Work apparatus and work method

The work apparatus and method address the issue of misaligned support pins by detecting and notifying operators, ensuring accurate substrate support and preventing defects, thereby enhancing production efficiency.

JP2026100493APending Publication Date: 2026-06-19PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Filing Date
2024-12-09
Publication Date
2026-06-19

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  • Figure 2026100493000001_ABST
    Figure 2026100493000001_ABST
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Abstract

The objective is to provide a work apparatus and work method that can correct misalignment of the support pins of the lower support unit that occurs during production, thereby preventing the manufacture of defective circuit boards. [Solution] In a work device that repeatedly performs a series of component mounting operations, in which a circuit board is brought in, the lower surface of the circuit board is supported by a lower support unit having a configuration in which a plurality of support pins are arranged on the lifting body, predetermined work is performed on the circuit board, and then the support of the circuit board by the lower support unit is released and the circuit board is unloaded, an inspection operation is performed to detect as misaligned pins any of the plurality of support pins arranged on the lifting body that are not located in a predetermined position set on the lifting body (ST2, ST9), and the position on the lifting body of the support pin detected as a misaligned pin in the inspection is notified (ST5).
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Description

Technical Field

[0001] The present disclosure relates to a working device and a working method for performing work by supporting the lower surface of a substrate with a lower receiving unit having a configuration in which a plurality of support pins are arranged on a lifting body.

Background Art

[0002] A working device such as a component mounting device carries in a substrate by a substrate transfer unit, performs predetermined work on the substrate while supporting the lower surface of the substrate by a lower receiving unit, and then releases the support of the substrate by the lower receiving unit and then repeats a series of unit operations of carrying out the substrate by the substrate transfer unit. Among such working devices, there is one in which the lower receiving unit is composed of a flat lifting body and a plurality of support pins erected on the lifting body, and each support pin is attached to the lifting body by magnetic force (for example, Patent Document 1 below). In the lower receiving unit having such a configuration, since the support pins can be installed at any position on the upper surface of the lifting body, there is an advantage that the degree of freedom in arranging the support pins is high.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when the support pins are attached to the lifting mechanism by magnetism, there is a drawback in that the support pins are prone to misalignment relative to the lifting mechanism. Therefore, even if the support pins are correctly positioned in the prescribed position on the lifting mechanism at the start of production, as production progresses (unit operations are repeatedly performed), the support pins may shift from the prescribed position, resulting in abnormal support of the circuit board and the potential for defective circuit boards to be manufactured.

[0005] Therefore, the present disclosure aims to provide a work apparatus and work method that can correct misalignment of the support pins of the lower support unit that occurs during production work, thereby preventing the manufacture of defective substrates. [Means for solving the problem]

[0006] The work apparatus of the present disclosure is a work apparatus that repeatedly performs a series of unit operations, in which a substrate is brought in by a substrate transport unit, the lower surface of the substrate is supported by a lower support unit having a plurality of support pins arranged on a lifting body, a predetermined operation is performed on the substrate, the support of the substrate by the lower support unit is released and the substrate is transported out by the substrate transport unit, the apparatus comprising: an inspection unit that performs an inspection operation to detect as misaligned pins any of the plurality of support pins arranged on the lifting body that are misaligned from a predetermined position set on the lifting body; and a notification means that notifies the position on the lifting body of the support pin detected as a misaligned pin by the inspection unit.

[0007] The work method of the present disclosure is a work method using a work device that repeatedly performs a series of unit operations, in which a substrate is brought in by a substrate transport unit, the lower surface of the substrate is supported by a lower support unit having a plurality of support pins arranged on a lifting body, a predetermined operation is performed on the substrate, the support of the substrate by the lower support unit is released and the substrate is carried out by the substrate transport unit, the work method comprising: an inspection step of performing an inspection operation to detect as misaligned pins any of the plurality of support pins arranged on the lifting body that are misaligned from a predetermined position set on the lifting body; and a notification step of notifying the position on the lifting body of the support pin that was detected as a misaligned pin in the inspection step. [Effects of the Invention]

[0008] According to this disclosure, even if misalignment occurs in the support pins of the lower support unit during production, this can be corrected to prevent the manufacture of defective substrates. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view of a key part of a component mounting device in one embodiment of the present disclosure. [Figure 2] This is a side view of a key part of a component mounting device in one embodiment of the present disclosure. [Figure 3] This is a plan view of the main part of a component mounting device in one embodiment of the present disclosure. [Figure 4] This is a perspective view showing the substrate transport section of a component mounting device in one embodiment of the present disclosure, together with the substrate. [Figure 5] (a)(b) A perspective view of a substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 6] This is a perspective view of a lower support unit included in a component mounting device according to one embodiment of the present disclosure. [Figure 7] This is a block diagram showing the control system of a component mounting device in one embodiment of the present disclosure. [Figure 8]This figure shows an example of pin configuration data stored in a component mounting device according to one embodiment of the present disclosure. [Figure 9] (a)(b)(c)(d) These are plan views illustrating the procedure for arranging the support pins of a component mounting device in one embodiment of the present disclosure in the arrangement area of ​​the lifting body. [Figure 10] (a)(b)(c) These are side views illustrating the procedure for arranging the support pins of a component mounting device in one embodiment of the present disclosure in the arrangement area of ​​the lifting body. [Figure 11] (a)(b)(c)(d) These are side views illustrating the operation from the operation of a component mounting device supporting a substrate to the operation of mounting components onto the substrate in one embodiment of the present disclosure. [Figure 12] This is a side view showing a state in which a camera is capturing images of a support pin provided in a component mounting device according to one embodiment of the present disclosure. [Figure 13] (a)(b)(c)(d) These are plan views illustrating the procedure for returning the support pins of a component mounting device to a standby area in one embodiment of the present disclosure. [Figure 14] (a)(b)(c) This is a side view illustrating the procedure for returning a support pin of a component mounting device to a standby area in one embodiment of the present disclosure. [Figure 15] This flowchart shows the flow of production operations performed by the component mounting device disclosed herein. [Figure 16] This figure shows an example of a screen displayed on a display device provided in a component mounting device according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0010] Embodiments of this disclosure will be described below with reference to the drawings. Figures 1, 2, and 3 show a component mounting device 10 as a work device in one embodiment of this disclosure.

[0011] The component mounting device 10 is a device that performs an operation (production operation) of mounting components BH on a substrate KB positioned at a work position to produce a mounted substrate. In the present embodiment, the component mounting device 10 includes a base 11, a substrate transfer unit 12, a lower receiving unit 13, a plurality of parts feeders 14, a head moving mechanism 15, a mounting head 16, and a camera 17. A base cover 18 is provided on the base 11, and a display device 19 is attached to the base cover 18. Inside the base 11, a control unit 20 for controlling the operations of each part of the component mounting device 10 is provided. Here, for convenience of explanation, the left - right direction of the component mounting device 10 as viewed by the operator OP is defined as the X direction, the front - rear direction of the component mounting device 10 as viewed by the operator OP is defined as the Y direction, and the up - down direction is defined as the Z direction.

[0012] In FIGS. 1 and 3, the substrate transfer unit 12 has a configuration in which a fixed conveyor 12P and a movable conveyor 12Q, which are two conveyors extending in the X direction, are arranged side by side in the Y direction. The fixed conveyor 12P is fixedly provided on the base 11 and is located on the front side as viewed by the operator OP. The movable conveyor 12Q is provided so as to be movable in the Y direction with respect to the base 11 (and thus with respect to the fixed conveyor 12P) and is located on the back side (the back side of the fixed conveyor 12P) as viewed by the operator OP.

[0013] In FIG. 4, the fixed conveyor 12P and the movable conveyor 12Q each include a portal - shaped conveyor base 21 provided to extend in the X direction on the base 11, two pulleys 22 provided at both ends in the X direction of the conveyor base 21, a conveyor belt 23 wound around these two pulleys 22, a belt drive motor 24, and a substrate presser 25 provided at the upper end of the conveyor base 21. The conveyor base 21 has a shape extending along the XZ plane, and the substrate presser 25 has a shape extending along the XZ plane. The belt drive motor 24 rotationally drives one of the two pulleys 22 to run the conveyor belt 23 in the X direction.

[0014] The substrate transfer unit 12 supports both end portions in the Y direction of the substrate KB from below by the fixed conveyor 12P and the movable conveyor 12Q, transfers them in the X direction, and positions them at the working position. As shown in FIG. 4, a guide rail 12G extending in the Y direction is provided on the base 11, and the movable conveyor 12Q is movable in the Y direction along the guide rail 12G.

[0015] In FIGS. 4 and FIGS. 5(a) and (b), one end side of a ball screw 12S extending in the Y direction is supported by the fixed conveyor 12P, and the other end side of the ball screw 12S penetrates the movable conveyor 12Q in the Y direction. The fixed conveyor 12P is provided with an interval changing motor 12M that rotationally drives the ball screw 12S. When the interval changing motor 12M is driven, the ball screw 12S rotates about its axis, and the movable conveyor 12Q moves relatively in the Y direction with respect to the fixed conveyor 12P. As a result, the movable conveyor 12Q can be moved away from the fixed conveyor 12P (FIG. 5(a) → FIG. 5(b)), or the movable conveyor 12Q can be moved closer to the fixed conveyor 12P (FIG. 5(b) → FIG. 5(a)), and the interval (conveyor interval) between the fixed conveyor 12P and the movable conveyor 12Q can be freely changed according to the size (dimension in the Y direction) of the substrate KB.

[0016] In FIGS. 4 and FIGS. 5(a) and (b), the lower receiving unit 13 is provided below the substrate transfer unit 12. As shown in FIG. 6, the lower receiving unit 13 has a configuration in which a plurality of support pins 32 extending in the vertical direction are arranged on the upper surface of a flat lifting body 31.

[0017] In FIG. 6, each support pin 32 has its tip portion 32a facing upward and a magnet 32M at its base portion 32b. At least the upper surface of the lifting body 31 is made of a magnetic material. When the support pins 32 are arranged on the upper surface of the lifting body 31 with the base portion having a downward posture, the support pins 32 maintain a standing state on the lifting body 31 by the magnetic force between the magnet 32M and the magnetic material. Since the upper surface of the lifting body 31 is flat, each support pin can be arranged at an arbitrary position on the upper surface of the lifting body 31.

[0018] In Figures 2 and 6, a lifting cylinder 33 is provided below the lower support unit 13. The lifting cylinder 33 has a piston rod 33R facing upward, and the upper end of the piston rod 33R is connected to the lower surface of the lower support unit 13. Therefore, when the lifting cylinder 33 moves the piston rod 33R in the Z direction, the lifting body 31 moves up and down accordingly.

[0019] In Figure 6, the majority of the upper surface area of ​​the lifting body 31 is the placement area HA, where support pins 32 are positioned to support the substrate KB. A standby area TA, distinct from placement area HA, is set up at the rear of the upper surface area of ​​the lifting body 31 (at the rear of placement area HA). The standby area TA functions as a standby position for the support pins 32 positioned in placement area HA.

[0020] In Figures 1 and 2, a feeder base 11F is provided at the Y-direction end of the base 11, and multiple parts feeders 14 are detachably attached to the feeder base 11F. The parts feeders 14 continuously supply parts BH to a parts pick-up position 14T set at the far end (towards the substrate transport section 12) as seen from the operator OP.

[0021] In Figures 1, 2, and 3, the head movement mechanism 15 comprises a fixed beam 15a and a movable beam 15b. The fixed beam 15a extends in the Y direction and both ends are fixed to the base 11. The movable beam 15b extends in the X direction and one end is attached to the fixed beam 15a. The movable beam 15b is moved in the Y direction by a drive mechanism (not shown) provided within the fixed beam 15a.

[0022] In Figures 1, 2, and 3, the mounting head 16 is attached to the movable beam 15b. The mounting head 16 is moved in the X direction by a drive mechanism (not shown) provided within the movable beam 15b. The mounting head 16 can move in a direction along the horizontal plane (XY plane) in the area above the base 11 by the movement of the movable beam 15b in the Y direction relative to the fixed beam 15a, and by its own movement in the X direction relative to the movable beam 15b.

[0023] In Figures 1 and 2, the mounting head 16 is equipped with a plurality of nozzles 16a extending downward. The mounting head 16 can generate a vacuum suction force at the lower end of each nozzle 16a, thereby allowing it to suction and pick up the parts BH supplied by the parts feeder 14.

[0024] In Figures 1, 2, and 3, the camera 17 is attached to the mounting head 16 and can be moved along the mounting head 16 in a direction along the XY plane. The camera 17 has its imaging field of view facing downwards. The camera 17 images each of the multiple support pins 32 located on the lifting body 31 of the lower support unit 13 from above.

[0025] In Figures 1 and 2, the base cover 18 is provided to cover the entire space above the base 11. As a result, the substrate transport unit 12, the lower receiving unit 13, the parts feeder 14 (however, as shown in Figure 2, only a part on the parts removal position 14T side), the head movement mechanism 15, the mounted head 16, and the camera 17, which are located above the base 11, are covered by the base cover 18.

[0026] In Figures 1 and 2, a portion of the base cover 18 is an opening / closing door 18T. The opening / closing door 18T is attached to the base cover 18 by a hinge 18H, which extends in the X direction, with the upper edge of the door 18T extending in the X direction. As a result, the opening / closing door 18T can swing freely around the hinge 18H as a pivot point, and the operator OP can manually open and close the opening / closing door 18T (arrow R shown in Figure 2).

[0027] In Figure 1, the display device 19 is attached to the base cover 18. The operator OP can visually receive information emitted by the component mounting device 10 through the display device 19.

[0028] In Figure 7, the control unit 20 controls the fixed conveyor 12P, movable conveyor 12Q, and spacing change motor 12M of the substrate transport section 12, the lifting cylinder 33 of the lower support unit 13, the parts feeder 14, the head movement mechanism 15, the mounted head 16, the camera 17, and the display device 19. The open / closed state of the opening / closing door 18T is detected by the door opening / closing sensor 18S (Figure 2) provided on the base cover 18, and the control unit 20 can detect whether the opening / closing door 18T is in the open or closed state based on the detection information from the door opening / closing sensor 18S (Figure 7).

[0029] In Figure 7, the control unit 20 is equipped with a memory unit 41. The memory unit 41 stores various data 43, including an execution program 42 in which the execution procedure for production work is written, as well as pin placement data 43H. The pin placement data 43H is data of the placement positions (XY coordinates fixed to the lifting body 31) of the support pins 32 that are set in advance for the circuit board KB that is the target of production (Figure 6), and as shown in Figure 8, XY coordinates (Xn,Yn) (n=1,2,3,...) are defined for each pin placement position P(n) (n=1,2,3,...).

[0030] In Figure 7, the control unit 20 includes a pin placement unit 44. The pin placement unit 44 performs the operation of placing support pins 32 in the placement area HA on the lifting body 31 (pin placement operation) based on the pin placement data 43H stored in the memory unit 41. During the pin placement operation, the support pins 32 to be placed in the placement area HA are initially placed in the standby area TA, and then moved from the standby area TA to the position set by the pin placement data 43H in the placement area HA by the mounting head 16 controlled by the pin placement unit 44.

[0031] Before the pin placement work begins, the movable conveyor 12Q is positioned in the "normal position," which is in front of the waiting area TA, and multiple support pins 32 that will be placed in the placement area HA are placed in the waiting area TA (Figures 9(a) and 10(a)). From this state, the pin placement unit 44 first operates the spacing change motor 12M to move the movable conveyor 12Q to the rear as seen from the worker OP (arrow A shown in Figures 9(b) and 10(a)), moving the movable conveyor 12Q to the "waiting area open position," which is in the rear of the waiting area TA (Figure 9(b)). Before moving the movable conveyor 12Q from the normal position to the waiting area open position in this way, the lifting body 31 is lowered to a predetermined height position by the lifting cylinder 33. As a result, the movable conveyor 12Q moves over the support pins 32 placed in the waiting area TA, so the movable conveyor 12Q does not interfere with the support pins 32 placed in the waiting area TA.

[0032] Once the movable conveyor 12Q is moved from its normal position to the standby area open position as described above, the pin placement unit 44 operates the lifting cylinder 33 to raise the lifting body 31. After raising the lifting body 31, the pin placement unit 44 uses the mounting head 16 to move the support pins 32 placed in the standby area TA one by one to the placement area HA based on the pin placement data 43H stored in the memory unit 41 (Figures 9(c) and 10(b)). At this time, the mounting head 16 attracts the tip 32a of the support pin 32 to the lower end of the nozzle 16a, moves the support pin 32 to the position (pin placement position) specified by the pin placement data 43H, and then releases the attraction of the support pin 32.

[0033] After the pin placement unit 44 has moved (placed) the support pins 32 to each pin placement position P(n) (n=1,2,3,...) within the placement area HA as described above, the lifting cylinder 33 lowers the lifting body 31. Then, the spacing change motor 12M is activated to return the movable conveyor 12Q to its normal position (arrow B shown in Figures 9(d) and 10(c)). As a result, the support pins 32 are placed on the lifting body 31 of the lower support unit 13, and the pin placement work is completed.

[0034] In this embodiment, the mounting head 16 is a pin moving means that automatically positions the multiple support pins 32 on the lifting body 31 by moving the multiple support pins 32, which are placed in a predetermined standby area TA, to a predetermined position (specified position) on the lifting body 31.

[0035] Once the pin placement work is completed as described above, the control unit 20 operates the spacing change motor 12M to move the movable conveyor 12Q in the Y direction relative to the fixed conveyor 12P, thereby adjusting the conveyor spacing according to the size (Y-direction dimension) of the circuit board KB being produced. After adjusting the conveyor spacing, the work execution unit 45 (Figure 7) of the control unit 20 executes the work of mounting components BH onto the circuit board KB (component mounting work) according to the execution program 42 in the following procedure.

[0036] When performing component mounting work, the work execution unit 45 first operates the board transport unit 12 to bring in the board KB sent from outside the component mounting device 10 and position it at the work position (Figure 11(a) → Figure 11(b)). Once the board KB is positioned at the work position, the work execution unit 45 operates the lifting cylinder 33 to raise the lower support unit 13. This causes the lower support unit 13 to lift the board KB with multiple support pins 32 supporting it, and press both ends of the board KB in the Y direction against the two board holders 25 located above it from below (Figure 11(b) → Figure 11(c)). This fixes the board KB to the board transport unit 12 (Figure 11(c)).

[0037] Once the substrate KB is fixed to the substrate transport unit 12, the work execution unit 45 operates each parts feeder 14 to supply parts BH to the parts pick-up position 14T, and moves the mounting head 16 back and forth between the upper position of the parts feeder 14 and the upper position of the substrate KB, thereby causing the mounting head 16 to repeatedly perform mounting turns. A mounting turn consists of a pickup operation in which the mounting head 16 moves to the upper position of the parts feeder 14 and picks up the parts BH supplied by the parts feeder 14 with the nozzle 16a, and a mounting operation in which the mounting head 16 moves to the upper position of the substrate KB and mounts the parts BH picked up by the nozzle 16a onto the substrate KB (Figure 11(d)).

[0038] In this embodiment, the component mounting device 10 performs a predetermined component mounting operation on the substrate KB supported by the lower support unit 13.

[0039] Once all the components BH to be mounted on the substrate KB have been mounted by the mounting head 16 repeatedly performing mounting turns, the work execution unit 45 operates the lifting cylinder 33 to lower the lower support unit 13 and release the support of the substrate KB from the lower support unit 13, and then operates the substrate transport unit 12 to transport the substrate KB to the downstream process equipment. This completes the component mounting work for one substrate KB.

[0040] As described above, the component mounting device 10 in this embodiment repeatedly performs a series of unit operations for component mounting, in which the substrate KB is loaded by the substrate transport unit 12, the lower surface of the substrate KB is supported by the lower support unit 13, and then the support of the substrate KB by the lower support unit 13 is released and the substrate KB is unloaded by the substrate transport unit 12. During this process, if a support pin 32 becomes misaligned from the designated position of the lifting body 31 for any reason, this can be detected and the operator OP can take the necessary action. The following is a description of this.

[0041] In Figure 7, the control unit 20 includes, in addition to the aforementioned storage unit 41, pin placement unit 44, and work execution unit 45, a position calculation unit 46, an inspection unit 47, and a notification control unit 48. The position calculation unit 46 calculates the position of each of the multiple support pins 32 on the lifting body 31 based on images of each support pin 32 obtained by the camera 17 imaging each of the multiple support pins 32 from above when the substrate KB is not supported from below by the lower support unit 13. The inspection unit 47 performs the work (inspection work) of detecting support pins 32 that are misaligned from the prescribed position on the lifting body 31 among the multiple support pins 32 arranged on the lifting body 31 by the pin moving means as "misaligned pins". The notification control unit 48 controls the display device 19 as a notification means so that a notification is given when a misaligned pin is detected by the inspection unit 47.

[0042] Here, the inspection unit 47 performs the above inspection work when it detects that the pre-set inspection execution conditions are met before the first component mounting operation is performed and between component mounting operations performed thereafter. In this case, the inspection execution conditions include, for example, that the aforementioned opening and closing door 18T of the component mounting device 10 has been opened and closed (opened and then closed) before the component mounting operation is performed. Other conditions include that the number of times the component mounting operation has been performed has reached a predetermined number, and that the elapsed time from a predetermined reference time (such as when production work has started or when the first component mounting operation has started) has reached a predetermined time.

[0043] In the inspection process, first, the camera 17 images each of the multiple support pins 32 located in the placement area HA of the lifting body 31 from above (Figure 12). Next, the position calculation unit 46 calculates the position of each of the multiple support pins 32 on the lifting body 31 based on the images obtained by the camera 17. Once the position calculation unit 46 has calculated the position of each of the multiple support pins 32 on the lifting body 31, the inspection unit 47 compares the calculated position of each of the multiple support pins 32 on the lifting body 31 (i.e., the actual position) with the data position of each of the multiple support pins 32 obtained from the pin placement data 43H (i.e., the specified position). If, as a result, any support pin 32 whose actual position does not match the data position is detected, that support pin 32 is detected as a "misaligned pin". When the inspection unit 47 detects a misaligned pin, the notification control unit 48 controls the display device 19 to notify it of this fact (that there is a misaligned pin).

[0044] In this embodiment, if any support pins 32 (misaligned pins) have become misaligned for any reason, both before and after the initial component mounting operation, this is detected and reported. This allows the operator (OP) to quickly take necessary countermeasures and prevent the production of defective circuit boards due to misalignment of the support pins 32 of the lower support unit 13. Furthermore, since the operator (OP) does not need to periodically reset the system to check for misalignment of the support pins 32, work efficiency is improved.

[0045] When the inspection unit 47 detects a misaligned pin as described above, the work execution unit 45 lowers the lifting body 31 and moves the movable conveyor 12Q from its normal position to the standby area open position (arrow A shown in Figures 13(a) and 14(a)). Then, when the movable conveyor 12Q is in the standby area open position, the mounting head 16 is activated to move the support pins 32 that were not detected as misaligned pins during the inspection process (support pins 32 that did not experience misalignment) from the placement area HA to the standby area TA (Figures 13(b) and 14(b)).

[0046] The work execution unit 45 moves the support pins 32 that did not experience misalignment from the placement area HA to the standby area TA as described above, so that only the support pins 32 detected as misaligned pins remain in the placement area HA (Figure 13(c)). As a result, the position of the support pins 32 detected as misaligned pins on the lifting body 31 is notified to the operator OP. Therefore, the operator OP can visually understand where the support pins 32 detected as misaligned pins were located in the placement area HA. ​​At this time, the mounting head 16 functions as a pin moving means as described above, and also functions as a notification means that notifies the operator of the position of the support pins 32 detected as misaligned pins on the lifting body 31 by the inspection unit 47.

[0047] As described above, once the position of the misaligned pins on the lifting body 31 is notified to the operator OP, the operator OP manually moves the remaining misaligned pins in the placement area HA to the standby area TA (Figures 13(d), 14(c)). Once all the support pins 32 that were placed in the placement area HA have been returned to the standby area TA, it becomes possible to perform the pin placement work again (redo the pin placement work).

[0048] As described above, when moving the misaligned pin to the waiting area TA, the operator OP will first identify the cause of the misalignment of the support pin 32, such as checking for any debris or foreign objects in the area where the misaligned support pin 32 was located, and then perform work to remove the cause. In other words, in this embodiment, the operator OP is notified of the position of the misaligned pin on the lifting body 31, so that appropriate action (action to remove the cause of the misalignment) can be taken, and the lower support unit 13, which has become abnormal, can be quickly restored to a normal state.

[0049] Figure 15 is a flowchart showing the flow of production work performed by the component mounting device 10 in this embodiment. When the control unit 20 performs production work, first the pin placement unit 44 performs the aforementioned pin placement work (step ST1. pin placement process). Then, once the support pins 32 are placed in the placement area HA of the lifting body 31 by the pin placement work, the inspection unit 47 performs the inspection work (step ST2. inspection process).

[0050] If the control unit 20 detects a misaligned pin during the inspection process ("Y" in step ST3), the notification control unit 48 notifies the display device 19 that there is a misaligned pin on the lifting body 31 (step ST4, notification process). Then, the work execution unit 45 moves the support pin 32 that is not misaligned to the standby area TA, thereby notifying the operator OP of the position of the misaligned pin on the lifting body 31 (step ST5, notification process).

[0051] Once the position of the misaligned pins on the lifting body 31 is notified to the operator OP, the operator OP manually moves the remaining misaligned pins in the placement area HA to the standby area TA (step ST6). At this time, the operator OP investigates the cause of the misalignment and takes steps to eliminate the cause. Once all the misaligned pins in the placement area HA have been returned to the standby area TA, the control unit 20 returns to step ST1, and the pin placement unit 44 re-executes the pin placement operation.

[0052] If the pin placement operation is re-executed after returning to step ST1, the inspection unit 47 re-executes the inspection operation in step ST2. If the inspection unit 47 detects misaligned pins in the re-executed inspection operation, the operation execution unit 45 proceeds to "Y" again from step ST3. If no misaligned pins are detected ("N" in step ST3), the operation execution unit 45 checks whether the door 18T was opened or closed (opened and then closed) after the previous inspection operation (step ST2) based on the opening and closing history of the door 18T obtained from the door opening / closing sensor 18S (step ST7).

[0053] If the work execution unit 45 detects in step ST7 that the opening / closing door 18T was not opened or closed after the previous inspection work (step ST2), it performs component mounting work for one board KB (step ST8). On the other hand, if the work execution unit 45 detects in step ST7 that the opening / closing door 18T was opened or closed after the previous inspection work, it is possible that the worker OP reached through the opening / closing door 18T and moved the support pin 32, so the inspection unit 47 performs the same misalignment inspection work as in step ST2 (step ST9, inspection process). If a misaligned pin is detected as a result of the inspection work in step ST9 ("Y" in step ST10), the process proceeds from step ST4 (notification process) to step ST5 (notification process), and then to step ST6. If no misaligned pin is detected in step ST9 ("N" in step ST10), the work execution unit 45 proceeds to step ST8 and performs component mounting work for one board KB.

[0054] In step ST8, the work execution unit 45 performs component mounting work on one board KB. After the component mounting work is completed and the board KB is unloaded, it determines whether there is another board KB (the board KB on which component BH will be mounted next) (step ST11). If there is no next board KB, the production work is terminated. If there is another board KB, it determines whether the inspection execution conditions are met at that point (step ST12).

[0055] Specifically, for example, the system determines whether (1) the number of times the component mounting operation has been performed (the cumulative number in that production operation) has reached a predetermined number, and whether (2) the elapsed time from a predetermined reference time (such as when the production operation started or when the first component mounting operation started) has reached a predetermined time. The reason for considering (1) and (2) above as inspection execution conditions is that when the number of times the component mounting operation has been performed or the elapsed time from a predetermined reference time is large, the contact between the support pin 32 and the circuit board KB changes during that time, which may cause the support pin 32 to gradually shift from its designated position, or the support pin 32 may fall over or shift from its designated position due to shaking of the component mounting device 10, etc.

[0056] If the control unit 20 determines in step ST12 that the inspection execution conditions are met, it returns to step ST2 and the inspection unit 47 performs the inspection work. On the other hand, if it determines in step ST12 that the inspection conditions are not met, it returns to step ST7 and checks whether the opening / closing door 18T was opened or closed after the previous inspection work (the inspection process in step ST9). After proceeding through the processes from step ST7 onward, if the determination in step ST11 does not indicate that there is no next circuit board KB, the production work is terminated.

[0057] As described above, the component mounting device 10 in this embodiment includes an inspection unit 47 that performs an inspection to detect support pins 32 that are misaligned from a predetermined position on the lifting body 31 among a plurality of support pins 32 arranged on the lifting body 31, and a mounting head 16 that serves as a notification means for notifying the position on the lifting body 31 of the support pins 32 detected as misaligned by the inspection unit 47. The work method by the component mounting device 10 includes an inspection step (steps ST2 and ST9) that performs an inspection to detect support pins 32 that are misaligned from a predetermined position on the lifting body 31 among a plurality of support pins 32 arranged on the lifting body 31, and a notification step (step ST5) that notifies the position on the lifting body 31 of the support pins 32 detected as misaligned in the inspection step.

[0058] In the component mounting device 10 of this embodiment, if any of the multiple support pins 32 arranged on the lifting body 31 have become misaligned for any reason, this is detected and the position of that misaligned pin on the lifting body 31 is notified. Therefore, the operator OP can easily grasp the position of the misaligned pin, and by eliminating the cause of the misalignment based on the grasped position of the misaligned pin and correcting the misalignment of the support pin 32, it is possible to prevent the production of defective substrates due to the misalignment of the support pin 32. In addition, since the operator OP does not need to worry about the occurrence of misalignment of the support pin 32 and reset the device from time to time, work efficiency is improved.

[0059] Incidentally, in the above-described embodiment, when a misaligned pin is detected by the inspection unit 47, the mounted head 16, which acts as a pin moving means, also functions as a notification means. By moving the support pins 32 that were not detected as misaligned pins by the inspection unit 47 from the placement area HA to the standby area TA, the position of the misaligned pins on the lifting body 31 is notified to the operator OP. However, the notification means is not limited to a configuration that actually moves the support pins 32 as described above, and may consist of a screen display means such as a display device 19 that displays the position of the misaligned pins detected by the inspection unit 47 on a screen.

[0060] Figure 16 shows an example of the screen 19G of the display device 19. In the figure, "● (black circle)" indicates a misaligned pin, and "〇 (white circle)" indicates a support pin 32 that is not a misaligned pin. The numbers "1", "2", ..., "10" in the figure indicate the numbers of the support pins 32. In Figure 16, the left area of ​​the screen 19G is a map section 19M that shows the placement of the circuit board KB and the support pins 32 set on the circuit board KB, and the right area of ​​the screen 19G is a list section 19L that lists the numbers of the misaligned pins combined with their coordinates (X,Y) on the circuit board KB. In Figure 16, the support pins 32 with numbers "4" and "9" detected as misaligned pins are shown in the map section 19M, and the coordinates (X,Y) of the misaligned pins on the lifting body 31 are displayed in the list section 19L.

[0061] Thus, the notification means only needs to be capable of notifying the position of the misaligned pin on the lifting body 31 when the inspection unit 47 detects a misaligned pin, and its configuration and form are not limited. In the case where the notification means consists of an image display means (display device 19) as described above, the pin placement process (pin placement work) in step ST1 may be performed manually by the operator OP. In this case, steps ST5 and ST6 will be replaced by the process in which the operator OP performs the pin placement work manually.

[0062] The embodiments of this disclosure are described above, and include the following technologies (working apparatus and working methods).

[0063] (Item 1) A work device (component mounting device 10) that repeatedly performs a series of unit operations (component mounting operations) on which a substrate (substrate KB) is loaded by a substrate transport unit (substrate transport unit 12), the lower surface of the substrate is supported by a lower support unit (lower support unit 13) having a configuration in which a plurality of support pins (support pins 32) are arranged on a lifting body (lifting body 31), a predetermined operation (component mounting operation) is performed on the substrate, and then the support of the substrate by the lower support unit is released and the substrate is unloaded by the substrate transport unit, the work device comprising: an inspection unit (inspection unit 47) that performs an inspection operation to detect as misaligned pins any of the plurality of support pins arranged on the lifting body that are misaligned from a predetermined position set on the lifting body; and a notification means (mounting head 16) that notifies the position on the lifting body of the support pins detected as misaligned pins by the inspection unit.

[0064] According to the technology in item 1, among the multiple support pins placed on the lifting body, support pins that are misaligned from the prescribed position set on the lifting body are detected as misaligned pins, and the position of the misaligned pin on the lifting body is notified. As a result, the operator can easily understand the position of the misaligned pin, and by eliminating the cause of the misalignment based on the identified position of the misaligned pin and correcting the misalignment of the support pin, it is possible to prevent the production of defective circuit boards due to misaligned support pins. In addition, since the operator does not need to worry about the occurrence of misaligned support pins and reset the system from time to time, work efficiency is improved.

[0065] (Item 2) The inspection unit is the work apparatus according to item 1, which performs the inspection work before the first unit operation is performed and between the unit operations performed thereafter.

[0066] According to the technology in item 2, inspection work is performed not only before the first unit operation is executed, but also between subsequent unit operations, so it is effective against misalignment of the support pins that occurs after the first unit operation is executed and during repeated unit operations.

[0067] (Item 3) The work device according to item 1, comprising a support pin moving means (mounting head 16) that positions a plurality of support pins on the lifting body by moving a plurality of support pins waiting in a predetermined waiting area (waiting area TA) to a predetermined position on the lifting body, wherein the support pin moving means functions as a notification means by moving support pins that were not detected as misaligned pins by the inspection unit to the waiting area and notifying the position on the lifting body of the support pins that were detected as misaligned pins by the inspection unit.

[0068] According to the technology in item 3, support pins that were not detected as misaligned pins are moved to a waiting area by a support pin moving means that functions as a notification means, and as a result the misaligned pins remain on the lifting body, so that the operator can clearly understand the position of the misaligned pins on the lifting body.

[0069] (Item 4) The work apparatus according to item 1, wherein the notification means comprises a display device that displays the position of the misaligned pin detected by the inspection unit on a screen.

[0070] According to the technology in item 4, the detected misaligned pins are displayed in the image on the display device, making it easier for the operator to understand the location of the misaligned pins.

[0071] (Item 5) The work apparatus according to item 1, comprising: a camera (camera 17) that images each of the multiple support pins from above; and a position calculation unit (position calculation unit 46) that calculates the actual position of each of the multiple support pins on the lifting body based on the images of each of the multiple support pins captured by the camera, wherein the inspection unit compares the actual position of each of the multiple support pins on the lifting body calculated by the position calculation unit with the position in the data, and detects the support pins whose actual position does not match the position in the data as misaligned pins.

[0072] According to the technology described in item 5, the inspection unit can easily and accurately detect misaligned pins.

[0073] (Item 6) The work apparatus described in item 1, wherein the predetermined work is a component mounting operation in which components are mounted on the substrate.

[0074] According to the technology in item 6, the effects in item 1 can be applied to a component mounting device that mounts components onto a substrate using a mounting head.

[0075] (Item 7) A work method using a work device that repeatedly performs a series of unit operations, in which a substrate is loaded by a substrate transport unit, the lower surface of the substrate is supported by a lower support unit having a configuration in which a plurality of support pins are arranged on a lifting body, a predetermined operation is performed on the substrate, the support of the substrate by the lower support unit is released and the substrate is loaded by the substrate transport unit, the work method comprising: an inspection step (step ST2, step ST9) in which an inspection operation is performed to detect as misaligned pins any of the plurality of support pins arranged on the lifting body that are misaligned from a predetermined position set on the lifting body; and a notification step (step ST5) in which the position on the lifting body of the support pin detected as the misaligned pin in the inspection step is notified.

[0076] According to the technology in item 7, as in the case of item 1, among the multiple support pins placed on the lifting body, support pins that are misaligned from the prescribed position set on the lifting body are detected as misaligned pins, and the position of the misaligned pin on the lifting body is notified. As a result, the operator can easily understand the position of the misaligned pin, and by eliminating the cause of the misalignment based on the understood position of the misaligned pin and correcting the misalignment of the support pin, it is possible to prevent the production of defective circuit boards due to misaligned support pins. In addition, since the operator does not need to worry about the occurrence of misaligned support pins and reset the system from time to time, work efficiency is improved.

[0077] (Item 8) The inspection step is the work method described in item 7, which is performed before the first unit operation is performed and between the unit operations that are performed thereafter.

[0078] According to the technique in item 8, inspection work is performed not only before the first unit operation is executed, but also between subsequent unit operations, so it is effective against misalignment of the support pins that occurs after the first unit operation is executed and during repeated unit operations.

[0079] While embodiments of the present disclosure have been described above, the technology of the present disclosure is not limited to those described above, and various modifications are possible. For example, in the above-described embodiments, the work apparatus to which the technology of the present disclosure is applied was an apparatus for mounting components onto a substrate (component mounting apparatus), but it may also be other work apparatuses such as an apparatus for printing solder on the upper surface of a substrate (solder printing apparatus) or an apparatus for inspecting components mounted on a substrate (inspection apparatus). [Industrial applicability]

[0080] The present invention provides a work apparatus and work method that can correct misalignment of the support pins of the lower support unit that occurs during production, thereby preventing the manufacture of defective circuit boards. [Explanation of Symbols]

[0081] 10. Parts mounting device (working device) 12. Substrate transport section 12P Fixed Conveyor 12Q Movable Conveyor 13 Lower support unit 16. Mounted head (notification means) (support pin movement means) 16a Nozzle 17 Cameras 18 Base cover 18T Opening / Closing Door 18H Hinge 19 Display device (screen display means) 20 Control Units 31 Lifting mechanism 32 support pins 33 Lifting Cylinder 41 Storage section 43H Pinout Data 44 Pin configuration section 45. Work Execution Department 46 Position calculation section 47. Inspection Department 48. Notification Control Unit HA deployment area TA waiting area BH parts KB board

Claims

1. A work device that repeatedly performs a series of unit operations, which include loading a substrate by a substrate transport unit, supporting the lower surface of the substrate with a lower support unit having a configuration in which multiple support pins are arranged on a lifting body, performing predetermined work on the substrate, releasing the support of the substrate by the lower support unit, and then unloading the substrate by the substrate transport unit. An inspection unit that performs an inspection operation to detect, among the plurality of support pins arranged on the lifting body, support pins that are misaligned from a predetermined position set on the lifting body as misaligned pins, A notification means for notifying the position of the support pin on the lifting body of the support pin detected as the misaligned pin by the inspection unit, A work device equipped with a work mechanism.

2. The work apparatus according to claim 1, wherein the inspection unit performs the inspection work before the first unit operation is performed and between the unit operations performed thereafter.

3. The work apparatus according to claim 1, comprising a support pin moving means for arranging a plurality of support pins on the lifting body by moving a plurality of support pins waiting in a predetermined waiting area to the predetermined positions, wherein the support pin moving means functions as a notification means by moving support pins that were not detected as misaligned pins by the inspection unit to the waiting area and notifying the position on the lifting body of the support pins detected as misaligned pins by the inspection unit.

4. The work apparatus according to claim 1, wherein the notification means comprises a screen display means that displays the position of the misaligned pin detected by the inspection unit on a screen.

5. The work apparatus according to claim 1, comprising: a camera that images each of the plurality of support pins from above; a position calculation unit that calculates the actual position of each of the plurality of support pins on the lifting body based on the images of each of the plurality of support pins captured by the camera, wherein the inspection unit compares the actual position of each of the plurality of support pins on the lifting body calculated by the position calculation unit with the position in the data, and detects the support pins whose actual position does not match the position in the data as misaligned pins.

6. The work apparatus according to claim 1, wherein the predetermined work is a component mounting operation in which components are mounted on the substrate.

7. A work method using a work device that repeatedly performs a series of unit operations, in which a substrate is loaded by a substrate transport unit, the lower surface of the substrate is supported by a lower support unit having a configuration in which a plurality of support pins are arranged on a lifting body, a predetermined operation is performed on the substrate, the support of the substrate by the lower support unit is released and the substrate is unloaded by the substrate transport unit, An inspection step in which an inspection operation is performed to detect, among the plurality of support pins arranged on the lifting body, support pins that are misaligned from a predetermined position set on the lifting body are identified as misaligned pins, A notification step that notifies the position of the support pin detected as the misaligned pin in the lifting body during the inspection step, A work method that includes [a specific feature].

8. The work method according to claim 7, wherein the inspection step is performed before the first unit operation is performed and between the unit operations that are performed thereafter.