electrostatic chuck

Abstract

The present invention provides an electrostatic chuck capable of suppressing variations in the in-plane temperature distribution of a substrate. [Solution] The electrostatic chuck 10 comprises a dielectric substrate 100 having a first portion 101 including a surface 110 which is a mounting surface, and a second portion 102 which protrudes further outward from the outer peripheral end of the first portion 101 and is thinner than the first portion 101; a base plate 200 bonded to the dielectric substrate 100; and a bonding layer 300 that bonds the dielectric substrate 100 and the base plate 200. The bonding layer 300 includes a first bonding layer 310 and a second bonding layer 320 which surrounds the first bonding layer 310 in an annular shape from the outer peripheral side. The thermal conductivity of the second bonding layer 320 is higher than that of the first bonding layer 310. In this electrostatic chuck 10, in a top view, the inner peripheral end of the second bonding layer 320 is in a position that does not overlap with the first portion 101.

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