Component mounting device, component mounting system, and transfer method

Abstract

The present invention provides a component mounting apparatus, a component mounting system, and a transfer method for efficiently and uniformly depositing flux into a film. [Solution] The component mounting device comprises a stage having a recess for accumulating flux, a flattening unit for flattening the surface of the flux accumulated in the recess, a drive unit for moving the stage relative to the flattening unit, a transfer unit for bringing a held object into contact with the flattened flux, and a control unit for controlling the relative movement of the stage by the drive unit. The control unit performs a first operation in which the drive unit moves the flux accumulated in the recess away from a transfer position from which it can transfer the flux accumulated in the recess to the object held by the transfer unit, and then moves the stage back and forth relative to the flattening unit on the recess, and a second operation in which it moves the stage to the transfer position.

Description

Technical Field

[0001] The present disclosure relates to a component mounting device, a component mounting system, and a transfer method.

Background Art

[0002] Conventionally, in a component mounting device for mounting electronic components such as ICs on a substrate, before bonding the components to the substrate with solder, flux is attached to remove oxides or dirt on the bumps on the lower surface of the chip-type electronic component or the electrode portion where solder bonding is performed on the substrate.

[0003] For example, in Patent Document 1, it is described that the lower surface of an electronic component is brought into contact with a flux reservoir of a flux transfer device to attach flux to the bumps of the electronic component.

Prior Art Documents

Patent Documents

[0004] [[ID=2​​​​​​​​​​​​​​​​​​​​​​​The component mounting apparatus of this disclosure comprises a stage having a recess for accumulating flux, a flattening unit for flattening the surface of the flux accumulated in the recess, a drive unit for moving the stage relative to the flattening unit, a transfer unit for bringing a held object into contact with the flattened flux, and a control unit for controlling the relative movement of the stage by the drive unit. The control unit performs a first operation in which the drive unit moves the flux accumulated in the recess away from a transfer position from which it can transfer the flux accumulated in the recess to the object held by the transfer unit, and then moves the stage back and forth relative to the recess to the transfer position, and a second operation in which it moves the stage to the transfer position. The transfer unit includes a mounting head that takes a component as an object from a component supply unit and mounts the component that has come into contact with the flux onto a substrate, or a transfer head having a plurality of transfer pins as an object for transferring flux onto a substrate.

[0008] The component mounting system of this disclosure includes a stage having a recess for accumulating flux, a flattening unit for flattening the surface of the flux accumulated in the recess, a drive unit for moving the stage relative to the flattening unit, a transfer unit for bringing a held object into contact with the flattened flux, and a control unit for controlling the relative movement of the stage by the drive unit. The control unit performs a first operation by moving the stage to a transfer position in which the flux accumulated in the recess can be transferred to an object held by the transfer unit, and a second operation by moving the stage back and forth relative to the flattening unit over the recess while the stage is retracted from the transfer position. The transfer unit includes a mounting head that takes a component as an object from a component supply unit and mounts the component that has come into contact with the flux onto a substrate, or a transfer head having a plurality of transfer pins as an object for transferring flux onto a substrate.

[0009] The transfer method of this disclosure is a transfer method for transferring flux accumulated in a recess of a stage to an object held by a transfer unit. The transfer method includes a first step of moving the flattening unit back and forth relative to the recess while the flux accumulated in the recess is moved away from a transfer position from which it can be transferred to the object held by the transfer unit, and a second step of moving the stage to the transfer position after the first step. [Effects of the Invention]

[0010] This disclosure provides a component mounting apparatus, a component mounting system, and a transfer method for uniformly forming a film on the surface of a flux. [Brief explanation of the drawing]

[0011] [Figure 1] Side view showing the schematic configuration of the component mounting device according to Embodiment 1 [Figure 2] Side view of the component mounting device with the mounting head positioned at the flux application site. [Figure 3] Side view of a component mounting device showing the mounting head applying flux to a component it has picked up. [Figure 4] Side view of a parts mounting device in which the mounting head is transporting a flux-coated part toward the mounting position. [Figure 5] Side view of the component mounting device with the mounting head in the mounting position. [Figure 6] Side view of a component mounting device with the mounting head mounting components onto a circuit board. [Figure 7] Perspective view of the flux supply device from the front. [Figure 8] Plan view of the flux supply unit where the recess is the transfer position. [Figure 9] Front view of a component mounting device showing the stage of a flux supply device where the recess is the transfer position. [Figure 10] Plan view of the flux supply unit with the recess in the standby position. [Figure 11] Front view of a component mounting device showing the stage of a flux supply device with a recess in the standby position. [Figure 12] Plan view of the flux supply unit with the recess in the sliding position. [Figure 13] A longitudinal cross-sectional view showing one step of flux film formation according to Embodiment 1. [Figure 14] A longitudinal cross-sectional view showing one step of flux film formation according to Embodiment 1. [Figure 15]Vertical cross-sectional view showing a step of forming a flux according to Embodiment 1 [Figure 16] Block diagram showing the functional configuration of the component mounting apparatus according to Embodiment 1 [Figure 17] Flowchart of forming a flux [Figure 18] Vertical cross-sectional view showing a step of forming a flux according to Modified Example 1 of Embodiment 1 [Figure 19] Vertical cross-sectional view showing a step of forming a flux according to Modified Example 1 of Embodiment 1 [Figure 20] Vertical cross-sectional view showing a step of forming a flux according to Modified Example 2 of Embodiment 1 [Figure 21] Vertical cross-sectional view showing a step of forming a flux according to Modified Example 2 of Embodiment 1 [Figure 22] Vertical cross-sectional view showing a step of forming a flux according to Modified Example 3 of Embodiment 1 [Figure 23] Side view showing the schematic configuration of the component mounting apparatus according to Embodiment 2 [Figure 24] Block diagram showing the functional configuration of the component mounting apparatus according to Embodiment 2 [Figure 25] Side view of the component mounting apparatus in a state where the transfer head is located at the flux adhesion position [Figure 26] Side view of the component mounting apparatus in a state where flux is adhered to the tip of the pin of the transfer head [Figure 27] Side view of the component mounting apparatus in a state where the transfer head with flux adhered to the tip of the pin is being transported toward the mounting position [Figure 28] Side view of the component mounting apparatus in a state where the transfer head is transferring flux to the substrate [Figure 29] Block diagram showing the schematic configuration of the component mounting system

Modes for Carrying Out the Invention

[0012] A component mounting apparatus according to a first aspect of this disclosure includes a stage having a recess for accumulating flux, a flattening unit for flattening the surface of the flux accumulated in the recess, a drive unit for moving the stage relative to the flattening unit, a transfer unit for bringing a held object into contact with the flattened flux, and a control unit for controlling the relative movement of the stage by the drive unit. The control unit performs a first operation in which the drive unit moves the flux accumulated in the recess away from a transfer position from which it can transfer the flux accumulated in the recess to the object held by the transfer unit, and then moves the stage back and forth relative to the recess, and a second operation in which it moves the stage to the transfer position. The transfer unit includes a mounting head that takes a component as an object from a component supply unit and mounts the component that has come into contact with the flux onto a substrate, or a transfer head having a plurality of transfer pins as an object for transferring flux onto a substrate.

[0013] By performing two types of first and second operations, it is possible to uniformly deposit a film on the surface of the flux where transfer marks from dipping the component remain, thereby improving the accuracy of film deposition.

[0014] According to a second aspect of this disclosure, in the component mounting apparatus of the first aspect, the first operation is to move the stage in a direction toward the transfer position and in a direction toward away from the transfer position.

[0015] According to a third aspect of this disclosure, in the component mounting apparatus of the first or second aspect, the control unit performs a first operation while the transfer unit is transporting the object from the transfer position and bringing it into contact with the substrate.

[0016] According to a fourth aspect of this disclosure, in a component mounting device according to any one of the first to third aspects, the control unit performs a first operation while the mounting head, which acts as a transfer unit, is moving from the component supply unit to the transfer position after taking out a component as an object.

[0017] According to a fifth aspect of this disclosure, in a component mounting apparatus according to any one of the first to third aspects, the control unit performs a first operation while the mounting head, which is a transfer unit, is moving to the component supply unit after it has mounted the component, which is an object, taken out from the component supply unit onto the substrate.

[0018] According to a sixth aspect of the present disclosure, in a component mounting device according to any one of the first to fifth aspects, the control unit performs a third operation in which the flattening unit flattens the surface of the flux in the recess at a speed slower than the speed at which the stage is moved relative to the flattening unit in the first operation, after the first operation and before the second operation.

[0019] According to a seventh aspect of this disclosure, in the component mounting apparatus of the sixth aspect, when the control unit performs the second operation after the third operation, it moves the stage to the transfer position at a speed faster than the speed at which the stage is moved relative to the flattening section in the third operation.

[0020] According to the eighth aspect of this disclosure, in the component mounting apparatus of the seventh aspect, the control unit retracts the stage from the transfer position at a speed faster than the speed at which the stage is moved relative to the flattening unit in the third operation, after the flux has been transferred to the object by the transfer unit.

[0021] According to the ninth aspect of this disclosure, a component mounting device according to any one of the first to eighth aspects further includes a storage unit that stores data relating to the number of relative movements of the stage with respect to the flattening unit in the first operation, and the control unit causes the drive unit to perform the first operation based on the number of movements.

[0022] According to a tenth aspect of this disclosure, a component mounting device according to any one of the first to eighth aspects further comprises an imaging unit that images the surface of flux accumulated in a recess of a stage. The control unit continues or stops the first operation based on the imaging result of the imaging unit.

[0023] According to the eleventh aspect of this disclosure, in a component mounting device according to any one of the first to tenth aspects, the control unit, in the first operation, moves the stage back and forth within a range greater than the width in the reciprocating direction of the recess while the stage is retracted from the transfer position.

[0024] According to the twelfth aspect of this disclosure, in a component mounting device according to any one of the first to eleventh aspects, the flattening section has a through hole that penetrates in the vertical direction, one opening of the through hole is closed by a stage, and is a flux storage section that stores flux in the through hole.

[0025] A component mounting system according to a thirteenth aspect of the present disclosure includes a stage having a recess for accumulating flux, a flattening unit for flattening the surface of the flux accumulated in the recess, a drive unit for moving the stage relative to the flattening unit, a transfer unit for bringing a held object into contact with the flattened flux, and a control unit for controlling the relative movement of the stage by the drive unit. The control unit performs a first operation by moving the stage to a transfer position in which the flux accumulated in the recess can be transferred to an object held by the transfer unit, and a second operation by moving the stage back and forth relative to the flattening unit over the recess while the stage is retracted from the transfer position. The transfer unit includes a mounting head for taking a component as an object from a component supply unit and mounting the component that has come into contact with the flux onto a substrate, or a transfer head having a plurality of transfer pins as an object for transferring flux onto a substrate.

[0026] A transfer method according to a fourteenth aspect of the present disclosure is a transfer method for transferring flux accumulated in a recess of a stage to an object held by a transfer unit. The transfer method includes a first step of moving the flattening unit back and forth relative to the recess while the flux accumulated in the recess is moved away from a transfer position from which it can be transferred to the object held by the transfer unit, and a second step of moving the stage to the transfer position after the first step.

[0027] Hereinafter, exemplary embodiments of the component mounting apparatus, component mounting system, and transfer method relating to this disclosure will be described with reference to the attached drawings. This disclosure is not limited to the specific configurations of the embodiments described below, but includes configurations based on similar technical ideas.

[0028] [Embodiment 1] (Overall structure) Hereinafter, the component mounting apparatus 1 in an embodiment of the present disclosure will be described with reference to Figures 1 to 6. Figure 1 is a side view showing a schematic configuration of the component mounting apparatus 1 equipped with a flux supply device 15 according to an embodiment of the present disclosure. Figure 2 is a side view of the component mounting apparatus 1 with the mounting head 12 located at the flux attachment position Pc. Figure 3 is a side view of the component mounting apparatus 1 with the mounting head 12 attaching flux to the attached component 203. Figure 4 is a side view of the component mounting apparatus 1 with the mounting head 12 transporting the flux-attached component 203 toward the mounting position Pa. Figure 5 is a side view of the component mounting apparatus 1 with the mounting head 12 located at the mounting position Pa. Figure 6 is a side view of the component mounting apparatus 1 with the mounting head 12 mounting the component 203 onto the substrate 201.

[0029] As shown in Figure 1, the component mounting device 1 comprises a component supply unit 11, a mounting head 12, a stage 13, a flux supply device 15, and a beam 17. The component mounting device 1 further comprises a camera 18, a control unit 19, a touch panel 20, a base 21, a component supply unit moving unit 23, a pickup head 31, a stage moving unit 25, and a stage tilt adjustment unit 29.

[0030] The component mounting device 1 mounts components 203, such as semiconductor chips, onto a substrate 201, which serves as a workpiece. On the base 21, a stage 13 for holding the substrate 201 and a component supply unit 11 are arranged side by side in the Y-axis direction.

[0031] The parts supply unit 11 supplies parts 203. The parts supply unit 11 is mounted on the parts supply unit moving unit 23. The parts supply unit moving unit 23 is controlled by the control unit 19 and moves the parts supply unit 11 in the X and Y directions. The parts supply unit moving unit 23 is, for example, a combination of rack and pinion, or a combination of motor and ball screw that can be driven in the X and Y directions respectively, and a combination of motor and spur gear for rotation around the θ axis. Multiple parts 203 are held on the upper part of the parts supply unit 11. The parts 203 are held on the upper part of the parts supply unit 11 either placed on a tray or attached to an adhesive sheet.

[0032] Stage 13 is located above the stage moving unit 25. The stage moving unit 25 is controlled by the control unit 19, which moves Stage 13 in the X and Y directions. Stage 13 receives the substrate 201, for example, via a transport rail, and positions and holds the substrate 201 at the location where the components 203 will be mounted. Stage 13 also transports the substrate 201 with the components 203 mounted to the next process, for example, via a transport rail.

[0033] Inside the stage 13 are a stage heating unit 27 for heating the held substrate 201 and a temperature sensor (not shown) for measuring the temperature of the heated stage 13. The stage heating unit 27 is controlled by the control unit 19 and heats the stage 13 to a specified temperature. The temperature measured by the thermometer inside the stage 13 is transmitted to the control unit 19.

[0034] The stage tilt adjustment unit 29 is located inside the stage movement unit 25 and can adjust the tilt of the mounted head 12 relative to the head surface by rotating the stage 13 around two orthogonal axes (X axis and Y axis). The stage tilt adjustment unit 29 has a mechanism in which, for example, cam mechanisms are provided at each of the four corners of the stage 13, and a linear cam provided for each cam mechanism moves in the left-right direction, causing the cam follower to move up and down, and each moves independently in the up and down direction.

[0035] Component 203 is held on the component supply unit 11 with the bumps formed on the back surface of component 203 facing upwards. A pickup head 31 is positioned above the component supply unit 11. The pickup head 31 picks up component 203 from the component supply unit 11 by suction. The pickup head 31 rotates around the X axis by a pickup head drive unit (not shown) controlled by the control unit 19, and then moves to a transfer position Pb, which will be described later. That is, at the transfer position Pb, the pickup head 31 holds component 203 with the bumps facing downwards.

[0036] A mounting head 12 is positioned above the pickup head 31 and the component supply unit 11. The mounting head 12 holds the supplied component 203 and mounts it onto the substrate 201 supported by the stage 13. The mounting head 12 moves in the Y-axis direction by a mounting head moving mechanism 33 controlled by a control unit 19. The mounting head moving mechanism 33 is provided on the beam 17. The mounting head moving mechanism 33 includes, for example, a rail 34 arranged along the Y-axis direction on the beam 17 and a linear motor (not shown) for moving the mounting head 12. The amount of drive of the linear motor is controlled by the control unit 19, and the mounting head 12 can move along the rail 34 on the beam 17 by the amount of drive of the linear motor.

[0037] The beam 17 is a member extending in the Y-axis direction and movably supports the mounting head 12. The flux supply device 15 is supported by the beam 17, for example, between the component supply unit 11 and the stage 13. Although not shown in Figure 1, both ends of the beam 17 in the Y-axis direction are supported, for example, by a housing surrounding the components of the component mounting device 1. The lower surface of the beam 17 is positioned, for example, substantially parallel to the horizontal plane.

[0038] A tool 35 for adsorbing and holding the component 203 is provided at the lower end of the mounting head 12. At the transfer position Pb, the mounting head 12 receives the component 203 from the pickup head 31 using the tool 35. The mounting head moving mechanism 33 moves the mounting head 12 from the transfer position Pb to the flux application position Pc, where flux adheres to the lower surface of the component 203.

[0039] The mounting head 12 is equipped with a component heating unit 37 that heats the component 203 held by the tool 35, and a tool temperature sensor 39 that measures the temperature of the tool 35 heated by the component heating unit 37. The component heating unit 37 is controlled by the control unit 19 and heats the tool 35 to a specified temperature. The temperature of the tool 35 measured by the tool temperature sensor 39 is transmitted to the control unit 19.

[0040] The mounting head 12 is equipped with a tool lifting mechanism 41 for raising and lowering the tool 35. The mounting head 12 is also equipped with a pressure sensor 43 for measuring the load applied by the tool lifting mechanism 41 to press the tool 35, which holds the component 203, against the substrate 201.

[0041] The tool lifting mechanism 41 is driven and controlled by the mounting control unit 93 of the control unit 19, which lowers the tool 35 so that the tool 35 mounts the component 203 onto the substrate 201 with a specified load. The tool lifting mechanism 41 includes, for example, a linear motor for raising and lowering the tool 35 and an encoder for measuring the amount of drive of the linear motor. The load measured by the pressure sensor 43 is transmitted to the control unit 19.

[0042] The mounting head 12 may also be equipped with an ultrasonic oscillator 45 that vibrates the tool 35 ultrasonically. The ultrasonic oscillator 45 is driven and controlled by the control unit 19, and when mounting the component 203 to the substrate 201 by ultrasonic crimping, the tool 35 is vibrated ultrasonically at the specified ultrasonic power, amplitude, and frequency. When mounting the component 203 to the substrate 201 by thermocompression only, the ultrasonic oscillator 45 does not need to be provided on the mounting head 12.

[0043] The touch panel 20, which is communicatively connected to the control unit 19, displays the operation menu and operating status information of the component mounting device 1 on its display screen. Data input to the control unit 19 and operation of the component mounting device 1 can be performed using the operation buttons displayed on the screen. The touch panel 20 may be a portable terminal or it may be installed on the component mounting device 1. A combination of an LCD monitor and operation buttons, a keyboard, and a mouse may be used instead of the touch panel 20.

[0044] Camera 18 images the component 203 supported by the mounting head 12. Camera 18 is positioned between the component supply unit 11 and the stage 13, for example, at the flux application position Pc. Camera 18 is positioned below the flux supply device 15 and overlaps with the flux supply unit 51 at the transfer position Pd in ​​a plan view.

[0045] Therefore, when the mounting head 12 supporting the component 203 is located at the flux application position Pc, and the flux supply unit 51 is located at the standby position Pe, the mounting head 12 that has received the component 203 is located directly above the camera 18. The camera 18 captures an image of the component 203 held by the tool 35 and transmits the captured image to the control unit 19. When an image of the underside of the component 203 after the flux 3 has been applied to it is captured, the control unit 19 recognizes the shape of the captured component 203 and the amount of rotation from the reference position, and further recognizes the state of flux application. In the component mounting operation in which the mounting head 12 mounts the component 203 onto the substrate 201, the control unit 19 corrects the orientation of the component 203 based on the image of the component 203 captured by the camera 18.

[0046] Alternatively, before applying flux 3 to component 203, an image of the underside of component 203 may be captured, and the control unit 19 may recognize the condition of the underside of component 203. The camera 18 may be positioned away from directly below the flux supply device 15.

[0047] Next, the movement of the mounting head 12 will be described with reference to Figures 2 to 6. As shown in Figure 2, when the mounting head 12, which has picked up the component 203, arrives at the flux attachment position Pc from the transfer position Pb, the mounting head 12 lowers the tool 35 using the tool lifting mechanism 41, as shown in Figure 3, to attach the flux 3 to the bumps on the back surface of the component 203. In this specification, flux 3 may include not only flux alone, but also solder paste containing flux.

[0048] After applying flux 3 to the back surface of component 203, as shown in Figure 4, the mounting head 12 raises component 203 using the tool lifting mechanism 41, and the mounting head moving mechanism 33 moves the mounting head 12 from the flux application position Pc to the mounting position Pa where the stage 13 holds the substrate 201. As shown in Figure 5, when the mounting head 12, which has picked up component 203, arrives at the mounting position Pa, as shown in Figure 6, the mounting head 12 lowers the tool 35 using the tool lifting mechanism 41 to mount component 203 onto the substrate 201.

[0049] (Configuration of the flux supply system) Next, the flux supply device 15 will be described with reference to Figures 6 and 7. Figure 7 is a perspective view of the flux supply device 15.

[0050] The flux supply device 15 supplies flux to be applied to the part 203. The flux supply device 15 comprises a flux supply unit 51 for supplying flux and a suspension device 52 for suspending the flux supply unit 51 from the beam 17.

[0051] The flux supply unit 51 comprises a stage 53, a drive unit 54, a flux supply unit 55, a stage support member 56, and a pair of rails 57.

[0052] The stage support member 56 supports the stage 53 from below so that it can move between the transfer position Pd and the standby position Pe (see Figures 8 and 9). A pair of rails 57 are arranged on the substantially rectangular stage support member 56. The stage 53 is slidably positioned on the pair of rails 57.

[0053] Stage 53 supplies flux 3 to the mounted head 12. Stage 53 is, for example, a rectangular plate made of metal or resin, and has a recess 58 on one end. Flux 3 is stored in the recess 58.

[0054] The drive unit 54 moves the stage 53 between the transfer position Pd and the standby position Pg. The drive unit 54 comprises a drive motor 59, a ball screw 60, and a fixing block 61.

[0055] The drive motor 59 rotates the ball screw 60 in both forward and reverse directions, causing the fixed block 61, which is a nut engaged with the ball screw 60, to reciprocate. The fixed block 61 is fixed to the other end of the stage 53. Therefore, the stage 53 reciprocates as the ball screw 60 rotates.

[0056] The flux supply unit 55 supplies flux to the recess 58 of the stage 53. The flux supply unit 55 comprises a flux storage unit 62 and a pair of arms 63.

[0057] The flux storage section 62 has a hollow, cylindrical through-hole 62a with openings at both the bottom and top. The flux storage section 62 has two walls 62e that intersect with the reciprocating direction (X-axis direction) in which the stage 53 moves, and the two walls 62e face each other (see Figure 8). The walls 62e of the flux storage section 62 extend, for example, perpendicular to the reciprocating direction of the stage 53. The flux storage section 62 stores flux inside. The lower opening of the flux storage section 62 is closed by the upper surface of the stage 53, so that the flux inside the flux storage section 62 does not leak out to the outside. A pair of arms 63 are connected to the flux storage section 62, and the outer ends of each arm 63 are fixed to the stage support member 56.

[0058] Next, the operation of the stage 53 of the flux supply device 15 will be described with reference to Figures 8 to 11. Figure 8 is a plan view of the flux supply unit 55 with the recess 58 at the transfer position Pd. Figure 9 is a front view of the component mounting device 1 showing the stage 53 of the flux supply device 15 with the recess 58 at the transfer position Pd. Figure 10 is a plan view of the flux supply unit 55 with the recess 58 at the standby position Pe. Figure 11 is a front view of the component mounting device 1 showing the stage 53 of the flux supply device 15 with the recess 58 at the standby position Pe.

[0059] The flux supply device 15, positioned at the flux attachment position Pc in the Y-axis direction, moves the stage 53 between the transfer position Pd and the standby position Pe in the X-axis direction. As shown in Figures 8 and 9, when the stage 53 is at the transfer position Pd, the recess 58 of the stage 53 is positioned below the tool 35 of the mounting head 12, which is located at the flux attachment position Pc. Therefore, when the mounting head 12, which has picked up the part 203, descends, flux can be applied to the underside of the part 203.

[0060] As shown in Figures 10 and 11, when the recess 58 is in the standby position Pe, the flux supply unit 55 is located on the transfer position Pd side of the recess 58. By performing a first operation in which the flux supply unit 55 reciprocates between the standby position Pe and the slide position Pf (see Figure 12), the transfer marks left on the recess 58 can be reduced. At the slide position Pf, the recess 58 is located on the transfer position Pd side of the flux supply unit 55.

[0061] Referring to Figures 13 to 15, the first operation for reducing transfer marks will be described. Figures 13 to 15 are longitudinal cross-sectional views showing one step in the film formation process of flux 3 according to Embodiment 1.

[0062] The stage 53, with the recess 58 located at the standby position Pe, is moved by the drive unit 54 via the film deposition control unit 94 to the transfer position Pd, causing the stage 53 to pass over the recess 58 through the flux supply unit 55. At this time, the flux 3 stored in the flux storage unit 62 of the flux supply unit 55 mixes with the flux in the recess 58, thereby reducing the transfer marks left on the flux 3 in the recess 58 (Figure 14).

[0063] After the flux supply unit 55 passes over the recess 58, as shown in Figure 15, the drive unit 54 stops the recess 58 of the stage 53 at the sliding position Pf by the film deposition control unit 94, and then moves the recess 58 back to the standby position Pe. This first operation, which is a reciprocating motion from standby position Pe to sliding position Pf and back to standby position Pe, is performed at least once, for example, two or more times, for example, about seven times. The first operation is also an operation to move the stage 53 in the direction toward the transfer position Pd and in the direction toward the transfer position Pd.

[0064] This first operation eliminates depth-direction transfer marks in the flux 3 of the recess 58, but leaves streaks in the reciprocating direction on the surface of the flux 3 in the recess 58. To eliminate these streaks, the film deposition control unit 94 causes the drive unit 54 to perform a third operation, from the standby position Pe to the sliding position Pf, at a slower movement speed of the stage 53 than the first operation. The speed of the first operation is at least twice the speed of the third operation, for example, between 10 and 50 times. For example, the speed of the first operation is 250 mm / s, and the speed of the third operation is 10 mm / s. The faster the speed of the first operation, the greater the amount of streaks formed on the surface of the flux 3. As streaks are formed on the surface of the flux 3, it is stirred from below, so the faster the speed of the first operation, the greater the amount of streaks formed on the surface of the flux 3, making it easier to thoroughly stir the entire flux 3 in the recess 58 and further eliminating the transfer marks.

[0065] This third operation allows the surface of flux 3 to be flattened more uniformly. After the completion of the third operation, the film deposition control unit 94 causes the drive unit 54 to move the recess 58 of the stage 53 to the transfer position Pd at a higher speed.

[0066] Next, with reference to Figure 16, the control unit 19 of the component mounting device 1 will be described. The control unit 19 is communicated with the touch panel 20, the component supply unit movement unit 23, the stage movement unit 25, the stage tilt adjustment unit 29, the mounting head movement mechanism 33, the component heating unit 37, the tool temperature sensor 39, the tool lifting mechanism 41, the pressure sensor 43, the ultrasonic oscillator 45, and the drive unit 54, respectively.

[0067] The control unit 19 is configured to control the component mounting device 1. The control unit 19 is a circuit including semiconductor elements, and for example, it includes a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that realizes predetermined functions by executing a program. The control unit 19 has a storage unit 95 such as memory, a hard disk, or an SSD, and realizes its functions by executing a program stored in the storage unit 95.

[0068] The control unit 19 comprises a mounting control unit 93, a film formation control unit 94, and a storage unit 95.

[0069] The mounting control unit 93 controls the operation of the parts supply unit moving unit 23, the stage moving unit 25, the mounting head moving mechanism 33, and the tool lifting mechanism 41 based on the production program 96 in the memory unit 95.

[0070] The film deposition control unit 94 controls the operation of the drive unit 54 to erase the transfer marks left in the flux 3 in the recesses 58 of the stage 53 and deposit a uniform film on the surface.

[0071] The production program 96 is a program necessary to operate the component mounting device 1. The production program 96 also includes information such as the component mounting positions (coordinates) on the circuit board 201, as well as the names and mounting order of the components 203 to be mounted there.

[0072] The memory unit 95 stores the number of reciprocating movements 97 performed by the first operation, and the film deposition control unit 94 determines whether the number of first operations has reached the stored number 97. The number of movements 97 may be changed according to the viscosity of the flux 3, and the higher the viscosity, the larger the value of the number of movements 97 may be.

[0073] (Flux deposition method) Next, with reference to Figure 17, the deposition process of flux 3 in the recessed area after dipping will be explained. Figure 17 is a flowchart of the deposition process of flux 3.

[0074] After the part 203 is dipped in flux 3, a transfer mark remains in the flux 3 of the recess 58. In step S1, the film deposition control unit 94 drives the drive unit 54 to move the recess 58 of the stage 13 of the flux supply unit 51 to the standby position Pe.

[0075] After the flux 3 is transferred to the component 203 by the mounting head 12, the film deposition control unit 94 retracts the stage 53 from the transfer position Pd at a speed faster than the speed at which the stage 53 is moved relative to the flux storage unit 62 in the third operation. This improves work efficiency.

[0076] In step S2, the film deposition control unit 94 drives and controls the drive unit 54 to perform a first operation in which the flux storage unit 62 is moved back and forth relative to the stage 13. The film deposition control unit 94 may perform the first operation while the mounting head 12 is transporting the component 203 from the transfer position Pd and bringing it into contact with the substrate 201 by the mounting control unit 93, or while the mounting head 12 is picking up the component 203 from the component supply unit 11 and moving to the transfer position Pd. Alternatively, the film deposition control unit 94 may perform the first operation while the mounting head 12 is moving to the component supply unit 11 after mounting the component 203 on the substrate 201. Performing the first operation while component mounting or component pickup operations are being performed can improve work efficiency.

[0077] In step S3, the film deposition control unit 94 determines whether the number of times the first operation has been performed has reached a predetermined number 97 stored in the memory unit 95. If the film deposition control unit 94 determines that the predetermined number 97 has not been reached (No in step S3), the film deposition control unit 94 continues the first operation. If the film deposition control unit 94 determines that the predetermined number 97 has been reached (Yes in step S3), in step S4, the film deposition control unit 94 drives and controls the drive unit 54 to perform the third operation of flux deposition finishing.

[0078] In step S5, the film formation control unit 94 drives the drive unit 54 to move the recess 58 of the stage 53 to the transfer position Pd.

[0079] When performing the second operation after the third operation, the stage 53 is moved to the transfer position Pd at a speed faster than the speed at which the stage 53 is moved relative to the flux reservoir 62 in the third operation. This improves work efficiency.

[0080] (effect) As described above, the component mounting device 1 of Embodiment 1 includes a stage 53 having a recess 58 for accumulating flux 3, a flux storage unit 62 for flattening the surface of the flux 3 accumulated in the recess 58, a drive unit 54 for moving the stage 53 relative to the flux storage unit 62, a mounting head 12 as a transfer unit for bringing the component 203, which is the object to be held, into contact with the flattened flux 3, and a film formation control unit 94 for controlling the relative movement of the stage 53 by the drive unit 54. The film formation control unit 94 performs a first operation in which the flux storage unit 62 is moved back and forth relative to the recess 58 while the flux 3 accumulated in the recess 58 is moved away from the transfer position Pd, which is the position from which the flux 3 can be transferred to the component 203 held by the mounting head 12, and a second operation in which the stage 53 is moved to the transfer position Pd. The transfer unit includes a mounting head 12 that takes out a component 203 from the component supply unit 11 and mounts the component 203, which has come into contact with the flux 3, onto the substrate 201.

[0081] Furthermore, the transfer method of Embodiment 1 is a transfer method for transferring flux 3 accumulated in the recess 58 of the stage 53 to a component 203 held by the mounting head 12. The first step is to move the flattening part back and forth relative to the recess while it is retracted from the transfer position Pd from which it is possible to transfer the flux 3 accumulated in the recess 58 to the component 203 held by the mounting head 12, The process includes a second step of moving the stage to the transfer position after the first step.

[0082] By performing two types of first and second operations, it is possible to uniformly deposit a film on the surface of flux 3 where transfer marks from dipping of component 203 remain, thereby improving the accuracy of film deposition.

[0083] Next, a modified example 1 of the component mounting device 1 of Embodiment 1 will be described with reference to Figures 18 and 19. Figures 18 and 19 are longitudinal cross-sectional views showing one step of the film formation process of flux 3 according to Modified Example 1 of Embodiment 1, respectively.

[0084] In Embodiment 1, the relative movement range of the flux supply unit 55 in the first operation was between the standby position Pe and the sliding position Pf, but is not limited to this. The relative movement range of the flux supply unit 55 is not limited to this. For example, as shown in Figures 18 and 19, it may be between the position where the inner wall of the flux storage unit 121 on the transfer position Pd side is directly above the inner wall of the recess 58 on the transfer position Pd side, and the position where the inner wall of the flux storage unit 121 on the drive unit 54 side is directly above the inner wall of the recess 58 on the drive unit 54 side. This allows the first operation to be performed quickly and in a short amount of time.

[0085] Next, a modified example 2 of the component mounting device 1 of Embodiment 1 will be described with reference to Figures 20 and 21. Figures 20 and 21 are longitudinal cross-sectional views showing one step of the flux 3 film formation process according to the modified example 2 of Embodiment 1, respectively.

[0086] In the modified example 2 of Embodiment 1, for example, as shown in Figures 20 and 21, the part 203 transferred to the recess 58 may reciprocate by an amount equal to the size of the movement direction of the stage 53. For example, the inner wall of the flux reservoir 121 on the transfer position Pd side may be located between a position directly above the end of the part 203 on the transfer position Pd side at the time of dipping and a position directly above the end of the part 203 on the drive unit 54 side at the time of dipping. This allows the first operation to be performed at a higher speed and in a shorter time.

[0087] Next, a modified example 3 of the component mounting device 1 of Embodiment 1 will be described with reference to Figure 22. Figure 22 is a longitudinal cross-sectional view showing one step of film formation of flux 3 according to modified example 3 of Embodiment 1.

[0088] In the modified example 3 of Embodiment 1, the flattening portion is composed of a single blade 71. The blade 71 may be biased downward, or the blade 71 may be an elastic material. As a result, when the stage 53 is moved relative to the blade 71 by the drive unit 54, the lower end 71d of the blade 71 slides within the recess 58. This makes it possible to erase the transfer marks.

[0089] [Embodiment 2] Next, the component mounting device 1A in Embodiment 2 will be described with reference to Figures 23 and 24. Figure 23 is a side view showing the schematic configuration of the component mounting device 1A according to Embodiment 2. Figure 24 is a block diagram showing the functional configuration of the component mounting device 1A according to Embodiment 2. The component mounting device 1A in Embodiment 2 has a configuration in which a flux transfer device 111 is added to the component mounting device 1 in Embodiment 1. Regarding this point and the configuration other than those described below, the component mounting device 1A in Embodiment 2 and the component mounting device 1 in Embodiment 1 are common, so a detailed explanation will be omitted.

[0090] (Flux transfer device) The flux transfer apparatus 111 transfers flux 3 to the electrode portion on the substrate 201 held on the stage 13 where the component 203 is mounted. The flux transfer apparatus 111 includes a transfer head 113 to which one end of a plurality of transfer pins 112 is fixed, a transfer head moving mechanism 114, and a transfer head lifting mechanism 115.

[0091] The transfer head 113 has a plurality of transfer pins 112. The transfer head 113 is a component that holds flux 3 at the tips of the transfer pins 112 and transfers it to the surface of the substrate 201.

[0092] The transfer pins 112 have flux 3 attached to their tips and transfer the flux 3 to predetermined electrode areas on the substrate 201. The transfer pins 112 have a columnar structure. Multiple transfer pins 112 are arranged in predetermined patterns corresponding to the patterns of each electrode area on the substrate 201 where components 203 are mounted. The transfer pins 112 are made of resin or metal.

[0093] The transfer head moving mechanism 114 moves the transfer head 113 horizontally (in the Y-axis direction) to the standby position Pg, the mounting position Pa, and the flux attachment position Pc. The transfer head moving mechanism 114 includes a rail 34 arranged along the Y-axis direction on the beam 17 and a linear motor (not shown) for moving the transfer head 113. The amount of drive of the linear motor is controlled by the control unit 19, and the transfer head 113 can move along the rail 34 on the beam 17 by the amount of drive of the linear motor.

[0094] The transfer head lifting mechanism 115 raises and lowers the transfer head 113 relative to the stage 13 and the flux supply device 15. Therefore, the transfer head lifting mechanism 115 raises and lowers the transfer head 113 in the vertical direction at the mounting position Pa and the flux application position Pc, respectively. The transfer head lifting mechanism 115 includes, for example, a linear motor (not shown) for raising and lowering the transfer head 113, an arm (not shown) that is moved vertically by the linear motor, and an encoder (not shown) for detecting the amount of drive of the motor. The amount detected by the encoder is transmitted to the control unit 19, which can calculate the height of the transfer head 113.

[0095] As shown in Figure 23, when the mounting head 12 is at a position away from the mounting position Pa and the component 203 has not yet been mounted on the substrate 201, the mounting control unit 93 moves the transfer head 113 toward the flux attachment position Pc using the transfer head moving mechanism 114.

[0096] As shown in Figure 25, when the transfer head 113 arrives at the flux attachment position Pc, the mounting control unit 93 starts the operation of attaching flux to the transfer pins 112 of the transfer head 113. As shown in Figure 26, the mounting control unit 93 drives and controls the transfer head lifting mechanism 115 to lower the transfer head 113 toward the flux supply unit 51, and when the tip of the transfer pin 112 comes into contact with the flux 3 supplied by the flux supply device 15, the flux 3 adheres to the tip of the transfer pin 112.

[0097] As shown in Figure 27, the mounting control unit 93 drives and controls the transfer head lifting mechanism 115 to raise the transfer head 113 holding the flux 3, and the transfer head moving mechanism 114 moves the transfer head 113 above the stage 13 at the mounting position Pa. As shown in Figure 26, at the mounting position Pa, the mounting control unit 93 lowers the transfer head 113 toward the substrate 201 using the transfer head lifting mechanism 115. When the transfer head 113 comes into contact with the substrate 201, the flux 3 is transferred to the substrate 201.

[0098] In the component mounting apparatus 1A of Embodiment 2, the flux storage unit 62 performs two types of first and second operations, which allows for uniform film formation on the surface of the flux 3 where transfer marks from the dipping of the component 203 remain, thereby improving film formation accuracy.

[0099] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various variations and modifications will be obvious to those skilled in the art. Such variations and modifications should be understood as being included within the scope of this disclosure as defined by the attached claims. Furthermore, variations in combinations and sequences of elements in each embodiment can be realized without departing from the scope and spirit of this disclosure.

[0100] (1) In the above-described embodiment, the control unit 19 of the component mounting device 1 controlled the deposition of the flux 3, but this is not limited to this. As shown in Figure 29, a management device 153 that is communicatively connected to the component mounting device 1 may have a deposition control unit 94 and a storage unit 155, and drive control the drive unit 54 of the flux supply unit 51.

[0101] The component mounting system 151 comprises a component mounting device 1 and a management device 153 that can access the control unit 19 of the component mounting device 1. The component mounting system 151 may include multiple component mounting devices 1, and the management device 153 may be able to access multiple control units 19. The management device 153 collects information on the mounting status of the component mounting device 1 by accessing the control unit 19.

[0102] The management device 153 centrally manages the production information of the component mounting device 1. The management device 153 is, for example, a host computer and can be composed of circuits such as a microcontroller, CPU, MPU, GPU, DSP, FPGA, or ASIC. The functions of the management device 153 are realized by combining hardware and software. The management device 153 realizes predetermined functions by reading data and programs stored in the memory unit and performing various calculation processes.

[0103] The component mounting system 151 includes a stage 53 having a recess 58 for accumulating flux 3, a flux storage unit 62 for flattening the surface of the flux 3 accumulated in the recess 58, a drive unit 54 for moving the stage 53 relative to the flux storage unit 62, a mounting head 12 as a transfer unit for bringing the component 203, which is the object being held, into contact with the flattened flux 3, and a film deposition control unit 94 for controlling the relative movement of the stage 53 by the drive unit 54. The film deposition control unit 94 performs a first operation in which the flux storage unit 62 is moved back and forth relative to the recess 58 while the flux 3 accumulated in the recess 58 is moved away from the transfer position Pd, which is the position from which the flux 3 can be transferred to the component 203 held by the mounting head 12, and a second operation in which the stage 53 is moved to the transfer position Pd. The transfer unit includes a mounting head 12 that takes out a component 203 from the component supply unit 11 and mounts the component 203, which has come into contact with the flux 3, onto the substrate 201.

[0104] In the component mounting system 151, the flux storage unit 62 performs two types of first and second operations, which allows for uniform film formation on the surface of the flux 3 where transfer marks from the dipping of the component 203 remain, thereby improving film formation accuracy.

[0105] (2) In the above-described embodiment, the film deposition control unit 94 determined whether to continue or stop the first operation based on a predetermined number of times 97 stored in the memory unit 155, but is not limited to this. The component mounting device 1 further includes a camera that images the surface of the flux 3 accumulated in the recess 58 of the stage 13, and the film deposition control unit 94 may continue or stop the first operation based on the imaging results of the camera. The film deposition control unit 94 may terminate the first operation and perform the third and second operations by detecting a line along the direction of movement of the stage 13 where the transfer trace has disappeared through image processing of the image captured by the camera.

[0106] Furthermore, by appropriately combining any embodiment or modification from the various embodiments and modifications described above, the effects of each can be achieved. [Industrial applicability]

[0107] The component mounting apparatus, component mounting system, and transfer method relating to this disclosure are applicable to component mounting apparatus, component mounting system, and transfer method for attaching flux to components or substrates. [Explanation of Symbols]

[0108] 1. 1A Component Mounting Device 3. Flux 11. Parts Supply Department 12 mounted heads 13 stages 15, 15B Flux supply device 17 Beam 18 Cameras 19 Control Unit 20 Touch Panel 21 base 23 Parts supply unit moving unit 25 Stage Movement Section 27 Stage heating section 29 Stage tilt adjustment section 31 Pickup head 33. Mounted head movement mechanism 34 rails 35 Tools 37. Parts heating section 39 Tool Temperature Sensor 41 Tool lifting mechanism 43 Pressure Sensor 45 Ultrasonic Oscillator 51 Flux supply unit 52, 52B Lifting equipment 53 stages 54 Drive unit 55 Flux supply section 56 Stage support member 57 rails 58 recess 59 Drive motor 60 Ball Screw 61 Fixed Block 62 Flux storage section 62a through hole 62b, 62c opening 62d bottom end 63 Arm 93 Mounted Control Unit 94 Film Deposition Control Unit 95 Memory section 97 times 111 Flux Transfer Apparatus 112 Transfer Pins 113 Transfer head 114 Transfer head movement mechanism 115 Transfer head lifting mechanism 116 Pressure Sensor 151-component mounting system 153 Management device 155 Storage section 201 circuit board 203 parts Pa mounting position Pb handover location Pc flux application location Pd transfer location Pe standby position Pf slide position

Claims

1. A stage having a recess for accumulating flux, A flattening section for flattening the surface of the flux accumulated in the recess, A drive unit that moves the stage relative to the flattening unit, A transfer unit that brings the held object into contact with the flattened flux, The system includes a control unit that controls the relative movement of the stage by the drive unit, The control unit, by the drive unit, A first operation involves moving the flattening unit back and forth relative to the recess, while the flux accumulated in the recess is moved away from the transfer position from which it can be transferred to the object held in the transfer unit. A second operation is performed to move the stage to the aforementioned transfer position. The transfer unit includes a mounting head that takes a component as the target object from a component supply unit and mounts the component that has come into contact with the flux onto a substrate, or a transfer head having a plurality of transfer pins as the target object for transferring the flux onto the substrate. Component mounting device.

2. The first operation involves moving the stage in a direction toward the transfer position and in a direction toward the transfer position. The component mounting device according to claim 1.

3. The control unit performs the first operation while the transfer unit is transporting the object from the transfer position and bringing it into contact with the substrate. The component mounting device according to claim 1.

4. The control unit performs the first operation while the mounting head, which acts as the transfer unit, is taking the part, which acts as the object, from the part supply unit and moving to the transfer position. The component mounting device according to claim 1.

5. The control unit performs the first operation while the mounting head, which acts as the transfer unit, is moving to the component supply unit after it has taken the component, which acts as the object, out of the component supply unit and mounted it onto the substrate. The component mounting device according to claim 1.

6. The control unit, after the first operation and before the second operation, performs a third operation in which the flattening unit flattens the surface of the flux in the recess at a speed slower than the speed at which the stage is moved relative to the flattening unit in the first operation. The component mounting device according to claim 1.

7. When the control unit performs the second operation after the third operation, it moves the stage to the transfer position at a speed faster than the speed at which the stage is moved relative to the flattening section in the third operation. The component mounting device according to claim 6.

8. The control unit, after the flux has been transferred to the object by the transfer unit, retracts the stage from the transfer position at a speed faster than the speed at which the stage is moved relative to the flattening unit in the third operation. The component mounting device according to claim 7.

9. The system further includes a storage unit that stores data relating to the number of relative movements of the stage with respect to the flattening unit in the first operation, The control unit causes the drive unit to perform the first operation based on the number of times. The component mounting device according to claim 1.

10. The stage further comprises an imaging unit for imaging the surface of the flux accumulated in the recess of the stage, The control unit continues or stops the first operation based on the imaging results of the imaging unit. The component mounting device according to claim 1.

11. In the first operation, the control unit moves the stage back and forth within a range greater than the width of the recess in the reciprocating direction, while the stage is retracted from the transfer position. The component mounting device according to claim 1.

12. The flattening section has a through hole that penetrates in the vertical direction, one opening of the through hole is closed by the stage, and the through hole is a flux storage section for storing the flux. A component mounting device according to any one of claims 1 to 11.

13. A stage having a recess for accumulating flux, A flattening section for flattening the surface of the flux accumulated in the recess, A drive unit that moves the stage relative to the flattening unit, A transfer unit that brings the held object into contact with the flattened flux, The system includes a control unit that controls the relative movement of the stage by the drive unit, The control unit, by the drive unit, A first operation involves moving the stage to a transfer position in which the flux accumulated in the recess can be transferred to the object held in the transfer unit, A second operation is performed in which the stage is moved away from the transfer position and the flattening portion is moved back and forth relative to the recess, The transfer unit includes a mounting head that takes a component as the target object from a component supply unit and mounts the component that has come into contact with the flux onto a substrate, or a transfer head having a plurality of transfer pins as the target object for transferring the flux onto the substrate. Component mounting system.

14. A transfer method in which flux accumulated in a recess of a stage is transferred to an object held by a transfer unit, The first step involves moving the flux accumulated in the recess away from the transfer position where it can be transferred to the object held in the transfer unit, and then moving the flattening unit back and forth relative to the recess. The process includes a second step of moving the stage to the transfer position after the first step, Transfer method.

Images