Surface-treated copper powder, conductive paste containing the same, and method for producing surface-treated copper powder

JP2026106768APending Publication Date: 2026-06-30FUKUDA METAL FOIL & POWDER CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
FUKUDA METAL FOIL & POWDER CO LTD
Filing Date
2024-12-18
Publication Date
2026-06-30

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Abstract

The present invention provides a surface-treated copper powder that, when used in conductive pastes, can improve the low-temperature sinterability of conductive pastes. [Solution] Surface-treated copper powder obtained by applying α-cyclodextrin and / or β-cyclodextrin as an organic surface treatment agent to the surface of copper powder. The amount of organic surface treatment agent applied to the surface of the copper powder particles is 0.35 mg / m² of carbon per unit BET specific surface area of ​​the copper powder. 2 More than 2.0mg / m 2 The following applies:
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