Carrier tape, electronic component storage structure, and method for manufacturing carrier tape.

Abstract

The present invention aims to provide a carrier tape that is less prone to misalignment of electronic components, an electronic component storage structure using the carrier tape, and a method for manufacturing the carrier tape. [Solution] For a carrier tape 1 used for transporting and storing electronic components (EC) in storage pockets 3, through holes 31 are provided through the front and back of the tape body 2, which is made of a long strip of resin, and the storage pockets 3 are formed by laminating a bottom tape 32 along the length direction of the back side of the tape body 2 so as to cover the through holes 31.

Description

Technical Field

[0001] The present invention relates to a carrier tape in which electronic components are stored in storage pockets and used for transportation and storage, an electronic component storage structure using the carrier tape, and a method for manufacturing the carrier tape.

Background Art

[0002] A carrier tape having a form in which a plurality of storage pockets are formed along the length direction of a long strip-shaped tape body is a packaging material for a usage mode in which after electronic components such as semiconductors are stored in the storage pockets, the openings of the storage pockets are closed with a top tape and then used for transportation and storage.

[0003] Currently, this type of carrier tape includes a "paper carrier tape" in which through holes are provided in a paper tape body and one end of the through hole is closed with a bottom tape to form a storage pocket, and an "embossed carrier tape" in which storage pockets are formed by embossing a resin tape body (for example, see Patent Documents 1 and 2 below).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] While paper carrier tapes offer cost advantages, measures must be taken to prevent contamination of electronic components due to the generation of paper dust. Furthermore, paper carrier tapes make it difficult to form relatively deep storage pockets, and due to strength issues, the tape itself cannot be made thin, making it difficult to form shallow storage pockets of 0.5 mm or less.

[0006] On the other hand, embossed carrier tape allows for a thinner tape body and also enables the formation of shallow storage pockets.

[0007] However, as shown in Figure 5, the storage pockets 3 formed in the embossed carrier tape 11 have tapered side walls, which sometimes caused misalignment of the electronic components (EC) stored in the storage pockets 3. Furthermore, this misalignment of the electronic components (EC) tended to occur more frequently as the storage pockets 3 became shallower.

[0008] The present invention was developed in view of the aforementioned technical problems, and aims to provide a carrier tape that is less prone to misalignment of electronic components, an electronic component storage structure using the carrier tape, and a method for manufacturing the carrier tape. [Means for solving the problem]

[0009] The carrier tape of the present invention, which solves the aforementioned technical problems, comprises a tape body and a plurality of storage pockets arranged continuously along the length of the tape body, and is used for transporting and storing electronic components stored in the storage pockets, wherein the tape body is a long strip made of resin, and the storage pockets are formed by through holes penetrating the front and back of the tape body and a bottom tape laminated along the length of the back side of the tape body so as to cover the through holes (hereinafter referred to as "the carrier tape of the present invention").

[0010] In the carrier tape of the present invention, the through holes are formed by punching from the surface to the back surface of the tape body, and the bottom tape is laminated to the back surface of the tape body by compression, which is a preferred embodiment.

[0011] The electronic component storage structure of the present invention, which solves the aforementioned technical problems, is an electronic component storage structure using the carrier tape of the present invention, and is characterized by comprising the carrier tape of the present invention, electronic components stored in the storage pockets, and a top tape laminated along the longitudinal direction of the surface of the tape body so as to cover the opening of the storage pockets (hereinafter referred to as the "storage structure of the present invention").

[0012] In the storage structure of the present invention, a preferred embodiment is one in which the top tape is fixed to the tape body by seals applied to two fixing lines located along the length of the tape body and between the storage pockets, and to fixing points located in the area between adjacent storage pockets.

[0013] The present invention provides a method for manufacturing a carrier tape that solves the aforementioned technical problems, comprising: a first step of forming through holes that penetrate both the front and back surfaces of a long, strip-shaped tape body; and a second step of laminating a bottom tape on the back surface of the tape body so as to cover the through holes, wherein during the execution of the first step, the through holes are formed by punching from the front surface to the back surface of the tape body; and during the execution of the second step, the bottom tape is laminated onto the tape body by pressing (hereinafter referred to as the "present invention manufacturing method").

[0014] In the manufacturing method of the present invention described above, it is preferable that the bottom tape is laminated onto the tape body by heat compression during the execution of the second step. [Effects of the Invention]

[0015] According to the present invention, displacement of electronic components is less likely to occur.

Brief Description of the Drawings

[0016] [Figure 1] FIG. 1 is a perspective view (a) and an exploded perspective view (b) showing a carrier tape of the present invention according to an embodiment. [Figure 2] FIGS. 2(a) to (c) are perspective views showing each step of the manufacturing method of the present invention. [Figure 3] FIGS. 3(a) to (c) are perspective views showing a state of constructing a storage structure of the present invention using the carrier tape of the present invention. [Figure 4] FIG. 4 is a perspective view showing another embodiment of the storage structure of the present invention. [Figure 5] FIGS. 5(a) and (b) are a perspective view and an A-A cross-sectional view showing a conventional embossed carrier tape, and FIG. 5(c) is a cross-sectional view showing a state in which an electronic component is stored in a storage pocket.

Embodiments for Carrying Out the Invention

[0017] Hereinafter, embodiments for carrying out the present invention will be described based on the drawings, but the present invention is not limited to this embodiment.

[0018] [Embodiment] <The carrier tape 1 of the present invention> FIG. 1 shows an embodiment of the carrier tape 1 of the present invention. The carrier tape 1 of the present invention includes a "tape body (2)" and a plurality of "storage pockets (3)" continuously arranged along the length direction of the tape body 2.

[0019] - Tape body 2 - The tape body 2 is a long strip made of resin. In this embodiment, as the tape body 2, a long strip made of polystyrene with a width of 8 mm and a thickness of 0.2 mm was used.

[0020] - Storage pocket 3 - The storage pocket 3 is formed by a through-hole 31 that penetrates both the front and back of the tape body 2, and a bottom tape 32 laminated along the length of the back side of the tape body 2 so as to cover the through-hole 31 (see Figure 1(a)). In this embodiment, a rectangular through-hole (3.5 × 3.0 mm) 31 is formed by punching from the front to the back of the tape body 2, and then the storage pocket 3 is formed by pressing a long strip of plastic film bottom tape 32 onto the back side of the tape body 2. In this embodiment, when the punching is performed, a plurality of circular feed holes (sprockets) 21 are also provided along one side edge of the tape body 2.

[0021] In the carrier tape 1 of the present invention having the above configuration, the side walls of the storage pocket 3 are formed by the inner walls of the through holes 31 provided in the tape body 2, resulting in substantially non-tapered vertical walls. Therefore, the opening and bottom surface of the storage pocket 3 are contiguous with the same shape and dimensions. Thus, the carrier tape 1 of the present invention is equipped with a storage pocket 3 that has the shape and volume as designed.

[0022] <Manufacturing method of the present invention> Figure 2 shows one embodiment of the manufacturing method of the present invention. In the manufacturing method of the present invention, the carrier tape 1 of the present invention is manufactured by performing a "first step" of forming through holes 31 that penetrate through the front and back of the tape body 2, and a "second step" of laminating a bottom tape 32 on the back side of the tape body 2 so as to cover the through holes 31.

[0023] -First step- In the first step, through holes 31 are formed by punching from the front to the back of the tape body 2 (see Figures 2(a) and (b)). In this embodiment, the die (P) of the punching machine is pressed against the front side of the tape body 2 to punch out the tape body 2 and thereby form the through holes 31. The feed holes 21 are also formed at the same time as the execution of the first step.

[0024] -Second process- In the second step, the bottom tape 32 is laminated onto the tape body 2 by compression. In this embodiment, the bottom tape 32 is placed between a pair of rollers (R) with the bottom tape 32 aligned with the back side of the tape body 2, and the bottom tape is laminated onto the back side of the tape body 2 by compression (heat compression) while applying pressure and heat and feeding it out.

[0025] <Storage structure 10 of the present invention> Figure 3 shows the storage structure 10 of the present invention. The storage structure 10 of the present invention comprises the carrier tape 1 of the present invention, electronic components (EC) stored in the storage pocket 3, and a top tape 4 laminated along the longitudinal direction of the surface of the tape body 2 so as to cover the opening of the storage pocket 3. In this embodiment, semiconductor elements are assumed as electronic components (EC), but the electronic components (EC) mounted on the carrier tape 1 of the present invention are not limited to semiconductor elements.

[0026] -Top Tape 4- The top tape 4 closes the opening of the storage pocket 3 and serves to enclose the electronic components (EC) inside the storage pocket 3. In this embodiment, a long strip of plastic film is used as the top tape 4, and the top tape 4 is fixed to the tape body 2 by seals applied to two fixing lines (AL) that run along the length of the tape body 2 and are located on either side of the storage pocket 3 (i.e., along the sprocket flange and the free flange).

[0027] The storage structure 10 of the present invention, having the above configuration, is wound around the carrier tape 1 of the present invention with electronic components (EC) stored in the storage pockets 3, and is used for transport and storage. At the destination, the top tape 4 is peeled off, and the electronic components (EC) are removed from the storage pockets 3.

[0028] Furthermore, since the present invention's electronic storage structure 10 is constructed using the present invention's carrier tape 1 equipped with storage pockets 3 having the shape and volume specified in the design dimensions, it is less likely for electronic components (ECs) to shift position within the storage pockets 3 compared to the conventional embossed carrier tape 11 shown in Figure 5.

[0029] In this embodiment, a long strip of polystyrene with a width of 8 mm and a thickness of 0.2 mm was used as the tape body 2. However, the material of the tape body 2 can be appropriately selected according to the required strength and properties, and is not particularly limited. In addition to polystyrene, synthetic resins such as polyvinyl chloride, amorphous polyethylene terephthalate, polycarbonate, and polypropylene can be used as the material of the tape body 2. Furthermore, the tape body 2 may be formed by kneading carbon or the like into these resins to impart conductivity, or by applying a conductive coating to the surface.

[0030] Furthermore, the width of the tape body 2 is not particularly limited and may be, for example, 4mm, 8mm, 12mm, 16mm, 24mm, 32mm, 44mm, 56mm, etc.

[0031] Furthermore, the thickness of the tape body 2 can be appropriately selected according to the volume of the electronic components (EC) stored in the storage pocket 3. The carrier tape 1 of the present invention has the advantage of being able to be designed with extremely shallow storage pockets 3, which was difficult to achieve with conventional embossed carrier tapes 11, because the depth of the storage pocket 3 can be made shallower by reducing the thickness of the tape body 2. Therefore, it is preferable that the thickness of the tape body 2 be 0.5 mm (more preferably 0.3 mm or less; even more preferably 0.1 mm or less).

[0032] In this embodiment, a rectangular through-hole (3.5 × 3.0 mm) 31 is formed by punching from the front to the back of the tape body 2, and then the storage pocket 3 is formed by pressing the bottom tape 32 onto the back side of the tape body 2. However, the shape and size of the through-hole 31 can be appropriately selected according to the shape of the electronic component (EC) to be stored in the storage pocket 3. Furthermore, the through-hole 31 may be formed by processing means other than punching. In addition, the bottom tape 32 may be laminated onto the tape body 2 using fixing means other than pressing.

[0033] However, if the through-hole 31 is formed by punching from the front to the back of the tape body 2, burrs may be generated around the periphery of the through-hole 31 that protrude to the back side of the tape body 2, impairing the flatness of the tape body 2.

[0034] In this case, it has been confirmed that pressing the bottom tape 32 to the back side of the tape body 2 reduces the amount of burrs that protrude and improves the flatness of the tape body 2. In particular, it has been confirmed that applying pressure and heat while heat-pressing the bottom tape 32 to the back side of the tape body 2 further improves the flatness of the tape body 2.

[0035] In this embodiment, when performing the die-cutting process, a plurality of circular feed holes 21 are provided along one side edge of the tape body 2. However, the presence or absence of feed holes 21 is not an essential component of the present invention. The feed holes 21 may be provided as appropriate according to the specifications of the electronic component (EC) mounting machine.

[0036] In this embodiment, a long, strip-shaped plastic film was used as the bottom tape 32. However, the material and dimensions of the bottom tape 32 can be appropriately selected according to the required strength and properties, as well as the size and shape of the through-hole 31. Alternatively, a laminated film in which an adhesive layer is laminated on one surface of a base film may be used as the bottom tape 32.

[0037] In this embodiment, a long, strip-shaped plastic film is used as the top tape 4. However, the material and dimensions of the top tape 4 can be appropriately selected according to the required strength and properties, as well as the size and shape of the through-hole 31. Alternatively, a laminated film in which an adhesive layer is laminated on one side of a base film may be used as the top tape 4.

[0038] However, in this embodiment, when fixing the top tape 4 to the tape body 2 by seals applied to two fixing lines (AL) located along the length of the tape body 2 and on either side of the storage pocket 3, it is preferable to use a laminated film in which pressure-sensitive or heat-sensitive adhesive resins are laminated along both sides of the base film.

[0039] In particular, in the present invention, when fixing the top tape 4 to the tape body 2, it is preferable to apply seals to the fixing points (AP) located in the area between adjacent storage pockets 3, in addition to the seals applied to the two fixing lines (AL), as shown in Figure 4.

[0040] Thus, it has been confirmed that by applying seals to the fixed points (AP) located in the area between adjacent storage pockets 3, the displacement of electronic components (EC) becomes even less likely. Furthermore, the present invention can be implemented in various other forms without departing from its spirit or main features. Therefore, the embodiments described above are merely illustrative in all respects and should not be interpreted restrictively. The scope of the present invention is defined by the claims, and the text of the specification is not restrictive. Moreover, any modifications or changes within the equivalent scope of the claims are all within the scope of the present invention. [Industrial applicability]

[0041] This invention is suitably used as packaging material for storing and transporting electronic components. [Explanation of symbols]

[0042] 1. Carrier tape of the present invention (carrier tape) 2 Tape body 3 storage pockets 31 Through hole 32 Bottom Tape 4 Top Tape 10. Storage structure of the present invention (electronic component storage structure) AL fixed line AP Fixed Point EC electronic parts

Claims

1. A carrier tape comprising a tape body and a plurality of storage pockets arranged continuously along the length of the tape body, wherein electronic components are stored in the storage pockets and used for transport and storage, The tape body is a long, strip-shaped body made of resin. The aforementioned storage pocket, The tape body has through holes that penetrate both the front and back sides, A bottom tape is laminated along the length direction of the back side of the tape body so as to cover the through hole, A carrier tape characterized by being formed by [a certain method].

2. In the carrier tape according to claim 1, The through-hole is formed by a punching process from the surface to the back of the tape body. A carrier tape in which the bottom tape is laminated to the back side of the tape body by compression.

3. An electronic component storage structure using a carrier tape according to claim 1 or 2, The carrier tape and, The electronic components stored in the aforementioned storage pocket, A top tape is laminated along the length of the surface of the tape body so as to cover the opening of the storage pocket, An electronic component housing structure characterized by comprising the following:

4. In the electronic component housing structure described in claim 3, Two fixing lines are located along the length of the tape body and between the storage pockets, Fixed points located in the area between adjacent storage pockets, An electronic component storage structure in which the top tape is fixed to the tape body by a seal applied thereto.

5. A method for manufacturing a carrier tape according to claim 1 or 2, The first step is to form through holes that penetrate both the front and back of the long, strip-shaped tape body, A second step involves laminating a bottom tape on the back side of the tape body so as to cover the through hole, Execute, During the execution of the first step, the through hole is formed by punching from the front surface to the back surface of the tape body. A method for manufacturing a carrier tape, characterized in that, during the execution of the second step, the bottom tape is laminated onto the tape body by compression.

6. In the method for manufacturing a carrier tape according to claim 5, A method for manufacturing a carrier tape, wherein, during the execution of the second step, the bottom tape is laminated onto the tape body by heat compression.

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