Radiation detectors, radiation imaging systems

Abstract

In radiation detectors, technologies that efficiently dissipate heat from stacked semiconductor chips were expected to be advantageous in achieving high detection performance with suppressed noise. [Solution] A radiation detector comprising: a first semiconductor chip having a detection region and a peripheral region located around the detection region in a plan view; a support portion arranged in the peripheral region so as not to overlap with the detection region in a plan view; and a second semiconductor chip arranged in the peripheral region, characterized in that, in a plan view, the end of the support portion located on the detection region side is on the detection region side of the end of the second semiconductor chip that is located on the outer edge side of the first semiconductor chip.

Claims

1. A first semiconductor chip having a detection region and a peripheral region located around the detection region in a plan view, Support parts are arranged in the peripheral region so as not to overlap with the detection region in a plan view, A radiation detector comprising a second semiconductor chip arranged in the peripheral region, In a plan view, the end of the support portion located on the detection region side is closer to the detection region than the end of the second semiconductor chip located on the outer edge side of the first semiconductor chip. A radiation detector characterized by the following features.

2. In a plan view, the end of the support portion located on the side opposite to the detection region is further from the detection region than the end of the second semiconductor chip located on the side of the detection region. In the first semiconductor chip, the support portion is arranged on the side opposite to the side on which the second semiconductor chip is arranged. The radiation detector according to claim 1.

3. In a plan view, the end of the support portion located on the side opposite to the detection region is further from the detection region than the end of the second semiconductor chip located on the side of the detection region. In the first semiconductor chip, the second semiconductor chip and the support portion are arranged on the same plane. The support portion includes a recess for mating with the second semiconductor chip. The radiation detector according to claim 1.

4. In a plan view, the end of the support portion located on the side opposite to the detection region is closer to the detection region than the end of the second semiconductor chip located on the side of the detection region. In the first semiconductor chip, the support portion is arranged on the side opposite to the side on which the second semiconductor chip is arranged. The radiation detector according to claim 1.

5. In a plan view, the end of the support portion located on the side opposite to the detection region is closer to the detection region than the end of the second semiconductor chip located on the side of the detection region. In the first semiconductor chip, the second semiconductor chip and the support portion are arranged on the same plane. The radiation detector according to claim 1.

6. The aforementioned first semiconductor chip includes a semiconductor layer and a wiring layer, The wiring layer is provided with heat dissipation wiring at a position that overlaps with at least one of the second semiconductor chip and the support portion in a plan view. A radiation detector according to any one of claims 1 to 5.

7. The heat dissipation wiring comprises a plurality of conductive layers and via plugs connecting the conductive layers of the plurality of conductive layers. The radiation detector according to feature 6.

8. The system includes via plugs for connecting the heat dissipation wiring to the semiconductor layer. The radiation detector according to feature 6.

9. The aforementioned second semiconductor chip includes a semiconductor layer and a wiring layer. The heat dissipation wiring is connected to the wiring layer of the second semiconductor chip. The radiation detector according to feature 6.

10. The heat dissipation wiring is connected to the semiconductor layer of the first semiconductor chip on the outer edge side of the first semiconductor chip, rather than on the second semiconductor chip side. The radiation detector according to feature 9.

11. The device comprises a mounting substrate that contacts the support portion, and a cooling mechanism for cooling the mounting substrate. A radiation detector according to any one of claims 1 to 5.

12. The first semiconductor chip includes a semiconductor layer, a wiring layer, and a support substrate bonded to the wiring layer. A radiation detector according to any one of claims 1 to 5.

13. Each of the first semiconductor chip and the second semiconductor chip has a wiring layer, The wiring layer of the first semiconductor chip and the wiring layer of the second semiconductor chip are arranged to face each other. A radiation detector according to any one of claims 1 to 5.

14. The device includes a Cu-Cu hybrid connection structure that connects the first semiconductor chip and the second semiconductor chip. A radiation detector according to any one of claims 1 to 5.

15. The second semiconductor chip is one of a plurality of second semiconductor chips arranged in the peripheral region, The plurality of second semiconductor chips include a second semiconductor chip arranged along the first edge of the first semiconductor chip, and a second semiconductor chip arranged along the second edge of the first semiconductor chip that, in a plan view, faces the first edge across the detection region. A radiation detector according to any one of claims 1 to 5.

16. The second semiconductor chip is one of a plurality of second semiconductor chips arranged in the peripheral region, The plurality of second semiconductor chips include a second semiconductor chip arranged along the first edge of the first semiconductor chip, and a second semiconductor chip arranged along the second edge of the first semiconductor chip that intersects the first edge in a plan view. A radiation detector according to any one of claims 1 to 5.

17. The second semiconductor chip is one of a plurality of second semiconductor chips arranged in the peripheral region, The plurality of second semiconductor chips include at least two second semiconductor chips arranged along one side of the first semiconductor chip. A radiation detector according to any one of claims 1 to 5.

18. The first semiconductor chip has a buffer region between the detection region and the peripheral region in a plan view, and at least a part of the support portion is located in the buffer region. A radiation detector according to any one of claims 1 to 5.

19. Having an insulating film for embedding the second semiconductor chip, A radiation detector according to any one of claims 1 to 5.

20. A radiation source that irradiates the object to be imaged, A radiation detector according to any one of claims 1 to 5, A radiation imaging system characterized by having the following features.

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