Molded
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- INOAC CORP
- Filing Date
- 2024-12-11
- Publication Date
- 2026-06-23
AI Technical Summary
【0012】 本発明に係る成形型によれば、断熱層を保護できる。
Smart Images

Figure 2026102351000001_ABST
Abstract
Claims
1. An insulating layer provided on the outer surface of the mold, A mold comprising a protective layer disposed on the outside of the thermal insulation layer and having a higher strength than the thermal insulation layer.
2. The molding die according to claim 1, wherein the protective layer is a coating film covering the heat insulating layer.
3. The mold according to claim 1, wherein the protective layer is a plate-like body.
4. The molding die according to claim 1, wherein the protective layer is a plate-like body arranged at a distance from the heat insulating layer.
5. The molding die according to claim 1, wherein the protective layer is a film that covers the heat insulating layer.
6. The molding die according to claim 2 or 5, wherein the protective layer has a joint portion that is joined to the outer surface of the molding die.