rotates toward the outer circumference of the rotating body due to the centrifugal force caused by the rotation of the rotating body, and the support portion rotates toward the inner circumference of the rotating body, thereby holding the thin sheet at the support portion.

2. The thin plate drying apparatus according to claim 1, characterized in that the support portion is provided with a support surface portion that supports the lower surface side of the peripheral edge of the thin plate, and a projection portion that protrudes upward from the support surface portion and restricts the outward movement of the peripheral edge of the thin plate.

3. The thin plate drying apparatus according to claim 1, characterized in that the thin plate is formed of a circular portion which is circular in plan view and a straight portion which is cut out in a straight line from the circular portion, and the plurality of support parts support the straight portion and the plurality of support parts support the circular portion.

4. The thin sheet drying apparatus according to claim 1, characterized in that a plurality of weight portions are arranged in series, and each of these weight portions is detachably provided to the support portion.

5. The thin sheet drying apparatus according to claim 1, characterized in that it is provided with means for preventing the support portion from moving outward from a vertical position relative to the support pin.

6. The thin plate drying apparatus according to any one of claims 1 to 5, characterized in that the thin plate is a semiconductor wafer.

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