Semiconductor memory and substrate unit

JP2026106526APending Publication Date: 2026-06-30KIOXIA CORP

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
KIOXIA CORP
Filing Date
2024-12-18
Publication Date
2026-06-30

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    Figure 2026106526000001_ABST
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Abstract

One embodiment provides a semiconductor memory device and substrate unit that can improve the degree of freedom. [Solution] A semiconductor memory device according to one embodiment comprises a first substrate and a second substrate. The first substrate has a first portion, a second portion that is thinner than the first portion, and a plurality of first conductive portions provided in the second portion. The second substrate has a plurality of second conductive portions. The plurality of second conductive portions overlap with the plurality of first conductive portions when viewed from a first direction which is the thickness direction of the first substrate, and are each connected to the plurality of first conductive portions by solder.
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