Footwear kit
The footwear kit addresses the issue of comfort in low-heel states by incorporating a sole with an inclined curved portion and higher cushioning in the second heel, enhancing impact absorption and reducing manufacturing complexity.
JP2026100453APending Publication Date: 2026-06-19MIZUNO CORPORATION
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- MIZUNO CORPORATION
- Filing Date
- 2024-12-09
- Publication Date
- 2026-06-19
AI Technical Summary
Technical Problem
Existing footwear kits with detachable heels fail to provide adequate walking comfort in low-heel states, particularly due to insufficient cushioning and impact absorption.
Method used
A footwear kit design featuring a sole with an upwardly inclined curved portion supporting the MP joint, higher cushioning in the second heel, and a sole structure that maintains consistent shape between high- and low-heel states, enhancing impact absorption and reducing foot strain.
Benefits of technology
Improves walking comfort in low-heel states by increasing cushioning and impact absorption, allowing for easy transition between heel heights without structural changes, and reducing the need for multiple lasts, thus lowering manufacturing costs.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026100453000001_ABST
Abstract
To improve walking comfort when wearing low heels. [Solution] The pump body 3 is provided with a sole 11 having a sole base 12 in which a curved portion 12a that curves around the part that supports the MP joint of the wearer's foot is formed such that the portion behind the curved portion 12a is inclined upward toward the rear, and the cushioning of the second heel 9 is set to be higher than that of the first heel.
Need to check novelty before this filing date? Find Prior Art