Sensor and method for manufacturing the same

Abstract

The present invention provides a sensor capable of improving its characteristics and a method for manufacturing the same. [Solution] According to the embodiment, the sensor includes a first base, first and second detection units. The first detection unit includes a plurality of first fixing parts fixed to the first base, a plurality of first connecting parts, and a first element. The plurality of first connecting parts are supported by the plurality of first fixing parts. The first element is supported by the plurality of first connecting parts and includes a first resistive member. The second detection unit includes a plurality of second fixing parts fixed to the first base, a plurality of second connecting parts, and a second element. The plurality of second connecting parts are supported by the plurality of second fixing parts. The second element includes a second resistive member. The second element includes a second inner part and a second outer part. The second outer part is around the second inner part. The second outer part is supported by the plurality of second connecting parts. The second inner part is fixed to the first base. The second distance between the first base and the second outer part is less likely to change than the first distance between the first base and the first element.

Description

Technical Field

[0001] Embodiments of the present invention relate to sensors and methods for manufacturing the same.

Background Art

[0002] For example, there are sensors using MEMS (Micro Electro Mechanical Systems) elements etc. In sensors, improvement of characteristics is desired.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Embodiments provide a sensor capable of improving characteristics and a method for manufacturing the same.

Means for Solving the Problems

[0005] According to the embodiment, the sensor includes a first base, a first detection unit, and a second detection unit. The first detection unit includes a plurality of first fixing parts fixed to the first base, a plurality of first connecting parts, and a first element. One of the plurality of first connecting parts is supported by one of the plurality of first fixing parts. The first element is supported by the plurality of first connecting parts and includes a first resistive member. A first gap is provided between the first base and the first element. The second detection unit includes a plurality of second fixing parts fixed to the first base, a plurality of second connecting parts, and a second element. One of the plurality of second connecting parts is supported by one of the plurality of second fixing parts. The second element includes a second resistive member. The second element includes a second inner part and a second outer part. The second outer part surrounds the second inner part. The second outer part is supported by the plurality of second connecting parts. The second inner part is fixed to the first base. A second gap is provided between the first substrate and the second outer portion. The second distance between the first substrate and the second outer portion is less likely to change than the first distance between the first substrate and the first element. [Brief explanation of the drawing]

[0006] [Figure 1] Figures 1(a) and 1(b) are schematic diagrams illustrating the sensor according to the first embodiment. [Figure 2] Figures 2(a) and 2(b) are schematic diagrams illustrating the sensor according to the first embodiment. [Figure 3] Figures 3(a) and 3(b) are schematic diagrams illustrating the sensor according to the first embodiment. [Figure 4] Figures 4(a) and 4(b) are schematic diagrams illustrating the sensor according to the first embodiment. [Figure 5] Figures 5(a) and 5(b) are schematic diagrams illustrating the sensor according to the first embodiment. [Figure 6] Figures 6(a) and 6(b) are schematic diagrams illustrating a part of the sensor according to the second embodiment. [Figure 7] Figures 7(a) and 7(b) are schematic diagrams illustrating the sensor according to the third embodiment. [Figure 8]Figure 8 is a flowchart illustrating a method for manufacturing a sensor according to the fourth embodiment. [Modes for carrying out the invention]

[0007] The embodiments of the present invention will be described below with reference to the drawings. Drawings are schematic or conceptual, and the relationships between the thickness and width of each part, as well as the ratios of the sizes of different parts, are not necessarily identical to those of reality. Even when representing the same part, the dimensions and ratios may be depicted differently in different drawings. In this specification and in each figure, elements similar to those described above are denoted by the same reference numerals with respect to previously shown figures, and detailed explanations are omitted as appropriate.

[0008] (First Embodiment) Figures 1(a) and 1(b) are schematic diagrams illustrating the sensor according to the first embodiment. Figure 1(b) is a cross-sectional view taken along the line A1-A2 in Figure 1(a).

[0009] As shown in Figures 1(a) and 1(b), the sensor 110 according to this embodiment includes a first base 51s, a first detection unit 11D, and a second detection unit 12D.

[0010] The first detection unit 11D includes a plurality of first fixing parts 31, a plurality of first connecting parts 41, and a first element 11EL. The plurality of first fixing parts 31 are fixed to the first base body 51s.

[0011] The direction from the first base 51s to the multiple first fixing parts 31 is defined as the first direction D1. The first direction D1 is defined as the Z-axis direction. One direction perpendicular to the Z-axis direction is defined as the X-axis direction. The direction perpendicular to both the Z-axis direction and the X-axis direction is defined as the Y-axis direction.

[0012] The first substrate, for example, lies along the XY plane.

[0013] The plurality of first connection parts 41 are respectively supported by the plurality of first fixing parts 31. For example, one of the plurality of first connection parts 41 is supported by one of the plurality of first fixing parts 31.

[0014] The first element 11EL is supported by the plurality of first connection parts 41. The first element 11EL includes the first resistance member 11. The first element 11EL may further include the first conductive member 21. A first gap g1 is provided between the first substrate 51s and the first element 11EL. The first element 11EL may be in a film shape along the X-Y plane.

[0015] The second detection part 12D includes the plurality of second fixing parts 32, the plurality of second connection parts 42, and the second element 12EL. The plurality of second fixing parts 32 are fixed to the first substrate 51s. The plurality of second connection parts 42 are respectively supported by the plurality of second fixing parts 32. For example, one of the plurality of second connection parts 42 is supported by one of the plurality of second fixing parts 32.

[0016] The second element 12EL is supported by the plurality of second connection parts 42. The second element 12EL includes the second resistance member 12. The second element 12EL may further include the second conductive member 22.

[0017] The second element 12EL includes the second inner part 12c and the second outer part 12r. The second outer part 12r is around the second inner part 12c. The second outer part 12r may correspond to the outer edge part of the second element 12EL. The second inner part 12c may correspond to the central part of the second element 12EL. The second outer part 12r is supported by the plurality of second connection parts 42. The second inner part 12c is fixed to the first substrate 51s. A second gap g2 is provided between the first substrate 51s and the second outer part 12r.

[0018] The outer edge of the first element 11EL is supported by a plurality of first connection portions 41. On the other hand, in the second element 12EL, the second outer portion 12r of the second element 12EL is supported by a plurality of second connection portions 42, and the second inner portion 12c of the second element 12EL is fixed to the first base 51s. Therefore, the distance between the first base 51s and the second element 12EL is less likely to change compared to the distance between the first base 51s and the first element 11EL. The distance between the first base 51s and the second element 12EL does not substantially change.

[0019] In the embodiment, the second distance d2 between the first base 51s and the second outer portion 12r is less likely to change than the first distance d1 between the first base 51s and the first element 11EL.

[0020] For example, the first electrical resistance R1 of the first resistance member 11 is configured to change according to the detection target around the first detection unit 11D and the second detection unit 12D. The second electrical resistance R2 of the second resistance member 12 is configured to change according to the detection target.

[0021] For example, the first electrical resistance R1 of the first resistance member 11 changes according to the state of the detection target. By detecting the first electrical resistance R1, the detection target can be detected. The second electrical resistance R2 of the second resistance member 12 changes according to the state of the detection target. By detecting the second electrical resistance R2, the detection target can be detected. The detection target may be, for example, a gas (such as carbon dioxide). The sensor 110 is, for example, a gas sensor.

[0022] For example, the value based on the first electrical resistance R1 (for example, the first detection result) may be corrected by the value based on the second electrical resistance R2 (for example, the second detection result).

[0023] For example, the first distance d1 between the first substrate 51s and the first element 11EL may change due to temperature changes of the first element 11EL. For example, the first distance d1 between the first substrate 51s and the first element 11EL may change due to changes over time. When the first distance d1 between the first substrate 51s and the first element 11EL changes, the thermal characteristics (e.g., heat dissipation) of the first element 11EL change. As a result, the first electrical resistance R1 may change unintentionally, independently of the state of the object being detected.

[0024] On the other hand, the change in the second distance d2 between the first substrate 51s and the second element 12EL (second outer part 12r) is small. The change in the second electrical resistance R2 due to the change in the second distance d2 is small. By correcting the value based on the first electrical resistance R1 using the value based on the detected second electrical resistance R2, the target can be detected more accurately. According to this embodiment, a sensor capable of improving characteristics can be provided.

[0025] As shown in Figure 1(b), a controller 70 may be provided in the sensor 110. The controller 70 is configured to perform a first operation that outputs an output signal Sg1. The output signal Sg1 is obtained by a second operation that corrects a first value based on a first electrical resistance R1 based on a second value based on a second electrical resistance R2. In the second operation, for example, correction (or calibration) is performed. By performing the first operation based on the second operation, a more accurate detection result can be obtained. The controller 70 may include a processor.

[0026] The controller 70 may be configured to repeat the first and second operations multiple times. Calibration may be performed periodically.

[0027] In this embodiment, the coefficient relating the first electrical resistance R1 obtained from the first resistive member 11 and the concentration of the substance to be detected may be corrected by a second value (e.g., a second detection result) based on the second electrical resistance R2. For example, the detection result of the first electrical resistance R1 is converted to the concentration of the substance to be detected (e.g., gas concentration) based on the coefficient. The converted value (concentration) corresponds to the value based on the first electrical resistance R1. In this case as well, by correcting the coefficient with a second value (e.g., a second detection result) based on the second electrical resistance R2, the substance to be detected can be accurately detected.

[0028] As shown in Figures 1(a) and 1(b), the first element 11EL may further include a first conductive member 21. The second element 12EL may further include a second conductive member 22. The controller 70 may be configured to supply first power to the first conductive member 21 when detecting the first electrical resistance R1. The controller 70 may be configured to supply second power to the second conductive member 22 when detecting the second electrical resistance R2. These conductive members are, for example, heaters. The temperature at which electrical resistance is detected changes depending on the state of the object to be detected.

[0029] As shown in Figures 1(a) and 1(b), the first element 11EL may include a first insulating member 11i. At least a portion of the first insulating member 11i is located between the first resistive member 11 and the first conductive member 21. The second element 12EL may include a second insulating member 12i. At least a portion of the second insulating member 12i is located between the second resistive member 12 and the second conductive member 22.

[0030] The wiring connected to the first resistive member 11 may be electrically connected to the controller 70 via one of the multiple first connection parts 41. The wiring connected to the first conductive member 21 may be electrically connected to the controller 70 via one of the multiple first connection parts 41. The wiring connected to the second resistive member 12 may be electrically connected to the controller 70 via one of the multiple second connection parts 42. The wiring connected to the second conductive member 22 may be electrically connected to the controller 70 via one of the multiple second connection parts 42.

[0031] As shown in Figure 1(a), the length of one of the multiple first connection portions 41 (first length) may be longer than the width of one of the multiple first connection portions 41 (first width). The first length is the length of one of the multiple first connection portions 41 along the first extending direction in which one of the multiple first connection portions 41 extends. The first width is the length of one of the multiple first connection portions 41 along the first intersecting direction that intersects the first extending direction. Each of the multiple first connection portions 41 may have, for example, a bent structure. Each of the multiple first connection portions 41 may have, for example, a meander structure. Such a structure suppresses heat dissipation from the first element 11EL. Stable characteristics are easily obtained.

[0032] As shown in Figure 1(a), the length of one of the multiple second connection portions 42 (second length) may be longer than the width of one of the multiple second connection portions 42 (second width). The second length is the length of one of the multiple second connection portions 42 along the second extending direction to which one of the multiple second connection portions 42 extends. The second width is the length of one of the multiple second connection portions 42 along the second intersecting direction that intersects the second extending direction. Each of the multiple second connection portions 42 may have, for example, a bent structure. Each of the multiple second connection portions 42 may have, for example, a meander structure. Such a structure suppresses heat dissipation from the second element 12EL. Stable characteristics are easily obtained.

[0033] As shown in Figure 1(b), the sensor 110 may be provided with a first memory 70M. The first memory 70M may be configured to store detection results. The first memory 70M may be configured to store values ​​(such as coefficients) used in at least one of the first and second operations described above. The controller 70 may be configured to control the operation of the first memory 70M. The controller 70 may be configured to store information acquired from an external source in the first memory 70M.

[0034] In the sensor 110, for example, in the second direction D2, the first element 11EL is between one of the plurality of first connection parts 41 and another of the plurality of first connection parts 41. The second direction D2 intersects with the first direction D1. The second direction D2 may be, for example, the X-axis direction. For example, in the third direction D3, the first element 11EL is between one of the plurality of first connection parts 41 and another of the plurality of first connection parts 41. The third direction D3 intersects with the plane containing the first direction D1 and the second direction D2. The third direction D3 may be, for example, the Y-axis direction.

[0035] In the sensor 110, for example, in the second direction D2, the second element 12EL is located between one of the multiple second connection parts 42 and another of the multiple second connection parts 42. For example, in the third direction D3, the second element 12EL is located between one of the multiple second connection parts 42 and another of the multiple second connection parts 42.

[0036] Figures 2(a) and 2(b) are schematic diagrams illustrating the sensor according to the first embodiment. Figure 2(b) is a cross-sectional view taken along the line A1-A2 in Figure 2(a). As shown in Figures 2(a) and 2(b), in the sensor 110a according to this embodiment, the configuration of the second detection unit 12D differs from the configuration of the first detection unit 11D. The configuration of the sensor 110a, excluding this, may be the same as that of the sensor 110.

[0037] In sensor 110a, the number of multiple second connection points 42 (second number) is different from the number of multiple first connection points 41 (first number). In this example, the second number is smaller than the first number. The multiple second connection points 42 serve as heat dissipation paths for the second element 12EL. The heat dissipation through the connection members in the second element 12EL is different from the heat dissipation through the connection members in the first element 11EL.

[0038] As already explained, the second distance d2 is less prone to change than the first distance d1. In the first element 11EL and the second element 12EL, a difference in heat dissipation to the first substrate 51s is provided due to the difference in distance. Furthermore, as described above, a difference in heat dissipation via connecting members may also be provided. For example, a second operation may be performed in which the first value based on the first electrical resistance R1 is corrected based on the second value based on the second electrical resistance R2.

[0039] Figures 3(a) and 3(b) are schematic diagrams illustrating the sensor according to the first embodiment. Figure 3(b) is a cross-sectional view taken along the line A1-A2 in Figure 3(a). As shown in Figures 3(a) and 3(b), in the sensor 110b according to this embodiment, the configuration of the second detection unit 12D differs from the configuration of the first detection unit 11D. The configuration of the sensor 110b, excluding this, may be the same as that of the sensor 110. In the sensor 110b, the second number is greater than the first number. In this embodiment, the second number may be smaller than the first number.

[0040] Figures 4(a) and 4(b) are schematic diagrams illustrating the sensor according to the first embodiment. Figure 4(b) is a cross-sectional view taken along the line A1-A2 in Figure 4(a). As shown in Figures 4(a) and 4(b), in the sensor 110c according to this embodiment, the configuration of the second detection unit 12D differs from the configuration of the first detection unit 11D. The configuration of the sensor 110c other than this can be the same as that of sensor 110, sensor 110a, or sensor 110b.

[0041] In sensor 110c, the area of ​​the second element 12EL (second area) is different from the area of ​​the first element 11EL (first area). In this example, the second area is larger than the first area. This difference in area results in a difference in heat dissipation.

[0042] In the first element 11EL and the second element 12EL, a difference in heat dissipation to the first base 51s due to the difference between the first distance d1 and the second distance d2, and a difference in heat dissipation due to the difference in area may be provided. For example, a second operation may be performed in which the first value based on the first electrical resistance R1 is corrected based on the second value based on the second electrical resistance R2.

[0043] Figures 5(a) and 5(b) are schematic diagrams illustrating the sensor according to the first embodiment. Figure 5(b) is a cross-sectional view taken along the line A1-A2 in Figure 5(a). As shown in Figures 5(a) and 5(b), in the sensor 110d according to this embodiment, the configuration of the second detection unit 12D differs from the configuration of the first detection unit 11D. The configuration of the sensor 110d other than this may be the same as that of the sensor 110. In the sensor 110d, the second area is smaller than the first area. In this embodiment, the second area may be smaller than the first area.

[0044] As described above, in the embodiment, the first detection unit 11D and the second detection unit 12D may satisfy at least one of the first and second conditions. In the first condition, the second number of the plurality of second connection parts 42 is different from the first number of the plurality of first connection parts 41. In the second condition, the second area of ​​the second element 12EL is different from the first area of ​​the first element 11EL.

[0045] (Second Embodiment) In the second embodiment, the sensor further includes a third detection unit 13D in addition to the first detection unit 11D and the second detection unit 12D described above. In the second embodiment, the first detection unit 11D and the second detection unit 12D may have the configuration described with respect to the first embodiment. An example of the third detection unit 13D will be described below.

[0046] Figures 6(a) and 6(b) are schematic diagrams illustrating a part of the sensor according to the second embodiment. Figure 6(b) is a cross-sectional view taken along the line A1-A2 in Figure 6(a). As shown in Figures 6(a) and 6(b), the sensor 120 according to the embodiment includes a third detection unit 13D. The sensor 120 includes the first detection unit 11D and the second detection unit 12D described with respect to the first embodiment.

[0047] The third detection unit 13D includes a plurality of third fixing parts 33, a plurality of third connecting parts 43, and a third element 13EL. The plurality of third fixing parts 33 are fixed to the first substrate 51s. The plurality of third connecting parts 43 are each supported by the plurality of third fixing parts 33. For example, one of the plurality of third connecting parts 43 is supported by one of the plurality of third fixing parts 33.

[0048] The third element 13EL is supported by a plurality of third connection parts 43. The third element 13EL includes a third resistive member 13. The third element 13EL may further include a third conductive member 23.

[0049] The third element 13EL includes a third inner portion 13c and a third outer portion 13r. The third outer portion 13r surrounds the third inner portion 13c. The third outer portion 13r may correspond to the outer edge of the third element 13EL. The third inner portion 13c may correspond to the central portion of the third element 13EL. The third outer portion 13r is supported by a plurality of third connection portions 43. The third inner portion 13c is fixed to the first base 51s.

[0050] A third void g3 is provided between the first base 51s and the third outer part 13r. The third distance d3 between the first base 51s and the third outer part 13r is less likely to change than the first distance d1.

[0051] The first electrical resistance R1 of the first resistive member 11 is configured to change according to the object being detected around the first detection unit 11D, the second detection unit 12D, and the third detection unit 13D. The second electrical resistance R2 of the second resistive member 12 is configured to change according to the object being detected. The third electrical resistance R3 of the third resistive member 13 is configured to change according to the object being detected.

[0052] In this embodiment, the configuration of the third element 13EL may differ from the configuration of the second element 12EL. For example, the third area of ​​the multiple third elements 13EL may differ from the second area of ​​the multiple second elements 12EL.

[0053] For example, a difference in heat dissipation is created between the third element 13EL and the second element 12EL due to the difference in area. By using the two detection results obtained from these two elements, the state of the object to be detected can be detected more accurately.

[0054] For example, the value (detection result) based on the first electrical resistance R1 may be corrected based on the second electrical resistance R2 and the third resistive member 13. For example, a controller 70 configured to perform a first operation that outputs an output signal Sg1 may be provided. The output signal Sg1 is obtained by a second operation that corrects the first value (first detection result) based on the first electrical resistance R1 based on at least one of the second value (second detection result) based on the second electrical resistance R2 and the third value (third detection result) based on the third electrical resistance R3. Such correction allows for more accurate detection of the object to be detected.

[0055] The controller 70 may be configured to repeat the first and second operations multiple times. For example, correction (or calibration) may be performed periodically. For example, the obtained correction coefficient may be stored in the first memory 70M or the like.

[0056] The third detection unit 13D described with respect to Figures 6(a) and 6(b) may be combined with the sensor 110a. In this case, the number of the multiple third connection parts 43 (third number) is different from the number of the multiple second connection parts 42 (second number). For example, the third number is greater than the second number. A difference in heat dissipation may be provided between the second element 12EL and the third element 13EL based on the number of connection parts.

[0057] Thus, the second detection unit 12D and the third detection unit 13D may satisfy at least one of the third and fourth conditions. In the third condition, the third number of the plurality of third connection parts 43 is different from the second number of the plurality of second connection parts 42. In the fourth condition, the third area of ​​the plurality of third elements 13EL is different from the second area of ​​the plurality of second elements 12EL.

[0058] In the sensor 120, the first element 11EL may include a first conductive member 21. The second element 12EL may include a second conductive member 22. The third element 13EL may include a third conductive member 23. The controller 70 may be configured to supply first power to the first conductive member 21 when detecting a first electrical resistance R1. The controller 70 may be configured to supply second power to the second conductive member 22 when detecting a second electrical resistance R2. The controller 70 may be configured to supply third power to the third conductive member 23 when detecting a third electrical resistance R3.

[0059] As shown in Figure 6(a), the length of one of the multiple third connection parts 43 (third length) may be longer than the width of one of the multiple third connection parts 43 (third width). The third length is the length of one of the multiple third connection parts 43 along the third extending direction to which one of the multiple third connection parts 43 extends. The third width is the length of one of the multiple third connection parts 43 along the third intersecting direction that intersects the third extending direction. Each of the multiple third connection parts 43 may have, for example, a bent structure. Each of the multiple third connection parts 43 may have, for example, a meander structure. Such a structure suppresses heat dissipation from the third element 13EL. Stable characteristics are easily obtained.

[0060] As shown in Figures 6(a) and 6(b), the third element 13EL may include a third insulating member 13i. At least a portion of the third insulating member 13i is located between the third resistive member 13 and the third conductive member 23.

[0061] (Third embodiment) Figures 7(a) and 7(b) are schematic diagrams illustrating the sensor according to the third embodiment. Figure 7(b) is a cross-sectional view taken along the line A1-A2 in Figure 7(a). As shown in Figures 7(a) and 7(b), the sensor 130 according to this embodiment includes a first base 51s, a first detection unit 11D, and a second detection unit 12D.

[0062] The first detection unit 11D includes a plurality of first fixing parts 31, a plurality of first connecting parts 41, and a first element 11EL. The plurality of first fixing parts 31 are fixed to the first base 51s. The plurality of first connecting parts 41 are each supported by the plurality of first fixing parts 31. For example, one of the plurality of first connecting parts 41 is supported by one of the plurality of first fixing parts 31. The first element 11EL is supported by the plurality of first connecting parts 41. A first gap g1 is provided between the first base 51s and the first element 11EL.

[0063] The second detection unit 12D includes a plurality of second fixing parts 32, a plurality of second connecting parts 42, and a second element 12EL. The plurality of second fixing parts 32 are fixed to the first base body 51s. The plurality of second connecting parts 42 are each supported by the plurality of second fixing parts 32. For example, one of the plurality of second connecting parts 42 is supported by one of the plurality of second fixing parts 32. The second element 12EL is supported by the plurality of second connecting parts 42. The second element 12EL includes a second resistive member 12. A second air gap g2 is provided between the first base body 51s and the second element 12EL.

[0064] In the sensor 130, the number of multiple second connection points 42 (second number) is different from the number of multiple first connection points 41 (first number).

[0065] The difference in the number of connection points results in a difference in heat dissipation. By using the detection signals obtained from these two detection units, the target can be detected more accurately.

[0066] As already explained, the first electrical resistance R1 of the first resistive member 11 is configured to change depending on the object to be detected around the first detection unit 11D and the second detection unit 12D. The second electrical resistance R2 of the second resistive member 12 is configured to change depending on the object to be detected.

[0067] A controller 70 may be provided in the sensor 130. The controller 70 is configured to perform a first operation that outputs an output signal Sg1. The output signal Sg1 is obtained by a second operation that corrects the first value (detection result) based on the first electrical resistance R1 based on a second value based on the second electrical resistance R2.

[0068] In the sensor 130, the second distance d2 between the first substrate 51s and the second element 12EL may be less prone to change than the first distance d1 between the first substrate 51s and the first element 11EL.

[0069] (Fourth Embodiment) The method for manufacturing a sensor according to the fourth embodiment is a method for manufacturing a sensor (for example, a sensor 110, etc.) that includes a first base 51s, a first detection unit 11D, a first memory 70M, and a controller 70.

[0070] As already explained, the first detection unit 11D includes a plurality of first fixing parts 31, a plurality of first connecting parts 41, and a first element 11EL, all fixed to the first base 51s. One of the plurality of first connecting parts 41 is supported by one of the plurality of first fixing parts 31. The first element 11EL is supported by the plurality of first connecting parts 41. A first gap g1 is provided between the first base 51s and the first element 11EL.

[0071] The controller 70 is configured to correct a first value based on the first electrical resistance R1 of the first resistive member 11 based on first information stored in the first memory 70M.

[0072] Figure 8 is a flowchart illustrating a method for manufacturing a sensor according to the fourth embodiment. As shown in Figure 8, the manufacturing method according to the embodiment includes forming the first detection unit 11D (step S110). The manufacturing method also includes storing the first information in the first memory 70M (step S120).

[0073] At least a portion of the above first information is obtained from the second detection unit 12D. The second detection unit 12D may include a plurality of second fixing parts 32, a plurality of second connecting parts 42, and a second element 12EL. The plurality of second fixing parts 32 are fixed to a substrate other than the first substrate 51s (e.g., a second substrate). One of the plurality of second connecting parts 42 is supported by one of the plurality of second fixing parts 32. The second element 12EL is supported by the plurality of second connecting parts 42. The second element 12EL includes a second resistive member 12. The second element 12EL may further include a second conductive member 22.

[0074] The second element 12EL includes a second inner portion 12c and a second outer portion 12r. The second outer portion 12r is located around the second inner portion 12c. The second outer portion 12r is supported by a plurality of second connecting portions 42. The second inner portion 12c is fixed to the second base (see Figure 1(b), etc.). A second gap g2 is provided between the second base and the second outer portion 12r. For example, the second distance d2 between the second base and the second outer portion 12r is less likely to change than the first distance d1 between the first base 51s and the first element 11EL.

[0075] In the sensor manufacturing method according to the embodiment, information derived from a second value (detection result) based on the second electrical resistance R2 obtained from the second element 12EL of the second detection unit 12D as described above is stored in the first memory 70M. The first information includes, for example, a correction coefficient. Once the first information is stored in the first memory 70M, correction is performed in the controller 70. According to the embodiment, a sensor manufacturing method capable of improving characteristics is provided.

[0076] The second substrate described above may correspond to a part of the first substrate 51s illustrated in Figures 1(a) and 1(b), etc.

[0077] In the manufacturing method according to the embodiment, a portion of the first information may be further obtained from the third detection unit 13D. The third detection unit 13D may include a plurality of third fixing parts 33 fixed to the second substrate, a plurality of third connecting parts 43, and a third element 13EL. One of the plurality of third connecting parts 43 is supported by one of the plurality of third fixing parts 33. The third element 13EL is supported by the plurality of third connecting parts 43.

[0078] The third element 13EL includes a third inner portion 13c and a third outer portion 13r. The third outer portion 13r surrounds the third inner portion 13c. The third outer portion 13r is supported by a plurality of third connecting portions 43. The third inner portion 13c is fixed to the second base. A third gap g3 is provided between the second base and the third outer portion 13r.

[0079] The third distance d3 between the second base and the third outer portion 13r is less prone to change than the first distance d1. For example, the second detection unit 12D and the third detection unit 13D satisfy at least one of the third and fourth conditions. In the third condition, the third number of the plurality of third connection parts 43 is different from the second number of the plurality of second connection parts 42. In the fourth condition, the third area of ​​the plurality of third elements 13EL is different from the second area of ​​the plurality of second elements 12EL. A method for manufacturing a sensor capable of improving characteristics is provided.

[0080] The embodiments may include the following technical proposals. (Technical proposal 1) First substrate and, First detection unit, The second detection unit, Equipped with, The first detection unit is, A plurality of first fixing parts fixed to the first base, A plurality of first connecting parts, wherein one of the plurality of first connecting parts is supported by one of the plurality of first fixing parts, A first element supported by the plurality of first connection points and including a first resistive member, Includes, A first gap is provided between the first substrate and the first element. The second detection unit is, A plurality of second fixing parts fixed to the first base, A plurality of second connecting parts, wherein one of the plurality of second connecting parts is supported by one of the plurality of second fixing parts, A second element including a second resistive member, wherein the second element includes a second inner portion and a second outer portion, the second outer portion is located around the second inner portion, the second outer portion is supported by the plurality of second connecting portions, and the second inner portion is fixed to the first base, Includes, A second gap is provided between the first base and the second outer part. A sensor in which the second distance between the first substrate and the second outer portion is less likely to change than the first distance between the first substrate and the first element.

[0081] (Technical proposal 2) The first length of one of the plurality of first connecting portions is longer than the first width of one of the plurality of first connecting portions. The first length is the length of one of the plurality of first connecting parts along the first extending direction in which one of the plurality of first connecting parts extends, The sensor according to Technical Proposal 1, wherein the first width is the length of one of the plurality of first connection portions along a first intersecting direction that intersects the first extending direction.

[0082] (Technical proposal 3) The first electrical resistance of the first resistor is configured to change according to the object to be detected around the first detection unit and the second detection unit. The sensor according to Technical Proposal 1 or 2, wherein the second electrical resistance of the second resistive member is configured to change according to the object to be detected.

[0083] (Technical proposal 4) The controller further comprises a controller configured to perform a first operation that outputs an output signal, The sensor according to Technical Proposal 3, wherein the output signal is obtained by a second operation which corrects the first value based on the first electrical resistance based on the second value based on the second electrical resistance.

[0084] (Technical proposal 5) The first element further includes a first conductive member, The second element further includes a second conductive member, The controller is configured to supply first power to the first conductive member when detecting the first electrical resistance. The sensor according to Technical Proposal 4, wherein the controller is configured to supply a second power to the second conductive member when detecting the second electrical resistance.

[0085] (Technical proposal 6) The sensor according to Technical Proposal 4 or 5, wherein the controller is configured to perform the first operation and the second operation multiple times.

[0086] (Technical proposal 7) The first detection unit and the second detection unit satisfy at least one of the first and second conditions, In the first condition described above, the second number of the plurality of second connection parts is different from the first number of the plurality of first connection parts, The sensor according to any one of Technical Proposals 1 to 6, wherein, in the second condition, the second area of ​​the second element is different from the first area of ​​the first element.

[0087] (Technical proposal 8) Further equipped with a third detection unit, The third detection unit is, Multiple third fixing parts fixed to the first base, A plurality of third connecting parts, wherein one of the plurality of third connecting parts is supported by one of the plurality of third fixing parts, A third element including a third resistive member, wherein the third element includes a third inner portion and a third outer portion, the third outer portion is located around the third inner portion, the third outer portion is supported by the plurality of third connecting portions, and the third inner portion is fixed to the first base, the third element and Includes, A third gap is provided between the first base and the third outer portion. The sensor according to Technical Proposal 1 or 2, wherein the third distance between the first substrate and the third outer portion is less likely to change than the first distance.

[0088] (Technical proposal 9) The sensor according to Technical Proposal 8, wherein the third number of the plurality of third connection parts is different from the second number of the plurality of second connection parts.

[0089] (Technical proposal 10) The sensor according to Technical Proposal 8, wherein the third area of ​​the plurality of third elements is different from the second area of ​​the plurality of second elements.

[0090] (Technical proposal 11) The first electrical resistance of the first resistor member is configured to change according to the object to be detected around the first detection unit, the second detection unit, and the third detection unit. The second electrical resistance of the second resistor is configured to change according to the object to be detected. The sensor according to Technical Proposal 8, wherein the third electrical resistance of the third resistive member is configured to change according to the object to be detected.

[0091] (Technical proposal 12) The controller further comprises a controller configured to perform a first operation that outputs an output signal, The sensor according to proposal 11, wherein the output signal is obtained by a second operation that corrects the first value based on the first electrical resistance based on at least one of the second value based on the second electrical resistance and the third value based on the third electrical resistance.

[0092] (Technical proposal 13) The sensor according to Technical Proposal 12, wherein the controller is configured to perform the first operation and the second operation multiple times.

[0093] (Technical proposal 14) The first element further includes a first conductive member, The second element further includes a second conductive member, The third element further includes a third conductive member, The controller is configured to supply first power to the first conductive member when detecting the first electrical resistance. The controller is configured to supply a second power to the second conductive member when detecting the second electrical resistance. The sensor according to technical proposal 12 or 13, wherein the controller is configured to supply a third power to the third conductive member when detecting the third electrical resistance.

[0094] (Technical proposal 15) First substrate and, First detection unit, The second detection unit, Equipped with, The first detection unit is, A plurality of first fixing parts fixed to the first base, A plurality of first connecting parts, wherein one of the plurality of first connecting parts is supported by one of the plurality of first fixing parts, A first element supported by the plurality of first connection points and including a first resistive member, Includes, A first gap is provided between the first substrate and the first element. The second detection unit is, A plurality of second fixing parts fixed to the first base, A plurality of second connecting parts, wherein one of the plurality of second connecting parts is supported by one of the plurality of second fixing parts, A second element supported by the plurality of second connection portions and including a second resistive member, Includes, A second gap is provided between the first substrate and the second element. A sensor in which the second number of the plurality of second connection parts is different from the first number of the plurality of first connection parts.

[0095] (Technical proposal 16) The sensor according to Technical Proposal 15, wherein the second distance between the first substrate and the second element is less likely to change than the first distance between the first substrate and the first element.

[0096] (Technical proposal 17) The first electrical resistance of the first resistor is configured to change according to the object to be detected around the first detection unit and the second detection unit. The sensor according to technical proposal 15 or 16, wherein the second electrical resistance of the second resistive member is configured to change according to the object to be detected.

[0097] (Technical proposal 18) The controller further comprises a controller configured to perform a first operation that outputs an output signal, The sensor according to Technical Proposal 17, wherein the output signal is obtained by a second operation which corrects the first value based on the first electrical resistance based on the second value based on the second electrical resistance.

[0098] (Technical proposal 19) A method for manufacturing a sensor, comprising a first substrate, a first detection unit, a first memory, and a controller, The first detection unit is, A plurality of first fixing parts fixed to the first base, A plurality of first connecting parts, wherein one of the plurality of first connecting parts is supported by one of the plurality of first fixing parts, A first element supported by the plurality of first connection points and including a first resistive member, Includes, A first gap is provided between the first substrate and the first element. The controller is configured to correct a first value based on the first electrical resistance of the first resistor member based on first information stored in the first memory. The aforementioned manufacturing method is The first detection unit is formed, The first information is stored in the first memory, At least a portion of the first information is obtained from the second detection unit, The second detection unit is, Multiple second fixing parts fixed to the second base, A plurality of second connecting parts, wherein one of the plurality of second connecting parts is supported by one of the plurality of second fixing parts, A second element including a second resistive member, wherein the second element includes a second inner portion and a second outer portion, the second outer portion is located around the second inner portion, the second outer portion is supported by the plurality of second connecting portions, and the second inner portion is fixed to the second base, Includes, A second gap is provided between the second base and the second outer part. A method for manufacturing a sensor, wherein the second distance between the second substrate and the second outer portion is less likely to change than the first distance between the first substrate and the first element.

[0099] (Technical proposal 20) A portion of the above first information is further obtained from the third detection unit, The third detection unit is, Multiple third fixing parts fixed to the second base, A plurality of third connecting parts, wherein one of the plurality of third connecting parts is supported by one of the plurality of third fixing parts, A third element including a third resistive member, wherein the third element includes a third inner portion and a third outer portion, the third outer portion is located around the third inner portion, the third outer portion is supported by the plurality of third connecting portions, and the third inner portion is fixed to the second base, the third element and Includes, A third gap is provided between the second base and the third outer part. The third distance between the second substrate and the third outer portion is less prone to change than the first distance. The second detection unit and the third detection unit satisfy at least one of the third and fourth conditions, In the third condition described above, the third number of the plurality of third connection parts is different from the second number of the plurality of second connection parts, A method for manufacturing a sensor according to Technical Proposal 19, wherein, in the fourth condition, the third area of ​​the plurality of third elements is different from the second area of ​​the plurality of second elements.

[0100] According to the embodiment, a sensor capable of improving its characteristics and a method for manufacturing the same can be provided.

[0101] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configuration of each element included in the sensor, such as the substrate, detection unit, and controller, is included within the scope of the present invention as long as it can be implemented in the same way and similar effects can be obtained by appropriately selecting from the range known to those skilled in the art.

[0102] Furthermore, combinations of two or more elements from any of the specific examples, to the extent technically feasible, are also included within the scope of the present invention, insofar as they encompass the gist of the invention.

[0103] Furthermore, all sensors and their manufacturing methods that a person skilled in the art can implement by appropriately modifying the design based on the sensors and their manufacturing methods described above as embodiments of the present invention also fall within the scope of the present invention, insofar as they encompass the gist of the present invention.

[0104] Furthermore, within the scope of the concept of the present invention, a person skilled in the art could conceive of various modifications and alterations, and it is understood that such modifications and alterations also fall within the scope of the present invention.

[0105] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of symbols]

[0106] 11~13: 1st~3rd resistive members, 11D~13D: 1st~3rd detection units, 11EL~13EL: 1st~3rd elements, 11i~13i: 1st~3rd insulating members, 12c, 13c: 2nd, 3rd inner parts, 12r, 13r: 2nd, 3rd outer parts, 21~23: 1st~3rd conductive members, 31~33: 1st~3rd fixing parts, 41~43: 1st~3rd connection parts, 51s: 1st base body, 70: controller, 70M: 1st memory, 110, 110a~110d, 120, 130: sensors, D1~D3: 1st~3rd directions, Sg1: output signal, d1~d3: 1st~3rd distances, g1~g3: 1st~3rd air gaps

Claims

1. First substrate and, First detection unit, The second detection unit, Equipped with, The first detection unit is, A plurality of first fixing parts fixed to the first base, A plurality of first connecting parts, wherein one of the plurality of first connecting parts is supported by one of the plurality of first fixing parts, A first element supported by the plurality of first connection portions and including a first resistive member, Includes, A first gap is provided between the first substrate and the first element. The second detection unit is, A plurality of second fixing parts fixed to the first base, A plurality of second connecting parts, wherein one of the plurality of second connecting parts is supported by one of the plurality of second fixing parts, A second element comprising a second resistive member, wherein the second element includes a second inner portion and a second outer portion, the second outer portion is located around the second inner portion, the second outer portion is supported by the plurality of second connecting portions, and the second inner portion is fixed to the first base, Includes, A second gap is provided between the first base and the second outer part. A sensor in which the second distance between the first substrate and the second outer portion is less likely to change than the first distance between the first substrate and the first element.

2. The first electrical resistance of the first resistor member is configured to change according to the object to be detected around the first detection unit and the second detection unit. The sensor according to claim 1, wherein the second electrical resistance of the second resistive member is configured to change according to the object to be detected.

3. The controller is further configured to perform a first operation that outputs an output signal, The sensor according to claim 2, wherein the output signal is obtained by a second operation which corrects the first value based on the first electrical resistance based on the second value based on the second electrical resistance.

4. The first element further includes a first conductive member, The second element further includes a second conductive member, The controller is configured to supply first power to the first conductive member when detecting the first electrical resistance. The sensor according to claim 3, wherein the controller is configured to supply a second power to the second conductive member when detecting the second electrical resistance.

5. The sensor according to claim 3 or 4, wherein the controller is configured to perform the first operation and the second operation multiple times.

6. Further equipped with a third detection unit, The third detection unit is, A plurality of third fixing parts fixed to the first base, A plurality of third connecting parts, wherein one of the plurality of third connecting parts is supported by one of the plurality of third fixing parts, A third element including a third resistive member, wherein the third element includes a third inner portion and a third outer portion, the third outer portion is located around the third inner portion, the third outer portion is supported by the plurality of third connecting portions, and the third inner portion is fixed to the first base, the third element and Includes, A third void is provided between the first base and the third outer portion. The sensor according to claim 1, wherein the third distance between the first substrate and the third outer portion is less likely to change than the first distance.

7. The sensor according to claim 6, wherein the third number of the plurality of third connection parts is different from the second number of the plurality of second connection parts.

8. The sensor according to claim 6, wherein the third area of ​​the plurality of third elements is different from the second area of ​​the plurality of second elements.

9. First substrate and, First detection unit, The second detection unit, Equipped with, The first detection unit is, A plurality of first fixing parts fixed to the first base, A plurality of first connecting parts, wherein one of the plurality of first connecting parts is supported by one of the plurality of first fixing parts, A first element supported by the plurality of first connection portions and including a first resistive member, Includes, A first gap is provided between the first substrate and the first element. The second detection unit is, A plurality of second fixing parts fixed to the first base, A plurality of second connecting parts, wherein one of the plurality of second connecting parts is supported by one of the plurality of second fixing parts, A second element, supported by the plurality of second connection points and including a second resistive member, Includes, A second gap is provided between the first substrate and the second element. A sensor in which the second number of the plurality of second connection parts is different from the first number of the plurality of first connection parts.

10. A method for manufacturing a sensor, comprising a first substrate, a first detection unit, a first memory, and a controller, The first detection unit is, A plurality of first fixing parts fixed to the first base, A plurality of first connecting parts, wherein one of the plurality of first connecting parts is supported by one of the plurality of first fixing parts, A first element supported by the plurality of first connection portions and including a first resistive member, Includes, A first gap is provided between the first substrate and the first element. The controller is configured to correct a first value based on the first electrical resistance of the first resistor member based on first information stored in the first memory. The aforementioned manufacturing method is The first detection unit is formed, The first information is stored in the first memory, At least a portion of the first information is obtained from the second detection unit, The second detection unit is, Multiple second fixing parts fixed to the second base, A plurality of second connecting parts, wherein one of the plurality of second connecting parts is supported by one of the plurality of second fixing parts, A second element comprising a second resistive member, wherein the second element includes a second inner portion and a second outer portion, the second outer portion is located around the second inner portion, the second outer portion is supported by the plurality of second connecting portions, and the second inner portion is fixed to the second base, Includes, A second gap is provided between the second base and the second outer portion. A method for manufacturing a sensor, wherein the second distance between the second substrate and the second outer portion is less likely to change than the first distance between the first substrate and the first element.

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