Two-phase shower immersion cooling system for data centers: shutdown sequence

JP2026100828APending Publication Date: 2026-06-19ジェムズ ラブス
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
ジェムズ ラブス
Filing Date
2025-12-09
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing two-phase immersion cooling (2P-LIC) technologies face structural and operational inefficiencies in high-density hyperscale data centers due to vertical PCB maintenance access, leading to reduced space utilization, environmental risks, and thermal management challenges, particularly with the rise in power density of computing components.

Method used

A cooling system employing a refrigerant shower method with a recirculation and condensation unit, utilizing a refrigerant chamber and inclined fins to form virtual immersion pockets, enhancing refrigerant circulation and condensation efficiency, and minimizing immersion depth effects.

Benefits of technology

Improves thermal management efficiency, reduces space requirements, and mitigates environmental risks by optimizing refrigerant utilization and condensation, effectively addressing the thermal limitations of rising power densities in computing components.

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Abstract

The present invention provides a cooling system and post-cooling method that can improve efficiency. [Solution] A cooling system configured to perform a cooling operation, the cooling system includes a refrigerant chamber, during the cooling operation of the cooling system a liquid refrigerant and a refrigerant vapor are present in the refrigerant chamber, a circuit board is placed in the refrigerant chamber, the cooling operation is performed by the liquid refrigerant coming into contact with the circuit board, the cooling system executes a stop sequence before opening the refrigerant chamber, and the stop sequence is configured to remove any remaining liquid refrigerant on the circuit board after the cooling operation before opening the refrigerant chamber.
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