Apparatus and method for bonding substrates

Abstract

The present invention provides an improved apparatus and method for bonding substrates. [Solution] The method is a method for bonding a first substrate 3 to a second substrate 8 at the contact surfaces 3k and 8k of both substrates 3 and 8, comprising the steps of: mounting the first substrate 3 on the first mounting surface 2o of a first mounting device 1 and mounting the second substrate 8 on the second mounting surface 2o' of a second mounting device 4; contacting both contact surfaces 3k and 8k at a predetermined bonding start point 20; and bonding the first substrate 3 to the second substrate 8 along a bonding wave that progresses from the bonding start point 20 to the side edges 3s and 8s of both substrates 3 and 8. The first substrate 3 and / or the second substrate 8 are deformed outside the bonding start point 20 before and / or during bonding in order to align the contact surfaces 3k and 8k.

Claims

1. A method for bonding a first substrate (3) to a second substrate (8) at the contact surfaces (3k, 8k) of both substrates (3, 8), comprising the following steps, particularly the following sequence: The steps include mounting the first substrate (3) onto the first mounting surface (2o) provided on the first mounting device (1), and mounting the second substrate (8) onto the second mounting surface (2o') provided on the second mounting device (4), The steps include: making contact between the two aforementioned contact surfaces (3k, 8k) at a predetermined bonding start point (20); The first substrate (3) is bonded to the second substrate (8) along a bonding wave that progresses from the bonding start point (20) to the side edges (3s, 8s) of both substrates (3, 8), In a method having, A method for bonding substrates, characterized in that the first substrate (3) and / or the second substrate (8) are deformed outside the bonding start point (20) before and / or during bonding in order to align the contact surfaces (3k, 8k).

2. The method according to claim 1, wherein the deformation of the first substrate (3) and / or the second substrate (8) is performed in relation to a predetermined influence factor that affects the propagation of the bonding wave.

3. The method according to claim 1 or 2, wherein the bonding start point (20) is located in the center of the contact surfaces (3k, 8k).

4. The method according to any one of claims 1 to 3, wherein the deformation of the first substrate (3) and / or the second substrate (8) is performed in the lateral direction and / or in a concave or convex manner.

5. The method according to any one of claims 1 to 4, wherein the deformation is performed by stretching, compressing, or bending the first substrate (3) and / or the second substrate (8).

6. The method according to any one of claims 1 to 5, wherein the diameters (d1, d2) of both substrates (3, 8) differ from each other by a margin less than 5 mm, particularly less than 3 mm, and preferably less than 1 mm.

7. The method according to any one of claims 1 to 6, wherein the deformation is performed by mechanical operating means and / or by temperature control of the first mounting device (1) and / or the second mounting device (4).

8. The method according to any one of claims 1 to 7, wherein the first substrate (3) and / or the second substrate (8) are fixed to the first mounting surface (2o) and / or the second mounting surface (2o') only in the range of the side edges (3s, 8s).

9. An apparatus for bonding a first substrate (3) to a second substrate (8) at the contact surfaces (3k, 8k) of both substrates (3, 8): A first mounting device (1) for mounting a first substrate (3) onto a first mounting surface (2o), and a second mounting device (4) for mounting a second substrate (8) onto a second mounting surface (2o'), A contact means for making contact between the two aforementioned contact surfaces (3k, 8k) at a predetermined bonding start point (20), In an apparatus for bonding substrates, which includes the following: A substrate bonding apparatus characterized by being provided with a deformation means for deforming the first substrate (3) and / or the second substrate (8) outside the bonding start point (20) before and / or during bonding in order to align the contact surfaces (3k, 8k).

10. The apparatus according to claim 9, wherein the deformation means includes the first mounting device (1) which can be deformed laterally and / or into a convex or concave shape, particularly at the first mounting surface (2o).

11. The apparatus according to claim 9, wherein the deformation means includes a second mounting device (4) that can be deformed laterally and / or convex or concave, particularly at the second mounting surface (2o').

12. The apparatus according to any one of claims 9 to 11, wherein the deformation means has a mechanical actuation means and / or a temperature control means for controlling the temperature of the first mounting device (1) and / or the second mounting device (4).

13. The apparatus according to any one of claims 9 to 12, wherein position fixing means are provided for fixing the first substrate (3) and / or the second substrate (8) to the first mounting surface (2o) and / or the second mounting surface (2o') only in the range of the side edges (3s, 8s).

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