(Meth)acrylic resin composition, inorganic fine particle dispersion slurry composition, and inorganic fine particle dispersion molded product

Abstract

The present invention provides a (meth)acrylic resin composition, an inorganic fine particle dispersion slurry composition, and an inorganic fine particle dispersion molded product that exhibit excellent decomposition properties at low temperatures and can improve the dispersibility and aggregation suppression effect of inorganic fine particles. [Solution] A (meth)acrylic resin composition that satisfies any of the following conditions (1) to (3), and in which the weight concentration of OH groups contained in the organic solvent is 9.0% by weight or more and 28.0% by weight or less. (1) Contains a high molecular weight (meth)acrylic resin (A) with a weight-average molecular weight of 120,000 or more and 300,000 or less, and the weight concentration of OH groups in (A) is 0.4% by weight or more and 2.0% by weight or less. (2) Contains a high molecular weight (meth)acrylic resin (B) having a weight-average molecular weight greater than 300,000 and less than or equal to 500,000, and the weight concentration of OH groups in (B) is 1.3% by weight or more and 3.5% by weight or less. (3) Contains a low molecular weight (meth)acrylic resin (C) having a weight-average molecular weight of 0.5 million or more and 100,000 or less, and the weight concentration of OH groups in (C) is 1.3% by weight or more and 3.5% by weight or less.

Description

[Technical Field]

[0001] The present invention relates to (meth)acrylic resin compositions, inorganic fine particle dispersion slurry compositions, and inorganic fine particle dispersion molded products. [Background technology]

[0002] Compositions in which inorganic fine particles such as ceramic powder and glass particles are dispersed in a binder resin are used in the production of multilayer electronic components such as multilayer ceramic capacitors. Such multilayer ceramic capacitors are generally manufactured using the following method. First, a binder resin is dissolved in an organic solvent, to which additives such as plasticizers and dispersants are added. Then, ceramic raw material powder is added and uniformly mixed using a ball mill or the like to obtain an inorganic fine particle dispersion slurry composition. The obtained inorganic fine particle dispersion slurry composition is cast onto a support surface such as a release-treated polyethylene terephthalate film or SUS plate using a doctor blade, reverse roll coater, etc., and after evaporating volatile components such as organic solvents, it is peeled off from the support to obtain a ceramic green sheet. Next, a conductive paste, which will serve as the internal electrode, is applied to the obtained ceramic green sheet by screen printing or the like. Multiple sheets of this paste are stacked, heated, and pressed together to obtain a laminate. The resulting laminate is heated to remove binder resin and other components through thermal decomposition, a process known as degreasing. After this, it is fired to obtain a ceramic fired body equipped with internal electrodes. Furthermore, external electrodes are applied to the end faces of the resulting ceramic fired body and fired to complete the multilayer ceramic capacitor.

[0003] In recent years, with the miniaturization of multilayer ceramic capacitors, the inorganic microparticles used have also become smaller. These miniaturized inorganic microparticles tend to aggregate in the paste, and when aggregation occurs, voids are more likely to remain during the degreasing and firing processes. Furthermore, when the capacitor is made into a multilayer ceramic capacitor, the dispersibility of the inorganic microparticles decreases, which can lead to a decrease in the electrical characteristics of the product.

[0004] As the binder resin, for example, ethyl cellulose or polyvinyl acetal resin (PVB) is generally used. For example, Patent Document 1 discloses a method for efficiently dispersing ceramic powder in a configuration using these binders. Specifically, a method is disclosed in which ceramic powder such as calcium titanate is first crushed in a solvent such as ethanol, and then a resin such as polyvinyl butyral resin or ethyl cellulose resin is added. Also, Patent Document 2 discloses a method of using an acrylic resin or the like as a binder in addition to polyvinyl butyral and cellulose-based polymers.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, the polyvinyl acetal resin described in Patent Document 1 has a high decomposition temperature and cannot be applied to applications where low-temperature firing is desirable, for example, applications using metals such as copper that are easily oxidized or low-melting-point glass. Also, although Patent Document 2 describes using an acrylic resin, there is a problem that the dispersibility deteriorates when using minute inorganic fine particles having an average particle diameter of less than 1 μm. Further, in the acrylic resin described in Patent Document 2, there is a problem that deterioration due to oxidation occurs during debinding that requires a high firing temperature.

[0007] An object of the present invention is to provide a (meth)acrylic resin composition that has excellent decomposability at low temperatures and can improve the dispersibility and aggregation suppression effect of inorganic fine particles. Another object is to provide an inorganic fine particle dispersion slurry composition and an inorganic fine particle dispersion molded product using the (meth)acrylic resin composition.

Means for Solving the Problems

[0008] The present disclosure (1) is a (meth)acrylic resin composition containing a (meth)acrylic resin and an organic solvent, which satisfies any one of the following (1) to (3), and the weight concentration of OH groups contained in the organic solvent is 9.0% by weight or more and 28.0% by weight or less. (1) The (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (A) having a weight average molecular weight of 120,000 or more and 300,000 or less, and the weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (A) is 0.4% by weight or more and 2.0% by weight or less. (2) The (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (B) having a weight average molecular weight exceeding 300,000 and 500,000 or less, and the weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (B) is 1.3% by weight or more and 3.5% by weight or less. (3) The (meth)acrylic resin contains a low molecular weight (meth)acrylic resin (C) having a weight average molecular weight of 5,000 or more and 100,000 or less, the weight concentration of OH groups contained in the low molecular weight (meth)acrylic resin (C) is 1.3% by weight or more and 3.5% by weight or less, and the weight concentration of S atoms contained in the (meth)acrylic resin is 250 ppm or more and 20,000 ppm or less. The present disclosure (2) is a (meth)acrylic resin composition of the present disclosure (1) that satisfies (1), contains a low molecular weight (meth)acrylic resin having a weight average molecular weight of 5,000 or more and 100,000 or less, the weight concentration of OH groups contained in the low molecular weight (meth)acrylic resin is 1.3% by weight or more and 3.5% by weight or less, and the content of the low molecular weight (meth)acrylic resin with respect to 100 parts by weight of the high molecular weight (meth)acrylic resin (A) is 0.1 part by weight or more and 10 parts by weight or less. Disclosure (3) is a (meth)acrylic resin composition of Disclosure (1) that satisfies (1) or (2) and has a solubility in ethanol of high molecular weight (meth)acrylic resin (A) or (B) of 10 parts by weight / 100 parts by weight of ethanol or more. Disclosure (4) is a (meth)acrylic resin composition of Disclosure (1) or (3) that satisfies (1) or (2), and the high molecular weight (meth)acrylic resin (A) or (B) contains, with respect to all constituent units, 79% by weight or more and 96% by weight or less of constituent units represented by the following formula (a), and 3.1% by weight or more and 17% by weight or less of constituent units represented by the following formula (b). [ka] In formula (a), R 1 R represents a linear or branched alkyl group having 1 to 8 carbon atoms, in formula (b), 2 This represents a linear or branched alkyl group having 2 to 4 carbon atoms, in which at least one hydrogen atom is substituted with an OH group. Disclosure (5) is a (meth)acrylic resin composition according to Disclosure (1), (3), or (4), which satisfies (1) or (2), and the ratio of the weight concentration of OH groups contained in the organic solvent to the weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (A) or (B) (weight concentration of OH groups contained in the organic solvent / weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (A) or (B)) is 4.5 or more and 46.2 or less. Disclosure (6) is a (meth)acrylic resin composition of Disclosure (1), (3), (4), or (5) that satisfies (2), and the (meth)acrylic resin consists only of high molecular weight (meth)acrylic resin (B), and the weight concentration of S atoms contained in the (meth)acrylic resin is 250 ppm or more and 20,000 ppm or less. Disclosure (7) is an inorganic fine particle dispersion slurry composition containing any of the (meth)acrylic resin compositions, inorganic fine particles, and plasticizers described in Disclosure (1) to (6). Disclosure (8) is an inorganic microparticle dispersion molded product made using the inorganic microparticle dispersion slurry composition of Disclosure (7). The present invention will be described in detail below.

[0009] The inventors have discovered that by using a combination of a (meth)acrylic resin having a predetermined weight-average molecular weight, weight concentration of OH groups, and weight concentration of S atoms, and an organic solvent having a weight concentration of OH groups of 9.0% by weight or more and 28.0% by weight or less, the binder resin exhibits extremely excellent decomposition properties even at low temperatures, while also improving the dispersibility of inorganic fine particles and the aggregation suppression effect, thus completing the present invention.

[0010] The (meth)acrylic resin composition of the present invention contains (meth)acrylic resin. The above (meth)acrylic resin satisfies one of the following conditions (1) to (3). (1) The (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (A) with a weight-average molecular weight of 120,000 or more and 300,000 or less, and the weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (A) is 0.4% by weight or more and 2.0% by weight or less. (2) The (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (B) having a weight-average molecular weight exceeding 300,000 and not exceeding 500,000, and the weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (B) is 1.3% by weight or more and 3.5% by weight or less. (3) The (meth)acrylic resin contains a low molecular weight (meth)acrylic resin (C) having a weight-average molecular weight of 0.5 million to 100,000, the weight concentration of OH groups contained in the low molecular weight (meth)acrylic resin is 1.3% by weight to 3.5% by weight, and the weight concentration of S atoms contained in the (meth)acrylic resin is 250 ppm to 20,000 ppm. By satisfying the above configuration, the dispersibility of inorganic fine particles can be sufficiently improved when an inorganic fine particle dispersion slurry composition is formed. Furthermore, aggregation of inorganic fine particles can be suppressed.

[0011] <High molecular weight (meth)acrylic resin (A)> In the (meth)acrylic resin composition of the present invention that satisfies (1) above, the (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (A). The above high molecular weight (meth)acrylic resin (A) has a weight-average molecular weight of 120,000 to 300,000. By setting the range as described above, the dispersibility of inorganic fine particles can be sufficiently improved when an inorganic fine particle dispersion slurry composition is formed. Furthermore, aggregation of inorganic fine particles can be suppressed. The above weight-average molecular weight is preferably 150,000 or more, more preferably 180,000 or more, preferably 250,000 or less, and more preferably 220,000 or less. By setting the viscosity within the above range, the inorganic fine particle dispersion slurry composition will have sufficient viscosity and improved printability. Furthermore, the ratio (Mw / Mn) of the weight-average molecular weight (Mw) to the number-average molecular weight (Mn) of the high molecular weight (meth)acrylic resin (A) is preferably 2 or more, and preferably 8 or less. By keeping the composition within the above range, a suitable amount of low-polymerization components are included, resulting in a viscosity within a desirable range for the inorganic fine particle dispersion slurry composition, thereby increasing productivity. Furthermore, the sheet strength of the resulting inorganic fine particle dispersion sheet can be made appropriate. In addition, the surface smoothness of the resulting ceramic green sheet can be sufficiently improved. The above Mw / Mn is more preferably 3 or greater, and more preferably 6 or less. Note that the weight-average molecular weight (Mw) and number-average molecular weight (Mn) are average molecular weights calculated on a polystyrene basis, and can be obtained by performing GPC measurements using, for example, column LF-804 (manufactured by Showa Denko Corporation).

[0012] The weight concentration of OH groups contained in the above high molecular weight (meth)acrylic resin (A) is 0.4% by weight or more and 2.0% by weight or less. By setting the range as described above, the binder resin can exhibit extremely excellent decomposition properties even at low temperatures, while also improving the dispersibility of inorganic fine particles and the effect of suppressing aggregation. The weight concentration of the above OH group is preferably 0.5% by weight or more, more preferably 0.6% by weight or more, preferably 1.6% by weight or less, and more preferably 1.4% by weight or less. The weight concentration of the above OH group represents the ratio of the weight of the OH group to the total weight of the high molecular weight (meth)acrylic resin (A), and can be calculated based on the following formula. The weight concentration of OH groups in high molecular weight (meth)acrylic resin (A) = [weight of OH groups in total monomer / (weight of total monomer + weight of polymerization initiator)] × 100

[0013] <High molecular weight (meth)acrylic resin (B)> In the (meth)acrylic resin composition of the present invention that satisfies (2) above, the (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (B). The above high molecular weight (meth)acrylic resin (A) has a weight-average molecular weight exceeding 300,000 and not exceeding 500,000. By setting the range as described above, the dispersibility of inorganic fine particles can be sufficiently improved when an inorganic fine particle dispersion slurry composition is formed. Furthermore, aggregation of inorganic fine particles can be suppressed. The above weight-average molecular weight is preferably 320,000 or more, more preferably 330,000 or more, preferably 480,000 or less, and more preferably 450,000 or less. By setting the viscosity within the above range, the inorganic fine particle dispersion slurry composition will have sufficient viscosity and improved printability. Furthermore, the ratio (Mw / Mn) of the weight-average molecular weight (Mw) to the number-average molecular weight (Mn) of the high molecular weight (meth)acrylic resin (B) is preferably 2 or more, and preferably 8 or less. By keeping the composition within the above range, a suitable amount of low-polymerization components are included, resulting in a viscosity within a desirable range for the inorganic fine particle dispersion slurry composition, thereby increasing productivity. Furthermore, the sheet strength of the resulting inorganic fine particle dispersion sheet can be made appropriate. In addition, the surface smoothness of the resulting ceramic green sheet can be sufficiently improved. The above Mw / Mn is more preferably 3 or greater, and more preferably 6 or less.

[0014] The weight concentration of OH groups contained in the above high molecular weight (meth)acrylic resin (B) is 1.3% by weight or more and 3.5% by weight or less. By setting the range as described above, the binder resin can exhibit extremely excellent decomposition properties even at low temperatures, while also improving the dispersibility of inorganic fine particles and the effect of suppressing aggregation. The weight concentration of the above OH group is preferably 1.5% by weight or more, more preferably 2% by weight or more, preferably 3.3% by weight or less, and more preferably 3% by weight or less. The weight concentration of the above OH group represents the ratio of the weight of the OH group to the total weight of the high molecular weight (meth)acrylic resin (B), and can be calculated based on the following formula. The weight concentration of OH groups in high molecular weight (meth)acrylic resin (B) = [weight of OH groups in total monomer / (weight of total monomer + weight of polymerization initiator)] × 100

[0015] The above high molecular weight (meth)acrylic resins (A) and (B) preferably have a constituent unit represented by the following formula (a), and preferably have a constituent unit represented by the following formula (b).

[0016] [ka]

[0017] In formula (a), R 1 R represents a linear or branched alkyl group having 1 to 8 carbon atoms, in formula (b), 2 This represents a linear or branched alkyl group having 2 to 4 carbon atoms, in which at least one hydrogen atom is substituted with an OH group. The above R 1 More preferably, the alkyl group is a linear or branched alkyl group having 1 to 4 carbon atoms, such as a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, etc. The above R 2Preferably, the alkyl group is a linear or branched alkyl group having 2 to 4 carbon atoms in which at least one hydrogen atom is substituted with an OH group. Examples include 2-hydroxyethyl group, 2-hydroxypropyl group, and 2-hydroxybutyl group.

[0018] The content of the constituent unit represented by formula (a) in the above high molecular weight (meth)acrylic resins (A) and (B) is preferably 79% by weight or more, and preferably 96% by weight or less. By setting the range as described above, the low-temperature decomposition properties can be sufficiently enhanced. The content of the constituent unit represented by the above formula (a) is more preferably 85% by weight or more, and more preferably 95% by weight or less.

[0019] The content of the constituent unit represented by formula (b) in the above high molecular weight (meth)acrylic resins (A) and (B) is preferably 3.1% by weight or more, and preferably 17% by weight or less. Ethanol is commonly used as a solvent for binder resins, but generally, acrylic resins have lower solubility in ethanol than polyvinyl acetal resins. Adding acrylic resin after primary crushing can cause inorganic fine particles to aggregate, but by using the above range, the dispersibility of inorganic fine particles and the effect of suppressing aggregation can be improved. Furthermore, it can improve solubility in ethanol. The content of the constituent unit represented by formula (2) above is more preferably 4% by weight or more, and more preferably 15% by weight or less.

[0020] The above high molecular weight (meth)acrylic resins (A) and (B) preferably have segments derived from (meth)acrylic acid esters having linear or branched alkyl groups having 3 to 4 carbon atoms. Having the above-mentioned segment allows for superior low-temperature decomposition properties. Examples of (meth)acrylic acid esters having a linear or branched alkyl group with 3 to 4 carbon atoms include n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, and isobutyl (meth)acrylate. Among these, isobutyl (meth)acrylate is preferred.

[0021] The content of segments derived from (meth)acrylic acid esters having linear or branched alkyl groups with 3 to 4 carbon atoms in the above high molecular weight (meth)acrylic resins (A) and (B) is preferably 30% by weight or more, more preferably 40% by weight or more, preferably 95% by weight or less, and more preferably 88% by weight or less.

[0022] The above-mentioned high molecular weight (meth)acrylic resins (A) and (B) may have segments derived from (meth)acrylic acid esters having an alkyl group with 1 to 2 carbon atoms. Examples of (meth)acrylic acid esters having an alkyl group with 1 to 2 carbon atoms include methyl (meth)acrylate and ethyl (meth)acrylate.

[0023] The content of segments derived from (meth)acrylic acid esters having an alkyl group with 1 to 2 carbon atoms in the above high molecular weight (meth)acrylic resins (A) and (B) is preferably 0% by weight or more, more preferably 10% by weight or more, preferably 66.8% by weight or less, and more preferably 46% by weight or less.

[0024] The above-mentioned high molecular weight (meth)acrylic resins (A) and (B) may have segments derived from (meth)acrylic acid esters having linear or branched alkyl groups having 5 to 8 carbon atoms. Examples of (meth)acrylic acid esters having a linear or branched alkyl group with 5 to 8 carbon atoms include n-pentyl (meth)acrylate, isopentyl (meth)acrylate, neopentyl (meth)acrylate, n-hexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate. Among these, (meth)acrylic acid esters having a linear or branched alkyl group with 6 to 8 carbon atoms are preferred, and 2-ethylhexyl (meth)acrylate is more preferred.

[0025] The content of segments derived from (meth)acrylic acid esters having linear or branched alkyl groups with 5 to 8 carbon atoms in the above high molecular weight (meth)acrylic resins (A) and (B) is preferably 0% by weight or more, more preferably 9% by weight or more, preferably 25% by weight or less, and more preferably 20% by weight or less.

[0026] The above-mentioned high molecular weight (meth)acrylic resins (A) and (B) may have segments derived from (meth)acrylic acid esters having linear or branched alkyl groups with 9 or more carbon atoms. Examples of (meth)acrylic acid esters having a linear or branched alkyl group with 9 or more carbon atoms include n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, n-lauryl (meth)acrylate, isolauryl (meth)acrylate, n-stearyl (meth)acrylate, and isostearyl (meth)acrylate.

[0027] The above high molecular weight (meth)acrylic resins (A) and (B) preferably have segments derived from a (meth)acrylic acid ester having a linear or branched alkyl group in which at least one hydrogen atom is substituted with an OH group. By having the above-mentioned segments, the binder resin exhibits extremely excellent decomposition properties even at low temperatures, while also improving the dispersibility of inorganic fine particles and the effect of suppressing aggregation.

[0028] As for the (meth)acrylic acid ester having a linear or branched alkyl group in which at least one of the above hydrogen atoms is substituted with an OH group, it is preferable that the weight percentage of the OH group is 10.5% by weight or more, more preferably 11.5% by weight or more, and preferably 13.1% by weight or less.

[0029] The above high molecular weight (meth)acrylic resins (A) and (B) preferably have segments derived from a (meth)acrylic acid ester having a linear or branched alkyl group having 2 to 4 carbon atoms, in which at least one hydrogen atom is substituted with an OH group. Examples of (meth)acrylic acid esters having a linear or branched alkyl group with 2 to 4 carbon atoms in which at least one of the hydrogen atoms is substituted with an OH group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. Among these, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate are preferred.

[0030] The content of segments derived from (meth)acrylic acid esters having a linear or branched alkyl group with 2 to 4 carbon atoms in which at least one hydrogen atom is substituted with an OH group in the above high molecular weight (meth)acrylic resins (A) and (B) is preferably 3.1% by weight or more, more preferably 5.0% by weight or more, preferably 17.0% by weight or less, and more preferably 12.2% by weight or less.

[0031] The above high molecular weight (meth)acrylic resins (A) and (B) preferably have segments derived from a (meth)acrylic acid ester having a linear or branched alkyl group having 5 or more carbon atoms, in which at least one hydrogen atom is substituted with an OH group. Examples of (meth)acrylic acid esters having a linear or branched alkyl group with 5 or more carbon atoms in which at least one hydrogen atom is substituted with an OH group include hydroxypentyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyheptyl (meth)acrylate, and hydroxyoctyl (meth)acrylate.

[0032] The above-mentioned high molecular weight (meth)acrylic resins (A) and (B) may have segments derived from (meth)acrylic acid, segments derived from (meth)acrylic acid, segments derived from other (meth)acrylic acid esters such as (meth)acrylic acid esters having a glycidyl group, in addition to the segments derived from the (meth)acrylic acid ester.

[0033] The glass transition temperature (Tg) of the above high molecular weight (meth)acrylic resins (A) and (B) is preferably 30°C or higher and 85°C or lower. By setting the range as described above, the amount of plasticizer added can be reduced, and the low-temperature decomposition properties can be improved. The above Tg is more preferably 32°C or higher, even more preferably 42°C or higher, even more preferably 45°C or higher, particularly preferably 50°C or higher, more preferably 80°C or lower, and even more preferably 75°C or lower. The glass transition temperature (Tg) can be measured, for example, using a differential scanning calorimeter (DSC).

[0034] The above-mentioned high molecular weight (meth)acrylic resins (A) and (B) preferably have a solubility in ethanol of 10 parts by weight / 100 parts by weight of ethanol or more. By setting the range as described above, the dispersibility and aggregation suppression effect of inorganic fine particles can be improved. In addition, the solubility in organic solvents can be sufficiently increased. The solubility in ethanol is more preferably 50 parts by weight or more, and even more preferably 100 parts by weight or more. The solubility in ethanol mentioned above refers to the amount of resin added when dissolved in 100 parts by weight of ethanol at 25°C until a precipitate forms.

[0035] The content of the high molecular weight (meth)acrylic resin (A) in the (meth)acrylic resin composition of the present invention is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 30% by weight or more, preferably 70% by weight or less, and more preferably 60% by weight or less.

[0036] The content of the high molecular weight (meth)acrylic resin (B) in the (meth)acrylic resin composition of the present invention is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 30% by weight or more, preferably 70% by weight or less, and more preferably 60% by weight or less.

[0037] Furthermore, in the (meth)acrylic resin composition of the present invention that satisfies (2) above, the weight concentration of S atoms contained in the (meth)acrylic resin is preferably 250 ppm or more, and preferably 20,000 ppm or less. By setting the range as described above, the binder resin can exhibit extremely excellent decomposition properties even at low temperatures, while also improving the dispersibility of inorganic fine particles and the effect of suppressing aggregation. The weight concentration of the above-mentioned S atoms is more preferably 400 ppm or more, and more preferably 15,000 ppm or less. The above weight concentration of S atoms refers to the ratio of the weight of S atoms to the weight of (meth)acrylic resin, and can be calculated based on the following formula. The weight concentration of sulfur atoms in (meth)acrylic resin = [weight of sulfur atoms contained in the chain transfer agent / (weight of total monomers + weight of polymerization initiator + weight of chain transfer agent)] × 100 Furthermore, if the above (meth)acrylic resin composition contains multiple (meth)acrylic resins, the weight concentration of the S atoms can be calculated based on the weight concentration of S atoms contained in each (meth)acrylic resin and the blending ratio of each (meth)acrylic resin. Furthermore, the weight concentration of the above-mentioned sulfur atoms can also be determined by ICP-AES (inductively coupled plasma emission spectroscopy).

[0038] The method for producing the above-mentioned high molecular weight (meth)acrylic resins (A) and (B) is not particularly limited. For example, one method involves preparing a monomer mixture by adding an organic solvent to a raw material monomer mixture containing (meth)acrylic acid ester, etc., and then further adding a polymerization initiator and a chain transfer agent to the obtained monomer mixture to copolymerize the raw material monomers. The polymerization method is not particularly limited and includes emulsion polymerization, suspension polymerization, bulk polymerization, interfacial polymerization, and solution polymerization. Among these, solution polymerization is preferred.

[0039] Examples of polymerization initiators include t-butyl peroxypivalate, p-menthane hydroperoxide, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, t-butyl hydroperoxide, cyclohexanone peroxide, and disuccinate peroxide. Examples of the above-mentioned chain transfer agents include 3-mercapto-1,2-propanediol, 3-mercapto-1-propanol, 3-mercapto-2-butanol, 8-mercapto-1-octanol, mercaptosuccinic acid, and mercaptoacetic acid.

[0040] <Low molecular weight (meth)acrylic resin (C)> In the (meth)acrylic resin composition of the present invention that satisfies (3) above, the (meth)acrylic resin contains a low molecular weight (meth)acrylic resin (C). In this specification, the low molecular weight (meth)acrylic resin (C) has a weight-average molecular weight of 0.5 million to 100,000. By including the above-mentioned low molecular weight (meth)acrylic resin (C), the dispersibility of inorganic fine particles can be improved. The above weight-average molecular weight is more preferably 0.6 million or more, even more preferably 0.8 million or more, even more preferably 90,000 or less, and even more preferably 30,000 or less. Furthermore, the ratio (Mw / Mn) of the weight-average molecular weight (Mw) to the number-average molecular weight (Mn) of the low molecular weight (meth)acrylic resin (C) is preferably 1.3 or higher, more preferably 2 or higher, and preferably 8 or lower. By keeping the composition within the above range, a suitable amount of low-polymerization components are included, resulting in a viscosity within a desirable range for the inorganic fine particle dispersion slurry composition, thereby increasing productivity. Furthermore, the sheet strength of the resulting inorganic fine particle dispersion sheet can be made appropriate. In addition, the surface smoothness of the resulting ceramic green sheet can be sufficiently improved. The above Mw / Mn is more preferably 3 or greater, and more preferably 6 or less. Note that the weight-average molecular weight (Mw) and number-average molecular weight (Mn) are average molecular weights calculated on a polystyrene basis, and can be obtained by performing GPC measurements using, for example, column LF-804 (manufactured by Showa Denko Corporation).

[0041] The weight concentration of OH groups contained in the above low molecular weight (meth)acrylic resin (C) is 1.3% by weight or more and 3.5% by weight or less. By setting the range as described above, the binder resin can exhibit extremely excellent decomposition properties even at low temperatures, while also improving the dispersibility of inorganic fine particles and the effect of suppressing aggregation. The weight concentration of the above OH group is preferably 1.4% by weight or more, preferably 3.3% by weight or less, and more preferably 3.2% by weight or less. The weight concentration of the above OH group represents the ratio of the weight of the OH group to the total weight of the low molecular weight (meth)acrylic resin (C), and can be calculated based on the following formula. The weight concentration of OH groups in low molecular weight (meth)acrylic resin (C) = [(weight of OH groups in total monomer + weight of OH groups in chain transfer agent) / (weight of total monomer + weight of polymerization initiator + weight of chain transfer agent)] × 100

[0042] The above low molecular weight (meth)acrylic resin (C) preferably has segments derived from a (meth)acrylic acid ester having a linear or branched alkyl group having 3 to 4 carbon atoms. Having the above-mentioned segment allows for superior low-temperature decomposition properties. Examples of (meth)acrylic acid esters having a linear or branched alkyl group with 3 to 4 carbon atoms include n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, and isobutyl (meth)acrylate. Among these, isobutyl (meth)acrylate is preferred.

[0043] The content of segments derived from (meth)acrylic acid esters having linear or branched alkyl groups with 3 to 4 carbon atoms in the above low molecular weight (meth)acrylic resin (C) is preferably 38% by weight or more, more preferably 50% by weight or more, preferably 80% by weight or less, and more preferably 75% by weight or less.

[0044] The above low molecular weight (meth)acrylic resin (C) may have segments derived from a (meth)acrylic acid ester having an alkyl group with 1 to 2 carbon atoms. Examples of (meth)acrylic acid esters having an alkyl group with 1 to 2 carbon atoms include methyl (meth)acrylate and ethyl (meth)acrylate.

[0045] The content of segments derived from (meth)acrylic acid esters having an alkyl group with 1 to 2 carbon atoms in the above low molecular weight (meth)acrylic resin (C) is preferably 0% by weight or more, more preferably 7% by weight or more, preferably 33% by weight or less, and more preferably 20.5% by weight or less.

[0046] The low molecular weight (meth)acrylic resin (C) described above may have segments derived from a (meth)acrylic acid ester having a linear or branched alkyl group having 5 to 8 carbon atoms. Examples of (meth)acrylic acid esters having a linear or branched alkyl group with 5 to 8 carbon atoms include n-pentyl (meth)acrylate, isopentyl (meth)acrylate, neopentyl (meth)acrylate, n-hexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate. Among these, (meth)acrylic acid esters having a linear or branched alkyl group with 6 to 8 carbon atoms are preferred, and 2-ethylhexyl (meth)acrylate is more preferred.

[0047] The content of segments derived from (meth)acrylic acid esters having linear or branched alkyl groups with 5 to 8 carbon atoms in the above low molecular weight (meth)acrylic resin (C) is preferably 0% by weight or more, more preferably 10% by weight or more, preferably 40% by weight or less, and more preferably 30% by weight or less.

[0048] The above low molecular weight (meth)acrylic resin (C) may have segments derived from a (meth)acrylic acid ester having a linear or branched alkyl group with 9 or more carbon atoms. Examples of (meth)acrylic acid esters having a linear or branched alkyl group with 9 or more carbon atoms include n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, n-lauryl (meth)acrylate, isolauryl (meth)acrylate, n-stearyl (meth)acrylate, and isostearyl (meth)acrylate.

[0049] The low molecular weight (meth)acrylic resin (C) described above preferably has segments derived from a (meth)acrylic acid ester having a linear or branched alkyl group in which at least one hydrogen atom is substituted with an OH group. By having the above-mentioned segments, the binder resin exhibits extremely excellent decomposition properties even at low temperatures, while also improving the dispersibility of inorganic fine particles and the effect of suppressing aggregation.

[0050] As for the (meth)acrylic acid ester having a linear or branched alkyl group in which at least one of the above hydrogen atoms is substituted with an OH group, it is preferable that the weight percentage of the OH group is 10.5% by weight or more, more preferably 11.5% by weight or more, and preferably 13.1% by weight or less.

[0051] The above low molecular weight (meth)acrylic resin (C) preferably has segments derived from a (meth)acrylic acid ester having a linear or branched alkyl group having 2 to 4 carbon atoms, in which at least one hydrogen atom is substituted with an OH group. Examples of (meth)acrylic acid esters having a linear or branched alkyl group with 2 to 4 carbon atoms in which at least one of the hydrogen atoms is substituted with an OH group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. Among these, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate are preferred.

[0052] The content of segments derived from (meth)acrylic acid esters having a linear or branched alkyl group with 2 to 4 carbon atoms in the low molecular weight (meth)acrylic resin (C) described above is preferably 7% by weight or more, more preferably 10% by weight or more, preferably 20% by weight or less, and more preferably 16% by weight or less.

[0053] The above low molecular weight (meth)acrylic resin (C) preferably has segments derived from a (meth)acrylic acid ester having a linear or branched alkyl group having 5 or more carbon atoms, in which at least one hydrogen atom is substituted with an OH group. Examples of (meth)acrylic acid esters having a linear or branched alkyl group with 5 or more carbon atoms in which at least one hydrogen atom is substituted with an OH group include hydroxypentyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyheptyl (meth)acrylate, and hydroxyoctyl (meth)acrylate.

[0054] The above low molecular weight (meth)acrylic resin (C) may have segments derived from (meth)acrylic acid, segments derived from (meth)acrylic acid, and segments derived from other (meth)acrylic acid esters such as (meth)acrylic acid esters having a glycidyl group, in addition to the segments derived from the above (meth)acrylic acid ester.

[0055] Furthermore, in the (meth)acrylic resin composition of the present invention that satisfies (3) above, the weight concentration of S atoms contained in the (meth)acrylic resin is 250 ppm or more and 20,000 ppm or less. By setting the range as described above, the binder resin can exhibit extremely excellent decomposition properties even at low temperatures, while also improving the dispersibility of inorganic fine particles and the effect of suppressing aggregation. The weight concentration of the above-mentioned S atoms is preferably 1500 ppm or more, more preferably 3000 ppm or more, preferably 18000 ppm or less, and more preferably 10000 ppm or less. The above weight concentration of S atoms refers to the ratio of the weight of S atoms to the weight of (meth)acrylic resin, and can be calculated based on the following formula. The weight concentration of sulfur atoms in (meth)acrylic resin = [weight of sulfur atoms contained in the chain transfer agent / (weight of total monomers + weight of polymerization initiator + weight of chain transfer agent)] × 100 Furthermore, if the above (meth)acrylic resin composition contains multiple (meth)acrylic resins, the weight concentration of the S atoms can be calculated based on the weight concentration of S atoms contained in each (meth)acrylic resin and the blending ratio of each (meth)acrylic resin. Furthermore, the weight concentration of the above-mentioned sulfur atoms can also be determined by ICP-AES (inductively coupled plasma emission spectroscopy).

[0056] The glass transition temperature (Tg) of the above low molecular weight (meth)acrylic resin (C) is between 30°C and 60°C. By setting the range as described above, the amount of plasticizer added can be reduced, and the low-temperature decomposition properties can be improved. The above Tg is preferably 32°C or higher, more preferably 42°C or higher, even more preferably 45°C or higher, preferably 58°C or lower, and more preferably 50°C or lower. The glass transition temperature (Tg) can be measured, for example, using a differential scanning calorimeter (DSC).

[0057] The content of the low molecular weight (meth)acrylic resin (C) in the (meth)acrylic resin composition of the present invention is preferably 0.006% by weight or more, more preferably 0.01% by weight or more, preferably 10% by weight or less, and more preferably 8% by weight or less.

[0058] Furthermore, in the (meth)acrylic resin composition of the present invention that satisfies (1) above, it is preferable that the (meth)acrylic resin further contains the low molecular weight (meth)acrylic resin (B) in addition to the high molecular weight (meth)acrylic resin (A). Furthermore, by including the above-mentioned low molecular weight (meth)acrylic resin (C), the dispersibility of inorganic fine particles can be further improved.

[0059] In the (meth)acrylic resin composition of the present invention that satisfies (1) above, the content of the low molecular weight (meth)acrylic resin (C) is preferably 0.1 parts by weight or more, and preferably 10 parts by weight or less, per 100 parts by weight of the high molecular weight (meth)acrylic resin (A). By setting the range as described above, the dispersibility of inorganic fine particles can be further improved. The content of low molecular weight (meth)acrylic resin (C) per 100 parts by weight of the high molecular weight (meth)acrylic resin is more preferably 0.3 parts by weight or more, and more preferably 7.5 parts by weight or less.

[0060] The method for producing the above-mentioned low molecular weight (meth)acrylic resin (C) is not particularly limited. For example, one method involves preparing a monomer mixture by adding an organic solvent to a raw material monomer mixture containing (meth)acrylic acid ester, etc., and then further adding a polymerization initiator and a chain transfer agent to the obtained monomer mixture to copolymerize the raw material monomers. The polymerization method is not particularly limited and includes emulsion polymerization, suspension polymerization, bulk polymerization, interfacial polymerization, and solution polymerization. Among these, solution polymerization is preferred.

[0061] Examples of polymerization initiators include t-butyl peroxypivalate, p-menthane hydroperoxide, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, t-butyl hydroperoxide, cyclohexanone peroxide, and disuccinate peroxide.

[0062] Examples of the above-mentioned chain transfer agents include 3-mercapto-1,2-propanediol, 3-mercapto-1-propanol, 3-mercapto-2-butanol, 8-mercapto-1-octanol, mercaptosuccinic acid, and mercaptoacetic acid.

[0063] <Organic solvents> The (meth)acrylic resin composition of the present invention contains an organic solvent. The weight concentration of OH groups contained in the above organic solvent is 9.0% by weight or more and 28.0% by weight or less. By including the above-mentioned organic solvent, the dispersibility of inorganic fine particles and the effect of suppressing aggregation can be improved. The weight concentration of the above OH group is preferably 11.0% by weight or more, more preferably 13.0% by weight or more, preferably 26.0% by weight or less, more preferably 24% by weight or less, and even more preferably 22.5% by weight or less. The weight concentration of the OH group mentioned above represents the ratio of the weight of the OH group to the total weight of the organic solvent, and can be calculated based on the following formula. The weight concentration of OH groups in an organic solvent = (Total weight of OH groups in the organic solvent / Total weight of the organic solvent) × 100

[0064] The ratio of the weight concentration of OH groups contained in the organic solvent to the weight concentration of OH groups contained in the high molecular weight (meth)acrylic resins (A) and (B) (weight concentration of OH groups in the organic solvent / weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin) is preferably 4.5 or higher, and preferably 46.2 or lower. By setting the range as described above, the dispersibility of inorganic fine particles and the effect of suppressing aggregation can be further improved. The above ratio is more preferably 8.1 or higher, even more preferably 10 or higher, even more preferably 40 or lower, even more preferably 30 or lower, even more preferably 25 or lower, and particularly preferably 20 or lower.

[0065] The above organic solvent contains an organic solvent having an OH group. Examples of organic solvents having the above-mentioned OH group include aliphatic alcohols, cyclic alcohols, and alicyclic alcohols. Examples of the above-mentioned aliphatic alcohols include ethanol, propanol, isopropanol, heptanol, octanol, decanol, tridecanol, lauryl alcohol, tetradecyl alcohol, cetyl alcohol, 2-ethyl-1-hexanol, octadecyl alcohol, hexadecenol, oleyl alcohol, texanol, 2-butyl-2-ethyl-1,3-propanediol, neopentyl glycol, and the like. Examples of the cyclic alcohols mentioned above include cresol and eugenol. Examples of the alicyclic alcohols mentioned above include cycloalkanols such as cyclohexanol, and terpene alcohols such as terpineol and dihydroterpineol. Among these, aliphatic alcohols are preferred, with ethanol, isopropanol, 2-butyl-2-ethyl-1,3-propanediol, neopentyl glycol, and texanol being particularly preferred.

[0066] The organic solvent having the above-mentioned OH group preferably has a molecular weight of 46 or more, more preferably 60 or more, more preferably 220 or less, and more preferably 160 or less. Furthermore, the organic solvent having the above-mentioned OH group preferably has 2 or more carbon atoms, more preferably 3 or more, preferably 12 or fewer, and more preferably 10 or fewer.

[0067] The weight percentage of OH groups contained in the above-mentioned organic solvent having OH groups is preferably 7.5% by weight or more, more preferably 15% by weight or more, even more preferably 21% by weight or more, and preferably 37% by weight or less.

[0068] The content of the organic solvent having an OH group relative to the total organic solvent is preferably 29% by weight or more, more preferably 43% by weight or more, preferably 79% by weight or less, and more preferably 61% by weight or less.

[0069] The above organic solvent may contain other organic solvents other than organic solvents having an OH group. Examples of other organic solvents include ketones such as acetone, methyl ethyl ketone, dipropyl ketone, and diisobutyl ketone; aromatic hydrocarbons such as toluene and xylene; and esters such as methyl propionate, ethyl propionate, butyl propionate, methyl butanoate, ethyl butanoate, butyl butanoate, methyl pentanoate, ethyl pentanoate, butyl pentanoate, methyl hexanoate, ethyl hexanoate, butyl hexanoate, ethyl acetate, butyl acetate, 2-ethylhexyl acetate, and 2-ethylhexyl butyrate. Among these, toluene, butyl acetate, and methyl ethyl ketone are preferred.

[0070] The content of the other organic solvents relative to the total amount of the above organic solvent is preferably 21% by weight or more, more preferably 39% by weight or more, preferably 71% by weight or less, and more preferably 57% by weight or less.

[0071] The content of the above organic solvent in the (meth)acrylic resin composition of the present invention is preferably 20% by weight or more, more preferably 30% by weight or more, preferably 95% by weight or less, more preferably 70% by weight or less, and even more preferably 60% by weight or less.

[0072] The content of the above organic solvent in the (meth)acrylic resin composition of the present invention is preferably 25 parts by weight or more, more preferably 100 parts by weight or more, preferably 2000 parts by weight or less, and more preferably 1500 parts by weight or less, per 100 parts by weight of the (meth)acrylic resin.

[0073] The content of the above organic solvent in the (meth)acrylic resin composition of the present invention is preferably 25 parts by weight or more, more preferably 42.9 parts by weight or more, preferably 1900 parts by weight or less, more preferably 233.3 parts by weight or less, and more preferably 150 parts by weight or less, per 100 parts by weight of the above high molecular weight (meth)acrylic resin (A).

[0074] The content of the above organic solvent in the (meth)acrylic resin composition of the present invention is preferably 25 parts by weight or more, more preferably 100 parts by weight or more, preferably 2000 parts by weight or less, and more preferably 1500 parts by weight or less, per 100 parts by weight of the above high molecular weight (meth)acrylic resin (B).

[0075] The content of the above organic solvent in the (meth)acrylic resin composition of the present invention is preferably 25 parts by weight or more, more preferably 1,000 parts by weight or more, preferably 1,500,000 parts by weight or less, and more preferably 1,000,000 parts by weight or less, per 100 parts by weight of the above low molecular weight (meth)acrylic resin (C).

[0076] The boiling point of the above organic solvent is preferably 90 to 160°C. A boiling point of 90°C or higher prevents excessive evaporation and improves handling. A boiling point of 160°C or lower makes it possible to improve the strength of the inorganic fine particle dispersion sheet.

[0077] The method for preparing the (meth)acrylic resin composition of the present invention is not particularly limited, but examples include mixing a (meth)acrylic resin containing at least one of the high molecular weight (meth)acrylic resin (A), the high molecular weight (meth)acrylic resin (B), and the high molecular weight (meth)acrylic resin (C), the organic solvent, and other additives added as needed.

[0078] The (meth)acrylic resin composition of the present invention exhibits excellent low-temperature decomposition properties, as well as excellent dispersibility and aggregation suppression effects for inorganic fine particles. Therefore, it can be suitably used as an inorganic fine particle dispersion slurry composition by combining inorganic fine particles and a plasticizer.

[0079] The present invention also includes an inorganic fine particle dispersion slurry composition containing a (meth)acrylic resin composition, inorganic fine particles, and a plasticizer.

[0080] <Inorganic fine particles> The inorganic fine particle dispersion slurry composition of the present invention contains inorganic fine particles. The inorganic fine particles mentioned above are not particularly limited and include, for example, glass powder, ceramic powder, phosphor fine particles, silicon oxide, metal fine particles, etc.

[0081] The above-mentioned glass powder is not particularly limited and includes, for example, glass powders such as bismuth oxide glass, silicate glass, lead glass, zinc glass, and boron glass, as well as glass powders of various silicon oxides such as CaO-Al2O3-SiO2 system, MgO-Al2O3-SiO2 system, and LiO2-Al2O3-SiO2 system. Furthermore, the above glass powders include: SnO-B2O3-P2O5-Al2O3 mixture, PbO-B2O3-SiO2 mixture, BaO-ZnO-B2O3-SiO2 mixture, ZnO-Bi2O3-B2O3-SiO2 mixture, Bi2O3-B2O3-BaO-CuO mixture, Bi2O3-ZnO-B2O3-Al2O3-SrO mixture, ZnO-Bi2O3-B2O3 mixture, Bi2O3-SiO2 mixture, P2O5-Na2O-CaO-BaO-Al2O3-B2O3 mixture, P2O5-SnO mixture, P2O5-SnO-B2O3 mixture, P2O5- Glass powders such as SnO-SiO2 mixture, CuO-P2O5-RO mixture, SiO2-B2O3-ZnO-Na2O-Li2O-NaF-V2O5 mixture, P2O5-ZnO-SnO-R2O-RO mixture, B2O3-SiO2-ZnO mixture, B2O3-SiO2-Al2O3-ZrO2 mixture, SiO2-B2O3-ZnO-R2O-RO mixture, SiO2-B2O3-Al2O3-RO-R2O mixture, SrO-ZnO-P2O5 mixture, SrO-ZnO-P2O5 mixture, and BaO-ZnO-B2O3-SiO2 mixture can also be used. Note that R is an element selected from the group consisting of Zn, Ba, Ca, Mg, Sr, Sn, Ni, Fe, and Mn. In particular, lead-free glass powders such as PbO-B2O3-SiO2 mixtures, BaO-ZnO-B2O3-SiO2 mixtures, or ZnO-Bi2O3-B2O3-SiO2 mixtures are preferred.

[0082] The above ceramic powders are not particularly limited and include, for example, alumina, ferrite, zirconia, zircon, barium zirconate, calcium zirconate, titanium oxide, barium titanate, strontium titanate, calcium titanate, magnesium titanate, zinc titanate, lanthanum titanate, neodymium titanate, lead zirconate titanate, alumina nitride, silicon nitride, boron nitride, boron carbide, barium stanate, calcium stanate, magnesium silicate, mullite, steatite, cordierite, forsterite, and the like. In addition, ITO, FTO, niobium oxide, vanadium oxide, tungsten oxide, lanthanum strontium manganite, lanthanum strontium cobalt ferrite, yttrium stabilized zirconia, gadolinium doped ceria, nickel oxide, lanthanum chromite, etc. can also be used. The phosphor fine particles are not particularly limited. For example, as the phosphor substance, blue phosphor substances, red phosphor substances, green phosphor substances, etc. that are conventionally known as phosphor substances for displays are used. As the blue phosphor substance, for example, MgAl 10 O 17 :Eu, Y2SiO5:Ce-based, CaWO4:Pb-based, BaMgAl 14 O 23 :Eu-based, BaMgAl 16 O 27 :Eu-based, BaMg2Al 14 O 23 :Eu-based, BaMg2Al 14 O 27 :Eu-based, ZnS:(Ag,Cd)-based ones are used. As the red phosphor substance, for example, Y2O3:Eu-based, Y2SiO5:Eu-based, Y3Al5O 12 :Eu-based, Zn3(PO4)2:Mn-based, YBO3:Eu-based, (Y,Gd)BO3:Eu-based, GdBO3:Eu-based, ScBO3:Eu-based, LuBO3:Eu-based ones are used. As the green phosphor substance, for example, Zn2SiO4:Mn-based, BaAl 12 O 19 :Mn-based, SrAl 13 O 19 :Mn-based, CaAl 12 O 19 :Mn-based, YBO3:Tb-based, BaMgAl 14 O 23 :Mn-based, LuBO3:Tb-based, GdBO3:Tb-based, ScBO3:Tb-based, Sr6Si3O3Cl4:Eu-based ones are used. In addition, ZnO:Zn-based, ZnS:(Cu,Al)-based, ZnS:Ag-based, Y2O2S:Eu-based, ZnS:Zn-based, (Y,Cd)BO3:Eu-based, BaMgAl 12 O 23 :Eu-based ones can also be used.

[0083] The above-mentioned metal nanoparticles are not particularly limited and include, for example, powders made of iron, copper, nickel, palladium, platinum, gold, silver, aluminum, tungsten, and alloys thereof. Furthermore, metals such as copper and iron, which have good adsorption properties with carboxyl groups, amino groups, amide groups, etc., and are easily oxidized, can also be suitably used. These metal powders may be used individually or in combination of two or more types. In addition to metal complexes, the metal nanoparticles may also be various types of carbon black, carbon nanotubes, etc.

[0084] The above inorganic fine particles preferably contain lithium or titanium. Specifically, for example, low-melting-point glass such as LiO2·Al2O3·SiO2-based inorganic glass, Li2S-M x S y Lithium sulfur-based glasses such as (M=B, Si, Ge, P), lithium cobalt composite oxides such as LiCeO2, lithium manganese composite oxides such as LiMnO4, lithium nickel composite oxides, lithium vanadium composite oxides, lithium zirconium composite oxides, lithium hafnium composite oxides, lithium silicate (Li 3.5 Si 0.5 P 0.5 O4), lithium titanium phosphate (LiTi2(PO4)3), lithium titanate (Li4Ti5O 12 ), Li 4 / 3 Ti 5 / 3 O4, LiCoO2, lithium germanium phosphate (LiGe2(PO4)3), Li2-SiS glass, Li4GeS4-Li3PS4 glass, LiSiO3, LiMn2O4, Li2S-P2S5 glass / ceramics, Li2O-SiO2, Li2O-V2O5-SiO2, LiS-SiS2-Li4SiO4 glass, ion-conductive oxides such as LiPON, lithium oxide compounds such as Li2O-P2O5-B2O3 and Li2O-GeO2Ba, Li x Al y Ti z (PO4)3-type glass, La x Li y TiO z Glass system, Li x Gey P z O4-based glass, Li7La3Zr2O 12 Glass system, Li v Si w P x S y Cl z Lithium niobium oxides such as LiNbO3, lithium alumina compounds such as Li-β-alumina, Li 14 Examples include lithium zinc oxides such as Zn(GeO4)4.

[0085] The content of the inorganic fine particles in the inorganic fine particle dispersion slurry composition of the present invention is not particularly limited, but a preferred lower limit is 10% by weight and a preferred upper limit is 90% by weight. A content of 10% by weight or more provides sufficient viscosity and excellent coating properties, while a content of 90% by weight or less provides excellent dispersibility of the inorganic fine particles.

[0086] <Other> The inorganic fine particle dispersion slurry composition of the present invention further contains a plasticizer. Examples of the plasticizers mentioned above include di(butoxyethyl) adipate, dibutoxyethoxyethyl adipate, triethylene glycol dibutyl, triethylene glycol bis(2-ethylhexanoate), triethylene glycol dihexanoate, triethyl acetyl citrate, tributyl acetyl citrate, diethyl acetyl citrate, dibutyl acetyl citrate, dibutyl acetyl citrate, tributyl sebacate, triacetin, diethyl acetyloxymalonate, and diethyl ethoxymalonate. By using these plasticizers, it is possible to reduce the amount of plasticizer added compared to when using conventional plasticizers (whereas it is usually added at around 30% by weight relative to the binder, it can be reduced to 25% by weight or less, and even further to 20% by weight or less). In particular, it is preferable to use non-aromatic plasticizers that do not contain aromatic rings such as benzene rings in their structure, and it is even more preferable that they contain components derived from adipic acid, triethylene glycol, citric acid, or succinic acid. Plasticizers containing aromatic rings are undesirable because they tend to burn and produce soot.

[0087] Furthermore, the plasticizers mentioned above are preferably those having alkyl groups with 2 or more carbon atoms, such as ethyl groups and butyl groups, and more preferably those having alkyl groups with 4 or more carbon atoms. The above-mentioned plasticizer contains an alkyl group having two or more carbon atoms, which suppresses the absorption of moisture into the plasticizer and prevents defects such as voids and blisters from occurring in the resulting inorganic fine particle dispersion sheet. In particular, it is preferable that the alkyl group of the plasticizer is located at the molecular terminal. Furthermore, the plasticizer preferably has a functional group with 2 carbon atoms, such as an ethyl group, a functional group with 4 carbon atoms, such as a butyl group, or a functional group such as a butoxyethyl group. The functional groups are preferably located in the terminal molecular chain. Plasticizers having a 2-carbon functional group such as an ethyl group at the terminal molecular chain are compatible with segments derived from ethyl methacrylate, and plasticizers having a 4-carbon functional group such as a butyl group at the terminal molecule are compatible with segments derived from butyl methacrylate. Plasticizers having a 2-carbon or 4-carbon functional group are compatible with the high molecular weight (meth)acrylic resin according to the present invention and can favorably improve the brittleness of the resin. Furthermore, the butoxyethyl group is compatible with the compositions of both segments derived from ethyl methacrylate and segments derived from butyl methacrylate and can be preferably used.

[0088] The above plasticizer preferably has a carbon:oxygen ratio of 5:1 to 3:1. By maintaining the carbon-oxygen ratio within the above range, the flammability of the plasticizer can be improved, preventing the generation of residual carbon. Furthermore, by improving compatibility with (meth)acrylic resin, the plasticizing effect can be achieved even with a small amount of plasticizer. Furthermore, high-boiling point organic solvents with a propylene glycol skeleton or a trimethylene glycol skeleton can also be preferably used if they contain an alkyl group with 4 or more carbon atoms and have a carbon:oxygen ratio of 5:1 to 3:1.

[0089] The boiling point of the plasticizer is preferably 240°C or higher and less than 390°C. A boiling point of 240°C or higher facilitates evaporation during the drying process, preventing residue in the molded article. Furthermore, a boiling point below 390°C prevents the generation of residual carbon. Note that the boiling point refers to the boiling point at atmospheric pressure.

[0090] The content of the plasticizer in the inorganic fine particle dispersion slurry composition of the present invention is not particularly limited, but a preferred lower limit is 0.1% by weight and a preferred upper limit is 3.0% by weight. By keeping it within this range, the amount of plasticizer residue after firing can be reduced.

[0091] The content of the above-mentioned (meth)acrylic resin composition in the inorganic fine particle dispersion slurry composition of the present invention is not particularly limited, but a preferred lower limit is 0.5% by weight and a preferred upper limit is 10% by weight. By setting the range as described above, it is possible to obtain an inorganic fine particle dispersion slurry composition that can be degreased even when fired at low temperatures, and that has excellent dispersibility and aggregation suppression effects for inorganic fine particles. The content of the above (meth)acrylic resin composition is more preferably 1% by weight at the lower limit and more preferably 7% by weight at the upper limit.

[0092] The inorganic fine particle dispersion slurry composition of the present invention may further contain additives such as surfactants. The above-mentioned surfactants are not particularly limited and include, for example, cationic surfactants, anionic surfactants, and nonionic surfactants. The above nonionic surfactant is not particularly limited, but it is preferable that it is a nonionic surfactant with an HLB value of 10 or more and 20 or less. Here, the HLB value is used as an indicator of the hydrophilicity and lipophilicity of a surfactant, and several calculation methods have been proposed. For example, for ester-based surfactants, the saponification value is S and the acid value of the fatty acid constituting the surfactant is A, and the HLB value is defined as 20 (1-S / A). Specifically, nonionic surfactants having polyethylene oxide obtained by adding alkylene ether to a fatty acid chain are preferred, and specifically, polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, etc. are preferably used. Although the above nonionic surfactant has good thermal decomposition properties, if it is added in large quantities, the thermal decomposition properties of the inorganic fine particle dispersion slurry composition may decrease, so the preferred upper limit of the content is 5% by weight.

[0093] The viscosity of the inorganic fine particle dispersion slurry composition of the present invention is not particularly limited, but when measured at 20°C using a B-type viscometer with a probe rotation speed of 5 rpm, the preferred lower limit of viscosity is 0.1 Pa·s and the preferred upper limit is 100 Pa·s. By setting the viscosity to 0.1 Pa·s or higher, the inorganic fine particle dispersion sheet obtained after coating by die coating printing or the like can maintain a predetermined shape. Furthermore, by setting the viscosity to 100 Pa·s or lower, problems such as the die coating marks not disappearing can be prevented, resulting in excellent printability.

[0094] The method for preparing the inorganic fine particle dispersion slurry composition of the present invention is not particularly limited, and conventionally known stirring methods can be used. Specifically, for example, a method of stirring the (meth)acrylic resin composition, the inorganic fine particles, the organic solvent, and other components such as plasticizers added as needed using a three-roll mixer or the like can be used. The order in which the constituent components of the inorganic fine particle dispersion slurry composition are added can be set as appropriate.

[0095] An inorganic microparticle dispersion slurry composition of the present invention can be applied to a support film that has been treated with a single-sided release agent, and an inorganic microparticle dispersion molded product can be manufactured by drying the organic solvent and molding the film. Such an inorganic microparticle dispersion molded product is also one of the present inventions. The shape of the inorganic fine particle dispersion molded product of the present invention is not particularly limited, but it can be in the shape of a sheet, for example.

[0096] Examples of methods for producing the inorganic fine particle dispersion molded product of the present invention include a method of uniformly forming a coating film on a support film using a coating method such as a roll coater, die coater, squeeze coater, or curtain coater with the inorganic fine particle dispersion slurry composition of the present invention. Furthermore, when manufacturing inorganic fine particle dispersion molded products, it is preferable to use the polymerization liquid as an inorganic fine particle dispersion slurry composition and process it into an inorganic fine particle dispersion molded product without drying the high molecular weight (meth)acrylic resin. When high molecular weight (meth)acrylic resin is dried, undried particles called particles are generated when it is dissolved again. These particles are difficult to remove even by filtration using cartridge filters, etc., and adversely affect the strength of inorganic fine particle dispersion molded products.

[0097] For example, when the inorganic fine particle dispersion molded product of the present invention is in the form of a sheet, the support film used in manufacturing the inorganic fine particle dispersion molded product of the present invention is preferably a resin film that has heat resistance, solvent resistance, and flexibility. The flexibility of the support film allows the inorganic fine particle dispersion slurry composition to be applied to the surface of the support film using a roll coater, blade coater, etc., and the resulting inorganic fine particle dispersion sheet-forming film can be stored and supplied in a rolled state.

[0098] Examples of resins used to form the support film include polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, polyfluoroethylene and other fluororesins, nylon, cellulose, and the like. The thickness of the above-mentioned support film is preferably, for example, 20 to 100 μm. Furthermore, it is preferable that the surface of the support film be treated with a release agent, which facilitates the peeling operation of the support film during the transfer process.

[0099] An inorganic fine particle dispersion molded product can be manufactured by coating and drying the inorganic fine particle dispersion slurry composition of the present invention. Furthermore, by using the inorganic microparticle dispersion slurry composition and inorganic microparticle dispersion molded product of the present invention in dielectric green sheets and electrode pastes, multilayer ceramic capacitors can be manufactured. Additionally, by using the inorganic microparticle dispersion slurry composition and inorganic microparticle dispersion molded product of the present invention, magnetic materials can be manufactured.

[0100] A method for manufacturing the above-mentioned multilayer ceramic capacitor includes the steps of printing a conductive paste onto the inorganic fine particle dispersion molded product of the present invention, drying it to produce a dielectric sheet, and laminating the dielectric sheets.

[0101] The conductive paste described above contains conductive powder. The material of the conductive powder described above is not particularly limited as long as it is a conductive material, and examples include nickel, palladium, platinum, gold, silver, copper, molybdenum, tin, and alloys thereof. These conductive powders may be used individually or in combination of two or more types.

[0102] The method for printing the conductive paste described above is not particularly limited and includes, for example, screen printing, die-coating, offset printing, gravure printing, and inkjet printing.

[0103] In the above-described method for manufacturing multilayer ceramic capacitors, a multilayer ceramic capacitor is obtained by stacking dielectric sheets on which the conductive paste is printed. [Effects of the Invention]

[0104] According to the present invention, it is possible to provide a (meth)acrylic resin composition that has excellent decomposability at low temperatures and can improve the dispersibility and aggregation suppression effect of inorganic fine particles. Furthermore, it is possible to provide an inorganic fine particle dispersion slurry composition and an inorganic fine particle dispersion molded product using the (meth)acrylic resin composition. [Modes for carrying out the invention]

[0105] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0106] (Manufacturing Examples 1-28: Preparation of High Molecular Weight (Meth)acrylic Resin) A 2L separable flask equipped with a stirrer, condenser, thermometer, water bath, and nitrogen gas inlet was prepared. A total of 100 parts by weight of monomers were added to the 2L separable flask according to the formulation shown in Table 1. Furthermore, 50 parts by weight of butyl acetate was added as an organic solvent to obtain a monomer mixture. The following monomers were used. MMA: Methyl methacrylate EMA: Ethyl methacrylate nBMA: n-butyl methacrylate iBMA: Isobutyl methacrylate 2EHMA:2-Ethylhexyl methacrylate HEMA: 2-hydroxyethyl methacrylate HPMA:2-hydroxypropyl methacrylate HBMA: 2-hydroxybutyl methacrylate

[0107] The resulting monomer mixture was bubbling with nitrogen gas for 20 minutes to remove dissolved oxygen, and then the separable flask system was replaced with nitrogen gas and the water bath was heated while stirring until it boiled. Polymerization initiators and chain transfer agents were added in the amounts shown in Table 1. Seven hours after the start of polymerization, the mixture was cooled to room temperature to terminate the polymerization. The resulting resin solution was then dried in a 130°C oven to remove the organic solvent. This yielded a high molecular weight (meth)acrylic resin. The following were used as polymerization initiators and chain transfer agents. <Polymerization initiator> t-butyl peroxypivalate <Chain movement agent> CT-1:3-mercapto-1,2-propanediol CT-2:3-mercapto-1-propanol CT-3:3-mercapto-2-butanol CT-4:8-mercapto-1-octanol CT-5: Mercaptosuccinate

[0108] [Table 1]

[0109] (Manufacturing Examples 29-62: Preparation of Low Molecular Weight (meth)acrylic Resins and Other (meth)acrylic Resins) A 2L separable flask equipped with a stirrer, condenser, thermometer, water bath, and nitrogen gas inlet was prepared. A total of 100 parts by weight of monomers were added to the 2L separable flask according to the formulation shown in Table 2. Furthermore, 50 parts by weight of butyl acetate was added as an organic solvent to obtain a monomer mixture. The monomers used were the same as those listed in Production Examples 1-28.

[0110] The resulting monomer mixture was bubbling with nitrogen gas for 20 minutes to remove dissolved oxygen, and then the separable flask system was replaced with nitrogen gas and the water bath was heated while stirring until it boiled. Polymerization initiators and chain transfer agents were added in the types and amounts shown in Table 2. Seven hours after the start of polymerization, the mixture was cooled to room temperature to terminate the polymerization. The resulting resin solution was then dried in a 130°C oven to remove the organic solvent. This yielded a low molecular weight (meth)acrylic resin. The polymerization initiator and chain transfer agent used were the same as those described in Production Examples 1 to 28.

[0111] [Table 2]

[0112] (Examples 1-29, Comparative Examples 1-8) (1) Preparation of resin composition A mixed solvent was obtained by mixing organic solvents to achieve the formulations shown in Table 4. A (meth)acrylic resin composition was obtained by mixing (meth)acrylic resin and the mixed solvent to achieve the formulations shown in Table 3. The following organic solvents were used. toluene ethyl acetate Methyl ethyl ketone ethanol Isopropanol 2-Butyl-2-ethyl-1,3-propanediol (BEPG) Neopentyl glycol (NPG) Texanol

[0113] (2) Preparation of inorganic fine particle dispersion slurry composition The obtained (meth)acrylic resin composition was mixed with ceramic powder and a plasticizer according to the formulations shown in Table 3, and then kneaded with a high-speed stirrer to prepare an inorganic fine particle dispersion slurry composition. The ceramic powders used were copper powder (manufactured by Fujino Metal Co., Ltd., average particle size 0.1 μm) and glass frit (manufactured by AGC Inc., average particle size 0.8 μm). The plasticizer used was di(butoxyethyl) adipate.

[0114] <Rating> The high molecular weight (meth)acrylic resin, low molecular weight (meth)acrylic resin, and inorganic fine particle dispersion slurry compositions obtained in the examples and comparative examples were evaluated as follows. The results are shown in Tables 1 to 3.

[0115] (1) Weight average molecular weight measurement The weight-average molecular weight (Mw) of the obtained high molecular weight (meth)acrylic resin and low molecular weight (meth)acrylic resin was measured in polystyrene equivalent by gel permeation chromatography using an LF-804 column (manufactured by SHOKO).

[0116] (2) Calculation of the weight concentration of OH groups The weight concentration of OH groups contained in high molecular weight (meth)acrylic resin, low molecular weight (meth)acrylic resin, and organic solvent was calculated using the following method. Weight concentration of OH groups in high molecular weight (meth)acrylic resin: [Weight of OH groups in total monomer / (Weight of total monomer + Weight of polymerization initiator)] × 100 Weight concentration of OH groups in low molecular weight (meth)acrylic resin: [(Weight of OH groups in total monomer + Weight of OH groups in chain transfer agent) / (Weight of total monomer + Weight of chain transfer agent + Weight of polymerization initiator)] × 100 Weight concentration of OH groups in an organic solvent: (Total weight of OH groups in the organic solvent / Total weight of the organic solvent) × 100

[0117] (3) Calculation of the weight concentration of S atoms The weight concentration of sulfur atoms contained in the (meth)acrylic resin was calculated using the following method. The weight concentration of sulfur atoms in (meth)acrylic resin = [weight of sulfur atoms contained in the chain transfer agent / (weight of total monomers + weight of polymerization initiator + weight of chain transfer agent)] × 100 Furthermore, if the above (meth)acrylic resin composition contains multiple (meth)acrylic resins, the weight concentration of the S atom was calculated based on the weight concentration of S atoms contained in each (meth)acrylic resin and the blending ratio of each (meth)acrylic resin.

[0118] (4) Measurement of solubility in ethanol The obtained high molecular weight (meth)acrylic resin was gradually dissolved in 100 parts by weight of ethanol at 25°C, and the amount of high molecular weight (meth)acrylic resin required to form a precipitate was defined as the solubility in ethanol.

[0119] (5) Low temperature decomposition (TGDTA characteristics) The obtained inorganic fine particle dispersion slurry composition was packed into a TG-DTA platinum pan, and the temperature was increased from 30°C at 5°C / min to evaporate the solvent and thermally decompose the resin and plasticizer. Subsequently, the time at which the weight reached 52.1% (90% degreasing was completed) was measured.

[0120] (6) Filterability Two ml of the obtained inorganic fine particle dispersion slurry composition was taken into a 2.5 ml syringe, and a needle with an outer diameter of 0.81 mm, an inner diameter of 0.51 mm, and a length of 38 mm was attached to the tip of the syringe. When a force of 5 kgf was applied, the time it took for the slurry composition to completely exit the tip of the needle was measured. A short time from which the slurry composition is completely expelled from the tip of the injection needle indicates excellent filterability, and excellent filterability suggests a high inhibitory effect on the aggregation of inorganic fine particles.

[0121] (7) Surface roughness An inorganic fine particle dispersion slurry composition was printed using a screen printing machine, screen plate, and printed glass substrate under conditions of 23°C and 50% humidity. The mixture was then solvent-dried in a forced-air oven at 100°C for 30 minutes. The resulting printed pattern was then measured at 10 locations using a surface roughness meter (Surfcom, manufactured by Tokyo Seimitsu Co., Ltd.). The following were used as the screen printing machine, screen plate, and printed glass substrate. Screen printing machine (MT-320TV, manufactured by Microtec) Screen (manufactured by Tokyo Process Service Co., Ltd., ST500, emulsion 2μm, 2012 patterns, screen frame 320mm x 320mm) Printed glass substrate (soda glass, 150mm x 150mm, 1.5mm thick) A low surface roughness indicates excellent dispersibility of inorganic fine particles.

[0122] (8) Ethanol cleansing properties 100 parts by weight of ethanol were added to 10 parts by weight of an inorganic fine particle dispersion slurry composition, and the mixture was irradiated with ultrasound. The time it took for the resin to completely dissolve in the ethanol was measured.

[0123] [Table 3]

[0124] [Table 4] [Industrial applicability]

[0125] According to the present invention, it is possible to provide a (meth)acrylic resin composition that has excellent decomposability at low temperatures and can improve the dispersibility and aggregation suppression effect of inorganic fine particles. Furthermore, it is possible to provide an inorganic fine particle dispersion slurry composition and an inorganic fine particle dispersion molded product using the (meth)acrylic resin composition.

Claims

1. A (meth)acrylic resin composition containing (meth)acrylic resin and an organic solvent, If any one of the following conditions (1) to (3) is met, A (meth)acrylic resin composition in which the weight concentration of OH groups contained in the organic solvent is 9.0% by weight or more and 28.0% by weight or less. (1) The (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (A) with a weight-average molecular weight of 120,000 or more and 300,000 or less. The weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (A) is 0.4% by weight or more and 2.0% by weight or less. (2) The (meth)acrylic resin contains a high molecular weight (meth)acrylic resin (B) having a weight-average molecular weight exceeding 300,000 and not exceeding 500,000. The weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (B) is 1.3% by weight or more and 3.5% by weight or less. (3) The (meth)acrylic resin contains a low molecular weight (meth)acrylic resin (C) having a weight-average molecular weight of 0.5 million or more and 100,000 or less. The weight concentration of OH groups contained in the low molecular weight (meth)acrylic resin (C) is 1.3% by weight or more and 3.5% by weight or less. The weight concentration of sulfur atoms contained in the (meth)acrylic resin is 250 ppm or more and 20,000 ppm or less.

2. The (meth)acrylic resin composition according to claim 1, which satisfies (1) and contains a low molecular weight (meth)acrylic resin having a weight-average molecular weight of 0.5 million to 100,000, wherein the weight concentration of OH groups contained in the low molecular weight (meth)acrylic resin is 1.3% by weight or more and 3.5% by weight or less, and the content of the low molecular weight (meth)acrylic resin per 100 parts by weight of high molecular weight (meth)acrylic resin is 0.1 parts by weight or more and 10 parts by weight or less.

3. The (meth)acrylic resin composition according to claim 1, which satisfies (1) or (2), and the solubility of the high molecular weight (meth)acrylic resin (A) or (B) in ethanol is 10 parts by weight / 100 parts by weight of ethanol or more.

4. The (meth)acrylic resin composition according to claim 1 or 3, wherein the high molecular weight (meth)acrylic resin (A) or (B) contains, with respect to all constituent units, 79% by weight or more and 96% by weight or less of constituent units represented by the following formula (a), and 3.1% by weight or more and 17% by weight or less of constituent units represented by the following formula (b). 【Chemistry 1】 In formula (a), R １ R represents a linear or branched alkyl group having 1 to 8 carbon atoms, in formula (b), ２ This represents a linear or branched alkyl group having 2 to 4 carbon atoms, in which at least one hydrogen atom is substituted with an OH group.

5. The (meth)acrylic resin composition according to claim 1 or 3, which satisfies (1) or (2), and the ratio of the weight concentration of OH groups contained in the organic solvent to the weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (A) or (B) (weight concentration of OH groups contained in the organic solvent / weight concentration of OH groups contained in the high molecular weight (meth)acrylic resin (A) or (B)) is 4.5 or more and 46.2 or less.

6. (2) is satisfied, and the (meth)acrylic resin consists only of high molecular weight (meth)acrylic resin (B), The (meth)acrylic resin composition according to claim 1 or 3, wherein the weight concentration of S atoms contained in the (meth)acrylic resin is 250 ppm or more and 20,000 ppm or less.

7. An inorganic fine particle dispersion slurry composition containing the (meth)acrylic resin composition according to any one of claims 1 to 3, inorganic fine particles, and a plasticizer.

8. An inorganic fine particle dispersion molded article made using the inorganic fine particle dispersion slurry composition described in claim 7.

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