Aluminum alloy rolled material and method for manufacturing the same, and aluminum substrate

An aluminum alloy with tailored composition and manufacturing process addresses thermal expansion and strength issues, achieving improved thermal conductivity and stability for electronic component substrates.

JP2026099055APending Publication Date: 2026-06-18SAKAI ALUMINUM CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SAKAI ALUMINUM CO LTD
Filing Date
2024-12-06
Publication Date
2026-06-18

AI Technical Summary

Technical Problem

Conventional aluminum alloys used in metal base substrates for electronic components face challenges such as warping due to thermal expansion coefficient differences with copper foils, disconnection of circuit copper foils, and cracking in solder joints, while also lacking sufficient thermal conductivity and material strength.

Method used

An aluminum alloy composition with specific ranges of Si, Fe, Cu, Mn, Mg, Ti, Sr, and other elements, combined with a manufacturing process involving homogenization, hot and cold rolling, and a phosphoric acid anodized film, results in a material with low thermal expansion, high thermal conductivity, and enhanced strength.

Benefits of technology

The solution provides an aluminum alloy with improved thermal stability, heat dissipation, and mechanical strength, ensuring better adhesion to resin insulating layers and reducing the risk of cracking and warping.

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Abstract

This invention provides rolled aluminum alloy material with good thermal conductivity and a low coefficient of thermal expansion. [Solution] The chemical composition contains Si: 11.5-15.4 mass%, Fe: 0.1-0.5 mass%, Cu: 0.01-0.25 mass%, Mn: 0.005-0.2 mass%, Mg: 0.3-0.8 mass%, Ti: 0.01-0.05 mass%, Sr: 0.005-0.04 mass%, B: 0.03 mass% or less, P: 0.005 mass% or less, Na: 0.005 mass% or less, Ca: 0.005 mass% or less, In is restricted to 0.004 mass% or less, the remainder consists of Al and unavoidable impurities, and the conductivity is 40% IACS or more and 52% IACS or less.
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