Camera module

JP2026108775APending Publication Date: 2026-06-30LG INNOTEK CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
LG INNOTEK CO LTD
Filing Date
2026-03-26
Publication Date
2026-06-30

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  • Figure 2026108775000001_ABST
    Figure 2026108775000001_ABST
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Abstract

The present invention provides a camera module and optical equipment including the same that can minimize the warping of the image sensor. [Solution] The camera module includes a circuit board including a cavity, a reinforcing plate including a first region corresponding to the cavity and a second region on which the circuit board is arranged, a wire portion arranged in the first region of the reinforcing plate, and an image sensor arranged in the wire portion, wherein the lower surface of the image sensor is in direct contact with the wire portion, and the wire portion and the image sensor are electrically insulated from each other.
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