Method for manufacturing a substrate and method for manufacturing a light-emitting device

Abstract

The present invention provides a method for manufacturing a substrate and a method for manufacturing a light-emitting device, which allow for the easy placement of a solid having a higher thermal conductivity than a conductive material within a resin layer. [Solution] The manufacturing method according to the embodiment is a method for manufacturing a substrate comprising a resin layer, a conductive member disposed in the resin layer, and a solid having a higher thermal conductivity than the conductive member. The manufacturing method comprises a preparation step of preparing the resin layer having a first surface and a second surface opposite to the first surface. The manufacturing method also comprises a solid placement step of directly or indirectly placing the solid on the first surface and pressing the resin layer and the solid to place at least a portion of the solid into the resin layer. The manufacturing method also comprises a conductive member placement step after the solid placement step of placing the conductive member into the resin layer.

Claims

1. A method for manufacturing a substrate comprising a resin layer, a conductive member disposed within the resin layer, and a solid having a higher thermal conductivity than the conductive member, A preparation step of preparing the resin layer having a first surface and a second surface opposite to the first surface, A solid body placement step involves placing the solid body directly or indirectly on the first surface and pressurizing the resin layer and the solid body to place at least a portion of the solid body into the resin layer. A method for manufacturing a substrate, comprising a conductive member placement step of placing the conductive member in the resin layer after the solid body placement step.

2. In the preparation step, two resin layers, each having the first surface and the second surface, are prepared. The aforementioned solid body arrangement step is, With the solid positioned between the two resin layers, the solid is placed directly or indirectly on the first surface of the two resin layers, and the two resin layers are each pressurized toward the solid, thereby placing the solid within each of the two resin layers. Includes, The method for manufacturing a substrate according to claim 1, wherein in the conductive member arrangement step, the conductive member is arranged in each of the two resin layers.

3. The method for manufacturing a substrate according to claim 1, wherein the solid body arrangement step includes a step of heating the resin layer and the solid body under pressure.

4. The method for manufacturing a substrate according to claim 1, wherein in the solid body placement step, adhesiveness is applied to a part of the first surface, the solid body is bonded to the part of the first surface, and the bonded solid body is pressurized.

5. The method for manufacturing a substrate according to claim 1, wherein the solid body comprises at least one selected from the group consisting of diamond, silicon carbide, boron nitride, and nanocarbon.

6. The method for manufacturing a substrate according to claim 1, wherein the diameter of the solid is 50 μm or more and 500 μm or less.

7. The bending strength of the resin layer prepared in the above preparation step is 450 N / mm ２ 550N / mm or more ２ The method for manufacturing a substrate according to claim 1, which is as follows:

8. The method for manufacturing a substrate according to claim 1, wherein the conductive member contains copper.

9. A method for manufacturing a substrate according to any one of claims 1 to 8, A light-emitting element placement step of arranging a light-emitting element on the solid body and the conductive member, A method for manufacturing a light-emitting device, comprising the above.

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