Radiation-curable or rapidly solidifying polysiloxane composition

Abstract

To provide a polysiloxane composition that rapidly solidifies or hardens upon exposure to radiation. [Solution] The radiation-rapid setting or curing polysiloxane composition comprises (A) an organopolysiloxane having two or more alkenyl groups, (B) an organohydrogenpolysiloxane having two or more SiH groups, (C) an organic crosslinking agent having two or more alkenyl groups, and (D) a photoactive catalyst, wherein the refractive index (N) of component (C) c ) is the refractive index (N) of the mixture of components (A) and (B). ab ) and the following relationship: |N c -N ab The present invention further provides a method for manufacturing a sealing material.

Description

[Technical Field]

[0001] The present invention relates to radiation-setting or curing polysiloxane compositions and related uses thereof. [Background technology]

[0002] Semiconductor encapsulating materials must possess resistance to high temperatures, and furthermore, resistance to both high temperatures and high humidity, and must maintain their appearance and optical properties in such environments. Since the optical properties of polysiloxanes remain largely unchanged even in high temperatures or high temperature and high humidity environments, their overall performance is superior to that of epoxy resins, and the industry is gradually shifting from the use of epoxy resins to the use of polysiloxanes as encapsulating materials.

[0003] Currently, widely used polysiloxane encapsulating materials are thermosetting. They require temperatures above 120°C for curing and take longer than two hours to cure. In the past, the dam and filling packaging technique (also known as dam and filler) has been used to prevent the encapsulating material from flowing onto the substrate and causing overflow during such a long baking process. This technique involves first applying a circle of high-viscosity dam material around the component to be packaged to form a barrier wall, and then filling the area enclosed by the barrier wall with a low-viscosity, fluid encapsulating material. However, under such high-temperature and long-duration thermosetting conditions, the substrate is susceptible to shrinkage, warping, or even damage, preventing it from proceeding to subsequent processes.

[0004] To simplify process steps and reduce material costs, the industry has developed packaging methods that replace the dam-and-fill process, involving filling or dispensing a sealing material into a mold, followed by leveling and curing. In this method, to achieve a leveling effect, after applying the sealing material, another substrate (referred to as the upper substrate, generally made of a light-transmitting material such as glass or acrylic) with a surface coated with a release layer (formed by a release agent) is applied to the sealing material. Then, after curing the sealing material, the upper substrate is removed (called lift-off) to obtain a flat sealing material. This method requires that the sealing material be cured rapidly enough to prevent it from flowing onto the substrate and causing overflow during the curing process, while also enabling better accuracy and flatness of film thickness and appearance. In contrast to other semiconductor components, light-emitting elements, such as LEDs (including inorganic LEDs, OLEDs, mini-LEDs, micro-LEDs, etc.), present further requirements for material encapsulation in terms of good flatness and light transmittance, making this method particularly suitable for encapsulating light-emitting elements. Therefore, the encapsulating material used for light-emitting elements such as LEDs should be able to withstand high temperatures or high temperature and high humidity environments, have good light transmittance, have good flatness (e.g., no irregularities on the surface), and be resistant to yellowing.

[0005] To achieve the rapid curing described above, radiation curing can be used. However, currently, most polysiloxane addition curing systems for radiation curing (e.g., UV curing) are of the delayed type. That is, after irradiation with UV light, the system remains in a fluid liquid or semi-solid state, requiring further thermal curing (called post-calcination) to solidify (i.e., become non-fluid) and cure the encapsulating material. If the encapsulating material is to be solidified or cured immediately after irradiation with UV light, a large amount of metal catalyst (e.g., platinum catalyst) must be added. However, in addition to increasing process costs, this makes the encapsulating material prone to yellowing at high temperatures, resulting in insufficient optical properties and failure to meet the product's characteristic requirements. [Overview of the project] [Problems that the invention aims to solve]

[0006] In response to the technical problems described above, there is a need in this industry to develop sealing materials that can be rapidly set or cured by radiation, possess good thermal stability, and have good optical properties. [Means for solving the problem]

[0007] The present invention (A) an organopolysiloxane having two or more alkenyl groups, (B) An organohydrogenpolysiloxane having two or more SiH groups, (C) An organic crosslinking agent having two or more alkenyl groups, (D) Photoactive catalyst and A radiation-induced rapid solidification or curing polysiloxane composition comprising: Refractive index (N) of component (C) c ) is the refractive index (N) of the mixture of components (A) and (B). ab ) and the following relationship: |N c -N ab |≦0.1 The present invention provides a radiation-induced rapid solidification or curing polysiloxane composition having the following properties.

[0008] The present invention also provides a two-component composition comprising a combination of component (I) and component (II), wherein component (I) comprises component (A), component (C), and component (D), and component (II) comprises component (B).

[0009] The present invention also provides a method for producing a sealing material, comprising the step of irradiating a composition with radiation (e.g., UV light) to rapidly set or cure the composition.

[0010] To further clarify and facilitate understanding the above-mentioned objectives, technical features, and advantages of the present invention, a detailed explanation is provided below, along with several specific examples. [Modes for carrying out the invention]

[0011] To facilitate understanding of the disclosures presented herein, several terms are defined below.

[0012] In this invention, the term "rapid setting or curing" is defined as a sealing material that can solidify (i.e., become non-flowing) or cure within 10 minutes.

[0013] The term "refractive index" refers to the ratio of the speed of light in a vacuum to its phase velocity after entering a medium. The refractive index of a vacuum is 1.

[0014] The term "transmittance" refers to the amount of light passing through a medium (e.g., polysiloxane resin) divided by the total amount of incident light.

[0015] The term "non-linear" refers to a branched, network-like, dendritic, star-shaped, cascading, or other non-linear configuration.

[0016] The term "alkyl group" typically refers to a saturated linear or branched hydrocarbon group having 1 to 20 carbon atoms (but not limited to), preferably 1 to 6 carbon atoms, more preferably 1 to 4 carbon atoms, and most preferably 1 to 3 carbon atoms. Examples include (but not limited to) methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl, neopentyl, and n-hexyl groups.

[0017] The term "aryl group" refers to, for example, a monocyclic, bicyclic, or tricyclic aromatic carbocyclic group having 6 to 20 ring carbon atoms. Examples include (but are not limited to) phenyl, indenyl, naphthyl, fluorenyl, anthracenyl, and phenanthryl groups. Unless otherwise specified, the "aryl group" in this invention may be substituted or unsubstituted. Examples of substituents include, but are not limited to, halogens, hydroxyl groups, and alkyl groups.

[0018] The term "heterocyclic group" refers to a saturated, partially saturated (named with prefixes such as dihydro, trihydro, tetrahydro, hexahydro, etc.), or unsaturated 3- to 14-membered, preferably 4- to 10-membered, more preferably 5 or 6-membered cyclic group, consisting of a carbon atom and at least one heteroatom selected from N, O, or S, preferably having 1 to 4 heteroatoms, more preferably 1 to 3 heteroatoms. The heterocyclic group may be a monocyclic, bicyclic, or tricyclic cyclic system including a fused ring (for example, a fused ring formed with another heterocyclic ring or another aromatic carbocyclic ring). Unless otherwise specified, in the present invention, the "heterocyclic group" may be substituted or unsubstituted. Examples of substituents include, but are not limited to, halogens, hydroxyl groups, oxo groups, alkyl groups, and hydroxyalkyl groups.

[0019] The term "nitrogen-containing heterocyclic group" refers to a 3- to 14-membered heterocyclic group, preferably a 4- to 10-membered nitrogen-containing heterocyclic group, and more preferably a 5 or 6-membered nitrogen-containing heterocyclic group, in which at least one ring carbon atom is substituted with a nitrogen atom. Examples include, but are not limited to, pyrrolyl, imidazolyl, pyrazolyl, pyrimidinyl, triazinyl, thiazolyl, pyridyl, indolyl, isoindolyl, benzimidazolyl, benzothiazolyl, quinolyl, and isoquinolyl groups. Unless otherwise specified, in the present invention, the "nitrogen-containing heterocyclic group" may be substituted or unsubstituted. Examples of substituents include, but are not limited to, halogens, hydroxyl groups, oxo groups, alkyl groups, and hydroxyalkyl groups.

[0020] The term "approximately" means a specific tolerance for a value determined by those skilled in the art, which depends in part on the method by which the value was measured or determined.

[0021] Each aspect and example of the present invention disclosed herein can be individually combined with all other aspects and examples of the present invention, encompassing all possible combinations.

[0022] The polysiloxane composition of the present invention contains the above-mentioned components (A) to (D), each of which is described below.

[0023] (A) Organopolysiloxane having two or more alkenyl groups

[0024] Component (A) has two or more alkenyl groups bonded to silicon, which is C 2~12 Alkenyl groups, for example, vinyl group, propenyl group, allyl group, butenyl group, pentenyl group, hexenyl group, heptenyl group, octenyl group, nonenyl group, decenyl group, undecenyl group, or dodecenyl group, preferably vinyl group, propenyl group, allyl group, more preferably vinyl group. In addition to alkenyl groups, component (A) further comprises other groups bonded to silicon, which are C 1~12 Alkyl alkyl group, C 3~6A cycloalkyl group, C 6~20 an aryl group, or C 7~20 an aralkyl group, for example, a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, an undecyl group, a dodecyl group, a phenyl group, a tolyl group, a xylyl group, a naphthyl group, a benzyl group, a phenylethyl group, or a phenylpropyl group, preferably, a methyl group, an ethyl group, a cyclohexyl group, a phenyl group, and a tolyl group, more preferably, a methyl group, a phenyl group, or a combination thereof may be. In some examples of the present invention, component (A) may have a small amount of a hydroxyl or alkoxy group bonded to silicon, for example, a methoxy or ethoxy group, within a range not interfering with the object of the present invention.

[0025] The molecular structure of component (A) is not particularly limited and may be a linear, branched, linear having a partially branched chain, cyclic, or three-dimensional network structure. Component (A) may be an organopolysiloxane having such a molecular structure, or a combination of two or more organopolysiloxanes having such a molecular structure.

[0026] The organopolysiloxane having two or more alkenyl groups of (A) in the present invention has a linear, branched, linear having a partially branched chain, cyclic, or three-dimensional network structure, and the following average compositional formula (I): R x SiO (4-x) / 2 (I) represented by In formula (I), x is a number from 0.8 to 3.0, for example, 0.8, 1, 1.2, 1.5, 1.8, 2, 2.5 or 3; each R may be the same or different and is independently a substituted or unsubstituted monovalent hydrocarbon group, which is C 2~12 an alkenyl group, C 1~12 an alkyl group, C 3~6 a cycloalkyl group, C 6~20 an aryl group, or C 7~20Aralkyl groups, such as vinyl group, propenyl group, allyl group, butenyl group, pentenyl group, hexenyl group, heptenyl group, octenyl group, nonenyl group, decenyl group, undecenyl group, dodecenyl group, methyl group, ethyl group, propyl group, isopropyl group, tert-butyl group, cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, phenyl group, tolyl group, xylyl group, naphthyl group, benzyl group, phenylethyl group, or phenylpropyl group, preferably methyl group, ethyl group, cyclohexyl group, phenyl group, and tolyl group. Preferably, R is an alkenyl group plus a methyl group, or a combination of methyl and phenyl groups. According to some embodiments of the present invention, when R is a combination of methyl and phenyl groups in addition to an alkenyl group, the molar ratio of methyl to phenyl groups can be about 9:1, about 8:2, about 7:3, about 6:4, about 5:5, about 4:6, about 3:7, about 2:8, or about 1:9, preferably about 2:3.

[0027] At least two R groups in each molecule of component (A) are alkenyl groups (e.g., 2, 3, 4, 5, 6, 7, 8, 9, 10 or more alkenyl groups). As described above, alkenyl groups are C 2~12 The alkenyl group may be an alkenyl group, preferably a vinyl group. According to some embodiments of the present invention, the alkenyl group in component (A) may be bonded to Si at the terminal end of the molecular chain or to Si on the side chain of the molecule. The alkenyl group content in component (A) is about 0.1 mol% to about 40 mol% (for example, about 0.1 mol%, about 0.5 mol%, about 1 mol%, about 5 mol%, about 10 mol%, about 15 mol%, about 20 mol%, about 25 mol%, about 30 mol%, about 35 mol%, or about 40 mol%), preferably about 0.5 mol% to about 20 mol%, based on the total amount of R groups.

[0028] According to some embodiments of the present invention, component (A) has a weight-average molecular weight of 100 to 100,000, preferably 200 to 50,000, more preferably 300 to 12,000, and even more preferably 1,000 to 10,000, for example, 100, 150, 200, 300, 500, 1,000, 2,000, 3,000, 4,000, 5,000, 6,000, 10,000, 12,000, 20,000, 50,000, or 100,000.

[0029] According to some embodiments of the present invention, the viscosity of component (A) at 25°C is preferably in the range of 1 mPa·s to 100,000 mPa·s, more preferably in the range of 100 mPa·s to 10,000 mPa·s, for example, 1, 10, 100, 1,000, 10,000, or 100,000 mPa·s.

[0030] According to some embodiments of the present invention, the amount of component (A) is 20% to 95% by mass, preferably 30% to 90% by mass, more preferably 50% to 85% by mass, based on the total mass of the solid components of the composition, for example, 25% by mass, 30% by mass, 40% by mass, 50% by mass, 55% by mass, 60% by mass, 65% by mass, 75% by mass, 80% by mass, 85% by mass, 90% by mass, or 95% by mass.

[0031] (A) The organopolysiloxane having two or more alkenyl groups of the present invention is SiO 4 / 2 Unit (also called Q unit) and / or RSiO 3 / 2 The unit (also called the T unit), and R3SiO 1 / 2 It may contain units (also called M units) and form branched organopolysiloxanes. Alternatively, (A) organopolysiloxanes having two or more alkenyl groups may be R2SiO 2 / 2 The unit (also called the D unit) and R3SiO 1 / 2 It may contain only units and form a linear organopolysiloxane (also called a linear organopolysiloxane). Alternatively, (A) an organopolysiloxane having two or more alkenyl groups is RSiO 3 / 2 Unit: R2SiO 2 / 2units, and R3SiO 1 / 2 It may form a linear organopolysiloxane having only units and having a branched chain (also called a partially branched linear organopolysiloxane).

[0032] The above organopolysiloxane having two or more alkenyl groups of (A) represented by the average composition formula (I) may contain one or more (for example, 1, 2, 3, 4, 5 or 6) organopolysiloxanes having two or more alkenyl groups of (A) in order to adjust and control the overall properties, and each of them may have the following average unit formula (II): (SiO 4 / 2 ) p (RSiO 3 / 2 ) q (R2SiO 2 / 2 ) r (R3SiO 1 / 2 ) s (II) In the formula (II), R is as described above, and p, q, r, and s satisfy 0 ≦ p < 1, 0 ≦ q < 1, 0 ≦ r < 1, and 0 < s < 1, provided that p + q + r > 0, and p + q + r + s = 1)

[0033] In some embodiments of the present invention, the above organopolysiloxane having two or more alkenyl groups of (A) can be represented by the following average unit formula: (ViMe2SiO 1 / 2 ) s (PhSiO 3 / 2 ) q (ViMe2SiO 1 / 2 ) s (MeSiO 3 / 2 ) q (ViMe2SiO 1 / 2 ) s (PrSiO 3 / 2 ) q (ViMe2SiO 1 / 2 ) s (ViSiO 3 / 2 ) q (ViMePhSiO1 / 2 ) s (PhSiO 3 / 2 ) q (ViMePhSiO 1 / 2 ) s (MeSiO 3 / 2 ) q (ViMePhSiO 1 / 2 ) s (PrSiO 3 / 2 ) q (ViMePhSiO 1 / 2 ) s (ViSiO) 3 / 2 ) q (ViMePhSiO 1 / 2 ) s’ (ViMe2SiO 1 / 2 ) s” (PhSiO 3 / 2 ) q (ViMe2SiO 1 / 2 ) s (Ph2SiO 2 / 2 ) r (PhSiO 3 / 2 ) q (ViMePhSiO 1 / 2 ) s (Ph2SiO 2 / 2 ) r (PhSiO 3 / 2 ) q (ViMe2SiO 1 / 2 ) s (MePhSiO 2 / 2 ) r (PhSiO 3 / 2 ) q (ViMePhSiO 1 / 2 ) s (MePhSiO 2 / 2 ) r (PhSiO 3 / 2 ) q (ViMePhSiO 1 / 2 ) s’ (ViMe2SiO 1 / 2 ) s” (Ph2SiO 2 / 2 )r (PhSiO 3 / 2 ) q (ViMe2SiO 1 / 2 ) s (SiO 4 / 2 ) p (PhSiO 3 / 2 ) q (ViMe2SiO 1 / 2 ) s (SiO 4 / 2 ) p In the above formulas, Me is a methyl group, Ph is a phenyl group, Pr is a propyl group, Vi is a vinyl group, p, q, r, and s are as described above, 0 < s’ < 1, 0 < s” < 1, and s’ + s” = s. Alternatively, the above individual organopolysiloxanes having two or more alkenyl groups can be represented by the following chemical formulas: ViMe2SiO(Ph2SiO) u SiMe2Vi ViMe2SiO(Me2SiO) v SiMe2Vi ViMe2SiO(Ph2SiO) u (Me2SiO) v SiMe2Vi ViMePhSiO(Ph2SiO) u SiMePhVi ViMe2SiO(MePhSiO) u SiMe2Vi ViMePhSiO(MePhSiO) v SiMePhVi ViMePhSiO(MePhSiO) v (Me2SiO) u SiMePhVi ViMe2SiO(ViMeSiO) u (Me2SiO) v SiMe2Vi Me3SiO(ViMeSiO) u SiMe3 ViMePhSiO(Ph2SiO) u (MePhSiO)v SiMePhVi ViMePhSiO(Ph2SiO) u (Me2SiO) v SiMePhVi In the above formula, Me is a methyl group, Ph is a phenyl group, Vi is a vinyl group, and u and v are each an integer from 1 to 200 (for example, 1, 2, 5, 10, 20, 50, 100, 120, 160, 180, or 200), preferably from 160 to 180.

[0034] The organopolysiloxane having two or more alkenyl groups (A) of the present invention is preferably in a liquid, solid, or viscous state at room temperature. When the organopolysiloxane is in a solid state, its viscosity can be adjusted and controlled by adding a solvent to facilitate handling. The solvent may be toluene, hexane, cyclohexane, etc.

[0035] (B) Organohydrogenpolysiloxane having two or more SiH groups

[0036] The molecular structure of component (B) is not particularly limited and may be linear, branched, partially branched linear, cyclic, or a three-dimensional network structure, preferably linear, branched, or partially branched linear. The position of the hydrogen atoms bonded to silicon in component (B) is not limited and may be located at the ends or side chains of the molecular chain, or in branched chains. In addition to hydrogen atoms, component (B) also contains organic groups bonded to silicon, including but not limited to alkyl groups, aryl groups, and aralkyl groups.

[0037] The polysiloxane composition of the present invention may contain one or more (e.g., 1, 2, 3, 4, 5, or 6) (B)organohydrogenpolysiloxanes having two or more SiH groups, each of which may have the following average unit formula (III): (SiO 4 / 2 ) a (R x SiO 3 / 2 ) b (Rx 2SiO 2 / 2 ) c (R x 3SiO 1 / 2 ) d (III) In the formula, each R x may be the same or different and each independently can be H or a monovalent hydrocarbon group having no aliphatic unsaturated carbon bond. The monovalent hydrocarbon group includes, for example, C 2~12 alkyl groups such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, or dodecyl group; C 3~6 cycloalkyl groups such as cyclohexyl group or cyclopentyl group; C 6~20 aryl groups such as phenyl group, tolyl group, xylyl group, or naphthyl group; C 7~20 aralkyl groups such as benzyl group, phenylethyl group, or phenylpropyl group; and groups in which some or all of the hydrogen atoms in these groups are substituted with halogen atoms such as fluorine, chlorine, bromine or iodine, but are not limited thereto. Preferably, R x is, in addition to H, a methyl group or a combination of methyl and phenyl groups. When R x is a combination of methyl and phenyl groups in addition to H, the molar ratio of the methyl group to the phenyl group can be about 9:1, about 8:2, about 7:3, about 6:4, about 5:5, about 4:6, about 3:7, about 2:8, or about 1:9. In formula (III), a, b, c, and d satisfy 0 ≦ a < 1, 0 ≦ b < 1, 0 ≦ c < 1, and 0 < d < 1, provided that a + b + c > 0 and a + b + c + d = 1.

[0038] A

[0039] Component (B) may also be represented as a whole by the above average unit formula (III). According to some embodiments of the present invention, at least two R xHowever, it is H (for example, 2, 3, 4, 5, 6, 7, 8, 9, 10, or more H).

[0040] According to some embodiments of the present invention, component (B) has a weight-average molecular weight of 100 to 100,000, preferably 200 to 50,000, more preferably 300 to 12,000, and even more preferably 1,000 to 10,000, for example, 100, 150, 200, 300, 500, 1,000, 2,000, 3,000, 4,000, 5,000, 6,000, 10,000, 12,000, 20,000, 50,000, or 100,000.

[0041] According to some embodiments of the present invention, the amount of component (B) is 1% to 70% by mass, preferably 10% to 60% by mass, more preferably 15% to 40% by mass, based on the total mass of the solid components of the composition, for example, 1% by mass, 5% by mass, 10% by mass, 15% by mass, 20% by mass, 30% by mass, 40% by mass, 50% by mass, 60% by mass, or 70% by mass.

[0042] The viscosity of component (B) at 25°C is not limited, but is preferably in the range of 1 mPa·s to 100,000 mPa·s, more preferably in the range of 2 mPa·s to 10,000 mPa·s, for example, 1, 2, 10, 100, 1,000, 10,000, or 100,000 mPa·s.

[0043] The organohydrogenpolysiloxane having two or more SiH groups (B) of the present invention is preferably in a liquid, solid, or viscous state at room temperature. If the organopolysiloxane is in a solid state, its viscosity can be adjusted and controlled by adding a solvent to facilitate handling. The solvent may be toluene, hexane, cyclohexane, etc.

[0044] In some embodiments of the present invention, each of the above-mentioned (B)organohydrogenpolysiloxanes having two or more SiH groups can be represented by the following average unit formula: (HMe2SiO 1 / 2) d (PhSiO 3 / 2 ) b (HMePhSiO 1 / 2 ) d (PhSiO 3 / 2 ) b (HMePhSiO 1 / 2 ) d’ (HMe2SiO 1 / 2 ) d” (PhSiO 3 / 2 ) b (HMe2SiO 1 / 2 ) d (Ph2SiO 2 / 2 ) c (PhSiO 3 / 2 ) b (HMePhSiO 1 / 2 ) d (Ph2SiO 2 / 2 ) c (PhSiO 3 / 2 ) b (HMe2SiO 1 / 2 ) d (MePhSiO 2 / 2 ) c (PhSiO 3 / 2 ) b (HMePhSiO 1 / 2 ) d (MePhSiO 2 / 2 ) c (PhSiO 3 / 2 ) b (HMePhSiO 1 / 2 ) d’ (HMe2SiO 1 / 2 ) d” (Ph2SiO 2 / 2 ) c (PhSiO 3 / 2 ) b (HMe2SiO 1 / 2 ) d (Not 4 / 2 ) a In the above formula, a, b, c, and d are as described above, 0 < d’ < 1, 0 < d” < 1, and d’ + d” = d. Alternatively, the above organohydrogenpolysiloxane having two or more SiH groups can be represented by the following chemical formula: HMe2SiO(Ph2SiO) m SiMe2H HMe2SiO(Me2SiO) n SiMe2H HMe2SiO(Ph2SiO) m (Me2SiO) n SiMe2H HMePhSiO(Ph2SiO) m SiMePhH HMe2SiO(MePhSiO) m SiMe2H HMePhSiO(MePhSiO) n SiMePhH HMePhSiO(MePhSiO) n (Me2SiO) m SiMePhH HMe2SiO(HMeSiO) m (Me2SiO) n SiMe2H Me3SiO(HMeSiO) m SiMe3 HMePhSiO(Ph2SiO) m (MePhSiO) n SiMePhH HMePhSiO(Ph2SiO) m (Me2SiO) n SiMePhH In the above formula, m and n are each independently an integer of 1 to 200 (for example, 1, 2, 5, 10, 20, 50, 100, 120, 160, 180, or 200), preferably an integer of 160 to 180.

[0045] (C) Organic crosslinking agent having two or more alkenyl groups

[0046] (A) an organopolysiloxane having two or more alkenyl groups of the present invention can undergo hydrosilylation with (B) an organohydrogenpolysiloxane having two or more SiH groups, where the alkenyl groups are converted to alkyl groups and bonded to the silicon atoms of the SiH groups, and the hydrogen atoms of the SiH groups are removed. To promote crosslinking of the polysiloxane and achieve rapid solidification or curing, the polysiloxane composition of the present invention further comprises (C) an organic crosslinking agent having two or more alkenyl groups.

[0047] The inventors of this invention have determined the refractive index (N) of component (C). c ) is the refractive index (N) of the mixture of components (A) and (B). ab ) and the following relationship: |N c -N ab It should have |≦0.1, that is, N c and N ab It has been found that the absolute value of the difference between ≤0.1, preferably ≤0.08, more preferably ≤0.05, most preferably ≤0.02, for example, ≤0.1, ≤0.09, ≤0.08, ≤0.07, ≤0.06, ≤0.05, ≤0.04, ≤0.03, ≤0.02, or ≤0.01. For example, the refractive index (N) of a mixture of components (A) and (B) ab If the refractive index (N) of component (C) is 1.54, c The refractive index (N) of component (C) should be between 1.44 and 1.64. c ) is the refractive index (N) of the mixture of components (A) and (B). ab When the above relationship is met, they can be mixed uniformly without causing layering, emulsification, or clouding. When applied to a radiation curing system (e.g., UV curing), the curing efficiency is greatly improved, and the surface can dry and become non-stick in a relatively short time after radiation irradiation, achieving a rapid solidification effect. For example, N c and N ab If the absolute value of the difference between them is ≤0.1, then setting or curing may be achieved more rapidly after radiation irradiation. Conversely, N c and N abIf the absolute value of the difference between the two is >0.1, insufficient crosslinking may occur after irradiation, and rapid solidification or hardening may not be achieved. In addition, the addition of component (C) helps in the formation of a network structure after hardening, increases the hardness of the hardened product, and further improves its physical properties. The inventors of the present invention have found that, like component (A), component (C) has an alkenyl group and can undergo a hydrosilylation reaction with a SiH group, and here, (C) an organic crosslinking agent having two or more alkenyl groups has the properties of a small molecule structure and a relatively high proportion of alkenyl groups, which can increase the likelihood of the reaction occurring, thereby increasing the reaction rate of UV curing and lowering the UV curing reaction temperature.

[0048] The (C) organic crosslinking agent having two or more alkenyl groups of the present invention has two or more alkenyl groups, for example, 2, 3, 4, 5, 6, or 8 alkenyl groups. The (C) organic crosslinking agent having two or more alkenyl groups of the present invention has a core structure, and the core structure is modified by two or more alkenyl groups.

[0049] According to some embodiments of the present invention, the above core structure can be a polyvalent organic structure based on a hydrocarbon group or a heterocyclic group, and the above hydrocarbon group may optionally contain one or more oxygen atoms. The valency of the core structure corresponds to the number of alkenyl groups modifying the core structure described above. Preferably, the above core structure can be a divalent organic structure, a trivalent organic structure, or a tetravalent organic structure. In the present invention, a polyvalent heterocyclic group, taking a divalent heterocyclic group as an example, refers to the group of atoms remaining after removing two hydrogen atoms directly bonded to a carbon atom or heteroatom of the heterocyclic ring.

[0050] According to some embodiments of the present invention, the above alkenyl groups can be bonded to the core structure via linking groups. The linking groups include single bonds, -O-, -S-, -C(O)-, -C(O)O-, and -OR 1 -, -SR 1 -, -C(O)R 1 -, or -C(O)OR 1 - may be, and in these formulas, R 1C 1~6 Alkylene group or C 1~6 Alkylene oxy group, preferably C 1~4 Alkylene group or C 1~4 Alkylene oxy group, more preferably C 1~2 Alkylene group or C 1~2 The group is an alkylene oxy group; preferred linking groups are -O-, -C(O)-, -C(O)O-, or -OR 1 -This may also be the case. The aforementioned linking group can bond to the core structure in any direction. Taking -C(O)O- as an example, the direction in which the linking group bonds to the core structure can be represented by * as follows: -C(O)O-* or *-C(O)O-.

[0051] The above embodiment of the alkenyl group is C 2~6 Alkenyl group or C 3~8 The cycloalkenyl group may be, for example, a vinyl group, a propenyl group (for example, an allyl group, a 1-propenyl group, or an isopropenyl group), a butenyl group, a pentenyl group, a hexenyl group, or a cyclohexenyl group, preferably a vinyl group or a propenyl group, more preferably an allyl group or an isopropenyl group.

[0052] According to some embodiments of the present invention, (C) an organic crosslinking agent having two or more alkenyl groups is given by the following formula: B-(LP) W (In the formula, B functions as a core structure and is a polyvalent organic group having a valency w; L is a linking group as already described herein; P is an alkenyl group as already described herein; w is an integer selected from 2 to 8, for example, 2, 3, 4, 5, 6, 7, or 8, preferably an integer from 2 to 6, more preferably an integer from 2 to 4. It may have.

[0053] According to some embodiments of the present invention, B may be a polyvalent hydrocarbon group or a heterocyclic group; the hydrocarbon group may optionally contain one or more oxygen atoms; the heterocyclic group may optionally be substituted with one to three groups selected from halogens, hydroxyl groups, oxo groups, alkyl groups, and hydroxyalkyl groups. According to some embodiments of the present invention, the above polyvalent hydrocarbon group may be a polyvalent aliphatic hydrocarbon group (e.g., C 1~20 Aliphatic hydrocarbon group) or aromatic hydrocarbon group (e.g., C 6~20 The above polyvalent heterocyclic groups may be aromatic hydrocarbon groups; for example, they may be 3- to 14-membered heterocyclic groups including, but not limited to, pyrrolyl, imidazolyl, pyrazolyl, pyrimidinyl, triazinyl, thiazolyl, pyridyl, indolyl, isoindolyl, benzimidazolyl, benzothiazolyl, quinolyl, or isoquinolyl groups. According to some embodiments of the present invention, B may be an alkyl group, an alkoxy group, a phenyl group, a biphenyl group, a segment derived from a polyol (e.g., polyethylene glycol or polypropylene glycol), or optionally, a 3- to 14-membered heterocyclic group substituted with 1 to 3 groups selected from halogen groups, hydroxyl groups, oxo groups, alkyl groups, and hydroxyalkyl groups.

[0054] In some embodiments, examples of polyvalent organic group B include, but are not limited to, the following: divalent organic group -CH2-, -CH2-CH2-, -CH2-CH2-CH2-, -CH2-CH2-CH2-CH2-, -CH2-CH2-CH2-CH2-CH2-, -CH2-CH2-CH2-CH2-CH2-CH2-, -CH2-CH(CH3)-, -CH2-C(CH3)-[O-CH2-CH(CH3)] k -, -CH2-CH2-[O-CH2-CH2] k -, [ka] (wherein k is an integer from 1 to 10, each R2 may be the same or different, and each is independently H, a C1-C4 alkyl group, a C1-C4 perfluoroalkyl group, a C1-C4 alkoxy group, or a halogen, R3 is a covalent bond, -O-, -S-, -CH2-, -S(O)2-, -C(CF3)2-, or -C(CH3)2-, and each y is independently an integer from 0 to 4); trivalent covalent group [ka] , or a trivalent heterocyclic group selected from pyrimidinyl, triazinyl, pyridyl, and isoindolyl groups (the trivalent heterocyclic groups described herein may optionally be substituted with 1 to 3 groups selected from oxo, alkyl, and hydroxyalkyl groups); tetravalent organic group [ka] (wherein each R2 may be the same or different, and each is independently H, a C1-C4 alkyl group, a C1-C4 perfluoroalkyl group, a C1-C4 alkoxy group, or a halogen; R3 is a covalent bond, -O-, -S-, -CH2-, -S(O)2-, -C(CF3)2-, or -C(CH3)2-, and each y is independently an integer from 0 to 4); and Hexavalent organic group [ka]

[0055] The following are exemplary -linking-alkenyl (i.e., -LP) structures according to some embodiments of the present invention: [ka] (In the formula, * indicates the direction of bonding to the core structure). (C)Specific examples of organic crosslinking agents having two or more alkenyl groups include triallyl isocyanurate (TAIC), tris(2-hydroxyethyl) isocyanurate triacrylate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, tetraallyl pyromelitate, 1,6-hexanediol diacrylate, ethylene glycol dimethacrylate, tri(propylene glycol) diacrylate, ethoxylated bisphenol A diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythritol hexaacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, di(trimethylolpropane) tetraacrylate, or combinations thereof (but not limited to these).

[0056] According to some embodiments of the present invention, (C) an organic crosslinking agent having two or more alkenyl groups does not contain an alkynyl group, or (C) an organic crosslinking agent having two or more alkenyl groups does not contain a silicon atom (i.e., does not contain a silicon-containing group, such as a siloxane or SiH group). According to a preferred embodiment of the present invention, (C) an organic crosslinking agent having two or more alkenyl groups does not contain either an alkynyl group or a silicon atom. Alkynyl groups can undergo hydrosilylation reactions with SiH groups, but these can reduce the reaction rate.

[0057] According to some embodiments of the present invention, component (C) has a weight-average molecular weight of 100 to 1,500, preferably 100 to 1,000, more preferably 200 to 500, for example, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1,000, 1,200, or 1,500. According to some embodiments of the present invention, component (C) has a weight-average molecular weight smaller than that of component (A).

[0058] According to some embodiments of the present invention, the amount of component (C) is 0.05% to 10% by mass, preferably 0.1% to 5% by mass, more preferably 0.2% to 3% by mass, relative to the total mass of the solid components of the composition, for example, 0.05%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.2%, 1.5%, 1.8%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, or 10% by mass. If the amount of component (C) is too small, the effect of rapid curing cannot be achieved, and a longer irradiation time (e.g., UV) may be required to completely cure the resin. If the amount of component (C) is too high, the light transmittance may decrease, and the high-temperature stability of the resin may be affected (i.e., the light transmittance decreases after high-temperature testing).

[0059] The amounts of components (A), (B), and (C) in the present invention should be determined considering the total number of moles of alkenyl groups contained in components (A) and (C), and the total number of moles of SiH groups contained in component (B). The ratio of the total number of moles of alkenyl groups to the total number of moles of SiH groups should be in the range of 0.1 to 4, preferably 0.5 to 3, more preferably 0.7 to 1, for example, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 2, 2.5, 3, 3.5, or 4. Unreacted alkenyl groups or SiH groups can adversely affect the long-term stability of the resin. Therefore, in some preferred embodiments of the present invention, the ratio of the total number of moles of alkenyl groups to the total number of moles of SiH groups is preferably close to 0.7 to 1.

[0060] Components (A) and (B) of the present invention both have a polysiloxane structure, are highly compatible with each other, and have a refractive index of approximately 1.35 to 1.65, which is R and R x It varies depending on the type. R and R of components (A) and (B) xWhen R and R of components (A) and (B) are mainly or exclusively alkyl groups (e.g., methyl), the refractive index is between approximately 1.40 and 1.50 (lower refractive index). x mainly or exclusively, unsubstituted or one or more C 1~3 When a phenyl group is substituted with an alkyl group (e.g., phenyl), the refractive index is always between approximately 1.45 and 1.60 (higher refractive index).

[0061] (D) light activated catalyst

[0062] The (D) photoactive catalyst of the present invention is a catalyst that can be activated under light irradiation at 200-500 nm and can catalyze hydrosilylation reactions. Preferably, it is a catalyst of a metal element, its salt or complex, more preferably a catalyst of a Group VIIIB transition metal element (such as nickel, palladium, platinum, and rhodium), its salt or complex, and most preferably a catalyst of a platinum element, its salt or complex. The (D) photoactive catalyst of the present invention may be a pure catalyst material or a catalyst material deposited on a support (e.g., silica or carbon black). In some preferred embodiments, the (D) photoactive catalyst of the present invention is soluble or dispersible in the organic phase and readily mixes with other components.

[0063] Photoactivation means that when a catalyst absorbs photons with a band gap energy greater than or equal to its own, it changes from its ground state to an excited state, forming a highly reactive species that then undergoes redox reactions with other substances. Therefore, photoactivated catalysts are activated during radiation hardening processes and exert their catalytic effect.

[0064] According to some embodiments of the present invention, (D) the type of photoactive catalyst includes platinum complexes of cyclopentadiene, cyclooctadiene, norbornadiene, or β-diketone. Specific types can be listed below (but are not limited to these): (cyclopentadienyl)dimethyl platinum complex, (cyclopentadienyl)trimethyl platinum complex, (methylcyclopentadienyl)trimethyl platinum complex, (cyclopentadienyl)ethyldimethyl platinum complex, (cyclopentadienyl)acetyldimethyl platinum complex, (methylcyclopentadienyl)diethyl platinum complex, (methylcyclopentadienyl)trihexyl platinum complex, (trimethylsilylcyclopentadienyl)diphenyl platinum complex, (trimethylsilyl Cyclopentadienyl)trimethylplatinum complex, (dimethylphenylsilylcyclopentadienyl)triphenylplatinum complex, (cyclopentadienyl)dimethyltrimethylsilylmethylplatinum complex, (1,5-cyclooctadiene)dimethylplatinum complex, (1,5-cyclooctadiene)diphenylplatinum complex, (1,5-cyclooctadiene)dipropylplatinum complex, (methylcycloocta-1,5-dienyl)diethylplatinum complex, (2,5-norbornadiene)dimethylplatinum complex, (2,5-norbornadiene)diphenylplatinum complex, and mixtures thereof.

[0065] According to some embodiments of the present invention, the amount of the photoactive catalyst (D) of the present invention is 1 ppm to 50 ppm, preferably 5 ppm to 25 ppm, more preferably 8 ppm to 15 ppm, based on the total mass of the solid components of the composition, for example, 1 ppm, 2 ppm, 3 ppm, 4 ppm, 5 ppm, 6 ppm, 7 ppm, 8 ppm, 9 ppm, 10 ppm, 12 ppm, 15 ppm, 18 ppm, 20 ppm, 30 ppm, 40 ppm, or 50 ppm. It is expected that the reaction rate will be faster as the amount of catalyst used increases. However, excessive catalyst addition leads to increased costs, degrades the transmittance of the polysiloxane resin (e.g., <90%), and increases the yellowing coefficient. The polysiloxane composition of the present invention can achieve a rapid solidification or curing effect using a smaller amount of catalyst. Therefore, compared to the prior art, the polysiloxane composition of the present invention has cost advantages and can provide good optical properties to the polysiloxane resin.

[0066] Polysiloxane resin

[0067] The components involved in the hydrosilylation reaction of the present invention are (A) an organopolysiloxane having two or more alkenyl groups, (B) an organohydrogenpolysiloxane having two or more SiH groups, (C) an organic crosslinking agent having two or more alkenyl groups, and (D) a photoactive catalyst, where (D) the photoactive catalyst is activated under radiation irradiation and catalyzes the hydrosilylation reaction to form a polysiloxane resin. The above radiation curing is a process that converts a composition from a liquid or flowable state to a solid state by irradiation energy. Examples of radiation include electron beams and UV light.

[0068] In the case of UV curing, UV light can be divided into near-ultraviolet (UVA), far-ultraviolet (UVB), and very short-wave ultraviolet (UVC) according to its wavelength, and the radiation dose is generally 1,000 to 10,000 mJ / cm². 2 Preferably 1,500 to 5,000 mJ / cm² 2 A range, for example, 1,000 mJ / cm²2 , 1,500 mJ / cm 2 2,000 mJ / cm² 2 3,000 mJ / cm² 2 4,000 mJ / cm² 2 5,000 mJ / cm² 2 6,000 mJ / cm² 2 7,000 mJ / cm² 2 8,000 mJ / cm² 2 9,000 mJ / cm² 2 , or 10,000 mJ / cm² 2 Therefore, in order to achieve rapid solidification or curing, the UV light irradiation time should be within 10 minutes, for example, 0.5 minutes, 1 minute, 1.5 minutes, 2 minutes, 3 minutes, 3.5 minutes, 4 minutes, 5 minutes, 6 minutes, 7 minutes, 8 minutes, 9 minutes, or 10 minutes. According to some embodiments of the present invention, 2,000 mJ / cm² 2 A near-ultraviolet (UVA) light source with the following irradiation intensity is used in this invention.

[0069] After irradiation is complete, the catalyst in the polysiloxane resin still retains catalytic activity, so the hydrosilylation reaction can be carried out continuously to further cure the resin. If necessary, post-baking may also be applied to further cure the resin, but the post-baking conditions, such as temperature and time, should not cause shrinkage or warping of the substrate. Since the polysiloxane resin of the present invention can solidify or cure rapidly under irradiation, it has good processability during subsequent operations (e.g., transfer of the sample into an oven) and can reduce or avoid resin overflow.

[0070] According to the present invention, although the irradiation process may raise the temperature of the composition, the temperature of the composition remains lower than that of a composition undergoing a reaction by thermosetting or a composition undergoing irradiation first and then thermosetting. Generally, to achieve effective curing, the temperature of the thermosetting reaction should reach a temperature higher than 120°C, and the curing time should reach a time longer than 2 hours. In the case of a composition undergoing irradiation first and then thermosetting, the temperature of the thermosetting reaction should reach a temperature higher than 80°C, and the curing time should reach a time longer than 0.5 hours. However, as described above, high temperature and long curing times readily cause shrinkage, warping, or even damage to the substrate, and therefore this does not meet the requirements of the product and process of the present invention. In contrast, the temperature achieved by radiation curing in the present invention does not exceed 80°C, and the curing time is shorter.

[0071] The polysiloxane resin formed after curing the composition of the present invention can be used, but is not limited to, for packaging light-emitting elements, such as LEDs. The polysiloxane resin of the present invention has properties such as good flatness, good light transmission, resistance to yellowing, and high-temperature stability. In some embodiments of the present invention, the polysiloxane resin of the present invention has a light transmittance of at least 90%, at least 92%, at least 95%, or at least 98%, and still has a light transmittance of at least 90%, at least 92%, at least 95%, or at least 98% after a high-temperature test (e.g., baking at 150°C for 24 hours). In some embodiments of the present invention, the polysiloxane resin of the present invention has a low yellowing index, for example, less than 5, less than 4, less than 3, or less than 2. In some embodiments of the present invention, the polysiloxane resin of the present invention has a low average surface roughness, for example, an average surface roughness of up to 0.05 μm, up to 0.04 μm, up to 0.03 μm, or up to 0.02 μm. The composition of the present invention can achieve good flatness by the leveling and hardening packaging method described above.

[0072] The present invention also provides a two-component composition comprising a combination of component (I) and component (II), wherein component (I) comprises component (A), component (C), and component (D), and component (II) comprises component (B). By storing component (B) separately, the alkenyl group and SiH group do not come into contact, and thus accidental reactions are avoided. The polysiloxane resin can be prepared by mixing component (I) and component (II).

[0073] According to some embodiments of the present invention, the composition may include other optional materials known in formulation technology, such as antioxidants, hindered amine light stabilizers, UV light absorbers and stabilizers, surfactants, flow control agents, thixotropic agents, fillers, organic solvents, antifungal agents, and other conventional additives. [Examples]

[0074] The following examples are intended to further illustrate the present invention and are not intended to limit its scope. Any modifications and changes readily achievable by those skilled in the art are included within the scope of this disclosure and the appended claims.

[0075] Table 1 shows a description of the components used in each of the examples and comparative examples: [Table 1]

[0076] According to the compositions and amounts shown in Table 2 below, components (A) to (D) were added to a 5-liter reactor and stirred at room temperature for 1 hour to prepare the compositions of Examples 1 to 8 and Comparative Examples 1 to 4. The compositions of the Examples and Comparative Examples of the present invention were coated onto a glass substrate and irradiated with UV light for different durations to obtain cured products (polysiloxane resins). Subsequently, the physical properties of the polysiloxane compositions and polysiloxane resins, including refractive index, light transmittance, and thermal stability, were measured by the following test methods.

[0077] 1. Refractive index The refractive index of a sample (e.g., a homogeneous mixture of components (A) and (B), or individual component (C)) was measured at 25°C using an Abbe refractometer manufactured by ATAGO Company, with visible light of 589 nm wavelength as the light source for measurement.

[0078] 2. UV curing state This composition contains 2,000 mJ / cm 2 The composition was irradiated with light using a UVA light source at a specific energy. The time required for the composition to react until it solidified or hardened was recorded, and it was observed whether or not the colloidal surface exhibited tackiness.

[0079] 3. Light transmittance and light transmittance after high-temperature testing After radiation hardening, the initial light transmittance was tested using a HunterLab spectrophotometer. The sample was then aged in a 150°C oven for 24 hours, and the light transmittance was tested again to observe the change in transmittance at a wavelength of 450 nm.

[0080] Tables 2 and 3 list the amounts of components used in the preparation of the above examples and comparative examples, the reaction conditions, and the test results:

[0081] [Table 2]

[0082] [Table 3]

[0083] From Table 2, in Examples 1 to 8, |N c -N ab It was found that |≦0.1. These compositions achieve a solidified or cured state with UV light irradiation within 10 minutes (a total of only 4 minutes of UV light irradiation is required). |N c -N abIt was also observed that the smaller |, the shorter the UV light irradiation time required for solidification or curing. In addition, Examples 1 to 8 showed good optical properties and thermal stability. In contrast, Table 3 shows that the composition of Comparative Example 1 did not contain component (C), and |N c -N ab The condition |≦0.1 was not met, indicating insufficient crosslinking. Even after UV light irradiation for longer than 10 minutes, the composition had not yet solidified. The composition of Comparative Example 2 also did not contain component (C), but the amount of component (D) was increased to three times the normal amount (i.e., 30 ppm). After UV light irradiation for longer than 10 minutes, the composition solidified or cured, but in this comparative example, an excessive amount of platinum catalyst was added, resulting in increased costs and insufficient thermal stability (light transmittance decreased to <90% after high-temperature testing, and yellowing occurred). The composition of Comparative Example 3 contained component (C), but |N c -N ab |>0.1. Even after UV light irradiation for longer than 10 minutes, the composition had not yet solidified, and its optical properties were insufficient. In addition, |N c -N ab Under the condition |≦0.1, the amount of component (C) could be further adjusted to avoid affecting the optical properties. Comparative Example 4 showed that an excess of component (C) can lead to a decrease in light transmittance and insufficient thermal stability.

[0084] Therefore, |N c -N ab The compositions of the present invention that satisfy the condition |≦0.1 can achieve the effect of rapid solidification or hardening, and the resulting product has good optical properties and thermal stability. In some preferred embodiments, the amount of component (C) can be further adjusted and controlled so that the resulting product has good optical properties and thermal stability.

Claims

1. (A) an organopolysiloxane having two or more alkenyl groups, (B) An organohydrogenpolysiloxane having two or more SiH groups, (C) An organic crosslinking agent having two or more alkenyl groups, (D) Photoactive catalyst and A polysiloxane composition that rapidly solidifies or hardens upon exposure to radiation, comprising: The refractive index (N) of component (C) ｃ ) is the refractive index (N) of the mixture of components (A) and (B). ａｂ ) and the following relationship: |N ｃ -N ａｂ |≦0.1 A polysiloxane composition having the properties of which it rapidly solidifies or hardens upon exposure to radiation.

2. Component (A) is given by the following average formula (I): (R ｘ SiO （４－ａ）／２ ) Formula (I) (In the formula, x is a number between 0.8 and 3.0) Each R is independently C ２～１２ an alkenyl group, a substituted or unsubstituted C １～１２ alkyl group, a substituted or unsubstituted C ３～６ cycloalkyl group, a substituted or unsubstituted C ６～２０ aryl group, or a substituted or unsubstituted C ７～２０ aralkyl group). Represented by, At least two R groups in each molecule of component (A) are C ２～１２ It is an alkenyl group, and The composition according to claim 1, wherein component (A) has a weight-average molecular weight of 100 to 100,000.

3. Component (B) is given by the following average formula (III): (Yes) ４／２ ) ａ (R ｘ Yes ３／２ ) ｂ (R ｘ ２ Yes ２／２ ) ｃ (R ｘ ３ Yes １／２ ) ｄ formula (II) (In the formula, each R ｘ These are H, substituted or unsubstituted C, independently. １～１２ Alkyl, substituted, or unsubstituted C ３～６ Cycloalkyl groups, substituted or unsubstituted C ６～２０ Aryl group, or substituted or unsubstituted C ７～２０ It is an aralkyl group, (0 ≤ a < 1, 0 ≤ b < 1, 0 ≤ c < 1, 0 < d < 1, a + b + c > 0, and a + b + c + d = 1) Represented by, At least two R molecules in each molecule of component (B) ｘ The base is H, and, The composition according to claim 1, wherein component (B) has a weight-average molecular weight of 100 to 100,000.

4. The composition according to claim 1, wherein the amount of component (C) is 0.05% to 10% by mass, based on 100% by mass of the solid components of the composition.

5. The composition according to claim 1, wherein the ratio of the total number of moles of alkenyl groups in components (A) and (C) to the total number of moles of SiH groups in component (B) is in the range of 0.1 to 4.

6. Component (C) is given by the following formula: B-(L-P) Ｗ (In the formula, B functions as the core structure and is a polyvalent organic group with valency w; L is a linking group, and each is independently a single bond, -O-, -S-, -C(O)-, -C(O)O-, -OR １ -, -SR １ -, -C(O)R １ -, or -C(O)OR １ Selected from the group consisting of: Each P is an alkenyl group independently; w is an integer selected from 2 to 8. The composition according to claim 1, which may have the following properties.

7. The composition according to claim 6, wherein P is independently a vinyl group, a propenyl group, an allyl group, an isopropenyl group, a butenyl group, a pentenyl group, or a hexenyl group.

8. The composition according to claim 6, wherein B is a polyvalent aliphatic hydrocarbon group, a polyvalent aromatic hydrocarbon group, or a polyvalent 3-14 member heterocyclic group having 1-3 heteroatoms selected from N, O, and S, where the polyvalent aliphatic hydrocarbon group or polyvalent aromatic hydrocarbon group may optionally contain 1 or more oxygen atoms, and the 3-14 member heterocyclic group may optionally be substituted with 1-3 groups selected from halogens, hydroxyl groups, oxo groups, alkyl groups, and hydroxyalkyl groups.

9. A two-component composition comprising a combination of component (I) and component (II), Component (I) comprises component (A), component (C), and component (D) as defined in claim 1, Component (II) comprises component (B) as defined in claim 1, Here, the refractive index (N) of component (C) ｃ ) is the refractive index (N) of the mixture of components (A) and (B). ａｂ ) and the following relationship: |N ｃ -N ａｂ |≦0.1 A two-component composition having the following properties.

10. A method for producing a sealing material, wherein the composition according to claim 1 contains 1,000 to 10,000 mJ / cm² ２ A method comprising the step of irradiating a composition with a UVA radiation source having energy for 10 minutes or less to solidify or harden it.

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