Temperature sensor

JP2026105016APending Publication Date: 2026-06-25MITSUBISHI MATERIALS CORP

Patent Information

Authority / Receiving Office: JP · JP
Patent Type: Applications
Current Assignee / Owner: MITSUBISHI MATERIALS CORP
Filing Date: 2026-04-17
Publication Date: 2026-06-25

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Benefits of technology

【0015】 本発明によれば、以下の効果を奏する。すなわち、本発明に係る温度センサによれば、ケース部材内で一対の接続部の間に配される絶縁性の隔壁部を有する隔壁部材を備えているので、隔壁部により物理的に一対の接続部間の絶縁が確保される。また、製造の際にインサート成形が不要なため、作業性が向上する。さらに、隔壁部材が、開口部を閉塞する蓋部を有しているので、隔壁部と蓋部とが一体化していることで、隔壁部の挿入と開口部の閉塞とを同時に行うことができる。また、蓋部に貫通孔が形成されているので、貫通孔からケース部材内に充填した封止樹脂部を目視で確認することができ、樹脂充填忘れを防止できる。このように本発明の温度センサは、一対のリード線間の絶縁が確保されて高い信頼性が得られると共に、製造コストが低く、自動車のATF等の温度測定に好適である。

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Abstract

To provide a temperature sensor that does not require insert molding and can reliably insulate the connection between the internal and external lead wires. [Solution] The device comprises a thermal element, a pair of internal lead wires with one end connected to the thermal element, a pair of external lead wires 5 with one end connected to the other end of the pair of internal lead wires via a pair of connecting parts, a case member 6 that houses the thermal element, the pair of internal lead wires and the pair of connecting parts, a sealing resin part 7 that is filled inside the case member and seals at least the thermal element, and a partition member having an insulating partition wall disposed between the pair of connecting parts inside the case member. The case member has a lower case 9A in which the thermal element is housed and an upper case 49B in which one end of the external lead wires is housed and which has an opening at the top. The partition member has a lid 38d that closes the opening, and a through hole 58h is formed in the lid.

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Claims

1. A heat-sensitive element, A pair of internal lead wires, one end of which is connected to the thermal sensing element, A pair of external lead wires, one end of which is connected to the other end of the pair of internal lead wires via a pair of connectors, A case member that houses the thermal sensing element, the pair of internal lead wires, and the pair of connection parts, A sealing resin portion filled inside the case member and sealing at least the heat-sensitive element, The case member comprises a partition member having an insulating partition portion disposed between the pair of connecting portions, The case member comprises the lower part of the case in which the thermal element is housed, The case has an upper part that houses one end of the aforementioned external lead wire and has an opening at the top, The partition member has a lid portion that closes the opening, A temperature sensor characterized by having a through hole formed in the lid portion.

2. In the temperature sensor according to claim 1, The partition wall member has a protrusion, A temperature sensor characterized in that the case member has a recess into which the protrusion can be fitted.

3. In the temperature sensor according to claim 1 or 2, A temperature sensor characterized in that the partition member has an orthogonal plate portion that is perpendicular to the partition portion and in contact with the inner surface of the case member.

4. In the temperature sensor according to any one of claims 1 to 3, The aforementioned external lead wires are bent within the upper part of the case and extend outward from the side of the upper part of the case. A temperature sensor characterized in that the lid portion has a lead retaining portion that, when the opening is closed, sandwiches and holds the pair of external lead wires between itself and the upper part of the case on its side.

5. In the temperature sensor according to any one of claims 1 to 4, A temperature sensor characterized in that the partition member has a protrusion that is insertable between the pair of external lead wires and is wider than the thickness of the partition.