Semiconductor equipment

Abstract

To improve the adhesion of the terminal to the conductive plate. [Solution] The extended portion of the wiring portion 22b3 of the first connection terminal 22b, which extends from the case 20, includes a thinned region 22b6 that is thinner than the portion of the first connection terminal 22b other than the extended portion. In such a semiconductor device 1, the rigidity is reduced because the extended portion of the first connection terminal 22b that extends from the inner wall 21c1 of the case 20 includes a thinned region 22b6. Therefore, the joint portion 22b2 of the first connection terminal 22b can be reliably joined to the conductive circuit pattern 11b3 while miniaturizing the device without increasing the length of the extended portion of the first connection terminal 22b.

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