Washing method, processing method, and processing apparatus
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DISCO CORP
- Filing Date
- 2024-12-20
- Publication Date
- 2026-07-02
Smart Images
Figure 2026109993000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a method for cleaning a workpiece such as a semiconductor wafer, a method and an apparatus for processing the workpiece.
Background Art
[0002] Device chips such as IC (Integrated Circuits) are essential components in various electronic devices such as mobile phones and personal computers. Such chips are manufactured, for example, by thinning a plate-shaped workpiece such as a semiconductor wafer having a plurality of devices formed on its surface by processes such as grinding and polishing, and then dividing it into regions each including a device. The processes involved in manufacturing such chips include various processes such as photolithography, etching, grinding, polishing, cutting, laser processing, and ultraviolet irradiation.
[0003] During a series of processes including such processes, the workpiece is washed as needed to remove foreign substances and the like adhering to the surface of the workpiece. The washing is performed, for example, by spraying a washing fluid such as water or air onto the workpiece.
[0004] As a document describing the technology related to the cleaning of such workpieces such as semiconductor wafers, for example, there is Patent Document 1.
[0005] The cleaning of the workpiece needs to be executed at an appropriate timing in a series of processes as described above. For example, if foreign substances adhere to the surface of the workpiece after washing and before the next process, the foreign substances may have an adverse effect on the process. For example, during a grinding process in which the back side of the workpiece is ground, if foreign substances adhere to the front side of the workpiece, the foreign substances will be sandwiched between the workpiece and the holding surface of the holding mechanism (such as a chuck table) that holds the workpiece, which may lead to non-uniform thickness in the workpiece after grinding.
Prior Art Documents
Patent Documents
[0006] [Patent Document 1] Japanese Patent Publication No. 2023-139675 [Overview of the Initiative] [Problems that the invention aims to solve]
[0007] The object of the present invention is to provide a cleaning method, a processing method, and a processing apparatus that can effectively suppress the intrusion of foreign matter between the object to be processed and the holding surface. [Means for solving the problem]
[0008] According to one aspect of the present invention, a cleaning method is provided which comprises: bringing the surface of an object to be processed to face the holding surface of a holding mechanism equipped with a holding surface for holding the object to be processed; supplying a cleaning fluid from the holding surface after bringing the surface of the object to be processed to face the holding surface of the holding mechanism to clean the surface of the object to be processed; and holding the object to be processed with the holding surface after cleaning the surface of the object to be processed.
[0009] Preferably, when cleaning the surface of the object to be processed that is to be held, the surface of the object to be processed and the surface of the holding mechanism are operated relative to each other.
[0010] Preferably, when cleaning the surface of the object to be processed that is being held, the holding surface is rotated.
[0011] Preferably, the process of bringing the surface of the object to be processed to face the holding surface of the holding mechanism and cleaning the surface of the object to be processed is performed while the object to be processed is being held by a transport mechanism that transports the object to the holding mechanism.
[0012] Preferably, the surface of the object to be processed that is to be held is cleaned, and then the holding surface is cleaned.
[0013] According to another aspect of the present invention, a method for processing an object to be processed using the above-described cleaning method is provided, further comprising cleaning the surface of the object to be processed, and then processing the object while it is being held on the surface.
[0014] According to another aspect of the present invention, a processing apparatus is provided comprising: a holding mechanism having a holding surface for holding an object to be processed; a washing holding mechanism for holding an object to be processed such that the holding surface and the surface of the object to be processed face each other; a flow path for supplying a cleaning fluid from the holding surface of the holding mechanism to the object to be processed held by the washing holding mechanism; a processing unit for processing the object to be processed held by the holding surface of the holding mechanism; and a controller that controls the supply of a cleaning fluid from the holding surface of the holding mechanism and cleaning the surface of the object to be processed while the object to be processed is held by the washing holding mechanism before the object to be processed is held by the holding surface. [Effects of the Invention]
[0015] According to the cleaning method, processing method, and processing apparatus relating to each aspect of the present invention, the surface of the object to be processed is cleaned by a cleaning fluid supplied from the holding surface of the holding mechanism while the surface of the object to be processed is facing the holding surface of the holding mechanism. This shortens the time from cleaning until the object to be processed is held by the holding surface, and effectively suppresses the intrusion of foreign matter between the object to be processed and the holding surface. [Brief explanation of the drawing]
[0016] [Figure 1] Figure 1 is a schematic perspective view showing an example of the configuration of the processing apparatus. [Figure 2] Figure 2 is a schematic side cross-sectional view showing an example of the configuration of a holding mechanism provided in a processing device. [Figure 3] Figure 3 is a flowchart showing an example of a procedure related to the cleaning and processing method of an object to be processed. [Figure 4] Figure 4 is a side cross-sectional view showing an example of the condition of the area surrounding an object being treated during cleaning. [Figure 5] FIG. 5 is a side sectional view showing an example of the state around the holding mechanism during cleaning of the holding mechanism. [Figure 6] FIG. 6 is a side sectional view showing an example of a process in which the workpiece is held by the holding mechanism. [Figure 7] FIG. 7 is a side sectional view showing an example of the state around the workpiece during processing of the workpiece.
MODE FOR CARRYING OUT THE INVENTION
[0017] Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing an example of a processing apparatus for processing a workpiece. In FIG. 1, some of the components of the grinding apparatus are shown as functional blocks.
[0018] In FIG. 1, the X direction, Y direction, and Z direction indicate the directions of three axes orthogonal to each other in a three-dimensional space. The X direction (front-rear direction) and the Y direction (left-right direction) are horizontal directions orthogonal to each other. The Z direction (vertical direction) is a direction orthogonal to the X direction and the Y direction and is a vertical direction.
[0019] In the present specification, expressions such as “along the Z direction” and “along the XY plane” are used, but these do not necessarily mean only the case where the direction of a member or surface exactly coincides with or is parallel to these axes or planes. For example, it includes cases where they are slightly inclined to each other but generally face the same direction, or cases where the angle or movement of a member includes a component in that direction.
[0020] The processing apparatus 2 shown in FIG. 1 is a grinding apparatus for grinding the workpiece 11. The processing apparatus (grinding apparatus) 2 includes a base 4 that supports various components. Cassette tables 6a and 6b are attached to the front end portion of the base 4. The cassette tables 6a and 6b are tables on which cassettes 8a and 8b, which are containers capable of accommodating a plurality of workpieces 11, are placed.
[0021] The workpiece 11 is, for example, a wafer made of a semiconductor material such as silicon. Multiple division lines (streets) are set in a grid pattern on the surface 11a side of the workpiece 11, and a device is formed in each region demarcated by these division lines.
[0022] In Figure 1, a semiconductor wafer with a device formed on its surface 11a is shown as an example of the workpiece 11, but the workpiece 11 is not limited to such a semiconductor wafer. The workpiece 11 can be any object to be subjected to some kind of processing. For example, the workpiece 11 may be a package substrate, a substrate without a device formed on it, or a semiconductor ingot before it is cut into a wafer. Furthermore, the workpiece 11 may be made of a material other than a semiconductor. Also, the workpiece 11 may be made of multiple types of materials, or it may be an article made up of multiple parts.
[0023] For example, the workpiece 11 may be a plate-shaped semiconductor wafer with protective tape attached to one side, or it may be a frame unit in which protective tape is attached to one side of a plate-shaped semiconductor wafer, and the outer periphery of the protective tape is attached to an annular frame.
[0024] A recess 4a is formed in the upper surface of the base 4, in an area slightly behind the cassette tables 6a and 6b. Inside the recess 4a is a transport mechanism (first transport mechanism) 10 for loading and unloading the workpieces 11 to and from the cassettes 8a and 8b.
[0025] The first transport mechanism 10 includes, for example, an arm with multiple joints and a robot hand provided at the tip of the arm, and is configured to hold the workpiece 11 on one side of the robot hand. The first transport mechanism 10 can also invert the top and bottom of the workpiece held by the robot hand by inverting the robot hand that is holding the workpiece 11.
[0026] A position adjustment mechanism 12 for adjusting the position of the workpiece 11 handled by the grinding device 2 is provided diagonally behind the recess 4a. The position adjustment mechanism 12 comprises a disc-shaped position adjustment table and a plurality of pins arranged around the position adjustment table.
[0027] The objects to be processed 11, which are discharged from cassettes 8a and 8b by the transport mechanism 10, are placed on a position adjustment table so that their centers are aligned to a predetermined position.
[0028] Specifically, after the workpiece 11 is discharged from the cassettes 8a and 8b, it is placed on the position adjustment table with its underside 11b facing upwards. Subsequently, a plurality of pins positioned to surround the position adjustment table approach the table along its radial direction and make contact with the outer periphery of the workpiece 11 placed on the position adjustment table.
[0029] As the multiple pins approach the position adjustment table, they maintain a relative position to each other such that they are located on the circumference of a circle whose center is at the position adjustment table. Therefore, if the workpiece 11 is disc-shaped, when all the pins are in contact with the outer circumference of the workpiece 11, the center of the workpiece 11 will roughly coincide with the center of the position adjustment table. In this way, the workpiece 11 is aligned.
[0030] A transport mechanism (second transport mechanism) 14 is provided on the upper surface of the base 4, behind the first transport mechanism 10 and to the side of the position adjustment mechanism 12, to hold the workpiece 11 and transport it backward. The transport mechanism 14 includes, for example, a support shaft 14a extending upward from the upper surface of the base 4 along the Z direction, an arm 14b extending from the upper end of the support shaft 14a in a direction perpendicular to the Z direction, and a holding pad 14c attached to the underside of the tip of the arm 14b.
[0031] The base of the support shaft 14a is connected to a rotating mechanism (not shown), such as a motor. The base end of the arm 14b is fixed to the tip of the support shaft 14a. When the rotating mechanism (not shown) connected to the support shaft 14a operates, the support shaft 14a, which extends along the Z direction, rotates about its axis, and along with this, the arm 14b pivots along the XY plane about the support shaft 14a. Due to the pivoting of the arm 14b, the retaining pad 14c attached to the tip of the arm 14b moves along the circumference centered on the tip of the support shaft 14a.
[0032] Furthermore, the support shaft 14a is connected to a moving mechanism (not shown), such as an air cylinder, and the operation of this moving mechanism causes the entire second transport mechanism 14, including the support shaft 14a, to move up and down along the Z direction.
[0033] The holding pad 14c is the part of the second transport mechanism 14 that holds the item to be held (for example, the item to be processed 11). The holding pad 14c is, for example, a vacuum suction pad.
[0034] Furthermore, the retaining pad 14c can employ any mechanism that is suitable for holding the article to be held. The retaining pad 14c may be a vacuum suction pad, a Bernoulli suction pad, an electromagnetic suction pad, or a mechanism that holds the article to be held using a clamp-like component.
[0035] The second transport mechanism 14 holds the workpiece 11 and transports it backward, for example, as follows: First, with the entire second transport mechanism 14 lifted by the aforementioned moving mechanism (not shown), the support shaft 14a rotates by the aforementioned rotating mechanism (not shown), and the holding pad 14c is positioned above the workpiece 11 supported by the position adjustment mechanism 12. The workpiece 11 is placed on the position adjustment table of the position adjustment mechanism 12, with its center aligned to a predetermined position.
[0036] Next, the moving mechanism (not shown) lowers the support shaft 14a. This causes the holding pad 14c to descend and come into contact with the back surface 11b of the workpiece 11. In this state, when the vacuum-type holding pad 14c sucks the back surface 11b (top surface) of the workpiece 11, the workpiece 11 is held by the holding pad 14c.
[0037] With the object to be processed 11 held by the holding pad 14c, when the moving mechanism (not shown) raises the support shaft 14a, the object to be processed 11 is lifted from the position adjustment mechanism 12 together with the holding pad 14c. The aforementioned rotating mechanism (not shown) rotates the support shaft 14a, causing the arm 14b to pivot together with the holding pad 14c and the object to be processed 11, and the object to be processed 11 is transported backward.
[0038] A turntable 16 is provided on the upper surface of the base 4, at a position behind the second transport mechanism 14. The base of the turntable 16 is connected to a rotating mechanism (not shown), such as a motor. When this rotating mechanism operates, the turntable 16 rotates about a rotation axis that passes through the center of the turntable 16 and extends along the Z direction.
[0039] Multiple (in this case, three) holding mechanisms are provided on the upper surface of the turntable 16. Each holding mechanism has a table portion 20 attached above a base portion 18.
[0040] Each base portion 18 is a disc-shaped member, and the three base portions 18 are arranged generally evenly along the circumferential direction of the turntable 16 (with angles of approximately 120° relative to the center of the turntable 16).
[0041] Each base unit 18 is mounted to the turntable 16 so as to be rotatable around an axis aligned with the Z direction. The orientation of the rotation axis of each base unit 18 does not necessarily coincide precisely with the Z direction, and the angle relative to the turntable 16 is adjusted by a tilt adjustment mechanism (not shown).
[0042] Referring now to Figure 2, the table section 20, which is a component of the holding mechanism, will be described. Figure 2 is a schematic side cross-sectional view showing an example of the configuration of a holding mechanism (table section 20) provided in the processing apparatus (grinding apparatus) 2. The table section 20 has a holding surface 20a for holding the workpiece 11 and is connected to the upper end of each base section 18 attached to the turntable 16, as shown in Figure 1.
[0043] The table section 20 is, for example, a chuck table that holds the workpiece 11 by negative pressure. The table section 20, which is a chuck table, has a frame 20b and a suction body 20c, as shown in Figure 2, for example.
[0044] The frame 20b is a generally cylindrical member formed from a material such as ceramics or metal, and is fixed to the base portion 18 (see Figure 1) by bolts or the like.
[0045] A disc-shaped recess is formed on the upper part of the frame 20b, and the adsorbent 20c is attached to this recess. The adsorbent 20c is an article formed to the dimensions and shape corresponding to the recess of the frame 20b, and is attached to the frame 20b so as to fit into the recess. The adsorbent 20c is formed from a material such as porous ceramics.
[0046] The upper surface of the adsorbent body 20c forms a holding surface 20a on which the object to be processed 11 is placed, and which adsorbs and holds the object to be processed 11.
[0047] Although the adsorbent 20c is formed in a disc shape overall, the upper surface (holding surface) 20a of the adsorbent 20c is formed in a conical shape. However, the inclination of the conical surface formed by the upper surface 20a of the adsorbent 20c is slight and not visible to the naked eye, so the upper surface 20a of the adsorbent 20c is not shown as conical in Figure 2 (the same applies to Figures 4 and beyond). For example, if the diameter of the adsorbent 20c is several hundred mm, the height of the cone is approximately 10 μm to several tens of μm.
[0048] The upper surface of the frame 20b into which the adsorbent 20c is fitted surrounds the adsorbent 20c, and the upper surface of the frame 20b has a shape in which the conical surface formed by the upper surface (holding surface) 20a of the adsorbent 20c is extended radially outward.
[0049] A suction source 22, such as a vacuum pump, a gas supply source 24, such as an air compressor, and a liquid supply source 26, such as a water pump, are connected to the lower surface of the adsorbent body 20c.
[0050] Specifically, a flow path 20d is provided on the lower surface side of the adsorbent 20c in the table section 20, and one end of a flow path 28 formed by piping such as a pipe is connected to the flow path 20d. The other end of the flow path 28 branches into a suction flow path 28a, a gas flow path 28b, and a liquid flow path 28c. The suction flow path 28a, the gas flow path 28b, and the liquid flow path 28c each form a part of the flow path 28.
[0051] The suction channel 28a, gas channel 28b, and liquid channel 28c are connected to the suction source 22, gas supply source 24, and liquid supply source 26, respectively. The suction channel 28a, gas channel 28b, and liquid channel 28c are each provided with a flow control valve and an on / off valve.
[0052] When the suction source 22 is activated with the object to be processed 11 placed on the holding surface 20a of the table section 20 (at this time, the on / off valve of the suction passage 28a is opened, and the on / off valves of the gas passage 28b and liquid passage 28c are closed), the object to be processed 11 is sucked towards the table section 20 and held on the holding surface 20a.
[0053] When the on-off valve of the suction passage 28a is closed and the on-off valves of the gas passage 28b and liquid passage 28c are open, the gas supply source 24 and liquid supply source 26 operate, and gas and liquid, respectively, are supplied from the gas supply source 24 and liquid supply source 26 to the passage 20d through the gas passage 28b and liquid passage 28c, and are ejected from the top surface (holding surface) 20a after passing through the inside of the adsorbent 20c.
[0054] In this explanation, the chuck table, specifically the table portion 20, is assumed to be a so-called porous chuck equipped with a porous ceramic as the adsorbent 20c. However, the form of the table portion 20 is not limited to a porous chuck as described herein. The table portion 20 only needs to have a holding surface 20a that holds at least a portion of the article to be held, and a structure that allows cleaning fluid to be supplied from the holding surface 20a.
[0055] In addition to a porous chuck, other possible forms of the table portion 20 include a universal chuck with grooves formed on its upper surface, which serves as the holding surface, and a pin chuck. If the table portion 20 is a pin chuck, the adsorbent body 20c is formed from a material such as metal, and a hole is provided that penetrates the adsorbent body 20c in the thickness direction.
[0056] Returning to Figure 1, let's continue the explanation of the grinding apparatus 2. When the turntable 16 rotates with the table section 20 mounted on the base section 18, the base section 18 and the table section 20 move together with the turntable 16. As a result, each of the base section 18 and the table section 20, which form a holding mechanism, are sequentially positioned at, for example, the loading / unloading position adjacent to the second transport mechanism 14, the rough grinding position diagonally behind the loading / unloading position, and the finish grinding position to the side of the rough grinding position.
[0057] The workpiece 11 is transferred from the position adjustment mechanism 12 to the table section 20, which is positioned at the loading / unloading location, by the second transport mechanism 14. The operation at this time is performed in the following order, for example.
[0058] First, the object to be processed 11 is held in the holding pad 14c of the transport mechanism 14, and with the entire second transport mechanism 14 lifted by the aforementioned moving mechanism (not shown), the support shaft 14a rotates by the aforementioned rotating mechanism (not shown), and the object to be processed 11 held in the holding pad 14c is positioned above the table portion 20.
[0059] Next, the moving mechanism (not shown) lowers the support shaft 14a. As a result, the holding pad 14c descends together with the workpiece 11, and the surface 11a (bottom side) of the workpiece 11 comes into contact with the holding surface 20a of the table section 20. In this state, when the suction of the workpiece 11 by the holding pad 14c is stopped, the workpiece 11 separates from the holding pad 14c and is placed on the holding surface 20a of the table section 20.
[0060] Next, when the suction source 22 operates, the surface 11a side (bottom side) of the workpiece 11 is sucked to the table section 20 and held on the holding surface 20a.
[0061] The procedure for transferring the workpiece 11 from the second transport mechanism 14 to the holding mechanism (table section 20) is as described above. However, in the grinding apparatus 2 of this embodiment, the workpiece 11 is cleaned during this transfer.
[0062] Specifically, before the workpiece 11 is held by the holding surface 20a, while the workpiece 11 is held by the second transport mechanism 14, cleaning fluid is supplied from the holding surface 20a of the table section 20, and the workpiece 11 and the table section 20 are cleaned. At this time, the second transport mechanism 14 functions as a holding mechanism during cleaning. The cleaning of the workpiece 11 before it is held by the table section 20 will be explained in detail later.
[0063] As the turntable 16 rotates, the table section 20 that holds the workpiece 11 is positioned at the rough grinding position. As the turntable 16 rotates further, the same table section 20 is positioned at the finish grinding position.
[0064] Behind both the rough grinding position and the finish grinding position, columnar support structures 30 are provided to support the grinding unit 44, which is a processing unit in the grinding apparatus 2, so as to protrude upward from the base 4.
[0065] A moving mechanism 32 is provided on the front side of each support structure 30. This moving mechanism 32 is a mechanism for moving the grinding unit 44 relative to the support structure 30.
[0066] Each moving mechanism 32 is equipped with a pair of guide rails 34 extending along the Z direction. A moving plate 36 is slidably mounted on the pair of guide rails 34.
[0067] A nut (not shown) that constitutes a ball screw is fixed to the rear (back) side of the movable plate 36, and a screw shaft 38 extending in the Z direction is rotatably connected to this nut. A rotational drive source 40, such as a motor, is connected to one end (upper end) of the screw shaft 38. When the screw shaft 38 rotates due to the operation of the rotational drive source 40, the movable plate 36 moves along the Z direction together with the nut.
[0068] A grinding unit 44 is attached to the front (surface) of the movable plate 36 via a fixing device 42. The grinding unit 44 comprises a spindle housing 46 fixed to the fixing device 42 and a cylindrical spindle 48 housed in the spindle housing 46.
[0069] The cylindrical spindle 48 is housed in the spindle housing 46 with its axis aligned along the Z-direction. The spindle 48 is supported in the spindle housing 46 in a manner that allows it to rotate about its axis.
[0070] The tip (lower end) of the spindle 48 is exposed from the lower end of the spindle housing 46, and a disc-shaped mount 50 is fixed to this lower end. Grinding wheels 54a and 54b are attached to the lower surface of the mount 50 by bolts 52.
[0071] In the grinding apparatus 2 shown in Figure 1, the grinding unit 44 located on the right side of the figure is a grinding unit for rough grinding, and the grinding unit 44 located on the left side is a grinding unit for finish grinding. The grinding unit 44 for rough grinding is located above the rough grinding position, and the grinding unit 44 for finish grinding is located above the finish grinding position. A grinding wheel 54a for rough grinding is attached to the mount 50 of the spindle 48 of the grinding unit 44, and a grinding wheel 54b for finish grinding is attached to the mount 50 of the spindle 48 of the grinding unit 44.
[0072] Each grinding wheel 54a, 54b is equipped with an annular wheel base 56 made of a metal such as stainless steel or aluminum. Multiple grinding wheels 58 are fixed to the lower surface of the wheel base 56 along the circumferential direction of the wheel base 56.
[0073] Each grinding wheel 58 is composed of a binder such as a vitrified bond or resin bond, and abrasive grains such as diamond or sapphire dispersed in this binder. The average particle size of the abrasive grains contained in the grinding wheel 58 of the grinding wheel 54b for finish grinding is smaller than the average particle size of the abrasive grains contained in the grinding wheel 58 of the grinding wheel 54a for rough grinding.
[0074] Each grinding unit 44 has a spindle housing 46 that houses a rotating mechanism such as a motor, which is connected to the base end (upper end) of the spindle 48. When this rotating mechanism operates, the spindle 48 rotates together with the grinding wheels 54a and 54b around an axis along the Z direction.
[0075] Fluid supply units 60a and 60b are provided near the grinding wheels 54a and 54b attached to each grinding unit 44. The fluid supply units 60a and 60b include nozzles 62a and 62b located inside the grinding wheels 54a and 54b in a plan view when the grinding wheels 54a and 54b are attached to the spindle 48. The nozzles 62a and 62b are connected to a fluid supply source (not shown) that supplies cleaning fluid to the nozzles 62a and 62b.
[0076] Flow channels are formed within the nozzles 62a and 62b, and a liquid such as water is supplied from the fluid supply source through these flow channels as a processing fluid. The processing fluid is sprayed from the nozzles 62a and 62b and supplied to the holding surface 20a of the table section 20 positioned at the rough grinding position or the finish grinding position, or to the workpiece 11 held on the holding surface 20a. In addition to the nozzles 62a and 62b, a fluid supply mechanism may be adopted in which the liquid is supplied, for example, through a flow channel formed within the grinding unit 44.
[0077] With the workpiece 11 held in the table section 20, when the table section 20 is positioned in a rough grinding position or a finish grinding position, rough grinding or finish grinding is performed on the workpiece 11.
[0078] Rough grinding and finish grinding are performed, for example, in the following procedure. First, the table section 20 on which the workpiece 11 is held, and the grinding wheels 54a and 54b, each rotate around an axis along the Z direction. In this state, the movement mechanism 32 moves each grinding unit 44 downward along the Z direction. The spindle 48 and the table section 20 move closer to each other. When the workpiece 11 and the grinding wheel 58 come into contact with each other, grinding begins.
[0079] Just before the workpiece 11 and the grinding wheel 58 come into contact, the fluid supply units 60a and 60b operate, supplying liquid to the workpiece 11. As a result, with liquid supplied to the contact surface between the workpiece 11 and the grinding wheel 58, rough grinding or finish grinding is performed on the back surface 11b (top surface) of the workpiece 11.
[0080] During grinding, the workpiece 11 gradually becomes thinner as it is ground. Each grinding unit 44 moves gradually downward accordingly (grinding feed). When the workpiece 11 has been ground to the desired thickness, rough grinding or finish grinding is completed. The rotation of the grinding unit 44 and the table section 20 is stopped, and the grinding unit 44 moves upward, separating the workpiece 11 from the grinding wheel 58. The supply of liquid from the fluid supply units 60a and 60b is stopped.
[0081] For each workpiece 11, rough grinding is performed with the workpiece 11 positioned in the rough grinding position by the rotation of the turntable 16, and then finish grinding is performed with the workpiece 11 positioned in the finish grinding position by the rotation of the turntable 16. After finish grinding, when the turntable 16 rotates further, the workpiece 11, which was positioned in the finish grinding position, is positioned together with the table section 20 in the loading / unloading position adjacent to the second transport mechanism 14.
[0082] A transport mechanism (third transport machine) 64 is provided on the upper surface of the base 4, in front of the loading / unloading position and to the side of the second transport mechanism 14.
[0083] The third transport mechanism 64 has a structure similar to that of the second transport mechanism 14, for example, and includes a support shaft 64a, an arm 64b, and a holding pad 64c. The third transport mechanism 64, for example, holds the workpiece 11 held on the table section 20 positioned at the loading / unloading position and transports it forward.
[0084] On the upper surface of the base 4, at a position to the side of the third conveying mechanism 64, is a cleaning unit 66 for cleaning the workpiece 11 that has been conveyed from the table section 20 by the third conveying mechanism 64. The cleaning unit 66 includes, for example, a spinner table that rotates while holding the lower surface of the workpiece 11, and a cleaning nozzle that sprays cleaning fluid onto the upper surface of the workpiece 11 held by the spinner table.
[0085] The cleaning fluid used in the cleaning unit 66 is, for example, a mixed fluid of a liquid such as water and a gas such as air. Alternatively, only a liquid such as water may be supplied from the cleaning unit 66 as the cleaning fluid.
[0086] Once the cleaning of the workpiece 11 in the cleaning unit 66 is complete, the workpiece 11 is transported from the cleaning unit 66 to cassettes 8a and 8b by the first transport mechanism 10.
[0087] Each component of the processing apparatus (grinding apparatus) 2 described above is controlled by a controller 68 built into the grinding apparatus 2. The controller 68 includes a processor 68a and a storage device 68b. The processor 68a is composed of a processor such as a CPU (Central Processing Unit). The storage device 68b is composed of volatile memory such as DRAM (Dynamic Random Access Memory) and SRAM (Static Random Access Memory), and non-volatile memory such as an SSD (Solid State Drive), NAND flash memory, HDD (Hard Disk Drive), and magnetic storage device.
[0088] The storage device 68b stores various types of information (data, programs, etc.) used by the processor 68a. For example, the storage device 68b stores a program for controlling the operation of each component of the grinding apparatus 2 related to rough grinding or finish grinding of the workpiece 11 when the table section 20 that holds the workpiece 11 is positioned at the rough grinding position or the finish grinding position.
[0089] Furthermore, the storage device 68b stores a program that controls the operation of each component of the grinding apparatus 2 for cleaning the workpiece 11 while the workpiece 11 is being held by the second transport mechanism (cleaning holding mechanism) 14, before the workpiece 11 is held by the holding surface 20a. At that time, the controller 68 uses this program to control the operation of the flow control valve and on / off valve provided in the gas flow path 28b and liquid flow path 28c, for example, and supplies cleaning fluid from the holding surface 20a of the table section 20.
[0090] The procedure for cleaning the workpiece 11 in the grinding apparatus 2 of this embodiment described above will now be explained with reference to Figure 3. Figure 3 is a flowchart showing an example of the procedure for cleaning and processing the workpiece 11. In the example described below, it is assumed that the workpiece 11, held by the second transport mechanism 14, is cleaned just before it is transferred to the holding surface 20a of the holding mechanism (table section 20). In this case, the second transport mechanism 14 corresponds to the holding mechanism during cleaning.
[0091] The procedure shown in Figure 3 includes a positioning step S10, a first cleaning step S20, a second cleaning step S30, a holding step S40, and a processing step S50. At least some of these steps are performed by the controller 68 controlling each component of the grinding apparatus 2.
[0092] In positioning step S10, the object to be processed 11, held by the second transport mechanism 14 which is a washing holding mechanism, is brought to face the holding surface 20a of the holding mechanism (table section 20). More specifically, with the object to be processed 11 held by the holding pad 14c, the arm 14b rotates, and the object to be processed 11 is positioned above the holding surface 20a. In this state, the surface of the object to be processed 11 that is to be held faces the holding surface 20a. The surface to be held is the side of the article (object to be processed 11) held by the holding mechanism (table section 20) that is held by the holding surface 20a, and in this case, for example, the surface 11a.
[0093] The operation of the aforementioned moving mechanism (14a), which is connected to the support shaft 14a (see Figure 1) of the second transport mechanism 14, causes the surface to be held (surface 11a) of the workpiece 11 to approach the holding surface 20a of the table section 20, and the two are positioned slightly separated in the Z direction.
[0094] In this state, cleaning fluid is supplied from the holding surface 20a, and the surface (surface 11a) of the object to be processed 11 is cleaned (first cleaning step S20). Figure 4 is a side cross-sectional view showing an example of the state of the area around the object to be processed 11 during cleaning (first cleaning step S20).
[0095] Of the channels 28 connected to the channel 20d within the table section 20, the on-off valve for the suction channel 28a is closed, and the on-off valves for the gas channel 28b and the liquid channel 28c are opened (see Figure 2). The operation of the liquid supply source 24 and the gas supply point 26 supplies liquids such as water and gases such as air to the holding surface 20a from the channel 28 through the channel 20d and the adsorbent 20c, acting as a cleaning fluid.
[0096] The cleaning fluid may be a gas-liquid mixture, a mixture of liquid and gas, or it may be either a liquid or a gas, or a mixture of liquid and gas. Examples of liquids used in the cleaning fluid include pure water and water mixed with surfactants. Examples of gases include air and various other gases.
[0097] Furthermore, when a gas-liquid mixed fluid is supplied as the cleaning fluid, instead of supplying gas and liquid from a gas supply source 24 and a liquid supply source 26, respectively, as shown in Figure 2, an alternative configuration may be adopted in which the cleaning fluid is supplied from a tank in which the cleaning fluid is stored as a gas-liquid mixed fluid.
[0098] In this state, the distance between the surface to be held (surface 11a) of the workpiece 11 and the holding surface 20a of the table portion 20 is maintained at a distance such that the cleaning fluid supplied from the holding surface 20a contacts at least a portion of the surface to be held (surface 11a) of the workpiece 11, and that the cleaning fluid flows between the surface to be held (surface 11a) and the holding surface 20a.
[0099] Specifically, the distance between the surface to be held (surface 11a) of the workpiece 11 and the holding surface 20a of the table portion 20 is set to, for example, 0.1 mm or more and 10 mm or less, preferably 1 mm or more and 5 mm or less, more preferably 2 mm or more and 4 mm or less, and typically about 3 mm. The distance between the two during cleaning should be adjusted according to the viscosity and flow rate of the supplied cleaning fluid, the required cleaning capacity, etc.
[0100] The flow rate of the liquid, such as water, supplied as the cleaning fluid is set to, for example, 0.1 [L / min] or more and 3 [L / min] or less, preferably 0.5 [L / min] or more and 2 [L / min] or less, more preferably 1.0 [L / min] or more and 1.5 [L / min] or less, and typically around 1.2 [L / min].
[0101] When a gas such as air is mixed with a liquid such as water supplied as a cleaning fluid, or when liquid and gas are supplied alternately, the flow rate of the supplied gas is set to, for example, 0.5 [L / min] or more and 15 [L / min] or less, preferably 1.0 [L / min] or more and 12 [L / min] or less, more preferably 2 [L / min] or more and 10 [L / min] or less, and typically around 5.0 [L / min].
[0102] The flow rate of the liquid and gas supplied as cleaning fluid should be adjusted according to the required cleaning capacity, the properties of the supplied cleaning fluid, the distance between the surface (surface 11a) of the object to be processed 11 and the holding surface 20a of the table section 20, etc.
[0103] When cleaning the surface (surface 11a) of the object to be processed 11, relative movement may occur between the holding surface 20a of the table portion 20 and the surface (surface 11a) of the object to be processed 11.
[0104] During cleaning of the surface to be held (surface 11a), the relative movement between the holding surface 20a and the surface to be held (surface 11a) is, for example, the rotation of the holding surface 20a. In this case, for example, the rotation of the base portion 18 (see Figure 1) provided in the holding mechanism causes the holding surface 20a of the table portion 20 to rotate. The rotation speed of the holding surface 20a at this time is set to, for example, 10 [rpm] or more and 300 [rpm] or less, preferably 15 [rpm] or more and 200 [rpm] or less, more preferably 20 [rpm] or more and 100 [rpm] or less, and typically to about 60 [rpm].
[0105] The cleaning fluid supplied from the holding surface 20a is, for example, a mixed fluid in which gas and liquid are intermingled. In such a gas-liquid mixed fluid, countless bubbles exist in the liquid. This cleaning fluid covers the surface to be held (surface 11a) and at least a portion of the holding surface 20a, and captures and washes away any foreign matter such as dust present therein.
[0106] At this time, as the holding surface 20a rotates, the cleaning fluid flows radially outward according to the centrifugal force caused by the rotation of the holding surface 20a. Foreign matter taken into the cleaning fluid is carried away with the cleaning fluid and removed from between the surface to be held (surface 11a) and the holding surface 20a.
[0107] Furthermore, if the second transport mechanism 14, which is a holding mechanism during cleaning, is equipped with a function to rotate the holding pad 14c, then during cleaning, instead of or in addition to the rotation of the holding surface 20a, the holding surface (surface 11a) of the workpiece 11 held by the second transport mechanism 14 may rotate.
[0108] Here, the centrifugal force due to rotation is weaker the closer you are to the axis of rotation. Therefore, when the holding surface 20a or the surface to be held (surface 11a) rotates, sufficient cleaning power may not be obtained in the region close to the axis of rotation, and residue may remain.
[0109] To minimize the occurrence of uncleaned areas, it is preferable that during cleaning, the surface to be held (surface 11a) and the holding surface 20a move relative to each other in a direction along these surfaces (along the XY plane), so that the position of one of the surfaces moves relative to the axis of rotation. As a result, a part that was being cleaned near the axis of rotation at one point during cleaning will be cleaned at a position away from the axis of rotation at another point, thus preventing specific areas from being left uncleaned due to the centrifugal force caused by rotation during cleaning.
[0110] Such movement is carried out, for example, by the rotation of the arm 14b of the second transport mechanism 14, causing the object to be processed 11 to reciprocate within a certain range around the support shaft 14a (see Figure 1), and the surface to be held (surface 11a) to move relative to the holding surface 20a.
[0111] Alternatively, the turntable 16 may rotate, causing the table section 20 to reciprocate within a certain range. However, in the case of the grinding apparatus 2 of this embodiment, while the workpiece 11 is being placed on one table section 20 by the second transport mechanism 14, grinding may be performed on the workpiece 11 held on the other table section 20 by the grinding unit 44.
[0112] When the turntable 16 rotates, its movement may affect the grinding of the workpiece 11 held on the other table section 20. Therefore, when the holding surface (surface 11a) and the holding surface 20a move relative to each other for sufficient cleaning as described above, if the timing coincides with grinding or other processes on the other table section 20, it is preferable for the workpiece 11 to be moved by the second transport mechanism 14.
[0113] Furthermore, the relative movement between the surface to be held (surface 11a) and the holding surface 20a during cleaning may be performed simultaneously with cleaning that involves rotation of the surface to be held (surface 11a) or the holding surface 20a (rotation of the table portion 20), or movement and cleaning with rotation may be performed alternately. During movement, rotation and the supply of cleaning fluid may be temporarily stopped. If the relative movement between the two occurs one or more times during cleaning with rotation, the above-mentioned effect of suppressing the occurrence of uncleaned areas can be achieved.
[0114] During cleaning, the surface to be held (surface 11a) and the holding surface 20a may be moved along a direction intersecting these surfaces (a direction along the Z-direction). In this case, depending on the thickness and strength of the workpiece 11, it is considered necessary to consider the mechanical load generated on the workpiece 11. However, by changing the distance between the surface to be held (surface 11a) and the holding surface 20a, force is applied to foreign matter present between them, and effects such as making it easier to wash away the foreign matter can be expected.
[0115] After cleaning with the supply of a liquid or gas-liquid mixture as a cleaning fluid, the surface of the object to be processed 11 (surface 11a) may be dried by supplying only gas from, for example, the holding surface 20a.
[0116] However, if, for example, the workpiece 11 is ground after the first cleaning step S20, grinding fluid will be supplied to the workpiece 11 during grinding, so there is little need to dry the workpiece 11 beforehand. Nevertheless, depending on the type of processing performed on the workpiece 11 after cleaning, it may be useful to dry the workpiece 11 as soon as cleaning is complete.
[0117] After the first cleaning step S20 in which the workpiece 11 is cleaned, a second cleaning step S30 is performed to clean the holding surface 20a of the table portion 20 as needed. Figure 5 is a side cross-sectional view showing an example of the state of the area around the table portion 20 during cleaning of the table portion 20 (second cleaning step S30).
[0118] The cleaning of the holding surface 20a is performed, for example, as shown in Figure 5, with the table section 20 holding the workpiece 11 positioned near the nozzle 62a of the fluid supply section 60a (see Figure 1). At this time, with the cleaned workpiece 11 still held by the second transport mechanism 14 (see Figure 4), the turntable 16 rotates, and the table section 20 that held the workpiece 11 in the first cleaning step S20 is positioned at the rough grinding position near the nozzle 62a, as shown in Figure 5.
[0119] In this state, cleaning fluid is supplied from the nozzle 62a, and the holding surface 20a of the table section 20 is cleaned. During cleaning, for example, the rotation of the turntable 16 causes the table section 20 and the nozzle 62a to move relative to each other. However, if cleaning fluid can be supplied from the nozzle 62a to the entire area of the holding surface 20a without movement, then relative movement between the holding mechanism (table section) 20) and the nozzle 62a is unnecessary.
[0120] Furthermore, the table section 20 may rotate during cleaning, but if sufficient cleaning of the holding surface 20a is possible without rotation, the table section 20 does not need to rotate.
[0121] For more efficient cleaning, cleaning fluid may be supplied from the holding surface 20a; however, if sufficient cleaning can be achieved by supplying cleaning fluid only from the nozzle 62a, the supply of cleaning fluid from the holding surface 20a is not required.
[0122] In Figure 5, the case is explained in which the table section 20 moves to the vicinity of the nozzle 62a (see Figure 1) located below the grinding unit 44, and cleaning is performed using the fluid supply section 60a. However, instead of using the fluid supply section 60a, which supplies liquid during grinding, to clean the holding surface 20a of the table section 20, a separate fluid supply section may be provided for cleaning the holding surface 20a.
[0123] Alternatively, if the retaining surface 20a can be sufficiently cleaned by supplying cleaning fluid from the retaining surface 20a, the retaining surface 20a may be cleaned solely by supplying cleaning fluid from the retaining surface 20a, without using the fluid supply unit 60a or any other fluid supply unit.
[0124] After cleaning, the holding surface 20a may be dried by supplying only gas from the fluid supply unit 60a or the holding surface 20a, if necessary.
[0125] After the holding surface 20a of the table section 20 is cleaned, the turntable 16 rotates, causing the table section 20 to move again to the loading / unloading position beneath the workpiece 11 (the workpiece 11 cleaned in the first cleaning step S20) held by the second transport mechanism 14.
[0126] Furthermore, if the fluid supply unit 60a is not used in the cleaning of the holding surface 20a in the second cleaning step S30, or if cleaning of the holding surface 20a by the second cleaning step S30 is unnecessary, then movement of the table unit 20 related to the execution of the second cleaning step S30 may not be necessary.
[0127] After the first cleaning step S20 (or after the second cleaning step S30 if the second cleaning step S30 is performed following the first cleaning step S20), the workpiece 11 is held on the holding surface 20a of the table portion 20 (holding step S40). Figure 6 is a side cross-sectional view showing an example of the process in which the workpiece 11 is held on the table portion 20 (holding step S40).
[0128] With the holding surface 20a of the table section 20 positioned below the workpiece 11 held by the holding pad 14c of the transport mechanism 14, the support shaft 14a is lowered by the aforementioned moving mechanism (not shown) connected to the support shaft 14a, and the holding pad 14c lowers together with the workpiece 11. When the surface 11a side (bottom side) of the workpiece 11 comes into contact with the holding surface 20a of the table section 20, the suction of the workpiece 11 by the holding pad 14c is stopped, and the workpiece 11 is placed on the holding surface 20a.
[0129] Next, the suction source 22 (see Figure 2) is activated, and the on / off valve provided in the suction passage 28a is opened, causing the surface 11a of the workpiece 11 to be held to be sucked into the table section 20 and held on the holding surface 20a.
[0130] Once the cleaned workpiece 11 is held on the holding surface 20a of the table section 20, processing of the workpiece 11 is performed in that state (processing step S50). Figure 7 is a side cross-sectional view showing an example of the state of the area around the workpiece 11 during processing (processing step S50). Here, grinding is assumed as an example of the processing applied to the workpiece 11.
[0131] During grinding, the table section 20, which holds the workpiece 11, and the spindle 48 provided on the grinding unit 44, each rotate around an axis along the Z direction. When the grinding unit 44 moves downward along the Z direction and the workpiece 11 and the grinding wheel 58 come into contact with each other, grinding begins. During grinding, liquid is supplied to the workpiece 11 by the fluid supply sections 60a and 60b. Grinding ends when the workpiece 11 has been ground to the desired thickness.
[0132] As described above, in this procedure, when the workpiece 11 is processed (grinding) while it is held on the holding surface 20a of the holding mechanism (table section 20), the surface of the workpiece 11 that is to be held (surface 11a) is cleaned by the cleaning fluid supplied from the holding surface 20a before the workpiece 11 is held on the holding surface 20a.
[0133] When processing is performed on an object 11 while it is held in the holding mechanism (table portion 20), if foreign matter is caught between the surface to be held (surface 11a) and the holding surface 20a of the object 11, it may adversely affect the processing of the object 11.
[0134] For example, if the process involves grinding, after grinding, the thickness of the workpiece 11 at the location of the foreign object may become smaller than in other parts. Other problems may also occur, such as cracks forming in the workpiece 11 or pressure marks being formed on the surface 11a of the workpiece 11 due to the foreign object.
[0135] Generally, in the manufacturing of chips, various processes are performed on the workpiece 11, such as a semiconductor wafer. Therefore, if foreign matter is found to be attached to the workpiece 11 at a certain stage, it is difficult to determine at which earlier stage that foreign matter was attached to the workpiece 11. This is one of the factors that makes it difficult to deal with the attachment of foreign matter to the workpiece 11.
[0136] However, regardless of when foreign matter adheres to the workpiece 11, if the workpiece 11 is properly cleaned at the stage where the foreign matter needs to be removed, problems caused by the foreign matter can be avoided, at least in the process immediately following.
[0137] When attempting to avoid problems caused by foreign matter during grinding or other processes by removing such foreign matter, it is most effective to perform cleaning immediately before the workpiece 11 is held by the holding mechanism (table section 20) for the process. This is because the shorter the time between cleaning the workpiece 11 and holding it by the holding mechanism (table section 20), the fewer opportunities there are for foreign matter to enter between the surface to be held (surface 11a) and the holding surface 20a after cleaning.
[0138] In the procedure and grinding apparatus 2 described above, the workpiece 11 is cleaned while facing the holding surface 20a by a cleaning fluid supplied from the holding surface 20a that holds the workpiece 11. This minimizes the time between the cleaning of the workpiece 11 and its retention by the holding surface 20a, effectively preventing foreign matter from entering between the surface to be held (surface 11a) and the holding surface 20a.
[0139] In the grinding apparatus 2 of the above embodiment, the steps of positioning the workpiece 11 by bringing the surface to be held (surface 11a) of the workpiece 11 facing the holding surface 20a of the holding mechanism (table section 20) (positioning step S10) and cleaning the surface to be held (surface 11a) of the workpiece 11 (first cleaning step S20) can be performed while the workpiece 11 is held by the second transport mechanism 14 that transports the workpiece 11 to the holding mechanism (table section 20).
[0140] In this way, when processing (grinding) the workpiece 11, it is not necessary to, for example, support the workpiece 11 with another mechanism for cleaning before processing and then transfer it to the second transport mechanism 14 or the holding mechanism (table section 20). Therefore, the effort and time involved in the cleaning process can be reduced, and the decrease in production efficiency due to the cleaning process can be minimized.
[0141] Furthermore, if necessary, the holding surface 20a can be cleaned after the holding surface (surface 11a) of the workpiece 11 has been cleaned. When foreign matter is trapped between the holding surface (surface 11a) and the holding surface 20a, it is possible that the foreign matter is attached to the holding surface (surface 11a) or to the holding surface 20a when the workpiece 11 is held by the holding surface 20a.
[0142] Alternatively, foreign matter adhering to the workpiece 11 may fall onto the holding surface 20a as the holding surface (surface 11a) is cleaned.
[0143] Therefore, by cleaning not only the surface (surface 11a) of the object to be processed 11, but also the holding surface 20a of the holding mechanism (table section 20), foreign matter that may get trapped between the surface (surface 11a) and the holding surface 20a can be removed more reliably.
[0144] In the above embodiment, the example described was that the processing apparatus is a grinding apparatus, but the configuration of the processing apparatus and the content of the processing performed on the workpiece are not limited to this.
[0145] In addition to the grinding process described above, other processing methods performed on the workpiece 11 include laser processing by irradiation with a laser beam, cutting with a cutting blade, polishing with a polishing pad, dry etching with plasma, wet etching using chemicals, cutting with a cutting tool, and braking with a braking blade or roller breaker. After processing such as grinding and polishing, the workpiece 11 may be divided by laser processing, cutting, etc., to produce chips, and cleaning of the workpiece and holding surface as described above may be performed before each of these processes (grinding, polishing, laser processing, cutting).
[0146] Furthermore, processes other than machining can also be considered as processes performed on the workpiece. Examples of such processes include cleaning, imaging, inspection, application of protective materials such as tape, removal of protective materials, transport, and film formation. In addition, all kinds of processes can be envisioned that are performed on the workpiece while it is held on the holding surface of the holding mechanism.
[0147] Regarding the processing equipment, various types and forms are possible depending on the content of the processing. For example, the processing equipment may be a laser processing device, cutting device, polishing device, etching device, braking device, etc. Alternatively, the processing equipment may be a device that performs processing other than processing on the workpiece, such as a cleaning device, imaging device, inspection device, adhesive device, peeling device, replacement device, conveying device, or film deposition device.
[0148] If the processing apparatus is, for example, a laser processing apparatus, the laser processing apparatus comprises, for example, a holding mechanism having a holding surface for holding an object to be processed, a processing unit (irradiation unit) that irradiates the object to be processed held on the holding surface of the holding mechanism with a laser beam, and a transport mechanism that transports the object to be processed to the holding mechanism, wherein a cleaning fluid is supplied to the holding mechanism from the holding surface. The processing unit comprises a laser oscillator that emits a laser beam, an optical system equipped with optical instruments such as mirrors to guide the emitted laser beam to the irradiation target, a lens for focusing the laser beam, etc.
[0149] If the processing apparatus is, for example, a cutting apparatus, the cutting apparatus comprises, for example, a holding mechanism having a holding surface for holding a workpiece, a processing unit (cutting unit) that cuts the workpiece held on the holding surface of the holding mechanism, a fluid supply unit that supplies liquid to the workpiece, and a transport mechanism that transports the workpiece to the holding mechanism, wherein a cleaning fluid is supplied to the holding mechanism from the holding surface. The cutting unit comprises a spindle on which a blade for cutting the workpiece held in the holding mechanism is mounted and which rotates with the blade, and the blade is brought into contact with the workpiece while rotating.
[0150] If the processing apparatus is, for example, a polishing apparatus, the polishing apparatus comprises, for example, a holding mechanism having a holding surface for holding an object to be processed, a processing unit (polishing unit) for polishing the object to be processed held on the holding surface of the holding mechanism, a fluid supply unit for supplying liquid to the object to be processed, and a transport mechanism for transporting the object to be processed to the holding mechanism, wherein a cleaning fluid is supplied to the holding mechanism from the holding surface. The polishing unit comprises a polishing wheel on which a polishing pad for polishing the object to be processed held in the holding mechanism is mounted, and a spindle that rotates together with the polishing wheel, and the polishing pad is brought into contact with the object to be processed while rotating.
[0151] If the processing apparatus is, for example, a cleaning apparatus, the cleaning apparatus comprises, for example, a holding mechanism having a holding surface for holding an object to be processed, a processing unit (cleaning unit) that cleans the object to be processed held on the holding surface of the holding mechanism, and a conveying mechanism for transporting the object to be processed to the holding mechanism, wherein a cleaning fluid is supplied to the holding mechanism from the holding surface. The cleaning unit is equipped with nozzles, pumps, etc. for supplying the cleaning fluid to the object to be processed.
[0152] If the processing device is, for example, an imaging device, the imaging device comprises, for example, a holding mechanism having a holding surface for holding an object to be processed, a processing unit (imaging unit) for imaging the object to be processed held on the holding surface of the holding mechanism, and a transport mechanism for transporting the object to be processed to the holding mechanism, wherein a cleaning fluid is supplied to the holding mechanism from the holding surface. The inspection unit comprises a camera or the like for imaging the object to be processed.
[0153] If the processing apparatus is, for example, an inspection apparatus, the inspection apparatus comprises, for example, a holding mechanism having a holding surface for holding an object to be processed, a processing unit (inspection unit) for inspecting the object to be processed held on the holding surface of the holding mechanism, and a transport mechanism for transporting the object to be processed to the holding mechanism, wherein a cleaning fluid is supplied to the holding mechanism from the holding surface. The inspection unit is equipped with a camera, sensors, etc. for inspecting the object to be processed.
[0154] Of course, various other types of processing devices can be envisioned besides those listed here. Furthermore, processing devices equipped with the functionality to perform multiple processes on the object being processed can also be considered.
[0155] Furthermore, the structures, methods, etc., according to the embodiments described above are not limited to those embodiments and may be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of Symbols]
[0156] 2: Processing equipment (grinding equipment) 4: Base, 4a: Recess 6a: Cassette table, 6b: Cassette table, 8a: Cassette, 8b: Cassette 10: Conveying mechanism (first conveying mechanism) 11: Object to be processed, 11a: Surface (surface to be held), 11b: Back surface 12:Position adjustment mechanism 14: Conveying mechanism (second conveying mechanism, gripping mechanism during washing) 14a: Support shaft, 14b: Arm, 14c: Retaining pad 16: Turntable 18: Holding mechanism (base part), 20: Holding mechanism (table part) 20a: Holding surface, 20b: Frame, 20c: Adsorbent, 20d: Flow channel 22: Suction source, 24: Gas supply source, 26: Liquid supply source 28: Flow channel, 28a: Suction flow channel, 28b: Gas flow channel, 28c: Liquid flow channel 30:Support structure 32: Moving mechanism, 34: Guide rail, 36: Moving plate, 38: Screw shaft 40: Rotary drive source 44: Processing unit (grinding unit), 46: Spindle housing, 48: Spindle 50: Mount, 52: Bolt 54a: Grinding wheel, 54b: Grinding wheel, 56: Wheel base, 58: Grinding wheel 60a: Fluid supply unit, 60b: Fluid supply unit, 62a: Nozzle, 62b: Nozzle 64: Conveying mechanism (third conveying mechanism) 64a: Support shaft, 64b: Arm, 64c: Retaining pad 66: Washing Unit 68: Controller, 68a: Processor, 68b: Memory
Claims
1. The surface of the object to be processed is brought into contact with the holding surface of a holding mechanism that has a holding surface for holding the object to be processed, After positioning the surface of the object to be processed facing the holding surface of the holding mechanism, cleaning fluid is supplied from the holding surface to clean the surface of the object to be processed. After cleaning the surface of the object to be processed that is to be held, the object to be processed is held on the holding surface. A cleaning method comprising the following features.
2. The cleaning method according to claim 1, wherein when cleaning the surface of the object to be processed that is to be held, the surface of the object to be processed and the holding surface of the holding mechanism are operated relative to each other.
3. The cleaning method according to claim 2, wherein the holding surface of the object to be processed is rotated when cleaning the holding surface.
4. The process of bringing the surface of the object to be processed to face the surface of the holding mechanism, and cleaning the surface of the object to be processed, The cleaning method according to claim 1, wherein the cleaning method is performed while the object to be processed is held in a conveying mechanism that transports the object to the holding mechanism.
5. The cleaning method according to claim 1, wherein the surface of the object to be processed is cleaned, and then the surface is cleaned.
6. A method for processing an object to be processed using the cleaning method described in any one of claims 1 to 5, After cleaning the surface of the object to be processed, the object to be processed is held on the holding surface and then processed while the object is being held on the holding surface. A processing method that further includes these features.
7. A holding mechanism having a holding surface for holding the object to be processed, A washing-time holding mechanism that holds the object to be processed so that the holding surface and the surface of the object to be processed face each other, A flow path for supplying cleaning fluid from the holding surface of the holding mechanism to the object to be processed, which is held by the holding mechanism during cleaning, A processing unit for processing the object to be processed held on the holding surface of the holding mechanism, Before the object to be processed is held on the holding surface, a controller controls the supply of cleaning fluid from the holding surface of the holding mechanism while the object to be processed is held by the cleaning holding mechanism, thereby cleaning the surface of the object to be processed. A processing device equipped with the following features.