Light-emitting device and method for manufacturing a light-emitting device

Abstract

To improve the reliability of light-emitting devices that use liquid encapsulants. [Solution] The light-emitting device 10 comprises a package substrate 14 having an upper surface 32 and a recess 36 provided on the upper surface 32, a light-emitting element 12 provided on the bottom surface 38 of the recess 36, a liquid sealing part 16 provided in the recess 36 and immersing the light-emitting element 12, an affinity layer 20 provided on the surface of the light-emitting element 12 and in contact with the liquid sealing part 16, and a solid sealing part 18 covering the upper surface 32 of the package substrate 14 and the liquid sealing part 16.

Description

Technical Field

[0001] The present invention relates to a light-emitting device and a method for manufacturing the light-emitting device.

Background Art

[0002] A light-emitting element is sealed by a package. For example, a configuration has been proposed in which a light-emitting element and a liquid are accommodated inside a package and the light-emitting element is sealed by the liquid (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When air bubbles are mixed into the liquid for sealing, since the liquid has fluidity, the air bubbles can also flow inside the package. When the air bubbles adhere to the surface of the light-emitting element, the refractive index difference on the surface of the light-emitting element becomes larger compared to the case where the liquid is in contact, and the light extraction efficiency of the light-emitting element decreases.

[0005] The present invention has been made in view of such problems, and an object thereof is to provide a technique for improving the reliability of a light-emitting device using a liquid sealing material.

Means for Solving the Problems

[0006] A light-emitting device according to an aspect of the present invention includes a package substrate having an upper surface and a recess provided on the upper surface, a light-emitting element provided on the bottom surface of the recess, a liquid sealing portion provided in the recess and immersing the light-emitting element, an affinity layer provided on the surface of the light-emitting element and contacting the liquid sealing portion, and a solid sealing portion covering the upper surface of the package substrate and the liquid sealing portion.

[0007] Another aspect of the present invention is a method for manufacturing a light-emitting device. This method comprises forming an affinity layer on the surface of a light-emitting element; bonding the light-emitting element to the bottom surface of a recess provided on the upper surface of a package substrate; immersing the light-emitting element in the recess in a liquid sealing portion having affinity with the affinity layer; and forming a solid sealing portion that covers the upper surface of the package substrate and the liquid sealing portion. [Effects of the Invention]

[0008] According to the present invention, the reliability of light-emitting devices using liquid encapsulants can be improved. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic cross-sectional view showing the configuration of the light-emitting device according to the first embodiment. [Figure 2] This is a flowchart showing a method for manufacturing a light-emitting device according to the first embodiment. [Figure 3] This is a schematic cross-sectional view showing the configuration of the light-emitting device according to the second embodiment. [Modes for carrying out the invention]

[0010] Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. In the description, the same elements will be denoted by the same reference numerals, and redundant explanations will be omitted as appropriate. Furthermore, to aid in understanding the description, the dimensional ratios of each component in each drawing do not necessarily correspond to the dimensional ratios of the actual light-emitting element.

[0011] (First Embodiment) Figure 1 is a schematic cross-sectional view showing the configuration of a light-emitting device 10 according to an embodiment. The light-emitting device 10 comprises a light-emitting element 12, a package substrate 14, a liquid sealing part 16, a solid sealing part 18, and an affinity layer 20.

[0012] The light-emitting element 12 is a semiconductor light-emitting element configured to emit ultraviolet light with a central wavelength λ of about 360 nm or less. In order to output ultraviolet light of such a wavelength, an aluminum gallium nitride (AlGaN) - based semiconductor material with a bandgap of about 3.4 eV or more is used. In this embodiment, in particular, a DUV - LED (Deep UltraViolet - Light Emitting Diode) chip that emits deep ultraviolet light with a central wavelength λ of about 240 nm to 320 nm is shown.

[0013] The light - emitting element 12 includes a light - transmissive substrate 22, a semiconductor layer 24, an anode electrode 26, a cathode electrode 28, and a protective layer 30.

[0014] The light - transmissive substrate 22 is made of a material that is transmissive to the ultraviolet light emitted by the light - emitting element 12. The light - transmissive substrate 22 is, for example, made of sapphire (Al2O3). The light emitted by the semiconductor layer 24 is output to the outside from the surface (upper surface and side surfaces) of the light - transmissive substrate 22.

[0015] The semiconductor layer 24 is provided under the light - transmissive substrate 22. The semiconductor layer 24 includes, for example, an n - type semiconductor layer, an active layer, and a p - type semiconductor layer. The semiconductor layer 24 is made of an AlGaN - based semiconductor material. The AlGaN - based semiconductor material can be represented by the composition of In 1-x-y Al x Ga y N(0 < x + y ≦ 1, 0 < x < 1, 0 < y < 1). The semiconductor layer 24 is covered by the protective layer 30.

[0016] The anode electrode 26 includes a first contact electrode 26a and a first pad electrode 26b. The first contact electrode 26a is an internal electrode that contacts the semiconductor layer 24 and contacts the p-type semiconductor layer contained in the semiconductor layer 24. The first contact electrode 26a is made of a metal layer such as Rh. The first contact electrode 26a is covered by a protective layer 30. The first pad electrode 26b is an external electrode exposed to the outside of the protective layer 30 and is electrically connected to the first contact electrode 26a through an opening provided in the protective layer 30. The first pad electrode 26b is made of a metal layer such as Ni / Au.

[0017] The cathode electrode 28 includes a second contact electrode 28a and a second pad electrode 28b. The second contact electrode 28a is an internal electrode that contacts the semiconductor layer 24 and contacts the n-type semiconductor layer contained in the semiconductor layer 24. The second contact electrode 28a is made of a metal layer such as Ti / Al. The second contact electrode 28a is covered by a protective layer 30. The second pad electrode 28b is an external electrode exposed to the outside of the protective layer 30 and is electrically connected to the second contact electrode 28a through an opening provided in the protective layer 30. The second pad electrode 28b is made of a metal layer such as Ni / Au.

[0018] The protective layer 30 covers the semiconductor layer 24, the first contact electrode 26a, and the second contact electrode 28a. The protective layer 30 is composed of a dielectric material such as an oxide or nitride, for example, silicon oxide (SiO2), aluminum oxide (Al2O3), or silicon nitride (SiN). The protective layer 30 may be composed of a laminate of multiple protective layers made of different materials.

[0019] The package substrate 14 is made of, for example, an inorganic material and is made of a ceramic material such as alumina (Al2O3), aluminum nitride (AlN), silicon nitride (SiN), silicon carbide (SiC). The package substrate 14 includes an upper surface 32 and a lower surface 34. The outer peripheries of the upper surface 32 and the lower surface 34 of the package substrate 14 are, for example, rectangular. The package substrate 14 includes a recess 36 provided inside the upper surface 32. The recess 36 has, for example, a rectangular parallelepiped shape and has a rectangular bottom surface 38 and four rectangular side surfaces 40.

[0020] The package substrate 14 includes a first bonding electrode 42 and a second bonding electrode 44 provided on the bottom surface 38 of the recess 36. The package substrate 14 includes a first mounting electrode 46 and a second mounting electrode 48 provided on the lower surface 34. The first bonding electrode 42 is electrically connected to the first mounting electrode 46. The second bonding electrode 44 is electrically connected to the second mounting electrode 48.

[0021] The light-emitting element 12 is housed inside the recess 36 of the package substrate 14. The depth h2 of the recess 36 is greater than the height h1 of the light-emitting element 12. The height h1 of the light-emitting element 12 is, for example, 0.1 mm or more and 1 mm or less, and for example, 0.2 mm or more and 0.8 mm or less. The depth h2 of the recess 36 is, for example, 0.2 mm or more and 2 mm or less, and for example, 0.3 mm or more and 1 mm or less.

[0022] The light-emitting element 12 is flip-chip bonded to the first bonding electrode 42 and the second bonding electrode 44. The light-emitting element 12 is bonded to the package substrate 14 via a first bonding portion 50 and a second bonding portion 52. The first bonding portion 50 is provided between the first pad electrode 26b and the first bonding electrode 42 and electrically connects the first pad electrode 26b and the first bonding electrode 42. The second bonding portion 52 is provided between the second pad electrode 28b and the second bonding electrode 44 and electrically connects the second pad electrode 28b and the second bonding electrode 44.

[0023] The liquid sealing portion 16 is provided to fill the recess 36 that accommodates the light-emitting element 12. The liquid sealing portion 16 is liquid and fluid at the operating temperature of the light-emitting element 12 (for example, between -10°C and 85°C). The liquid sealing portion 16 extends above the upper surface 12a of the light-emitting element 12, immersing the light-emitting element 12. The liquid sealing portion 16 is in contact with the affinity layer 20 provided on the surface of the light-emitting element 12. The liquid sealing portion 16 is in contact with the bottom surface 38 and the side surface 40 of the recess 36.

[0024] The liquid sealing portion 16 is translucent at the emission wavelength of the light-emitting element 12. The liquid sealing portion 16 has an internal transmittance of 50% or more at the peak emission wavelength of the light-emitting element 12, preferably 70% or more, 80% or more, or 90% or more. For example, fluorine oil can be used as the liquid sealing portion 16.

[0025] The solid sealing portion 18 is provided to cover the upper surface 32 and recess 36 of the package substrate 14. The solid sealing portion 18 covers the liquid sealing portion 16 provided in the recess 36, sealing it so that the liquid sealing portion 16 does not leak to the outside of the package substrate 14. The solid sealing portion 18 is solid and non-fluid at the operating temperature of the light-emitting element 12 (e.g., -10°C to 85°C). The solid sealing portion 18 is bonded to the upper surface 32 of the package substrate 14. The solid sealing portion 18 can be in direct contact with the liquid sealing portion 16. The solid sealing portion 18 may extend into the recess 36 or be in contact with the side surface 40 of the recess 36.

[0026] The solid encapsulation portion 18 has an internal transmittance of 50% or more at the peak emission wavelength of the light-emitting element 12, preferably 70% or more, 80% or more, or 90% or more. The solid encapsulation portion 18 may be made of an inorganic material such as quartz or sapphire, or an organic material such as silicone resin. The solid encapsulation portion 18 may be made of a thermosetting resin. In this case, the solid encapsulation portion 18 can be formed by applying a liquid thermosetting resin to cover the upper surface 32 of the package substrate 14 and the liquid encapsulation portion 16, and then heating and curing the liquid thermosetting resin.

[0027] The solid sealing portion 18 has a dome shape that protrudes upward from the upper surface 32 of the package substrate 14 and functions as a convex lens. The height h from the upper surface 32 of the package substrate 14 to the top 54 of the solid sealing portion 18 is, for example, 0.1 mm to 3 mm, or for example, 1 mm to 2.5 mm. The solid sealing portion 18 does not have to have a dome shape, and the top 54 of the solid sealing portion 18 may be formed as a flat or concave surface.

[0028] The affinity layer 20 is provided on the surface of the light-emitting element 12. The affinity layer 20 is made of a material that has affinity with the liquid sealing portion 16. The affinity layer 20 is made of a material that has a higher affinity with the liquid sealing portion 16 than the material that constitutes the surface of the light-emitting element 12 (for example, sapphire that constitutes the translucent substrate 22). Here, high affinity means that the difference in surface free energy is small, which means that wettability is high. Therefore, the affinity layer 20 is made of a material that has higher wettability with the liquid sealing portion 16 than the material that constitutes the surface of the light-emitting element 12.

[0029] When the liquid sealing portion 16 is fluorine oil, the affinity layer 20 is made of solid fluororesin. Since fluororesin is a material similar to fluorine oil, it has high wettability to fluorine oil. On the other hand, the materials that make up the surface of the light-emitting element 12 are inorganic materials such as sapphire which makes up the translucent substrate 22 and silicon oxide (SiO2) which makes up the protective layer 30. Inorganic materials that make up the surface of the light-emitting element 12 have lower wettability to fluorine oil compared to fluororesin.

[0030] The affinity layer 20 is provided so as to cover at least the upper surface 12a of the light-emitting element 12. The affinity layer 20 may further cover the side surface 12b of the light-emitting element 12. The affinity layer 20 may cover the surface (upper and side surfaces) of the light-transmitting substrate 22. The affinity layer 20 may cover the surface of the protective layer 30.

[0031] The affinity layer 20 prevents air bubbles from adhering to the surface of the light-emitting element 12, which is immersed in the liquid sealing portion 16. Because the affinity layer 20 has high wettability with the liquid sealing portion 16, it adheres closely to the liquid sealing portion 16. As a result, the surface of the light-emitting element 12 remains covered by the liquid sealing portion 16, and almost no air bubbles adhere to it. Consequently, the refractive index difference on the surface of the light-emitting element 12 can be reduced compared to when air is in contact with the surface of the light-emitting element 12, and the decrease in the light extraction efficiency of the light-emitting element 12 can be suppressed.

[0032] Figure 2 is a flowchart showing the manufacturing method of the light-emitting device 10 according to the first embodiment. First, an affinity layer 20 is formed on the surface of the light-emitting element 12 (S10). The affinity layer 20 can be formed, for example, by applying a liquid in which a solid resin is dissolved in a solvent and allowing the solvent to evaporate. The affinity layer 20 is composed of, for example, a solid fluororesin.

[0033] Next, the light-emitting element 12 is bonded to the bottom surface 38 of the recess 36 of the package substrate 14 (S12). The light-emitting element 12 is, for example, flip-chip bonded to the bottom surface 38. The anode electrode 26 and cathode electrode 28 of the light-emitting element 12 are bonded to the first bonding electrode 42 and the second bonding electrode 44 via the first bonding portion 50 and the second bonding portion 52, respectively.

[0034] The order of the steps for forming the affinity layer 20 (S10) and joining the light-emitting element 12 (S12) is not particularly important. Conversely to the flow in Figure 2, the affinity layer 20 may be formed on the surface of the light-emitting element 12 after it has been joined to the package substrate 14.

[0035] Next, the liquid sealing portion 16 is placed in the recess 36 of the package substrate 14, and the light-emitting element 12 in the recess 36 is immersed in the liquid sealing portion 16 (S14). The liquid sealing portion 16 is made of a material that has affinity with the affinity layer 20. For example, the liquid sealing portion 16 is fluorine oil. The liquid sealing portion 16 is placed up to a height above the upper surface 12a of the light-emitting element 12. Because the liquid sealing portion 16 has a high affinity with the affinity layer 20, it becomes in close contact with the affinity layer 20.

[0036] Next, a solid sealing portion 18 is formed to cover the upper surface 32 of the package substrate 14 and the liquid sealing portion 16 (S18). For example, a solid sealing portion 18 made of an inorganic or organic material can be placed on top of the liquid sealing portion 16, and the solid sealing portion 18 can be bonded to the upper surface 32 of the package substrate 14. Alternatively, a solid sealing portion 18 can be formed by applying a liquid thermosetting resin to cover the upper surface 32 of the package substrate 14 and the liquid sealing portion 16, and then heating and curing the liquid thermosetting resin. In this case, the liquid thermosetting resin is, for example, a silicone resin obtained by mixing a main agent and a curing agent. This makes it possible to manufacture the light-emitting device 10 shown in Figure 1.

[0037] According to this embodiment, since an affinity layer 20 is provided on the surface of the light-emitting element 12, it is possible to prevent air bubbles from adhering to the surface of the light-emitting element 12 that is immersed in the liquid sealing part 16. As a result, the refractive index difference on the surface of the light-emitting element 12 can be reduced, and the light output efficiency of the light-emitting element 12 can be improved.

[0038] According to this embodiment, since a solid affinity layer 20 is formed on the surface of the light-emitting element 12, the affinity layer 20 may deteriorate due to ultraviolet light emitted from the light-emitting element 12, potentially causing cracks in the affinity layer 20. However, since a liquid sealing portion 16 is present around the affinity layer 20, the liquid sealing portion 16 can fill the gaps in the cracks, thereby repairing the cracks. This prevents a decrease in light output and sealing performance due to crack formation, improving the reliability of the light-emitting device 10.

[0039] (Second Embodiment) Figure 3 is a schematic cross-sectional view showing the configuration of the light-emitting device 10A according to the second embodiment. In the second embodiment, the formation range of the affinity layer 20A differs from that of the first embodiment described above. The second embodiment will be described below, focusing on the differences from the first embodiment, and the common points will be omitted as appropriate.

[0040] The light-emitting device 10A comprises a light-emitting element 12, a package substrate 14, a liquid sealing part 16, a solid sealing part 18, and an affinity layer 20A. The light-emitting element 12, package substrate 14, liquid sealing part 16, and solid sealing part 18 can be configured in the same manner as in the first embodiment described above.

[0041] The affinity layer 20A covers the surface of the light-emitting element 12 and further covers the surface of the recess 36. The affinity layer 20A may also cover the bottom surface 38 of the recess 36. The affinity layer 20A may also cover the first junction electrode 42 and the second junction electrode 44. The affinity layer 20A may also cover the first junction portion 50 and the second junction portion 52. The affinity layer 20A may further cover the side surface 40 of the recess 36. The affinity layer 20A may further cover the side surface 40 of the recess 36 below the top surface 12a of the light-emitting element 12 58. The affinity layer 20A may further cover the side surface 40 of the recess 36 above the top surface 12a of the light-emitting element 12 56. The affinity layer 20A does not need to cover the side surface 40 of the recess 36. The affinity layer 20A does not need to cover the side surface 40 of the recess 36 above the upper surface 12a of the light-emitting element 12 56. The affinity layer 20A does not need to cover the side surface 40 of the recess 36 below the upper surface 12a of the light-emitting element 12 58.

[0042] The affinity layer 20A is made of a material with high affinity to the liquid sealing portion 16, similar to the affinity layer 20 in the first embodiment described above. When the liquid sealing portion 16 is a fluorine oil, the affinity layer 20A is made of a solid fluororesin.

[0043] The affinity layer 20A can be formed after the light-emitting element 12 is bonded to the package substrate 14. For example, the affinity layer 20A can be formed on the side surface 40 and bottom surface 38 of the recess 36 and on the surface of the light-emitting element 12 by filling the recess 36 to which the light-emitting element 12 is bonded with a liquid in which a solid resin is dissolved in a solvent, and then allowing the solvent to evaporate.

[0044] The method for forming the affinity layer 20A is not limited to the method described above. The affinity layer 20A may be formed before bonding the light-emitting element 12 to the package substrate 14. For example, a first affinity layer may be formed on the surface of the light-emitting element 12, and a second affinity layer may be formed on the side surface 40 of the recess 36 of the package substrate 14. Subsequently, the affinity layer 20A can be formed by bonding the light-emitting element 12 having the first affinity layer to the package substrate 14 having the second affinity layer.

[0045] In this embodiment as well, the same effects as in the above-described embodiment can be achieved. According to this embodiment, since the affinity layer 20A is also formed on the side surface 40 and bottom surface 38 of the recess 36 of the package substrate 14, the side surface 40 and bottom surface 38 of the recess 36 can be kept wet by the liquid sealing part 16, and it is possible to prevent air bubbles from adhering to and remaining on the side surface 40 and bottom surface 38 of the recess 36. This improves the reliability of the light-emitting device 10A.

[0046] The present invention has been described above based on embodiments. Those skilled in the art will understand that the present invention is not limited to the embodiments described above, that various design changes are possible, and that various modifications are possible, and that such modifications also fall within the scope of the present invention.

[0047] Several embodiments of the present invention will be described below.

[0048] A first aspect of the present invention is a light-emitting device comprising: a package substrate having an upper surface and a recess provided on the upper surface; a light-emitting element provided on the bottom surface of the recess; a liquid sealing portion provided in the recess for immersing the light-emitting element; an affinity layer provided on the surface of the light-emitting element and in contact with the liquid sealing portion; and a solid sealing portion covering the upper surface of the package substrate and the liquid sealing portion. According to the first aspect, an affinity layer is formed on the surface of the light-emitting element, and the state in which the surface of the light-emitting element is covered by the liquid sealing portion is maintained, thereby preventing air bubbles from adhering to the surface of the light-emitting element. As a result, the refractive index difference on the surface of the light-emitting element can be reduced compared to the case in which air comes into contact with the surface of the light-emitting element, and a decrease in the light extraction efficiency of the light-emitting element can be suppressed.

[0049] A second aspect of the present invention is a light-emitting device according to the first aspect, wherein the affinity layer has a higher affinity with the liquid sealing portion than with the surface of the light-emitting element. According to the second aspect, by providing an affinity layer with a high affinity with the liquid sealing portion on the surface of the light-emitting element, the adhesion of air bubbles to the surface of the light-emitting element can be prevented.

[0050] A third aspect of the present invention is a light-emitting device according to the first or second aspect, wherein the liquid sealing portion is composed of fluorine oil and the affinity layer is composed of fluororesin. According to the third aspect, by using fluorine oil for the liquid sealing portion, the light output and sealing performance of the light-emitting device can be improved. By using solid fluororesin for the affinity layer, the affinity with the liquid sealing portion can be increased, and the adhesion of air bubbles to the surface of the light-emitting element can be prevented.

[0051] A fourth aspect of the present invention is a light-emitting device according to any one of the first to third aspects, wherein the solid encapsulation portion is made of silicone resin. According to the fourth aspect, the reliability of the light-emitting device can be improved by using silicone resin for the solid encapsulation portion.

[0052] A fifth aspect of the present invention is a light-emitting device according to any one of the first to third aspects, wherein the solid sealing portion is made of an inorganic material. According to the fifth aspect, the reliability of the light-emitting device can be improved by using an inorganic material for the solid sealing portion.

[0053] A sixth aspect of the present invention is a light-emitting device according to any one of the first to fifth aspects, wherein the affinity layer covers the upper surface and side surface of the light-emitting element. According to the sixth aspect, since the affinity layer is formed on both the upper surface and side surface of the light-emitting element, the adhesion of air bubbles to both the upper surface and side surface of the light-emitting element can be prevented. This suppresses a decrease in the light extraction efficiency of the light-emitting element.

[0054] A seventh aspect of the present invention is a light-emitting device according to any one of the first to sixth aspects, wherein the affinity layer further covers the surface of the recess. According to the seventh aspect, by further covering the surface of the recess with the affinity layer, it is possible to suppress the remaining air bubbles on the surface of the recess when sealing with the liquid sealing part. This improves the reliability of the light-emitting device.

[0055] An eighth aspect of the present invention is a method for manufacturing a light-emitting device, comprising: forming an affinity layer on the surface of a light-emitting element; bonding the light-emitting element to the bottom surface of a recess provided on the upper surface of a package substrate; immersing the light-emitting element in the recess in a liquid sealing portion having affinity with the affinity layer; and forming a solid sealing portion that covers the upper surface of the package substrate and the liquid sealing portion. According to the eighth aspect, since an affinity layer is formed on the surface of the light-emitting element and the surface of the light-emitting element is covered by the liquid sealing portion, the adhesion of air bubbles to the surface of the light-emitting element can be prevented. As a result, the refractive index difference on the surface of the light-emitting element can be reduced compared to the case where air comes into contact with the surface of the light-emitting element, and a decrease in the light extraction efficiency of the light-emitting element can be suppressed. [Explanation of symbols]

[0056] 10...Light-emitting device, 12...Light-emitting element, 14...Package substrate, 16...Liquid sealing part, 18...Solid sealing part, 20...Affinity layer, 32...Top surface, 36...Recess, 38...Bottom surface, 40...Side surface.

Claims

1. A package substrate having an upper surface and a recess provided on the upper surface, A light-emitting element is provided on the bottom surface of the recess, A liquid sealing portion is provided within the recess for immersing the light-emitting element, A affinity layer provided on the surface of the light-emitting element and in contact with the liquid sealing portion, The package comprises the upper surface of the package substrate and a solid sealing portion that covers the liquid sealing portion, Light-emitting device.

2. The affinity layer has a higher affinity with the liquid sealing portion than with the surface of the light-emitting element. The light-emitting device according to claim 1.

3. The liquid sealing portion is composed of fluorine oil, The affinity layer is made of fluororesin. The light-emitting device according to claim 1.

4. The solid sealing portion is made of silicone resin. A light-emitting device according to any one of claims 1 to 3.

5. The solid sealing portion is made of an inorganic material. A light-emitting device according to any one of claims 1 to 3.

6. The affinity layer covers the upper and side surfaces of the light-emitting element. A light-emitting device according to any one of claims 1 to 3.

7. The affinity layer further covers the surface of the recess. A light-emitting device according to any one of claims 1 to 3.

8. Forming an affinity layer on the surface of the light-emitting element, A light-emitting element is bonded to the bottom surface of a recess provided on the upper surface of the package substrate, The light-emitting element in the recess is immersed in a liquid sealing portion having affinity with the affinity layer, The method includes forming a solid sealing portion that covers the upper surface and the liquid sealing portion of the package substrate. A method for manufacturing a light-emitting device.

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