Methods for manufacturing semiconductor substrates and semiconductor devices

Abstract

The present invention provides a method for manufacturing semiconductor substrates and semiconductor devices. [Solution] The device comprises a main substrate, a seed portion (SD) located above the main substrate, and first and second semiconductor portions (8F and 8S) arranged in a first direction (9Y direction). The first and second semiconductor portions are in contact with the seed portion (SD), the seed portion (SD) has its longitudinal direction in the first direction (Y direction), and a hollow portion (VD) is located between the main substrate (1) and the first and second semiconductor portions.

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