Semiconductor memory and substrate unit
JP2026106526APending Publication Date: 2026-06-30KIOXIA CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- KIOXIA CORP
- Filing Date
- 2024-12-18
- Publication Date
- 2026-06-30
Smart Images

Figure 2026106526000001_ABST
Abstract
One embodiment provides a semiconductor memory device and substrate unit that can improve the degree of freedom. [Solution] A semiconductor memory device according to one embodiment comprises a first substrate and a second substrate. The first substrate has a first portion, a second portion that is thinner than the first portion, and a plurality of first conductive portions provided in the second portion. The second substrate has a plurality of second conductive portions. The plurality of second conductive portions overlap with the plurality of first conductive portions when viewed from a first direction which is the thickness direction of the first substrate, and are each connected to the plurality of first conductive portions by solder.
Need to check novelty before this filing date? Find Prior Art