Antenna boards and high-frequency modules

Abstract

To provide an antenna substrate and a high-frequency module that can suppress warping deformation. [Solution] The antenna substrate 10 comprises a multilayer substrate portion 11 having a mounting surface 11a on which a high-frequency IC 20 can be mounted, and a dielectric substrate portion 12 laminated on the side of the multilayer substrate portion 11 opposite to the mounting surface 11a. The multilayer substrate portion 11 has a plurality of conductive layers 5 and a plurality of dielectric layers 6. The plurality of conductive layers 5 include a power supply layer 1 having mounting pads 13 and power supply lines 14, a ground layer 2, and antenna layers 3 and 4 having antennas 36, 37, 46, and 47. The antenna layers 3 and 4 have openings. The antennas 36, 37, 46, and 47 are formed in the openings. In a plan view, the ground layer 2 includes a region encompassing the mounting pads 13 and power supply lines 14, and a region overlapping with the openings. At least a portion of the outer edge of the ground layer 2 is inward from the outer edge of the dielectric layer 6 in a plan view.

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