Method for manufacturing an energy storage device and an energy storage device

The method of laser welding a power storage device using a sealing plate with a protruding portion addresses the challenge of maintaining welding strength and preventing spatter intrusion, enhancing the device's reliability and efficiency.

JP2026100143APending Publication Date: 2026-06-19PRIME PLANET ENERGY & SOLUTIONS INC

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
PRIME PLANET ENERGY & SOLUTIONS INC
Filing Date
2024-12-09
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing methods for manufacturing power storage devices face challenges in ensuring welding strength while preventing the intrusion of welding spatter into the case.

Method used

A method involving laser welding a case body and a sealing plate, where the sealing plate has a protruding portion that is melted to create a continuous weld outside the opening, ensuring strong bonding while minimizing spatter intrusion.

Benefits of technology

This approach enhances welding strength and prevents spatter from entering the case, improving manufacturing efficiency and reliability of the power storage device.

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Abstract

The present invention provides a method for manufacturing an energy storage device suitable for ensuring welding strength while suppressing the intrusion of welding spatter into the case, and an energy storage device manufactured by this method. [Solution] The method for manufacturing the energy storage device includes a case body preparation step S1, a sealing plate preparation step S2, and a welding step S4. The sealing plate 20 prepared in the sealing plate preparation step S2 has a sealing portion 21 and a protruding portion 23A. The sealing portion 21 covers the opening 10A of the case body 10 and is superimposed on the outside of the opening 10A. The protruding portion 23A protrudes outward from the outer edge of the opening 10A, continuously in the circumferential direction of the opening 10A, while the sealing portion 21 is closing the opening 10A. In the welding step S4, with the sealing plate 20 mounted on the case body 10 so as to close the opening 10A, a laser beam LS is irradiated onto the protruding portion 23A of the sealing plate 20, and the boundary between the case body 10 and the sealing plate 20 is welded by melting the protruding portion 23A.
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