Light-emitting device, first and second light-emitting devices, and light-emitting module

Abstract

To realize a light-emitting device that can reduce wiring resistance. [Solution] A plurality of light-emitting elements, each having a first electrode and a second electrode and emitting light in a first direction, a first element side wiring section, a second element side wiring section, a third element side wiring section, and a first power supply side wiring section and a second power supply side wiring section electrically connected thereto. , 3rd power supply side wiring section It has multiple wiring sections including multiple light-emitting elements Aligned in the second direction A substrate is provided, and a first wiring and a second wiring are electrically connected to a plurality of light-emitting elements on the first electrode side. Third wiring that electrically connects to multiple light-emitting elements on the second electrode side. It includes multiple wirings, The first element-side wiring section and the second element-side wiring section are both located at a position away from the multiple light-emitting elements in a second direction, and the third element-side wiring section is located at a position away from the multiple light-emitting elements in the direction opposite to the second direction. The first wiring, the second wiring, and the third wiring are the wiring section on the first element side and the wiring section on the second element side. , and connected to the wiring section on the third element side A light-emitting device.

Description

Technical Field

[0001] The present invention relates to a light-emitting device, a first and a second light-emitting device, and a light-emitting module.

Background Art

[0002] Japanese Unexamined Patent Application Publication No. 2023-46198 discloses a light-emitting device including a substrate, a plurality of light-emitting elements, and a plurality of wirings, in which the plurality of light-emitting elements arranged on the substrate are electrically connected to the substrate by the plurality of wirings.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Disclosed is an invention that solves the problem of realizing a light-emitting device capable of reducing the resistance related to conduction.

[0005] Alternatively, instead of the above problems, an invention that solves the problem of realizing a light-emitting device that is easy to wire-connect is disclosed.

[0006] Alternatively, instead of each of the above problems, an invention that solves the problem of improving the convenience related to the confirmation of the bonding state of the wiring in a light-emitting device is disclosed.

[0007] Note that in this specification, inventions that solve a plurality of the above problems in a combined manner are also disclosed.

Means for Solving the Problems

[0009] Another light-emitting device disclosed in the embodiment comprises one or more second light-emitting elements having a first electrode and a second electrode, a substrate on which the one or more second light-emitting elements are arranged having a plurality of wiring sections including a first element-side wiring section, a second element-side wiring section, a first power supply-side wiring section electrically connected to the first element-side wiring section, and a second power supply-side wiring section electrically connected to the second element-side wiring section, and a plurality of wirings including a first wiring that electrically connects to the one or more second light-emitting elements on the first electrode side, and a second wiring that electrically connects to the one or more second light-emitting elements on the second electrode side, wherein the first wiring is joined to the first element-side wiring section, and the second wiring is joined to the second element-side wiring section, and the first light-emitting elements and the second light-emitting elements emit light with different peak wavelengths.

[0010] The light-emitting module disclosed in the embodiment comprises the light-emitting device, the other light-emitting device, and a wiring board on which these light-emitting devices are mounted.

[0011] In at least one of the one or more inventions disclosed by the embodiments, a light-emitting device capable of reducing resistance related to conductivity can be realized. [Brief explanation of the drawing]

[0012] [Figure 1] FIG. 1 is a perspective view of a light-emitting device according to each embodiment. [Figure 2] FIG. 2 is a top view of a light-emitting device according to each embodiment. [Figure 3] FIG. 3 is a side view of a light-emitting device according to each embodiment. [Figure 4] FIG. 4 is a cross-sectional view of a light-emitting device according to each embodiment taken along the IV-IV cross-sectional line of FIG. 2. [Figure 5] FIG. 13 is a perspective view showing the configuration inside the package of the light-emitting device according to the first embodiment. [Figure 6] FIG. 16 is a top view showing the configuration inside the package of the light-emitting device according to the first embodiment. [Figure 7] FIG. 7 is a perspective view of a package according to each embodiment. [Figure 8] FIG. 8 is a top view of a package according to each embodiment. [Figure 9] FIG. 9 is a cross-sectional view of a package according to each embodiment taken along the IX-IX cross-sectional line of FIG. 8. [Figure 10] FIG. 10 is a cross-sectional view of a package according to each embodiment taken along the X-X cross-sectional line of FIG. 8. [Figure 11] FIG. 11 is a top view of a substrate according to each embodiment. [Figure 12] FIG. 12 is a bottom view of a substrate according to each embodiment. [Figure 13] FIG. 13 is a cross-sectional view of a substrate according to each embodiment taken along the XIII-XIII cross-sectional line of FIG. 11. [Figure 14A] FIG. 14A is an enlarged view obtained by enlarging FIG. 13 in the Z direction to explain the stacked structure of the substrate according to each embodiment. [Figure 14B] FIG. 14B is a top view of the first insulating member in the stacked structure of the substrate according to each embodiment. [Figure 14C] FIG. 14C is a top view of an insulating member provided under the first insulating member of FIG. 14B. [Figure 14D] FIG. 14D is a top view of an insulating member provided under the insulating member of FIG. 14C. [Figure 14E] FIG. 14E is a bottom view of the second insulating member in the laminated structure of the substrate according to each embodiment. [Figure 15] FIG. 15 is a top view of a state where a semiconductor laser element is mounted on a submount according to each embodiment. [Figure 16] FIG. 16 is a side view of a state where a semiconductor laser element is mounted on a submount according to each embodiment. [Figure 17] FIG. 17 is a top view showing the configuration inside the package of the light-emitting device according to the second embodiment. [Figure 18] FIG. 18 is a perspective view of a light-emitting module according to the third embodiment. [Figure 19] FIG. 19 is a top view of a light-emitting module according to the third embodiment.

MODE FOR CARRYING OUT THE INVENTION

[0013] In this specification or the claims, with respect to polygons such as triangles and quadrilaterals, shapes obtained by processing such as rounding, chamfering, corner rounding, and rounding at the corners of the polygon are also included and shall be referred to as polygons. Further, not limited to the corners (ends of the sides), shapes obtained by processing the middle part of the sides shall also be referred to as polygons. That is, shapes obtained by partially processing while leaving the polygon as a base are included in the interpretation of "polygon" described in this specification and the claims.

[0014] Further, not limited to polygons, the same applies to terms representing specific shapes such as trapezoids, circles, and irregularities. The same also applies when dealing with each side forming the shape. That is, even if a side has been processed at the corner or the middle part, the processed part is included in the interpretation of "side". When distinguishing a "polygon" or "side" without partial processing from the processed shape, "strict" is added, for example, described as "strict quadrilateral", etc.

[0015] Furthermore, in this specification or the claims, descriptions such as up and down (up / down), left and right, front and back, front and back (front / back), and front and back merely describe relative positions, orientations, and directions, and do not necessarily correspond to the relationships during use.

[0016] Furthermore, directions such as the X, Y, and Z directions may be indicated in the drawings using arrows. The direction of these arrows is consistent across multiple drawings representing the same embodiment. In the drawings, the direction of arrows marked X, Y, and Z is considered the positive direction, and the opposite direction is considered the negative direction. For example, the direction indicated by an X at the end of the arrow is the X direction and is also the positive direction. In this specification, the direction that is both the X direction and the positive direction will be referred to as the "positive X direction," and the opposite direction will be referred to as the "negative X direction." When referring to the "X direction," both the positive and negative directions are included. The same applies to the Y and Z directions.

[0017] Furthermore, in this specification, when an object is identified as "one or more" and described accordingly, the form in which there is one object and the form in which there are multiple objects are described together. Accordingly, the description identifying an object as "one or more" supports any of the embodiments comprising one or more objects, embodiments comprising at least one object, and embodiments comprising multiple objects.

[0018] Furthermore, in this specification, descriptions describing "one or each" of an object are a combined description of one object in an embodiment having one object, one object in an embodiment having multiple objects, and each of the multiple objects in an embodiment having multiple objects. Accordingly, descriptions describing "one or each" of an object support any of the following: in an embodiment having one object, this one object provides the description; in an embodiment having multiple objects, at least one of these objects provides the description; in an embodiment having multiple objects, each of these multiple objects provides the description; and in an embodiment having one or more objects, all objects provide the description.

[0019] Furthermore, in this specification, the terms "component" and "part" may be used when describing components, for example. "Component" refers to an object that is treated as a single physical unit. An object that is treated as a single physical unit can also be an object that is treated as a single part in the manufacturing process. On the other hand, "part" refers to an object that does not necessarily have to be treated as a single physical unit. For example, "part" is used when considering a part of one component, or when considering multiple components together as a single object.

[0020] Furthermore, the distinction between "component" and "part" as described above does not indicate an intention to consciously limit the scope of rights in the interpretation of the doctrine of equivalents. In other words, even if a component is described as a "component" in the claims, this alone does not mean that the applicant recognizes that treating this component as a physical unit is indispensable for the application of the present invention.

[0021] Furthermore, in this specification or the claims, when there are multiple components and each is to be expressed separately, the components may be distinguished by adding "1st," "2nd," etc., to their names. Also, the objects being distinguished may differ between this specification and the claims. Therefore, even if a component with the same prefix as in this specification is described in the claims, the objects identified by this component may not be the same in this specification and the claims.

[0022] For example, if there are components designated as “First,” “Second,” and “Third” in this specification to distinguish them, and these components are described in the claims as “First” and “Third” in this specification, then for readability, the components may be distinguished in the claims as “First” and “Second.” In this case, the components designated as “First” and “Second” in the claims refer to the components designated as “First” and “Third” in this specification, respectively. This rule is not limited to components, but can be applied to other subjects in a reasonable and flexible manner.

[0023] The following describes embodiments for carrying out the present invention. Furthermore, specific embodiments for carrying out the present invention will be described with reference to the drawings. However, the embodiments for carrying out the present invention are not limited to these specific embodiments. In other words, the illustrated embodiments are not the only forms in which the present invention is realized. Note that the size and positional relationships of the components shown in each drawing may be exaggerated for the sake of ease of understanding.

[0024] <First Embodiment> A light-emitting device 1 according to the first embodiment will be described. Figures 1 to 16 are drawings illustrating an exemplary form of the light-emitting device 1. Figure 1 is a perspective view of the light-emitting device 1. Figure 2 is a top view of the light-emitting device 1. Figure 3 is a side view of the light-emitting device 1 viewed from the Y direction. Figure 4 is a cross-sectional view of the light-emitting device 1 along the IV-IV section in Figure 2. Figure 5 is a perspective view showing the internal configuration of the package 10 of the light-emitting device 1. Figure 6 is a top view showing the internal configuration of the package 10 of the light-emitting device 1. Note that the wiring 60 shown in Figure 6 is omitted in Figure 5. Figure 7 is a perspective view of the package 10. Figure 8 is a top view of the package 10. Figure 9 is a cross-sectional view of the package 10 along the IX-IX section in Figure 8. Figure 10 is a cross-sectional view of the package 10 along the XX section in Figure 8. Figure 11 is a top view of the substrate 11. Figure 12 is a bottom view of the substrate 11. Figure 13 is a cross-sectional view of the substrate 11 along the XIII-XIII section in Figure 11. Figure 14A is an enlarged view of Figure 13 in the Z direction to illustrate the laminated structure LS of the substrate 11. Figure 14B is a top view of the first insulating member 11P1 in the laminated structure LS of the substrate 11. In Figure 14B, the position where the inner surface 11E of the substrate 11 is provided is indicated by a dashed line to make it easier to understand the position of the element-side wiring. Figure 14C is a top view of the insulating member 11P provided immediately below the first insulating member 11P1. Figure 14D is a top view of the insulating member 11P provided immediately below the insulating member 11P in Figure 14C. In Figure 14D, the positions where the first to fourth power supply side wiring sections 12A21 to 12A24 are provided are indicated by dashed lines to make it easier to understand the position of the power supply side wiring. Figure 14E is a bottom view of the second insulating member 11P2. Figure 15 is a top view of the state in which the light-emitting element 20 is mounted on the submount 30. In Figure 15, region R1 is indicated by a grid-like hatching. Figure 16 is a side view from the X direction showing the submount 30 with the light-emitting element 20 mounted on it.

[0025] The light-emitting device 1 comprises multiple components. These multiple components include a package 10, one or more light-emitting elements 20, one or more submounts 30, one or more reflective members 40, one or more protective elements 50, multiple wirings 60, and an optical member 70.

[0026] Furthermore, the light-emitting device 1 may have other components. For example, the light-emitting device 1 may have additional light-emitting elements in addition to the one or more light-emitting elements 20. Also, the light-emitting device 1 may not have some of the components listed here.

[0027] First, let's explain each component.

[0028] (Package 10) Package 10 comprises a base 11 and a lid 14. Package 10 is formed by joining the lid 14 to the base 11. Within package 10, an internal space is defined where other components are arranged. This internal space is a closed space surrounded by the base 11 and the lid 14. Furthermore, this internal space can be a space sealed in a vacuum or airtight state.

[0029] In a top view, the outer edge shape of package 10 is rectangular. This rectangle can have a long side and a short side. In the illustrated package 10, the direction of the long side of this rectangle is the same as the X direction, and the direction of the short side is the same as the Y direction. Note that the outer edge shape of package 10 does not have to be rectangular in a top view.

[0030] In package 10, an internal space is formed where other components are arranged. The first upper surface 11A of package 10 is part of the region that defines the internal space. In addition, each inner surface 11E and the lower surface 14B of package 10 are part of the region that defines the internal space.

[0031] The base 11 has a first upper surface 11A and a lower surface 11B. The base 11 has a second upper surface 11C. The base 11 has one or more outer surfaces 11D. The base 11 has one or more inner surfaces 11E. One or more outer surfaces 11D intersect with the second upper surface 11C. One or more outer surfaces 11D intersect with the lower surface 11B. One or more inner surfaces 11E intersect with the second upper surface 11C.

[0032] In a top view, the outer edge shape of the base 11 is rectangular. In a top view, the outer edge shape of the base 11 is the same as the outer edge shape of the package 10. In a top view, the outer edge shape of the first top surface 11A is rectangular. This rectangle can be a rectangle with a long side and a short side. The direction of the long side of the first top surface 11A is parallel to the direction of the long side of the outer edge shape of the base 11. Note that in a top view, the outer edge shape of the first top surface 11A does not have to be rectangular.

[0033] In a top view, the first top surface 11A is surrounded by the second top surface 11C. The second top surface 11C is an annular surface that surrounds the first top surface 11A in a top view. The second top surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of the second top surface 11C is called the inner frame of the second top surface 11C, and the frame defined by the outer edge of the second top surface 11C is called the outer frame of the second top surface 11C.

[0034] The base 11 has a recess surrounded by a frame formed by the second upper surface 11C. The recess defines a portion of the base 11 that is recessed below the second upper surface 11C. The first upper surface 11A is part of the recess. One or more inner surfaces 11E are part of the recess. The second upper surface 11C is located above the first upper surface 11A.

[0035] The base 11 has one or more stepped portions 11F. Each stepped portion 11F has an upper surface 11G and a side surface 11H that intersects with the upper surface 11G and extends downward from the upper surface 11G. Here, each stepped portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner side surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0036] Each of the stepped portions 11F is located inside the inner frame of the second upper surface 11C when viewed from above. Each of the stepped portions 11F is formed along part or all of the inner surface 11E when viewed from above. In the base body 11, the side surface 11H is an inner surface, but side surface 11H and inner surface 11E are different surfaces. Each of the inner surfaces 11E and each of the side surfaces 11H are perpendicular to the first upper surface 11A. Perpendicularity here allows for a difference of ±3 degrees.

[0037] One or more stepped sections 11F may include a first stepped section 11F1 and a second stepped section 11F2. The first stepped section 11F1 and the second stepped section 11F2 are provided at positions where their respective side surfaces 11H face each other. The first stepped section 11F1 and the second stepped section 11F2 are provided on the short side of the inner frame of the second upper surface 11C.

[0038] The base 11 has a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N may be made of different materials. The base 11 may be composed of a base member corresponding to the base portion 11M and a frame member corresponding to the frame portion 11N.

[0039] The base portion 11M includes a first upper surface 11A. The frame portion 11N includes a second upper surface 11C. The frame portion 11N includes one or more outer surfaces 11D and one or more inner surfaces 11E. The frame portion 11N includes one or more stepped portions 11F.

[0040] The lower surface of the base portion 11M constitutes part or all of the area of ​​the lower surface 11B of the base body 11. If the lower surface of the base portion 11M constitutes part of the area of ​​the lower surface 11B of the base body 11, the lower surface of the frame portion 11N constitutes the remaining area of ​​the lower surface 11B of the base body.

[0041] The base body 11 has a plurality of wiring sections 12A. The plurality of wiring sections 12A include one or more first wiring sections 12A1 and one or more second wiring sections 12A2. One or more first wiring sections 12A1 are arranged in the internal space of the package 10. One or more second wiring sections 12A2 are provided on the outer surface of the package 10.

[0042] One or each of the first wiring sections 12A1 is provided on the upper surface 11G of the stepped section 11F. The base body 11 has one or more first wiring sections 12A1 provided on the upper surface 11G of the first stepped section 11F1. The base body 11 has one or more first wiring sections 12A1 provided on the upper surface 11G of the second stepped section 11F2.

[0043] One or each of the second wiring sections 12A2 is provided on the lower surface 11B of the package 10. One or each of the second wiring sections 12A2 is provided on the lower surface of the frame section 11N. The second wiring section 12A2 may be provided on an outer surface different from the lower surface 11B of the package 10.

[0044] When viewed from above, the base body 11 is divided into two regions by a virtual line passing through the side surface 11H of the first stepped portion 11F1 and parallel to this side surface 11H. In the region that includes the upper surface 11G of the first stepped portion 11F1, the base body 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base body 11.

[0045] When viewed from above, the base body 11 is divided into two regions by a virtual line passing through the side surface 11H of the second stepped portion 11F2 and parallel to this side surface 11H. In the region that includes the upper surface 11G of the second stepped portion 11F2, the base body 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base body 11.

[0046] In the base 11, one or each of the first wiring sections 12A1 are electrically connected to a second wiring section 12A2. One or more first wiring sections 12A1 are electrically connected to different second wiring sections 12A2.

[0047] The base body 11 has a laminated structure LS in which a plurality of insulating members 11P are stacked. The frame portion 11N of the base body 11 may have the laminated structure LS. A plurality of via wirings 11Q are provided in the laminated structure LS. The first wiring portion 12A1 and the second wiring portion 12A2 are provided on the surface of the laminated structure LS. The first wiring portion 12A1 and the second wiring portion 12A2 are electrically connected via the via wirings 11Q.

[0048] The via wiring 11Q has a via portion 11R that penetrates the insulating member 11P in the stacking direction, and a wiring layer 11S connected to the via portion 11R. The wiring layer 11S is provided between the two insulating members 11P. The wiring layer 11S extends in the planar direction of the insulating member 11P, which is perpendicular to the stacking direction.

[0049] The multiple insulating members 11P include a first insulating member 11P1 on which a first wiring portion 12A1 is provided, and a second insulating member 11P2 on which a second wiring portion 12A2 is provided. The first wiring portion 12A1 is provided on the upper side of the first insulating member 11P1. The second wiring portion 12A2 is provided on the lower side of the second insulating member 11P2.

[0050] The base body 11 has a joining pattern 13A. The joining pattern 13A is provided on the second upper surface 11C. The joining pattern 13A is provided in an annular shape. The joining pattern 13A is provided in a rectangular annular shape. In a top view, the first upper surface 11A is surrounded by the joining pattern 13A.

[0051] The substrate 11 can be formed, for example, using ceramic as the main material. Examples of ceramics that can be used as the main material for the substrate 11 include aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide.

[0052] Here, the main material refers to the material that accounts for the largest proportion in mass or volume of the object being considered. Furthermore, if the object is formed from a single material, that material is the main material. In other words, for a material to be the main material includes the possibility of that material accounting for 100% of the total.

[0053] The base body 11 may be formed using a base member and a frame member formed using different main materials. The base member can be formed using, for example, a metal or a composite containing a metal, graphite, diamond, or other material with excellent heat dissipation properties as the main material. Examples of metals that can be used as the main material of the base member include copper, aluminum, or iron. Examples of composites containing a metal that can be used as the main material of the base member include copper molybdenum or copper tungsten. The frame member can be formed using, for example, a ceramic as the main material, as mentioned above as the main material of the base body 11.

[0054] The wiring section 12A can be formed, for example, using a metal material as the main material. Examples of the metal material that serves as the main material for the wiring section 12A include elemental metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, or alloys containing these metals. The wiring section 12A can be composed of, for example, one or more metal layers.

[0055] The bonding pattern 13A can be formed, for example, using a metallic material as the main material. Examples of metallic materials that can be used as the main material for the bonding pattern 13A include elemental metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, or alloys containing these metals. The bonding pattern 13A can be composed of, for example, one or more metallic layers.

[0056] The lid 14 has an upper surface 14A and a lower surface 14B. The lid 14 also has one or more side surfaces 14C. The lid 14 is constructed in the shape of a rectangular parallelepiped. However, the shape of the lid 14 does not have to be a rectangular parallelepiped.

[0057] The lid 14 is joined to the base 11. The lower surface 14B of the lid 14 is joined to the second upper surface 11C of the base 11. The lid 14 is joined to the joining pattern 13A of the base 11. The lid 14 is joined to the base 11 via adhesive.

[0058] The lid 14 is translucent, meaning it transmits light. Here, translucency means that the transmittance of light incident on the lid 14 is 80% or more. The lid 14 may also have a non-translucent region (a region that does not transmit light) in part.

[0059] The lid 14 can be formed, for example, using glass as the main material. The lid 14 can also be formed, for example, using sapphire as the main material.

[0060] (Light-emitting element 20) The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and a plurality of side surfaces 21C. The shape of the upper surface 21A is rectangular. This rectangle has a long side and a short side. The external shape of the light-emitting element 20 when viewed from above is rectangular. This rectangle has a long side and a short side. However, the shape of the upper surface 21A and the external shape of the light-emitting element 20 when viewed from above are not limited to these.

[0061] The light-emitting element 20 has a light-emitting surface 22 that emits light. For example, a side surface 21C can be the light-emitting surface 22. The side surface 21C that becomes the light-emitting surface 22 intersects with the short side of the top surface 21A. Alternatively, for example, the top surface 21A can be the light-emitting surface 22. The light-emitting element 20 has one or more light-emitting surfaces 22.

[0062] The light-emitting element 20 has a first electrode and a second electrode. These two electrodes can be provided on two surfaces that are opposite to each other, for example. For example, one electrode may be provided on the upper surface 21A and the other electrode on the lower surface 21B. Alternatively, the two electrodes may be provided on a single surface. The two electrodes are the anode electrode and the cathode electrode.

[0063] For example, the light-emitting element 20 may be a light-emitting element that emits red light. Alternatively, the light-emitting element 20 may be a light-emitting element that emits green light. Alternatively, the light-emitting element 20 may be a light-emitting element that emits blue light. In addition, the light-emitting element 20 may be a light-emitting element that emits light of other colors or wavelengths.

[0064] Here, blue light is defined as light whose emission peak wavelength is in the range of 420 nm to 494 nm. Green light is defined as light whose emission peak wavelength is in the range of 495 nm to 570 nm. Red light is defined as light whose emission peak wavelength is in the range of 605 nm to 750 nm.

[0065] Examples of light-emitting elements 20 that emit blue light or green light include light-emitting elements containing nitride semiconductors. Examples of nitride semiconductors include GaN-based semiconductors such as GaN, InGaN, and AlGaN. Examples of light-emitting elements 20 that emit red light include light-emitting elements containing InAlGaP-based, GaInP-based, and GaAs-based semiconductors such as GaAs and AlGaAs.

[0066] The light-emitting element 20 can be, for example, a semiconductor laser element. Furthermore, the light-emitting element 20 can be a single-emitter semiconductor laser element consisting of one emitter. Alternatively, the light-emitting element 20 can be a multi-emitter semiconductor laser element consisting of multiple emitters. Note that the light-emitting element 20 is not limited to a semiconductor laser element; it may also be a light-emitting diode or the like.

[0067] Here, we will describe a semiconductor laser element, which is an example of a light-emitting element 20.

[0068] A semiconductor laser element emits directional laser light. Divergent light with a broad spread is emitted from the light-emitting surface 22 of the semiconductor laser element. The light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light-emitting surface 22. FFP is the shape and light intensity distribution of the emitted light at a position away from the light-emitting surface of the semiconductor laser element.

[0069] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the FFP's light intensity distribution, is referred to as light traveling along the optical axis, or light passing through the optical axis. Furthermore, in the FFP's light intensity distribution, 1 / e is applied to the peak intensity value. 2 Light with the above intensity will be referred to as the main part of the light.

[0070] The shape of the FFP (Fiber Focused Plane) of the light emitted from the semiconductor laser element is an ellipse, with the stacking direction being longer than the direction perpendicular to the stacking direction, in a plane parallel to the light emission surface 22. The stacking direction refers to the direction in which multiple semiconductor layers, including the active layer, are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the plane direction of the semiconductor layer. Furthermore, the major axis direction of the elliptical shape of the FFP can be called the speed axis direction of the semiconductor laser element, and the minor axis direction can be called the slow axis direction of the semiconductor laser element.

[0071] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2 The angle at which light of a certain intensity spreads is defined as the divergence angle of the semiconductor laser element. Here, the divergence angle is calculated by dividing the light of peak intensity (light passing through the optical axis) by 1 / e of the peak intensity. 2 The angle of light divergence is expressed as the angle formed by light of intensity 1 / e of the peak light intensity. 2 In addition to the light intensity, it can also be determined from, for example, the light intensity at half the peak light intensity. In this specification, when we simply refer to the "angle of light divergence," we mean 1 / e of the peak light intensity. 2 This refers to the angle of light divergence at a given light intensity.

[0072] The divergence angle in the speed axis direction of light emitted from a semiconductor laser element can be between 20 degrees and less than 80 degrees. Furthermore, the divergence angle in the slow axis direction can be greater than 0 degrees and less than or equal to 30 degrees. Additionally, the divergence angle in the speed axis direction is greater than the divergence angle in the slow axis direction.

[0073] For example, the divergence angle in the fast axis direction of blue light emitted from a semiconductor laser element may be 30 degrees or more and less than 60 degrees, while the divergence angle in the slow axis direction may be 5 degrees or more and less than 15 degrees. Also, for example, the divergence angle in the fast axis direction of green light emitted from a semiconductor laser element may be 30 degrees or more and less than 60 degrees, while the divergence angle in the slow axis direction may be greater than 0 degrees and less than 30 degrees. Also, for example, the divergence angle in the fast axis direction of red light emitted from a semiconductor laser element may be 40 degrees or more and less than 80 degrees, while the divergence angle in the slow axis direction may be 5 degrees or more and less than 20 degrees.

[0074] (Submount 30) The submount 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be considered the mounting surface on which other components are mounted. The shape of the upper surface 31A is rectangular. This rectangle of the upper surface 31A may have a short side and a long side. However, the shape of the upper surface 31A does not have to be rectangular.

[0075] The external shape of the submount 30 in a top view is rectangular. This rectangle of the submount 30 may have a short side and a long side. However, the external shape of the submount 30 in a top view does not have to be rectangular. In a top view, the submount 30 may have an external shape in which the length in one direction (hereinafter referred to as the short side direction of the submount 30) is smaller than the length in the direction perpendicular to it (hereinafter referred to as the long side direction of the submount 30). In the illustrated submount 30, the short side direction is the same direction as the X direction, and the long side direction is the same direction as the Y direction.

[0076] The submount 30 may be composed of a substrate 32A and an upper metal member 32B. The submount 30 may also be composed of a lower metal member 32C. The upper metal member 32B is provided on the upper side of the substrate 32A. The lower metal member 32C is provided on the lower side of the substrate 32A. The submount 30 may also have a wiring layer 33. The wiring layer 33 is provided on top of the upper metal member 32B.

[0077] The substrate 32A is insulating. The substrate 32A is formed from, for example, silicon nitride, aluminum nitride, or silicon carbide. For the main material of the substrate 32A, it is preferable to select a ceramic with relatively good heat dissipation (high thermal conductivity).

[0078] The main material of the upper metal member 32B is a metal such as copper or aluminum. The upper metal member 32B has one or more metal layers. The upper metal member 32B may have multiple metal layers, each primarily made of a different metal.

[0079] The main material of the lower metal member 32C is a metal such as copper or aluminum. The lower metal member 32C has one or more metal layers. The lower metal member 32C may have multiple metal layers, each primarily made of a different metal.

[0080] The wiring layer 33 can be formed using metal. For example, the wiring layer 33 can be formed using AuSn solder (a metal layer of AuSn).

[0081] For example, the length of the submount 30 in the short side direction is 700 μm or more and 900 μm or less. Also, the length of the submount 30 in the long side direction is 2000 μm or more and 2200 μm or less. Furthermore, the difference between the length in the long side direction and the length in the short side direction of the submount 30 is 1200 μm or more and 1600 μm or less.

[0082] For example, the thickness of the submount 30 (width in the direction perpendicular to the top surface 31A) is 250 μm or more and 350 μm or less. Also, for example, the thickness of the substrate 32A is 150 μm or more and 250 μm or less. Also, for example, the thickness of the upper metal member 32B is 30 μm or more and 80 μm or less. Also, for example, the thickness of the lower metal member 32C is 30 μm or more and 80 μm or less. Also, for example, the thickness of the wiring layer 33 is 1.5 μm or more and 3.5 μm or less.

[0083] (Reflective member 40) The reflective member 40 has a lower surface 41A and a light-reflecting surface 41B that reflects light. The light-reflecting surface 41B is inclined with respect to the lower surface 41A. The straight line connecting the lower end and upper end of the light-reflecting surface 41B is inclined with respect to the lower surface 41A. The angle at which the light-reflecting surface 41B is inclined with respect to the lower surface 41A is called the inclination angle of the light-reflecting surface 41B.

[0084] The light-reflecting surface 41B is flat. However, the light-reflecting surface 41B may be curved. The inclination angle of the light-reflecting surface 41B is 45 degrees. However, the inclination angle of the light-reflecting surface 41B does not have to be 45 degrees.

[0085] The main material of the reflective member 40 can be glass or metal. It is preferable to use a heat-resistant material as the main material of the reflective member 40. For example, the main material can be glass such as quartz or BK7 (borosilicate glass), or metal such as Al. The reflective member 40 can also be formed using Si as the main material.

[0086] If the main material is a reflective material such as Al, the light-reflecting surface 41B can be formed from the main material. Alternatively, instead of forming the light-reflecting surface 41B with the main material, the general shape of the reflective member 40 may be formed with the main material, and the light-reflecting surface 41B may be formed on the surface of the general shape. In this case, the light-reflecting surface 41B can be formed using, for example, a metal layer such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0087] The light-reflecting surface 41B has a reflectance of 90% or more with respect to the peak wavelength of light irradiated onto it. This reflectance may also be 95% or more. Furthermore, this reflectance may be 99% or more. The light reflectance is 100% or less, or less than 100%.

[0088] (Protection element 50) The protective element 50 has a top surface, a bottom surface, and one or more sides. The shape of the protective element 50 is a rectangular parallelepiped. However, the shape of the protective element 50 does not have to be a rectangular parallelepiped.

[0089] The protective element 50 is designed to prevent excessive current from flowing through a specific element (such as a semiconductor laser element) and causing it to be damaged. An example of the protective element 50 is a Zener diode. Furthermore, a Zener diode made of silicon can be used.

[0090] (Wiring 60) The wiring 60 is a linear conductive material with joints at both ends. The joints at both ends become connection points with other components. The wiring 60 is used for electrical connection between two components. The wiring 60 is, for example, a metal wire. The metal can be, for example, gold, aluminum, silver, copper, etc.

[0091] (Optical component 70) The optical member 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical component 70 exerts an optical effect on the light incident upon it. Examples of optical effects exerted on light by the optical component 70 include focusing, collimation, diffusion, polarization, diffraction, multiplexing, light guidance, reflection, and wavelength conversion.

[0092] The optical member 70 has an optical surface that provides an optical effect. The upper surface 71A, the lower surface 71B, or the side surface 71C can be the optical surface. Alternatively, the optical surface may be located at a position different from the upper surface 71A, the lower surface 71B, and the side surface 71C. For example, the optical surface may be formed inside the optical member 70 rather than on its surface.

[0093] The optical component 70 may have one or more lens surfaces 71D. The lens surface 71D is the optical working surface of the optical component 70. The optical component 70 having a lens surface 71D may also be called a lens component. Light that passes through the lens surface 71D and is emitted from the optical component 70 is subjected to optical effects such as focusing, diffusion, or collimation by the optical component 70. For example, the optical component 70 is a collimating lens that emits collimated light after light incident on the optical component 70.

[0094] One or each lens surface 71D is located on the upper surface 71A side. Alternatively, the lens surface 71D may be located on the lower surface 71B side. The upper surface 71A and the lower surface 71B are flat. One or each lens surface 71D intersects with the upper surface 71A. In a top view, one or each lens surface 71D is surrounded by the upper surface 71A.

[0095] In a top view, the outer shape of the optical element 70 is rectangular. However, the outer shape of the optical element 70 in a top view does not have to be rectangular. The bottom surface 71B is flat. No lens surface 71D is formed on the bottom surface 71B side of the optical element 70. The shape of the bottom surface 71B is rectangular. However, the shape of the bottom surface 71B does not have to be rectangular.

[0096] In the optical member 70, the portion that overlaps with the lens surface 71D when viewed from above is defined as the lens portion 72A. In the optical member 70, the portion that overlaps with the upper surface 71A when viewed from above is defined as the non-lens portion 72B. The lower surface 71B has a region that constitutes the lower surface of one or each of the lens portions 72A and a region that constitutes the lower surface of the non-lens portion 72B.

[0097] The optical member 70 may have a plurality of lens surfaces 71D formed in a continuous line in one direction. In a top view, the direction in which the plurality of lens surfaces 71D are aligned is called the lens connection direction. In the illustrated optical member 70, the connection direction is the same direction as the X direction.

[0098] The multiple lens surfaces 71D are formed such that the vertices of each lens surface 71D lie on a straight line. This imaginary line connecting the vertices is parallel to the lower surface 71B of the optical member 70. Note that this parallelism includes a difference of ±5 degrees.

[0099] Some or all of the multiple lens surfaces 71D may have the same curvature, and two or more of these lens surfaces 71D may have the same curvature. All of the multiple lens surfaces 71D may have the same curvature.

[0100] The optical component 70 is translucent. The optical component 70 has a transmittance of 80% or more for the peak wavelength of light incident on it. The optical component 70 may have a translucent region and a non-translucent region (hereinafter referred to as the non-translucent region). In the non-translucent region, the transmittance for the peak wavelength of light incident on the optical component 70 is 50% or less. The optical component 70 can be formed using glass such as BK7, for example.

[0101] Next, the light-emitting device 1 will be described.

[0102] (Light-emitting device 1) In the light-emitting device 1, one or more light-emitting elements 20 are arranged in the internal space of the package 10. The one or more light-emitting elements 20 are arranged on the substrate 11. The one or more light-emitting elements 20 are positioned on the first upper surface 11A. The light-emitting elements 20 emit light from the light-emitting surface 22 in a first direction. In the illustrated light-emitting device 1, the first direction is the same direction as the Y direction.

[0103] One or more light-emitting elements 20 can consist of multiple light-emitting elements 20 that emit light of the same color. Alternatively, one or more light-emitting elements 20 can consist of multiple light-emitting elements 20, including a first light-emitting element and a second light-emitting element that emit light of different colors from each other.

[0104] Multiple light-emitting elements 20 are arranged in a line in one direction. When viewed from above, multiple light-emitting elements 20 are arranged in a line in a second direction perpendicular to the first direction. All of the multiple light-emitting elements 20 emit light in the same direction. In the illustrated light-emitting device 1, multiple light-emitting elements 20, consisting of at least five light-emitting elements 20, are arranged in a line in one direction. The second direction is the same direction as the positive X direction.

[0105] One or more light-emitting elements 20 are arranged on one or more submounts 30. One or more light-emitting elements 20 are arranged on the first upper surface 11A via one or more submounts 30. One or more light-emitting elements 20 are arranged on one submount 30. One or each light-emitting element 20 is arranged on the wiring layer 33 of the submount 30.

[0106] One electrode of one or each of the light-emitting elements 20 is joined to the wiring layer 33. One or each of the submounts 30 is electrically connected to the light-emitting elements 20 on one electrode side. For example, one electrode is the anode and the other electrode is the cathode. Note that "one electrode side" means that one electrode is closer than the other electrode. Similarly, "the other electrode side" means that the other electrode is closer than the one electrode.

[0107] In the light-emitting device 1, a plurality of wires 60 are provided to electrically connect one or more light-emitting elements 20 to the package 10. The plurality of wires 60 include one or more wires 60 that electrically connect to a given light-emitting element 20 on the first electrode side, and one or more wires 60 that electrically connect to a given light-emitting element 20 on the second electrode side. In relation to a given light-emitting element 20, the wires 60 that electrically connect to one or more light-emitting elements 20 are either wires 60 that electrically connect to the light-emitting element 20 on the first electrode side, or wires 60 that electrically connect to the light-emitting element 20 on the second electrode side.

[0108] The multiple wirings 60 include one or more wirings 60 that are electrically connected to the light-emitting element 20 and joined to the first wiring section 12A1. This electrically connects the light-emitting element 20 to the first wiring section 12A1 and the second wiring section 12A2. Furthermore, the light-emitting element 20 can receive power from an external power source via the wiring section 12A.

[0109] In the light-emitting device 1, the first wiring section 12A1 can be called the element-side wiring section, and the second wiring section 12A2 can be called the power supply-side wiring section. In the current path, of the first wiring section 12A1 and the second wiring section 12A2, the one closer to the light-emitting element 20 is the element-side wiring section, and the one closer to the external power supply is the power supply-side wiring section.

[0110] The multiple wirings 60 include a first wiring 60A and a second wiring 60B, which are electrically connected to the light-emitting element 20 on the first electrode side. The first wiring 60A and the second wiring 60B are electrically connected to the multiple light-emitting elements 20. The first wiring 60A is joined to the first element-side wiring section 12A11, and the second wiring 60B is joined to the second element-side wiring section 12A12. The first element-side wiring section 12A11 and the second element-side wiring section 12A12 are element-side wiring sections that are spaced apart from each other. In this way, by joining the two wirings 60 that are electrically connected to the light-emitting element 20 on the first electrode side to different wiring sections 12A, the current path on the first electrode side in the substrate 11 can be divided into two, and the resistance when the substrate 11 is conducted can be reduced.

[0111] The first element-side wiring section 12A11 is electrically connected to the first power supply-side wiring section 12A21. The second element-side wiring section 12A12 is electrically connected to the second power supply-side wiring section 12A22. The first power supply-side wiring section 12A21 and the second power supply-side wiring section 12A22 are power supply-side wiring sections that are spaced apart from each other.

[0112] The first element-side wiring section 12A11 and the second element-side wiring section 12A12 are not electrically connected to each other in the base 11. The first power supply-side wiring section 12A21 and the second power supply-side wiring section 12A22 are not electrically connected to each other in the base 11. As a result, the two divided current paths do not merge midway in the base 11, and complete separation of the current paths in the base 11 is achieved.

[0113] The multiple wirings 60 include a third wiring 60C that is electrically connected to the light-emitting element 20 on the second electrode side. The third wiring 60C is electrically connected to the multiple light-emitting elements 20. The third wiring 60C is also joined to the third element side wiring section 12A13. The third element side wiring section 12A13 is electrically connected to the third power supply side wiring section 12A23.

[0114] In the substrate 11, the resistance [Ω] from the first element-side wiring section 12A11 to the first power supply-side wiring section 12A21 is greater than the resistance [Ω] from the third element-side wiring section 12A13 to the third power supply-side wiring section 12A23. In this case, it is more effective to reduce resistance by interrupting the current path related to the first element-side wiring section 12A11 than by interrupting the current path related to the third element-side wiring section 12A13.

[0115] In the substrate 11, the number of current paths electrically connected to the light-emitting element 20 on the first electrode side is greater than the number of current paths electrically connected to the light-emitting element 20 on the second electrode side. Increasing the number of current paths complicates the wiring structure in the substrate 11 and may also increase the number of wires 60 used. Therefore, it is desirable to adjust the number of current path divisions to obtain an efficient resistive effect, taking these factors into consideration. In the illustrated light-emitting device 1, there is only one element-side wiring section 12A1 electrically connected to the light-emitting element 20 on the second electrode side in the substrate 11, and the current path is not divided into multiple sections.

[0116] The first element-side wiring section 12A11 is provided at a position a second away from one or more light-emitting elements 20. The first element-side wiring section 12A11 is provided on the first outer surface 11D1 side of the multiple outer surfaces 11D of the base body 11. The first power supply-side wiring section 12A21 is provided on the second outer surface 11D2 side of the multiple outer surfaces 11D of the base body 11. The second outer surface 11D2 is the outer surface 11D on the opposite side of the first outer surface 11D1.

[0117] The second element-side wiring section 12A12 is provided at a position a second away from one or more light-emitting elements 20. The second element-side wiring section 12A12 is provided on the first outer surface 11D1 side. The second power supply-side wiring section 12A22 is provided on the second outer surface 11D2 side.

[0118] The third element-side wiring section 12A13 is located at a position away from one or more light-emitting elements 20 in the direction opposite to the second direction. The third element-side wiring section 12A13 is located on the second outer surface 11D2 side. The third power supply-side wiring section 12A23 is located on the second outer surface 11D2 side. In a top view, one or more light-emitting elements 20 are arranged between the first element-side wiring section 12A11 and the third element-side wiring section 12A13.

[0119] By providing the first element-side wiring section 12A11 and the second element-side wiring section 12A12 on the same outer surface 11D, the connection of the first wiring 60A and the second wiring 60B becomes easier, and the two current paths in the base 11 become easier to utilize.

[0120] The first element-side wiring section 12A11 and the third element-side wiring section 12A13 are provided on opposite outer surfaces 11D, which facilitates the connection of multiple wirings 60 that connect multiple light-emitting elements 20 in series. In the illustrated light-emitting device 1, multiple light-emitting elements 20 are connected in series.

[0121] By providing the first power supply side wiring section 12A21 and the third power supply side wiring section 12A23 on the same outer surface 11D, multiple power supply side wiring sections 12A2 can be arranged in a consolidated manner. Alternatively, in the base 11, the resistance value [Ω] from the first element side wiring section 12A11 to the first power supply side wiring section 12A21 may be more than twice the resistance value [Ω] from the third element side wiring section 12A13 to the third power supply side wiring section 12A23.

[0122] By providing the first power supply side wiring section 12A21 and the second power supply side wiring section 12A22 on the same outer surface 11D, it becomes easier to connect the first power supply side wiring section 12A21 and the second power supply side wiring section 12A22 to the same electrode. For example, it becomes easier to connect these power supply side wiring sections together to a single electrode section, resulting in a light-emitting device 1 with easy wiring connections.

[0123] Multiple power supply side wiring sections, including a first power supply side wiring section 12A21, a second power supply side wiring section 12A22, and a third power supply side wiring section 12A23, are arranged in a line in one direction. The second power supply side wiring section 12A22 is provided next to the first power supply side wiring section 12A21. By providing the first power supply side wiring section 12A21 and the second power supply side wiring section 12A22 next to each other, these power supply side wiring sections can be easily connected together to a single electrode section, resulting in a light-emitting device 1 with easy wiring connections.

[0124] Dividing the current path on at least one electrode side of the substrate 11 into multiple paths can be more effective for semiconductor laser elements emitting red light than for semiconductor laser elements emitting blue or green light. If the resistance of the substrate 11 is high, the heat generated in the substrate 11 will increase, reducing the heat dissipation performance of the substrate 11. Therefore, reducing resistance by dividing the current path is more effective for red semiconductor laser elements, which have relatively worse temperature characteristics than semiconductor laser elements emitting blue or green light.

[0125] The multiple wirings 60 include one or more first wirings 60A, one or more second wirings 60B, and multiple third wirings 60C. In the light-emitting device 1, the number of third wirings 60C connected to the third element side wiring section 12A13 is greater than the number of first wirings 60A connected to the first element side wiring section 12A11. The number of third wirings 60C connected to the third element side wiring section 12A13 is greater than the number of second wirings 60B connected to the second element side wiring section 12A12.

[0126] The sum of the number of first wires 60A connected to the first element-side wiring section 12A11 and the number of second wires 60B connected to the second element-side wiring section 12A12 is greater than or equal to the number of third wires 60C connected to the third element-side wiring section 12A13. In this way, it is preferable to adjust the number of wires 60 connected to each element-side wiring section according to the division of the current path.

[0127] One or more first wires 60A and one or more second wires 60B are joined to a submount 30. One or more third wires 60C are joined to a light-emitting element 20. The submount 30 to which the first wires 60A are joined and the submount 30 on which the light-emitting element 20 to which the third wires 60C are joined are different. This submount 30 accommodates a light-emitting element 20 located at the end of a plurality of light-emitting elements 20 arranged in a second direction, on the side of the second direction. This light-emitting element 20 is located at the end of a plurality of light-emitting elements 20 arranged in a second direction, on the side of the direction opposite to the second direction.

[0128] In a top view, one or each of the first wirings 60A is located between a first virtual plane containing the light-emitting surface 22 of the light-emitting element 20 and a second virtual plane containing the side surface 21C of the light-emitting element 20 opposite to the light-emitting surface 22. The light-emitting element 20 is a light-emitting element 20 that is positioned on a submount 30 to which the first wirings 60A are joined.

[0129] In a top view, one or each of the second wirings 60B are positioned in the region that does not include the light-emitting element 20, which is divided into two regions by the second virtual plane. This light-emitting element 20 is a light-emitting element 20 that is positioned on the submount 30 to which the second wirings 60B are joined.

[0130] The first element-side wiring section 12A11 and the first power supply-side wiring section 12A21 are electrically connected via the first via wiring 11Q1. The second element-side wiring section 12A12 and the second power supply-side wiring section 12A22 are electrically connected via the second via wiring 11Q2. The third element-side wiring section 12A13 and the third power supply-side wiring section 12A23 are electrically connected via the third via wiring 11Q3. The first via wiring 11Q1, the second via wiring 11Q2, and the third via wiring 11Q3 are all via wiring 11Q.

[0131] The first via wiring 11Q1 has a first via section 11R1 and a first wiring layer 11S1. The second via wiring 11Q2 has a second via section 11R2 and a second wiring layer 11S2. The third via wiring 11Q3 has a third via section 11R3 and a third wiring layer 11S3. The first via section 11R1, the second via section 11R2, and the third via section 11R3 are all via sections 11R. The first wiring layer 11S1, the second wiring layer 11S2, and the third wiring layer 11S3 are all wiring layers 11S.

[0132] In the substrate 11, the first via wiring 11Q1 and the second via wiring 11Q2 are not electrically connected. Also, in the substrate 11, the first via wiring 11Q1, the second via wiring 11Q2, and the third via wiring 11Q3 are not electrically connected to each other.

[0133] The first via wiring 11Q1 is connected to the first power supply side wiring section 12A21. The first via wiring 11Q1 may also be connected to a fourth power supply side wiring section. The fourth power supply side wiring section may be provided on the outer surface 11D side (first outer surface 11D1 side) opposite to the first power supply side wiring section 12A21. This allows selection of which power supply side wiring section on which outer surface 11D side is provided to be used for electrical connection with an external power supply.

[0134] The second via wiring 11Q2 is connected to the second power supply side wiring section 12A22. The second via wiring 11Q2 may also be connected to the fifth power supply side wiring section. The fifth power supply side wiring section may be provided on the outer side 11D side (first outer side 11D1 side) opposite to the second power supply side wiring section 12A22. The third via wiring 11Q3 is connected to the third power supply side wiring section 12A23. The third via wiring 11Q3 may also be connected to the sixth power supply side wiring section. The sixth power supply side wiring section may be provided on the outer side 11D side (first outer side 11D1 side) opposite to the third power supply side wiring section 12A23.

[0135] The base 11 may further have a fourth element-side wiring section 12A14 provided on the second outer surface 11D2 side as an element-side wiring section. It may also have a seventh power supply-side wiring section provided on the first outer surface 11D1 side, electrically connected to the fourth element-side wiring section 12A14 as a power supply-side wiring section. As a result, the third element-side wiring section 12A13 and the fourth element-side wiring section can be used as the first wiring section 12A1 that separates the current path, instead of the first element-side wiring section 12A11 and the second element-side wiring section 12A12.

[0136] In the illustrated light-emitting device 1, there are wires 60 connected to the first element side wiring section 12A11 (first wire 60A), wires 60 connected to the second element side wiring section 12A12 (second wire 60B), and wires 60 connected to the third element side wiring section 12A13 (third wire 60C), but there is no wire 60 connected to the fourth element side wiring section 12A14.

[0137] In the light-emitting device 1, one or more reflective members 40 are arranged in the internal space of the package 10. One or more reflective members 40 are arranged on the base 11. One or more reflective members 40 are arranged on the first upper surface 11A. One or more reflective members 40 are positioned at a distance in a first direction from one or more light-emitting elements 20. One or more reflective members 40 reflect the light emitted from one or more light-emitting elements 20. The light reflected by one or more reflective members 40 is emitted upward from the upper surface 14A of the package 10.

[0138] In the light-emitting device 1, one or more protective elements 50 are arranged in the internal space of the package 10. The one or more protective elements 50 are arranged in the first wiring section 12A1 of the package 10. The one or more protective elements 50 protect one or more light-emitting elements 20.

[0139] One or more protective elements 50 include at least one protective element 50 located on the second stepped portion 11F2. One or more protective elements 50 include at least one protective element 50 that is electrically connected to the fifth element side wiring portion 12A15 located on the second outer surface 11D2 side. This protective element 50 is located on the fifth element side wiring portion 12A15. This protective element 50 is also located on the third element side wiring portion 12A13.

[0140] In the base 11, the fifth element side wiring section 12A15 is electrically connected to the second power supply side wiring section 12A22. In the base 11, the fifth element side wiring section 12A15 is electrically connected to the second power supply side wiring section 12A22 together with the second element side wiring section 12A12. In other words, in the base 11, the fifth element side wiring section 12A15 is electrically connected to the second element side wiring section 12A12.

[0141] In the light-emitting device 1, the optical element 70 is positioned above the package 10. The optical element 70 is fixed to the package 10. The optical element 70 is joined to the lid 14 via adhesive.

[0142] The optical element 70 is positioned closer to the outer surface 11D on the side opposite to the first direction of the package 10 than the outer surface 11D on the side opposite to the first direction. In a top view, with respect to the first direction, the distance from the outer surface 11D on the side opposite to the first direction of the package 10 to the optical element 70 is greater than the distance from the optical element 70 to the outer surface 11D on the side opposite to the first direction of the package 10.

[0143] The position where the second wiring 60B connects to the second element-side wiring section 12A12 does not overlap with the optical member 70 when viewed from above. Since the cover 14 is translucent, by designing the light-emitting device 1 to connect the second wiring 60B at this position, it is possible to visually confirm whether the second wiring 60B is connected and the state of the connection when the light-emitting device 1 is manufactured. However, even if the second wiring 60B is not connected, a current path is formed by the first wiring 60A, so it may not be possible to determine whether the second wiring 60B is connected or not by checking the continuity of the light-emitting element 20. In such cases, the convenience of being able to visually confirm the connection of the second wiring 60B is improved.

[0144] The second element-side wiring section 12A12 is located at a position further away in the third direction than the first element-side wiring section 12A11. The submount 30 to which the second wiring 60B is joined has a region R1 that extends in the third direction from the light-emitting element 20 when viewed from above (see Figure 15). Region R1 has a width of at least 200 μm in the third direction. This allows the second wiring 60B to be easily joined to region R1. If this width is 400 μm or more, multiple second wirings 60B can be easily joined to region R1.

[0145] The second wiring 60B is joined within region R1 of the submount 30. This allows the length of the second wiring 60B to be shortened and the wiring resistance of the second wiring 60B to be reduced.

[0146] Light emitted from package 10 enters the optical element 70. The light irradiates the optical surface 71D of the optical element 70, causing an optical effect, and is then emitted from the optical element 70. The light emitted from the optical element 70 becomes the light emitted from the light-emitting device 1. For example, light collimated by the lens surface 71D is emitted from the light-emitting device 1.

[0147] <Second Embodiment> A light-emitting device 2 according to the second embodiment will now be described. Figures 1 to 4, Figures 7 to 14E, and Figure 17 are drawings illustrating an exemplary embodiment of the light-emitting device 2. Figure 1 is a perspective view of the light-emitting device 2. Figure 2 is a top view of the light-emitting device 2. Figure 3 is a side view of the light-emitting device 2 viewed from the Y direction. Figure 4 is a cross-sectional view of the light-emitting device 2 along the IV-IV section in Figure 2. Figure 7 is a perspective view of the package 10. Figure 8 is a top view of the package 10. Figure 9 is a cross-sectional view of the package 10 along the IX-IX section in Figure 8. Figure 10 is a cross-sectional view of the package 10 along the XX section in Figure 8. Figure 11 is a top view of the substrate 11. Figure 12 is a bottom view of the substrate 11. Figure 13 is a cross-sectional view of the substrate 11 along the XIII-XIII section in Figure 11. Figure 14A is an enlarged view of Figure 13 in the Z direction to illustrate the laminated structure LS of the substrate 11. Figure 14B is a top view of the first insulating member 11P1 in the laminated structure LS of the substrate 11. In Figure 14B, the position where the inner surface 11E of the substrate 11 is provided is indicated by a dashed line to make it easier to understand the position of the element-side wiring section. Figure 14C is a top view of the insulating member 11P provided immediately below the first insulating member 11P1. Figure 14D is a top view of the insulating member 11P provided immediately below the insulating member 11P in Figure 14C. In Figure 14D, the positions where the first to fourth power supply side wiring sections 12A21 to 12A24 are provided are indicated by dashed lines to make it easier to understand the position of the power supply side wiring section. Figure 14E is a bottom view of the second insulating member 11P2. Figure 17 is a top view showing the internal configuration of the package 10 of the light-emitting device 2.

[0148] All of the above-described descriptions of the light-emitting device 1 and its components, excluding any content that can be said to contradict the drawings of the light-emitting device 2 (Figures 1 to 4, 7 to 14, and 17), also apply to the description of the light-emitting device 2. All non-contradictory content will not be repeated here to avoid redundancy.

[0149] Unlike light-emitting device 1, light-emitting device 2 does not have a structure that separates the current path by the first wiring 60A and the second wiring 60B. In light-emitting device 1, the first element side wiring section 12A11 and the second element side wiring section 12A12 were both used for electrical connection on the first electrode side, but in light-emitting device 2, one is used for electrical connection on the first electrode side and the other is used for electrical connection on the second electrode side. Furthermore, the same base 11 can be used for light-emitting device 1 and light-emitting device 2, and electrical connection is achieved using a base 11 with the same wiring section 12A structure.

[0150] Thus, by utilizing the same wiring section 12A structure for different wiring connection configurations, the productivity of the light-emitting device is improved. Therefore, manufacturers of light-emitting devices should manufacture both light-emitting device 1 (first light-emitting device) and light-emitting device 2 (second light-emitting device). Note that manufacturing both does not mean manufacturing them simultaneously, but rather that the sales periods of the first light-emitting device and the second light-emitting device are not far apart, preferably overlapping, and the same base 11 with the same wiring section 12A structure is used for both the first and second light-emitting devices, thereby enjoying the benefits of improved productivity of the light-emitting device. Those who transfer or export light-emitting devices to customers or other third parties (hereinafter referred to as providers) should also transfer or export both the first and second light-emitting devices. Even if the first and second light-emitting devices are transferred or exported to different customers, as long as they are purchased from the same supplier, the benefits of improved productivity of the light-emitting devices can be enjoyed.

[0151] (Light-emitting device 2) In the light-emitting device 2, one or more light-emitting elements 20 include a second light-emitting element 20B that emits light with a different peak wavelength than the first light-emitting element 20A. The first light-emitting element 20A is the light-emitting element 20 provided in the light-emitting device 1. Furthermore, the second light-emitting element described in the description of the light-emitting device 1 in the first embodiment may be a light-emitting element 20 that emits light with the same peak wavelength as the second light-emitting element 20B in the light-emitting device 2, or it may be a light-emitting element 20 that emits light with a different peak wavelength.

[0152] One or more light-emitting elements 20 include a third light-emitting element 20C that emits light with a different peak wavelength than the first light-emitting element 20A. The third light-emitting element 20C emits light with a different peak wavelength than the second light-emitting element 20B.

[0153] The first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C each emit light of a different color, specifically red, green, and blue. This allows the light-emitting module, comprising the first and second light-emitting devices, to emit RGB light.

[0154] In the light-emitting device 2, one or more light-emitting elements 20 can be composed of multiple light-emitting elements 20, including one or more second light-emitting elements 20B and one or more third light-emitting elements 20C. In the illustrated light-emitting device 1, five or more light-emitting elements 20 are composed of two or more second light-emitting elements 20B and three or more third light-emitting elements 20C.

[0155] In the light-emitting device 2, the plurality of wirings 60 include a first wiring 60A that is electrically connected to one or more second light-emitting elements 20B on the first electrode side, and a second wiring 60B that is electrically connected to one or more second light-emitting elements 20B on the second electrode side. The first wiring 60A is joined to the first element side wiring section 12A11, and the second wiring 60B is joined to the second element side wiring section 12A12. As a result, the first element side wiring section 12A11 and the second element side wiring section 12A12 can be used not only for branching the current path on the same electrode side, but also for conducting electricity between the first electrode and the second electrode of the light-emitting element 20.

[0156] In the light-emitting device 2, the multiple wirings 60 include a third wiring 60C that electrically connects to one or more third light-emitting elements 20C on the first electrode side, and a fourth wiring 60D that electrically connects to one or more third light-emitting elements 20C on the second electrode side. The third wiring 60C is joined to the third element-side wiring section 12A13, and the fourth wiring 60D is joined to the fourth element-side wiring section 12A14. This allows the second light-emitting element 20B to be electrically connected to the base body 11 by two element-side wiring sections provided on one outer surface 11D, and the third light-emitting element 20C to be electrically connected to the base body 11 by two element-side wiring sections provided on the other outer surface 11D, making it easier to connect the wirings 60.

[0157] <Third Embodiment> A light-emitting module 901 according to a third embodiment will now be described. Figures 1 to 19 are diagrams illustrating an exemplary form of the light-emitting module 901. Figures 1 to 17 are diagrams of the light-emitting devices 1 and 2 included in the light-emitting module 901, as previously described. Figure 18 is a perspective view of the light-emitting module 901. Figure 19 is a top view of the light-emitting module 901.

[0158] The light-emitting module 901 comprises multiple components. These components include multiple light-emitting devices, a wiring board 101, a connector 201, and a thermistor 301.

[0159] The light-emitting module 901 may also have other components. For example, the light-emitting module 901 may have a different light-emitting device than the light-emitting device 1. Also, the light-emitting module 901 may not have some of the components listed here.

[0160] The multiple light-emitting devices provided by the light-emitting module 901 include a first light-emitting device 1A and a second light-emitting device 1B. In the illustrated light-emitting module 901, the light-emitting device 1 of the first embodiment is used for the first light-emitting device 1A, and the light-emitting device 2 of the second embodiment is used for the second light-emitting device 1B. Since the light-emitting devices 1 and 2 have already been described in their respective embodiments, we will not repeat their descriptions here.

[0161] (Light-emitting module 901) In the light-emitting module 901, the first light-emitting device 1A and the second light-emitting device 1B are mounted on the wiring board 101. The light-emitting module 901 has one or more first light-emitting elements 20A, one or more second light-emitting elements 20B, and one or more third light-emitting elements 20C. This makes it possible to realize a light-emitting module 901 that emits RGB light.

[0162] The first light-emitting device 1A may include one or more first light-emitting elements 20A, and the second light-emitting device 1B may include one or more second light-emitting elements 20B and one or more third light-emitting elements 20C.

[0163] Although various embodiments of the present invention have been described above, the light-emitting devices and light-emitting modules of the present invention are not strictly limited to the light-emitting devices and light-emitting modules of each embodiment. In other words, the present invention is not limited to the external form and structure of the light-emitting devices and light-emitting modules disclosed in each embodiment. The present invention can be applied without requiring all components to be present. For example, if some of the components of the light-emitting device disclosed in the embodiment are not described in the claims, a degree of design freedom for those skilled in the art is permitted, such as substitution, omission, modification of shape, or change of material for those components, and the invention described in the claims is then specified to be applicable.

[0164] Through the information described herein so far, the following technical matters are disclosed: (Section 1) A plurality of light-emitting elements, each having a first electrode and a second electrode, and emitting light in a first direction, First element side wiring section, second element side wiring section, third element side wiring section, first power supply side wiring section electrically connected to the first element side wiring section, second power supply side wiring section electrically connected to the second element side wiring section , and the third power supply side wiring section which is electrically connected to the third element side wiring section It has a plurality of wiring sections including the plurality of light-emitting elements Aligned in the first direction and the second direction perpendicular to it. The base to be arranged, The first electrode side comprises a first wiring and a second wiring that electrically connect to the plurality of light-emitting elements, Third wiring that electrically connects to the plurality of light-emitting elements on the second electrode side Multiple wirings, including Equipped with, Both the first element-side wiring section and the second element-side wiring section are provided at positions away from the plurality of light-emitting elements in the second direction. The third element side wiring section is provided at a position away from the plurality of light-emitting elements in the direction opposite to the second direction, The first wiring is joined to the wiring section on the first element side, and the second wiring is joined to the wiring section on the second element side. The third wiring is joined to the wiring portion on the third element side. A light-emitting device. (Section 2) The substrate has a first outer surface and a second outer surface opposite to the first outer surface. The first element-side wiring section and the second element-side wiring section are provided on the first outer surface side, The third element side wiring portion is provided on the second outer side, as described in item 1. (Section 3) The light-emitting device according to item 2, wherein, in a top view, the plurality of light-emitting elements are arranged between the wiring section on the first element side and the wiring section on the third element side. (Section 4) The system further comprises one or more submounts on which the plurality of light-emitting elements are arranged. The first wiring and the second wiring are connected to the submount. The third wiring is joined to the light-emitting element, as described in any one of claims 1 to 3. (Section 5) In a top view, the first wiring is provided between a first virtual plane including the light-emitting surface of the light-emitting element and a second virtual plane including the side surface opposite to the light-emitting surface. The light-emitting device according to item 4, wherein, in a top view, the second straight line is positioned in the region that does not include the light-emitting element, which is divided into two regions with respect to the second virtual plane. (Section 6) The substrate has a laminated structure in which a plurality of insulating members, including at least a first insulating member and a second insulating member, are stacked. The first element-side wiring section, the second element-side wiring section, and the third element-side wiring section are provided on the first insulating member. The first power supply side wiring section, the second power supply side wiring section, and the third power supply side wiring section are provided on the second insulating member, The first element-side wiring section and the first power supply-side wiring section are electrically connected via a first via wiring provided in the laminated structure. The second element-side wiring section and the second power supply-side wiring section are electrically connected via a second via wiring provided in the laminated structure. The third element-side wiring section and the third power supply-side wiring section are electrically connected via a third via wiring provided in the laminated structure. The light-emitting device according to any one of claims 1 to 5, wherein within the laminated structure, the first via wiring, the second via wiring, and the third via wiring are not electrically connected to each other. (Section 7) The first via wiring comprises a first via portion that penetrates the insulating member in the stacking direction, and a first wiring layer connected to the first via portion and extending in a planar direction of the insulating member perpendicular to the stacking direction. The light-emitting device according to claim 6, wherein the second via wiring comprises a second via portion penetrating the insulating member in the stacking direction, and a second wiring layer connected to the second via portion and extending in a planar direction of the insulating member perpendicular to the stacking direction. (Section 8) A first light-emitting device and a second light-emitting device, each comprising a substrate having a plurality of wiring sections, including a first element-side wiring section, a second element-side wiring section, a first power supply-side wiring section electrically connected to the first element-side wiring section, and a second power supply-side wiring section electrically connected to the second element-side wiring section, The aforementioned first light-emitting device, One or more first light-emitting elements having a first electrode and a second electrode, The substrate on which the one or more first light-emitting elements are arranged, A plurality of wirings, including first and second wirings that electrically connect to the one or more first light-emitting elements on the first electrode side, It is equipped with, and also, The first wiring is connected to the wiring portion on the first element side, and the second wiring is connected to the wiring portion on the second element side. The aforementioned second light-emitting device is One or more second light-emitting elements having a first electrode and a second electrode, The substrate on which the one or more second light-emitting elements are arranged, A plurality of wires, including a first wire electrically connected to the one or more second light-emitting elements on the first electrode side, and a second wire electrically connected to the one or more second light-emitting elements on the second electrode side, It is equipped with, and also, The first wiring is connected to the wiring portion on the first element side, and the second wiring is connected to the wiring portion on the second element side. A first light-emitting device and a second light-emitting device, wherein the first light-emitting device and the second light-emitting device emit light with different peak wavelengths from each other. (Section 9) The plurality of wiring sections in the substrate further include a third element side wiring section, a fourth element side wiring section, a third power supply side wiring section electrically connected to the third element side wiring section, and a fourth power supply side wiring section electrically connected to the fourth element side wiring section. The plurality of wirings provided in the first light-emitting device further include a third wiring that is electrically connected to the one or more first light-emitting elements on the second electrode side, The third wiring of the first light-emitting device is joined to the wiring portion on the third element side, The second light-emitting device further comprises one or more third light-emitting elements having a first electrode and a second electrode, The plurality of wirings provided in the second light-emitting device further include a third wiring that is electrically connected to the one or more third light-emitting elements on the first electrode side, and a fourth wiring that is electrically connected to the one or more third light-emitting elements on the second electrode side. The third wiring of the second light-emitting device is joined to the wiring portion on the third element side, The fourth wiring of the second light-emitting device is joined to the wiring portion on the fourth element side, The first light-emitting device and the second light-emitting device according to item 8, wherein the first light-emitting device, the second light-emitting device, and the third light-emitting device emit light with different peak wavelengths from each other. (Section 10) The first light-emitting device and the second light-emitting device according to item 9, wherein in the first light-emitting device, there is no wiring connected to the wiring portion on the fourth element side. (Section 11) The first light-emitting device and the second light-emitting device described in item 8, A light-emitting module comprising a wiring board on which the first light-emitting device and the second light-emitting device are mounted. (Section 12) The first light-emitting device and the second light-emitting device described in item 9 or 10, The system comprises a wiring board on which the first light-emitting device and the second light-emitting device are mounted, A light-emitting module in which the first light-emitting element, the second light-emitting element, and the third light-emitting element each emit light of a different color, which is one of the colors red, green, and blue. [Industrial applicability]

[0165] The light-emitting devices and light-emitting modules described in the embodiments can be used in projectors. In other words, projectors can be considered one application of the present invention. However, the present invention is not limited to this and can be used in various applications such as projectors, lighting, exposure, in-vehicle headlights, head-mounted displays, and backlights for other displays. [Explanation of Symbols]

[0166] 1, 2 Light-emitting devices 10 packages 11 Base 11A 1st top surface 11B Bottom side 11C 2nd top surface 11D External surface 11D1 1st outer surface 11D2 2nd outer surface 11E Inside surface 11th floor step section 11F1 First step section 11F2 Second step section 11G top surface 11H side 11M base 11N frame 11P Insulating material 11P1 First insulating member 11P2 Second insulating member 11Q via wiring 11R Beer Club 11S wiring layer 11Q1 Via 1 wiring 11R1 1st Beer Section 11S1 1st wiring layer 11Q2 2nd via wiring 11R2 2nd Beer Section 11S2 2nd wiring layer 11Q3 Third via wiring 11R3 3rd Beer Section 11S3 3rd wiring layer 12A wiring section 12A1 First wiring section (element-side wiring section) 12A11 First element side wiring section 12A12 Second element side wiring section 12A13 Third element side wiring section 12A14 Fourth element side wiring section 12A15 Fifth element side wiring section 12A2 2nd wiring section (power supply side wiring section) 12A21 1st power supply side wiring section 12A22 2nd power supply side wiring section 12A23 3rd power supply side wiring section 12A24 4th power supply side wiring section 13A Joint Pattern 14 Lid 14A Top 14B Bottom surface 14C side 20 Light-emitting elements 20A First light-emitting element 20B Second light-emitting element 20C Third Light-Emitting Device 21A Top 21B Bottom side 21C side 22 Light exit surface 30 Submount 31A Top 31B Bottom surface 31C side 32A circuit board 32B Upper metal member 32C Lower metal component 33 Wiring layer 40 Reflective material 41A Bottom 41B Light reflective surface 50 protective elements 60 Wiring 60A First Wiring 60B 2nd wiring 60C 3rd wiring 60D 4th wiring 70 Optical components (lens components) 71A Top 71B Bottom side 71C side 71D Lens surface (optical surface) 72A Lens section 72B Non-lens section 101 Wiring board 201 Connector 301 Thermistor 901 Light-emitting module

Claims

1. A plurality of light-emitting elements, each having a first electrode and a second electrode, and emitting light in a first direction, A substrate having a plurality of wiring sections including a first element-side wiring section, a second element-side wiring section, a third element-side wiring section, a first power supply-side wiring section electrically connected to the first element-side wiring section, a second power supply-side wiring section electrically connected to the second element-side wiring section, and a third power supply-side wiring section electrically connected to the third element-side wiring section, wherein the plurality of light-emitting elements are arranged in a second direction perpendicular to the first direction, A plurality of wires, including a first wire and a second wire electrically connected to the plurality of light-emitting elements on the first electrode side, and a third wire electrically connected to the plurality of light-emitting elements on the second electrode side, Equipped with, Both the first element-side wiring section and the second element-side wiring section are provided at a position away from the plurality of light-emitting elements in the second direction. The third element side wiring section is provided at a position away from the plurality of light-emitting elements in the direction opposite to the second direction, A light-emitting device in which the first wiring is connected to the wiring portion on the first element side, the second wiring is connected to the wiring portion on the second element side, and the third wiring is connected to the wiring portion on the third element side.

2. The substrate has a first outer surface and a second outer surface opposite to the first outer surface. The first element-side wiring section and the second element-side wiring section are provided on the first outer surface side, The third element side wiring portion is provided on the second outer side surface, as described in claim 1.

3. The light-emitting device according to claim 2, wherein, in a top view, the plurality of light-emitting elements are arranged between the wiring section on the first element side and the wiring section on the third element side.

4. The system further comprises one or more submounts on which the plurality of light-emitting elements are arranged. The first wiring and the second wiring are connected to the submount. The light-emitting device according to claim 1, wherein the third wiring is joined to the light-emitting element.

5. In a top view, the first wiring is provided between a first virtual plane including the light-emitting surface of the light-emitting element and a second virtual plane including the side surface opposite to the light-emitting surface. The light-emitting device according to claim 4, wherein, in a top view, the second straight line is positioned in the region that does not include the light-emitting element, which is divided into two regions with respect to the second virtual plane.

6. The substrate has a laminated structure in which a plurality of insulating members, including at least a first insulating member and a second insulating member, are stacked. The first element-side wiring section, the second element-side wiring section, and the third element-side wiring section are provided on the first insulating member. The first power supply side wiring section, the second power supply side wiring section, and the third power supply side wiring section are provided on the second insulating member. The first element-side wiring section and the first power supply-side wiring section are electrically connected via a first via wiring provided in the laminated structure. The second element-side wiring section and the second power supply-side wiring section are electrically connected via a second via wiring provided in the laminated structure. The third element-side wiring section and the third power supply-side wiring section are electrically connected via a third via wiring provided in the stacked structure. The light-emitting device according to claim 1, wherein the first via wiring, the second via wiring, and the third via wiring are not electrically connected to each other within the laminated structure.

7. The first via wiring comprises a first via portion that penetrates the insulating member in the stacking direction, and a first wiring layer connected to the first via portion and extending in a planar direction of the insulating member perpendicular to the stacking direction. The light-emitting device according to claim 6, wherein the second via wiring comprises a second via portion that penetrates the insulating member in the stacking direction, and a second wiring layer connected to the second via portion and extending in a planar direction of the insulating member perpendicular to the stacking direction.

8. A first light-emitting device and a second light-emitting device, each comprising a substrate having a plurality of wiring sections, including a first element-side wiring section, a second element-side wiring section, a first power supply-side wiring section electrically connected to the first element-side wiring section, and a second power supply-side wiring section electrically connected to the second element-side wiring section, The first light-emitting device described above is One or more first light-emitting elements having a first electrode and a second electrode, The substrate on which the one or more first light-emitting elements are arranged, A plurality of wirings, including first and second wirings that electrically connect to the one or more first light-emitting elements on the first electrode side, It is equipped with, and also, The first wiring is connected to the wiring portion on the first element side, and the second wiring is connected to the wiring portion on the second element side. The aforementioned second light-emitting device is One or more second light-emitting elements having a first electrode and a second electrode, The substrate on which the one or more second light-emitting elements are arranged, A plurality of wirings, including a first wiring that electrically connects to the one or more second light-emitting elements on the first electrode side, and a second wiring that electrically connects to the one or more second light-emitting elements on the second electrode side, It is equipped with, and also, The first wiring is connected to the wiring portion on the first element side, and the second wiring is connected to the wiring portion on the second element side. A first light-emitting device and a second light-emitting device, wherein the first light-emitting device and the second light-emitting device emit light with different peak wavelengths from each other.

9. The plurality of wiring sections in the substrate further include a third element side wiring section, a fourth element side wiring section, a third power supply side wiring section electrically connected to the third element side wiring section, and a fourth power supply side wiring section electrically connected to the fourth element side wiring section. The plurality of wirings provided in the first light-emitting device further include a third wiring that is electrically connected to the one or more first light-emitting elements on the second electrode side, The third wiring of the first light-emitting device is joined to the wiring portion on the third element side, The second light-emitting device further comprises one or more third light-emitting elements having a first electrode and a second electrode, The plurality of wirings provided in the second light-emitting device further include a third wiring that is electrically connected to the one or more third light-emitting elements on the first electrode side, and a fourth wiring that is electrically connected to the one or more third light-emitting elements on the second electrode side. The third wiring of the second light-emitting device is joined to the wiring portion on the third element side, The fourth wiring of the second light-emitting device is joined to the wiring portion on the fourth element side, The first light-emitting device and the second light-emitting device according to claim 8, wherein the first light-emitting device, the second light-emitting device, and the third light-emitting device emit light with different peak wavelengths from each other.

10. The first light-emitting device and the second light-emitting device according to claim 9, wherein in the first light-emitting device, there is no wiring connected to the wiring portion on the fourth element side.

11. The first light-emitting device and the second light-emitting device according to claim 8, A light-emitting module comprising a wiring board on which the first light-emitting device and the second light-emitting device are mounted.

12. The first light-emitting device and the second light-emitting device according to claim 9 or 10, The system comprises a wiring board on which the first light-emitting device and the second light-emitting device are mounted, A light-emitting module in which the first light-emitting element, the second light-emitting element, and the third light-emitting element each emit light of a different color, which is one of the colors red, green, and blue.

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