Molded body for transporting electronic components

Abstract

To provide a molded body for transporting electronic components that offers excellent protection for stored electronic components due to its good moldability, surface wear resistance, release properties, and antistatic properties. [Solution] Per 100 parts by mass of thermoplastic resin (a) A molded body for transporting electronic components, obtained by molding a resin composition (A) containing (b) 0.5 to 20 parts by mass of polyether block amide, (d) a polyolefin with one end modified, and (e) a block copolymer (c) having a specific structure that can be obtained by reacting a polyether or a modified product thereof.

Description

[Technical Field]

[0001] The present invention relates to a molded body for transporting electronic components, and more particularly to a molded body for transporting electronic components that has excellent moldability, surface wear resistance, release properties, and antistatic properties, thereby providing excellent protection for stored electronic components. [Background technology]

[0002] As electronic components become smaller, lighter, and more functional, molded parts for transporting electronic components, such as trays, embossed carrier tapes, and cover tapes, are used in the manufacturing of electronic devices to safely transport and store components. These molded parts can generate static electricity due to friction during handling, requiring conductivity to suppress static electricity generation. However, using surfactant-based antistatic agents presents a problem: the surfactant bleeds onto the surface, contaminating the components. Furthermore, trays and embossed carrier tapes require moldability to separate components, and insufficient mechanical strength can lead to cracking. Additionally, wear resistance is necessary to prevent contamination of components due to the generation of resin powder caused by friction and friction when trays are stacked. To address these challenges, various studies are being conducted on incorporating conductive materials and additives into synthetic resins.

[0003] For example, an antistatic polyamide resin composition containing a polyamide resin, a polymeric antistatic agent, and single-crystal fibers is disclosed, which has improved antistatic properties, mechanical strength, and heat resistance (Patent Document 1). Patent Document 2 discloses a thermoplastic resin molded article for handling electronic components, such as a magnetic head carrier that causes less electrical damage, which contains a thermoplastic resin, carbon fibers, and a polymer antistatic agent. Patent Document 3 discloses a resin composition and molded article comprising a propylene polymer and a polyether / polyolefin block copolymer, which have excellent cleanliness, dustproof properties, and transparency of the molded article, and have a melt flow rate in the range of 2 to 100 g / 10 min. Patent Document 4 discloses a thermoplastic resin composition for an electric and electronic packaging material containing a thermoplastic resin, carbon nanotubes, and wax and an aliphatic metal salt.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0005] In conventional molded bodies for transporting electronic components, in order to improve moldability, abrasion resistance, mold release properties, and antistatic properties, proposals have been made to incorporate polymer antistatic agents and carbon fibers that are excellent in the persistence of antistatic performance. On the other hand, there has been no development of a molded body for transporting electronic components that is excellent in protecting stored electronic components, such as a decrease in antistatic performance due to the incorporation of other components, restrictions on the matrix resin to be incorporated, or contamination of components due to the generation of resin powder.

[0006] In Patent Document 1 described above, potassium titanate fibers and wollastonite fibers having a high electrical resistance value are used as single crystal fibers, and the antistatic performance cannot be said to be sufficient. In Patent Document 2, carbon fibers that are difficult to process and are likely to produce burrs after processing are used as antistatic agents, and no discussion has been made about processability. Patent Document 3 describes a material that combines a polyether / polyolefin block copolymer and a nucleating agent as an antistatic agent, exhibiting excellent dustproof properties and transparency. However, processability and abrasion resistance are not discussed, and furthermore, its antistatic performance is not considered sufficient. In Patent Document 4, carbon nanotubes are used as an antistatic agent, but when they are melt-kneaded with thermoplastic resin, some of the carbon nanotubes are crushed, generating carbon powder, and the carbon that is detached by vibration or friction contaminates the parts. The present invention has been made in view of the above problems, and aims to provide a molded body for transporting electronic components that has good moldability, surface wear resistance, release properties, and antistatic properties, and is excellent in protecting stored electronic components. [Means for solving the problem]

[0007] As a result of diligent research, the inventors of the present invention discovered that the above problems can be solved by blending a polyether block amide and a specific block copolymer in a predetermined ratio with a thermoplastic resin, and thus completed the present invention.

[0008] In other words, the present invention covers the following [1] to [5]. [1] per 100 parts by mass of thermoplastic resin (a) Polyether block amide (b) 0.5 to 20 parts by mass 5 to 30 parts by mass of block copolymer (c) represented by the following general formula (1) or general formula (2) A molded body for transporting electronic components, obtained by molding a resin composition (A) containing the above. [ka] (In the formula, R 1 is a polyolefin residue, A 1 X is a divalent group having a polyoxyalkylene group. 1 is -O- or -N(R 2 )-(wherein, R 2 ) represents a hydrogen atom or an alkyl group, alkenyl group, or acyl group having 1 to 22 carbon atoms. 1represents a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkenyl group, an aryl group, an alkylaryl group, an acyl group, or a structure represented by the following general formula (3) or the following general formula (4), and M 1 represents a hydrogen atom, an alkali metal atom, an alkaline earth metal atom, an ammonium group, or an organic ammonium group.) [Chemical formula] (In the formula, R 3 is a polyolefin residue, A 2 represents a divalent group having a polyoxyalkylene group, and B 2 represents a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkenyl group, an aryl group, an alkylaryl group, an acyl group, or a structure represented by the following general formula (3) or the following general formula (4).) [Chemical formula] (In the formula, R 4 is a polyolefin residue, X 2 is -O- or -N(R 5 )-(wherein, R 5 represents a hydrogen atom or an alkyl group, an alkenyl group or an acyl group having 1 to 22 carbon atoms.) , M 2 represents a hydrogen atom, an alkali metal atom, an alkaline earth metal atom, an ammonium group, or an organic ammonium group.) [Chemical formula] (In the formula, R 6 represents a polyolefin residue.) [2] The molded body for transporting electronic components according to [1], which is formed by molding a laminate in which the resin composition (A) is used as a surface layer and laminated on a base material layer made of a thermoplastic resin (B). [3] The molded body for transporting electronic components according to [1], wherein the thermoplastic resin (a) is a polyolefin resin. [4] The molded body for transporting electronic components according to [1], wherein the molded body for transporting electronic components is a tray for transporting electronic components. [5] The molded body for transporting electronic components according to [1], wherein the molded body for transporting electronic components is an embossed carrier tape for transporting electronic components. [Effects of the Invention]

[0009] The molded body for transporting electronic components of the present invention is excellent in moldability, surface wear resistance, and antistatic properties, and does not generate resin powder due to wear. It also has good release properties even when stacked, making it suitable for use as a transport tray for electronic components, an embossed carrier tape, and the like. [Modes for carrying out the invention]

[0010] The present invention will be described in more detail below. In general formulas (1) and (2), R 1 , R 3 , R 4 , R 6 (d) is a polyolefin residue, and (d) is a portion derived from the polyolefin of an acid-modified polyolefin. As polyolefins, polyolefins obtained by polymerizing one or more olefins having 2 to 30 carbon atoms, preferably 2 to 12 carbon atoms, and more preferably 2 to 10 carbon atoms (polymerization method), and low molecular weight polyolefins obtained by thermal depolymerization of high molecular weight polyolefins (thermal depolymerization method) can be used. The number average molecular weight Mn of the polyolefin is preferably 800 to 20,000, more preferably 1,000 to 10,000, and most preferably 1,500 to 9,000.

[0011] Examples of olefins having 2 to 30 carbon atoms include ethylene, propylene, 1-butene, 2-butene, and isobutene; α-olefins having 5 to 30 carbon atoms, preferably 5 to 12, and more preferably 5 to 10, such as 4-methyl-1-pentene, 1-pentene, 1-octene, 1-decene, and 1-dodecene; and dienes having 4 to 30 carbon atoms, preferably 4 to 18, and more preferably 4 to 8, such as butadiene, isoprene, cyclopentadiene, and 11-dodecadiene.

[0012] (d) As the polyolefin with one end modified by acid, a polyolefin having an average number of terminal double bonds per molecule of 0.5 to 1.5, preferably 0.7 to 1.0, and preferably polypropylene modified with a dicarboxylic acid such as (anhydride) maleic acid or fumaric acid can be preferably used.

[0013] In general formulas (1) and (2), A 1 , A 2 Each of these is a divalent group having a polyoxyalkylene group, and the polyoxyalkylene units are preferably contained in their composition at a rate of 20 to 100% by mass, more preferably 50 to 100% by mass, and particularly preferably 70 to 100% by mass. Specifically, (e) polyethers and the -(R) that constitute their modified products. 8 O) m -R 7 -(OR 9 ) n -(R 7 R is a divalent organic group with 1 to 30 carbon atoms. 8 , R 9 Each of these groups independently contains an alkylene group having 2 to 4 carbon atoms, and m and n are each independently represented by integers from 1 to 100. (e) Examples of polyethers include (e1) polyetherdiols, (e2) polyetherdiamines in which the hydroxyl groups are converted to amino groups, and (e3) polyethermonools.

[0014] The above (e1) polyetherdiol can be obtained by adding alkylene oxide to a diol compound, and can be polyethylene glycol or polypropylene glycol, as well as, for example, polyetherdiols of the general formula: HO-(R 8 O) m -R 7 -(OR 9 ) n Examples include compounds represented by -OH. In the formula, R 7 R is a residue obtained by removing the hydroxyl group from a diol compound. 8 , R 9 is an alkylene group having 2 to 4 carbon atoms, and m and n represent the number of alkylene oxide additions per hydroxyl group of the diol. m (R 8 O) and n (OR 9 The oxyalkylene groups may be the same or different, and when they are composed of two or more oxyalkylene groups, the bonding configuration may be block, random, or a combination thereof. m and n are usually integers from 1 to 100, preferably from 2 to 30, and particularly preferably from 3 to 20. Also, m and n may be the same or different.

[0015] Examples of diol compounds include dihydric alcohols (e.g., aliphatic, alicyclic, or aromatic dihydric alcohols having 2 to 12 carbon atoms), dihydric phenols having 6 to 18 carbon atoms, and tertiary amino group-containing diols. Examples of aliphatic dihydric alcohols include alkylene glycols (ethylene glycol, propylene glycol), 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, and 1,12-dodecanediol. Examples of alicyclic dihydric alcohols include cyclohexanedimethanol and hydrogenated bisphenol, while examples of aromatic dihydric alcohols include xylylenediol. Examples of divalent phenols include monocyclic divalent phenols (hydroquinone, catechol, resorcinol, urushiol, etc.), bisphenols (bisphenol A, bisphenol F, bisphenol S, 4,4'-dihydroxydiphenyl-2,2-butane, dihydroxybiphenyl, etc.), and condensed polycyclic divalent phenols (dihydroxynaphthalene, binaphthol, etc.).

[0016] Examples of tertiary amino group-containing diols include bishydroxyalkylated compounds of aliphatic or alicyclic primary monoamines having 1 to 30 carbon atoms (methylamine, ethylamine, cyclopropylamine, 1-propylamine, 2-propylamine, amylamine, isoamylamine, hexylamine, 1,3-dimethylbutylamine, 3,3-dimethylbutylamine, 2-aminoheptane, 3-aminoheptane, cyclopentylamine, hexylamine, cyclohexylamine, heptylamine, nonylamine, decylamine, undecylamine, dodecylamine, etc.) and bishydroxyalkylated compounds of aromatic primary monoamines having 6 to 12 carbon atoms (aniline, benzylamine, etc.). Among these diol compounds, aliphatic dihydric alcohols and bisphenols are preferred, and ethylene glycol and bisphenol A are particularly preferred.

[0017] Examples of alkylene oxides to be added to the above-mentioned diol compound include alkylene oxides having 2 to 4 carbon atoms, such as ethylene oxide, propylene oxide, and butylene oxide, and one or more of these can be used. The addition of the alkylene oxide is carried out, for example, in the presence of an alkaline catalyst at a temperature of 100 to 200°C.

[0018] In particular, suitable candidates for (e1) polyetherdiol in the present invention include polyethylene glycol or ethylene oxide adducts of bisphenol A having a molecular weight of 100 to 2,000, more preferably 200 to 1,000.

[0019] Furthermore, the (e2) polyetherdiamine can be obtained by converting the hydroxyl group of the polyetherdiol to an amino group by a known method, for example, the general formula: H2N-(R 8 O) m -R 7 -(OR 9 ) n Examples include compounds represented by -NH2. In the formula, R 7 , R 8 , R 9 , m and n are the same as those listed for polyetherdiol above.

[0020] The (e3) polyether monools are obtained by adding alkylene oxides to monools such as monohydric alcohols and phenols, for example, the general formula is RO-(AO) k Compounds represented by -H are examples. In the formula, R is a residue obtained by removing a hydroxyl group from any monool, A is an alkylene group having 2 to 4 carbon atoms, and k is the number of alkylene oxide additions. The k (AO) groups may be the same oxyalkylene group or different oxyalkylene groups, and when these are composed of two or more oxyalkylene groups, the bonding configuration may be block, random, or a combination thereof. k is usually an integer from 1 to 200, preferably from 3 to 60, and particularly preferably from 5 to 30.

[0021] Examples of monohydric alcohols include linear or side-chain aliphatic saturated alcohols such as methyl alcohol, ethyl alcohol, propyl alcohol, n-butyl alcohol, isobutyl alcohol, tertiary butyl alcohol, isoamyl alcohol, octyl alcohol, 2-ethylhexyl alcohol, lauryl alcohol, tridecyl alcohol, cetyl alcohol, stearyl alcohol, isostearyl alcohol, and synthetic alcohols (e.g., Ziegler alcohol, oxo alcohol); aliphatic unsaturated alcohols such as allyl alcohol, clotyl alcohol, propagyl alcohol, oleyl alcohol, and linoleyl alcohol; aliphatic saturated and unsaturated alcohols such as fragrant alcohol, tallow-reduced alcohol, and coconut oil-reduced alcohol; alicyclic alcohols such as cyclopentanol and cyclohexanol; and aromatic alcohols such as benzyl alcohol and cinnamyl alcohol. In addition to phenols, examples of phenols include cresol, isopropylphenol, tertiary butylphenol, and tertiary amylphenol. Of these, monohydric alcohols are preferred, and aliphatic monohydric alcohols are even more preferred.

[0022] Examples of modified polyethers (e4) include aminocarboxylic acid modified products of (e1) or (e2), and monocarboxylic acid modified products of (e2). Aminocarboxylic acid modified products can be obtained by reacting (e1) or (e2) with an aminocarboxylic acid or lactam. Monocarboxylic acid modified products can be obtained by reacting (e2) polyetherdiamine or the like with a monocarboxylic acid having 1 to 22 carbon atoms.

[0023] [Block copolymer] The block copolymer (c) according to the present invention can be obtained by reacting (d) a polyolefin with one end modified by acid with (e) a polyether or a modified product thereof. The reaction between (d) a polyolefin with one end modified by acid with (e) a polyether or a modified product thereof can be carried out at 150 to 250°C in the presence of a catalyst as needed. Specific examples of catalysts include acid catalysts such as sulfuric acid, p-toluenesulfonic acid, and phosphoric acid; alkali metal hydroxides such as lithium hydroxide, sodium hydroxide, and potassium hydroxide; alkaline earth metal hydroxides such as calcium hydroxide and magnesium hydroxide; and metal oxides such as calcium oxide, magnesium oxide, zinc oxide, lead oxide, and tin oxide. Furthermore, the catalysts used may include antimony catalysts such as antimony trioxide; tin catalysts such as monobutyltin oxide; titanium catalysts such as tetrabutyl titanate; zirconium catalysts such as tetrabutyl zirconate; organic acid metal salt catalysts such as zirconyl acetate and zinc acetate; palladium catalysts such as palladium acetate and tetrakis(triphenylphosphine)palladium; and combinations of two or more of these. Of these, zirconium catalysts and organic acid metal salt catalysts are preferred, with zirconyl acetate being particularly preferred.

[0024] The charging ratio of (d) an acid-modified polyolefin and (e) a polyether is not particularly limited, but in terms of obtaining the block copolymer of the present invention in high yield, a molar ratio of (d) / (e) = 0.8 / 1 to 3 / 1 is preferred.

[0025] The carboxyl group produced by reacting (d) with (e1) or (e3), etc., may be neutralized with an alkaline substance. Examples of alkaline substances used for neutralization include hydroxides, carbonates, phosphates, acetates, sulfates, etc., of alkali metals such as lithium, potassium, and sodium; hydroxides, carbonates, ammonia, organic amines, etc., of alkaline earth metals such as calcium and magnesium; and combinations of two or more of these. Specifically, examples include, but are not limited to, sodium hydride, potassium hydride, calcium hydride, sodium ethoxide, sodium methoxide, sodium tert-butoxide, potassium tert-butoxide, n-butyllithium, sec-butyllithium, lithium diisopropylamide, sodium amide, lithium bistrimethylsilylamide, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate, lithium hydroxide, sodium hydroxide, potassium hydroxide, barium hydroxide, calcium hydroxide, sodium phosphate, potassium phosphate, calcium phosphate, sodium acetate, potassium acetate, sodium sulfate, potassium sulfate, magnesium sulfate, sodium silicate, lithium silicate, sodium tripolyphosphate, sodium ethylenediaminetetraacetate, sodium nitrilotriacetate, sodium p-toluenesulfonate, potassium p-toluenesulfonate, sodium metaborate, sodium citrate, potassium citrate, sodium ethylenediaminetetraacetate, sodium nitrilotriacetate, sodium hydroxyethylethylenediaminetriacetate, sodium diethylenetriaminepentaacetate, sodium uracil diacetate, sodium thiosulfate, etc.

[0026] In the present invention, the thermoplastic resin (a) and thermoplastic resin (B) constituting the resin composition can be polyolefin resins such as polyethylene-based or polypropylene-based resins, polyvinyl chloride resins, acrylic resins, and the like. Polyethylene-based materials include high-density polyethylene (HDPE), low-density polyethylene (LDPE), very low-density polyethylene (VLDPE), linear low-density polyethylene (LLDPE), ultra-high molecular weight polyethylene (UHMW-PE), metallocene polyethylene, as well as chlorinated polyethylene (CPE), silane-crosslinked polyethylene, and maleic anhydride-modified polyethylene. Polypropylene-based materials include isotactic polypropylene (iPP), syndiotactic polypropylene (syn-PP), atactic polypropylene (aPP), ultra-high molecular weight polypropylene (UHMW-PP), metallocene polypropylene, chlorinated polypropylene, silane-crosslinked polypropylene, maleic anhydride-modified polypropylene, and oxidized polypropylene. Other polyolefins include olefin homopolymers such as polyisobutylene (PIB), polybutylene (polybutene-1, PB-1), and poly(4-methyl-1-pentene), ethylene-propylene block copolymer, ethylene-propylene random copolymer, ethylene-1-butene copolymer, ethylene-1-hexene copolymer, ethylene-4-methyl-1-pentene copolymer, ethylene-1-octene copolymer, propylene-1-butene copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene-vinyl alcohol copolymer (EVOH), ethylene-(meth)acrylic acid copolymer (EMAA, EAA), metal salts of ethylene-(meth)acrylic acid copolymer (ionomer resin, ION), ethylene-maleic anhydride copolymer, ethylene-(meth)acrylic acid ester copolymer, ethylene-(meth)acrylic acid ester-maleic anhydride copolymer, and other olefin-based copolymers, as well as olefin-based elastomers (TPO) and olefin-based plastomers (POP).

[0027] Furthermore, polyvinyl chloride includes PVC-S (straight PVC), which is polymerized with chloroethylene alone, and PVC-M, which is a copolymer with other substances. PVC-S is further divided into soft PVC and hard PVC depending on the amount of plasticizer added. PVC-M includes vinyl chloride-ethylene copolymer, vinyl chloride-propylene copolymer, vinyl chloride-vinyl acetate copolymer, vinyl acetate-vinyl chloride-vinyl alcohol copolymer, vinyl chloride-vinyl acetate-hydroxyalkyl acrylate copolymer, vinyl chloride-vinyl acetate-itaconic acid copolymer, vinyl chloride-vinyl acetate-fumaric acid copolymer, vinyl chloride-vinyl acetate-vinylidene chloride copolymer, vinyl chloride-alkyl vinyl ether copolymer, vinyl chloride-vinyl propionate copolymer, vinyl chloride-vinyl acetate-(meth)acrylic acid copolymer, vinyl chloride-vinyl acetate-(meth)acrylic acid ester copolymer, vinyl chloride-vinyl acetate-(meth)acrylic acid ester-(meth)acrylic acid copolymer, and chlorinated polyvinyl chloride (CPVC).

[0028] In addition to highly transparent (meth)acrylic acid ester resins such as polymethyl methacrylate (PMMA), other acrylic resins include methyl methacrylate-butadiene-styrene copolymer (MBS) and methyl methacrylate-styrene copolymer (MS). Other resins include bisphenol A polycarbonate resin (PC), produced by the reaction of bisphenol A and phosgene, polyester resins such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polytrimethylene terephthalate (PTT), polyester elastomers (TPEE), acrylonitrile-styrene resin (AS), styrene-butadiene resin (SB), acrylonitrile-butadiene-styrene resin (ABS), acrylonitrile-styrene-acrylic rubber resin (ASA), and acrylonitrile Examples of thermoplastic resins include tolyl-ethylenepropylenediene-styrene resin (AES), silicone-acrylonitrile-styrene resin (SAS), styrene elastomer (TPS), polyamide resins such as nylon 6 (PA6), nylon 6,6 (PA66), nylon 6,10 (PA610), nylon 4,6 (PA46), nylon 11 (PA11), nylon 12 (PA12), and nylon MXD6 (PAMXD6), as well as polyurethane elastomers (TPU). However, two or more of the above thermoplastic resins may be used in blend form. Among these thermoplastic resins, olefin resins are most preferred.

[0029] In the present invention, the mass ratio of thermoplastic resin (a) to block copolymer (c) is set to 100 parts thermoplastic resin (a) from the viewpoint of antistatic performance and moldability. quality The amount of block copolymer (c) per part is 5 to 30 parts by mass, more preferably 7 to 27 parts by mass, and even more preferably 10 to 25 parts by mass.

[0030] The polyether block amide (b) used in the present invention is a copolymer in which polyamide blocks and polyether blocks are alternately condensed. For example, the polyamide block is a copolymer amide obtained by condensing at least one α,ω-aminocarboxylic acid or lactam, at least one diamine and a dicarboxylic acid, and is further obtained by ester condensation of the polyether block component.

[0031] Examples of α,ω-aminocarboxylic acids used in the polyether block amide (b) used in the present invention include aminocaproic acid, 7-aminoheptanoic acid, amino-11-undecanoic acid, n-heptyl-11-aminoundecanoic acid, and 12-aminododecanoic acid. Examples of dicarboxylic acids include 1,4-cyclohexyldicarboxylic acid, butanediic acid, adipic acid, azelaic acid, suberic acid, sebacic acid, dodecanedicarboxylic acid, octadecanedicarboxylic acid, terephthalic acid, and isophthalic acid. Examples of lactams include those having 3 to 18 carbon atoms in the main ring, and may be substituted. Examples include β,β-dimethylpropiolactam, α,α-dimethylpropiolactam, amyloractam, caprolactam (also known as lactam 6), capryllactam (also known as lactam 8), enantractam, 2-pyrrolidone, and lauryllactam (also known as lactam 12). The polyethers used in the polyether block are selected from poly(ethylene glycol) (PEG), poly(1,2-propylene glycol) (PPG), poly(1,3-propylene glycol) (PO3G), poly(tetramethylene glycol) (PTMG), and copolymers or blends thereof.

[0032] Furthermore, the melting point of polyether block amide (b) is preferably 120 to 190°C, more preferably 130 to 180°C, and even more preferably 140 to 170°C, from the viewpoint of tack resistance.

[0033] Furthermore, the Shore hardness of polyether block amide (b) is preferably 20 to 75, more preferably 25 to 70, and even more preferably 30 to 60, from the viewpoint of moldability.

[0034] The weight-average molecular weight of the polyether block amide (b) used in the present invention is preferably 10,000 to 200,000, more preferably 200,000 to 140,000, and even more preferably 30,000 to 80,000, from the viewpoint of dispersibility in thermoplastic resin.

[0035] In the present invention, the mass ratio of thermoplastic resin (a) to polyether block amide (b) is 0.5 to 20 parts by mass of polyether block amide (b) per 100 parts by mass of thermoplastic resin (a), more preferably 1 to 15 parts by mass, and even more preferably 2 to 10 parts by mass, from the viewpoint of antistatic performance and moldability.

[0036] In this invention, additives such as plasticizers, lubricants, pigments, surfactants, antioxidants, ultraviolet absorbers, antibacterial agents, desiccants, and alcohols can be added to the resin composition (A) and thermoplastic resin (B) that constitute the molded body for transporting electronic components.

[0037] Examples of the aforementioned plasticizers include phthalates, adipic acids, phosphoric acids, and trimellitic acid epoxys. Examples of phthalates include dimethyl phthalate (DMP), diethyl phthalate (DEP), dibutyl phthalate (DBP), bis(2-ethylhexyl) phthalate (DOP), di-2-ethylhexyl phthalate (DEHP), butyl benzyl phthalate (BBP), diisononyl phthalate (DINP), diisodecyl phthalate (DIDP), diundecyl phthalate (DUP), and bis(2-ethylhexyl) terephthalate (DOTP). Examples of adipic acids include adipic acid Examples of phosphate-based phosphates include bis(2-ethylhexyl) phosphate (DOA), diisononyl adipate (DINA), di-n-alkyl adipate, diisodecyl adipate (DIDA), diisobutyl adipate, ditridecyl adipate, dibutoxyethoxyethyl adipate, and phosphate-based phosphates such as trimethyl phosphate, triethyl phosphate, tributyl phosphate, tris(2-ethylhexyl) phosphate, triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, and 2-ethylhexyl diphenyl phosphate. Trimethic acid-based phosphates include tris(2-ethylhexyl) trimellitate. Epoxy-based phosphates include epoxidized soybean oil (ESBO), epoxidized linseed oil (ELSO), epoxidized fatty acid isobutyl, epoxidized fatty acid 2-ethylhexyl, and epoxidized fatty acid octyl ester. Such plasticizers can be used individually or in combination of two or more. The amount of such plasticizer to be added varies depending on the type of plasticizer, but generally, 1 to 60 parts by mass is preferred per 100 parts by mass of the resin composition (A) and thermoplastic resin (B).

[0038] Examples of the lubricants include fatty acids containing linear or branched alkyl groups, alkenyl groups, or hydroxyalkyl groups, or their metal salts, as fatty acid-based lubricants; butyl stearate and stearyl stearate as fatty acid esters; stearyl alcohol as alcohols; monoglyceride stearate as glycerin esters; amides such as stearate amide, oleate amide, erucate amide, methylenebisstearate amide, and ethylenebisstearate amide; and hydrocarbons such as liquid paraffin, paraffin wax, and fine particles of acrylic crosslinked materials. Such lubricants can be used individually or in combination of two or more, and the amount added is preferably 0.5 to 5 parts by mass, and more preferably 1 to 3 parts by mass, per 100 parts by mass of the resin composition (A) and thermoplastic resin (B).

[0039] The aforementioned pigments include inorganic pigments and organic pigments. Inorganic pigments include titanium white (titanium dioxide), calcium carbonate, clay, talc, precipitated barium sulfate and barite powder, white carbon, pearl pigments (bismuth oxychloride, basic lead carbonate, titanium oxide-coated mica, etc.), metal powder pigments (aluminum powder, copper powder, brass powder, gold powder, lead powder, tin powder, zinc powder, nickel powder, stainless steel powder, etc.), zinc oxide, zinc sulfide, cadmium-based pigments, lead yellow, lead-based pigments, phosphate-based pigments, chromate-based pigments, molybdate-based pigments, mica-like iron oxide, zinc powder, cuprous oxide, carbon black, iron oxide (iron black), yellow iron oxide, red iron oxide (synthetic or natural), brown iron oxide, Prussian blue, ultramarine blue, chromium oxide, and composite oxide pigments (titanium-antimony-nickel composite oxide, iron-zinc composite oxide, etc.). Organic pigments (such as tan-barium-nickel composite oxides and cobalt-aluminum-chromium composite oxides) can be broadly divided into azo pigments and polycyclic pigments based on their chemical structure. Examples of azo pigments include soluble azo pigments such as Lake Red C, Lysol Red BA, Lysol Red CA, Lysol Red SR, Brilliant Carmine 6B, Permanent Red 2B, Bon Red, Bordeaux 10B, and Pigment Rubin G. Examples of insoluble azo pigments include Para Red, Naphthol Orange, Brilliant Fast Scarlet, Naphthol Red FRR, Naphthol Red M, Fast Yellow G, Benzimidazolone Yellow H3G, Disazo Yellow HR, and Balkan Orange. Examples of condensation-type azo pigments include Condensed Azo Yellow 166 and Condensed Azo Red BR. Examples of polycyclic pigments include phthalocyanine pigments such as metal-free phthalocyanine blue, phthalocyanine blue (α-type), and highly chlorinated phthalocyanine green, and condensed polycyclic pigments such as anthencelon orange, indigo blue, perinone orange, quinophthalone yellow, dioxazine violet 37, unsubstituted quinacridone red (γ-type), quinacridone magenta, isoindolinone yellow G, nickel complex orange, isoindoline yellow 139, and diketopyrrolopyrrole red 255.Other pigments include fluorescent pigments, aniline black, and alkaline blue toner. The amount added is preferably 0.05 to 30 parts by mass, and more preferably 0.1 to 20 parts by mass, per 100 parts by mass of the resin composition (A) and thermoplastic resin (B), so as not to reduce the strength of the resin.

[0040] Examples of the surfactants include known anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants. Examples of anionic surfactants include alkyl sulfates and their salts such as sodium lauryl sulfate, potassium lauryl sulfate, sodium myristyl sulfate, potassium myristyl sulfate, sodium cetyl sulfate, sodium stearyl sulfate, sodium oleyl sulfate, and triethanolamine lauryl sulfate; alkyl ether sulfates and their salts such as sodium polyoxyethylene lauryl ether sulfate, sodium polyoxyethylene cetyl ether sulfate, sodium polyoxyethylene oleyl ether sulfate, and triethanolamine polyoxyethylene lauryl ether sulfate; alkylaryl ether sulfates and their salts such as sodium polyoxyethylene octylphenyl ether sulfate; sodium polyoxyethylene laurate amide ether sulfate, triethanolamine polyoxyethylene laurate amide ether sulfate, sodium polyoxyethylene myristic acid amide ether sulfate, and sodium polyoxyethylene oleic acid amide ether sulfate. Alkylamide sulfates and their salts, such as sodium polyoxyethylene coconut oil fatty acid amide ether sulfate and sodium oleic acid amide ether sulfate; acyl ester sulfates and their salts, such as sodium hydrogenated coconut oil fatty acid glycerin sulfate; alkyl sulfonic acids and their salts, such as sodium lauryl sulfonate, sodium myristyl sulfonate, and sodium coconut oil alkyl sulfonate; alkylbenzene sulfonic acids and their salts, such as sodium dodecylbenzenesulfonate and dodecylbenzenesulfonate triethanolamine; alkylnaphtha Lensulfonic acid and its salts; Formalin condensation sulfonic acid and its salts, such as formalin polycondensates of naphthalene sulfonates; Sulfosuccinic acid and its salts, such as disodium lauryl sulfosuccinate, sodium di-2-ethylhexyl sulfosuccinate, disodium lauryl polyoxyethylene sulfosuccinate, and disodium oleamide sulfosuccinate; α-olefin sulfonic acid and its salts, such as sodium dodecenesulfonate, sodium tetradecenesulfonate, potassium dodecenesulfonate, and potassium detrandecenesulfonate;α-sulfo fatty acid esters and their salts such as α-sulfolaurate methyl ester, α-sulfomyristate methyl ester, α-sulfolaurate (EO)n methyl ester; sodium lauroyl-N-methyltaurate, potassium lauroyl-N-methyltaurate, lauroyl-N-methyltaurate triethanolamine, sodium myristoyl-N-methyltaurate, myristoyl-N-methyltaurate triethanolamine, potassium coconut oil fatty acid acyl-N-methyltaurate, sodium coconut oil fatty acid acyl-N-methyltaurate N-acylmethyl-taurine and its salts, such as acetyl-N-methyltaurinetriethanolamine from coconut oil fatty acid; potassium acyl-glutamate from coconut oil fatty acid, sodium acyl-glutamate from coconut oil fatty acid, triethanolamine from coconut oil fatty acid, sodium lauroyl-glutamate, potassium myristoyl-glutamate, sodium myristoyl-glutamate, sodium palm oil fatty acid acyl-glutamate and its salts; sodium N-lauroylglycine, N-mil N-acylglycines and their salts, such as ristoylglycine triethanolamine, sodium N-coconut oil fatty acid acyl-glycine, potassium N-coconut oil fatty acid acyl-glycine; acyl isethionic acids and their salts, such as sodium lauroyl isethionate, sodium myristoyl isethionate, sodium coconut oil fatty acid acyl isethionate; alkyl sulfoacetates; alkyl ether phosphates and their salts, such as sodium polyoxyethylene lauryl ether phosphate, sodium polyoxyethylene cetyl ether phosphate, potassium polyoxyethylene myristyl phosphate, sodium polyoxyethylene oleyl ether phosphate, sodium dipolyoxyethylene oleyl ether phosphate; alkyl phosphates and their salts, such as alkylaryl ether phosphates and their salts; fatty acid amide ether phosphates and their salts, such as sodium polyoxyethylene lauryl amide ether phosphate; alkyl phosphates and their salts, such as sodium lauryl phosphate, sodium myristyl phosphate, sodium coconut oil fatty acid phosphate, potassium myristyl phosphate, triethanolamine lauryl phosphate, diethanolamine oleyl phosphate;Examples include acyliminodiacetates and their salts, such as sodium lauroyliminodiacetate, triethanolamine lauroyliminodiacetate, sodium coconut oil fatty acid acyliminodiacetate, disodium lauroyliminodiacetate, and sodium palm kernel fatty acid iminodiacetate; ether carboxylic acids and their salts, such as sodium polyoxyethylene lauryl ether acetate, potassium polyoxyethylene myristyl ether acetate, triethanolamine polyoxyethylene palmityl ether acetate, sodium polyoxyethylene stearyl ether acetate, and sodium polyglyceryl lauryl ether acetate; acylated peptides, such as coconut oil fatty acid silk peptide; amide ether carboxylic acids and their salts, such as sodium polyoxyethylene lauric acid amide ether carboxylate, sodium polyoxyethylene myristic acid amide ether carboxylate, and triethanolamine polyoxyethylene coconut oil fatty acid amide ether carboxylate; acyl lactates; and alkenyl succinic acid and its salts.

[0041] Examples of cationic surfactants include monoalkyl quaternary ammonium salts such as lauryltrimethylammonium chloride, myristyltrimethylammonium chloride, palmityltrimethylammonium chloride, stearyltrimethylammonium chloride, oleyltrimethylammonium chloride, cetyltrimethylammonium chloride, behenyltrimethylammonium chloride, coconut oil alkyltrimethylammonium chloride, beef tallow alkyltrimethylammonium chloride, stearyltrimethylammonium bromide, coconut oil alkyltrimethylammonium bromide, and cetyltrimethylammonium methyl sulfate; and dialkyl quaternary ammonium salts such as dioctyldimethylammonium chloride, dilauryldimethylammonium chloride, and distearyldimethylammonium chloride. Examples include ammonium salts; triethylmethylammonium methyl carbonate; acylaminoalkyl quaternary ammonium salts such as lanolin fatty acid aminopropyl ethyldimethylammonium ethyl sulfate and lauroylaminoethyl methyldiethylammonium methyl sulfate; alkylisoquinolinium salts such as laurylisoquinolinium chloride; benzalkonium salts such as lauryldimethylbenzylammonium chloride and stearyldimethylbenzylammonium chloride; pyridinium salts such as cetylpyridinium chloride; imidazolinium salts; acyl basic amino acid alkyl ester salts such as N-cocoyl arginine ethyl ester pyrrolidone carboxylate and N-lauroyl lysine ethyl ester hydrochloride; primary amine salts such as laurylamine hydrochloride; secondary amine salts such as dilaurylamine acetate; and tertiary amine salts.

[0042] Examples of nonionic surfactants include polyoxyethylene alkyl ethers such as POE (polyoxyethylene) octyl ether, POE (2-ethyl-hexyl) ether, POE lauryl ether, POE myristyl ether, POE cetyl ether, POE stearyl ether, POE oleyl ether, POE isostearyl ether, POE behenyl ether, and polyoxyethylene cetyl stearyl diether; polyoxyethylene polyoxypropylene glycol types such as POE·POP (polyoxypropylene) butyl ether, POE·POP lauryl ether, POE·POP cetyl ether, and POE·POP glycol; polyoxyethylene aryl ethers such as POE octylphenyl ether, POE nonylphenyl ether, POE chlorophenyl ether, and POE naphthyl ether; POE hydrogenated castor oil ether; other ether-based surfactants such as POE lanolin alcohol ether and POE phytosterol; and POE glyceryl monostearate and POE glyceryl oleate. Polyoxyethylene glycerin fatty acid esters such as; polyoxyethylene sorbitan fatty acid esters such as POE sorbitan monolaurate, POE sorbitan monostearate, POE sorbitan tristearate, POE sorbitan monoisostearate; polyoxyethylene sorbitol fatty acid esters such as POE sorbitol hexastearate, POE sorbitol tetrastearate, POE sorbitol tetraoleate, POE sorbitol monolaurate; polyethylene glycol fatty acid esters such as polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol monooleic acid, polyethylene glycol distearate, polyethylene glycol dioleic acid, polyethylene glycol diisostearate; ether esters such as polyethylene glycol lanolin fatty acid esters; glycerin fatty acid esters such as glyceryl monostearate, self-emulsifying glyceryl monostearate, glyceryl monohydroxystearate, glyceryl distearate;Polyglycerin fatty acid esters such as diglyceryl monostearate, diglyceryl monooleate, diglyceryl dioleate, diglyceryl monoisostearate, tetraglyceryl monostearate, tetraglyceryl tristearate, tetraglyceryl pentastearate, hexaglyceryl monolaurate, hexaglyceryl monomyristate, decaglyceryl distearate, decaglyceryl diisostearate; sorbitan fatty acid esters such as sorbitan monolaurate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan tristearate, sorbitan monoisostearate; ethylene glycol fatty acid esters such as ethylene glycol monolaurate and ethylene glycol distearate; propylene glycol fatty acid esters such as propylene glycol monostearate and self-emulsifying propylene glycol monostearate; pentaerythritol fatty acid esters such as pentaerythritol monostearate and pentaerythritol monooleate. Examples include: esters; sugar derivatives such as maltitol hydroxy fatty acid ethers, alkylated polysaccharides, alkyl(poly)glucosides, and sugar esters; alkylglyceryl ethers such as α-monoisostearyl glyceryl ether; organic acid monoglycerides such as acetyl monoglycerides, lactate monoglycerides, and citrate monoglycerides; fatty acid alkanolamides such as coconut oil fatty acid monoethanolamide, lauroyl monoethanolamide, myristoyl monoethanolamide, lauroyl diethanolamide, coconut oil fatty acid diethanolamide, lauroyl isopropanolamide, myristoyl isopropanolamide, coconut oil fatty acid isopropanolamide, POE lauroyl monoethanolamide, coconut oil fatty acid methyl monoethanolamide, and coconut oil fatty acid methyl diethanolamide; POE alkylamines such as POE laurylamine and POE stearylamine; and amine oxides such as lauryldimethylamine oxide, cocodimethylamine oxide, and cocoamidopropyldimethylamine oxide.

[0043] Examples of amphoteric surfactants include carboxybetaine-type surfactants such as lauryldimethylbetaine, myristyldimethylbetaine, palmityldimethylbetaine, stearyldimethylbetaine, oleyldimethylbetaine, coconut oil alkyldimethylbetaine, laurylmethylethylbetaine, octadecyloxymethyldimethylbetaine, lauryldihydroxyethylbetaine, stearyldihydroxyethylbetaine, coconut oil alkyldihydroxyethylbetaine, lauramidopropyldimethylbetaine, myristicamidepropyldimethylbetaine, stearateamidepropyldimethylbetaine, oleamidepropyldimethylbetaine, and coconut oil fatty acid amidopropyldimethylbetaine;RN + H2CH2COO - Glycine-type compounds such as laurylglycine, stearylglycine, sodium lauryldiaminoethylglycine, alkylaminoethylglycine chloride, and coconut oil fatty acid acyl-N-carboxyethoxyethyl-N-carboxyethylethylenediamine disodium, indicated by (R: alkyl); RN + H2CH2CH2COO - Aminopropionic acid types such as lauryl-β-alanine and stearyl-β-alanine, indicated by (R: alkyl); sulfobetaine types such as sodium lauryl sulfoacetate, sodium tetradecenesulfonate, sodium di(2-ethylhexyl) sulfosuccinate, lauryldimethylhydroxypropyl sulfobetaine, myristyldimethylhydroxypropyl sulfobetaine, lauryldimethylpropyl sulfobetaine, coconut oil alkyldimethylpropyl sulfobetaine, and lauric acid amidopropyl dimethylhydroxypropyl sulfobetaine; RN + H2CH2CH2SO3 - (R: alkyl) indicates the sulfonic acid type; RN + H2CH2CH2OSO3 -Sulfate forms indicated by (R: alkyl); sodium laurylaminopropionate, sodium laurylaminodipropionate, N-lauroyl-N-hydroxyethyl-N'-dicarboxyethyl-ethylenediamine disodium, N-lauroyl-N-hydroxyethyl-N'-carboxyethyl-ethylenediamine sodium, N-lauroyl-N'-carboxymethyl-N'-hydroxyethylethylenediamine sodium, N-coconut fatty acid acyl-N'-carboxyethyl-N'-hydroxyethylethylenediamine sodium, N-lauroyl-N-hydroxyethyl-N'-dicarboxymethyl-ethylenediamine disodium, N-lauroyl-N-hydroxyethyl-N'- Aminocarboxylate salt types such as carboxymethyl-ethylenediamine sodium, N-hydroxydodecyl-N-polyoxyethylene-N'-carboxyethyl-N'-polyoxyethyleneethylenediamine sodium, coconut fatty acid acyl-N-hydroxyethylethylenediamine sodium; imidazoline types such as 2-lauryl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine, 2-myristyl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine, 2-stearyl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine, 2-coconut oil alkyl-N-carboxymethyl-N-hydroxyethylimidazolinium betaine; RN + H2CH(CH3)P(OH)O2 - Examples include phosphate-type compounds represented by (R: alkyl); lecithin; and aminoacetic acid betaine types such as lauryldimethylaminoacetic acid betaine and coconut oil fatty acid amidopropyldimethylaminoacetic acid betaine.

[0044] In the present invention, the amount of surfactant added is preferably 0.05 to 10 parts by mass, and more preferably 0.1 to 3 parts by mass, per 100 parts by mass of the resin composition (A) and thermoplastic resin (B), from the viewpoint of preventing the surfactant from bleeding to the interface of the molded body for transporting electronic components.

[0045] Examples of the aforementioned antioxidants include phenolic, phosphite, and thioether-based antioxidants. Phenolic antioxidants include 1,3,5-tris(3',5'-di-tert-butyl-4'-hydroxybenzyl)isocyanuric acid, 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, butylidenebis(methyl-butylphenol), 3-(4'-hydroxy-3',5'-di-tert-butylphenyl)propionic acid-n-octadecyl, and pentaerythritol. Examples include tetrakis[3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate], 2,2'-dimethyl-2,2'-(2,4,8,10-tetraoxaspiro[5.5]undecane-3,9-diyl)dipropane-1,1'-diyl=bis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate], and 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene. Phosphite-based phosphates include 3,9-bis(octadecyloxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane, 3,9-bis(2,6-di-tert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane, and 2,4,8,10-tetra-tert-butyl-6-[(2-ethylhexane-1-yl)oxy]-12H-dibenzo[d Examples include [1,3,2]dioxaphosphosine, tris(2,4-di-tert-butylphenyl) phosphite, trisnonylphenyl phosphite, tetraalkyl(C=12~15)=[propane-2,2-diylbis(4,1-phenylene)]=bis(phosphite), 2-ethylhexyl=diphenyl=phosphite, diphenylisodecyl phosphite, triisodecyl=phosphite, and triphenyl phosphite.Examples of thioethers include 2,2-bis({[3-(dodecylthio)propionyl]oxy}methyl)-1,3-propanediyl=bis[3-(dodecylthio)propionate] and ditridecane-1-yl=3,3'-sulfandiyldipropanoate. One type can be used alone or two or more types can be used in combination. The amount added is preferably 0.03 to 5 parts by mass, and more preferably 0.05 to 3 parts by mass, per 100 parts by mass of the resin composition (A) and thermoplastic resin (B).

[0046] The UV absorbers include 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]benzotriazole, 2-[2-hydroxy-5-(1,1,3,3-tetramethylbutyl)phenyl]benzotriazole, 6,6'-bis(2H-benzotriazol-2-yl)-4,4'-bis(2,4,4-trimethylpentan-2-yl)-2,2'-methylenediphenol, 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2 Examples include -(2'-hydroxy-3'-t-butyl-5'-methylphenyl)-5-chlorobenzotriazole, 6,6',6''-(1,3,5-triazine-2,4,6-triyl)tris[3-(hexyloxy)-2-methylphenol], and 2-hydroxy-4-n-octyloxybenzophenone. The amount added is preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 3 parts by mass, per 100 parts by mass of the resin composition (A) and thermoplastic resin (B).

[0047] Examples of the antibacterial agents include organic antibacterial agents such as chlorine-based, iodine-based, phenol-based, imidazole-based, thiazole-based, or quaternary ammonium compounds; metals such as silver and copper supported on inorganic compounds such as zeolite or zirconium phosphate; and metal oxides such as zinc oxide and titanium oxide. These can be used individually or in combination, and the amount added is preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 3 parts by mass, per 100 parts by mass of the resin composition (A) and thermoplastic resin (B).

[0048] Examples of the drying agent include zeolite-based, alumina-based, silica gel-based, clay-based such as desiccant clay, sulfate compounds such as magnesium sulfate, calcium oxide, and calcium chloride. These can be used individually or in combination, and the amount added is preferably 0.05 to 20 parts by mass, and more preferably 0.1 to 10 parts by mass, per 100 parts by mass of the resin composition (A) and thermoplastic resin (B).

[0049] The aforementioned alcohols include, as monohydric alcohols, for example, methyl alcohol, ethyl alcohol, propyl alcohol, n-butyl alcohol, isobutyl alcohol, tertiary butyl alcohol, isoamyl alcohol, octyl alcohol, 2-ethylhexyl alcohol, lauryl alcohol, tridecyl alcohol, cetyl alcohol, stearyl alcohol, isostearyl alcohol, synthetic alcohols (e.g., Ziegler alcohol, oxo alcohol), aliphatic saturated alcohols having straight or side chains, allyl alcohol, clotyl alcohol, propagyl alcohol, oleyl alcohol, linoleyl alcohol, aliphatic unsaturated alcohols, fragrant alcohol, tallow-reduced alcohol, coconut oil-reduced alcohol, aliphatic saturated and unsaturated alcohols, cyclopentanol, cyclohexanol, etc. Examples of alicyclic alcohols, aromatic alcohols such as benzyl alcohol and cinnamyl alcohol, dihydric alcohols such as hexamethylene glycol, tetramethylene glycol, ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, 1,3-butanediol, 1,4-butanediol, 4,4-dihydroxyphenylpropane, and 4,4-dihydroxyphenylmethane, and trihydric or higher polyhydric alcohols such as glycerin, diglycerin, trimethylolpropane, 1,2,5-hexanetriol, 1,2,6-hexanetriol, sorbitol, and pentaerythritol can be listed. The amount added is preferably 0.005 to 1 part by mass, and more preferably 0.01 to 0.5 parts by mass, per 100 parts by mass of the resin composition (A) and thermoplastic resin (B).

[0050] [Molded body for transporting electronic components] A molded article for transporting electronic components, obtained by molding the resin composition (A) of the present invention, can be obtained by any method, such as pre-mixing the polyether block amide (b) and block copolymer (c) with the thermoplastic resin (a) and then adding the mixture to the thermoplastic resin (a) and heating and mixing, or by adding the polyether block amide (b) and block copolymer (c) separately to the thermoplastic resin (a) and then heating and mixing. For example, the thermoplastic resin (a) and polyether block amide (b) may be mixed using a twin-screw extruder, and then the block copolymer (c) may be added. A single-screw extruder, twin-screw extruder, or multi-screw extruder can be used for the heating and mixing method, but it is preferable to use a twin-screw extruder in terms of cost and dispersibility.

[0051] Furthermore, the molded body for transporting electronic components according to the present invention can also be obtained via a masterbatch. For example, a polyether block amide (b) and a block copolymer (c) can be added to a thermoplastic resin (a), heated, and mixed to form a masterbatch. In particular, using a masterbatch allows for uniform dispersion of each component when the molded body is processed.

[0052] As specific embodiments of the molded body for transporting electronic components of the present invention, in addition to a molded body consisting only of a resin composition (A), in a molded body for transporting electronic components which is formed by molding a laminate in which the resin composition (A) is used as a surface layer and laminated on a base layer made of a thermoplastic resin (B), the laminate configuration can preferably include a layer configuration in which the resin composition (A) is arranged on one side of the base layer ((A) surface layer / (B) base layer), or a three-layer configuration in which the resin composition (A) is arranged on both sides of the thermoplastic resin (B) that is the base layer ((A) surface layer / (B) base layer / (A) surface layer).

[0053] Furthermore, in the molded body for transporting electronic components of the present invention, the thickness of the constituent resin layer is not particularly limited and may be set appropriately depending on the manner of use. For example, in the case of a tray-shaped or tape-shaped molded body, the thickness is preferably about 0.2 to 3.0 mm in the case of a single-layer material, and in the case of a laminated material, for example, in the case of a single-area layer configuration of (A) layer ((A) surface layer / (B) base material), the surface layer (A) is preferably about 0.05 to 2.0 mm / base layer (B) is preferably about 0.1 to 5.0 mm, and in the case of a double-sided laminated configuration ((A) surface layer / (B) base material layer / (A) surface layer), the layer (A) is preferably about 0.05 to 2.0 mm / layer (B) is preferably about 0.1 to 5.0 mm / layer (A) is preferably about 0.05 to 2.0 mm. In the case of the above laminated body, the proportion of the resin composition (A) in the total wall thickness is preferably about 5 to 30% in the case of a single-area layer and about 5 to 30% in the case of a double-sided laminate.

[0054] As a method for forming the molded body for transporting electronic components of the present invention, any molding method commonly used for this type of molded body can be used without particular limitation. For example, when forming a tray, the resin single layer or laminated sheet formed by extrusion or co-extrusion may be molded into a tray shape by vacuum forming, pressure forming, plug forming, press forming, etc. In the case of a single layer, it can also be formed directly from the resin material by injection molding. Furthermore, in the case of a laminate, in addition to co-extrusion, the layers (A) layer / (B) layer and (B) layer / (A) layer may be joined using adhesive resin, and a coating layer or the like may also be interposed. In addition, vacuum forming is preferably used for tape-shaped molded bodies because it is easy to form shapes such as bumps and protrusions for holding (fixing) and placing electronic components.

[0055] In the molded articles for transporting electronic components of the present invention, when heating, mixing, or heat-molding in an extruder or the like, it is desirable to mix the thermoplastic resin (a), polyether block amide (b), thermoplastic resin (B), and block copolymer (c) at a temperature 10 to 30°C or more above their melting or softening points. For example, in the case of polypropylene resins, it is preferable to mix them at 200 to 260°C, more preferably 210 to 250°C, and even more preferably 220 to 240°C, from the viewpoint of productivity and thermal degradation. Furthermore, in the case of polyethylene resins, it is preferable to mix them at 160 to 250°C, more preferably 170 to 240°C, and even more preferably 180 to 230°C, from the viewpoint of productivity and thermal degradation.

[0056] Molded bodies obtained from the molded body for transporting electronic components according to the present invention, such as bottles, films or sheets, hollow tubes, laminates, vacuum (pressure) molded containers, (mono, multi) filaments, nonwoven fabrics, and foams, can be suitably used in various forms, such as transport trays, boxes, containers, packaging bags, embossed carrier tapes, carrier tape reels, carrier tape cover tapes, and end tapes, for transporting silicon wafers, CPUs, IC chips, image sensors, camera modules, light-emitting diodes, DVDs, Blu-rays, memory, hard disks, and magnetic heads for hard disks. [Examples]

[0057] Next, the present invention will be described in more detail based on the examples. However, the present invention is not limited to these examples.

[0058] [Production Example 1] Synthesis of Amido Alcohols 3,205 g of methyl palmitate molten at 80°C was charged into a glass flask equipped with a nitrogen inlet tube, stirrer, and thermometer. While stirring, a pre-prepared mixture of 731 g of monoethanolamine and 64 g of 28% sodium methylate methanol solution was added dropwise over 5 hours. After maintaining the mixture at 80°C under a nitrogen atmosphere for 5 hours, unreacted monoethanolamine and methanol were removed by desolvent removal, yielding 3,560 g of viscous liquid. The amine value of the obtained viscous liquid, after subtracting the sodium methylate content, was 0.01 mg KOH / g. The IR spectrum showed an OH expansion of 3300 cm. -1 , NH telescopic 3100cm -1 , C=O telescopic 1650cm -1 , NH angle angle 1565cm -1 There was a characteristic absorption pattern.

[0059] [Production Example 2] Synthesis of Amido Alcohol Ethylene Oxide Adduct (1) 802 g of amide alcohol obtained in Production Example 1 was charged into a stainless steel autoclave equipped with a nitrogen inlet tube, stirrer, and thermometer (the same applies hereafter), and the mixture was thoroughly purged with nitrogen. After raising the temperature to 80°C while stirring, 470 g of ethylene oxide was introduced over 5 hours, and the mixture was aged at the same temperature for 2 hours to complete the reaction. An appropriate amount of adsorbent [product name: Kyoward (registered trademark) 700SL (manufactured by Kyowa Chemical Industry Co., Ltd.)] was then added for adsorption, and the mixture was filtered to obtain a pale yellow liquid. The hydroxyl value was 119 mg KOH / g, and the moisture content was 0.02%.

[0060] [Production Example 3] Synthesis of Amido Alcohol Ethylene Oxide Adduct (2) 267 g of amide alcohol obtained in Production Example 1 was charged into a stainless steel autoclave and thoroughly purged with nitrogen. After raising the temperature to 80°C while stirring, 493 g of ethylene oxide was introduced over 5 hours, and the reaction was completed by aging at the same temperature for 2 hours. An appropriate amount of Kyoward 700SL was then added for adsorption, and the mixture was filtered to obtain a pale yellow liquid. The hydroxyl value was 66 mg KOH / g, and the moisture content was 0.01%.

[0061] [Production Example 4] Synthesis of block copolymer (c-1) 815 g of polybutenyl succinic acid (saponification value 36 mg KOH / g), 12 g of amide alcohol ethylene oxide adduct (1) (hydroxyl value 119 mg KOH / g) obtained in Production Example 2, 197 g of amide alcohol ethylene oxide adduct (2) (hydroxyl value 66 mg KOH / g) obtained in Production Example 3, and 4 g of antioxidant [product name: ADEKA Stab (registered trademark) PEP-8 (manufactured by ADEKA Corporation), chemical name: 3,9-bis(octadecyloxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane] were charged into a stainless steel autoclave. After thoroughly purging with nitrogen and raising the temperature to 80°C while stirring, 60g of 48% KOH and 20g of potassium acetate aqueous solution were added. After further thorough nitrogen purging, the temperature was raised to 160°C, and then maintained under reduced pressure of 0.2kPa or less for 4 hours. The product was a viscous polymer. The obtained product was designated as block copolymer (c-1).

[0062] [Manufacturing Example 5] Synthesis of Acid-Modified Polypropylene 9,700 g of low molecular weight polypropylene with a manganese content of 3,300 and an average number of terminal double bonds of 0.9, along with 300 g of maleic anhydride, were charged into a stainless steel autoclave. The mixture was melted at 220°C under a nitrogen gas atmosphere and reacted for 10 hours. Subsequently, the excess maleic acid was removed by distillation under reduced pressure at 200°C for 4 hours to obtain maleic anhydride-modified polypropylene (one-terminal acid-modified polypropylene). The manganese content was 3,400, the saponification value was 30 mg KOH / g, and the degree of acid modification per molecule was 0.9.

[0063] [Production Example 6] Synthesis of block copolymer (c-2) 4,000 g of maleic anhydride-modified polypropylene prepared in Production Example 5, 750 g of amide alcohol ethylene oxide adduct (1) obtained in Production Example 2, 46 g of amide alcohol ethylene oxide adduct (2) obtained in Production Example 3, 13 g of antioxidant [product name: Irganox® 1010 (manufactured by BASF Japan Ltd.)], 90 g of 48% NaOH, and 100 g of ionized water were charged into a stainless steel autoclave. After thorough nitrogen purging, the temperature was raised to 220°C and stirred for 1 hour. The temperature was then maintained at 2 kPa or less for 6 hours to obtain the product. The obtained product was easy to handle and was a solid polymer. The obtained product was designated as block copolymer (c-2).

[0064] Example 1 (Extrusion molding, vacuum forming) 100 parts by mass of polypropylene resin (a-1) [product name: Novatec® MG03BD (manufactured by Nippon Polypropylene Co., Ltd.), MFR 30.0 g / 10 min], 3 parts by mass of polyether block amide (b-1) [product name: Pebax® 4033 (manufactured by Arkema Co., Ltd.)], and 10 parts by mass of the block copolymer (c-1) from Production Example 4 were kneaded in a twin-screw extruder at 200°C, and pelletized by water-cooled strand cutting to obtain resin composition (A) constituting the surface layer. For the base layer, polypropylene resin [product name: PL-500A (manufactured by Sun Allomer Co., Ltd.), MFR 3.0 g / 10 min] was used as the thermoplastic resin (B). Using the above materials, a two-type, three-layer co-extrusion machine (extruder A: 50mmφ, extruder B: 50mmφ, extruder C: 50mmφ, layer configuration = extruder A / extruder B / extruder C) was used. Resin composition (A) was fed into extruders A and C, and thermoplastic resin (B) into extruder B. At an extrusion temperature of 230°C, a laminated sheet was produced in which the surface layer, base layer, and surface layer were laminated in a ratio of 0.1:0.8:0.1 mm. The laminated sheet was further heated and softened, and then shaped into a container shape using a vacuum forming machine.

[0065] Examples 2-7, Comparative Examples 1-3 Laminated sheets were prepared in the same manner as in Example 1, except that the polyether block amide (b) and block copolymer (c) were blended as shown in Table 1, and each was evaluated. The evaluation results are shown in Table 1.

[0066] Example 8 A laminated sheet was prepared in the same manner as in Example 1, except that polyethylene resin (a-2) [product name: UBE Polyethylene® F224N (manufactured by Ube Maruzen Polyethylene Co., Ltd.), MFR 2.0 g / 10 min, 190°C] was used as the thermoplastic resin (a) and thermoplastic resin (B) in the surface layer (resin composition (A)), and polyether block amide (b) and block copolymer (c) were blended as shown in Table 1.

[0067] Examples 9-10, Comparative Examples 4-5 Laminated sheets were prepared in the same manner as in Example 8, except that the polyether block amide (b) and block copolymer (c) were blended as shown in Table 1, and each was evaluated. The evaluation results are shown in Table 1.

[0068] <Evaluation Method> (1) Moldability (ease of peeling from mold and cooling roll) In the examples and comparative examples, the adhesion of the laminated sheet surface to the mold or cooling roll during extrusion molding and vacuum forming was visually inspected. A ○ (○) indicated that no adhesion of the laminated sheet surface to the mold or cooling roll was present, while a × (×) indicated that even a small amount of the laminated sheet surface was present.

[0069] (2) Abrasion resistance Abrasion resistance tests were conducted by sliding the surface of a laminated sheet using Kimwipes (registered trademark) (manufactured by Nippon Paper Crecia Co., Ltd.). The test method involved manually sliding a Kimwipe over the surface of a 5cm x 3cm laminated sheet 10 times in the vertical direction with a light load (approximately 10g). Visual inspection revealed that 0 to 10 scratches on the surface were considered "good" (○), and 11 or more scratches were considered "bad" (×).

[0070] (3) Antistatic properties (surface resistivity) After leaving the laminated sheet in an environment of 23°C and 50% relative humidity for one day, the surface resistivity of the laminated sheet surface was measured using a resistivity meter [product name: High Resista (registered trademark) UP <MCP-HT450 type> (manufactured by Nitto Seiko Analytic Co., Ltd.)]. The smaller the numerical value, the better the antistatic property. The target surface resistivity (LogΩ / □) is 11.0 or less.

[0071] (4) Tray release property The stickiness (tackiness) of the laminated sheet surface was evaluated using a tactile measuring instrument [product name: Handy Lab Tester TL701 (manufactured by Trinity Lab Co., Ltd.)]. The smaller the numerical value, the better the tray release property. The target tackiness (Load (gf)) is 20 or less. When the measured value is 20 or less, the stickiness (tackiness) of the molded product surface is not felt, and even when multiple trays are stacked and stored, the release property between the trays is good.

[0072] (5) Comprehensive evaluation If the formability and abrasion resistance are ○, and the antistatic property and tray release property reach the target values, the comprehensive evaluation is ○. If the formability and abrasion resistance are ○ but the antistatic property or tray release property does not reach the target value, the comprehensive evaluation is ×.

[0073]

Table 1

[0074] As shown in Table 1, in Examples 1 to 10, molded bodies for transporting electronic components with excellent formability, abrasion resistance, tray release property, and antistatic property were obtained. On the other hand, in Comparative Examples 1 to 5, results that could satisfy all of the formability, abrasion resistance, tray release property, and antistatic property were not obtained. From the above results, it was confirmed that the molded body for transporting electronic components according to the present invention is excellent in antistatic property and formability, and is excellent in abrasion resistance and tray release property required for transporting electronic components.

Claims

1. Per 100 parts by mass of thermoplastic resin (a) Polyether block amide (b) 0.5 to 20 parts by mass 5 to 30 parts by mass of a block copolymer (c) represented by the following general formula (1) or general formula (2) A molded body for transporting electronic components, obtained by molding a resin composition (A) containing the above. 【Chemistry 1】 (In the formula, R １ is a polyolefin residue, A １ X is a divalent group having a polyoxyalkylene group. １ is -O- or -N(R ２ )-(wherein, R ２ ) B １ M represents a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkenyl group, an aryl group, an alkylaryl group, an acyl group, or a structure represented by the following general formula (3) or the following general formula (4). １ (This represents a hydrogen atom, alkali metal atom, alkaline earth metal atom, ammonium group, or organic ammonium group.) 【Chemistry 2】 (wherein, R ３ represents a polyolefin residue, A ２ represents a divalent group having a polyoxyalkylene group, and B ２ represents a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkenyl group, an aryl group, an alkylaryl group, an acyl group, or a structure represented by the following general formula (3) or the following general formula (4).) 【Transformation 3】 (In the formula, R ４ X is a polyolefin residue. ２ is -O- or -N(R ５ )-(wherein, R ５ (This represents a hydrogen atom or an alkyl group, alkenyl group, or acyl group having 1 to 22 carbon atoms.) M ２ (This represents a hydrogen atom, alkali metal atom, alkaline earth metal atom, ammonium group, or organic ammonium group.) 【Chemistry 4】 (In the formula, R ６ (This represents a polyolefin residue.)

2. The molded body for transporting electronic components according to claim 1, wherein the resin composition (A) is used as the surface layer, and the laminate is formed by laminating this on a base layer made of thermoplastic resin (B).

3. A molded article for transporting electronic components, wherein the thermoplastic resin (a) described in claim 1 is a polyolefin resin.

4. The molded body for transporting electronic components according to claim 1, wherein the molded body for transporting electronic components is a tray for transporting electronic components.

5. The molded body for transporting electronic components according to claim 1, wherein the molded body for transporting electronic components is an embossed carrier tape for transporting electronic components.

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