Chip package structure and domain controller

Abstract

This disclosure relates to a chip package structure and a domain controller that can guarantee heat dissipation performance. [Solution] The chip package structure includes a heat-generating chip, a substrate on which the heat-generating chip is mounted, a heat-dissipating cover which is attached to the substrate so that the heat-generating chip is located in a housing space surrounded by the substrate, the inner bottom wall of the heat-dissipating cover, and the inner side wall of the heat-dissipating cover, a heat transfer medium interposed between a first surface of the heat-generating chip away from the substrate and a first region of the inner bottom wall, and a reinforcing structure which abuts a second region other than the first region of the inner bottom wall and the inner side wall, and satisfies the condition that the distance to the second region is greater for the part of the second surface facing the heat-generating chip that is closer to the inner side wall, and smaller for the part of the second surface that is farther from the inner side wall.

Description

【Technical Field】 【0001】 The present disclosure relates to chip technology, and particularly to chip package structures and domain controllers. 【Background Art】 【0002】 Currently, chip package structures are widely applied. The type of chip package structure can be, for example, a Flip Chip Ball Grid Array (FCBGA) type. In related technologies, due to the poor heat dissipation performance of chip package structures, how to improve the heat dissipation performance of chip package structures is a problem worthy of attention for those skilled in the art. 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0003】 The present disclosure provides a chip package structure and a domain controller to solve the above technical problems. 【Means for Solving the Problems】 【0004】 A chip package structure according to an aspect of an embodiment of the present disclosure includes a heat-generating chip, a substrate on which the heat-generating chip is mounted, a heat dissipation cover, which is crowned on the substrate such that the heat-generating chip is located in an accommodation space surrounded by the substrate, the inner bottom wall of the heat dissipation cover, and the inner side wall of the heat dissipation cover, a heat transfer medium interposed between a first surface of the heat-generating chip away from the substrate and a first region of the inner bottom wall, a reinforcing structure that abuts against a second region other than the first region of the inner bottom wall and the inner side wall, and satisfies that the distance from the second surface facing the heat-generating chip to the second region is greater at a site closer to the inner side wall and smaller at a site farther from the inner side wall. 【0005】 A domain controller according to another embodiment of the embodiments of this disclosure includes the above-described chip package structure. [Effects of the Invention] 【0006】 According to the chip package structure and domain controller of the above embodiment of this disclosure, the substrate mounts a heat-generating chip, and the heat dissipation cover can be attached to the substrate so as to package the heat-generating chip in a housing space surrounded by the substrate, the inner bottom wall of the heat dissipation cover, and the inner side wall of the heat dissipation cover. Since a heat transfer medium is interposed between the first surface of the heat-generating chip that is away from the substrate and the first region of the inner bottom wall of the heat dissipation cover, the heat generated by the heat-generating chip can be quickly conducted to the heat dissipation cover via the heat transfer medium and dissipated. The reinforcing structure is advantageous for forming a triangular stabilizing structure or a triangular-like stabilizing structure within the housing space because the reinforcing structure abuts the second region of the inner bottom wall of the heat dissipation cover and the inner side wall of the heat dissipation cover and the second surface of the reinforcing structure that faces the heat-generating chip satisfies the target conditions, thereby improving the rigidity of the heat dissipation cover and, consequently, the entire chip package structure. For chip package structures applied to domain controllers, it is often necessary to perform a thermal reflow treatment during the packaging process, and a series of pressure tests are often required after the packaging process is completed. Furthermore, generally, the thermal expansion coefficients of the materials of the heat-generating chip and the substrate do not match, and if the rigidity of the chip package structure is insufficient, warping of the substrate is likely to occur after thermal reflow processing. This causes layer separation between the heat sink cover and the heat transfer medium, affecting the efficiency of heat conduction and thereby reducing the heat dissipation performance of the chip package structure. In addition, during pressure testing, when pressure is applied to the heat sink cover by the jig used to perform the pressure test, deformation occurs in both the heat sink cover and the heat transfer medium. When the pressure is released, the deformation recovery capabilities of the heat sink cover and the heat transfer medium do not match, which also causes layer separation between the heat sink cover and the heat transfer medium, affecting the efficiency of heat conduction and thereby reducing the heat dissipation performance of the chip package structure. In the embodiments of this disclosure, the arrangement of the reinforcing structure can improve the rigidity of the heat dissipation cover and, consequently, the entire chip package structure. This is advantageous not only for reducing substrate warping due to thermal reflow processing, but also for reducing the amount of deformation required for the recovery of the heat dissipation cover and heat transfer medium after the release of pressure. This weakens the degree of layer separation between the heat dissipation cover and the heat transfer medium, ensuring the efficiency of heat conduction and guaranteeing the heat dissipation performance of the chip package structure. [Brief explanation of the drawing] 【0007】 [Figure 1] This is a schematic diagram of a chip package structure relating to some exemplary embodiments of the present disclosure. [Figure 2] This is a schematic diagram of a chip package structure relating to some other exemplary embodiments of the present disclosure. [Figure 3] This is a schematic diagram of a chip package structure relating to some further exemplary embodiments of the present disclosure. [Figure 4] This is a schematic diagram of a chip package structure relating to some exemplary embodiments of the present disclosure. [Figure 5] This is a schematic diagram of the configuration of the inner bottom wall of a heat dissipation cover in some exemplary embodiments of the present disclosure. [Figure 6] This is a schematic diagram of a reinforcing structure in some exemplary embodiments of the present disclosure. [Figure 7] This is a schematic diagram of a chip package structure relating to some exemplary embodiments of the present disclosure. [Figure 8-1] This is a schematic diagram of the layout of multiple reinforcing structures in some exemplary embodiments of the present disclosure. [Figure 8-2] This is a schematic diagram of the layout of multiple reinforcing structures in some other exemplary embodiments of the present disclosure. [Figure 9] This is a schematic diagram of finite element simulation results in some exemplary examples of the present disclosure. [Modes for carrying out the invention] 【0008】 Hereinafter, exemplary embodiments relating to this disclosure will be described in detail with reference to the drawings. It is clear that the embodiments described are not all embodiments but only a selection of embodiments of this disclosure, and this disclosure is not limited to the exemplary embodiments described herein. 【0009】 In the description of this disclosure, directions or positional relationships indicated by terms such as “up,” “down,” “left,” and “right” refer to the directions or positional relationships shown in the drawings and are merely for the purpose of facilitating the description and simplification of the description. They do not indicate or suggest that the devices shown necessarily have a specific direction or must be configured or operated in a specific direction, and should not be understood as limiting this disclosure. 【0010】 In the descriptions of this disclosure, unless otherwise explicitly stated or limited, terms such as “attachment,” “connection,” and “fixing” should be understood broadly, including, for example, fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, direct connections, and indirect connections via an intermediate medium. Those skilled in the art will be able to understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. 【0011】 Embodiments of this disclosure provide a chip package structure. 【0012】 The chip package structure can be selectively applied to the domain controller. The domain controller is a core component in vehicles, enabling technologies such as driver assistance and autonomous driving. The domain controller is a highly integrated and complex circuit system. For example, a domain controller can be a circuit system integrating power modules, control modules, sensor modules, and electronic control units. 【0013】 Naturally, the chip package structure can be applied to devices or systems other than domain controllers, depending on the actual needs, and this disclosure is not limited to such applications. For the sake of understanding, the application of the chip package structure to a domain controller will be described below as an example. 【0014】 As shown in FIGS. 1 to 4, the chip package structure includes: a heat - generating chip 10, a substrate 20 on which the heat - generating chip 10 is mounted, a heat dissipation cover 30, where the heat - generating chip 10 is located within a housing space surrounded by the substrate 20, the inner bottom wall 305 of the heat dissipation cover 30, and the inner side wall 307 of the heat dissipation cover 30, and the heat dissipation cover 30 is crowned on the substrate 20; a heat transfer medium 40 interposed between the first surface 101 of the heat - generating chip 10, which is away from the substrate 20, and the first region 3051 of the inner bottom wall 305; a reinforcing structure 50 that abuts against the second region 3053 other than the first region 3051 of the inner bottom wall 305 and the inner side wall 307, and the second surface 501 facing the heat - generating chip 10 satisfies the target condition that the distance to the second region 3053 is larger at the part closer to the inner side wall 307 and smaller at the part farther from the inner side wall 307. 【0015】 Optionally, the heat - generating chip 10 can be a chip that generates a large amount of heat during operation. For example, the heat - generating chip 10 can be a chip for intelligent operation. 【0016】 Optionally, the substrate 20 can be a support on which elements are mounted and can also be called a carrier of the elements. The elements mentioned in this specification may include, but are not limited to, the heat - generating chip 10 and the electronic element 60 mentioned below. The substrate 20 can mount the heat - generating chip 10 on its upper surface, and the heat - generating chip 10 can be fixed to the substrate 20. For example, several micro - bumps 102 are installed on the lower surface of the heat - generating chip 10, and the micro - bumps 102 can be welded to the substrate 20 to realize the fixation of the heat - generating chip 10 to the substrate 20. 【0017】 Optionally, the heat dissipation cover 30 can be a covering structure that combines a heat transfer function, a support function, and a function of assisting in forming the housing space. The heat dissipation cover 30 includes: a heat - spreader sheet 308 including an upper surface and a lower surface that are parallel to each other. The base 309 may include a base 309 that extends from the lower surface of the heat-distributing sheet 308 toward the upper surface of the heat-distributing sheet 308, has a central through-hole 3092 which is a rectangular hole, and whose bottom wall is flush with the lower surface of the heat-distributing sheet 308. 【0018】 When the heat dissipation cover 30 is constructed with the above structure, the bottom wall of the central through-hole 3092 can be made into the inner bottom wall 305 of the heat dissipation cover 30, and the side walls of the central through-hole 3092 can be made into the inner side wall 307 of the heat dissipation cover 30. The heat uniforming sheet 308, the base 309, and the substrate 20 can be center-aligned (same center alignment), and by bonding the lower surface of the base 309 and the upper surface of the substrate 20 with adhesive 70, the heat dissipation cover 30 can be attached to the substrate 20. In addition, the substrate 20, the inner bottom wall 305 of the heat dissipation cover 30, and the inner side wall 307 of the heat dissipation cover 30 surround each other, forming a housing space for housing the heat-generating chip 10. 【0019】 Selectively, the heat transfer medium 40 can be a medium with good heat transfer properties, and the heat transfer medium 40 may also be called a thermal interface material. The heat transfer medium 40 may include, but is not limited to, silica gel, thermal silicone grease, thermal gel, etc. The heat transfer medium 40 can be interposed between the first surface 101 of the heat-generating chip 10 away from the substrate 20 and the first region 3051 of the inner bottom wall 305 of the heat dissipation cover 30. The first surface 101 of the heat-generating chip 10 away from the substrate 20 is the top surface of the heat-generating chip 10. The first region 3051 of the inner bottom wall 305 of the heat dissipation cover 30 is the projected region of the heat-generating chip 10 on the inner bottom wall 305 of the heat dissipation cover 30, and this projected region is a rectangular region. The remaining region of the inner bottom wall 305 of the heat dissipation cover 30 other than the first region 3051 can be collectively referred to as the second region 3053. The configuration of the inner bottom wall 305 of the heat dissipation cover 30 can be specifically seen in Figure 5. 【0020】 Selectively, the reinforcing structure 50 is a structure that can improve the rigidity of the heat dissipation cover 30 and, consequently, the entire chip package structure. The reinforcing structure 50 includes a second surface 501 facing the heat-generating chip 10. The second surface 501 may be a flat surface or a curved surface, and this curved surface may be convex or concave. The remaining components of the reinforcing structure 50 other than the second surface 501 are all located in the space defined by the second region 3053, the inner side wall 307, and the second surface 501. The second surface 501 satisfies the above-mentioned target conditions. For example, as shown in Figure 1, the second surface 501 may include parts B1, B2, and B3, where part B1 is closest to the inner side wall 307, and part B3 is furthest from the inner side wall 307. Therefore, the distance between part B1 and the second region 3053 is the greatest, the distance between part B2 and the second region 3053 is the second greatest, and the distance between part B3 and the second region 3053 is the smallest. 【0021】 In one example, the reinforcing structure 50 can be a solid structure, and the reinforcing structure 50 can be similar to a reinforcing rib exhibiting a pentahedral structure as shown in Figure 6, where one straight edge of the reinforcing rib abuts against the second region 3053, the other straight edge of the reinforcing rib abuts against the inner side wall 307, and the outer surface of the slanted edge of the reinforcing rib can be the second surface 501. 【0022】 In another example, the reinforcing structure 50 can be a hollow structure, and the reinforcing structure 50 can be a diagonally placed reinforcing plate, where one end of the reinforcing plate abuts against the second region 3053, the other end of the reinforcing plate abuts against the inner side wall 307, and one outer surface of the reinforcing plate can be the second surface 501. 【0023】 In embodiments of this disclosure, the substrate 20 mounts the heat-generating chip 10, and the heat dissipation cover 30 can be mounted on the substrate 20 so as to package the heat-generating chip 10 into a housing space enclosed by the substrate 20, the inner bottom wall 305 of the heat dissipation cover 30, and the inner side wall 307 of the heat dissipation cover 30. Since the heat transfer medium 40 is interposed between the first surface 101 of the heat-generating chip 10 away from the substrate 20 and the first region 3051 of the inner bottom wall 305 of the heat dissipation cover 30, the heat generated by the heat-generating chip 10 can be rapidly conducted to the heat dissipation cover 30 via the heat transfer medium 40 and dissipated. For example, after the heat is conducted to the heat dissipation cover 30, it can be further conducted to a heat sink (e.g., a finned heat sink) in contact with the outer wall of the heat dissipation cover 30, and subsequently released to the external environment by the heat sink. Since the reinforcing structure 50 abuts against the second region 3053 of the inner bottom wall 305 of the heat dissipation cover 30 and the inner side wall 307 of the heat dissipation cover 30, and the second surface 501 of the reinforcing structure 50 facing the heat-generating chip 10 satisfies the target conditions, it is advantageous to form a triangular stabilizing structure (see Figures 1 and 2) or a triangular-like stabilizing structure (see Figures 3 and 4) within the housing space, thereby improving the rigidity of the heat dissipation cover 30 and, consequently, the entire chip package structure. 【0024】 For chip package structures applied to domain controllers, the packaging process often requires thermal reflow (e.g., thermal reflow reaching a temperature of 260°C), and a series of pressure tests (e.g., Burn In, Final Test, System Level Test, etc.) are frequently required after the packaging process is completed. Generally, the thermal expansion coefficients of the materials of the heat-generating chip 10 and the substrate 20 do not match, and if the rigidity of the chip package structure is insufficient, warping of the substrate 20 is likely to occur after thermal reflow. This can cause layer separation between the heat dissipation cover 30 and the heat transfer medium 40, affecting the efficiency of heat conduction and consequently reducing the heat dissipation performance of the chip package structure. Furthermore, in a pressure test, when pressure is applied to the heat dissipation cover 30 by a jig for conducting the pressure test, deformation occurs in both the heat dissipation cover 30 and the heat transfer medium 40. When the pressure is released, the deformation recovery capabilities of the heat dissipation cover 30 and the heat transfer medium 40 are mismatched, causing layer separation between the heat dissipation cover 30 and the heat transfer medium 40, which affects the efficiency of heat conduction and reduces the heat dissipation performance of the chip package structure. In the embodiment of this disclosure, the arrangement of the reinforcing structure 50 improves the rigidity of the heat dissipation cover 30 and, consequently, the entire chip package structure. Therefore, it is advantageous not only to reduce warping of the substrate 20 due to thermal reflow processing, but also to reduce the amount of deformation required for the recovery of the heat dissipation cover 30 and the heat transfer medium 40 after the pressure is released. This weakens the degree of layer separation between the heat dissipation cover 30 and the heat transfer medium 40, ensuring the efficiency of heat conduction and guaranteeing the heat dissipation performance of the chip package structure. 【0025】 In some selectable examples, the chip package structure is as shown in Figures 1 to 4. The system further includes an electronic element 60 mounted on the substrate 20, which forms a gap between it and the reinforcing structure 50. 【0026】 Selectively, the electronic components 60 may include, but are not limited to, resistors, capacitors, inductors, diodes, transistors, etc., and will not be listed individually here. The number of electronic components 60 may be two, three, four, or more, and will not be listed individually here. For the sake of understanding, the case of a single electronic component 60 will be described below. 【0027】 The electronic element 60 can be selectively mounted on the upper surface of the substrate 20 and fixed to the substrate 20. For example, the electronic element 60 can be fixed to the substrate 20 by welding. 【0028】 In the embodiments of this disclosure, a gap exists between the electronic element 60 mounted on the substrate 20 and the reinforcing structure 50. In other words, the electronic element 60 does not directly contact the reinforcing structure 50. This is to avoid any influence on the electronic element 60 from the reinforcing structure 50. Therefore, it is advantageous in ensuring the normal and reliable operation of the electronic element 60 and, consequently, the entire chip package structure. 【0029】 In some selectable examples, as shown in Figures 1 and 2, the second surface 501 is planar, and the inclination of this plane is advantageous in forming a gap between the electronic element 60 and the reinforcing structure 50, so as to conform to the structural parameters of the electronic element 60 and the layout of the electronic element 60 relative to the substrate 20. 【0030】 Selectively, the structural parameters of the electronic element 60 may include, but are not limited to, shape parameters and dimensional parameters of the electronic element 60. Shape parameters can indicate that the electronic element 60 is cylindrical, rectangular, sheet-like, etc., and these will not be listed individually here. If the shape parameters indicate that the electronic element 60 is cylindrical, the dimensional parameters may include diameter and height. If the shape parameters indicate that the electronic element 60 is rectangular, the dimensional parameters may include length, width, and height. 【0031】 Selectively, the layout of the electronic element 60 on the substrate 20 can be displayed, showing the placement position of the electronic element 60 on the substrate 20. For example, this placement position can be displayed using two-dimensional coordinates. 【0032】 Furthermore, if the second surface 501 is a plane, the structural parameters of the electronic element 60 are fixed, the layout of the electronic element 60 on the substrate 20 is fixed, and different inclinations are used for the second surface 501, then a difference in the size of the space between the second surface 501 and the electronic element 60 will occur. If the second surface 501 is a plane, the inclination of the second surface 501 is fixed, the structural parameters of the electronic element 60 are fixed, and the layout of the electronic element 60 on the substrate 20 is different (for example, if the electronic element 60 is moved horizontally to the left or right), then a difference in the size of the space between the second surface 501 and the electronic element 60 will occur. If the second surface 501 is a plane, the inclination of the second surface 501 is fixed, the layout of the electronic element 60 on the substrate 20 is fixed, and the structural parameters of the electronic element 60 are different (for example, if the height is doubled or halved), then a difference in the size of the space between the second surface 501 and the electronic element 60 will occur. 【0033】 As can be seen from the description in the previous paragraph, if the second surface 501 is a plane, the inclination of the second surface 501, the structural parameters of the electronic element 60, and the layout of the electronic element 60 relative to the substrate 20 can all affect the size of the space between the second surface 501 and the electronic element 60. In view of this, the inclination of the second surface 501 can be set to suit both the structural parameters of the electronic element 60 and the layout of the electronic element 60 relative to the substrate 20, so that the reinforcing structure 50 does not come into contact with the electronic element 60 and maintains a certain gap. Therefore, the reinforcing structure 50 can be effectively retracted from the electronic element 60, which is advantageous in ensuring the normal and reliable operation of the electronic element 60 and, consequently, the entire chip package structure. 【0034】 In some selectable examples, as shown in Figures 3 and 4, the second surface 501 is a curved surface, and the curvature of this curved surface is advantageous in forming a gap between the electronic element 60 and the reinforcing structure 50, so as to conform to the structural parameters of the electronic element 60 and the layout of the electronic element 60 on the substrate 20. 【0035】 The structural parameters of the electronic element 60 and its layout on the substrate 20 can be selectively described by referring to the related introductions above, and a detailed explanation is omitted here. 【0036】 Furthermore, if the second surface 501 is a curved surface, the structural parameters of the electronic element 60 are fixed, the layout of the electronic element 60 on the substrate 20 is fixed, and different curvatures are used for the second surface 501, then a difference in the size of the space between the second surface 501 and the electronic element 60 will occur. If the second surface 501 is a curved surface, the curvature of the second surface 501 is fixed, the structural parameters of the electronic element 60 are fixed, and the layout of the electronic element 60 on the substrate 20 is different (for example, if the electronic element 60 moves horizontally to the left or right), then a difference in the size of the space between the second surface 501 and the electronic element 60 will occur. If the second surface 501 is a curved surface, the curvature of the second surface 501 is fixed, the layout of the electronic element 60 on the substrate 20 is fixed, and the structural parameters of the electronic element 60 are different (for example, if the height is doubled or halved), then a difference in the size of the space between the second surface 501 and the electronic element 60 will occur. 【0037】 As can be seen from the description in the previous paragraph, if the second surface 501 is a curved surface, the curvature of the second surface 501, the structural parameters of the electronic element 60, and the layout of the electronic element 60 relative to the substrate 20 can all affect the size of the space between the second surface 501 and the electronic element 60. In view of this, the curvature of the second surface 501 can be set to suit both the structural parameters of the electronic element 60 and the layout of the electronic element 60 relative to the substrate 20, so that the reinforcing structure 50 does not come into contact with the electronic element 60 and maintains a certain gap. Therefore, the reinforcing structure 50 can be effectively retracted from the electronic element 60, which is advantageous in ensuring the normal and reliable operation of the electronic element 60 and, consequently, the entire chip package structure. 【0038】 In some selectable examples, as shown in Figure 7, the reinforcing structure 50 is a solid structure and is provided with a weight-reducing groove (lightweight slot) 505 whose opening is located on the second surface 501, the position of the weight-reducing groove 505 in the reinforcing structure 50 corresponds to the position of the electronic element 60 in the substrate 20, a part of the electronic element 60 fits into the weight-reducing groove 505, and a gap exists between the part that fits into the weight-reducing groove 505 and the inner wall of the weight-reducing groove 505. 【0039】 The fact that the placement position of the weight-reducing groove 505 in the reinforcing structure 50 corresponds to the placement position of the electronic element 60 on the substrate 20 can be understood as follows: When the placement position of the weight-reducing groove 505 in the reinforcing structure 50 is projected onto the upper surface of the substrate 20 to obtain the projected position, this projected position can be the same as or approximately the same as the placement position of the electronic element 60 on the substrate 20. 【0040】 In the embodiments of this disclosure, when the reinforcing structure 50 is a solid structure, the weight of the chip package structure can be reduced by designing the weight-reducing grooves 505, while ensuring the rigidity of the entire chip package structure. Furthermore, if a portion of the electronic element 60 fits into the weight-reducing grooves 505 and a gap exists between the portion that fits into the grooves 505 and the inner wall of the grooves 505, the electronic element 60 can be accommodated, while at the same time maintaining a certain gap between the reinforcing structure 50 and the electronic element 60. Therefore, by using the embodiments of this disclosure and utilizing the weight-reducing grooves 505 in multiple locations, the reinforcing structure 50 can be effectively retracted relative to the electronic element 60, which is advantageous in ensuring the normal and reliable operation of the electronic element 60 and, consequently, the entire chip package structure. 【0041】 In some selectable examples, as shown in Figures 1 to 4, there is a gap between the reinforcing structure 50 and the heat transfer medium 40, and a gap between the reinforcing structure 50 and the heating chip 10. 【0042】 The size of the gap between the reinforcing structure 50 and the heat transfer medium 40, and the size of the gap between the reinforcing structure 50 and the heat-generating chip 10 can be set according to actual needs, provided that the rigidity of the chip package structure is guaranteed, and this disclosure is not limited to this. 【0043】 In the embodiments of this disclosure, the reinforcing structure 50 does not come into direct contact with the heat transfer medium 40 and can maintain a certain gap. Similarly, the reinforcing structure 50 does not come into direct contact with the heat-generating chip 10 and can maintain a certain gap. This prevents the force acting on the reinforcing structure 50 from being transmitted to the heat transfer medium 40 and the heat-generating chip 10, which is advantageous in avoiding layer separation between the heat transfer medium 40 and the heat-generating chip 10 due to the applied force, thereby ensuring the heat dissipation performance of the chip package structure. 【0044】 In some selectable examples, the height of the projection of the reinforcing structure 50 onto the inner side wall 307 is less than or equal to the height of the inner side wall 307. 【0045】 Selectively, the heat dissipation cover 30 may include a heat soaking sheet 308 and a base 309, and the height of the inner side wall 307 can be understood as the height of the base 309 protruding from the heat soaking sheet 308. 【0046】 As shown in Figures 1 and 3, the projection height of the reinforcing structure 50 onto the inner side wall 307 can be equal to the height of the inner side wall 307. In this way, the reinforcing structure 50 is connected to the lower surface of the base 309, and the dimensions of the reinforcing structure 50 can be made as large as possible, which is considered advantageous in ensuring the rigidity of the chip package structure. 【0047】 As shown in Figures 2 and 4, the projection height of the reinforcing structure 50 onto the inner side wall 307 can be smaller than the height of the inner side wall 307. In this way, the reinforcing structure 50 is not connected to the lower surface of the base 309, and because the dimensions of the reinforcing structure 50 are relatively smaller compared to the situation shown in Figures 1 and 3, more space can be left between the reinforcing structure 50 and the substrate 20, which is considered advantageous for achieving retraction of the reinforcing structure 50 from the electronic elements 60. 【0048】 In some selectable examples, the number of reinforcing structures 50 is multiple, and the multiple reinforcing structures 50 are distributed symmetrically with respect to the first region 3051. 【0049】 If the reinforcing structure 50 is a solid structure, one or more reinforcing structures 50 can be distributed on the front, rear, left, and right sides of the first region 3051, as shown in Figure 8-1. If the reinforcing structure 50 is a hollow structure, one reinforcing structure 50 can be distributed on the front, rear, left, and right sides of the first region 3051, as shown in Figure 8-2. 【0050】 In the embodiments of this disclosure, the rigidity of the chip package structure can be effectively improved by the combined action of multiple reinforcing structures 50. Furthermore, the multiple reinforcing structures 50 can be distributed symmetrically with respect to the first region 3051, which is advantageous in ensuring uniformity of forces applied to the entire chip package structure. 【0051】 In some possible configurations, the heat dissipation cover 30 and the reinforcing structure 50 may be integrally molded. For example, the heat dissipation cover 30 and the reinforcing structure 50 can be integrally molded by machining. This simplifies the manufacturing process of the heat dissipation cover 30 and the reinforcing structure 50 and reduces processing costs. Of course, the heat dissipation cover 30 and the reinforcing structure 50 may be molded separately and then integrally fixed by welding or other means. 【0052】 In some selectable examples, the heat sink cover 30 can be manufactured from a copper-based material. For example, the heat sink cover 30 can be manufactured from red copper (i.e., pure copper) or brass (i.e., copper alloy) material. Since copper-based materials have good heat dissipation properties, a heat sink cover 30 manufactured using a copper-based material is advantageous in ensuring the heat dissipation performance of the chip package structure. 【0053】 In some selectable examples, the heat dissipation cover 30 can be a cover structure plated with an anti-oxidation layer. For example, the heat dissipation cover 30 can be a cover structure plated with a nickel layer. The thickness of the nickel layer can be 2 μm to 9 μm. For example, the thickness of the nickel layer can be 2 μm, 3 μm, 6 μm, 7 μm, 9 μm, etc., and these will not be listed here. The anti-oxidation layer can prevent oxidative corrosion of the heat dissipation cover 30, which is advantageous in improving the service life of the heat dissipation cover 30. 【0054】 In some selectable examples, at least two heat chips 10 can be located within the same housing space. For example, two, three, or more than three heat chips 10 may be housed within the same housing space. In this way, different heat chips 10 can share the same heat dissipation cover 30 and the same reinforcing structure 50, which is advantageous in saving materials and reducing manufacturing costs. Of course, only one heat chip 10 may be housed within the same housing space. 【0055】 In some selectable examples, the following process flow can be used to manufacture the chip package structure. 【0056】 (1) The heat chip 10 and the substrate 20 are interconnected by a flip-chip process. For example, in order to interconnect the heat chip 10 and the substrate 20, the microbump 102 provided on the lower end of the heat chip 10 can be welded to the substrate 20. 【0057】 (2) The interconnected heating chips 10 and substrate 20 are baked at 125°C for 1 to 2 hours, and then plasma cleaning is performed. 【0058】 (3) In the dispensing process, the underfill material is filled into the gap between the lower end of the heating chip 10 and the substrate 20, and then the underfill material is cured by baking at 125°C for 1 to 2 hours. 【0059】 (4) In the dispensing process, a heat transfer medium 40 is applied to the upper surface of the heating chip 10, and adhesive 70 is applied to the edge of the upper surface of the substrate 20. Then, the integrally molded heat dissipation cover 30 and reinforcing structure 50 are placed on the substrate 20 with the opening side of the heat dissipation cover 30 facing the substrate 20, and then baked at 150°C for 1 to 2 hours to cure the adhesive 70. 【0060】 Selectively, the heating chip 10 may have a length of 18 mm, a width of 16 mm, and a thickness of 0.775 mm. The substrate 20 may have a length and width of 37.5 mm and a thickness of 1.3175 mm. The heat transfer medium 40 may have a thickness of 100 μm. The heat uniforming sheet 308 provided on the heat dissipation cover 30 may have a thickness of 1 mm. The second surface 501 of the reinforcing structure 50 may be flat or curved. If the second surface 501 is flat as shown in Figures 1 and 2, the reinforcing structure 50 may also be called a triangular reinforcing structure. If the second surface 501 is curved as shown in Figures 3 and 4, the reinforcing structure 50 may also be called a rounded chamfered reinforcing structure. 【0061】 The inventors have found the following through finite element simulations: During a pressure test, when the test pressure is 876 N (Newtons), the pressure deformation of a standard heat-distributing sheet in the prior art can be seen by the curve 910 in Figure 9, and the pressure deformation of the heat-distributing sheet 308 provided on the heat-dissipating cover 30 in the embodiment of this disclosure can be seen by the curve 920 in Figure 9. The horizontal axis in Figure 9 indicates the position along the diagonal of the surface of the heat-distributing sheet, and the vertical axis in Figure 9 indicates the amount of pressure deformation. As can be seen from the observation in Figure 9, the maximum deformation of a standard heat-sensing sheet in related technologies is 70 μm, whereas the maximum deformation of the heat-sensing sheet 308 provided in the heat dissipation cover 30 in the embodiment of this disclosure is 43 μm. Clearly, the pressure resistance capacity of the heat-sensing sheet 308 has been improved by 38% compared to a standard heat-sensing sheet, which is advantageous in reducing the amount of deformation required for the heat-sensing sheet 308 and the heat transfer medium 40 to recover after the pressure is released, thereby mitigating the degree of layer separation between the heat-sensing sheet 308 and the heat transfer medium 40. 【0062】 The inventors further discovered through finite element simulations that, while the warpage of substrates in related technologies at 25°C and 260°C is 108 μm and 50 μm, respectively, the warpage of substrate 20 in the embodiments of this disclosure at 25°C and 260°C is 101 μm and 47 μm, respectively. Clearly, the warpage of substrate 20 is reduced by 6% compared to substrates in related technologies, which is advantageous in mitigating the degree of layer separation between the heat uniforming sheet 308 and the heat transfer medium 40. 【0063】 Based on the above, the embodiments of this disclosure can improve the rigidity of the chip package structure, solve the problem of layer separation between the heat dissipation cover 30 and the heat transfer medium 40, thereby improving the efficiency of heat conduction and ensuring the heat dissipation performance of the chip package structure. 【0064】 Embodiments of this disclosure further provide domain controllers including the chip package structure in any of the embodiments described above. Specific embodiments of the chip package structure can be found in the above introduction, and since the chip package structure provides the technical effects described above, domain controllers including the chip package structure also provide the corresponding technical effects, and a detailed explanation is omitted here. 【0065】 Furthermore, the various selectable embodiments and selectable models disclosed above can all be flexibly selected and combined as needed to achieve the corresponding functions and effects, and therefore, they are not listed individually in this disclosure. 【0066】 The basic principles of this disclosure have been explained above with reference to specific examples. However, the advantages, advantages, and effects mentioned in this disclosure are not limiting but merely illustrative, and should not be interpreted as essential to each example of this disclosure. Furthermore, the specific details disclosed above are not limiting but serve only as illustrative examples and to facilitate understanding, and do not imply that this disclosure must necessarily adopt and implement the specific details mentioned above. 【0067】 Each example in this specification is described in an incremental manner, with each example focusing on its differences from the others, and identical or similar parts of each example may be referenced to one another. 【0068】 A person skilled in the art can make various modifications and variations to the present disclosure without departing from the spirit and scope of the present application. In this way, if such modifications and variations of the present application fall within the scope of the claims of the present disclosure and the equivalent art, then the present disclosure also means that such modifications and variations are included.

Claims

[Claim 1] Heating chip (10) and A substrate (20) on which the heat-generating chip (10) is mounted, A heat dissipation cover (30) is attached to the substrate (20) such that the heat-generating chip (10) is located within a housing space enclosed by the substrate (20), the inner bottom wall (305) of the heat dissipation cover (30), and the inner side wall (307) of the heat dissipation cover (30), A heat transfer medium (40) is interposed between the first surface (101) of the heating chip (10) that is away from the substrate (20) and the first region (3051) of the inner bottom wall (305), The reinforcing structure (50) includes a second surface (501) facing the heating chip (10) that abuts against the inner bottom wall (305) and the inner side wall (307), and the second surface (501) facing the heating chip (10) is such that the distance to the second region (3053) is greater in parts closer to the inner side wall (307) and smaller in parts further away from the inner side wall (307), A chip package structure characterized by the following features. [Claim 2] The substrate (20) is mounted on an electronic element (60) which forms a gap between itself and the reinforcing structure (50), The chip package structure according to feature 1. [Claim 3] The second surface (501) is a plane, and the inclination of the plane is such that a gap is formed between the electronic element (60) and the reinforcing structure (50), so as to conform to the structural parameters of the electronic element (60) and the layout of the electronic element (60) on the substrate (20). The chip package structure according to feature 2. [Claim 4] The second surface (501) is a curved surface, and the curvature of the curved surface is made to conform to the structural parameters of the electronic element (60) and the layout of the electronic element (60) on the substrate (20) such that a gap is formed between the electronic element (60) and the reinforcing structure (50). The chip package structure according to feature 2. [Claim 5] The reinforcing structure (50) is a solid structure, and the reinforcing structure (50) is provided with a weight-reducing groove (505) whose opening is located on the second surface (501), the position of the weight-reducing groove (505) in the reinforcing structure (50) corresponds to the position of the electronic element (60) in the substrate (20), a part of the electronic element (60) fits into the weight-reducing groove (505), and a gap exists between the part that fits into the weight-reducing groove (505) and the inner wall of the weight-reducing groove (505). The chip package structure according to feature 2. [Claim 6] A gap exists between the reinforcing structure (50) and the heat transfer medium (40), and a gap exists between the reinforcing structure (50) and the heating chip (10), The chip package structure according to feature 1. [Claim 7] The height of the projection of the reinforcing structure (50) onto the inner side wall (307) is less than or equal to the height of the inner side wall (307). and / or, The number of the reinforcing structures (50) is multiple, and the multiple reinforcing structures (50) are distributed symmetrically with respect to the first region (3051). The chip package structure according to any one of claims 1 to 6. [Claim 8] The heat dissipation cover (30) and the reinforcing structure (50) are integrally molded. and / or, The heat dissipation cover (30) is made of a copper material, and / or, The heat dissipation cover (30) has a cover structure plated with an oxidation-preventive layer. The chip package structure according to any one of claims 1 to 6. [Claim 9] At least two of the heat-generating chips (10) are located within the same housing space. The chip package structure according to any one of claims 1 to 6. [Claim 10] It is a domain controller, A chip package structure comprising the chip package structure described in any one of claims 1 to 6, A domain controller characterized by the following features.

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