Semiconductor equipment
A semiconductor device with a main terminal design that distributes stress by separating narrow and wide portions prevents cracks, enhancing stability and reducing heat generation, facilitating miniaturization and cost efficiency.
JP2026098944APending Publication Date: 2026-06-18FUJI ELECTRIC CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- FUJI ELECTRIC CO LTD
- Filing Date
- 2024-12-06
- Publication Date
- 2026-06-18
AI Technical Summary
Technical Problem
The occurrence of cracks in main terminals of semiconductor devices due to stress concentration at the transition from a narrow to a wide portion, caused by ultrasonic bonding, is a significant issue.
Method used
The design of a main terminal with a narrow portion extending over a vertical and bent portion, followed by a wide portion that does not overlap with the bent portion, distributes stress and reduces the likelihood of cracks.
Benefits of technology
This design effectively suppresses the occurrence of cracks in the main terminals, stabilizes the semiconductor device, extends its lifespan, and reduces heat generation, while allowing for miniaturization and cost reduction.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026098944000001_ABST
Abstract
To provide a semiconductor device that suppresses the occurrence of cracks in the main terminals. [Solution] In a semiconductor device, the main terminal (140) has a narrow portion (140-1) including a vertical portion (142) that extends perpendicularly to the mounting surface of the semiconductor element on the laminated substrate, and a wide portion (140-2) in which the width in the width direction (D) of the main terminal (140) is wider than that of the narrow portion (140-1) (W2>W1). The narrow portion (140-1) is located on one end side of the wide portion (140-2) in the width direction (D). The main terminal (140) is provided with an extended portion (143) that extends outward from the laminated substrate, separated by a bent portion (C2), from the end of the vertical portion (142) opposite to the laminated substrate. The narrow portion (140-1) extends over at least the vertical portion (142), the curved portion (C2), and a part of the extended portion (143), and the wide portion (140-2) extends over at least another part of the extended portion (143) that is different from the aforementioned part.
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