Polyetheramide copolymer, antistatic agent made therefrom, resin composition thereof, and molded article

Abstract

The present invention provides a polyetheramide copolymer exhibiting excellent antistatic properties and a composition thereof with a thermoplastic resin. [Solution] (a) Any of the following selected from aminocarboxylic acids, lactams, and salts synthesized from diamines and dicarboxylic acids, (b) Polyalkylene etherdiamine having a number average molecular weight of 300 to 3000, and (c) Polyetheramide copolymer (A) obtained by polymerizing dicarboxylic acids are used as antistatic agents.

Description

[Technical Field] 【0001】 This invention relates to a polyetheramide with excellent permanent antistatic properties, particularly in terms of productivity, and to a resin composition using the same. [Background technology] 【0002】 As additives to impart antistatic properties to thermoplastic resins, for example, polyether ester amide copolymers consisting of polyamide components, diol compounds, polyalkylene oxide diols, and dicarboxylic acids, as described in Patent Documents 1 and 2, and polyether amide copolymers that do not contain ester bonds, as described in Patent Document 3, have been investigated. [Prior art documents] [Patent Documents] 【0003】 [Patent Document 1] Japanese Patent Publication No. 2007-9012 [Patent Document 2] Patent No. 6807478 [Patent Document 3] Japanese Patent Publication No. 2009-35611 [Disclosure of the Invention] [Problems that the invention aims to solve] 【0004】 However, the antistatic properties of polyetheramides and polyether esteramides disclosed in these Patent Documents 1 to 3 are insufficient, and there was a problem that resin compositions using these as antistatic agents could not be used in applications such as storage and transportation components for electrical and electronic equipment, where high surface resistivity of molded products and stable, long-lasting antistatic properties are required. 【0005】 In view of the problems of the prior art described above, the present invention aims to provide a polyetheramide copolymer with excellent antistatic properties and a composition thereof with a thermoplastic resin. [Means for solving the problem] 【0006】 To solve the above problems, the present inventors conducted diligent research and found that a polyetheramide copolymer having a specific molecular weight has excellent antistatic properties. Furthermore, they found that a thermoplastic resin composition using the polyetheramide copolymer of the present invention as an antistatic agent can be given a high degree of antistatic properties, leading to the present invention. 【0007】 In other words, the present invention is as follows. (1) A polyetheramide copolymer (A) obtained by polymerizing (a) any of aminocarboxylic acids, lactams, and salts synthesized from diamines and dicarboxylic acids, (b) a polyalkylene etherdiamine having a number average molecular weight of 300 to 3000, and (c) a dicarboxylic acid. (2) The polyetheramide copolymer (A) according to (1), wherein the number average molecular weight of the polyalkylene etherdiamine (b) is 300 or more and less than 1000. (3) An antistatic agent comprising the polyetheramide copolymer (A) described in (1) or (2). (4) A thermoplastic resin composition comprising 5 to 50% by weight of the polyetheramide copolymer (A) described in (1) or (2) and 95 to 50% by weight of the thermoplastic resin (B), with the total of the polyetheramide copolymer (A) and thermoplastic resin (B) being 100% by weight. (5) The thermoplastic resin composition according to (4), comprising 0.01 to 20% by weight of at least one compound (C) selected from the group consisting of metal sulfonic acid salts, sulfonimides, and organic ionic conductive agents, with the total of the polyetheramide copolymer (A) and thermoplastic resin (B) being 100% by weight. (6) A thermoplastic resin composition of (4) or (5) wherein the thermoplastic resin (B) is at least one selected from styrene resins, polyolefin resins, polyester resins, polyamide resins, modified polyphenylene ether resins, polycarbonate resins, and polyacetal resins. (7) The thermoplastic resin composition according to (6), wherein the styrene resin is a rubber-reinforced styrene resin. (8) The thermoplastic resin composition according to (6) or (7), wherein the styrene resin is a mixture of (B-1) 10 to 100% by weight of a vinyl copolymer and (B-2) 0 to 90% by weight of a graft copolymer obtained by graft polymerization of a monomer or monomer mixture containing an aromatic vinyl monomer in a rubbery polymer. (9) A molded article comprising a polyetheramide copolymer (A) as described in (1) or (2), or a thermoplastic resin composition as described in any of (4) to (8). [Effects of the Invention] 【0008】 The polyetheramide copolymer of the present invention has high antistatic properties, and furthermore, the thermoplastic resin composition consisting of the polyetheramide copolymer of the present invention and a thermoplastic resin also exhibits excellent antistatic properties, mechanical properties, and heat resistance. [Modes for carrying out the invention] 【0009】 The present invention will be described in detail below. 【0010】 The polyetheramide copolymer (A) of the present invention is a polyetheramide block copolymer obtained by polymerizing (a) any of the aminocarboxylic acid, lactam, and diamine and dicarboxylic acid salts, (b) a polyalkylene etherdiamine having a number average molecular weight of 300 to 3000, and (c) a dicarboxylic acid. The polyetheramide copolymer thus obtained of the present invention is preferable because it does not contain ester bonds in the main chain, thus suppressing polymer hydrolysis and improving thermal stability. 【0011】 The following describes the components used as raw materials for the polyetheramide copolymer (A) of the present invention. 【0012】 This document describes (a) aminocarboxylic acids, lactams, and salts synthesized from diamines and dicarboxylic acids used in the polymerization of the polyetheramide copolymer (A) of the present invention, and the polyamide-forming components of the polyetheramide copolymer (A) formed therefrom. Examples of aminocarboxylic acids include ω-aminocaproic acid, ω-aminoenanthic acid, ω-aminocaprylic acid, ω-aminopergonic acid, ω-aminocapric acid, 11-aminoundecanoic acid, and 12-aminododecanoic acid, and examples of lactams include caprolactam, enantractam, capryllactam, and laurolactam. Examples of salts synthesized from diamines and dicarboxylic acids include hexamethylenediamine-adipate, hexamethylenediamine-sebacate, hexamethylenediamine-decanedicarboxylic acid salt, and hexamethylenediamine-isophthalate. Caprolactam, 11-aminoundecanoic acid, 12-aminododecanoic acid, and hexamethylenediamine-adipate are particularly preferred, and caprolactam is more preferred. One or two or more of these (a) polyamide-forming components may be used as needed. 【0013】 The copolymerization amount of the above (a) polyamide consisting of aminocarboxylic acid, lactam, and diamine and dicarboxylic acid is not particularly limited, but is used in the range of 10 to 95% by weight, preferably 20 to 70% by weight, and more preferably 30 to 50% by weight relative to the constituent units of the polyetheramide copolymer (A). The range of 10 to 95% by weight is preferred because it enhances the mechanical properties and transparency of the polyetheramide copolymer (A). 【0014】 The polyalkylene ether diamine (b) having a number average molecular weight of 300 to 3000 and used in the polymerization of the polyether amide copolymer (A) of the present invention is a polyether forming component of the polyether amide copolymer (A) of the present invention. The number average molecular weight of the (b) polyalkylene ether diamine is 300 to 3000, and particularly preferably in the range of 300 or more and less than 1000. When the number average molecular weight is 300 to 3000, the antistatic property, thermal stability and transparency of the obtained polyether amide copolymer (A) can be improved. Further, when the number average molecular weight of the polyalkylene ether diamine is less than 300, the thermal stability decreases, which is not preferable. 【0015】 (b) The number average molecular weight of the polyalkylene ether diamine can be measured by an end titration method by titration of terminal amino groups or a method using a gel permeation chromatography (GPC) apparatus with a differential refractometer as a detector (GPC method). For example, it can be determined by the number average molecular weight in terms of polymethyl methacrylate (PMMA) measured by gel permeation chromatography (GPC) using tetrahydrofuran as a solvent. 【0016】 The polyalkylene ether diamine (b) having a number average molecular weight of 300 to 3000 used in the present invention can be obtained by converting all hydroxyl groups of a polyalkylene ether diol having a number average molecular weight of 300 to 3000 into alkylamino groups. For example, it can be produced by reacting the above polyalkylene ether diol with acrylonitrile and hydrogenating the obtained cyanoethylated product. In this case, the number average molecular weight of the (b) polyalkylene ether diamine of the present invention may adopt the number average molecular weight of the polyalkylene ether diol used, or may be measured by the method described below. 【0017】 Examples of the polyalkylene ether diol having a number average molecular weight of 300 to 3000 used for obtaining the above polyalkylene ether diamine include poly(ethylene oxide) glycol, poly(1,2-propylene oxide) glycol, poly(1,3-propylene oxide) glycol, poly(tetramethylene oxide) glycol, poly(hexamethylene oxide) glycol, block or random copolymers of ethylene oxide and propylene oxide, and block or random copolymers of ethylene oxide and tetrahydrofuran. Among these, poly(ethylene oxide) glycol is particularly preferably used in terms of excellent antistatic properties. These polyalkylene oxide diols can be used alone or in combination of two or more as needed. 【0018】 Further, the polyalkylene ether diol having a number average molecular weight of 300 to 3000 may be one to which hydroquinone, bisphenol A, naphthalene, etc. are added to both ends. 【0019】 The number average molecular weight of the polyalkylene ether diol can be measured by an end titration method by titrating terminal amino groups or a method (GPC method) using a gel permeation chromatography (GPC) apparatus with a differential refractometer as a detector. For example, it can be determined by the number average molecular weight in terms of polymethyl methacrylate (PMMA) measured by gel permeation chromatography (GPC) using tetrahydrofuran as a solvent. 【0020】 (b) There is no particular limitation on the copolymerization amount of the polyalkylene ether diamine, but it is used in the range of 5 to 90% by weight, preferably 30 to 80% by weight, more preferably 50 to 80% by weight with respect to the structural units of the polyether amide copolymer (A). The range of 5 to 90% by weight is preferable because the antistatic property and transparency of the polyether amide copolymer (A) are enhanced. 【0021】 Examples of (c) dicarboxylic acids constituting the polyetheramide copolymer (A) in the present invention include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, phthalic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, diphenyl-4,4'-dicarboxylic acid, diphenoxyethanedicarboxylic acid, and sodium 3-sulfisoisophthalate; alicyclic dicarboxylic acids such as 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, and dicyclohexyl-4,4'-dicarboxylic acid; and aliphatic dicarboxylic acids such as succinic acid, oxalic acid, adipic acid, sebacic acid, and dodecanediic acid (decanedicarboxylic acid). In particular, terephthalic acid, isophthalic acid, 1,4-cyclohexanedicarboxylic acid, sebacic acid, adipic acid, and dodecanediic acid are preferred in terms of polymerizability, color, transparency, and physical properties. 【0022】 The polyetheramide copolymer (A) in the present invention is obtained by polymerizing the above (a), (b), and (c). The polymerization method of the polyetheramide copolymer is not particularly limited. For example, one method involves reacting (a) a polyamide-forming component with (c) a dicarboxylic acid to produce a polyamide prepolymer with carboxylic acid groups at both ends, and then reacting the polyamide prepolymer with (b) a polyalkylene etherdiamine under vacuum. The number-average molecular weight of this polyamide prepolymer is not particularly limited, but is preferably 200 to 15,000, and more preferably 500 to 5,000. 【0023】 Another method involves charging compounds (a), (b), and (c) into a reaction vessel and reacting them at a temperature of 220-260°C in or without water, under atmospheric pressure or under pressure, to produce a polyamide prepolymer, after which the reaction can be carried out under vacuum. 【0024】 Here, "under vacuum" preferably means about 2 kPa or less, more preferably 0.67 kPa or less, and most preferably 0.13 kPa or less. 【0025】 The above raw material components are usually introduced into the polymerization apparatus as individual components, aqueous solutions, and / or aqueous slurry. While any method that is easy to handle should be adopted considering factors such as melting point, water solubility, transport method, and metering method, it is preferable to introduce them as aqueous solutions and / or aqueous slurry due to the ease of transport and metering. At this time, other additive components can also be added simultaneously. It is also possible to mix, preheat, prepolymerize, and / or concentrate each component individually or in combination of two or more components before mixing and polymerizing all of them. When using aqueous solutions and / or aqueous slurry as the introduction method, it is preferable to concentrate the monomer components to a concentration of approximately 80% before introducing them into the polymerization apparatus in order to optimize the equipment size. 【0026】 The molecular weight and molecular weight distribution of the polyetheramide copolymer (A) of the present invention are not particularly limited, but a preferred range for the weight-average molecular weight is 5,000 to 500,000, more preferably 10,000 to 300,000, and particularly preferably 20,000 to 300,000. The weight-average molecular weight referred to here is the weight-average molecular weight in terms of polymethyl methacrylate (PMMA) measured by gel permeation chromatography (GPC) using hexafluoroisopropanol as the solvent. 【0027】 The melting point of the polyetheramide copolymer (A) of the present invention is not particularly limited, but is preferably in the range of 50°C to 250°C, and more preferably in the range of 100°C to 250°C. 【0028】 The volume resistivity of the polyetheramide copolymer (A) of the present invention, measured according to ASTM D257, is 10 9 Ωcm or less, preferably 10 8 It is less than or equal to Ωcm, and there is no lower limit, but 10 5 A value of Ωcm or higher is economical and preferable. 【0029】 The volume resistivity of polyetheramide copolymer (A) is 10 11 If the value exceeds Ωcm, the resulting resin composition will have insufficient antistatic properties, which is undesirable. 【0030】 The polyetheramide copolymer (A) of the present invention can be molded using general molding methods used for conventional thermoplastic resins and rubbers, such as injection molding, extrusion molding, blow molding, calendering, sheet molding, and coating. 【0031】 In the present invention, the polyetheramide copolymer (A) may be used as an elastomer as is, or it can be used as an antistatic agent by mixing it with various thermoplastic resins (B). By mixing it with thermoplastic resin (B), it is possible to improve the mechanical properties of the thermoplastic resin (B) and impart antistatic properties. 【0032】 The following describes a thermoplastic resin composition comprising the polyetheramide copolymer (A) of the present invention as an antistatic agent and a thermoplastic resin (B). 【0033】 Specific examples of thermoplastic resin (B) include, for example, styrene resins, polyester resins, polycarbonate resins, polyamide resins, polyphenylene oxide resins, modified polyphenylene oxide resins, polyphenylene sulfide resins, polyoxymethylene resins, polypropylene resins, polyolefin resins such as polyethylene, ethylene / propylene resins, ethylene / 1-butene resins, ethylene / propylene / non-conjugated diene resins, ethylene / ethyl acrylate resins, ethylene / glycidyl methacrylate resins, ethylene / vinyl acetate / glycidyl methacrylate resins, ethylene / vinyl acetate / glycidyl methacrylate resins, ethylene / propylene-g-maleic anhydride resins, polyester polyether elastomers, polyester polyester elastomers, or mixtures of two or more of these thermoplastic resins. However, styrene resins, polyester resins, polyolefin resins, and polycarbonate resins are preferred, and styrene resins are more preferred. 【0034】 Examples of olefin resins include polypropylene, polyethylene, ethylene / propylene copolymer, ethylene / 1-butene copolymer, ethylene / propylene / non-conjugated diene copolymer, ethylene / ethyl acrylate copolymer, ethylene / glycidyl methacrylate copolymer, ethylene / vinyl acetate / glycidyl methacrylate copolymer, ethylene / propylene-g-maleic anhydride copolymer, and methacrylic acid / methyl methacrylate / glutaric acid anhydride copolymer, and two or more of these may be included. Among these, polypropylene is particularly preferred from the viewpoint of further improving fluidity and the mechanical strength of the molded product. 【0035】 As polyester resins, polymers or copolymers having residues of dicarboxylic acid or its ester-forming derivative and diol or its ester-forming derivative as the main structural units are preferred. Among these, aromatic polyester resins such as polyethylene terephthalate, polypropylene terephthalate, polybutylene terephthalate, polycyclohexanedimethylene terephthalate, polyethylene naphthalate, polypropylene naphthalate, polybutylene naphthalate, polyethylene isophthalate / terephthalate, polypropylene isophthalate / terephthalate, polybutylene isophthalate / terephthalate, polyethylene terephthalate / naphthalate, polypropylene terephthalate / naphthalate, and polybutylene terephthalate / naphthalate are particularly preferred, with polybutylene terephthalate being the most preferred. Two or more of these may be contained. In these polyesters, the ratio of terephthalic acid residues to total dicarboxylic acid residues is preferably 30 mol% or more, and more preferably 40 mol% or more. 【0036】 Furthermore, the polyester resin may contain one or more residues selected from hydroxycarboxylic acids or their ester-forming derivatives and lactones. Examples of hydroxycarboxylic acids include glycolic acid, lactic acid, hydroxypropionic acid, hydroxybutyric acid, hydroxyvaleric acid, hydroxycaproic acid, hydroxybenzoic acid, p-hydroxybenzoic acid, and 6-hydroxy-2-naphthoic acid. Examples of lactones include caprolactone, valerolactone, propiolactone, undecalactone, and 1,5-oxepant-2-one. Examples of polymers or copolymers using these residues as structural units include aliphatic polyester resins such as polyglycolic acid, polylactic acid, polyglycolic acid / lactic acid, and polyhydroxybutyric acid / β-hydroxybutyric acid / β-hydroxyvaleric acid. Two or more of these may be contained. 【0037】 Polyamide resins are not particularly limited as long as they have amide bonds in their repeating structure and are obtained by ring-opening polymerization of lactams, polycondensation of diamines and dicarboxylic acids, polycondensation of aminocarboxylic acids, etc. Examples of lactams include ε-caprolactam, enantractam, and ω-laurolactam. Examples of diamines include aliphatic diamines such as tetramethylenediamine, hexamethylenediamine, undecamethylenediamine, dodecamethylenediamine, tridecamethylenediamine, 1,9-nonanediamine, 1,10-decanediamine, 2-methyl-1,8-octanediamine, 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, and 5-methylnonamethylenediamine; alicyclic diamines such as 1,3-bisaminomethylcyclohexane and 1,4-bisaminomethylcyclohexane; and aromatic diamines such as m-phenylenediamine, p-phenylenediamine, m-xylylenediamine, and p-xylylenediamine. Examples of dicarboxylic acids include aliphatic dicarboxylic acids such as adipic acid, suberic acid, azelaic acid, sebacic acid, dimer acid, dodecanediic acid, and 1,1,3-tridecanediic acid; alicyclic dicarboxylic acids such as 1,3-cyclohexanedicarboxylic acid; and aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalenedicarboxylic acid. Examples of aminocarboxylic acids include ε-aminocaproic acid, 7-aminoheptanoic acid, 8-aminooctanoic acid, 9-aminononanoic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, and 13-aminotridecanoic acid. 【0038】 Specific examples of polyamide resins include, for example, nylon 6, nylon 46, nylon 66, nylon 11, nylon 12, nylon 610, nylon 612, nylon 6 / 66, nylon 6 / 612, nylon MXD (m-xylylenediamine) 6, nylon 9T, nylon 10T, nylon 6T / 66, nylon 6T / 6I, nylon 6T / M5T, nylon 6T / 12, nylon 66 / 6T / 6I, nylon 6T / 6, etc. Two or more of these may be included. Among these, nylon 6, nylon 66, nylon 610, and nylon 9T are preferred. 【0039】 Polycarbonate resins can be obtained by methods such as the phosgene method, in which phosgene is blown into a difunctional phenolic compound in the presence of a caustic alkali and a solvent, and the transesterification method, in which a difunctional phenolic compound and diethyl carbonate are transesterified in the presence of a catalyst. Examples of polycarbonates include aromatic homopolycarbonates and aromatic copolycarbonates. The viscosity-average molecular weight of these aromatic polycarbonates is preferably 10,000 or more, and more preferably 15,000 or more. The upper limit is preferably 100,000 or less, and more preferably 50,000 or less, from the perspective of reducing fracture of fibrous fillers and ensuring production stability. Examples of difunctional phenolic compounds include 2,2'-bis(4-hydroxyphenyl)propane, 2,2'-bis(4-hydroxy-3,5-dimethylphenyl)propane, bis(4-hydroxyphenyl)methane, 1,1'-bis(4-hydroxyphenyl)ethane, 2,2'-bis(4-hydroxyphenyl)butane, 2,2'-bis(4-hydroxy-3,5-diphenyl)butane, 2,2'-bis(4-hydroxy-3,5-dipropylphenyl)propane, 1,1'-bis(4-hydroxyphenyl)cyclohexane, and 1-phenyl-1,1'-bis(4-hydroxyphenyl)ethane. Two or more of these may be used. 【0040】 Among the thermoplastic resins (B) mentioned above, examples of styrene-based resins include polystyrene, styrene / acrylonitrile copolymer, rubber-reinforced styrene-based resin, and polymer blends of rubber-reinforced styrene-based resin and polyphenylene oxide (modified polyphenylene oxide resin). 【0041】 Preferred examples of rubber-reinforced styrene resins include a vinyl copolymer (B-1) described later and a graft copolymer (B-2) obtained by graft polymerization of an aromatic vinyl monomer and, if necessary, other monomers to a rubbery polymer. This can be obtained by subjecting an aromatic vinyl monomer and, if necessary, other vinyl monomers to known bulk polymerization, bulk suspension polymerization, solution polymerization, or emulsion polymerization in the presence of a rubbery polymer. 【0042】 Examples of such rubber-reinforced styrene-based resins include high-impact polystyrene (HIPS), ABS resin (acrylonitrile-butadiene rubber-styrene copolymer), AAS resin (acrylonitrile-acrylic rubber-styrene copolymer), MBS resin (methyl methacrylate-butadiene rubber-styrene copolymer), and AES resin (acrylonitrile-ethylene propylene rubber-styrene copolymer). 【0043】 The vinyl copolymer (B-1) and graft copolymer (B-2) contained in the rubber-reinforced styrene resin used in the present invention will be described below. 【0044】 (Vinyl copolymer (B-1)) The vinyl copolymer (B-1) used in the present invention is obtained by subjecting aromatic vinyl monomers (b1-1), such as styrene, α-methylstyrene, o-methylstyrene, p-methylstyrene, o-ethylstyrene, p-ethylstyrene, and pt-butylstyrene, to known bulk polymerization, bulk suspension polymerization, solution polymerization, precipitation polymerization, or emulsion polymerization. Preferably, it is a copolymer obtained by copolymerizing a monomer mixture that contains at least an aromatic vinyl monomer (b1-1), and optionally includes a vinyl cyanide monomer (b1-2), an unsaturated carboxylate alkyl ester monomer (b1-3), and other vinyl monomers copolymerizable with these (b1-4). Note that the styrene resin (B-1) referred to here does not include graft copolymers (B-2) obtained by graft polymerization of monomer components into a rubbery polymer (r) as described later. 【0045】 There are no particular restrictions on the vinyl cyanide monomer (b1-2). Specific examples include acrylonitrile, methacrylonitrile, and ethacrylonitrile, but acrylonitrile is preferred. One or more of these can be used. 【0046】 There are no particular restrictions on the unsaturated carboxylate alkyl ester monomers (b1-3), but acrylic acid esters and / or methacrylic acid esters having an alkyl group with 1 to 6 carbon atoms or a substituted alkyl group are preferred. Specific examples include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, t-butyl (meth)acrylate, n-hexyl (meth)acrylate, cyclohexyl (meth)acrylate, chloromethyl (meth)acrylate, 2-chloroethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2,3,4,5,6-pentahydroxyhexyl (meth)acrylate, and 2,3,4,5-tetrahydroxypentyl (meth)acrylate, among which methyl methacrylate is most preferred. One or more of these can be used. 【0047】 Other vinyl monomers (b1-4) are not particularly limited as long as they can copolymerize with aromatic vinyl monomers (a1), vinyl cyanide monomers (a2), and unsaturated carboxylate alkyl ester monomers (a3). Specific examples include maleimide monomers such as N-methylmaleimide, N-ethylmaleimide, N-cyclohexylmaleimide, and N-phenylmaleimide, as well as acrylic acid, methacrylic acid, maleic acid, monoethyl maleic acid, maleic anhydride, phthalic acid, and itaconic acid. Vinyl monomers having a carboxyl group or anhydrous carboxyl group, vinyl monomers having a hydroxyl group such as 3-hydroxy-1-propene, 4-hydroxy-1-butene, cis-4-hydroxy-2-butene, trans-4-hydroxy-2-butene, 3-hydroxy-2-methyl-1-propene, cis-5-hydroxy-2-pentene, trans-5-hydroxy-2-pentene, 4,4-dihydroxy-2-butene, glycidyl acrylate, glycidyl methacrylate, glycidyl ethanolate Examples include vinyl monomers having epoxy groups such as lysidyl, glycidyl itaconicate, allyl glycidyl ether, styrene-p-glycidyl ether, and p-glycidylstyrene; acrylamide, methacrylamide, N-methylacrylamide, butoxymethylacrylamide, N-propyl methacrylamide, aminoethyl acrylate, propylaminoethyl acrylate, dimethylaminoethyl methacrylate, ethylaminopropyl methacrylate, phenylaminoethyl methacrylate, cyclohexylaminoethyl methacrylate, N-vinyldiethylamine, N-acetylvinylamine, allylamine, methallylamine, N-methylallylamine, and p-aminostyrene; vinyl monomers having amino groups and their derivatives; and vinyl monomers having oxazoline groups such as 2-isopropenyl-oxazoline, 2-vinyl-oxazoline, 2-acroyl-oxazoline, and 2-styryl-oxazoline. One or more of these can be used. 【0048】 There are no restrictions on the molecular weight of the vinyl copolymer (B-1), but preferably, a thermoplastic resin composition with excellent impact resistance and moldability can be obtained by using a vinyl copolymer (B-1) whose weight-average molecular weight, as measured by gel permeation chromatography (GPC) using tetrahydrofuran solvent, is in the range of 10,000 to 400,000, more preferably in the range of 50,000 to 400,000. Specific examples of the styrene resin (B-1) used in the present invention include polystyrene, AS resin, MAS resin, MS resin, etc. The vinyl copolymer (B-1) used in the present invention may be used by compounding one or more types; for example, AS resin and MAS resin can be used in combination. 【0049】 Here, it is preferable to use a vinyl copolymer (B-1-2) containing at least one of a carboxyl group, an acid anhydride group, an epoxy group, an amino group, and a substituted amino group as the vinyl copolymer (B-1) above, because this improves compatibility with polyetheramide (A). 【0050】 In this case, it is even more preferable to use in combination a vinyl copolymer (B-1-1) that does not contain carboxyl groups, acid anhydride groups, epoxy groups, amino groups, and substituted amino groups, and a vinyl copolymer (B-1-2) that contains at least one of carboxyl groups, acid anhydride groups, epoxy groups, amino groups, and substituted amino groups, and the amount of (B-1-2) added is preferably 1% to 15% by weight based on 100% by weight of the total of polyetheramide (A) and thermoplastic resin (B). 【0051】 (Graft copolymer (B-2)) The graft copolymer (b) used in the present invention is obtained by graft polymerization of the monomer component used in the styrene-based resin (a) in the presence of a rubbery polymer (r) by subjecting it to known bulk polymerization, bulk suspension polymerization, solution polymerization, precipitation polymerization, or emulsion polymerization. The graft copolymer (b) may include not only graft copolymers in which monomer components are graft-polymerized onto the rubbery polymer (r), but also polymers of monomer components that are not grafted onto the rubbery polymer (r). 【0052】 There are no particular restrictions on the rubbery polymer (r), but those with a glass transition temperature of 0°C or lower are preferred, and diene rubbers, acrylic rubbers, ethylene rubbers, etc., can be preferably used. Specific examples include polybutadiene, styrene-butadiene copolymer, styrene-butadiene block copolymer, acrylonitrile-butadiene copolymer, butyl acrylate-butadiene copolymer, polyisoprene, butadiene-methyl methacrylate copolymer, butyl acrylate-methyl methacrylate copolymer, butadiene-ethyl acrylate copolymer, ethylene-propylene copolymer, ethylene-isoprene copolymer, and ethylene-methyl acrylate copolymer. Among these rubbery polymers, polybutadiene, styrene-butadiene copolymer, styrene-butadiene block copolymer, and acrylonitrile-butadiene copolymer are preferably used from the viewpoint of improving mechanical strength, and can be used individually or in mixtures of two or more. 【0053】 There are no particular restrictions on the weight-average particle diameter of the rubbery polymer (r), but it is preferably in the range of 0.05 to 1.0 μm, and especially 0.1 to 0.5 μm. By setting the weight-average particle diameter of the rubbery polymer to the range of 0.05 μm to 1.0 μm, excellent impact resistance and tensile properties can be achieved. Furthermore, one or more types of rubbery polymers can be used, and in terms of impact resistance and fluidity, it is preferable to use two or more types of rubbery polymers with different weight-average particle diameters. For example, a so-called bimodal rubber may be used, which combines a rubbery polymer with a small weight-average particle diameter and a rubbery polymer with a large weight-average particle diameter. Here, the weight-average particle size of the rubbery polymer (r) can be measured using the sodium alginate method described in "Rubber Age, Vol. 88, pp. 484-490, (1960), by E. Schmidt, PHBiddison," which utilizes the fact that the particle size of polybutadiene that becomes creamy differs depending on the concentration of sodium alginate. The particle size at a cumulative weight fraction of 50% is then determined from the cumulative weight fraction of the creamy weight and the cumulative weight fraction of the sodium alginate concentration. 【0054】 There are no particular restrictions on the gel content of the rubbery polymer (r), but in terms of impact resistance and heat resistance, it is preferably 40 to 99% by weight, more preferably 60 to 95% by weight, and particularly preferably 70 to 90% by weight. Here, the gel content can be measured by determining the weight percentage of the insoluble matter obtained by extracting with toluene at room temperature for 24 hours. 【0055】 As described above, graft copolymer (b) contains not only a graft copolymer in which monomer components are graft polymerized onto a rubbery polymer (r), but also polymers of monomer components that are not grafted onto the rubbery polymer (r). There are no particular restrictions on the grafting ratio of graft copolymer (b), but in order to obtain a thermoplastic resin composition with excellent impact resistance and tensile properties, it is preferably in the range of 10 to 100% by weight, and particularly 30 to 70% by weight. Here, the grafting ratio is a value calculated by the following formula. Grafting rate (%) = [<Amount of vinyl copolymer grafted onto rubbery polymer> / <Rubber content of graft copolymer>] × 100. 【0056】 The properties of the ungrafted polymer, which is the methyl ethyl ketone-soluble component of the graft copolymer (b), are not particularly limited. However, preferably, a thermoplastic resin composition with excellent impact resistance and moldability can be obtained by using a polymer with a weight-average molecular weight in the range of 10,000 to 400,000, more preferably in the range of 50,000 to 150,000, as measured by gel permeation chromatography (GPC) using tetrahydrofuran solvent. 【0057】 As mentioned above, graft copolymer (b) can be obtained by known polymerization methods. For example, it can be obtained by emulsion polymerization, in which a mixture of monomers and chain transfer agents and a solution of a radical generator dissolved in an emulsifier are continuously supplied to a polymerization vessel in the presence of a rubbery polymer latex. 【0058】 In the rubber-reinforced styrene resin containing the above-mentioned (B-1) styrene resin and (B-2) graft copolymer, the mixing ratio is preferably 10-100% by weight of (B-1) and 0-90% by weight of (B-2) relative to the total of (B-1) and (B-2), and more preferably 20-80% by weight of (B-1) and 20-80% by weight of (B-2). Furthermore, the content of the rubbery polymer contained in the above-mentioned rubber-reinforced styrene resin is preferably 5-30% by weight, and more preferably 10-20% by weight, in order to balance impact resistance and moldability. 【0059】 In a thermoplastic resin composition containing the above-mentioned polyetheramide copolymer (A) as an antistatic agent and a thermoplastic resin (B), the mixing ratio is 95-50% by weight of thermoplastic resin (B) and 5-50% by weight of the antistatic agent, preferably 80-50% by weight of thermoplastic resin (B) and 20-50% by weight of the antistatic agent, with the total of the antistatic agent and thermoplastic resin (B) being 100% by weight. When the mixing ratio of the antistatic agent and thermoplastic resin (B) is within the above range, the antistatic properties and mechanical properties of the thermoplastic resin composition are improved, which is preferable. 【0060】 Furthermore, the thermoplastic resin composition of the present invention may contain at least one compound (C) selected from the group consisting of metal sulfonic acid salts, sulfonimides, and organic ionic conductive agents, which is preferable from the viewpoint of antistatic properties. 【0061】 Examples of metal sulfonic acid salts and metal sulfoimide salts include alkyl sulfonic acid salts, alkyl sulfoimide salts, perfluoroalkyl sulfonates, and perfluoroalkyl sulfoimide salts. From the viewpoint of dispersibility in resin compositions and more effective antistatic properties, specific examples include benzenesulfonates and trifluoromethanesulfonates. 【0062】 The organic ionic conductive agent used in this invention is an organic compound salt that, while being an organic substance, possesses ionic properties, and includes organic compound salts that have a low melting point and are liquid at room temperature, also known as ionic liquids or ionic fluids. Examples of such organic compound salts include those composed of cations such as imidazolium, pyridinium, ammonium, and phosphonium, and fluorine-containing anions such as fluoride ions and triflate. 【0063】 More specifically, examples of imidazolium salts as organic ionic conductive agents include 1,3-dimethylimidazolium methylsulfate, 1-ethyl-3-methylimidazolium bis(pentafluoroethylsulfonyl)imide, 1-ethyl-3-methylimidazolium bis(trifluoroethylsulfonyl)imide, 1-ethyl-3-methylimidazolium bromide, 1-ethyl-3-methylimidazolium chloride, 1-ethyl-3-methylimidazolium nitrate, and 1-ethyl-3-methylimidazolium hexafluorophosphate. 1-ethyl-3-methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium tosylate, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-n-butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide, 1-butyl-3-methylimidazolium bromide, 1-butyl-3-methylimidazolium chloride, 1-butyl-3-methylimidazolium hexafluorophosphate 1-Butyl-3-methylimidazolium·2-(2-methoxyethoxy)ethyl sulfate, 1-Butyl-3-methylimidazolium·methyl sulfate, 1-Butyl-3-methylimidazolium·tetrafluoroborate, 1-Hexyl-3-methylimidazolium·chloride, 1-Hexyl-3-methylimidazolium·hexafluorophosphate, 1-Hexyl-3-methylimidazolium·tetrafluoroborate, 1-Methyl-3-octylimidazolium·chloride, 1-Methyl-3-octylimidazolium·tetrafluoroborate 1,2-dimethyl-3-propyloctylimidazolium·tris(trifluoromethylsulfonyl)methide, 1-butyl-2,3-dimethylimidazolium·chloride, 1-butyl-2,3-dimethylimidazolium·hexafluorophosphate, 1-butyl-2,3-dimethylimidazolium·tetrafluoroborate, 1-methyl-3-(3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl)imidazolium·hexafluorophosphate, and 1-butyl-3-(3,3,4,4,5,5,6,6,7,7,Examples include 8,8,8-tridecafluorooctyl)imidazolium hexafluorophosphate. 【0064】 Examples of pyridinium salts used as organic ionic conductive agents include 3-methyl-1-propylpyridinium bis(trifluoromethylsulfonyl)imide, 1-butyl-3-methylpyridinium bis(trifluoromethylsulfonyl)imide, 1-propyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-4-methylpyridinium bromide, 1-butyl-4-methylpyridinium chloride, 1-butyl-4-methylpyridinium hexafluorophosphate, and 1-butyl-4-methylpyridinium tetrafluoroborate. 【0065】 Examples of organic ionic conductive agents that are ammonium salts include tetrabutylammonium heptadecafluorooctanesulfonate, tetrabutylammonium nonafluorobutanesulfonate, tetrapentylammonium methanesulfonate, tetrapentylammonium thiocyanate, and methyl-tri-n-butylammonium methylsulfate. 【0066】 Examples of organic ionic conductive agents that are phosphonium salts include tetrabutylphosphonium methanesulfonate, tetrabutylphosphonium p-toluenesulfonate, trihexyltetradecylphosphonium bis(trifluoroethylsulfonyl)imide, trihexyltetradecylphosphonium bis(2,4,4-trimethylpentyl)phosphinate, trihexyltetradecylphosphonium bromide, trihexyltetradecylphosphonium chloride, trihexyltetradecylphosphonium decanoate, trihexyltetradecylphosphonium hexafluorophosphinate, triethyltetradecylphosphonium tetrafluoroborate, and tributylmethylphosphonium tosylate. 【0067】 At least one compound (C) selected from the group consisting of the above-mentioned metal sulfonic acid salts, sulfonimides, and organic ionic conductive agents is preferably 0.01 to 20% by weight, more preferably 0.05 to 10% by weight, and even more preferably 0.1 to 5% by weight, based on 100% by weight of the total of the antistatic agent (A) made of polyetheramide copolymer and the thermoplastic resin (B). 【0068】 It is preferable to set the mixing ratio of compound (C) within the above range, as this effectively improves the antistatic properties of the thermoplastic resin composition of the present invention. 【0069】 At least one compound (C) selected from the group consisting of the above-mentioned metal sulfonic acid salts, sulfonimides, and organic ionic conductive agents may be blended with the polyetheramide copolymer (A), in which case an antistatic agent containing the polyetheramide copolymer (A) and compound (C) can be obtained. There are no particular restrictions on the method of mixing the polyetheramide copolymer (A) and compound (C), but examples include blending before or after polymerization of the polyetheramide copolymer (A), or blending after obtaining the polyetheramide copolymer (A) using a known mixer or the like. 【0070】 Furthermore, at least one compound (C) selected from the group consisting of metal sulfonic acid salts, sulfonimides, and organic ionic conductive agents may be pre-blended into the thermoplastic resin (B) or blended into a resin composition comprising the above-mentioned antistatic agent and thermoplastic resin (B). 【0071】 The thermoplastic resin composition of the present invention may optionally contain fillers such as glass fibers, carbon fibers, metal fibers, aramid fibers, asbestos, potassium titanate whiskers, wollastonite, glass flakes, glass beads, talc, mica, clay, calcium carbonate, barium sulfate, titanium oxide, and aluminum oxide, as long as the objectives of the present invention are not impaired. Among these, glass fibers, carbon fibers, and metal fibers can be preferably used, with carbon fibers being the most preferred. The type of these fibrous fillers is not particularly limited as long as they are commonly used for reinforcing resins, and can be selected from, for example, long fiber type or short fiber type chopped strands, milled fibers, etc. 【0072】 Furthermore, the fibrous, powdered, granular, or plate-like fillers used in the present invention may also be used after their surfaces have been treated with known coupling agents (for example, silane-based coupling agents, titanate-based coupling agents, etc.) or other surface treatment agents. 【0073】 Furthermore, glass fibers and carbon fibers may be coated or bundled with thermoplastic resins such as ethylene / vinyl acetate copolymers, or thermosetting resins such as polyurethane resins or epoxy resins. 【0074】 To the thermoplastic resin composition of the present invention, one or more conventional additives may be added, to the extent that the objectives of the present invention are not impaired, such as antioxidants such as hindered phenol-based, phosphorus-based, and sulfur-based antioxidants; heat stabilizers; ultraviolet absorbers (e.g., resorcinol, salicylate, benzotriazole, benzophenone, etc.); lubricants and mold release agents (e.g., montanic acid and its salts, its esters, its half-esters, stearyl alcohol, stellaamide, and ethylene wax, etc.); color inhibitors (e.g., phosphates, hypophosphates, etc.); nucleating agents; plasticizers; impact modifiers (e.g., silicone oil, silicone resin, elastomer, etc.); and colorants including dyes and pigments (e.g., cadmium sulfide, phthalocyanine, titanium dioxide, etc.). 【0075】 The present invention provides a resin composition comprising an antistatic agent made of a polyetheramide copolymer (A) and a thermoplastic resin (B), and a resin composition comprising the resin composition and at least one compound (C) selected from the group consisting of metal sulfonic acid salts, sulfonimides, and organic ion conductive agents. The method for producing this resin composition is not particularly limited. For example, a preferred method involves pre-blending the antistatic agent made of a polyetheramide copolymer (A), the thermoplastic resin (B), at least one compound (C) selected from the group consisting of metal sulfonic acid salts, sulfonimides, and organic ion conductive agents, and optionally adding a nucleating agent, filler, plasticizer, and other additives, and then uniformly melt-kneading the mixture at a temperature above its melting point using a single-screw or twin-screw extruder, or mixing the mixture in a solution and then removing the solvent. 【0076】 The mixture is supplied to an extruder or the like, with or without pre-mixing, and thoroughly melted in a temperature range of 150°C to 350°C. It is prepared by kneading. In this case, for example, a single-screw extruder, twin-screw, or tri-screw extruder equipped with a "Unimelt" type screw, or a kneader-type kneader can be used. 【0077】 The thermoplastic resin composition of the present invention not only exhibits antistatic properties but also excellent mechanical properties, heat resistance, and moldability. Because it is melt-mold, it can be used in extrusion molding, injection molding, press molding, etc., and can be molded into films, tubes, rods, or molded products of any desired shape and size. Furthermore, its flame retardancy allows it to be used in a variety of applications, including housings and components for electrical and electronic components, automotive parts, mechanical components, office automation equipment, and home appliances. [Examples] 【0078】 To further illustrate the present invention, examples and comparative examples will be given below, but the present invention is not limited to these examples. Parts and % in the examples refer to parts by weight and weight %, respectively. 【0079】 [Characterization of polyetheramide copolymer (A), vinyl copolymer (B-1), and graft copolymer (B-2)] (1) Volume resistivity (Ωcm) The obtained polyetheramide copolymer (A) was press-molded at 230°C to form a 1 mm thick sheet. After being left for 24 hours in an environment of 23°C and 50% RH humidity, the volume resistivity was measured in accordance with ASTM D257. 【0080】 (2) Number-average molecular weight and weight-average molecular weight Number-average molecular weight and weight-average molecular weight were measured using a Water gel permeation chromatography (GPC) system with a differential refractometer (Water2414) as the detector, two Polymer Laboratories MIXED-B columns, and hexafluoroisopropanol as the solvent for polyetheramide copolymers (A), and tetrahydrofuran for polyalkylene etherdiamine (b), vinyl copolymers (B-1-1, B-1-2), and non-grafted polymers of graft copolymer (B-2). The measurements were performed at a flow rate of 1 ml / min and a column temperature of 40°C. 【0081】 (3) Grafting rate of graft copolymer (B-2) The grafting rate of the graft copolymer (B-2) was determined by the following method. A predetermined amount (m) of the graft copolymer was mixed with acetone and refluxed for 4 hours. This solution was centrifuged at 8000 rpm (centrifugal force of 10,000 G) for 30 minutes, and the insoluble matter was filtered out. This insoluble matter was dried under reduced pressure at 70°C for 5 hours, and its weight (n) was measured. The grafting rate was calculated using the following formula. Graft rate = [(n) - (m) × L] / [(m) × L] × 100 (In the formula, L is the rubber content of the graft copolymer.) 【0082】 (4) Melting point The crystallization temperature of polyetheramide copolymer (A) was measured using a differential scanning calorimetry (PerkinElmer DSC-7) (measurement conditions: cooling start temperature 250°C, cooling rate 20°C / min). <Example 1, Comparative Example 1 and Comparative Example 2: Production of polyetheramide copolymers (A-1, A-2) and polyether ester amide copolymer (A-3)> (Example 1) Polyethylene glycol diamine (number-average molecular weight 650), in which more than 97% of both ends are amino groups, was synthesized by reacting polyethylene glycol with acrylonitrile in the presence of an alkaline catalyst and then carrying out a hydrogenation reaction. A 45% by weight aqueous solution of polyethylene glycol diammonium adipate was obtained by reacting this with adipic acid using a conventional salt reaction. 【0083】 Next, a capacity of 2m 3 200 kg (net weight: 90 kg, ratio to total polymerization raw materials: 42% by weight) of the above 45% by weight polyethylene glycol diammonium adipate aqueous solution, 120 kg (net weight: 102 kg, ratio to total polymerization raw materials: 48% by weight) of the above 85% by weight caprolactam aqueous solution, and 0.5 parts of antioxidant (Irganox 1098: manufactured by Ciba Specialty Chemicals Co., Ltd., hereafter the same) were added to the concentrate, and the mixture was heated at atmospheric pressure for about 2 hours until the internal temperature reached 110°C to concentrate it to about 80%. Subsequently, the above concentrate was transferred to a polymerization tank with a capacity (internal volume of the polymerization tank: 800 L) equipped with helical ribbon type stirring blades, and heating was started at a stirring speed of 20 rpm while flowing nitrogen at 50 L / min into the polymerization tank, and the mixture was heated until the internal temperature reached 250°C to complete the polymerization. 【0084】 After polymerization was complete, a nitrogen pressure of 0.7 MPa·G was applied to the can, and the molten polymer was extruded onto a rotating endless belt (6 m long, belt material: stainless steel, cooled on the back with water spray) in the shape of a belt approximately 15 cm wide and 1.5 mm thick. After cooling, it was cut into pellets to obtain polyetheramide copolymer (A-1). The weight-average molecular weight of the obtained copolymer was 154,000, and the volume resistivity was 4 × 10⁻⁶. 8 The material had a density of Ωcm and a melting point of 120°C. 【0085】 (Comparative Example 1) Polyetheramide copolymer (A-2) was obtained in the same manner as in Example 1, except that the number-average molecular weight of polyethylene glycol diamine was set to 4000. The weight-average molecular weight of the obtained copolymer was 162,000, and the volume resistivity was 8 × 10⁻⁶. 9 The pressure was Ωcm and the melting point was 205°C. 【0086】 (Comparative Example 2) 45 parts caprolactam, 45 parts ethylene oxide adduct of bisphenol A with a number-average molecular weight of 1,800, 5 parts polyethylene glycol with a number-average molecular weight of 1,800, 5.2 parts terephthalic acid, and 0.2 parts "Irganox" (registered trademark) 1098 (antioxidant) were charged into a reaction vessel. The mixture was purged with nitrogen and heated and stirred at 260°C for 60 minutes to obtain a clear homogeneous solution, after which the pressure was reduced to below 0.07 kPa. 0.1 parts tetrabutyl titanate was added, and the mixture was reacted for 2 hours under conditions of a pressure of below 0.07 kPa and a temperature of 260°C. The resulting polymer was extruded in strand form and cut to obtain a pellet-shaped polyether ester amide copolymer (A-3). The weight-average molecular weight of the obtained copolymer was 152,000, and the volume resistivity was 1 × 10⁻⁶. 10 The pressure was Ωcm and the melting point was 202°C. 【0087】 From Example 1, it can be seen that the polyetheramide copolymer (A) of the present invention has a low volume resistivity and is useful as an antistatic agent. 【0088】 On the other hand, Comparative Examples 1 and 2 show that polyetheramide copolymers fall outside the scope of the present invention, and polyether ester amides have inferior volume resistivity and are insufficient as antistatic agents. 【0089】 <Reference Example 1: Production of vinyl copolymers (B-1-1, B-1-2) and graft copolymers (B-2)> [Production of vinyl copolymer (B-1-1)] A monomer mixture consisting of 70% styrene and 30% acrylonitrile was subjected to suspension polymerization to obtain vinyl copolymer (B-1). The weight-average molecular weight of the obtained vinyl copolymer (B-1) in terms of polystyrene was 337,000. [Production of vinyl copolymer (B-1-2)] A monomer mixture consisting of 70% styrene, 25% acrylonitrile, and 5% methacrylic acid was subjected to suspension polymerization to obtain a vinyl copolymer (B-1-2). The weight-average molecular weight of the obtained vinyl copolymer (B-1-2) on a polystyrene basis was 335,000. 【0090】 [Production of graft copolymer (B-2)] 60 parts (on a solids basis) of polybutadiene latex (weight-average particle size 0.3 μm, gel content 85%) were added to 40 parts of a monomer mixture consisting of 70% styrene and 30% acrylonitrile, and emulsion polymerization was carried out. The resulting graft copolymer was coagulated with sulfuric acid, neutralized with sodium hydroxide, washed, filtered, and dried to obtain a powdered graft copolymer (B-2). The grafting rate of the obtained graft copolymer (B-1) was 36%, and the weight-average molecular weight of the ungrafted polymer was 125,000. 【0091】 [Perfluoroalkyl metal salt compound (C-1)] As the perfluoroalkyl metal salt compound (C), lithium trifluoromethanesulfonate "EF-15" (manufactured by Mitsubishi Plastics Materials Corporation) (C-1) was used. 【0092】 <Examples 2-6 and Comparative Examples 3-6> The thermoplastic resin composition of the present invention was prepared by compounding it according to the ratios shown in Table 1, and then using a vented 30 mmφ twin-screw extruder (manufactured by Japan Steel Works, TEX-30) to perform melt-kneading and extrusion at a cylinder temperature of 230°C to produce a pelletized resin composition. 【0093】 [Evaluation of resin compositions] The pellets obtained in the above examples and comparative examples were injection molded using a Toshiba Machine IS55EPN injection molding machine under conditions of a molding temperature of 230°C and a mold temperature of 40°C. The characteristics of the test specimens obtained were evaluated using the following measurement methods. 【0094】 (1) Surface specific resistance (Ω / □) For the injection molded product (3 mm thick), after leaving it standing for 24 hours in an environment of temperature 23°C and humidity 50%RH, the surface specific resistance was measured in accordance with ASTM D257. The surface specific resistance value after 1 minute with an applied voltage of 500V was read. 【0095】 (2) Charpy impact strength (kJ / m 2 ) Measured in accordance with ISO179. 【0096】 (3) Flexural modulus (GPa) Measured in accordance with ASTM D790. 【0097】 【Table 1】 【0098】 It can be seen from Examples 2 to 5 that the resin composition using the polyether amide copolymer (A-1) of the present invention as an antistatic agent is excellent in surface specific resistance and also excellent in impact resistance and flexural modulus. Furthermore, it can be seen that the surface specific resistance can be reduced by using a resin composition containing a sulfonate (C). 【0099】 On the other hand, it can be seen from Comparative Examples 3 to 6 that when the polyether amide copolymer (A) is outside the scope of the present invention, the surface specific resistance of the molded product of the thermoplastic resin composition is inferior. 【Industrial Applicability】 【0100】 The polyether amide copolymer, antistatic agent and thermoplastic resin composition of the present invention have a low volume resistivity and surface specific resistance, have stable and persistent antistatic properties, and are excellent in mechanical properties. Taking advantage of such properties, the resin composition of the present invention is suitably used as a component for storing and transporting electrical and electronic equipment parts. 【0101】 Electrical and electronic equipment components include, for example, parts for various devices equipped with precision electrical and electronic control devices, such as car navigation systems, car audio systems, automotive electrical components such as fuel cell peripherals installed in electric vehicles, IC peripherals or casings for commercial or home electronic toys equipped with ICs, commercial or home digital electronic equipment components, slot machines, and commercial amusement and entertainment equipment components such as pachinko or electronic game devices. Components for transporting electrical and electronic components include, for example, carrier reels and TAB tape reels.

Claims

[Claim 1] (a) A polyetheramide copolymer (A) obtained by polymerizing any of the following: (a) an aminocarboxylic acid, a lactam, and a salt synthesized from a diamine and a dicarboxylic acid; (b) a polyalkylene etherdiamine having a number average molecular weight of 300 to 3000; and (c) a dicarboxylic acid. [Claim 2] The polyetheramide copolymer (A) according to claim 1, wherein the number average molecular weight of the polyalkylene etherdiamine (b) is 300 or more and less than 1000. [Claim 3] An antistatic agent comprising the polyetheramide copolymer (A) according to claim 1 or 2. [Claim 4] A thermoplastic resin composition comprising 5 to 50% by weight of the polyetheramide copolymer (A) and 95 to 50% by weight of the thermoplastic resin (B) according to claim 1, with the total of the polyetheramide copolymer (A) and thermoplastic resin (B) being 100% by weight. [Claim 5] The thermoplastic resin composition according to claim 4, wherein the total amount of polyetheramide copolymer (A) and thermoplastic resin (B) is 100% by weight, and the composition comprises 0.01 to 20% by weight of at least one compound (C) selected from the group consisting of metal sulfonic acid salts, sulfonimides, and organic ionic conductive agents. [Claim 6] The thermoplastic resin composition according to claim 4, wherein the thermoplastic resin (B) is at least one selected from styrene resins, polyolefin resins, polyester resins, polyamide resins, modified polyphenylene ether resins, polycarbonate resins, and polyacetal resins. [Claim 7] The thermoplastic resin composition according to claim 6, wherein the styrene resin is a rubber-reinforced styrene resin. [Claim 8] The thermoplastic resin composition according to claim 7, wherein the styrene resin is a mixture of 10 to 100% by weight of a vinyl copolymer (B-1) and 0 to 90% by weight of a graft copolymer (B-2) obtained by graft polymerization of a monomer or monomer mixture containing an aromatic vinyl monomer in a rubbery polymer. [Claim 9] A molded article comprising the polyetheramide copolymer (A) according to claim 1 or 2, or the thermoplastic resin composition according to any one of claims 4 to 8.