Sputtering device
The sputtering apparatus with synchronized pulse power supplies for dual cathodes addresses discharge instability, enabling efficient and rapid thin film formation on both substrate sides, enhancing productivity.
JP2026110274APending Publication Date: 2026-07-02CARBON FLY INC
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- CARBON FLY INC
- Filing Date
- 2024-12-20
- Publication Date
- 2026-07-02
Smart Images
Figure 2026110274000001_ABST
Abstract
The present invention provides a sputtering apparatus that can rapidly and efficiently deposit insulating films (buffer layers) and catalyst layers on both sides of a substrate. [Solution] A sputtering apparatus for forming a thin film on both sides of a substrate by sputtering, comprising a sputtering chamber, a first cathode and a second cathode arranged in the sputtering chamber, a first pulse power supply connected to the first cathode and a second pulse power supply connected to the second cathode, the substrate being placed between the first cathode and the second cathode, targets being fixed to the first cathode and the second cathode respectively, the first pulse power supply being configured to apply a pulse current to the first cathode, the second pulse power supply being configured to apply a pulse current to the second cathode, and the pulse current output from the first pulse power supply and the pulse current output from the second pulse power supply being output alternately.
Need to check novelty before this filing date? Find Prior Art