Two-phase shower immersion cooling system for data centers

The cooling system addresses inefficiencies in 2P-LIC by using a refrigerant chamber with vertical boards and a shower cooling method, enhancing thermal management and space utilization while managing refrigerant circulation and condensation to handle rising power densities in computing components.

JP2026100825APending Publication Date: 2026-06-19ジェムズ ラブス
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
ジェムズ ラブス
Filing Date
2025-12-09
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Conventional two-phase immersion cooling (2P-LIC) systems face structural and operational inefficiencies in high-density hyperscale data centers due to vertical PCB maintenance access, leading to reduced space utilization, increased environmental risks, and thermal management challenges, particularly with the rise in power density of computing components.

Method used

A cooling system that employs a refrigerant chamber with vertically arranged circuit boards, utilizing a shower cooling method where liquid refrigerant is injected from the top, vaporizes into vapor, and flows downstream, with a recirculation and condensation unit to manage refrigerant circulation and condensation, enhancing contact with heating surfaces and minimizing immersion depth effects.

Benefits of technology

This approach improves thermal management efficiency, reduces space requirements, and addresses environmental risks by optimizing refrigerant use and condensation, effectively handling increased power consumption in computing components.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2026100825000001_ABST
    Figure 2026100825000001_ABST
Patent Text Reader

Abstract

To provide a cooling system that can improve efficiency. [Solution] The cooling system includes a refrigerant chamber, in which multiple circuit boards are arranged vertically within the refrigerant chamber. A liquid refrigerant vaporizes as refrigerant vapor by absorbing heat generated by heat-generating components on the circuit boards. During the operation of the cooling system, the liquid refrigerant is injected into the refrigerant chamber from the top, flows downstream, and flows through the multiple circuit boards, with the heated surfaces associated with the heat-generating components in contact with the liquid refrigerant. The spaces between the multiple circuit boards are filled with a mixture of air and refrigerant vapor.
Need to check novelty before this filing date? Find Prior Art