Molding Management System

The molding management system addresses the inefficiency of existing abnormality detection in injection molding by directly analyzing cycle and condition data from the apparatus, enabling quick and effective detection of abnormalities for diverse production scenarios.

JP2026106569APending Publication Date: 2026-06-30SEIKO EPSON CORP

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SEIKO EPSON CORP
Filing Date
2024-12-18
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing technologies for detecting abnormalities in injection molding devices require the preparation of reference waveform data, which is time-consuming and not suitable for small-lot and multi-variety production or prototype product manufacturing.

Method used

A molding management system that includes an information processing device connected to a terminal device, acquiring cycle data and injection molding condition data to detect abnormality periods without preparing additional reference data, by analyzing first quantity information and target values from the injection molding apparatus.

Benefits of technology

Facilitates easy detection of abnormalities in injection molding apparatuses, reducing time and effort, and is applicable to small-lot and multi-variety production or prototype product manufacturing.

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Abstract

To provide a molding management system that can easily detect an abnormality in an injection molding machine without having to prepare any information other than the information obtained from the injection molding machine. [Solution] A molding management system that includes an information processing device and manages the production of products by an injection molding device, wherein the information processing device acquires cycle data for each cycle, which includes first quantity information indicating the value of a first quantity controlled by the injection molding device, and acquires injection molding condition data each time injection molding conditions are set, which includes first target value information indicating a first target value in the control of the first quantity by the injection molding device as one of the injection molding condition information indicating the injection molding conditions set in the cycle, and in response to a received first operation, displays abnormal occurrence period information on a display unit, which indicates at least a part of the period during which an abnormality occurred in the first cycle, based on the acquired first cycle data and the acquired first injection molding condition data.
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Description

Technical Field

[0001] This disclosure relates to a molding management system.

Background Art

[0002] Research and development have been conducted on technologies for managing the production of products in a production process including an injection molding process of products by an injection molding device.

[0003] Here, reference waveform data showing a plurality of waveforms serving as references as waveforms indicating temporal changes in the amount controlled by the injection molding device is prepared, and whether an abnormality has occurred in the injection molding device is detected based on whether the value of the amount is included within the range sandwiched by the plurality of waveforms shown by the prepared reference waveform data (see Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the technology as described in Patent Document 1, since reference waveform data has to be prepared to detect whether an abnormality has occurred in the injection molding device, it may take time and effort. This is not desirable as it is difficult to apply, for example, to small-lot and multi-variety production, production of prototype products for research, etc.

Means for Solving the Problems

[0006] To solve the above problems, one aspect of the present disclosure includes an information processing device that is communicably connected to a terminal device, and is a molding management system for managing the production of a product in a production process including an injection molding process of a product by an injection molding apparatus, wherein the information processing device acquires cycle data from the injection molding apparatus for each cycle, which includes first quantity information indicating the value of a first quantity controlled by the injection molding apparatus in the execution of a cycle in which injection molding is performed, and as one of the injection molding condition pieces of information indicating the injection molding conditions set in the injection molding apparatus in the cycle, the target in the control of the first quantity by the injection molding apparatus This molding management system acquires injection molding condition data, which includes first target value information indicating a first target value, from the injection molding apparatus each time the injection molding conditions are set in the injection molding apparatus, and in response to the first operation received, displays abnormal occurrence period information on the display unit, which indicates at least a portion of the period during which an abnormality occurred in the first cycle, based on the first cycle data from the cycle data acquired from the injection molding apparatus and the first injection molding condition data from the acquired injection molding condition data that is associated with the first cycle data. [Brief explanation of the drawing]

[0007] [Figure 1] This figure shows an example of the configuration of the molding management system 1. [Figure 2] This figure shows an example of a target value reception image P1. [Figure 3] This figure shows an example of an acceptable range image P2. [Figure 4] This figure shows an example of an abnormality detection result image P3. [Figure 5] This is a diagram showing an example of the first detailed information image P4. [Figure 6] This figure shows another example of an abnormality detection result image P3. [Figure 7] This figure shows an example of the second detailed information image P5. [Figure 8] This figure shows an example of the hardware configuration of the information processing device X. [Figure 9] This figure shows an example of the functional configuration of the information processing device X. [Figure 10] This diagram shows an example of the processing flow performed by the information processing device X in response to an received operation. [Modes for carrying out the invention]

[0008] <Embodiment> The embodiments of this disclosure will be described below with reference to the drawings.

[0009] <Overview of the Molding Management System> First, an overview of the molding management system according to the embodiment will be described.

[0010] The molding management system according to this embodiment manages the production of products in a production process that includes the injection molding process of products by an injection molding apparatus. The molding management system includes an information processing device. The information processing device is connected to a terminal device in a communicative manner. The information processing device also acquires cycle data from the injection molding apparatus for each cycle, which includes first quantity information indicating the value of a first quantity controlled by the injection molding apparatus during the execution of an injection molding cycle. Furthermore, the information processing device acquires injection molding condition data from the injection molding apparatus each time injection molding conditions are set in the injection molding apparatus, which includes first target value information indicating the first target value, which is the target value in the control of the first quantity by the injection molding apparatus, as one of the injection molding condition information indicating the injection molding conditions set in the injection molding apparatus during the cycle. Then, in response to the received first operation, the information processing device displays abnormality period information on the display unit, which indicates at least a portion of the period during which an abnormality occurred in the first cycle, based on the first cycle data from the cycle data acquired from the injection molding apparatus and the first injection molding condition data from the acquired injection molding condition data that is associated with the first cycle data. As a result, the molding management system can easily detect that an abnormality has occurred in the injection molding apparatus without having to prepare any information other than the information acquired from the injection molding apparatus.

[0011] The configuration of the molding management system according to this embodiment, and the processing performed by the server included in the molding management system, will be described in detail below.

[0012] <Configuration of the molding management system> The configuration of the molding management system according to the embodiment will be described below, using molding management system 1 as an example.

[0013] Figure 1 shows an example of the configuration of the molding management system 1.

[0014] The molding management system 1 is a type of Manufacturing Execution System (MES). For example, the molding management system 1 includes one or more managed devices 10, an information processing device 20, and a server 30. However, the molding management system 1 may be configured to omit some or all of the one or more managed devices 10. Also, the molding management system 1 may be configured to include the server 30 but not the information processing device 20. Furthermore, the molding management system 1 may be configured to include the information processing device 20 but not the server 30. In addition, in the molding management system 1, the information processing device 20 may be configured integrally with the server 30. Below, as an example, a case in which the molding management system 1 includes multiple managed devices 10 as one or more managed devices 10 will be described. Also, below, as an example, a case in which the molding management system 1 includes both the information processing device 20 and a server 30 separate from the information processing device 20 will be described. At least one of the information processing device 20 and the server 30 is an example of an information processing device.

[0015] Each of the plurality of managed devices 10 included in the molding management system 1 is a device managed by the molding management system 1. In FIG. 1, for the sake of convenience of explanation, each of these plurality of managed devices 10 is denoted by the same reference numeral. However, some or all of these plurality of managed devices 10 may be different types of devices from each other. Among these plurality of managed devices 10, at least one injection molding device that performs injection molding of a production product using a resin such as plastic is included. The injection molding device 11 shown in FIG. 1 is an example of such an injection molding device. Note that among these plurality of managed devices 10, an injection molding device that performs metal powder injection molding (MIM; Metal Injection Molding) of a production product may be included. Hereinafter, for the sake of convenience of explanation, injection molding of a production product using a resin such as plastic will be simply referred to as injection molding and described. Further, hereinafter, an injection molding device that performs injection molding of a production product using a resin such as plastic will be simply referred to as an injection molding device and described. Also, at least one injection molding device included in the plurality of managed devices 10 may be a device that performs injection molding using a material other than resin and metal. Further, the plurality of managed devices 10 include, in addition to the injection molding device, for example, peripheral equipment of the injection molding device and the like. The peripheral equipment of the injection molding device is, for example, a material supply device, a transfer device, a cleaning device, a sintering device, etc., but is not limited thereto. Here, the material supply device is a device that supplies the material used by the injection molding device for injection molding of the production product to the injection molding device. The cleaning device is a device that transfers the production product injection-molded by the injection molding device. The cleaning device is a device that cleans the production product injection-molded by the injection molding device. The sintering device is a device that sinters the production product after being cleaned by the cleaning device.

[0016] The molding management system 1 manages the production of products in a production process that includes the injection molding process of products by injection molding machines included in a plurality of controlled devices 10. Here, the injection molding machines included in the plurality of controlled devices 10 may have any configuration as long as they are capable of producing products by injection molding. In the following, for the sake of explanation, the process in which an injection molding machine performs injection molding of a product once will be referred to as a cycle. Also, in the following, for the sake of explanation, the cavity inside the mold attached to the injection molding machine will be referred to as a cavity. That is, the injection molding machine injects material into the cavity inside the mold attached to the injection molding machine and applies pressure to the material inside the cavity to perform injection molding of the product.

[0017] Here, one or more injection molding machines included in the multiple controlled devices 10 are equipped with an extrusion unit that, in the injection molding process, pushes the material used for injection molding of the product into a cavity in a mold attached to the injection molding machine. The extrusion unit is, for example, a screw that moves its position back and forth within the cylinder by rotating within the cylinder. The extrusion unit may also be a component that moves its position back and forth within the cylinder by hydraulics, a linear actuator, or the like, instead of a screw. As the extrusion unit moves forward within the cylinder, the material is pushed out from the cylinder's injection port toward the cavity in the mold. For the sake of explanation, the extrusion unit provided in the injection molding machine will be referred to as a screw below.

[0018] In addition, one or more injection molding devices included in the plurality of managed devices 10 have one or more detection units attached thereto. The one or more detection units detect an amount controlled by the injection molding device in each cycle. The amount controlled by the injection molding device in each cycle is, for example, the position of the screw, the injection speed which is the speed at which the screw injects the material into the cavity in the mold, the rotational speed of the screw, the injection holding pressure which is the pressure in the mold held by the screw, the temperature in the mold, etc., and is part or all of these, but is not limited thereto. Hereinafter, for convenience of explanation, the amount detected by each of the one or more detection units attached to each of the one or more injection molding devices included in the plurality of managed devices 10 will be simply referred to as the detected amount. A detection unit that detects a certain detected amount among the one or more detection units attached to a certain injection molding device is, for example, a sensor that detects the detected amount, but is not limited thereto. Note that the one or more detection units may be configured to include a detection unit that detects the quality of the produced product. This is because the quality of the produced product is also controlled by the injection molding device in each cycle. In this case, the detection unit includes, for example, an imaging unit capable of imaging the produced product and is a device that detects the quality of the produced product, but is not limited thereto. Also, in this case, for example, the amount indicating the quality of the produced product detected by the detection unit is, for example, any one of a plurality of predetermined values arranged in descending order from the highest quality, but is not limited thereto.

[0019] The information processing device 20 acquires cycle data for each cycle from each of the one or more injection molding devices included in the plurality of managed devices 10. More specifically, the information processing device 20 acquires cycle data from each of the one or more injection molding devices every time each cycle ends. Hereinafter, for convenience of explanation, the cycle data acquired when a certain cycle ends will be referred to as the cycle data of that cycle. Also, hereinafter, for convenience of explanation, the cycle that ends when a certain cycle data is acquired will be referred to as the cycle of that cycle data.

[0020] Cycle data acquired from an injection molding apparatus in a given cycle includes one or more cycle-related pieces of information obtained in accordance with the execution of the cycle by the injection molding apparatus, apparatus identification information that identifies the injection molding apparatus, and first date and time information indicating the date and time the data was acquired from the injection molding apparatus to the information processing device 20. However, the apparatus identification information is, for example, an ID (Identifier) ​​that identifies the injection molding apparatus, but it may also be other information that can identify the injection molding apparatus, such as an IP (Internet Protocol) address assigned to the injection molding apparatus. The first date and time information may also be a timestamp or other information indicating the date and time. In addition to the one or more cycle-related pieces of information, the apparatus identification information and the first date and time information, the cycle data may also include other information. Furthermore, the apparatus identification information may be included in the cycle data as one of the one or more cycle-related pieces of information. Below, as an example, the case in which the apparatus identification information is included in the cycle data as one of the one or more cycle-related pieces of information will be described.

[0021] Each cycle-related piece of information included in the cycle data acquired from an injection molding apparatus in a given cycle includes, in addition to apparatus identification information that identifies the injection molding apparatus, one or more pieces of detected quantity information. Each of these one or more pieces of detected quantity information is information indicating the value of each detected quantity controlled by the injection molding apparatus. The detected quantity information indicating the value of a certain detected quantity includes time-series information indicating the time series of the detected quantity and feature value information indicating one or more type of feature value for the detected quantity. Here, the one or more type of feature value for a certain detected quantity is, for example, at least one of the minimum value, maximum value, mean, variance, standard deviation of the detected quantity, the start value of the period during which the detected quantity was detected, and the end value of the period. In other words, the one or more type of feature value is a value that indicates the waveform characteristics showing the temporal change of the detected quantity. Note that the one or more type of feature value may include other statistically processed values ​​for the detected quantity in place of some or all of these, or in addition to all of these. Note that the injection molding apparatus or the information processing apparatus 20 may include the feature value information in the detected quantity information. This is because the information processing device 20 can calculate one or more feature values ​​based on the time-series information. Furthermore, the detected quantity information does not need to include the time-series information, as long as it includes the feature value information. Below, as an example, we will explain the case where the detected quantity information includes both the time-series information and the feature value information. Note that the feature value information may also be the time-series information. This is also because the information processing device 20 can calculate one or more feature values ​​based on the time-series information.

[0022] Furthermore, the cycle-related information included in the cycle data acquired from a certain injection molding apparatus in a given cycle may include, in addition to the apparatus identification information and one or more feature value pieces of information, other information. This other information may include, but is not limited to, some or all of, operating status information, production quantity information, etc. Here, the operating status information included in the cycle data as cycle-related information indicates the operating status of the injection molding apparatus. Also, the production quantity information included in the cycle data as cycle-related information indicates the number of products injected and molded by the injection molding apparatus in that cycle.

[0023] The cycle data described above can be distinguished by a combination of device identification information and first date and time information. However, if only one injection molding machine is connected to the information processing device 20, the cycle data may not include device identification information. This is because, in this case, each cycle data can be distinguished solely by the first date and time information.

[0024] When the information processing device 20 acquires certain cycle data, it stores the acquired cycle data and also outputs the acquired cycle data to the server 30. In this way, the information processing device 20 can also store the acquired cycle data in the server 30.

[0025] Furthermore, the information processing device 20 acquires injection molding condition data from each of the one or more injection molding devices included in the multiple managed devices 10, each time injection molding conditions are set for an injection molding device.

[0026] Here, the injection molding condition data acquired from a certain injection molding apparatus is information that associates one or more injection molding condition pieces indicating the injection molding conditions set in the injection molding apparatus, apparatus identification information that identifies the injection molding apparatus, and second date and time information indicating the date and time the data was acquired from the injection molding apparatus to the information processing device 20. However, the apparatus identification information is, for example, an ID that identifies the injection molding apparatus, but it may also be other information that can identify the injection molding apparatus, such as an IP address assigned to the injection molding apparatus. The second date and time information may also be a timestamp or other information that indicates the date and time. The injection molding condition data may also include other information in addition to the one or more injection molding condition pieces, the apparatus identification information, and the second date and time information. Furthermore, the apparatus identification information may be included in the injection molding condition data as one of the one or more injection molding condition pieces. Below, as an example, we will describe the case in which the apparatus identification information is included in the injection molding condition data as one of the one or more injection molding condition pieces.

[0027] The injection molding condition data obtained from a certain injection molding apparatus includes one or more pieces of injection molding condition information, in addition to apparatus identification information that identifies the injection molding apparatus, one or more pieces of target value information. Each of these one or more pieces of target value information indicates one or more target values ​​in the control of each detected quantity by the injection molding apparatus. Therefore, the target value information indicating one or more target values ​​for a certain detected quantity is associated with that detected quantity. The method of associating the detected quantity with the target value information may be a known method or a method to be developed in the future. The reason why the one or more pieces of target value information are included as injection molding condition information in the injection molding condition data is that in each cycle, the injection molding apparatus controls the detected quantity so that the value of the detected quantity matches the target value of the detected quantity. The reason why there is one or more target values ​​for each detected quantity is that there may be multiple target values ​​that bring each detected quantity closer to the target value in the control by the injection molding apparatus in each cycle. For example, the injection speed, which is the speed at which the screw injects the material into the cavity in the mold, changes in multiple stages during the injection molding process of each cycle. In such cases, there will be multiple target values ​​for the detected quantity. The target value information for a given detected quantity indicates one or more of these target values. Therefore, the injection molding condition data includes the same number of target value pieces as the number of detection units attached to the injection molding apparatus, as part of the injection molding condition information. For the sake of explanation, below, each of the one or more target values ​​for a given detected quantity will be referred to as the target value corresponding to that detected quantity. Therefore, for the sake of explanation, below, the detected quantity will be referred to as the detected quantity corresponding to the one or more target values.

[0028] Furthermore, the injection molding condition data obtained from a certain injection molding apparatus includes one or more injection molding condition pieces of information, in addition to apparatus identification information that identifies the injection molding apparatus and one or more target value pieces of information, and abnormality judgment condition information associated with each of the target values ​​set as injection molding conditions for the injection molding apparatus. The abnormality judgment condition information associated with a certain target value is information that indicates the abnormality judgment condition that the value of the detected quantity satisfies when no abnormality occurs in the value of the detected quantity in the control that the injection molding apparatus uses to match the value of the detected quantity to the target value. The method for associating the target value with the abnormality judgment condition information may be a known method or a method to be developed in the future. Furthermore, the abnormality judgment condition may be any condition that the value of the detected quantity satisfies when no abnormality occurs in the value of the detected quantity in the control.

[0029] Here, we will explain the abnormality determination condition information using an example of abnormality determination condition information X3 associated with a target value X2 corresponding to a certain detected quantity X1, and an injection molding machine X4 that performs control to make the value of the detected quantity X1 match the target value X2. In the control by the injection molding machine X4 to make the value of the detected quantity X1 match the target value X2, an abnormality in the value of the detected quantity X1 means that the quality of the product has deteriorated in the cycle executed by the injection molding machine X4, or that an abnormality occurred in the injection molding machine X1 in that cycle. Whether or not such an abnormality has occurred can be determined by whether or not the value of the detected quantity X1 deviates from the allowable range of deviation of the value of the detected quantity X1 from the target value X2 in the control by the injection molding machine X4 to make the value of the detected quantity X1 match the target value X2. In this case, the abnormality determination condition indicated by the abnormality determination condition information X3 is that, in the control of the injection molding machine X4 to match the value of the detected amount X1 to the target value X2, the value of the detected amount X1 does not deviate from the allowable range of deviation of the value of the detected amount X1 from the target value X2. In this case, the information processing device 20 determines that there is no abnormality in the value of the detected amount X1 if, in the control of the injection molding machine X4 to match the value of the detected amount X1 to the target value X2, the value of the detected amount X1 does not deviate from the allowable range of deviation of the value of the detected amount X1 from the target value X2. On the other hand, in this case, the information processing device 20 determines that there is an abnormality in the value of the detected amount X1 if, in the control of the injection molding machine X4 to match the value of the detected amount X1 to the target value X2, the value of the detected amount X1 deviates from the allowable range of deviation of the value of the detected amount X1 from the target value X2. However, if the tolerance range for the deviation of the detected quantity X1 from the target value X2 is 0, then a deviation of the detected quantity X1 from this tolerance range may mean, for example, that the detected quantity X1 exceeds the target value X2, that the detected quantity X1 falls below the target value X2, or that it signifies other events corresponding to the difference between the detected quantity X1 and the target value X2.In other words, if the tolerance range for the deviation of the detected quantity X1 from the target value X2 is 0, then the fact that the detected quantity X1 does not deviate from this tolerance range may mean, for example, that the detected quantity X1 does not exceed the target value X2, or that the detected quantity X1 does not fall below the target value X2, or it may mean other events corresponding to the difference between the detected quantity X1 and the target value X2. For the sake of explanation, below, the tolerance range for the deviation of a detected quantity from a target value corresponding to a certain detected quantity will be referred to as the tolerance range of the target value.

[0030] Thus, the abnormality determination condition indicated by the abnormality determination condition information X3 associated with the target value X2 is a value used to monitor the deviation of the detected amount X1 from the target value X2. For this reason, the abnormality determination condition can be rephrased as a monitoring condition accepted to monitor the temporal change of the detected amount X1 in order to prevent a decrease in the quality of the product or the occurrence of an abnormality in the injection molding machine X4.

[0031] Furthermore, whether the value of detected quantity X1 deviates from the acceptable range of the target value X2 must be determined using the time series of the value of detected quantity X1. However, this determination method requires reading out the information showing the time series each time a determination is made, which is not a desirable method from the standpoint of reducing the processing load of the information processing device 20.

[0032] Therefore, the information processing device 20 may be configured to determine, for example, in the control of the injection molding device X4 to match the value of the detected amount X1 to the target value X2, whether or not an abnormality has occurred in the value of the detected amount X1, based on at least one feature value from one or more types of feature values ​​for the detected amount X1 and the tolerance range of said at least one feature value. Here, the tolerance range of a certain feature value from the one or more types of feature values ​​is a range that is determined such that when the feature value does not deviate from the tolerance range of the feature value, the value of the detected amount X1 does not deviate from the tolerance range of the target value X2, and when the feature value deviates from the tolerance range of the feature value, the value of the detected amount X1 deviates from the tolerance range of the target value X2. For example, the tolerance range of the maximum value, average value, etc. of the detected amount X1 is an example of a range that is determined in this way. Therefore, the tolerance range of the feature value is equivalent to the tolerance range of the target value. The same applies to other feature values ​​from the one or more types of feature values. Therefore, for the sake of clarity, in the following explanation, we will refer to a deviation of a certain feature value from its acceptable range as an abnormality occurring in that feature value. Furthermore, in the following explanation, as an example, we will refer to each of the one or more feature values ​​for a detected quantity corresponding to a certain target value as the feature value corresponding to that target value. For the reasons stated above, in the following explanation, as an example, we will describe a case in which, in control of an injection molding machine X4 to match the value of detected quantity X1 to a target value X2, the information processing device 20 determines whether or not an abnormality has occurred in the value of detected quantity X1 by determining whether or not an abnormality has occurred in at least one of the one or more feature values ​​for detected quantity X1.

[0033] Furthermore, the injection molding condition data obtained from a certain injection molding apparatus may include, in addition to apparatus identification information that identifies the injection molding apparatus, one or more target value pieces of information, and abnormality determination condition information associated with each of the target values ​​set as injection molding conditions for the injection molding apparatus, it may also include other information.

[0034] The injection molding condition data described above can be distinguished by a combination of device identification information and second date and time information. However, if only one injection molding device is connected to the information processing device 20, the injection molding condition data may not include device identification information. This is because, in this case, each injection molding condition data can be distinguished solely by the second date and time information.

[0035] When the information processing device 20 acquires injection molding condition data, it stores the acquired injection molding condition data and outputs the acquired injection molding condition data to the server 30. This allows the information processing device 20 to also store the acquired injection molding condition data in the server 30. Here, the information processing device 20 associates injection molding condition data, which indicates the injection molding conditions set in a certain injection molding device during a given cycle, with the cycle data acquired from the injection molding device during that cycle. This association method may be a known method or a method to be developed in the future. Through this association, at least one injection molding condition data is associated with each cycle data. Below, as an example, the case where one injection molding condition data is associated with each cycle data will be described.

[0036] Furthermore, the information processing device 20 displays various images based on data stored in the information processing device 20 on the display unit of a terminal device that is communicatively connected to the information processing device 20, in response to a request from the terminal device. Here, such images include GUIs (Graphical User Interfaces), icons, and windows on the OS (Operating System). Below, as an example, we will describe the case in which the information processing device 20 is communicatively connected to the terminal device 40, as shown in Figure 1. In this embodiment, the process related to the login of the information processing device 20 by the terminal device 40 is a known process and will therefore not be explained. Also, for the sake of explanation, below, when we describe the information processing device 20 receiving an operation from the terminal device 40 via an image displayed on the terminal device 40, we will simply refer to the information processing device 20 receiving an operation. That is, below, when we say that the information processing device 20 performs a certain process in response to an received operation, we mean that the information processing device 20 performs that process in response to an operation received from the terminal device 40 via an image displayed on the terminal device 40.

[0037] The information processing device 20 is, for example, a workstation, a desktop PC (Personal Computer), a notebook PC, etc., but is not limited to these. The information processing device 20 is connected to each of the multiple managed devices 10 in a communicative manner via wired or wireless communication. The communication network connecting the information processing device 20 to each of the multiple managed devices 10 is, for example, a LAN (Local Area Network) within the facility where the multiple managed devices 10 are installed, but is not limited to this. The communication network may also be other communication networks such as the Internet or a mobile communication network.

[0038] Server 30 stores cycle data acquired by information processing device 20. For example, if server 30 acquires certain cycle data from information processing device 20, it stores the acquired cycle data.

[0039] Furthermore, the server 30 stores injection molding condition data acquired by the information processing device 20. For example, if the server 30 acquires certain injection molding condition data from the information processing device 20, it stores the acquired injection molding condition data.

[0040] Furthermore, in response to a request from a terminal device that is communicatively connected to the server 30, the server 30 displays various images based on data stored in the server 30 on the display unit of the terminal device. Here, these images include GUIs, icons, OS windows, etc. Below, as an example, we will describe the case where the server 30 is communicatively connected to the terminal device 40, as shown in Figure 1. In this embodiment, the process related to the terminal device 40 logging into the server 30 is a known process, so we will omit its explanation. Also, for the sake of explanation, below, when we describe the server 30 receiving an operation from the terminal device 40 via an image displayed on the terminal device 40, we will simply refer to the server 30 receiving an operation. That is, below, when we say that the server 30 performs a certain process in response to an received operation, we mean that the server 30 performs that process in response to an operation received from the terminal device 40 via an image displayed on the terminal device 40.

[0041] As described above, in the molding management system 1, both the information processing device 20 and the server 30 display various images based on stored data on the display unit of the terminal device 40 in response to the received operation. For the sake of convenience in the following explanation, unless it is necessary to distinguish between the information processing device 20 and the server 30, they will be collectively referred to as the information processing device X. The display unit is, for example, the display of the terminal device 40, a display device connected to the terminal device 40 in a communicative manner, etc., but is not limited to these. In the following explanation, as an example, the case in which the display unit is the display of the terminal device 40 will be described. Also, for the sake of convenience in the following explanation, the act of displaying a certain image on the display unit will be referred to as "displaying the image."

[0042] Here, the information processing device X displays a target value reception image P1 for the injection molding apparatus specified by the target value reception image display operation, in response to the received target value reception image display operation. The target value reception image P1 is an image that receives one or more target values ​​corresponding to the detected amounts detected by each detection unit attached to the injection molding apparatus. For the sake of explanation, the injection molding apparatus specified in response to the target value reception image display operation will be referred to as the first target injection molding apparatus. Note that the target value reception image display operation may be any operation.

[0043] Figure 2 shows an example of a target value reception image P1. In the example shown in Figure 2, the target value reception image P1 includes a region R1, five tabs TB1 to TB5, and ten input fields F1 to F10. The target value reception image P1 may also include other GUIs that can accept one or more target values ​​corresponding to the detected amounts detected by each detection unit attached to the first target injection molding apparatus, in place of some or all of these GUIs (Graphical User Interfaces), or in addition to all of these GUIs.

[0044] Region R1 is the area where the input field for accepting the target value is displayed.

[0045] Tab TB1 is a GUI that accepts an operation to display input fields in area R1, each accepting one or more target values ​​corresponding to the detected quantities in the weighing process, which is one of the processes included in each cycle. When a selection operation is performed on Tab TB1, the information processing device X displays input fields in area R1, each accepting one or more target values ​​corresponding to the detected quantities in the weighing process. In this embodiment, the selection operation is, for example, a click or a tap, but is not limited to these.

[0046] Tab TB2 is a GUI that accepts an operation to display input fields in area R1 that accept one or more target values ​​corresponding to the detected quantities related to the injection process, which is one of the processes included in each cycle. When a selection operation is performed on Tab TB2, the information processing device X displays input fields in area R1 that accept one or more target values ​​corresponding to the detected quantities related to the injection process. In this embodiment, the selection operation is, for example, a click or a tap, but is not limited to these. In the example shown in Figure 2, area R1 displays input fields that accept one or more target values ​​corresponding to the detected quantities related to the injection process. Specifically, in this example, area R1 displays 10 input fields, input fields F1 to F10.

[0047] Tab TB3 is a GUI that accepts an operation to display input fields in area R1, each accepting one or more target values ​​corresponding to the detected quantities related to the die-closing process, which is one of the processes included in each cycle. When a selection operation is performed on Tab TB3, the information processing device X displays input fields in area R1, each accepting one or more target values ​​corresponding to the detected quantities related to the die-closing process. In this embodiment, the selection operation is, for example, a click or a tap, but is not limited to these.

[0048] Tab TB4 is a GUI that accepts an operation to display input fields in area R1 that accept one or more target values ​​corresponding to the detected quantities related to the die-opening process, which is one of the processes included in each cycle. When a selection operation is performed on Tab TB2, the information processing device X displays input fields in area R1 that accept one or more target values ​​corresponding to the detected quantities related to the die-opening process.

[0049] Tab TB5 is a GUI that accepts an operation to display input fields in area R1, each accepting one or more target values ​​corresponding to the detected temperature. When a selection operation is performed on tab TB2, the information processing device X displays input fields in area R1, each accepting one or more target values ​​corresponding to the detected temperature.

[0050] Input field F1 is where the first target injection speed, which is a target value corresponding to the injection speed at which material is injected into the mold, is entered. Here, the injection speed is an example of a detected quantity related to the injection process. The first target injection speed is the target value for the injection speed in the first half of the speed control, in which the screw position is changed so that the injection speed is kept constant. In the example shown in Figure 2, "20.0" is entered in input field F1 as an example of the first target injection speed. When the first target injection speed is entered in input field F1, the information processing device X identifies the first target injection speed entered in input field F1 as the injection molding condition for the injection speed in the first half of the speed control, and outputs the injection molding condition information indicating the identified injection molding condition to the first target injection molding device. In this way, the information processing device X can set the first target injection speed as one of the injection molding conditions for that injection speed to the first target injection molding device. In the example shown in Figure 2, the information processing device X identifies 20.0 mm / s, an example of a first target injection speed, as the injection molding condition for that injection speed, and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. The value in input field F1 may be entered by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0051] Input field F2 is where the second target injection speed, which is a target value corresponding to the injection speed at which material is injected into the mold, is entered. The second target injection speed is the target value for the injection speed in the latter half of the speed control process, in which the screw position is changed to keep the injection speed constant. In the example shown in Figure 2, "30.0" is entered in input field F2 as an example of the second target injection speed. When the second target injection speed is entered in input field F2, the information processing device X identifies the second target injection speed entered in input field F2 as an injection molding condition for that injection speed in the latter half of the speed control process, and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. In this way, the information processing device X can set the second target injection speed as one of the injection molding conditions for that injection speed to the first target injection molding device. In the example shown in Figure 2, the information processing device X identifies 30.0 mm / s, an example of a second target injection speed, as the injection molding condition for that injection speed, and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. The value in input field F2 may be entered by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0052] Input field F3 is where the target value for the injection speed switching position, which corresponds to the screw position when switching from the first target injection speed to the second target injection speed for injecting material into the mold, is entered. Here, the injection speed switching position is an example of a detected quantity related to the injection process. In the example shown in Figure 2, "25.000" is entered in input field F3 as an example of the injection speed switching target position. When the injection speed switching target position is entered in input field F3, the information processing device X identifies the injection speed switching target position entered in input field F3 as an injection molding condition for the injection speed switching position and outputs the injection molding condition information indicating the identified injection molding condition to the first target injection molding device. In this way, the information processing device X can set the injection speed switching target position as one of the injection molding conditions for the injection speed switching position to the first target injection molding device. In the example shown in Figure 2, the information processing device X identifies 25.000 mm, an example of an injection speed switching target position, as an injection molding condition for the injection speed switching position, and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. The value in input field F3 may be entered by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0053] Input field F4 is where the VP switching target position is entered. This target value corresponds to the VP switching position, which is the screw position when the control for changing the screw position is switched from speed control to pressure control. Here, the VP switching position is an example of a detected quantity related to the injection process. In the example shown in Figure 2, "20.000" is entered in input field F4 as an example of the VP switching target position. When the VP switching target position is entered in input field F4, the information processing device X identifies the VP switching target position entered in input field F4 as an injection molding condition for the VP switching position and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. This allows the information processing device X to set the VP switching target position as one of the injection molding conditions for the VP switching position in the first target injection molding device. In the example shown in Figure 2, the information processing device X identifies 20.000 mm, an example of the VP switching target position, as an injection molding condition for the VP switching position and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. The value in input field F4 may be entered by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0054] Input field F5 is where the target value for the maximum injection pressure, which corresponds to the maximum injection pressure during the process of material injection into the mold, is entered. Here, the maximum injection pressure is an example of a detected quantity related to the injection process. In the example shown in Figure 2, "100.0" is entered in input field F5 as an example of the target injection pressure. When the target injection pressure is entered in input field F5, the information processing device X identifies the target injection pressure entered in input field F5 as an injection molding condition for the maximum injection pressure and outputs the injection molding condition information indicating the identified injection molding condition to the first target injection molding device. As a result, the information processing device X can set the target injection pressure as one of the injection molding conditions for the maximum injection pressure in the first target injection molding device. In the example shown in Figure 2, the information processing device X identifies 100.0 MPa, an example of the target maximum injection pressure, as the injection molding condition for the maximum injection pressure, and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. The value in input field F5 may be entered by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0055] Input field F6 is where the first target injection holding pressure, which is the target value corresponding to the injection holding pressure in pressure control that changes the screw position to maintain a constant pressure inside the mold, is entered. Here, injection holding pressure is an example of a detected quantity related to the injection process. The first target injection holding pressure is the pressure in the first half of the pressure control that changes the screw position to maintain a constant pressure inside the mold. In the example shown in Figure 2, "10.0" is entered in input field F6 as an example of the first target injection holding pressure. When the first target injection holding pressure is entered in input field F6, the information processing device X identifies the first target injection holding pressure entered in input field F6 as an injection molding condition for injection holding pressure and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. As a result, the information processing device X can set the first target injection holding pressure as one of the injection molding conditions for injection holding pressure in the first target injection molding device. In the example shown in Figure 2, the information processing device X identifies 10.0 mm / s, an example of the first target injection holding pressure, as the injection molding condition for the injection holding pressure, and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. The value in input field F6 may be entered by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0056] Input field F7 is where the second target injection holding pressure is entered. This second target injection holding pressure is the target value corresponding to the injection holding pressure in pressure control, which is the pressure used to change the screw position so that the pressure inside the mold remains constant. The second target injection holding pressure is the pressure in the latter half of the pressure control process, which changes the screw position so that the pressure inside the mold remains constant. In the example shown in Figure 2, "0.0" is entered in input field F7 as an example of the second target injection holding pressure. When the second target injection holding pressure is entered in input field F7, the information processing device X identifies the second target injection holding pressure entered in input field F7 as an injection molding condition for injection holding pressure and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. This allows the information processing device X to set the second target injection holding pressure as one of the injection molding conditions for injection holding pressure in the first target injection molding device. In the example shown in Figure 2, the information processing device X identifies 0.0 MPa, an example of a second target injection holding pressure, as the injection molding condition for the injection holding pressure, and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. The value in input field F7 may be entered by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0057] Input field F8 is where the first target injection holding pressure time is entered. This first target injection holding pressure time is the target value corresponding to the injection holding pressure time, which is the duration of pressure control that changes the screw position to maintain a constant pressure inside the mold. Here, the injection holding pressure time is an example of a detected quantity related to the injection process. The first target injection holding pressure time is the duration of the first half of the pressure control that changes the screw position to maintain a constant pressure inside the mold. In the example shown in Figure 2, "3.0" is entered in input field F8 as an example of the first target injection holding pressure time. When the first target injection holding pressure time is entered in input field F8, the information processing device X identifies the first target injection holding pressure time entered in input field F8 as an injection molding condition for the injection holding pressure time and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. This allows the information processing device X to set the first target injection holding pressure time as one of the injection molding conditions for the injection holding pressure time in the first target injection molding device. In the example shown in Figure 2, the information processing device X identifies 3.0 sec, an example of the first target injection holding pressure time, as an injection molding condition for the injection holding pressure time, and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. The value in input field F8 may be entered by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0058] Input field F9 is where the second target injection holding pressure time is entered. This second target injection holding pressure time is the duration of the pressure control process, which involves changing the screw position to maintain a constant pressure within the mold. The second target injection holding pressure time is the duration of the latter half of the pressure control process, which involves changing the screw position to maintain a constant pressure within the mold. In the example shown in Figure 2, "0.0" is entered in input field F9 as an example of the second target injection holding pressure time. When the second target injection holding pressure time is entered in input field F9, the information processing device X identifies the second target injection holding pressure time entered in input field F9 as an injection molding condition for the injection holding pressure time and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. This allows the information processing device X to set the second target injection holding pressure time as one of the injection molding conditions for the injection holding pressure time on the first target injection molding device. In the example shown in Figure 2, the information processing device X identifies 0.0 sec, an example of the second target injection holding pressure time, as the injection molding condition for the injection holding pressure time, and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. The value in input field F9 may be entered by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0059] Input field F10 is where the target value of the injection holding pressure limit speed, which corresponds to the injection holding pressure limit speed, is entered. This limit speed is used in pressure control to change the screw position so that the pressure inside the mold remains constant. Here, the injection holding pressure limit speed is an example of a detected quantity related to the injection process. In the example shown in Figure 2, "3.0" is entered in input field F10 as an example of the target injection holding pressure limit speed. When the target injection holding pressure limit speed is entered in input field F10, the information processing device X identifies the target injection holding pressure limit speed entered in input field F10 as an injection molding condition for the injection holding pressure limit speed and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. As a result, the information processing device X can set the target injection holding pressure limit speed as one of the injection molding conditions for the injection holding pressure limit speed in the first target injection molding device. In the example shown in Figure 2, the information processing device X identifies 3.0 mm / s, an example of a target injection holding pressure limit speed, as an injection molding condition for the injection holding pressure limit speed, and outputs injection molding condition information indicating the identified injection molding condition to the first target injection molding device. The value in input field F10 may be entered by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0060] The information processing device X can receive one or more target values ​​for each detected quantity detected from the first target injection molding apparatus via the target value reception image P1 described above. On the other hand, the information processing device X displays an allowable range reception image P2 for the first target injection molding apparatus in response to the accepted allowable range reception image display operation. The allowable range reception image P2 is an image that receives the allowable range of each feature value corresponding to each target value for all target values ​​received via the target value reception image P1. Note that the allowable range reception image display operation may be any operation. Displaying the allowable range reception image is an example of the fourth operation.

[0061] Figure 3 shows an example of an acceptable range reception image P2. In the example shown in Figure 3, the acceptable range reception image P2 includes, for each target value received via the target value reception image P1, a combination of information indicating the target value and an input field into which the acceptable range of each feature value corresponding to the target value is entered. However, in Figure 3, in order to simplify the diagram, combinations other than those for the three target values ​​of the first target injection speed, second target injection speed, and target mold temperature are omitted. Also in Figure 3, in order to simplify the diagram, input fields other than those into which the acceptable ranges of the two feature values, the maximum value and the average value, are entered are omitted. Therefore, in Figure 3, the acceptable range reception image P2 includes information D1 and four input fields F21 to F24, information D2 and four input fields F31 to F34, and information D3 and four input fields F41 to F44.

[0062] Information D1 is information indicating the first target injection velocity, which is one of the target values ​​received via the target value reception image P1.

[0063] Input fields F21 and F22 are input fields into which the tolerance range of the maximum value, which is one of the feature values ​​corresponding to the first target injection velocity indicated by information D1, is entered. Specifically, input field F21 is the input field into which the lower limit of the tolerance range is entered. However, in the example shown in Figure 3, the lower limit is represented as a value indicating a negative deviation on the number line from the first target injection velocity. In this example, "4.0" is entered in input field F21 as an example of the lower limit. This means that the lower limit is 4.0 mm / s smaller than the first target injection velocity. When the lower limit is entered in input field F21, the information processing device X identifies the lower limit entered in input field F21 as the lower limit of the tolerance range. On the other hand, input field F22 is the input field into which the upper limit of the tolerance range is entered. However, in this example, the upper limit is represented as a value indicating a positive deviation on the number line from the first target injection velocity. In this example, "0.5" is entered in input field F22 as an example of the upper limit. This means that the upper limit is 0.5 mm / s greater than the first target injection velocity. When the upper limit is entered in input field F22, the information processing device X identifies the upper limit entered in input field F22 as the upper limit of the allowable range. When the information processing device X has identified the lower limit and the upper limit, it identifies the range from the identified lower limit to the identified upper limit as the allowable range. In this example, the information processing device X identifies the range of -4.0 mm / s to 0.5 mm / s as the allowable range for the maximum value, which is one of the feature values ​​corresponding to the first target injection velocity indicated by information D1. If no values ​​are entered in both input fields F21 and F22, the information processing device X determines that the allowable range for the maximum value, which is one of the feature values ​​corresponding to the first target injection velocity indicated by information D1, has not been specified. In this case, the information processing device X does not use the tolerance range to determine whether or not an abnormality has occurred in the value of the detected quantity corresponding to the first target injection velocity. Furthermore, the input of values ​​into input fields F21 and F22 may be performed by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0064] Input fields F23 and F24 are input fields into which the tolerance range of the average value, which is one of the feature values ​​corresponding to the first target injection velocity indicated by information D1, is entered. Specifically, input field F23 is the input field into which the lower limit of the tolerance range is entered. However, in the example shown in Figure 3, the lower limit is represented as a value indicating a negative deviation on the number line from the first target injection velocity. In this example, "5.0" is entered in input field F23 as an example of the lower limit. This means that the lower limit is 5.0 mm / s smaller than the first target injection velocity. When the lower limit is entered in input field F23, the information processing device X identifies the lower limit entered in input field F23 as the lower limit of the tolerance range. On the other hand, input field F24 is the input field into which the upper limit of the tolerance range is entered. However, in this example, the upper limit is represented as a value indicating a positive deviation on the number line from the first target injection velocity. In this example, "0.1" is entered in input field F24 as an example of the upper limit. This means that the upper limit is 0.1 mm / s greater than the first target injection velocity. When the upper limit is entered in input field F24, the information processing device X identifies the upper limit entered in input field F24 as the upper limit of the allowable range. When the information processing device X identifies the lower limit and the upper limit, it identifies the range from the identified lower limit to the identified upper limit as the allowable range. In this example, the information processing device X identifies the range of -4.0 mm / s to 0.5 mm / s as the allowable range for the average value, which is one of the feature values ​​corresponding to the first target injection velocity indicated by information D1. If no values ​​are entered in both input fields F23 and F24, the information processing device X determines that the allowable range for the average value, which is one of the feature values ​​corresponding to the first target injection velocity indicated by information D1, has not been specified. In this case, the information processing device X does not use the tolerance range to determine whether or not an abnormality has occurred in the value of the detected quantity corresponding to the first target injection velocity. Furthermore, the input of values ​​into input fields F23 and F24 may be performed by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0065] Information D2 is information indicating the injection velocity 2, which is one of the target values ​​received via the target value reception image P1.

[0066] Input fields F31 and F32 are input fields into which the tolerance range of the maximum value, which is one of the feature values ​​corresponding to the second target injection velocity indicated by information D2, is entered. Specifically, input field F31 is the input field into which the lower limit of the tolerance range is entered. However, in the example shown in Figure 3, the lower limit is represented as a value indicating a negative deviation on the number line from the second target injection velocity. In this example, "5.0" is entered in input field F31 as an example of the lower limit. This means that the lower limit is 5.0 mm / s smaller than the second target injection velocity. When the lower limit is entered in input field F31, the information processing device X identifies the lower limit entered in input field F31 as the lower limit of the tolerance range. On the other hand, input field F32 is the input field into which the upper limit of the tolerance range is entered. However, in this example, the upper limit is represented as a value indicating a positive deviation on the number line from the second target injection velocity. In this example, "1.0" is entered in input field F32 as an example of the upper limit. This means that the upper limit is 1.0 mm / s greater than the second target injection velocity. When the upper limit is entered in input field F32, the information processing device X identifies the upper limit entered in input field F32 as the upper limit of the allowable range. When the information processing device X identifies the lower limit and the upper limit, it identifies the range from the identified lower limit to the identified upper limit as the allowable range. In this example, the information processing device X identifies the range of -5.0 mm / s to 1.0 mm / s as the allowable range for the maximum value, which is one of the feature values ​​corresponding to the second target injection velocity indicated by information D2. If no values ​​are entered in both input field F31 and input field F32, the information processing device X determines that the allowable range for the maximum value, which is one of the feature values ​​corresponding to the second target injection velocity indicated by information D2, has not been specified. In this case, the information processing device X does not use the tolerance range to determine whether or not an abnormality has occurred in the value of the detected quantity corresponding to the second target injection velocity. Furthermore, the input of values ​​into input fields F31 and F32 may be performed by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0067] Input fields F33 and F34 are input fields into which the tolerance range of the average value, which is one of the feature values ​​corresponding to the second target injection velocity indicated by information D2, is entered. Specifically, input field F33 is the input field into which the lower limit of the tolerance range is entered. However, in the example shown in Figure 3, the lower limit is represented as a value indicating a negative deviation on the number line from the second target injection velocity. In this example, "5.0" is entered in input field F33 as an example of the lower limit. This means that the lower limit is 5.0 mm / s smaller than the second target injection velocity. When the lower limit is entered in input field F33, the information processing device X identifies the lower limit entered in input field F33 as the lower limit of the tolerance range. On the other hand, input field F34 is the input field into which the upper limit of the tolerance range is entered. However, in this example, the upper limit is represented as a value indicating a positive deviation on the number line from the second target injection velocity. In this example, "0.1" is entered in input field F34 as an example of the upper limit. This means that the upper limit is 0.1 mm / s greater than the second target injection velocity. When the upper limit is entered in input field F34, the information processing device X identifies the upper limit entered in input field F34 as the upper limit of the allowable range. When the information processing device X identifies the lower limit and the upper limit, it identifies the range from the identified lower limit to the identified upper limit as the allowable range. In this example, the information processing device X identifies the range of -5.0 mm / s to 1.0 mm / s as the allowable range for the average value, which is one of the feature values ​​corresponding to the second target injection velocity indicated by information D2. If no values ​​are entered in both input fields F33 and F34, the information processing device X determines that the allowable range for the average value, which is one of the feature values ​​corresponding to the second target injection velocity indicated by information D2, has not been specified. In this case, the information processing device X does not use the tolerance range to determine whether or not an abnormality has occurred in the value of the detected quantity corresponding to the second target injection velocity. Furthermore, the input of values ​​into input fields F33 and F34 may be performed by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0068] Information D3 is information indicating the target mold temperature, which is one of the target values ​​received via the target value reception image P1.

[0069] Input fields F41 and F42 are input fields into which the tolerance range of the maximum value, which is one of the feature values ​​corresponding to the target mold temperature indicated by information D3, is entered. Specifically, input field F41 is the input field into which the lower limit of the tolerance range is entered. However, in the example shown in Figure 3, the lower limit is represented as a value indicating a negative deviation on the number line from the target mold temperature. In this example, "1.0" is entered in input field F41 as an example of the lower limit. This means that the lower limit is 1.0°C smaller than the target mold temperature. When the lower limit is entered in input field F41, the information processing device X identifies the lower limit entered in input field F41 as the lower limit of the tolerance range. On the other hand, input field F42 is the input field into which the upper limit of the tolerance range is entered. However, in this example, the upper limit is represented as a value indicating a positive deviation on the number line from the target mold temperature. In this example, "1.0" is entered in input field F42 as an example of the upper limit. This means that the upper limit is 1.0°C greater than the target mold temperature. When the upper limit is entered in input field F42, the information processing device X identifies the upper limit entered in input field F42 as the upper limit of the allowable range. When the information processing device X identifies the lower limit and the upper limit, it identifies the range from the identified lower limit to the identified upper limit as the allowable range. In this example, the information processing device X identifies the range of -1.0°C to 1.0°C as the allowable range for the maximum value, which is one of the feature values ​​corresponding to the target mold temperature indicated by information D3. If no values ​​are entered in both input fields F41 and F42, the information processing device X determines that the allowable range for the maximum value, which is one of the feature values ​​corresponding to the target mold temperature indicated by information D3, has not been specified. In this case, the information processing device X does not use the allowable range to determine whether or not an abnormality has occurred in the value of the detected quantity corresponding to the target mold temperature. Furthermore, values ​​may be entered into input fields F41 and F42 by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0070] Input fields F43 and F44 are input fields into which the tolerance range of the average value, which is one of the feature values ​​corresponding to the target mold temperature indicated by information D3, is entered. Specifically, input field F43 is the input field into which the lower limit of the tolerance range is entered. However, in the example shown in Figure 3, the lower limit is represented as a value indicating a negative deviation on the number line from the target mold temperature. In this example, "1.0" is entered in input field F43 as an example of the lower limit. This means that the lower limit is 1.0°C smaller than the target mold temperature. When the lower limit is entered in input field F43, the information processing device X identifies the lower limit entered in input field F43 as the lower limit of the tolerance range. On the other hand, input field F44 is the input field into which the upper limit of the tolerance range is entered. However, in this example, the upper limit is represented as a value indicating a positive deviation on the number line from the target mold temperature. In this example, "1.0" is entered in input field F44 as an example of the upper limit. This means that the upper limit is 1.0°C greater than the target mold temperature. When the upper limit is entered in input field F44, the information processing device X identifies the upper limit entered in input field F44 as the upper limit of the allowable range. When the information processing device X identifies the lower limit and the upper limit, it identifies the range from the identified lower limit to the identified upper limit as the allowable range. In this example, the information processing device X identifies the range of -1.0°C to 1.0°C as the allowable range for the average value, which is one of the feature values ​​corresponding to the target mold temperature indicated by information D3. If no values ​​are entered in both input fields F43 and F44, the information processing device X determines that the allowable range for the average value, which is one of the feature values ​​corresponding to the target mold temperature indicated by information D3, has not been specified. In this case, the information processing device X does not use the allowable range to determine whether or not an abnormality has occurred in the value of the detected quantity corresponding to the target mold temperature. Furthermore, values ​​may be entered into input fields F43 and F44 by selecting a value from a pull-down menu, or by direct input using an input device such as a keyboard.

[0071] The information processing device X can receive the tolerance range for each feature value corresponding to each target value for each target value received via the target value receiving image P1, through the tolerance range receiving image P2 described above. This allows the information processing device X to generate abnormality judgment condition information associated with each target value received via the target value receiving image P1. Note that this abnormality judgment condition information may also be tolerance range information indicating the tolerance range for each feature value. The information processing device X outputs the generated abnormality judgment condition information to the first target injection molding apparatus. This allows the information processing device X to set the abnormality judgment conditions indicated by each generated abnormality judgment condition information to the first target injection molding apparatus.

[0072] Furthermore, if the information processing device X receives 0.0 as the lower limit of a certain tolerance range in the tolerance range reception image P2, it identifies the range where no lower limit exists as that tolerance range. Also, if the information processing device X receives 0.0 as the upper limit of a certain tolerance range in the tolerance range reception image P2, it identifies the range where no upper limit exists as that tolerance range.

[0073] Furthermore, in response to an accepted abnormality determination result image display operation, the information processing device X displays abnormality determination result information indicating whether or not an abnormality occurred in the value of the detected quantity specified by the abnormality determination result image display operation during the cycle of the target cycle data, based on the target cycle data specified by the abnormality determination result image display operation from the stored cycle data and the target injection molding condition data associated with the target cycle data from the stored injection molding condition data. For the sake of explanation, in the following, the said cycle will be referred to as the target cycle, the said detected quantity as the target detected quantity, and the injection molding device from which the target cycle data is acquired will be referred to as the second target injection molding device. For example, the information processing device X generates a graph of the detected quantity waveform showing the temporal change in the value of the target detected quantity based on time-series information showing the time series of the target detected quantity included in the target cycle data. After generating the graph, the information processing device X superimposes a target value waveform onto the graph, based on target value information that indicates one or more target values ​​corresponding to the target detected quantity among the target value information included in the target injection molding condition data. This waveform shows the temporal change of the target value corresponding to the target detected quantity in the control of the target detected quantity by the second target injection molding device. After superimposing the target value waveform onto the graph, the information processing device X generates an abnormality judgment result image P3 that includes the graph with the superimposed target value waveform as abnormality judgment result information, and displays the generated abnormality judgment result image P3.

[0074] Figure 4 shows an example of an anomaly detection result image P3. The horizontal axis of the graph shown in Figure 4 represents the elapsed time in the target cycle. However, the horizontal axis of the graph shows the elapsed time based on the screw position. Alternatively, the horizontal axis of the graph may be configured to show the elapsed time based on other information that corresponds one-to-one with the elapsed time. The vertical axis of the graph shows the value of the injection velocity, which is an example of the target detected quantity. That is, in the example shown in Figure 4, the detected quantity specified by the anomaly detection result image display operation is the injection velocity. The waveform L1 plotted on the graph shows an example of the target value waveform. The waveform L2 plotted on the graph shows an example of the detected quantity waveform.

[0075] In the example shown in Figure 4, waveform L1 indicates that during period PD1, when the screw position is from 40 mm to 25 mm, the second target injection molding device is using the aforementioned first target injection speed as a target value for the injection speed, which is an example of the target detected quantity. In the same example, waveform L1 also indicates that during period PD2, when the screw position is from 25 mm to 20 mm, the second target injection molding device is using the aforementioned second target injection speed as a target value for the injection speed, which is an example of the target detected quantity. In this example, the graph shown in Figure 4 indicates that the maximum value of waveform L2 during period PD2 does not satisfy the abnormality judgment condition indicated by the abnormality judgment condition information associated with that maximum value. In this case, the information processing device X determines that the maximum value of the target detected quantity does not satisfy the abnormality judgment condition indicated by the abnormality judgment condition information associated with the second injection speed, and identifies period PD2 as the abnormality occurrence period during which an abnormality occurred in the target cycle. The information processing device X then displays abnormality occurrence period information showing at least a portion of period PD2, which has been identified as the abnormality occurrence period. In the example shown in Figure 4, the information processing device X displays the display of period PD2 on the graph as one of the abnormal occurrence period information by differentiating the display of period PD2 from that of other periods. This allows the information processing device X to easily detect that an abnormality has occurred in the second target injection molding machine without having to prepare any information other than that obtained from the second injection molding machine. Furthermore, by displaying the abnormal occurrence period information, the information processing device X allows the user to easily identify the target value that the second target injection molding machine was using during the period in the target cycle in which the abnormality occurred. Note that the information processing device X may also be configured to display a portion of the display of period PD2 as one of the abnormal occurrence period information by differentiating the display of a portion of period PD2 from that of other periods. In this case, the portion is, for example, the target period in period PD2 in which the maximum value does not satisfy the abnormality judgment condition, but is not limited to this.In this case, the information processing device X may be configured to display the target period and the non-target period within the period PD2 as different display modes, thereby displaying the display mode of the target period as one of the abnormal occurrence period information, and displaying the display mode of the non-target period as the second abnormal occurrence period information. In this embodiment, the display mode is color, shape, brightness, hatching, etc., but is not limited to these. The hatching of period PD2 shown in Figure 4 is an example of such a display mode.

[0076] Furthermore, in the example shown in Figure 4, the information processing device X displays an indicator I1, which indicates period PD2 as an abnormality period, as one of the abnormality period information items on the graph shown in Figure 4. This allows the information processing device X to more reliably and visually identify the abnormality period to the user. Indicator I1 is an indicator that indicates period PD2 by being displayed directly above it. The configuration of indicator I1 may be any configuration. In this example, indicator I1 is an indicator that includes the string "Injection Speed ​​Abnormal" along with an icon indicating that an abnormality has occurred. Indicator I1 may also be configured to indicate period PD2 using, for example, a callout, a leader line, or an arrow indicating the width of period PD2. Note that the information processing device X may also be configured not to display indicator I1. Even in this case, the information processing device X will display other information that indicates period PD2 as an abnormality period, such as the display mode of period PD2.

[0077] Furthermore, if a predetermined operation is performed on the mark I1 in the abnormality detection result image P3, the information processing device X displays a first detailed information image P4, which displays the target value and the corresponding feature value side by side for each of the one or more target values ​​corresponding to the detected target quantity. Here, Figure 5 shows an example of the first detailed information image P4. In the example shown in Figure 5, the operation is a mouseover over the mark I1. In this example, the operation causes the first detailed information image P4 to be superimposed on the graph shown in Figure 4. In this example, the first detailed information image P4 displays the first target injection speed, the maximum value of the injection speed which is an example of the detected target quantity during the period when the second target injection molding device was using the first target injection speed, and the average value of the injection speed during that period, all on a single line. In this example, the difference between the maximum value and the first target injection speed is displayed alongside the maximum value. This allows the information processing device X to easily recognize the magnitude of the deviation of the injection speed value from the first target injection speed. This is useful as it reduces the time required for users to manage cycles. Furthermore, in this example, the difference between the average value and the first target injection speed is displayed alongside the average value. This also allows the information processing device X to easily recognize the magnitude of the deviation of the injection speed value from the average first target injection speed. This is also useful as it reduces the time required for users to manage cycles. Furthermore, in this example, the first detailed information image P4 displays the second target injection speed, the maximum injection speed during the period when the second target injection molding machine was using the second target injection speed, and the average injection speed during that period side by side. Furthermore, in this example, the difference between the maximum value and the second target injection speed is displayed alongside the maximum value. This allows the information processing device X to easily recognize the magnitude of the deviation of the injection speed value from the second target injection speed. This is useful as it reduces the time required for users to manage cycles. Furthermore, in this example, the difference between the average value and the second target injection speed is displayed alongside the average value.This also allows the information processing device X to easily recognize the magnitude of the deviation of the injection speed value from the average second target injection speed. This is also useful as it reduces the time required for the user to manage the cycle. Furthermore, in this example, the information processing device X displays icon I2 in conjunction with the second target injection speed to indicate that an abnormality has occurred in the injection speed value. The configuration of icon I2 may be any configuration. By displaying icon I2 in conjunction with the second target injection speed in the first detailed information image P4, the information processing device X allows the user to easily identify the target value that the second target injection molding machine was using to control the injection speed during the period when an abnormality occurred in the injection speed value, out of one or more target values ​​corresponding to the injection speed.

[0078] On the other hand, Figure 6 shows another example of the abnormality detection result image P3. The horizontal axis of the graph shown in Figure 6 represents the elapsed time in the target cycle. The vertical axis of the graph represents the injection holding pressure value, which is another example of the target detected quantity. Waveform L3 plotted on the graph shows an example of a target value waveform that shows the temporal change of the target value corresponding to the injection holding pressure in the injection holding pressure control by the second target injection molding machine. Waveform L4 plotted on the graph shows an example of a detected quantity waveform that shows the temporal change of the injection holding pressure.

[0079] In the example shown in Figure 6, waveform L3 indicates that during period PD3, from 4 to 5 seconds, the second target injection molding machine is using 250 MPa as the target value for injection holding pressure, which is an example of the target detected quantity. For the sake of explanation, this 250 MPa will be referred to as the third target injection holding pressure below. In this example, waveform L3 also indicates that during period PD4, from 5 to 7 seconds, the second target injection molding machine is using 200 MPa as the target value for injection holding pressure, which is an example of the target detected quantity. For the sake of explanation, this 200 MPa will be referred to as the fourth target injection holding pressure below. In this example, waveform L3 also indicates that during period PD5, from 7 to 8 seconds, the second target injection molding machine is using 150 MPa as the target value for injection holding pressure, which is an example of the target detected quantity. For the sake of explanation, this 150 MPa will be referred to as the fifth target injection holding pressure below. In this example, the graph shows that the average value of waveform L4 during period PD4 does not satisfy the abnormality judgment condition indicated by the abnormality judgment condition information associated with that average value. In this case, the information processing device X determines that the average value of the injection holding pressure does not satisfy the abnormality judgment condition indicated by the abnormality judgment condition information associated with the fourth target injection holding pressure, and identifies period PD4 as the abnormality occurrence period during which an abnormality occurred in the target cycle. The information processing device X then displays abnormality occurrence period information that shows at least a portion of period PD4, which has been identified as the abnormality occurrence period. In the example shown in Figure 6, the information processing device X displays the display of period PD4 in the graph as one of the abnormality occurrence period information by making the display manner of period PD4 in the graph different from the display manner of other periods. As a result, the information processing device X can easily detect that an abnormality has occurred in the second target injection molding device without preparing any information other than the information obtained from the second injection molding device. Furthermore, by displaying the abnormality occurrence period information, the information processing device X allows the user to easily identify the target value that the second target injection molding device was using during the period during which an abnormality occurred in the target cycle.The display format for period PD4 is the same as that for period PD2, so a detailed explanation is omitted here.

[0080] Furthermore, in the example shown in Figure 6, the information processing device X displays mark I3, which indicates period PD4 as an abnormality occurrence period, as one of the abnormality occurrence period information items. This allows the information processing device X to more reliably and visually identify the abnormality occurrence period to the user. Mark I3 is a mark that indicates period PD4 by being displayed directly above period PD4. The configuration of mark I3 is the same as that of mark I1, so a detailed explanation is omitted here.

[0081] Furthermore, in the abnormality detection result image P3 shown in Figure 6, a different first detailed information image P4 is displayed from the first detailed information image P4 shown in Figure 5. This is because the information processing device X displayed the first detailed information image P4 by operating on mark I3. In the example shown in Figure 6, the first detailed information image P4 displays the third target injection holding pressure and the average value of the injection holding pressure during the period when the second target injection molding machine was using the third target injection holding pressure, side by side on a single line. In this example, the difference between the average value and the third target injection holding pressure is also displayed alongside the average value. This allows the information processing device X to easily allow the user to recognize the magnitude of the average deviation of the injection holding pressure value from the third target injection holding pressure. This is useful as it reduces the time required for the user to manage the cycle. In this example, the first detailed information image P4 also displays the fourth target injection holding pressure and the average value of the injection holding pressure during the period when the second target injection molding machine was using the fourth target injection holding pressure, side by side on a line below the aforementioned line. Furthermore, in this example, the difference between the average value and the fourth target injection holding pressure is displayed alongside the average value. This allows the information processing device X to easily recognize the magnitude of the average deviation of the injection holding pressure value from the fourth target injection holding pressure. This also contributes to reducing the time required for the user to manage the cycle, which is useful. In addition, in this example, the first detailed information image P4 displays the fifth target injection holding pressure and the average value of the injection holding pressure during the period when the third target injection molding machine was using the fifth target injection holding pressure, side by side in the row below the row below. Furthermore, in this example, the difference between the average value and the fifth target injection holding pressure is displayed alongside the average value. This allows the information processing device X to easily recognize the magnitude of the average deviation of the injection holding pressure value from the fifth target injection holding pressure. This also contributes to reducing the time required for the user to manage the cycle, which is useful. Moreover, in this example, the information processing device X displays an icon I4 associated with the fourth target injection holding pressure, indicating that an abnormality has occurred in the injection holding pressure value. The configuration of icon I4 may be the same as that of icon I2, or it may be different from that of icon I2.In the first detailed information image P4, by displaying icon I4 in association with the fourth target injection speed, the information processing device X allows the user to easily identify the target value that the second target injection molding machine was using to control the injection holding pressure during the period when an abnormality occurred in the injection holding pressure value, out of one or more target values ​​corresponding to the injection holding pressure.

[0082] Furthermore, when the information processing device X receives a predetermined second detailed information image display operation, it displays the second detailed information image P5 based on the second target cycle data specified by the second detailed information image display operation from the stored cycle data and the second target injection molding condition data associated with the second target cycle data from the stored injection molding condition data. The second detailed information image P5 is an image in which, for each of the one or more target values ​​corresponding to the detected quantity specified by the second detailed information image display operation in the cycle of the second target cycle data, the target value and the value relating to the detected quantity corresponding to the target value are displayed. In the second detailed information image P5, the value relating to the detected quantity corresponding to a certain target value is, but is not limited to, some or all of the one or more feature values ​​for the detected quantity and the statistical values ​​of some or all of the one or more feature values ​​in the past N cycles that were most recently executed in cycles prior to the cycle of the second target cycle data. However, N may be any integer greater than or equal to 2. Also, the statistical values ​​are, for example, the maximum value, the average value, etc., but are not limited to these. For the sake of explanation, in the following, the cycle in question will be referred to as the second target cycle, the detected quantity as the second target detected quantity, and the injection molding machine from which the second target cycle data is acquired as the third target injection molding machine. Furthermore, in the following, we will explain the case where N is 10 as an example.

[0083] Figure 7 shows an example of the second detailed information image P5. In the example shown in Figure 7, the second detailed information image P5 displays, on a single line, the first target injection speed, which is an example of a target value corresponding to the injection speed, which is an example of the second target detection quantity; the maximum value of the injection speed during the period when the third target injection molding machine was using the first target injection speed in the second target cycle; the average value of that injection speed; and the maximum value of the injection speed during that period in the most recent 10 cycles executed prior to the second target cycle, along with the average value of the injection speed during that period in those 10 cycles. In addition, in this example, the difference between the maximum value of the injection speed during that period in the second target cycle and the first target injection speed is displayed alongside the maximum value. This allows the information processing device X to easily allow the user to recognize the magnitude of the deviation of the injection speed value from the first target injection speed, and also allows the user to easily recognize the fluctuations in the injection speed during that period in the past 10 cycles. In this example, the second detailed information image P5 displays, in the row below the row containing the first target injection speed, the second target injection speed (an example of a target value corresponding to the injection speed, which is an example of a second target detection quantity), the maximum value of the injection speed during the period when the third target injection molding machine was using the second target injection speed in the second target cycle, the average value of that injection speed, the maximum value of the injection speed during that period in the most recent 10 cycles prior to the second target cycle, and the average value of the injection speed during that period in those 10 cycles. In this example, the difference between the maximum value of the injection speed during that period in the second target cycle and the second target injection speed is also displayed alongside the maximum value. This allows the information processing device X to easily allow the user to recognize the magnitude of the deviation of the injection speed value from the second target injection speed, and also allows the user to easily recognize the fluctuations in the injection speed during that period in the past 10 cycles. These features are useful as they reduce the time required for the user to manage the cycles.

[0084] Furthermore, in the example shown in Figure 7, the information processing device X displays icon I5, which indicates that an abnormality has occurred in the injection speed value, in conjunction with the second target injection speed. The configuration of icon I5 may be any configuration. By displaying icon I5 in conjunction with the second target injection speed in the second detailed information image P5, the information processing device X allows the user to easily identify the target value that the third target injection molding machine was using to control the injection speed during the period when an abnormality occurred in the injection speed value, out of one or more target values ​​corresponding to the injection speed.

[0085] <Hardware configuration of information processing device X> Here, the information processing device 20 and the server 30 may have the same hardware configuration or they may have different hardware configurations. Below, as an example, we will describe the case where the information processing device 20 and the server 30 have the same hardware configuration. In other words, in this example, the information processing device X has the hardware configuration shown in Figure 8. Figure 8 is a diagram showing an example of the hardware configuration of the information processing device X.

[0086] The information processing device X comprises, for example, a processor 31, a storage unit 32, and a communication unit 33. These components are connected to each other via a bus so as to be able to communicate with one another. The information processing device X also communicates with other devices via the communication unit 33. These other devices are, for example, an injection molding machine, a server 30, a terminal device 40, etc., if the information processing device X is an information processing device 20. These other devices are, for example, an information processing device 20, a terminal device 40, etc., if the information processing device X is a server 30.

[0087] The processor 31 is, for example, a CPU (Central Processing Unit). However, the processor 31 may be another processor, such as an FPGA (Field Programmable Gate Array), instead of a CPU. The processor 31 executes various programs stored in the memory unit 32.

[0088] The storage unit 32 is a storage device that includes, for example, an HDD (Hard Disk Drive), an SSD (Solid State Drive), an EEPROM (Electrically Erasable Programmable Read Only Memory), a ROM (Read Only Memory), or a RAM (Random Access Memory). The storage unit 32 may be an external storage device connected via a digital input / output port such as a USB (Universal Serial Bus), instead of being built into the information processing device X. The storage unit 32 stores various types of information, images, and programs processed by the information processing device X. In other words, all types of information stored by the information processing device X are stored in the storage unit 32.

[0089] The communication unit 33 is a communication device that includes, for example, digital input / output ports such as USB, an Ethernet® port, an antenna for wireless communication, and the like.

[0090] <Functional Configuration of Information Processing Device X> Here, the information processing device 20 and the server 30 may have the same functional configuration or they may have different functional configurations. Below, as an example, we will describe the case in which the information processing device 20 and the server 30 have the same functional configuration. In other words, in this example, the information processing device X has the functional configuration shown in Figure 9. Figure 9 is a diagram showing an example of the functional configuration of the information processing device X.

[0091] The information processing device X comprises a storage unit 32, a communication unit 33, and a control unit 34.

[0092] The control unit 34 controls the entire information processing device X. The control unit 34 comprises at least a cycle data acquisition unit 341, an injection molding condition data acquisition unit 342, a display control unit 343, and an output control unit 344. These functional units of the control unit 34 are realized, for example, by the processor 31 executing various programs stored in the storage unit 32. Some or all of these functional units may be hardware functional units such as LSIs (Large Scale Integration) or ASICs (Application Specific Integrated Circuits).

[0093] The cycle data acquisition unit 341 acquires cycle data for each cycle of the injection molding machine from a device that is communicatively connected to the information processing device X. This device may be, for example, an injection molding machine or an information processing device 20.

[0094] The injection molding condition data acquisition unit 342 acquires injection molding condition data from a device that is communicatively connected to the information processing device X each time injection molding conditions are set in each injection molding apparatus. This device may be, for example, an injection molding apparatus or an information processing device 20.

[0095] The display control unit 343 generates various images in response to the received operation. For example, the display control unit 343 generates the aforementioned target value reception image P1. The display control unit 343 transmits the generated image to the terminal device 40, causing the terminal device 40 to display the target value reception image P1.

[0096] The output control unit 344 outputs various types of data to other devices according to the received operation.

[0097] <Processing performed by the information processing device X in response to the received operation> Referring to Figure 10, the processing performed by the information processing device X in response to each operation described above will be explained. Figure 10 is a diagram showing an example of the flow of processing performed by the information processing device X in response to an received operation. In the following, as an example, we will explain the case in which the information processing device X is in a state where it can receive various operations from the user via the terminal device 40 at a time before the processing of step S110 shown in Figure 10 is performed. Furthermore, in the following, as an example, we will explain the case in which, at that time, multiple cycle data and multiple injection molding condition data are already stored in the information processing device X.

[0098] The control unit 34 waits until it receives an operation via the terminal device 40 (step S110). In Figure 10, the process in step S110 is indicated by "Operation received?".

[0099] If the control unit 34 determines that it has received an operation via the terminal device 40 (step S110-YES), it determines whether the received operation is an operation that terminates the process shown in the flowchart in Figure 10 (step S120). The determination process in step S120 by the control unit 34 may be performed by a known method or by a method to be developed in the future. Also, in Figure 10, the process in step S120 is indicated by "Termination?".

[0100] If the control unit 34 determines that the operation received in step S110 is an operation that terminates the process shown in the flowchart in Figure 10 (step S120-YES), it terminates the process shown in the flowchart in Figure 10, for example.

[0101] On the other hand, if the control unit 34 determines that the operation received in step S110 is not an operation that terminates the process shown in the flowchart in Figure 10 (step S120-NO), it performs processing corresponding to the received operation (step S130). This processing includes various processes that have been described as processes performed by the information processing device X in this embodiment. Here, the processing performed by the control unit 34 in step S130 has already been explained in the explanation of Figures 2 to 7, so a detailed explanation is omitted.

[0102] After the processing in step S130 is completed, the control unit 34 transitions to step S110 and waits again until it receives an operation via the terminal device 40.

[0103] Through the above processing, the information processing device X, in response to the received abnormality detection result image display operation, identifies the period during which an abnormality occurred in the target cycle based on the target cycle data specified by the abnormality detection result image display operation from the stored cycle data and the target injection molding condition data associated with the target cycle data from the stored injection molding condition data, and displays abnormality period information indicating at least a part of the identified abnormality period. As a result, the information processing device X can easily detect that an abnormality has occurred in the injection molding apparatus without preparing any information other than the information obtained from the injection molding apparatus.

[0104] Furthermore, the molding management system 1 described above may include a terminal device 40. Also, the molding management system 1 described above may include an injection molding apparatus such as an injection molding apparatus 11.

[0105] Furthermore, the elements described above can be combined in any way.

[0106] <Note> [1] A molding management system that includes an information processing device that is communicably connected to a terminal device, and manages the production of a product in a production process that includes an injection molding process of a product by an injection molding apparatus, wherein the information processing device acquires cycle data from the injection molding apparatus for each cycle, which includes a first quantity information indicating a value of a first quantity controlled by the injection molding apparatus during the execution of a cycle in which injection molding is performed, and acquires injection molding condition data from the injection molding apparatus each time the injection molding conditions are set in the injection molding apparatus, which includes a first target value information indicating a first target value that is a target value in the control of the first quantity by the injection molding apparatus, as one of the injection molding condition information indicating the injection molding conditions set in the injection molding apparatus during the cycle, and in response to a first operation received, displays abnormal occurrence period information on a display unit that indicates at least a part of the period during which an abnormality occurred in the first cycle, which is the cycle of the first cycle data, based on the first cycle data acquired from the injection molding apparatus and the first injection molding condition data associated with the first cycle data from the acquired injection molding condition data. [2] The molding management system according to [1], wherein the information processing device displays the abnormality occurrence period information on the display unit along with a waveform graph showing the temporal change of the first quantity in the first cycle in response to the first operation. [3] The molding management system according to [1] or [2], wherein the information processing device identifies the period during which the first target value was used to control the first quantity by the injection molding apparatus in the first cycle as the abnormality period if the value indicated by the first quantity information included in the first cycle data does not satisfy the abnormality determination condition corresponding to the first target value indicated by the first target value information included in the first injection molding condition data. [4] The molding management system described in [3], wherein the abnormality determination conditions are monitoring conditions accepted to monitor the temporal change of the first quantity so as not to cause a decrease in the quality of the product or the occurrence of an abnormality in the injection molding apparatus. [5] The molding management system according to [3] or [4], wherein the abnormality determination condition is that the value of the first quantity does not exceed the first target value. [6] The molding management system described in [5] includes time-series information showing the time series of the values ​​of the first quantity, in the first quantity information. [7] The molding management system according to [3], wherein the first quantity information includes, as one of the pieces of information indicating the value of the first quantity, first feature value information indicating a first feature value for the first quantity, the injection molding condition data includes, as one of the pieces of information indicating the injection molding condition data, first tolerance range information indicating an tolerance range for the first feature value, the tolerance range for the first feature value is the range in which the first feature value deviates when the value of the first quantity deviates from the range in which deviation from the first target value of the first quantity is permitted, and the range in which the first feature value does not deviate when the value of the first quantity does not deviate from the range in which deviation from the first target value of the first quantity is permitted, and the abnormality determination condition is that the first feature value does not deviate from the tolerance range for the first feature value. [8] The molding management system described in [7], wherein the first feature value information is first time series information showing the time series of the value of the first quantity, and the information processing device calculates the first feature value based on the first time series information. [9] The molding management system according to [7] or [8], wherein the first feature value is one of the minimum value, maximum value, mean value, variance, standard deviation of the first quantity, the start value of the detection period in which the first quantity was detected, or the end value of the detection period.

[10] The molding management system described in [7] or [9], wherein the first feature value information is information that represents the first feature value itself.

[11] The molding management system according to any one of [7] to

[10] , wherein the information processing device displays the abnormality occurrence period information on the display unit along with a waveform graph showing the temporal change of the first quantity in the first cycle in response to the first operation.

[12] The horizontal axis of the graph shows information that corresponds one-to-one with the elapsed time in the first cycle, as described in

[11] , for the molding management system described above.

[13] The molding management system according to

[11] or

[12] , wherein the information processing device displays at least a portion of the display patterns of the abnormal occurrence period in the graph as abnormal occurrence period information on the graph by making the display patterns of at least a portion of the abnormal occurrence period different from the display patterns of other periods.

[14] The molding management system according to any one of

[11] to

[13] , wherein the information processing device displays a mark on the graph indicating at least a portion of the abnormal occurrence period as abnormal occurrence period information.

[15] The molding management system according to

[14] , wherein the information processing device displays a first image on the display unit that shows the first target value and the first feature value side by side when a predetermined second operation is performed on the mark.

[16] The molding management system according to

[15] , wherein the information processing device displays the difference between the first target value and the first feature value in the first image, in conjunction with the first feature value.

[17] The molding management system according to any one of [7] to

[16] , wherein, when the information processing device receives a predetermined third operation, it displays a second image on the display unit that shows the first target value indicated by the first target value information included in the first injection molding condition data, the first feature value indicated by the first feature value information included in the first cycle data, and the statistical value of the first feature value in the past N cycles that were most recently executed among the cycles prior to the first cycle, where N is an integer of 2 or more.

[18] The molding management system according to

[17] , wherein the information processing device displays the difference between the first target value and the first feature value in the second image, in conjunction with the first feature value.

[19] The molding management system according to any one of [7] to

[18] , wherein the information processing device, upon receiving a predetermined fourth operation, displays a third image on the display unit that accepts the tolerance range of the first feature value.

[20] The molding management system according to any one of [1] to

[19] , wherein the information processing device displays the abnormal occurrence period information on the display unit, which indicates the period during which an abnormality occurred within the abnormal occurrence period, as at least a part of the abnormal occurrence period, and also displays second abnormal occurrence period information on the display unit, which indicates a period within the abnormal occurrence period other than the period during which an abnormality occurred. [twenty one] A molding management system according to any one of [1] to

[20] , including the aforementioned terminal device. [twenty two] A molding management system according to any one of [1] to

[21] , including the injection molding apparatus.

[0107] Although embodiments of this disclosure have been described in detail above with reference to the drawings, the specific configuration is not limited to these embodiments and may be modified, replaced, deleted, etc., as long as it does not deviate from the gist of this disclosure.

[0108] Furthermore, a program to realize the function of any component in the apparatus described above may be recorded on a computer-readable recording medium, and the program may be loaded into a computer system and executed. Here, the apparatus is, for example, an injection molding machine 11, an information processing device 20, a server 30, a terminal device 40, etc. The term "computer system" here includes hardware such as an OS (Operating System) and peripheral devices. The term "computer-readable recording medium" refers to portable media such as flexible disks, magneto-optical disks, ROMs, CD (Compact Disk)-ROMs, and storage devices such as hard disks built into a computer system. In addition, the term "computer-readable recording medium" also includes volatile memory inside a computer system that acts as a server or client when a program is transmitted via a network such as the Internet or a communication line such as a telephone line, which retains the program for a certain period of time.

[0109] Furthermore, the above program may be transmitted from a computer system that stores the program in a memory device or the like to another computer system via a transmission medium or by transmission waves within the transmission medium. Here, the "transmission medium" used to transmit the program refers to a medium that has the function of transmitting information, such as a network like the Internet or a communication line like a telephone line. Furthermore, the above program may be intended to implement some of the functions described above. In addition, the above program may be one that can implement the functions described above in combination with a program already recorded in the computer system, a so-called differential file or differential program. [Explanation of Symbols]

[0110] 1...Molding management system, 10...Managed device, 11...Injection molding machine, 20...Information processing device, 30...Server, 31...Processor, 32...Storage unit, 33...Communication unit, 34...Control unit, 40...Terminal device, 341...Cycle data acquisition unit, 342...Injection molding condition data acquisition unit, 343...Display control unit, 344...Output control unit, X...Information processing device

Claims

1. A molding management system that includes an information processing device that is communicably connected to a terminal device, and manages the production of a product in a production process that includes an injection molding process of a product by an injection molding machine, The aforementioned information processing device is During the execution of an injection molding cycle, cycle data including first quantity information indicating the value of a first quantity controlled by the injection molding apparatus is acquired from the injection molding apparatus for each cycle. Each time the injection molding conditions are set in the injection molding apparatus, injection molding condition data is acquired from the injection molding apparatus as one of the injection molding condition information pieces indicating the injection molding conditions set in the injection molding apparatus, including first target value information indicating a first target value which is the target value in the control of the first quantity by the injection molding apparatus. In response to the received first operation, the system displays abnormality period information on the display unit, which indicates at least a portion of the period during which an abnormality occurred in the first cycle, based on the first cycle data from the cycle data acquired from the injection molding apparatus and the first injection molding condition data from the acquired injection molding condition data that is associated with the first cycle data. Molding management system.

2. The information processing device, in response to the first operation, displays the abnormality period information on the display unit along with a waveform graph showing the temporal change of the first quantity in the first cycle. The molding management system according to claim 1.

3. If the value indicated by the first quantity information included in the first cycle data does not satisfy the abnormality determination condition corresponding to the first target value indicated by the first target value information included in the first injection molding condition data, the information processing device identifies the period during which the first target value was used for controlling the first quantity by the injection molding apparatus in the first cycle as the abnormality occurrence period. The molding management system according to claim 1.

4. The aforementioned abnormality determination conditions are monitoring conditions accepted in order to monitor the temporal change of the first quantity in order to prevent a decrease in the quality of the product or the occurrence of an abnormality in the injection molding apparatus. The molding management system according to claim 3.

5. The abnormality determination condition is that the value of the first quantity does not exceed the first target value. The molding management system according to claim 3.

6. The first quantity information includes time series information showing the time series of the values ​​of the first quantity. The molding management system according to claim 5.

7. The first quantity information includes, as one of the pieces of information indicating the value of the first quantity, first feature value information indicating the first feature value of the first quantity. The injection molding condition data includes, as one of the injection molding condition information items, first tolerance range information indicating the tolerance range of the first feature value. The tolerance range for the first feature value is the range in which the first feature value deviates when the value of the first quantity deviates from the range in which deviation from the first target value of the first quantity is permitted, and the range in which the first feature value does not deviate when the value of the first quantity does not deviate from the range in which deviation from the first target value of the first quantity is permitted. The abnormality determination condition is that the first feature value does not deviate from the acceptable range of the first feature value. The molding management system according to claim 3.

8. The first quantity information includes first time series information showing the time series of the value of the first quantity, The information processing device calculates the first feature value based on the first time-series information. The molding management system according to claim 7.

9. The first feature value is one of the following: the minimum value, maximum value, mean, variance, standard deviation, start value of the detection period in which the first quantity was detected, or end value of the detection period. The molding management system according to claim 7.

10. The first feature value information is information that represents the first feature value itself. The molding management system according to claim 7.

11. The information processing device, in response to the first operation, displays the abnormality period information on the display unit along with a waveform graph showing the temporal change of the first quantity in the first cycle. The molding management system according to claim 7.

12. The horizontal axis of the graph above shows information that corresponds one-to-one with the elapsed time in the first cycle. The molding management system according to claim 11.

13. The information processing device displays at least a portion of the display patterns of the abnormality occurrence period in the graph as abnormality occurrence period information on the graph by making the display patterns of at least a portion of the abnormality occurrence period different from the display patterns of other periods. The molding management system according to claim 11.

14. The information processing device displays, as information on the period of abnormal occurrence, marks on the graph indicating at least a portion of the period of abnormal occurrence in the graph. The molding management system according to claim 11.

15. When a predetermined second operation is performed on the mark, the information processing device displays a first image on the display unit that shows the first target value and the first feature value side by side. The molding management system according to claim 14.

16. The information processing device displays the difference between the first target value and the first feature value in the first image, in conjunction with the first feature value. The molding management system according to claim 15.

17. When the information processing device receives a predetermined third operation, it displays a second image on the display unit that shows the first target value indicated by the first target value information included in the first injection molding condition data, the first feature value indicated by the first feature value information included in the first cycle data, and the statistical value of the first feature value in the past N cycles that were most recently executed among the cycles prior to the first cycle. N is an integer greater than or equal to 2. The molding management system according to claim 7.

18. The information processing device displays the difference between the first target value and the first feature value in the second image, in conjunction with the first feature value. The molding management system according to claim 17.

19. When the information processing device receives a predetermined fourth operation, it causes the display unit to display a third image that accepts the tolerance range of the first feature value. The molding management system according to claim 7.

20. The information processing device displays the abnormality period information on the display unit, which indicates the period during which the abnormality occurred within the abnormality period, as at least a portion of the abnormality period, and also displays second abnormality period information on the display unit, which indicates a period within the abnormality period other than the period during which the abnormality occurred. The molding management system according to claim 1.

21. Including the aforementioned terminal device, The molding management system according to claim 1.

22. Including the injection molding apparatus, The molding management system according to claim 1.