Electrical connection unit

Abstract

The present invention provides an electrical connection unit that enables heat dissipation from terminals without increasing the number of components fixed to the terminals of electronic components. [Solution] An electrical connection unit according to one embodiment comprises a first electronic component having a terminal, a first cable member having a first mounting hole and fixed to the terminal by a fastening member inserted into the first mounting hole, a second cable member having a second mounting hole and fastened together with the first cable member by a fastening member inserted into the second mounting hole, and a heat dissipation part integrally formed with the second cable member.

Description

Technical Field

[0001] Embodiments of the present invention relate to an electrical connection unit.

Background Art

[0002] An electrical connection unit having an electronic component (relay), a wiring material (bus bar) fixed to the same terminal of the electronic component by a fastening member, and a heat dissipation member is known. In this type of electrical connection unit, heat of the electronic component may be transferred from the terminal to the heat dissipation member, thereby promoting heat dissipation of the electronic component.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in an electrical connection unit having a heat dissipation member, it is conceivable to fix two wiring materials to the same terminal of an electronic component. In this case, the number of components fixed to the same terminal increases.

[0005] One embodiment provides an electrical connection unit capable of promoting heat dissipation of an electronic component without increasing the number of components fixed to the terminal of the electronic component.

Means for Solving the Problems

[0006] An electrical connection unit according to one embodiment includes a first electronic component having a terminal, a first wiring material having a first mounting hole and fixed to the terminal by a fastening member inserted into the first mounting hole, a second wiring material having a second mounting hole and clamped together with the first wiring material when the fastening member is inserted into the second mounting hole, and a heat dissipation portion integrally formed with the second wiring material.

Effects of the Invention

[0007] According to one embodiment of the electrical connection unit, heat dissipation of electronic components can be promoted without increasing the number of components fixed to the terminals of the electronic components. [Brief explanation of the drawing]

[0008] [Figure 1] A top view showing an electrical connection unit in one embodiment. [Figure 2] A perspective view showing a disassembled portion of an electrical connection unit according to one embodiment. [Figure 3] An exploded perspective view showing a modified example of an electrical connection unit in one embodiment. [Modes for carrying out the invention]

[0009] The embodiments will be described below with reference to the drawings. In the following description, components having the same or similar functions will be denoted by the same reference numerals. Duplication of these components may be omitted. The components described below do not limit the scope of the embodiments.

[0010] In this disclosure, terms are defined as follows: “Connection” may include electrical connections, not just mechanical ones. Also, “Connection” may include cases where two elements to be connected are directly connected, not just cases where two elements to be connected are connected with another element in between. “Facing” or “overlapping” means that the virtual projections of two objects overlap when viewed from a particular direction. That is, “Facing” or “overlapping” may include cases where two objects face each other with another member or gap between them, not just cases where two objects face each other. “Parallel,” “orthogonal,” or “same” may include cases where they are “approximately parallel,” “approximately orthogonal,” or “approximately the same,” respectively.

[0011] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows: The +X direction is the direction from the first electronic component 10A (described later) toward the connection points 31 and 37 of the first and third busbars 30A and 30C (see Figure 1). The -X direction is the opposite direction of the +X direction. When the +X direction and the -X direction are not distinguished, they are simply referred to as the "X direction". The Y direction is the direction that intersects (for example, is orthogonal to) the X direction. The +Y direction is the direction from the second terminal 13B of the first electronic component 10A (described later) toward the first terminal 13A (see Figures 1 and 2). The -Y direction is the opposite direction of the +Y direction. When the +Y direction and the -Y direction are not distinguished, they are simply referred to as the "Y direction". The +Z direction is the direction that intersects (for example, is orthogonal to) the X direction and the Y direction. The +Z direction is the direction from the extension 35 of the second busbar 30B (described later) toward the first electronic component 10A (see Figure 2). The -Z direction is the opposite direction to the +Z direction. When the +Z and -Z directions are not distinguished, they are simply referred to as the "Z direction".

[0012] In the following, the X and Y directions may be referred to as the "horizontal direction" if they are not distinguished. In the following, the Z direction may be referred to as the "vertical direction." Also, in the following, the +Z direction may be referred to as "up" and the -Z direction as "down." However, these expressions are for the sake of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the installation orientation of the electrical connection unit 1).

[0013] <1. Electrical connection unit> Figure 1 is a top view showing an electrical connection unit 1 according to one embodiment. Figure 2 is a perspective view showing a part of the electrical connection unit 1 in an exploded view. The electrical connection unit 1 is an in-vehicle device installed in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may be referred to as, for example, an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device. The electrical connection unit 1 includes, for example, a housing 5 and a main body MU.

[0014] As shown in Figure 1, the housing 5 is a component that forms the outer casing of the electrical connection unit 1. The housing 5 is made of, for example, synthetic resin and has electrical insulating properties. The housing 5 houses the main body MU. The specific configuration of the housing 5 may be arbitrary. The housing 5 illustrated in Figure 1 has an insulating base 6 on which the main body MU is placed. The base 6 has an upper surface 6a facing the +Z direction. The main body MU is placed on the upper surface 6a of the base 6. The electrical connection unit 1 does not necessarily have a housing 5, for example. Alternatively, the electrical connection unit 1 may have a base 6 instead of a housing 5, for example. In the following description, "housing 5" may be read as "base 6". Both the housing 5 and the base 6 are examples of "supports" that support the main body MU.

[0015] As shown in Figures 1 and 2, the main body MU is the part of the electrical connection unit 1 that performs the main function (for example, switching the electrical connection state or overcurrent protection). The main body MU may also be referred to as a "circuit configuration". The main body MU includes one or more electronic components 10, a plurality of busbars 30 (wiring materials), and a heat dissipation section 40.

[0016] <2. Electronic Components> First, let's describe the electronic component 10. The electronic component 10 is installed in the main body MU according to the required functions. The electronic component 10 in this embodiment includes a first electronic component 10A and a second electronic component 10B.

[0017] (Daiichi Electronic Components) The first electronic component 10A may be, for example, a connector, a fuse, a relay (e.g., a mechanical relay or a semiconductor relay), a capacitor, a branching component, various sensors (e.g., a current sensor or a voltage sensor), an electronic control unit, or an electronic component unit comprising two or more of these. However, the type of the first electronic component 10A is not limited to the above examples. The first electronic component 10A may be, for example, a heat-generating component that generates heat when energized.

[0018] The first electronic component 10A has, for example, a component body 11 and a plurality of terminals 13. The component body 11 may have, for example, a functional portion that performs the main function of the first electronic component 10A and an outer portion that forms most of the outer shape of the first electronic component 10A. For example, when the first electronic component 10A is a relay, the functional portion of the component body 11 includes a switching portion (e.g., a contact portion) that switches between a conductive state and a non-conductive state. For example, when the first electronic component 10A is a fuse, the functional portion of the component body 11 includes a fusing portion that is blown when an overcurrent flows. For example, when the first electronic component 10A is a capacitor, the functional portion of the component body 11 includes a portion that accumulates electric charge. The outer portion of the component body 11 is, for example, made of synthetic resin and has electrical insulation properties. Note that the functional portion and the outer portion of the component body 11 may be integrally formed, for example.

[0019] As shown in FIG. 2, the component body 11 of the present embodiment has an insulating rib 11A that protrudes in the horizontal direction (e.g., the +X direction) and extends in the Z direction. The insulating rib 11A is, for example, plate-shaped along the X direction and the Z direction. The insulating rib 11A extends, for example, over the entire length of the component body 11 in the Z direction. The insulating rib 11A is disposed between adjacent terminals 13 (the first terminal 13A and the second terminal 13B described later) when viewed from the X direction. The insulating rib 11A electrically insulates adjacent terminals 13. Further, the insulating rib 11A electrically insulates bus bars 30 (e.g., the first bus bar 30A and the third bus bar 30C described later) respectively fixed to two adjacent terminals 13.

[0020] As shown in FIG. 2, in the present embodiment, the component body 11 constituting the first electronic component 10A is formed in a three-dimensional shape having a plurality of surfaces facing in different directions from each other and corner portions located between adjacent surfaces. The number of surfaces of the component body 11 may be two or more. Specifically, the component body 11 is formed in a rectangular parallelepiped shape. On the plurality of surfaces of the component body 11, there are a front surface 11f facing in the +X direction, a rear surface 11b facing in the -X direction, an upper surface 11t facing in the +Z direction, a lower surface 11u facing in the -Z direction, a first side surface 11l facing in the +Y direction, and a second side surface 11r facing in the -Y direction. The front surface 11f of the component body 11 is an example of the "first surface", and the lower surface 11u and the first side surface 11l of the component body 11 are examples of the "second surface" adjacent to the first surface. The lower surface 11u of the component body 11 is a surface facing the upper surface 6a (see FIG. 1) of the base portion 6 described above. On the front surface 11f of the component body 11, the insulating rib 11A described above is arranged.

[0021] The terminal 13 is an electrical connection portion exposed to the outside from the surface of the component body 11. The terminal 13 is electrically connected to the functional portion of the component body 11 inside the outer portion of the component body 11. In the present embodiment, the terminals 13 of the electronic component 10 include a first terminal 13A and a second terminal 13B. One of the first terminal 13A and the second terminal 13B is a terminal on the positive electrode side. The other of the first terminal 13A and the second terminal 13B is a terminal on the negative electrode side. In the present embodiment, the first terminal 13A and the second terminal 13B are exposed to the outside from the front surface 11f of the component body 11. The first terminal 13A and the second terminal 13B are arranged side by side in the horizontal direction (for example, the Y direction). Specifically, the first terminal 13A and the second terminal 13B are arranged in order in the -Y direction. Note that the first terminal 13A and the second terminal 13B are not limited to being arranged on the surface of the component body 11 facing in the same direction, and may be arranged on the surfaces of the component body 11 facing in different directions from each other, for example.

[0022] Each terminal 13 has a mounting hole 13h into which a fastening member 41 (e.g., a screw or bolt), described later, is inserted. The mounting hole 13h opens horizontally (e.g., in the +X direction). In this embodiment, the fastening member 41 is inserted into the mounting hole 13h from the X direction (e.g., from the +X direction side). The inner circumferential surface of the mounting hole 13h of the electronic component 10 has a screw groove. The mounting hole 13h is a bottomed hole provided in the electronic component 10.

[0023] (Second electronic component) The second electronic component 10B may be, for example, a relay, a resistor, or a conductivity detection circuit. However, the type of the second electronic component 10B is not limited to the above examples. Since the current flowing through the second electronic component 10B is lower than the current flowing through the first electronic component 10A, the amount of heat generated by the second electronic component 10B when energized is sufficiently lower compared to the amount of heat generated by the first electronic component 10A. The second electronic component 10B is electrically connected to the first electronic component 10A via the second busbar 30B, which will be described later.

[0024] <3. Busbar> As shown in Figures 1 and 2, the multiple busbars 30 are wiring components that electrically connect two or more connection targets. The busbars 30 are made of metal (for example, copper, copper alloy, aluminum, or aluminum alloy) and are conductive. The connection targets connected to the busbars 30 may be, for example, the aforementioned electronic component 10, another electronic component (not shown), another busbar (not shown), etc. Specific examples of the other electronic component may be the same as the first electronic component 10A or the second electronic component 10B described above. Note that the term "wiring component" in this disclosure is not limited to the busbars 30 or another busbar, but may be any connection component that electrically connects two or more connection targets.

[0025] The busbar 30 in this embodiment includes a first busbar 30A, a second busbar 30B, and a third busbar 30C. The first busbar 30A, the second busbar 30B, and the third busbar 30C are examples of the "first cable member," "second cable member," and "third cable member," respectively.

[0026] (First bus bar) As shown in Figure 2, the first busbar 30A has a first mounting hole 31h. The first busbar 30A is fixed to the first terminal 13A of the first electronic component 10A by a first fastening member 41A (fastening member 41) inserted into the first mounting hole 31h. With this configuration, the first busbar 30A is electrically connected to the first electronic component 10A. The first busbar 30A electrically connects the first electronic component 10A to other electronic components or other busbars (not shown). In this embodiment, the first busbar 30A is formed in a plate shape. The first busbar 30A includes, for example, a connecting portion 31, a first extension portion 32, and a second extension portion 33. In this embodiment, the entire first busbar 30A, including the connecting portion 31, the first extension portion 32, and the second extension portion 33, is formed from a single plate material. The connecting portion 31, the first extension portion 32, and the second extension portion 33 are each formed in a flat plate shape.

[0027] The connection portion 31 of the first busbar 30A is the portion that connects to the first terminal 13A of the first electronic component 10A. The connection portion 31 is a plate portion with the X direction as the thickness direction and along the Y and Z directions. The connection portion 31 includes a portion that overlaps with the first electronic component 10A in the X direction. From another viewpoint, the connection portion 31 includes a portion that overlaps with the first fastening member 41A, which is inserted into the mounting hole 13h of the first terminal 13A, when viewed from the X direction.

[0028] The connecting portion 31 includes a first mounting hole 31h. The first mounting hole 31h is, for example, a through hole that penetrates the connecting portion 31 in the X direction. The first mounting hole 31h does not have, for example, a screw thread. The first mounting hole 31h faces the mounting hole 13h of the first electronic component 10A in the X direction. The first fastening member 41A is inserted into the first mounting hole 31h in the X direction. The first fastening member 41A, passed through the first mounting hole 31h, engages with the mounting hole 13h of the first terminal 13A of the first electronic component 10A. With this configuration, the connecting portion 31 of the first busbar 30A and the first terminal 13A of the first electronic component 10A are physically and electrically connected (see Figure 1). In addition, the connecting portion 31 of the first busbar 30A overlaps the front surface 11f of the first electronic component 10A (see Figure 1).

[0029] The first extension portion 32 extends from the edge of the connection portion 31 when viewed from the X direction. The first extension portion 32 extends along the surface of the first electronic component 10A when the connection portion 31 of the first busbar 30A is fixed to the first electronic component 10A. In this embodiment, the first extension portion 32 bends in the -X direction from the +Y direction end of the connection portion 31 and extends in the -X direction. The first extension portion 32 also extends along the first side surface 11l of the first electronic component 10A. The first extension portion 32 is a plate portion with the Y direction as the thickness direction and extending along the X and Z directions. When the connection portion 31 of the first busbar 30A is fixed to the first electronic component 10A, the first extension portion 32, which is such a plate portion, overlaps the first side surface 11l of the first electronic component 10A (see Figure 1).

[0030] The second extension portion 33 extends from the edge of the first extension portion 32 when viewed from the Y direction. The second extension portion 33 extends away from the first electronic component 10A when the connection portion 31 of the first busbar 30A is fixed to the first electronic component 10A. In this embodiment, the second extension portion 33 bends in the +Y direction from the -X direction end of the first extension portion 32 and extends in the +Y direction. The second extension portion 33 also extends in the +Y direction so as to move away from the first side surface 11l of the first electronic component 10A (see Figure 1). The second extension portion 33, like the connection portion 31, is a plate portion with the X direction as the thickness direction and along the Y and Z directions.

[0031] The specific form (shape and components) of the first busbar 30A is not limited to the above and may be arbitrary.

[0032] (Second bus bar) As shown in Figure 2, the second busbar 30B has a second mounting hole 34h. The second busbar 30B is fastened together with the first busbar 30A by inserting the first fastening member 41A into the second mounting hole 34h, and is fixed to the first terminal 13A of the first electronic component 10A. With this configuration, the second busbar 30B is electrically connected to the first electronic component 10A. The second busbar 30B electrically connects the first electronic component 10A to the second electronic component 10B. The second busbar 30B may also electrically connect the first electronic component 10A to another electronic component or another busbar (not shown), for example.

[0033] In this embodiment, the second busbar 30B is formed in a plate shape. The thickness dimension of the second busbar 30B is smaller than the thickness dimension of the plate-shaped first busbar 30A. The thickness dimension of the second busbar 30B may be, for example, half or less of the thickness dimension of the first busbar 30A. A lower voltage current flows through the second busbar 30B compared to the first busbar 30A. Furthermore, the second busbar 30B, when bent, overlaps both of the two adjacent surfaces (the first surface and the second surface) that are facing in different directions.

[0034] The second busbar 30B includes, for example, a connecting portion 34 and an extension portion 35. In this embodiment, the entire second busbar 30B, including the connecting portion 34 and the extension portion 35, is formed from a single plate material. The connecting portion 34 and the extension portion 35 of the second busbar 30B are each formed in a flat plate shape. The connecting portion 34 of the second busbar 30B is an example of the "first part of the second cable member," and the extension portion 35 of the second busbar 30B is an example of the "second part of the second cable member."

[0035] The connection portion 34 of the second busbar 30B is the portion that connects to the first terminal 13A of the first electronic component 10A. The connection portion 34 is a plate portion with the thickness direction in the X direction and along the Y and Z directions. The connection portion 34 includes a portion that overlaps with the first electronic component 10A in the X direction. From another viewpoint, the connection portion 34 includes a portion that overlaps with the first fastening member 41A, which is inserted into the mounting hole 13h of the first terminal 13A, when viewed from the X direction. In this embodiment, the connection portion 34 of the second busbar 30B is sandwiched between the first terminal 13A of the first electronic component 10A and the connection portion 31 of the first busbar 30A. Alternatively, the connection portion 34 of the second busbar 30B may be positioned, for example, to sandwich the connection portion 31 of the first busbar 30A between itself and the first terminal 13A of the first electronic component 10A.

[0036] The connecting portion 34 includes a second mounting hole 34h. The second mounting hole 34h is, for example, a through hole that penetrates the connecting portion 34 in the X direction. The second mounting hole 34h does not have a screw thread, for example. The second mounting hole 34h faces the mounting hole 13h of the first electronic component 10A and the first mounting hole 31h of the first busbar 30A in the X direction. The first fastening member 41A is inserted into the second mounting hole 34h in the X direction. The first fastening member 41A, which has passed through the first mounting hole 31h and the second mounting hole 34h, engages with the mounting hole 13h of the first electronic component 10A, thereby fastening the connecting portion 34 of the second busbar 30B together with the connecting portion 31 of the first busbar 30A and fixing it to the first terminal 13A of the first electronic component 10A. With this configuration, the connection portion 34 of the second busbar 30B is physically and electrically connected to the first terminal 13A of the first electronic component 10A, together with the connection portion 31 of the first busbar 30A (see Figure 1). In addition, the connection portion 34 of the second busbar 30B, together with the connection portion 31 of the first busbar 30A, overlaps the front surface 11f of the first electronic component 10A (see Figure 1).

[0037] The extension portion 35 of the second busbar 30B is the portion that extends from the connection portion 34 and connects to the second electronic component 10B. The extension portion 35 extends from the edge of the connection portion 34 when viewed from the X direction. The base end portion 351 of the extension portion 35 in the extension direction extends along the surface of the first electronic component 10A when the connection portion 34 of the second busbar 30B is fixed to the first electronic component 10A. The tip portion 352 of the extension portion 35 in the extension direction extends away from the first electronic component 10A. As shown in Figures 1 and 2, in this embodiment, the extended portion 35 bends in the -X direction from the -Z direction end of the connecting portion 34 and extends in the -X direction. The extended portion 35 is a plate portion with the Z direction as the thickness direction and extending along the X and Y directions. The base end portion 351 of the extended portion 35 extends along the lower surface 11u of the first electronic component 10A. The tip portion 352 of the extended portion 35 extends in the direction away from the second side surface 11r of the first electronic component 10A (-Y direction) when viewed from the Z direction.

[0038] The extension portion 35 is connected to the second electronic component 10B at its tip in the extension direction, for example. Specifically, a terminal portion 36 is provided at the tip of the extension portion 35, which is located away from the first electronic component 10A. The second electronic component 10B is connected to the terminal portion 36 of the extension portion 35. In Figures 1 and 2, the second electronic component 10B is located above (towards the +Z direction) the tip of the extension portion 35 when it is connected to the terminal portion 36 of the extension portion 35. Note that the position of the second electronic component 10B relative to the tip of the extension portion 35 is not limited to the above example. Also, the configuration of the connection of the second electronic component 10B to the tip of the extension portion 35 is not limited to the configuration described above. As described above, the second electronic component 10B connected to the extension portion 35 is positioned adjacent to the first electronic component 10A. In Figure 1, the second electronic component 10B is positioned on the -Y direction side relative to the first electronic component 10A, but the position of the second electronic component 10B relative to the first electronic component 10A is not limited to the above example. Also, in Figure 1, the second electronic component 10B is positioned at a distance from the first electronic component 10A, but it may, for example, be in contact with the first electronic component 10A.

[0039] The specific form (shape and components) of the second busbar 30B is not limited to the above and may be arbitrary.

[0040] (Third bus bar) As shown in Figure 2, the third busbar 30C has a third mounting hole 37h. The third busbar 30C is fixed to the second terminal 13B of the first electronic component 10A by a second fastening member 41B (fastening member 41) inserted into the third mounting hole 37h. With this configuration, the third busbar 30C is electrically connected to the first electronic component 10A. The third busbar 30C electrically connects the first electronic component 10A to other electronic components or other busbars (not shown). In this embodiment, the third busbar 30C is formed in a plate shape. The thickness dimension of the third busbar 30C in this embodiment is the same as the thickness dimension of the first busbar 30A. However, the thickness dimension of the third busbar 30C may be different from the thickness dimension of the first busbar 30A. A current of the same voltage (high voltage) as that of the first busbar 30A flows through the third busbar 30C.

[0041] The third busbar 30C includes, for example, a connecting portion 37 and an extension portion 38. In this embodiment, the entire third busbar 30C, including the connecting portion 37 and the extension portion 38, is formed from a single plate material. The connecting portion 37 and the extension portion 38 of the third busbar 30C are each formed in a flat plate shape.

[0042] The connection portion 37 of the third busbar 30C is the portion that connects to the second terminal 13B of the first electronic component 10A. The connection portion 37 is a plate portion with the X direction as the thickness direction and along the Y and Z directions. The connection portion 37 includes a portion that overlaps with the first electronic component 10A in the X direction. From another viewpoint, the connection portion 37 includes a portion that overlaps with the second fastening member 41B, which is inserted into the mounting hole 13h of the second terminal 13B, when viewed from the X direction.

[0043] The connection portion 37 includes a third mounting hole 37h. The third mounting hole 37h is, for example, a through hole that penetrates the connection portion 37 in the X direction. The third mounting hole 37h does not have, for example, a screw thread. The third mounting hole 37h faces the mounting hole 13h of the first electronic component 10A in the X direction. A second fastening member 41B is inserted into the third mounting hole 37h in the X direction. The second fastening member 41B, passed through the third mounting hole 37h, engages with the mounting hole 13h of the second terminal 13B of the first electronic component 10A. With this configuration, the connection portion 37 of the third busbar 30C and the second terminal 13B of the first electronic component 10A are physically and electrically connected (see Figure 1). Also, the connection portion 37 of the third busbar 30C overlaps the front surface 11f of the first electronic component 10A (see Figure 1).

[0044] The extension portion 38 extends from the edge of the connection portion 37 when viewed from the X direction. The extension portion 38 extends away from the first electronic component 10A when the connection portion 37 of the third busbar 30C is fixed to the first electronic component 10A. In this embodiment, the extension portion 38 extends in the -Y direction from the -Y direction end of the connection portion 37. The extension portion 38 also extends along the first side surface 11l of the first electronic component 10A. The second extension portion 33 extends in the -Y direction away from the second side surface 11r of the first electronic component 10A. The extension portion 38, like the connection portion 37, is a plate portion with the X direction as the thickness direction and along the Y and Z directions. That is, the entire third busbar 30C, including the connection portion 37 and the extension portion 38, is formed as a single flat plate.

[0045] The specific form (shape and components) of the third busbar 30C is not limited to the above and may be arbitrary.

[0046] <4. Heat dissipation section> The heat dissipation section 40 is responsible for dissipating heat from the first electronic component 10A. As shown in Figure 2, the heat dissipation section 40 is integrally formed with the second busbar 30B. Specifically, the heat dissipation section 40 is made of a single plate material together with the second busbar 30B. That is, the heat dissipation section 40 is formed in a plate shape. In this embodiment, the heat dissipation section 40 is integrally formed with the connection section 34 of the second busbar 30B. The thickness of the heat dissipation section 40, which is integrally formed with the second busbar 30B, is the same as the thickness of the second busbar 30B and smaller than the thickness of the first busbar 30A.

[0047] The heat dissipation section 40 overlaps the surface of the first electronic component 10A. Furthermore, by bending the plate material that constitutes the second busbar 30B and the heat dissipation section 40, the plate-shaped second busbar 30B and the heat dissipation section 40 overlap the two surfaces of the first electronic component 10A, which are adjacent to each other and facing in different directions. Specifically, the connection portion 34 of the second busbar 30B overlaps the front surface 11f of the first electronic component 10A, and the heat dissipation section 40 connected to the connection portion 34 of the second busbar 30B overlaps the first side surface 11l of the first electronic component 10A adjacent to the front surface 11f (see Figure 1). In other words, the heat dissipation section 40 extends along the first side surface 11l of the first electronic component 10A. In Figure 1, the heat dissipation section 40 is positioned at a distance from the first side surface 11l of the first electronic component 10A in the X direction, but it may also be in contact with the first side surface 11l, for example.

[0048] As shown in Figure 1, the heat dissipation portion 40, which overlaps the first side surface 11l of the first electronic component 10A, is located in the X direction between the first side surface 11l of the first electronic component 10A and the first extension portion 32 of the first busbar 30A. Furthermore, both the heat dissipation portion 40 and the first extension portion 32 extend along the first side surface 11l of the first electronic component 10A. With the heat dissipation portion 40 and the first extension portion 32 positioned in this way, the first extension portion 32 of the first busbar 30A extends along the heat dissipation portion 40. In Figure 1, the first extension portion 32 is parallel to the heat dissipation portion 40, but it may be inclined with respect to the heat dissipation portion 40, for example. The first extension portion 32 is positioned at a distance from the heat dissipation portion 40 in the X direction. In Figure 1, the distance between the first side surface 11l of the first electronic component 10A and the heat dissipation portion 40 is smaller than the distance between the heat dissipation portion 40 and the first extension portion 32.

[0049] In the electrical connection unit 1 of this embodiment, configured as described above, a high-voltage current (e.g., 48V or higher) flows through the first electronic component 10A and the first and third busbars 30A and 30C. These first electronic component 10A and the first and third busbars 30A and 30C constitute a high-voltage circuit through which a high-voltage current flows. On the other hand, a low-voltage current (e.g., less than 48V) flows through the second electronic component 10B and the second busbar 30B. The second electronic component 10B and the second busbar 30B constitute a low-voltage circuit that branches off from the high-voltage circuit including the first electronic component 10A and the first busbar 30A with a low-voltage current.

[0050] <5. Advantages> As described above, in the electrical connection unit 1 of this embodiment, the heat dissipation section 40 is integrally formed with the second busbar 30B (second wiring member), which promotes heat dissipation of the first electronic component 10A without increasing the number of components fixed to the same terminal 13 (first terminal 13A) of the first electronic component 10A by the fastening member 41 (first fastening member 41A). In addition, the heat from the first electronic component 10A is transferred from the terminal 13 (first terminal 13A) to the heat dissipation section 40 via the second busbar 30B, thereby promoting heat dissipation of the first electronic component 10A.

[0051] In this embodiment, the heat dissipation section 40 is integrally formed with the connection section 34 (first portion) of the second busbar 30B, which is located closer to the terminal 13 (first terminal 13A) than the extension section 35 (second portion). With this configuration, the heat dissipation section 40 can efficiently dissipate heat from the first electronic component 10A compared to the case where the heat dissipation section 40 is integrally formed with the extension section 35.

[0052] In this embodiment, the plate-shaped heat dissipation section 40 overlaps the surface (first side surface 11l) of the first electronic component 10A, thereby reducing the volume of the portion of the electrical connection unit 1 that includes the first electronic component 10A and the heat dissipation section 40. This configuration makes it possible to miniaturize the electrical connection unit 1.

[0053] In this embodiment, the first busbar 30A includes a first extension portion 32 that extends along the heat dissipation portion 40, and the first extension portion 32 is positioned at a distance from the heat dissipation portion 40. With this configuration, heat can be efficiently dissipated from the heat dissipation portion 40 into the air compared to the case where the first extension portion 32 is positioned without a distance from the heat dissipation portion 40. Therefore, the heat dissipation performance of the first electronic component 10A can be improved.

[0054] In this embodiment, the first busbar 30A and the second busbar 30B are formed in a plate shape, and the thickness dimension of the plate material constituting the second busbar 30B and the heat dissipation section 40 is smaller than the thickness dimension of the first busbar 30A. With this configuration, the axial force loss of the fastening member 41 (first fastening member 41A) that fastens the first busbar 30A and the second busbar 30B together can be kept small compared to the case where the thickness dimension of the plate material constituting the second busbar 30B and the heat dissipation section 40 is the same as the thickness dimension of the first busbar 30A (when the thickness dimension of the second busbar 30B is larger).

[0055] In this embodiment, the first electronic component 10A has a front surface 11f (first surface) and a first side surface 11l (second surface) that are adjacent to each other and facing in different directions, and a corner located between the front surface 11f and the first side surface 11l. Furthermore, the thickness dimension of the plate material constituting the second busbar 30B and the heat dissipation section 40 is smaller than the thickness dimension of the plate-shaped first busbar 30A. By bending the plate material constituting the second busbar 30B and the heat dissipation section 40, the second busbar 30B (connecting section 34) overlaps the front surface 11f of the first electronic component 10A, and the heat dissipation section 40 overlaps the first side surface 11l of the first electronic component 10A. Because the thickness of the plate material constituting the second busbar 30B and the heat dissipation section 40 is smaller than the thickness of the first busbar 30A, the radius of curvature of the bent portion when the plate material constituting the second busbar 30B and the heat dissipation section 40 is bent can be reduced. With this configuration, the bent portion of the plate material constituting the second busbar 30B and the heat dissipation section 40 can be positioned closer to the corner of the first electronic component 10A. In addition, the second busbar 30B (connection section 34) can be positioned closer to the front surface 11f of the first electronic component 10A, and the heat dissipation section 40 can be positioned closer to the first side surface 11l of the first electronic component 10A. As a result, the volume of the portion of the electrical connection unit 1 that includes the first electronic component 10A, the second busbar 30B, and the heat dissipation section 40 can be kept small. Therefore, the electrical connection unit 1 can be miniaturized.

[0056] In this embodiment, the first electronic component 10A has a front surface 11f (first surface) and a bottom surface 11u (second surface) that are adjacent to each other and facing in different directions, and a corner located between the front surface 11f and the bottom surface 11u. Furthermore, the thickness dimension of the plate-shaped second busbar 30B is smaller than the thickness dimension of the plate-shaped first busbar 30A. By bending the second busbar 30B, the second busbar 30B overlaps both the front surface 11f and the bottom surface 11u of the first electronic component 10A. Specifically, the connecting portion 34 (first portion) of the second busbar 30B overlaps the front surface 11f of the first electronic component 10A, and the extended portion 35 (second portion) of the second busbar 30B overlaps the bottom surface 11u of the first electronic component 10A. Because the thickness of the second busbar 30B is smaller than that of the first busbar 30A, the radius of curvature of the bent portion when the second busbar 30B is bent can be reduced. With this configuration, the bent portion of the second busbar 30B can be positioned closer to the corner of the first electronic component 10A. In addition, the second busbar 30B can be positioned closer to both the front surface 11f and the bottom surface 11u of the first electronic component 10A. As a result, the volume of the portion of the electrical connection unit 1 that includes the first electronic component 10A and the second busbar 30B can be kept small. Therefore, the electrical connection unit 1 can be made smaller.

[0057] Furthermore, in this embodiment, the connection portion 34 (first part) of the second busbar 30B is located between the front surface 11f (first surface) of the first electronic component 10A and the first busbar 30A (connection portion 31). That is, the connection portion 34 (first part) of the second busbar 30B is located closer to the front surface 11f (first surface) of the first electronic component 10A than the first busbar 30A. With this configuration, the bent extended portion 35 (second portion) of the second busbar 30B can be positioned closer to the lower surface 11u (second surface) of the first electronic component 10A. Furthermore, the bent heat dissipation portion 40 of the second busbar 30B can be positioned closer to the first side surface 11l (second surface) of the first electronic component 10A. Therefore, the electrical connection unit 1 can be further miniaturized.

[0058] <6. Variation> In the above-described embodiment, for example, as shown in Figure 3, the heat dissipation portion 40 may be integrally formed with the extended portion 35 (second part) of the second busbar 30B. In the configuration shown in Figure 3, the heat dissipation portion 40 is integrally formed with the base end portion 351 of the extended portion 35 of the second busbar 30B that overlaps the lower surface 11u of the first electronic component 10A. Also, in the configuration shown in Figure 3, similar to the above embodiment, the heat dissipation portion 40 overlaps with the first side surface 11l of the first electronic component 10A adjacent to the lower surface 11u. Even with such a configuration, the same effects as in the above embodiment are achieved.

[0059] In the above-described embodiment, the first electronic component 10A may have, for example, a curved surface. Furthermore, the heat dissipation section 40, the first busbar 30A, and the second busbar 30B may overlap the curved surface of the first electronic component 10A. The portions of the heat dissipation section 40, the first busbar 30A, and the second busbar 30B that overlap the curved surface of the first electronic component 10A may be formed, for example, in a shape that conforms to the curved surface (i.e., a curved shape).

[0060] One embodiment and its variations have been described above. However, the embodiments and variations are not limited to the examples described above. For example, the embodiments and variations may be implemented in combination with each other. [Explanation of Symbols]

[0061] 1. Electrical connection unit 10 Electronic Components 10A 1st electronic parts 10B Second electronic component 11f Front (first surface) 11l First side (second surface) 11u bottom surface (second surface) 13 terminals 13A first terminal 30A First busbar (first cable material) 30B Second busbar (second cable guide) 31h First mounting hole 32 First extension section 34. Connection section (first part) 34h Second mounting hole 35 Stretching part (second part) 40 Heat dissipation part 41 Fastening members

Claims

1. A first electronic component having terminals, A first cable member having a first mounting hole and fixed to the terminal by a fastening member inserted into the first mounting hole, A second cable member having a second mounting hole, the fastening member being inserted into the second mounting hole and fastened together with the first cable member, An electrical connection unit comprising a heat dissipation section integrally formed with the second cable member.

2. The system further comprises a second electronic component that is electrically connected to the first electronic component, The second cable member has a first portion having the second mounting hole and a second portion extending from the first portion and connected to the second electronic component, The heat dissipation section is integrally formed with the first portion. The electrical connection unit according to claim 1.

3. The heat dissipation portion is formed in a plate shape and overlaps the surface of the first electronic component. The electrical connection unit according to claim 1 or claim 2.

4. The first cable member includes a first extension portion that extends along the heat dissipation portion, The first extension portion is positioned at a distance from the heat dissipation portion. The electrical connection unit according to claim 3.

5. The first electronic component has a first surface and a second surface that are adjacent to each other and facing in different directions, and a corner located between the first surface and the second surface. The first cable member is formed in a plate shape, The second cable guide and the heat dissipation section are made of a single plate material with a thickness smaller than that of the first cable guide. By bending the plate material, the second wiring material overlaps the first surface, and the heat dissipation portion overlaps the second surface. The electrical connection unit according to claim 1 or claim 2.

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