Molded

JP2026102351APending Publication Date: 2026-06-23INOAC CORP

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
INOAC CORP
Filing Date
2024-12-11
Publication Date
2026-06-23

AI Technical Summary

Benefits of technology

【0012】 本発明に係る成形型によれば、断熱層を保護できる。

✦ Generated by Eureka AI based on patent content.

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Abstract

It protects the heat insulating layer formed on the outer surface of the mold. [Solution] The molding die comprises a first mold 12 and a second mold that forms a cavity between itself and the first mold 12 when closed. The first mold 12 comprises a heat insulating layer 16 provided on the outer surface of the first mold 12 and a protective layer 20 positioned outside the heat insulating layer 16 and having higher strength than the heat insulating layer 16. The protective layer 20 can be made of, for example, a coating, a film, a plate-like body, etc.
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Claims

1. An insulating layer provided on the outer surface of the mold, A mold comprising a protective layer disposed on the outside of the thermal insulation layer and having a higher strength than the thermal insulation layer.

2. The molding die according to claim 1, wherein the protective layer is a coating film covering the heat insulating layer.

3. The mold according to claim 1, wherein the protective layer is a plate-like body.

4. The molding die according to claim 1, wherein the protective layer is a plate-like body arranged at a distance from the heat insulating layer.

5. The molding die according to claim 1, wherein the protective layer is a film that covers the heat insulating layer.

6. The molding die according to claim 2 or 5, wherein the protective layer has a joint portion that is joined to the outer surface of the molding die.