Substrate processing equipment

Abstract

To provide a substrate processing apparatus that can improve throughput. [Solution] The substrate processing apparatus 100 comprises a plurality of dry processing modules 1A, a wet processing module 1B, and a main transport unit 80. The dry processing module 1A includes a load lock unit 10 that switches between atmospheric pressure and vacuum states, a dry processing unit 30 that performs dry processing on the substrate W in a vacuum state, and a local transport unit 22 that transports the substrate W between the load lock unit 10 and the dry processing unit 30 in a vacuum state. The wet processing module 1B performs wet processing on the substrate W. The main transport unit 80 loads and unloads the substrate W into the load lock unit 10 in an atmospheric pressure state and transports the substrate W between the dry processing module 1A and the wet processing module 1B.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus.

Background Art

[0002] Conventionally, a substrate processing apparatus for processing a substrate has been proposed (for example, Patent Document 1). In Patent Document 1, the substrate processing apparatus includes a plurality of processing modules and a transfer robot. The transfer robot transfers the substrate to each processing module. Each processing module includes a wet processing unit, a dry processing unit, and a transfer unit. The wet processing unit performs wet processing on the substrate. The dry processing unit performs dry processing on the substrate. The transfer unit transfers the substrate between the wet processing unit and the dry processing unit.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In Patent Document 1, when the processing time of either the dry processing unit or the wet processing unit is long, the substrate may wait in the other unit. Therefore, there is room for improvement in throughput.

[0005] Therefore, an object of the present disclosure is to provide a substrate processing apparatus capable of improving throughput.

Means for Solving the Problems

[0006] The substrate processing apparatus includes a load lock unit that switches between atmospheric pressure and vacuum states, a dry processing unit that performs dry processing on the substrate in a vacuum state, and a plurality of dry processing modules including a local transport unit that transports the substrate between the load lock unit and the dry processing unit in a vacuum state, one or more wet processing modules that perform wet processing on the substrate, and a main transport unit that loads and unloads the substrate into and out of the load lock unit in an atmospheric pressure state and transports the substrate between the dry processing modules and the wet processing modules. [Effects of the Invention]

[0007] Throughput can be improved. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic plan view showing an example of the configuration of a substrate processing apparatus. [Figure 2] Figure 2 is a schematic longitudinal cross-sectional view showing an example of a specific configuration of a dry processing module. [Figure 3] Figure 3 is a schematic longitudinal cross-sectional view showing an example of the configuration of a wet processing module. [Figure 4] Figure 4 is a schematic diagram showing an example of the internal configuration of the control unit. [Figure 5] Figure 5 is a schematic diagram showing an example of the configuration of the transport system for the dry processing module. [Modes for carrying out the invention]

[0009] The embodiments will be described in detail below with reference to the drawings. Note that, for the purpose of ease of understanding, the dimensions and number of parts in the drawings are exaggerated or simplified as needed. Also, parts with similar configurations and functions are denoted by the same reference numerals, and redundant explanations are omitted in the following description.

[0010] Furthermore, in the following explanations, similar components will be denoted by the same symbols, and their names and functions will also be the same. Therefore, detailed explanations of them may be omitted to avoid redundancy.

[0011] Furthermore, even if ordinal numbers such as "first" or "second" are used in the following descriptions, these terms are used for convenience to facilitate understanding of the embodiments and are not limited to the order that may result from these ordinal numbers.

[0012] When expressions indicating relative or absolute positional relationships are used (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.), unless otherwise specified, such expressions shall not only strictly represent the positional relationship but also represent a state in which there is a relative displacement in terms of angle or distance within a tolerance or a range in which equivalent functionality is obtained. When expressions indicating equality are used (e.g., "identical," "equal," "homogeneous," etc.), unless otherwise specified, such expressions shall not only strictly represent a state in which there is a quantitatively exact equality but also represent a state in which there is a difference within a tolerance or a range in which equivalent functionality is obtained. When expressions indicating shape are used (e.g., "quadrilateral" or "cylindrical"), unless otherwise specified, such expressions shall not only strictly represent the geometrically exact shape but also represent a shape with features such as concavities or chamfers within a range in which equivalent effects are obtained. When expressions such as "possess," "equip," "include," or "have" a single component are used, such expressions are not exclusive expressions that exclude the existence of other components. When the expression "at least one of A, B, and C" is used, it includes A only, B only, C only, any two of A, B, and C, and all of A, B, and C.

[0013] <Overall configuration of the substrate processing equipment> Figure 1 is a schematic plan view showing an example of the configuration of the substrate processing apparatus 100. The substrate processing apparatus 100 is a single-wafer processing apparatus that processes substrates W one at a time.

[0014] The substrate W is, for example, a semiconductor wafer, a substrate for liquid crystal displays, an organic electroluminescence (EL) substrate, a flat panel display (FPD) substrate, an optical display substrate, a magnetic disk substrate, an optical disk substrate, a magneto-optical disk substrate, a photomask substrate, or a solar cell substrate. The substrate W has a thin, flat shape. In the following, the substrate W is assumed to be a semiconductor wafer. As an example, the substrate W is a silicon substrate. The substrate W has, for example, a disc shape. The diameter of the substrate W is, for example, about 300 mm, and the thickness of the substrate W is, for example, about 0.5 mm or more and about 3 mm or less.

[0015] In the example shown in Figure 1, the substrate processing apparatus 100 includes an indexer block 110, a processing block 120, and a control unit 90. The processing block 120 is primarily responsible for processing the substrate W, while the indexer block 110 is primarily responsible for transporting the substrate W between the outside of the substrate processing apparatus 100 and the processing block 120.

[0016] The indexer block 110 includes a load port 111 and an indexer transport section 112. A substrate carrier (hereinafter referred to as a carrier) C is placed on the load port 111. Multiple substrates W are housed in the carrier C, for example, arranged with spacing between them in the vertical direction. In the example shown in Figure 1, multiple load ports 111 are arranged in a row.

[0017] The indexer transport unit 112 is a transport robot capable of removing unprocessed substrates W from carriers C placed on each load port 111. The indexer transport unit 112 may also be called an indexer robot. The indexer transport unit 112 transports the unprocessed substrates W removed from carriers C to processing blocks 120. Processing blocks 120 can process the unprocessed substrates W. The indexer transport unit 112 can also receive processed substrates W from processing blocks 120 and transport the processed substrates W to carriers C on load ports 111.

[0018] In the example of FIG. 1, the processing block 120 includes a plurality of processing modules 1 and a main transfer unit 80. The main transfer unit 80 is a transfer robot and can transfer the substrate W between the indexer transfer unit 112 and the plurality of processing modules 1.

[0019] As illustrated in FIG. 1, the processing block 120 may also include a delivery unit 123. The delivery unit 123 relays the substrate W between the indexer transfer unit 112 and the main transfer unit 80. The delivery unit 123 can also be said to be a relay unit. For example, the delivery unit 123 includes a shelf on which a plurality of substrates W can be placed in a vertically arranged state. The delivery unit 123 can also be said to be a placement unit on which the substrate W is placed. The indexer transfer unit 112 places the unprocessed substrate W on the delivery unit 123. The main transfer unit 80 takes out the unprocessed substrate W from the delivery unit 123 and transfers the substrate W to the processing module 1. The processing module 1 processes the substrate W.

[0020] The plurality of processing modules 1 include a dry processing module 1A and a wet processing module 1B as described later. The main transfer unit 80 can also transfer the substrate W from one of the dry processing module 1A and the wet processing module 1B to the other. As described later, the dry processing module 1A performs dry processing on the substrate W in a vacuum state, and the wet processing module 1B performs wet processing on the substrate W in an atmospheric pressure state. Then, for example, the main transfer unit .....

[0021] In the example of FIG. 1, the main conveyance unit 80 is provided within the main conveyance space TS. The main conveyance space TS extends along a predetermined moving direction Dx. The moving direction Dx is, for example, a direction along the horizontal direction. In the example of FIG. 1, the moving direction Dx is a direction orthogonal to the arrangement direction of the load ports 111. Hereinafter, the horizontal direction orthogonal to the moving direction Dx will also be referred to as the width direction Dy (which is the same as the arrangement direction here). The size of the main conveyance space TS in the moving direction Dx is larger than the size of the main conveyance space TS in the width direction Dy. That is, the main conveyance space TS has an elongated shape that is long in the moving direction Dx in plan view. Here, the plan view means viewing the object along the vertical direction.

[0022] In the example of FIG. 1, on one side (the first side) of the main conveyance space TS in the width direction Dy, a plurality of processing modules 1 are provided. Hereinafter, these plurality of processing modules 1 will also be referred to as the first module group G1. In the example of FIG. 1, in the first module group G1, a plurality (two in the figure) of processing modules 1 are arranged in the moving direction Dx (that is, the longitudinal direction of the main conveyance space TS). Similar to the main conveyance space TS, the first module group G1 also has an elongated shape that is long in the moving direction Dx.

[0023] In the example of FIG. 1, on the other side (the second side) of the main conveyance space TS in the width direction Dy, a plurality of processing modules 1 are also provided. Hereinafter, these plurality of processing modules 1 will also be referred to as the second module group G2. In the example of FIG. 1, since the second module group G2 is provided on the other side of the main conveyance space TS, the main conveyance space TS is located between the first module group G1 and the second module group G2. In the example of FIG. 1, in the second module group G2, a plurality (two in the figure) of processing modules 1 are arranged in the moving direction Dx (that is, the longitudinal direction of the main conveyance space TS). Similar to the main conveyance space TS, the second module group G2 also has an elongated shape that is long in the moving direction Dx.

[0024] In a plan view, multiple (four in this case) processing modules 1 are provided. At the location where each processing module 1 is provided, the multiple processing modules 1 may be stacked vertically. If the portion including the multiple processing modules 1 stacked vertically is called a tower TW, then in the example of Figure 1, the first module group G1 is composed of multiple (two in the figure) tower TWs arranged along the direction of movement Dx, and the second module group G2 is composed of multiple (two in the figure) tower TWs arranged along the direction of movement Dx.

[0025] In the example shown in Figure 1, the main transport space TS and the transfer unit 123 are aligned in the direction of movement Dx. The transfer unit 123 is located on the indexer block 110 side of the main transport space TS. In the example shown in Figure 1, the transfer unit 123 is located adjacent to the center of the indexer block 110. The main transport unit 80 is movable within the main transport space TS along the direction of movement Dx. Within the main transport space TS, the main transport unit 80 can move to transfer positions corresponding to the transfer unit 123 and each of the multiple processing modules 1. At each transfer position, the main transport unit 80 loads and unloads the substrate W to and from the transfer unit 123 or the processing module 1.

[0026] Each processing module 1 includes a module transport gate GMT. The module transport gate GMT is located at the boundary between the processing module 1 and the main transport space TS. The module transport gate GMT is an openable / closable loading / unloading entrance, and its opening and closing are controlled by the control unit 90. The module transport gate GMT may be a gate valve or a shutter. This also applies to the other gates described later. The main transport unit 80 stops at a transfer position facing the module transport gate GMT. The main transport unit 80 then loads and unloads the substrate W to and from the processing module 1 through the open module transport gate GMT. When the module transport gate GMT is closed, the internal space of the processing module 1 is isolated from the main transport space TS.

[0027] The main transport unit 80 transports, for example, an unprocessed substrate W from the transfer unit 123 to the dry processing module 1A. The dry processing module 1A performs dry processing on the substrate W. Dry processing is a process that etches, for example, objects to be etched on the main surface of the substrate W. This dry processing may leave impurities on the main surface of the substrate W. The main transport unit 80 transports the dry-processed substrate W from the dry processing module 1A to the wet processing module 1B. The wet processing module 1B then performs wet processing on the dry-processed substrate W. Wet processing is a cleaning process that removes, for example, impurities from the main surface of the substrate W. This wet processing can remove at least some of the impurities from the substrate W. The main transport unit 80 transports the wet-processed substrate W from the wet processing module 1B to the transfer unit 123.

[0028] <Dry Processing Module> Next, the configuration of the dry processing module 1A will be outlined and then described in detail. The dry processing module 1A includes a load lock unit 10, a local transport unit 20, and a dry processing unit 30. The load lock unit 10 includes a load lock chamber 11, the local transport unit 20 includes a local transport chamber 21, and the dry processing unit 30 includes a dry processing chamber 31. The load lock chamber 11 is connected to the local transport chamber 21 via a load transport gate GLT, and the local transport chamber 21 is connected to the dry processing chamber 31 via a transport processing gate GTP. The load lock unit 10 is also the interface of the dry processing module 1A. The load lock chamber 11 has a dry transport gate GDT, which is a module transport gate GMT. The dry transport gate GDT is provided in the portion of the load lock chamber 11 facing the main transport space TS.

[0029] The load lock unit 10 switches between atmospheric pressure and vacuum states. In other words, the load lock unit 10 changes the state of the load lock chamber 11 between atmospheric pressure and vacuum. The main transport unit 80 transports the load lock unit 10 and the substrate W in the atmospheric pressure state. In other words, the main transport unit 80 transports the substrate W into and out of the load lock chamber 11 in the atmospheric pressure state through the dry transport gate GDT.

[0030] The local transport unit 20 includes a local transport section 22. The local transport section 22 is located inside the local transport chamber 21. The local transport section 22 is controlled by the control unit 90 and transports the substrate W between the load lock unit 10 and the dry processing unit 30 under vacuum conditions.

[0031] The dry processing unit 30 performs dry processing on the substrate W under vacuum conditions.

[0032] In the example in Figure 1, the local transport chamber 21 is adjacent to the load lock chamber 11 in the direction of movement Dx. Also in the example in Figure 1, the dry processing chamber 31 is adjacent to the local transport chamber 21 in the direction of movement Dx. In other words, in the example in Figure 1, the load lock chamber 11, the local transport chamber 21, and the dry processing chamber 31 are arranged in this order in the direction of movement Dx (i.e., the longitudinal direction of the main transport space TS). In this arrangement, the local transport chamber 21 is located between the load lock chamber 11 and the dry processing chamber 31. In the example in Figure 1, in each of the dry processing modules 1A, a load lock unit 10, a local transport unit 20, and a dry processing unit 30 are provided in a one-to-one correspondence. In other words, each of the load lock unit 10 and the local transport unit 20 is a unit dedicated to a single dry processing unit 30.

[0033] In this dry processing module 1A, the main transport unit 80 loads the unprocessed substrate W into the load lock chamber 11 under atmospheric pressure. Next, the load lock unit 10 reduces the pressure inside the load lock chamber 11 to within the vacuum range. Then, the local transport unit 22 removes the substrate W from the load lock chamber 11 under vacuum and loads the substrate W into the dry processing chamber 31. The dry processing unit 30 performs dry processing on the substrate W inside the dry processing chamber 31. The local transport unit 22 removes the dry-processed substrate W from the dry processing chamber 31 and loads it into the load lock chamber 11. Then, the load lock unit 10 raises the pressure inside the load lock chamber 11 to within the atmospheric pressure range, and the main transport unit 80 removes the substrate W from the load lock chamber 11.

[0034] Figure 2 is a schematic longitudinal cross-sectional view showing an example of a specific configuration of the dry processing module 1A. In the example in Figure 2, two dry processing modules 1A are stacked vertically, but this point will be explained later.

[0035] <Road Lock Unit> As shown in Figure 2, the load lock unit 10 includes a load lock chamber 11, a substrate mounting section 12, and a first pressure adjustment section 15.

[0036] The substrate placement section 12 is provided within the load lock chamber 11 and supports or holds the substrate W in a horizontal position. Here, "horizontal position" refers to a position where the thickness direction of the substrate W is aligned with the vertical direction. In the example in Figure 2, the substrate placement section 12 includes a plurality (e.g., three or more) of support pins 13. Each support pin 13 has a rod-like shape extending vertically, and its tip contacts the lower surface of the substrate W. In this state, the plurality of support pins 13 support the substrate W in a horizontal position. The substrate placement section 12 may also be a plate-shaped stage that supports the substrate W, or a suction stage that holds the substrate W by suction. In the example in Figure 2, the substrate placement section 12 supports or holds a single substrate W.

[0037] The first pressure adjustment unit 15 adjusts the pressure inside the load lock chamber 11. For example, the first pressure adjustment unit 15 adjusts the pressure inside the load lock chamber 11 to a value within the atmospheric pressure range. This brings the load lock chamber 11 into an atmospheric pressure state. The atmospheric pressure range includes standard atmospheric pressure and, for example, may be 80% or more and 120% or less of standard atmospheric pressure. Alternatively, the first pressure adjustment unit 15 adjusts the pressure inside the load lock chamber 11 to a value within the vacuum range, which is lower than the atmospheric pressure range. This brings the load lock chamber 11 into a vacuum state. The vacuum range may be, for example, one-tenth or less of standard atmospheric pressure, or one-hundredth or less.

[0038] In the example shown in Figure 2, the first pressure adjustment unit 15 includes a first gas suction unit 16 and a first gas supply unit 17. The first gas supply unit 17 supplies gas into the load lock chamber 11. The gas is, for example, an inert gas. The inert gas includes, for example, at least one of a noble gas and nitrogen gas. The noble gas includes, for example, at least one of argon gas and neon gas. The first gas suction unit 16 draws gas from inside the load lock chamber 11.

[0039] In the example shown in Figure 2, the first gas supply unit 17 includes a first supply pipe 171 and a first supply valve 172. The downstream end of the first supply pipe 171 is connected to, for example, the bottom of the load lock chamber 11. The upstream end of the first supply pipe 171 is connected to an inert gas supply source. The inert gas supply source has a storage section (not shown) for storing inert gas. The first supply pipe 171 is provided with a first supply valve 172. The first supply valve 172 is controlled by a control unit 90 to switch the opening and closing of the first supply pipe 171.

[0040] In the example shown in Figure 2, the first gas suction unit 16 includes a first suction pipe (corresponding to an example of a first gas pipe) 161, a first pressure regulating valve 162, and a suction unit VP. The upstream end of the first suction pipe 161 is connected to, for example, the bottom of the load lock chamber 11. The downstream end of the first suction pipe 161 is connected to the suction unit VP. The suction unit VP is, for example, a pump and is controlled by the control unit 90. The suction unit VP draws gas from the load lock chamber 11 through the first suction pipe 161. The first suction pipe 161 is provided with a first pressure regulating valve 162. The first pressure regulating valve 162 is controlled by the control unit 90. The first pressure regulating valve 162 adjusts the pressure in the load lock chamber 11 by adjusting its opening. The first pressure regulating valve 162 is, for example, an auto pressure controller. The first pressure regulating valve 162 may have a built-in pressure sensor, or a pressure sensor may be provided in the load lock chamber 11. The first pressure regulating valve 162 can adjust the pressure in the load lock chamber 11 with greater precision by adjusting its opening degree according to the value detected by the pressure sensor. The same applies to the other pressure regulating valves described later.

[0041] The dry transport gate GDT and load transport gate GLT of the load lock chamber 11 are openable and closable loading / unloading ports controlled by the control unit 90. The dry transport gate GDT opens and closes when the pressure inside the load lock chamber 11 is within the atmospheric pressure range. The main transport unit 80 loads and unloads substrates W into and out of the load lock chamber 11 through the dry transport gate GDT when the dry transport gate GDT is open. The load transport gate GLT opens and closes when the pressure inside the load lock chamber 11 and the pressure inside the local transport chamber 21 are within the vacuum range. The local transport unit 22 loads and unloads substrates W into and out of the load lock chamber 11 through the load transport gate GLT when the load transport gate GLT is open.

[0042] <Local transport unit> The local transport unit 20 includes a local transport chamber 21 and a local transport section 22, as well as a second pressure adjustment section 25.

[0043] The local transport unit 22 is a transport robot and is controlled by the control unit 90. In the example in Figure 2, the local transport unit 22 includes a hand 23 and a hand movement drive unit 24. The hand 23 has, for example, a plate-like shape. The hand 23 holds or supports the substrate W in a horizontal position. For example, the substrate W is placed on the hand 23. The hand movement drive unit 24 is controlled by the control unit 90 and moves the hand 23. For example, the hand movement drive unit 24 includes a drive source such as a motor and a power transmission unit that transmits the driving force of the drive source to the hand 23. The power transmission unit includes, for example, at least one of an arm mechanism, a ball screw mechanism, a rotation mechanism, and a cam mechanism.

[0044] The second pressure adjustment unit 25 adjusts the pressure inside the local transport chamber 21. Specifically, the second pressure adjustment unit 25 adjusts the pressure inside the local transport chamber 21 to a value within the vacuum range. This creates a vacuum state in the local transport chamber 21. The second pressure adjustment unit 25 includes a second gas suction unit 26 and a second gas supply unit 27. The second gas supply unit 27 supplies gas (e.g., inert gas) into the local transport chamber 21. The second gas suction unit 26 draws gas from inside the local transport chamber 21. In the example in Figure 2, the second gas supply unit 27 includes a second supply pipe 271 and a second supply valve 272, and the second gas suction unit 26 includes a second suction pipe (corresponding to an example of a second gas pipe) 261, a second pressure adjustment valve 262, and a suction unit VP. Since these configurations are the same as those of the first pressure adjustment unit 15, a detailed explanation is omitted.

[0045] The transport processing gate GTP is an openable and closable discharge entrance and is controlled by the control unit 90. The transport processing gate GTP opens and closes when the pressure in the local transport chamber 21 and the pressure in the dry processing chamber 31 are within the vacuum range. When the transport processing gate GTP is open, the local transport unit 22 transports the substrate W into and out of the dry processing chamber 31 through the transport processing gate GTP.

[0046] <Dry Processing Unit> The dry processing unit 30 includes a dry processing chamber 31, a substrate placement section 32, a third pressure adjustment section 35, and a processing gas supply section 38.

[0047] The substrate placement section 32 is located within the dry processing chamber 31 and supports or holds the substrate W in a horizontal position. In the example shown in Figure 2, the substrate placement section 32 includes a stage 33 and a plurality of lifting pins 34. The stage 33 has a plate-like shape and is positioned so that its thickness direction is aligned with the vertical direction. The substrate W is placed on the stage 33 in a horizontal position.

[0048] The lifting pin 34 has a rod-like shape extending vertically, and at least a portion of the lifting pin 34 is positioned to penetrate the stage 33. The lifting pin 34 moves up and down between a first height position and a second height position by a pin lifting drive unit 341. The first height position is the position where the tip of the lifting pin 34 is above the upper surface of the stage 33, and the second height position is the position where the tip of the lifting pin 34 is below the upper surface of the stage 33. The pin lifting drive unit 341 is controlled by a control unit 90. For example, the pin lifting drive unit 341 includes a drive source such as a motor or pump, and a power transmission unit that transmits the driving force of the drive source to the lifting pin 34. The power transmission unit includes, for example, a ball screw mechanism or an air cylinder. The lifting and lowering of the lifting pin 34 allows for the transfer of the substrate W between the stage 33 and the local transport unit 22.

[0049] The third pressure adjustment unit 35 adjusts the pressure inside the dry processing chamber 31. Specifically, the third pressure adjustment unit 35 adjusts the pressure inside the dry processing chamber 31 to a value within the vacuum range. This creates a vacuum state in the dry processing chamber 31. The third pressure adjustment unit 35 includes a third gas suction unit 36 ​​and a third gas supply unit 37. The third gas supply unit 37 supplies gas (e.g., inert gas) into the dry processing chamber 31. The third gas suction unit 36 ​​draws gas from inside the dry processing chamber 31. In the example in Figure 2, the third gas supply unit 37 includes a third supply pipe 371 and a third supply valve 372, and the third gas suction unit 36 ​​includes a third suction pipe (corresponding to an example of a third gas pipe) 361, a third pressure adjustment valve 362, and a suction unit VP. Since these configurations are the same as those of the first pressure adjustment unit 15, a detailed explanation is omitted. In the example shown in Figure 2, the downstream end of the third supply pipe 371 is connected to the side of the dry processing chamber 31.

[0050] The processing gas supply unit 38 supplies processing gas into the dry processing chamber 31. The processing gas acts on the main surface (in this case, the top surface) of the substrate W placed on the substrate placement unit 32 (specifically, the stage 33). This allows for dry processing on the main surface of the substrate W according to the type of processing gas. As an example, the processing gas is an etching gas. The etching gas removes the material to be etched from the substrate W. As a specific example, the processing gas may include hydrogen fluoride gas and may also include water vapor. By acting on the oxide film (e.g., silicon oxide film) of the substrate W with hydrogen fluoride gas (and water vapor), the oxide film can be etched. This dry processing may leave residues of the processing gas components (e.g., fluorine), by-reactants, or residues of the material to be etched on the main surface of the substrate W.

[0051] In the example shown in Figure 2, the processing gas supply unit 38 includes a supply pipe 381, a supply valve 382, ​​and a flow rate control valve 383. The downstream end of the supply pipe 381 is connected to, for example, the side of the dry processing chamber 31. In the example shown in Figure 2, the supply pipe 381 and the third supply pipe 371 merge into a common pipe, the downstream end of which is connected to the side of the dry processing chamber 31. The upstream end of the supply pipe 381 is connected to a processing gas supply source. The processing gas supply source has a storage section (not shown) for storing the processing gas. The supply pipe 381 is provided with a supply valve 382 and a flow rate control valve 383. The supply valve 382 is controlled by the control unit 90 to switch the opening and closing of the supply pipe 381. The flow rate control valve 383 is controlled by the control unit 90 to adjust the flow rate of the processing gas flowing through the supply pipe 381. If the processing gas contains multiple types of gases, a supply pipe 381, a supply valve 382, ​​and a flow control valve 383 corresponding to each type may be provided.

[0052] The dry processing unit 30 may include a plasma reactor for plasmaizing the processing gas. The plasma reactor may be, for example, a capacitively coupled or inductively coupled plasma reactor. The dry processing unit 30 may perform plasma processing on the substrate W by acting various active species (e.g., ions or radicals) contained in the plasma on the main surface of the substrate W.

[0053] <Wet Processing Module> Figure 3 is a schematic longitudinal cross-sectional view showing an example of the configuration of the wet processing module 1B. In the example in Figure 3, four wet processing modules 1B are stacked vertically, but this point will be explained later.

[0054] As shown in Figure 3, the wet processing module 1B includes a wet processing chamber 61, a substrate holding section 62, and a discharge section 63.

[0055] The wet processing chamber 61 forms a wet processing space for performing wet processing on the substrate W. The pressure inside the wet processing chamber 61 is within the atmospheric pressure range. The wet processing module 1B may be provided with a pressure adjustment unit, similar to the dry processing module 1A. This pressure adjustment unit can adjust the pressure inside the wet processing module 1B to within the atmospheric pressure range.

[0056] As shown in Figure 1, a wet transport gate GWT, which is a module transport gate GMT, is provided in the portion of the wet processing chamber 61 facing the main transport space TS. The wet transport gate GWT is an openable and closable transport entrance and is controlled by the control unit 90. When the wet transport gate GWT is open, the main transport unit 80 transports the substrate W into and out of the wet processing chamber 61 through the wet transport gate GWT.

[0057] The substrate holding unit 62 is located inside the wet processing chamber 61. The substrate holding unit 62 holds the substrate W in a horizontal position and rotates the substrate W around the rotation axis Q1. The rotation axis Q1 is an axis that extends vertically and passes through the center of the substrate W. The substrate holding unit 62 is also called a spin chuck.

[0058] In the example shown in Figure 3, the substrate holder 62 includes a spin base 621, chuck pins 622, and a rotation drive unit 623. The spin base 621 has a plate-like shape (e.g., a disc shape) and is positioned so that its thickness direction is aligned with the vertical direction. Multiple chuck pins 622 are provided on the upper surface of the spin base 621. The multiple chuck pins 622 are provided at equal intervals along the circumferential direction with respect to the rotation axis Q1. The multiple chuck pins 622 are provided so as to be displaceable between the holding position and the release position, which will be described below. The holding position is the position in which the chuck pins 622 contact the periphery of the substrate W. The multiple chuck pins 622 hold the substrate W by stopping at their respective holding positions. Figure 3 shows the chuck pins 622 stopped at the holding position. The release position is the position in which each chuck pin 622 is separated from the substrate W. The holding of the substrate W by the multiple chuck pins 622 is released when the multiple chuck pins 622 stop at their respective release positions. The substrate holding unit 62 also includes a pin drive unit (not shown) that displaces the chuck pins 622. The pin drive unit includes a drive source such as a motor and an air cylinder, and is controlled by the control unit 90.

[0059] The rotary drive unit 623 is controlled by the control unit 90 to rotate the spin base 621 around the rotation axis Q1. The rotary drive unit 623 includes, for example, a shaft and a motor. The upper end of the shaft is connected to the lower surface of the spin base 621, and the shaft extends from the lower surface of the spin base 621 along the rotation axis Q1. The motor is controlled by the control unit 90 to rotate the shaft around the rotation axis Q1. As a result, the spin base 621, chuck pin 622, and substrate W rotate together around the rotation axis Q1.

[0060] The substrate holding portion 62 does not necessarily need to have chuck pins 622. For example, the substrate holding portion 62 may hold the substrate W using a chuck method such as a vacuum chuck, an electrostatic chuck, or a Bernoulli chuck.

[0061] The discharge unit 63 sequentially discharges various processing liquids toward the main surface of the substrate W held by the substrate holding unit 62. The processing liquids include, for example, a chemical solution and a rinsing liquid. The chemical solution is a liquid that chemically reacts with the main surface of the substrate W, and includes, for example, a liquid that removes impurities from the main surface of the substrate W. As a specific example, the chemical solution includes at least one of hydrofluoric acid, sulfuric acid, nitric acid, a mixture of ammonium hydroxide and hydrogen peroxide (SC1), a mixture of hydrogen chloride and hydrogen peroxide (SC2), and a mixture of sulfuric acid and hydrogen peroxide (SPM). The rinsing liquid is a liquid that physically washes away at least one of the liquid and solid (e.g., particles) on the main surface of the substrate W, and includes, for example, at least one of pure water (deionized water), carbon dioxide water, and an organic solvent. The organic solvent includes, for example, isopropyl alcohol.

[0062] In the example shown in Figure 3, the discharge unit 63 includes a nozzle 631, a supply pipe 632, a supply valve 633, and a flow rate control valve 634. The nozzle 631 is located inside the wet processing chamber 61 and discharges the processing liquid toward the main surface of the substrate W held by the substrate holding unit 62. In the example shown in Figure 3, the nozzle 631 is located above the substrate W held by the substrate holding unit 62.

[0063] The downstream end of the supply pipe 632 is connected to the nozzle 631, and the upstream end of the supply pipe 632 is connected to the processing liquid supply source. The processing liquid supply source has a tank (not shown) for storing the processing liquid. The supply pipe 632 is equipped with a supply valve 633 and a flow control valve 634. The supply valve 633 is controlled by the control unit 90 to switch the opening and closing of the supply pipe 632. The flow control valve 634 is controlled by the control unit 90 to adjust the flow rate of the processing liquid flowing through the supply pipe 632. If the processing liquid contains multiple types of liquids, nozzles 631, supply pipes 632, supply valves 633 and flow control valves 634 may be provided according to each type of liquid. Note that the nozzle 631 may be shared by two or more types of liquids.

[0064] In the example shown in Figure 3, a nozzle movement drive unit 635 is connected to the nozzle 631. The nozzle movement drive unit 635 is controlled by the control unit 90 and moves the nozzle 631 between the processing position and the standby position, which will be described below. The processing position is the position where the nozzle 631 discharges the processing liquid, for example, a position perpendicular to the center of the substrate W. In the example shown in Figure 3, the nozzle 631 is shown stopped at the processing position. The standby position is a position where the nozzle 631 does not discharge the processing liquid toward the substrate W, for example, a position radially outside the substrate W. The nozzle movement drive unit 635 may have, for example, an arm rotation mechanism. For example, the arm rotation mechanism includes an arm (not shown), a support column, and a drive source. The support column is provided radially outside the guard 67 (described later) and extends vertically. The arm extends horizontally, its tip connected to the nozzle 631 and its base connected to the support column. The drive source is controlled by the control unit 90, which rotates the support column in forward and reverse directions within a predetermined angular range. The drive source includes, for example, a motor. When the support column rotates in forward and reverse directions within a predetermined angular range, the nozzle 631 reciprocates along the circumferential direction with the support column as the axis of rotation. The support column is installed so that the processing position and standby position are located on the movement trajectory of the nozzle 631. Note that the nozzle movement drive unit 635 does not necessarily have to include an arm rotation mechanism, and may include a linear motion mechanism such as a linear motor.

[0065] With the substrate holding unit 62 rotating the substrate W, the discharge unit 63 sequentially supplies the processing liquid, allowing sequential processing of the substrate W according to the type of processing liquid. For example, first, the discharge unit 63 discharges the chemical solution onto the main surface of the substrate W, thereby performing chemical treatment on the main surface of the substrate W. This makes it possible to remove impurities remaining on the main surface of the substrate W after the dry treatment of the dry treatment module 1A, for example. Next, the discharge unit 63 discharges the rinsing liquid onto the main surface of the substrate W, pushing the chemical solution on the main surface of the substrate W radially outward. This replaces the processing liquid on the main surface of the substrate W from the chemical solution to the rinsing liquid. Next, with the discharge unit 63 stopped discharging the processing liquid, the substrate holding unit 62 increases the rotation speed of the substrate W to dry the substrate W.

[0066] In the example shown in Figure 3, a guard 67 is provided inside the wet processing chamber 61. The guard 67 has a cylindrical shape that surrounds the substrate holding portion 62 and catches the processing liquid that splashes from the periphery of the substrate W. The processing liquid caught by the guard 67 flows down the guard 67 and is discharged to the outside through a discharge pipe (not shown).

[0067] <Main transport unit> Referring to Figure 1, the main conveying unit 80 is located within the main conveying space TS. The main conveying unit 80 is equipped with a conveying movement drive unit 85. The conveying movement drive unit 85 is controlled by a control unit 90 to move the main conveying unit 80 along the movement direction Dx. The conveying movement drive unit 85 includes, for example, a drive source such as a motor and a power transmission unit that transmits the driving force from the drive source to the main conveying unit 80. The power transmission unit includes, for example, a ball screw mechanism.

[0068] The main transport unit 80 includes at least one hand 81 and a hand movement drive unit 82 that drives the hand 81. The main transport unit 80 may include a plurality (e.g., four) of hands 81. The hand movement drive unit 82 may include, for example, a forward / backward drive unit, a rotation drive unit, and a lifting drive unit (not shown). The forward / backward drive unit moves each of the plurality of hands 81 independently along a predetermined forward / backward direction. For example, the forward / backward drive unit includes an arm drive unit provided corresponding to each hand 81. The arm drive unit includes a plurality of arms and a motor that adjusts the connection angle of the plurality of arms. One end of the connecting body including the plurality of arms is connected to a hand 81, and the other end is connected to a rotation drive unit. By adjusting the connection angle of the arms, the hand 81 moves along the forward / backward direction. The rotation drive unit includes a motor and rotates the hand 81 and the forward / backward drive unit together around a rotation axis along the vertical direction. This rotation allows adjustment of the orientation (i.e., forward / backward direction) of the hand 81. The lifting drive unit raises and lowers the hand 81, the forward / backward drive unit, and the rotation drive unit as a single unit. This lifting and lowering allows the hand 81 to be moved to a height position suitable for the transfer unit 123 and the processing module 1, respectively. The lifting drive unit includes, for example, a drive source such as a motor and a power transmission unit that transmits the driving force of the drive source to the hand 81. The power transmission unit includes, for example, a ball screw mechanism or a cam mechanism.

[0069] <Department Head> Figure 4 is a schematic diagram showing an example of the internal configuration of the control unit 90. The control unit 90 comprehensively controls the substrate processing apparatus 100. The control unit 90 is an electronic circuit and includes, for example, a data processing unit 91 and a storage unit 92. The data processing unit 91 and the storage unit 92 may be interconnected via a bus 93. The data processing unit 91 may be an arithmetic processing unit such as a CPU (Central Processor Unit). The storage unit 92 may include a non-temporary storage unit (e.g., ROM (Read Only Memory)) 921 and a temporary storage unit (e.g., RAM (Random Access Memory)) 922. The non-temporary storage unit 921 may store, for example, a program that defines the processing to be executed by the control unit 90. By executing this program, the data processing unit 91 enables the control unit 90 to execute the processing defined in the program. Of course, some or all of the processing performed by the control unit 90 may be performed by hardware such as dedicated logic circuits. In the example of Figure 4, the control unit 90 is also connected to a non-temporary storage unit 94 (e.g., memory such as flash memory or a hard disk).

[0070] As described above, the substrate processing apparatus 100 according to the first embodiment includes a plurality of dry processing modules 1A, a wet processing module 1B, and a main transport unit 80, the main transport unit 80 transports substrates W between the dry processing modules 1A and the wet processing modules 1B. Each dry processing module 1A includes a load lock unit 10, a local transport unit 20, and a dry processing unit 30. Therefore, the main transport unit 80 can transport substrates W to another dry processing module 1A while a dry processing module 1A is operating (for example, during pressure adjustment, while the local transport unit 22 is transporting the substrates W, or while the dry processing unit 30 is performing dry processing). Thus, the main transport unit 80 can load and unload substrates W to and from the dry processing modules 1A with a higher throughput.

[0071] Furthermore, in the example described above, each of the load lock unit 10 and the local transport unit 20 is provided on a one-to-one basis with respect to the dry processing unit 30. As a result, the local transport unit 20 can transport the substrate W to the dry processing unit 30 more quickly. In other words, if the local transport unit 20 is provided to correspond to multiple dry processing units 30, a waiting time will occur because the local transport unit 20 cannot load or unload the substrate W to another dry processing unit 30 while it is loading or unloading the substrate W to one dry processing unit 30. In contrast, if the local transport unit 20 is provided on a one-to-one basis with respect to the dry processing unit 30, this waiting time does not occur. As a result, loading and unloading to the dry processing unit 30 can be performed with even higher throughput.

[0072] Furthermore, in the example described above, multiple wet processing modules 1B are provided. Therefore, after the main transport unit 80 transports a substrate W to one wet processing module 1B, it can transport the substrate W to another wet processing module 1B without waiting for the wet processing in that module 1B to be completed. Thus, the main transport unit 80 can load and unload substrates W to and from the wet processing modules 1B with a higher throughput.

[0073] Furthermore, the main transport unit 80 is capable of transporting substrates W to each of the processing modules 1 stacked vertically. In other words, the lifting range of the hand 81 of the main transport unit 80 is set to a range that allows the hand 81 to stop at a height position corresponding to the uppermost processing module 1 and the lowermost processing module 1, respectively. Therefore, even if the dry processing module 1A and the wet processing module 1B are installed at different height positions, the main transport unit 80 can transport substrates W between the dry processing module 1A and the wet processing module 1B. Consequently, the number of processing modules 1 in each tower TW may differ among multiple towers TW. In other words, the degree of freedom in the installation of the dry processing module 1A and the wet processing module 1B can be improved.

[0074] Furthermore, in the above example, in each of the dry processing modules 1A, the load lock unit 10 (specifically the load lock chamber 11), the local transport unit 20 (specifically the local transport chamber 21), and the dry processing unit 30 (specifically the dry processing chamber 31) are arranged along the direction of movement Dx. Therefore, workers can move between the space on the opposite side of the main transport space TS to each load lock unit 10. For example, referring to Figure 1, workers can move between the space on the opposite side of the main transport space TS to the first module group G1. Therefore, workers can easily perform maintenance on each load lock unit 10 of the first module group G1. The same applies to the local transport unit 20 and the dry processing unit 30 of the first module group G1. Also, in the example in Figure 1, workers can move between the space on the opposite side of the main transport space TS to the second module group G2. Therefore, maintenance on the load lock unit 10, local transport unit 20, and dry processing unit 30 of the second module group G2 is also easy.

[0075] <Location of dry processing module and wet processing module> In each dry processing module 1A, the load lock unit 10, the local transport unit 20, and the dry processing unit 30 are arranged in this order in the direction of movement Dx. Therefore, the dry transport gate GDT provided on the load lock unit 10 is located at the end of the dry processing module 1A in the direction of movement Dx.

[0076] In the example shown in Figure 1, the first module group G1 includes one or more (one in the figure) dry processing modules 1A and one or more (one in the figure) wet processing modules 1B. In the first module group G1, the dry processing module 1A and the wet processing module 1B are arranged along the direction of movement Dx.

[0077] In the example shown in Figure 1, the dry processing unit 30, local transport unit 20, and load lock unit 10 are arranged in this order as they move away from the indexer block 110 (or transfer section 123) in this first module group G1. Here, we will introduce and explain the first and second ends in the longitudinal direction of the main transport space TS. The first end of the main transport space TS is the end on the transfer section 123 side, and the second end is the end on the opposite side of the first end. The dry processing unit 30, local transport unit 20, and load lock unit 10 are arranged in this order in the direction from the first end to the second end in the longitudinal direction of the main transport space TS. In other words, the load lock unit 10 is located at a position in the dry processing module 1A that is farther away from the indexer block 110. For this reason, even if the entire first module group G1 is located closer to the indexer block 110 in the movement direction Dx, the dry transport gate GDT can still face the main transport space TS. In the example shown in Figure 1, the first module group G1 is arranged such that a portion of the first module group G1 on the indexer block 110 side faces the transfer section 123 in the width direction Dy. In other words, at least a portion of the dry processing unit 30 closest to the indexer block 110 within the first module group G1 faces the transfer section 123 in the width direction Dy. To put it another way, the end G1a of the first module group G1 on the indexer block 110 side is located on the indexer block 110 side relative to the end 123b of the transfer section 123 that is opposite to the indexer block 110.

[0078] The end 123b of the transfer section 123 is located closer to the indexer block 110 than the module transport gate GMT that is closest to the indexer block 110 among the first module group G1. Therefore, all module transport gates GMT of the first module group G1 can face the main transport space TS. In the specific example shown in Figure 1, the end 123b of the transfer section 123 is located closer to the indexer block 110 than the end G1b of the dry processing unit 30 that is closest to the indexer block 110 among the first module group G1. End G1b is the end opposite to end G1a.

[0079] In this way, when the first module group G1 is positioned closer to the indexer block 110 in the movement direction Dx, the transport distance between the transfer unit 123 and the module transport gate GMT can be shortened. Therefore, the main transport unit 80 can transport the substrate W more quickly between the transfer unit 123 and each processing module 1 of the first module group G1.

[0080] Furthermore, in the example shown in Figure 1, the wet processing module 1B is located at the last position in the first module group G1, furthest from the indexer block 110 (or transfer section 123). In other words, the processing module 1 furthest from the indexer block 110 in the first module group G1 is the wet processing module 1B. Now, while the dry processing module 1A has three chambers arranged along the movement direction Dx, the wet processing module 1B includes a single wet processing chamber 61 into which the substrate W is loaded and unloaded. For this reason, the wet transport gate GWT can be located closer to the center of the movement direction Dx in the processing module 1 compared to the dry transport gate GDT.

[0081] Here, the entirety comprising the load lock chamber 11, local conveying chamber 21, and dry processing chamber 31 is referred to as the dry chamber. The size of the dry chamber in the direction of movement Dx and the size of the wet processing chamber 61 in the direction of movement Dx are approximately the same.

[0082] In the example shown in Figure 1, the dry transport gate GDT is shown by a dashed line when the dry processing module 1A is placed at the last position of the first module group G1. As can be seen from Figure 1, when a wet processing module 1B is provided at the last position, the position of the module transport gate GMT at the last position can be brought closer to the indexer block 110. Therefore, the transport distance between the module transport gate GMT of the last wet processing module 1B and the module transport gate GMT of the transfer unit 123 or the dry processing module 1A can be shortened. Consequently, the main transport unit 80 can transport the substrate W more quickly between the last wet processing module 1B and the transfer unit 123 or the dry processing module 1A.

[0083] On the other hand, in the example of Figure 1, the second module group G2 includes multiple processing modules 1, and at least one (two in the figure) of these processing modules 1 is a dry processing module 1A. In the second module group G2, the load lock unit 10, the local transport unit 20, and the dry processing unit 30 are provided in this order as they move away from the indexer block 110 (or transfer section 123). In other words, the load lock unit 10, the local transport unit 20, and the dry processing unit 30 are arranged in this order in the direction from the first end to the second end in the longitudinal direction of the main transport space TS. That is, the arrangement order of the units of the dry processing module 1A in the second module group G2 is the opposite of the arrangement order of the units of the dry processing module 1A in the first module group G1.

[0084] The dry processing module 1A of the second module group G2 may have a configuration obtained by rotating the dry processing module 1A of the first module group G1 by 180 degrees around a rotation axis along the vertical direction. This allows the configurations of the dry processing module 1A of the first module group G1 and the dry processing module 1A of the second module group G2 to be identical. Therefore, the dry processing modules 1A of the first module group G1 and the second module group G2 can be manufactured at a lower cost.

[0085] If the second module group G2 is positioned closer to the indexer block 110, the dry transport gate GDT closest to the indexer block 110 may face the transfer section 123 in the width direction Dy. In this case, the main transport section 80 will interfere with the transfer section 123 and will not be able to access the dry transport gate GDT. Therefore, in the example of Figure 1, the second module group G2 is positioned such that its position in the movement direction Dx is shifted further away from the indexer block 110 than that of the first module group G1. Specifically, the second module group G2 is positioned so that it does not face the transfer section 123 in the width direction Dy. In other words, the end G2a of the second module group G2 on the indexer block 110 side is at the same position as the end 123b of the transfer section 123, or is located on the opposite side of the indexer block 110 relative to the end 123b. With this arrangement, all module transport gates GMT in the second module group G2 can face the main transport space TS.

[0086] Furthermore, in the example shown in Figure 1, the dry processing module 1A is located at the last position in the second module group G2, furthest from the indexer block 110. In other words, the processing module 1 furthest from the indexer block 110 in the second module group G2 is the dry processing module 1A. Now, in the arrangement order of the dry processing module 1A in the second module group G2, the module transport gate GMT is located in a position close to the indexer block 110 within the dry processing module 1A. Therefore, the module transport gate GMT at the last position is closer to the indexer block 110 than when the wet processing module 1B is located at the last position. Consequently, the main transport unit 80 can transport the substrate W more quickly between the dry processing module 1A at the last position in the second module group G2 and the transfer unit 123 or the wet processing module 1B.

[0087] <Number of dry processing modules and wet processing modules> Here, as an example, the drying time required for dry processing is longer than the wet processing time required for wet processing. The drying time may be, for example, the time for supplying the processing gas, or it may be the time from when the substrate W is brought into the dry processing chamber 31 until it is removed. The wet processing time may be the time from when the processing liquid is supplied until the substrate W is dried, or it may be the time from when the substrate W is brought into the wet processing chamber 61 until it is removed. As an example, the drying time may be about 300 seconds, and the wet processing time may be about 200 seconds.

[0088] The number of dry processing modules 1A may be set to be greater than the number of wet processing modules 1B. The number of dry processing modules 1A and wet processing modules 1B may be set such that a first value, obtained by dividing the dry processing time by the number of dry processing modules 1A, balances with a second value, obtained by dividing the wet processing time by the number of wet processing modules 1B. Here, the first value balancing with the second value means, for example, that the following condition is satisfied. That is, the value obtained by dividing the difference between the first value and the second value by the first value is less than or equal to a predetermined reference value. The reference value may be, for example, 0.2 or less, or 0.1 or less. In the above example, the ratio of the number of dry processing modules 1A to the number of wet processing modules 1B may be set to 3:2. For example, each of the three towers TW is composed of two dry processing modules 1A, and one tower TW is composed of four wet processing modules 1B. In this case, the number of dry processing modules 1A is 6, and the number of wet processing modules 1B is 4.

[0089] According to this, the waiting time during which the substrate W waits until either the dry processing module 1A or the wet processing module 1B is completed can be reduced. Therefore, the substrate processing apparatus 100 can perform dry processing and wet processing on multiple substrates W with higher throughput.

[0090] <Dry Tower> In the example shown in Figure 2, multiple (two in this case) dry processing modules 1A are stacked vertically to form a single tower TW. The tower TW in Figure 2 does not include a wet processing module 1B. Hereafter, a tower TW that does not include a wet processing module 1B but includes two or more dry processing modules 1A will also be referred to as a dry tower TWA.

[0091] In the example shown in Figure 2, a piping space PS is provided directly below the entire load lock chamber 11, local transport chamber 21, and dry processing chamber 31 (i.e., the dry chamber) in the dry tower TWA. If we refer to the space in which the dry chamber is provided as the chamber space, then in the dry tower TWA, the chamber space and the piping space PS are arranged alternately in the vertical direction. At least a portion of the piping system of the dry processing module 1A is provided in the piping space PS.

[0092] In the example shown in Figure 2, the piping space PS is provided with at least a portion of the first suction pipe 161 and the first pressure regulating valve 162. Therefore, the first pressure regulating valve 162 is located near the load lock chamber 11. Consequently, the first pressure regulating valve 162 can adjust the pressure in the load lock chamber 11 with greater precision. In addition, in the example shown in Figure 2, the piping space PS is also provided with at least a portion of the second suction pipe 261 and the second pressure regulating valve 262. Therefore, the second pressure regulating valve 262 can adjust the pressure in the local transport chamber 21 with greater precision. Furthermore, in the example shown in Figure 2, the piping space PS is also provided with at least a portion of the third suction pipe 361 and the third pressure regulating valve 362. Therefore, the third pressure regulating valve 362 can adjust the pressure in the dry processing chamber 31 with greater precision.

[0093] In the example shown in Figure 2, the suction section VP is located below the dry tower TWA. For example, the dry tower TWA may be located on an upper floor, while the suction section VP is located on a lower floor (under the floor). Since the suction section VP is larger than, for example, the first pressure regulating valve 162, by placing such a large suction section VP below the dry tower TWA, the height of each piping space PS can be reduced. Consequently, the height of the dry tower TWA can be reduced.

[0094] In the example shown in Figure 2, the piping space PS is provided with at least a portion of the first supply pipe 171 and the first supply valve 172. Therefore, the first supply valve 172 is located near the load lock chamber 11. Consequently, the first supply valve 172 can switch the supply and stop of gas to the load lock chamber 11 with high responsiveness. In addition, in the example shown in Figure 2, the piping space PS is also provided with at least a portion of the second supply pipe 271 and the second supply valve 272. Therefore, the second supply valve 272 can switch the supply and stop of gas to the local transport chamber 21 with high responsiveness. Furthermore, in the example shown in Figure 2, the piping space PS is also provided with at least a portion of the third supply pipe 371 and the third supply valve 372. Therefore, the third supply valve 372 can switch the supply and stop of gas to the dry processing chamber 31 with high responsiveness.

[0095] In the example described above, the dry tower TWA does not have a wet treatment module 1B. Therefore, the piping for the dry treatment module 1A and the piping for the wet treatment module 1B are not mixed within the dry tower TWA. This simplifies the piping configuration within the dry tower TWA.

[0096] <Suction part> In the example shown in Figure 2, the first suction pipe 161 connected to the load lock chamber 11 and the second suction pipe 261 connected to the local transport chamber 21 are connected to a common suction section VP. For example, the downstream ends of the first suction pipe 161 and the second suction pipe 261 are connected to the upstream ends of the common pipe, and the downstream end of the common pipe is connected to the suction section VP. Hereafter, this suction section VP will be referred to as the first suction section VP1. In the example shown in Figure 2, the first suction section VP1 is not connected to the third suction pipe 361.

[0097] When the first suction unit VP1 is activated, it draws gas from the load lock chamber 11 through the first suction pipe 161 and draws gas from the local transport chamber 21 through the second suction pipe 261. In other words, the first suction unit VP1 serves both the load lock chamber 11 and the local transport chamber 21. This allows for a reduction in the number of suction units VP, thereby reducing manufacturing costs.

[0098] On the other hand, in the example shown in Figure 2, the third suction pipe 361 connected to the dry processing chamber 31 is connected to a suction section VP (hereinafter referred to as the second suction section VP2) that is separate from the first suction section VP1. In the example shown in Figure 2, the second suction section VP2 is not connected to the first suction pipe 161 or the second suction pipe 261. When the second suction section VP2 is activated, it draws gas from the dry processing chamber 31 through the third suction pipe 361. As a result, gas from the load lock chamber 11 and gas from the local transport chamber 21 do not flow into the third suction pipe 361 and the second suction section VP2. Therefore, the third pressure regulating valve 362 can adjust the pressure in the dry processing chamber 31 without being affected by these gases. In other words, pressure fluctuations in the dry processing chamber 31 caused by these gases can be avoided. Therefore, the third pressure regulating valve 362 can adjust the pressure in the dry processing chamber 31 with greater precision. Since the pressure value inside the dry processing chamber 31 affects the result of the dry processing on the substrate W, the dry processing unit 30 can perform the dry processing on the substrate W with higher precision.

[0099] <Wet Tower> In the example shown in Figure 3, multiple (two in this case) wet treatment modules 1B are stacked vertically to form a single tower TW. The tower TW in Figure 3 does not include a dry treatment module 1A. Hereafter, a tower TW that does not include a dry treatment module 1A but includes two or more wet treatment modules 1B will also be referred to as a wet tower TWB. Since a wet tower TWB does not have a dry treatment module 1A, the piping for dry treatment modules 1A and piping for wet treatment modules 1B are not mixed within the wet tower TWB. Therefore, the piping configuration within the wet tower TWB can be simplified.

[0100] <Conveyor system for dry processing module> Figure 5 is a schematic diagram showing an example of the configuration of the transport system of the dry processing module 1A. In the example of Figure 5, the load lock unit 10 includes a plurality of support pins 13, which are an example of a second support member that supports the substrate W, and a pin lifting drive unit 14, which is an example of a second lifting drive unit that raises and lowers the second support member. The pin lifting drive unit 14 raises and lowers the support pins 13 between a first height position H11 and a second height position H12, which will be described below. The first height position H11 is a position where the tips of the support pins 13 are above the upper surface of the hand 23 of the local transport unit 22. The substrate W, supported by the plurality of support pins 13 located at the first height position H11, is located above the hand 23 and away from the hand 23. The second height position H12 is a position where the tips of the support pins 13 are below the hand 23 of the local transport unit 22.

[0101] The pin lifting drive unit 14 includes, for example, a drive source such as a motor or an air pump, and a power transmission unit that transmits the driving force from the drive source to a plurality of support pins 13. The power transmission unit is, for example, a ball screw mechanism or an air cylinder mechanism. The pin lifting drive unit 14 is controlled by the control unit 90.

[0102] In the example shown in Figure 5, the hand movement drive unit 24 of the local transport unit 20 has a movement function to move the substrate W horizontally, but it does not have a lifting function to move the substrate W up and down. In other words, when loading and unloading the substrate W between the load lock unit 10 and the local transport unit 20, the local transport unit 22 is responsible for the horizontal movement of the substrate W, while the support pins 13 and the pin lifting drive unit 14 are responsible for the lifting and lowering of the substrate W.

[0103] In the example shown in Figure 5, the hand movement drive unit 24 includes a forward / backward drive unit 241 and a rotational drive unit 242. The forward / backward drive unit 241 moves the hand 23 along one horizontal direction (hereinafter referred to as the forward / backward direction). Referring also to Figure 1, for example, the hand 23 includes one or more elongated members 23a extending along the forward / backward direction. In the example shown in Figure 1, there are multiple (specifically two) elongated members 23a, and the base ends of the multiple elongated members 23a are connected by a connecting member 23b. The forward / backward drive unit 241 includes, for example, multiple arms and a motor that adjusts the connection angle of the multiple arms. The hand 23 is connected to one end of the connecting body including the multiple arms, and the other end is connected to the rotational drive unit 242. By adjusting the connection angle of the arms, the hand 23 moves along the forward / backward direction. Note that the forward / backward drive unit 241 may include a linear motion mechanism such as a ball screw mechanism instead of an arm drive.

[0104] The rotary drive unit 242 includes a motor and rotates the hand 23 and the forward / backward drive unit 241 together around a rotation axis aligned vertically. This rotation allows adjustment of the orientation of the hand 23. Specifically, the rotary drive unit 242 rotates the hand 23 between a local rotation position and a dry rotation position, which are described below. The local rotation position is the rotation position in which the tip of the elongated member 23a faces the load lock unit 10, and the dry rotation position is the rotation position in which the tip of the elongated member 23a faces the dry processing unit 30.

[0105] With the hand 23 in its local rotation position, the forward / backward drive unit 241 moves the hand 23 along the forward / backward direction between the load transfer position in the load lock chamber 11 and the position in the local transport chamber 21, which will be described next. The load transfer position is the position where the substrate W is transferred between the support pins 13 and the local transport unit 22. That is, the load transfer position is the position where the hand 23 is directly below the substrate W, with the multiple support pins 13 supporting the substrate W at a first height position H11. In this state, when the multiple support pins 13 descend from the first height position H11 to the second height position H12, the substrate W is transferred to the hand 23. On the other hand, with the hand 23 supporting the substrate W at the load transfer position, when the multiple support pins 13 rise from the second height position H12 to the first height position H11, the multiple support pins 13 lift the substrate W from the hand 23 of the local transport unit 22.

[0106] The dry processing unit 30 includes a plurality of lifting pins 34, which are an example of a first support member that supports the substrate W, and a pin lifting drive unit 341, which is an example of a first lifting drive unit that raises and lowers the first support member. The pin lifting drive unit 341 is controlled by the control unit 90 and raises and lowers the plurality of lifting pins 34 between a first height position H31 and a second height position H32, which will be described below. The first height position H31 is the position where the tips of the plurality of lifting pins 34 are above the hand 23 of the local transport unit 22, and the second height position H32 is the position where the tips of the plurality of lifting pins 34 are below the hand 23 of the local transport unit 22. Here, as an example, the second height position H32 is the position where the tips of the plurality of lifting pins 34 are below the upper surface of the stage 33. The lifting pins 34 and the pin lifting drive unit 341 are the same as the support pins 13 and the pin lifting drive unit 14, respectively.

[0107] With the hand 23 in the dry rotation position, the forward / backward drive unit 241 moves the hand 23 along the forward / backward direction between a position in the local transport chamber 21 and a dry transfer position in the dry processing chamber 31, which will be described next. The dry transfer position is the position where the substrate W is transferred between the lifting pins 34 and the local transport unit 22. That is, the dry transfer position is the position where the hand 23 is directly below the substrate W, with the multiple lifting pins 34 supporting the substrate W at a first height position H31. In this state, when the multiple lifting pins 34 descend from the first height position H31 to the second height position H32, the substrate W is transferred to the hand 23. On the other hand, with the hand 23 supporting the substrate W at the dry transfer position, when the multiple lifting pins 34 rise from the second height position H32 to the first height position H31, the multiple lifting pins 34 lift the substrate W from the hand 23 of the local transport unit 22.

[0108] As described above, in the example of Figure 5, the load lock unit 10 and the dry processing unit 30 have the function of raising and lowering the substrate W. Therefore, the local transport unit 20 does not need to have the function of raising and lowering the substrate W, and the vertical size of the local transport unit 20 can be reduced. In other words, since the local transport unit 22 includes the hand 23 and the hand movement drive unit 24, its vertical size is large, but by omitting the lifting drive unit, the vertical size of the local transport unit 20 is effectively reduced. On the other hand, the load lock unit 10 only needs to support the substrate W and does not need to have a horizontal movement function. Therefore, even if the load lock unit 10 is provided with a lifting drive unit for the substrate W, its vertical size will not be significantly larger than that of the local transport unit 20. The same applies to the dry processing unit 30.

[0109] Furthermore, since the local transport unit 22 does not have a lifting drive unit, the height and width of the load transport gate GLT and the transport processing gate GTP can be reduced. This reduces the cost of each gate. Also, since it is not necessary to raise the hand 23 above the lifting pin 34 within the dry processing chamber 31, the height and width of the dry processing chamber 31 can be reduced. This reduces the volume of the dry processing chamber 31. Therefore, the third pressure adjustment unit 35 can adjust the pressure in the dry processing chamber 31 with higher precision.

[0110] In the example shown in Figure 5, the pin lifting drive unit 14 is located in the external space of the load lock chamber 11. In the example shown in Figure 5, the lower ends of the multiple support pins 13 are connected to the upper surface of the support plate 18. The support plate 18 has, for example, a plate-like shape and is provided in a position where its thickness direction is aligned with the vertical direction. In the example shown in Figure 5, an opening is formed at the bottom of the load lock chamber 11, and the multiple support pins 13 are arranged to pass through this opening. In the example shown in Figure 5, a bellows 19 is provided between the bottom of the load lock chamber 11 and the support plate 18. The bellows 19 has a cylindrical and corrugated shape. In the example shown in Figure 5, multiple bellows 19 are provided, each surrounding the lower portion of the multiple support pins 13. The bellows 19 are deformable in the vertical direction. That is, the vertical size of the bellows 19 is variable. The upper end periphery of the bellows 19 is connected to the periphery of the opening of the load lock chamber 11, and the lower end periphery of the bellows 19 is connected to the periphery of the support plate 18.

[0111] The pin lifting drive unit 14 is located below the support plate 18. The pin lifting drive unit 14 is connected to the support plate 18 and moves the support plate 18 up and down. As a result, the multiple support pins 13 connected to the support plate 18 move up and down.

[0112] Since the pin lifting drive unit 14 is located outside the load lock chamber 11, it can be positioned within an atmospheric pressure space (e.g., the piping space PS). This improves the reliability of the pin lifting drive unit 14. Furthermore, as shown in Figure 5, a bellows 19 is provided in a one-to-one ratio with respect to the support pins 13. This reduces the volume of the vacuum section within the load lock chamber 11 compared to a structure where a single bellows surrounds multiple support pins 13. As a result, the first pressure adjustment unit 15 can adjust the pressure within the load lock chamber 11 with greater precision.

[0113] In the example shown in Figure 5, the pin lifting drive unit 341 is located in the space outside the dry processing chamber 31. In the example shown in Figure 5, the lower ends of the multiple lifting pins 34 are connected to the upper surface of the support plate 342, and a bellows 343 is provided between the bottom of the dry processing chamber 31 and the support plate 342. In the example shown in Figure 5, multiple bellows 343 are provided, each surrounding the lower portion of the multiple lifting pins 34. These are similar to the support plate 18 and the bellows 19, respectively.

[0114] As described above, the substrate processing apparatus 100 has been described in detail, but the above description is illustrative in all respects, and this disclosure is not limited thereto. Furthermore, the various modifications described above can be applied in combination as long as they do not contradict each other. And it is understood that a number of modifications not illustrated can be conceivable without falling outside the scope of this disclosure.

[0115] For example, in the above example, the first pressure regulating valve 162 is provided in the first suction pipe 161. However, the first pressure regulating valve 162 may also be provided in the first supply pipe 171 (corresponding to an example of the first gas pipe). Similarly, the second pressure regulating valve 262 may be provided in the second supply pipe 271 (corresponding to an example of the second gas pipe), and the third pressure regulating valve 362 may be provided in the third supply pipe 371 (corresponding to an example of the third gas pipe).

[0116] This disclosure includes the following aspects:

[0117] The first embodiment is a substrate processing apparatus comprising a load lock unit for switching between atmospheric pressure and vacuum states, a dry processing unit for performing dry processing on a substrate in a vacuum state, and a plurality of dry processing modules including a local transport unit for transporting a substrate between the load lock unit and the dry processing unit in a vacuum state, one or more wet processing modules for performing wet processing on the substrate, and a main transport unit for loading and unloading the substrate into and out of the load lock unit in an atmospheric pressure state and transporting the substrate between the dry processing modules and the wet processing modules.

[0118] A second embodiment is a substrate processing apparatus according to the first embodiment, wherein the main transport unit moves along the longitudinal direction of the main transport space within a main transport space having an elongated shape, and in the dry processing module, the load lock unit, the local transport unit, and the dry processing unit are arranged along the longitudinal direction, and the local transport unit is provided between the load lock unit and the dry processing unit.

[0119] A third embodiment is a substrate processing apparatus according to the second embodiment, wherein the main transport unit is provided on the first end side in the longitudinal direction with respect to the main transport space, and the main transport unit further comprises a transfer unit for transferring the substrate, and a first module group is arranged on the first side in the width direction perpendicular to the longitudinal direction with respect to the main transport space, the first module group includes one or more dry processing modules and one or more wet processing modules arranged along the longitudinal direction, in which the dry processing module belonging to the first module group is arranged in this order from the first end toward the second end in the longitudinal direction of the main transport space, and the wet processing module is provided at the last position of the first module group, furthest from the transfer unit.

[0120] A fourth embodiment is a substrate processing apparatus according to the third embodiment, wherein at least a portion of the dry processing unit located in the first module group closest to the transfer section faces the transfer section in the width direction.

[0121] A fifth embodiment is a substrate processing apparatus according to any one of the second to fourth embodiments, wherein the main transport unit is provided on the first end side in the longitudinal direction with respect to the main transport space, and the main transport unit further comprises a transfer unit for transferring the substrate, and a second module group is provided on the second side in the width direction perpendicular to the longitudinal direction with respect to the main transport space, the second module group includes one or more dry processing modules arranged along the longitudinal direction, and in the dry processing module belonging to the second module group, the load lock unit, the local transport unit and the dry processing unit are arranged in this order in the direction from the first end toward the second end in the longitudinal direction of the main transport space, and the dry processing module is provided at the last position in the second module group, furthest from the transfer unit.

[0122] The sixth embodiment is a substrate processing apparatus according to any one of the first to fifth embodiments, which does not include the wet processing module, but includes a dry tower in which two or more dry processing modules are stacked vertically.

[0123] The seventh embodiment is a substrate processing apparatus according to any one of the first to sixth embodiments, wherein the plurality of dry processing modules are stacked vertically to form a dry tower, and in the dry tower, chamber spaces and piping spaces are alternately provided vertically, the load lock unit includes a load lock chamber provided in the chamber space, the local transport unit is provided in a local transport chamber connected to the load lock chamber via a load transport gate in the chamber space, the dry processing unit includes a dry processing chamber connected to the local transport chamber via a transport processing gate in the chamber space, a first gas pipe is connected to the load lock chamber, a first pressure regulating valve is provided in the first gas pipe, a second gas pipe is connected to the local transport chamber, a second pressure regulating valve is provided in the second gas pipe, a third gas pipe is connected to the dry processing chamber, a third pressure regulating valve is provided in the third gas pipe, and at least one of the first pressure regulating valve, the second pressure regulating valve and the third pressure regulating valve is provided in the piping space.

[0124] The eighth aspect is a substrate processing apparatus according to any one of the first to seventh aspects, comprising: a first suction tube connected to the load lock chamber; a second suction tube connected to a local transport chamber in which the local transport unit is provided; a third suction tube connected to the dry processing chamber; a first suction unit connected to the first and second suction tubes; and a second suction unit connected to the third suction tube.

[0125] The ninth aspect is a substrate processing apparatus according to any one of the first to eighth aspects, which does not include the dry processing module, but includes a wet tower in which two or more of the wet processing modules are stacked vertically.

[0126] The tenth embodiment is a substrate processing apparatus according to any one of the first to eighth embodiments, wherein the first number of dry processing units and the second number of wet processing modules are determined such that a first value obtained by dividing the dry processing time required for the dry processing by the first number and a second value obtained by dividing the wet processing time required for the wet processing by the second number are balanced.

[0127] The eleventh embodiment is a substrate processing apparatus according to any one of the first to tenth embodiments, wherein the dry processing unit includes a first support member for supporting the substrate and a first lifting drive unit for raising and lowering the first support member, the load lock unit includes a second support member for supporting the substrate and a second lifting drive unit for raising and lowering the second support member, and the local transport unit includes a hand for supporting or holding the substrate and a hand movement drive unit having a movement function for moving the hand horizontally but not a lifting function for raising and lowering the hand.

[0128] According to the first embodiment, dry processing and wet processing can be performed on the substrate with high throughput.

[0129] According to the second embodiment, the load lock unit, local conveying section, and dry processing unit are arranged in the longitudinal direction of the main conveying space. Therefore, workers can maintain each of the load lock unit, local conveying section, and dry processing unit from the side opposite to the main conveying section. Thus, maintenance is easy.

[0130] According to the third embodiment, the transport distance between the transfer unit and the processing module at the last position of the first module group can be shortened.

[0131] According to the fourth embodiment, the transport distance between the transfer unit and the load lock unit of the first module group can be shortened.

[0132] According to the fifth embodiment, the transport distance between the transfer unit and the processing module at the last position of the second module group can be shortened.

[0133] According to the sixth embodiment, in the dry tower, the piping for the wet processing module and the piping for the dry processing module are not mixed. Therefore, the configuration of the dry tower can be simplified.

[0134] According to the seventh aspect, the pressure inside the chamber can be adjusted with high precision.

[0135] According to the eighth aspect, since the gas drawn in from the load lock chamber and the local conveying chamber does not flow into the third suction pipe, pressure fluctuations in the dry processing chamber caused by the gas can be avoided.

[0136] According to the ninth embodiment, in the wet tower, the piping for the wet processing module and the piping for the dry processing module are not mixed. Therefore, the configuration of the wet tower can be simplified.

[0137] According to the tenth embodiment, dry processing and wet processing can be performed on multiple substrates with high throughput.

[0138] According to the eleventh embodiment, the vertical size of the local transport section can be effectively reduced. [Explanation of Symbols]

[0139] 1. Processing Module 10 Load Lock Unit 11 Load Lock Chamber 123 Delivery Department 13. Second support member (support pin) 14. Second lifting drive unit (pin lifting drive unit) 161 First gas pipe (first supply pipe) 162 First pressure regulating valve 171 First gas pipe (first suction pipe) 1A Dry Processing Module 1B Wet Processing Module 21 Local transport chamber 22 Local transport section 23 Hand 24 Hand movement drive unit 261 Second gas pipe (second supply pipe) 262 Second pressure regulating valve 271 Second gas pipe (second suction pipe) 30 Dry Processing Units 31 Dry processing chamber 34. First support member (support pin) 341 First lifting drive unit (pin lifting drive unit) 361 Third gas pipe (third supply pipe) 362 Third pressure regulating valve 371 Third gas pipe (third suction pipe) 80 Main conveying unit Dx direction of movement Dy width direction G1 Module Group 1 G2 Module Group 2 PS piping space TS Main Conveyor Space TWA Dry Tower TWB Wet Tower VP1 1st suction part VP2 2nd suction part W board

Claims

1. A load lock unit that switches between atmospheric pressure and vacuum states, a dry processing unit that performs dry processing on a substrate in a vacuum state, and a plurality of dry processing modules including a local transport unit that transports the substrate between the load lock unit and the dry processing unit in a vacuum state, One or more wet processing modules that perform wet processing on the substrate, The main transport unit loads the substrate into and out of the load lock unit under atmospheric pressure, and transports the substrate between the dry processing module and the wet processing module. A substrate processing apparatus comprising:

2. A substrate processing apparatus according to claim 1, The main conveying unit moves along the longitudinal direction of the main conveying space within the main conveying space which has an elongated shape. A substrate processing apparatus in which, in the dry processing module, the load lock unit, the local transport unit, and the dry processing unit are arranged along the longitudinal direction, and the local transport unit is provided between the load lock unit and the dry processing unit.

3. A substrate processing apparatus according to claim 2, It is provided on the first end side in the longitudinal direction with respect to the main transport space, and the main transport section further comprises a transfer section for transferring the substrate, A first group of modules is arranged on the first side in the width direction perpendicular to the longitudinal direction with respect to the main transport space. The first module group includes one or more dry processing modules and one or more wet processing modules arranged along the longitudinal direction, In the dry processing module belonging to the first module group, the dry processing unit, the local transport unit, and the load lock unit are arranged in this order from the first end toward the second end in the longitudinal direction of the main transport space. A substrate processing apparatus in which the wet processing module is provided at the last position of the first module group, furthest from the transfer section.

4. A substrate processing apparatus according to claim 3, A substrate processing apparatus wherein at least a portion of the dry processing unit located closest to the transfer section among the first module group faces the transfer section in the width direction.

5. A substrate processing apparatus according to any one of claims 2 to 4, It is provided on the first end side in the longitudinal direction with respect to the main transport space, and the main transport section further comprises a transfer section for transferring the substrate, A second group of modules is provided on the second side in the width direction perpendicular to the longitudinal direction with respect to the main transport space. The second group of modules includes one or more of the dry processing modules arranged along the longitudinal direction, In the dry processing module belonging to the second module group, the load lock unit, the local transport unit, and the dry processing unit are arranged in this order from the first end toward the second end in the longitudinal direction of the main transport space. A substrate processing apparatus in which the dry processing module is provided at the last position of the second module group, furthest from the transfer section.

6. A substrate processing apparatus according to any one of claims 1 to 4, A substrate processing apparatus that does not include the wet processing module, but includes a dry tower in which two or more of the dry processing modules are stacked vertically.

7. A substrate processing apparatus according to any one of claims 1 to 4, The aforementioned dry processing modules are stacked vertically to form a dry tower. In the aforementioned dry tower, the chamber space and the piping space are arranged alternately in the vertical direction. The load lock unit includes a load lock chamber provided in the chamber space, The local transport unit is provided within the local transport chamber, which is connected to the load lock chamber and the load transport gate in the chamber space. The dry processing unit includes a dry processing chamber connected to the local transport chamber and a transport processing gate in the chamber space, A first gas pipe is connected to the load lock chamber, and a first pressure regulating valve is provided in the first gas pipe. A second gas pipe is connected to the local transport chamber, and a second pressure regulating valve is provided in the second gas pipe. A third gas pipe is connected to the dry processing chamber, and a third pressure regulating valve is provided in the third gas pipe. A substrate processing apparatus wherein at least one of the first pressure regulating valve, the second pressure regulating valve, and the third pressure regulating valve is provided within the piping space.

8. A substrate processing apparatus according to any one of claims 1 to 4, A first suction tube connected to the load lock chamber, A second suction pipe connected to a local transport chamber in which the local transport section is provided, A third suction tube connected to the dry processing chamber, A first suction unit connected to the first suction tube and the second suction tube, The second suction section connected to the third suction tube and A substrate processing apparatus comprising:

9. A substrate processing apparatus according to any one of claims 1 to 4, A substrate processing apparatus that does not include the dry processing module, but includes a wet tower in which two or more of the wet processing modules are stacked vertically.

10. A substrate processing apparatus according to any one of claims 1 to 4, A substrate processing apparatus in which the first number of dry processing units and the second number of wet processing modules are determined such that a first value obtained by dividing the dry processing time required for the dry processing by the first number balances out a second value obtained by dividing the wet processing time required for the wet processing by the second number.

11. A substrate processing apparatus according to any one of claims 1 to 4, The aforementioned dry processing unit is A first support member that supports the substrate, A first lifting drive unit for raising and lowering the first support member and Includes, The aforementioned load lock unit is A second support member that supports the substrate, A second lifting drive unit for raising and lowering the second support member and Includes, The local transport unit is, A hand for supporting or holding the aforementioned substrate, A hand movement drive unit having a movement function for moving the hand horizontally, but not having a lifting function for raising or lowering the hand. A substrate processing apparatus, including

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