Multilayer electronic components

Abstract

To provide a multilayer electronic component that offers excellent reliability, suppresses crack initiation and propagation, and exhibits superior high-temperature stability and reliability. [Solution] A stacked electronic component according to one embodiment of the present invention includes a body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, and external electrodes arranged on the body, wherein the internal electrodes include a plurality of electrode portions and a plurality of interrupted portions, and fillers including Y, Si and O are arranged in one or more of the plurality of interrupted portions, and the dielectric layer is made of BaTiO3 and (Ba 1-x Ca x ) Contains TiO3, and the above x may be greater than 0 and less than 1.0.

Claims

1. A body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, The body includes an external electrode disposed on the main body, The internal electrode includes a plurality of electrode portions and a plurality of interrupted portions, and one or more of the plurality of interrupted portions is provided with a filler containing Y, Si, and O. The dielectric layer is BaTiO ３ and (Ba １－ｘ Ca ｘ )TiO ３ A stacked electronic component including, wherein x is greater than 0 and less than 1.

0.

2. The stacked electronic component according to claim 1, wherein the interrupted portion in which the filler is arranged has a length of 1.0 μm or more.

3. The stacked electronic component according to claim 1, wherein the length of the gap in which the filler is placed is 20% or more.

4. The interrupted portion comprises one or more of the pores, dielectrics, and fillers, as described in claim 1.

5. The filler is Y ２ Si ２ O ７ and Y ２ Si ２ O ５ The multilayer electronic component according to claim 1, comprising one or more of them.

6. The stacked electronic component according to claim 1, wherein x satisfies the condition of being 0.025 or more and 0.2 or less.

7. The dielectric layer is BaTiO ３ and (Ba １－ｘ Ca ｘ )TiO ３ (Ba) １－ｘ Ca ｘ )TiO ３ The multilayer electronic component according to claim 1, wherein the content of is 10 mol% or more and 95 mol% or less.

8. The internal electrode contains ceramic particles, The multilayer electronic component according to claim 1, wherein the Y content of the filler is 0.1 moles or more and 10 moles or less per 100 moles of ceramic particles.

9. The stacked electronic component according to claim 8, wherein the ceramic particles are arranged within the electrode portion.

10. The dielectric layer and internal electrodes are arranged alternately in the first direction. The interrupted portion is arranged to penetrate the internal electrode in the first direction, as described in claim 1 of the stacked electronic component.

11. The laminated electronic component according to claim 1, wherein the filler is arranged to connect dielectric layers adjacent to the gap in which the filler is placed.

12. The stacked electronic component according to claim 1, wherein at least one of the plurality of interrupted portions is made of the filler.

13. At least one of the plurality of interrupted portions includes a dielectric, and the dielectric is BaTiO ３ and (Ba １－ｘ Ca ｘ )TiO ３ A stacked electronic component according to claim 1, comprising (0 < x < 1) as a main component.

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