Substrate bonding device

Abstract

To provide a substrate bonding apparatus. [Solution] A substrate bonding apparatus is a substrate bonding apparatus for bonding a first substrate and a second substrate, comprising: a first substrate holder for holding the first substrate; a second substrate holder for holding the second substrate; an upper stage for holding the first substrate holder; a lower stage for holding the second substrate holder; and an acquisition unit arranged at a plurality of positions along the direction toward the peripheral edge of the first substrate on the upper stage, and formed to acquire information regarding the degree of progress of a bonding wave, which is the outer edge of the contact area where the first substrate and the second substrate are in contact, and which progresses from the inside to the outside of the first substrate or the second substrate.

Claims

1. A substrate bonding apparatus for bonding a first substrate and a second substrate, A first substrate holder that holds the first substrate, A second substrate holder that holds the second substrate, An upper stage that holds the first substrate holder, A lower stage that holds the second substrate holder, A substrate bonding apparatus, comprising: an acquisition unit arranged at multiple positions along the direction toward the peripheral edge of the first substrate on the upper stage, and formed to acquire information regarding the degree of progress of a bonding wave, which is the outer edge of a contact area where the first substrate and the second substrate are in contact, and which moves from the inside to the outside of the first substrate or the second substrate.

2. The acquisition unit includes a detector for detecting reflected light from the first substrate or the second substrate, a displacement meter for measuring a quantity related to the distance between the first substrate and the second substrate, and a light receiving unit for detecting light transmitted through the first substrate and the second substrate. The substrate bonding apparatus according to claim 1.

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