electronic machines

Abstract

To provide electronic equipment that can reduce component costs. [Solution] The electronic device comprises a housing member, a substrate having a first surface and a second surface and having mounting holes that penetrate in the thickness direction, a support surface that supports the first surface of the substrate, a boss portion provided to protrude from the inner surface side of the housing member and having screw holes through which screws passed from the second surface side toward the first surface side are tightened, a stud component mounted on the second surface of the substrate so as to cover the mounting holes and having through holes arranged coaxially with the screw holes and through which the screws pass, and a substrate fixing component fixed to the stud component by screws tightened into the screw holes.

Description

Technical Field

[0001] The present invention relates to an electronic device provided with a substrate.

Background Art

[0002] An electronic device such as a notebook PC mounts a substrate on which components such as a CPU and connectors are mounted. In many cases, the substrate is screwed to a housing member or a keyboard device supported by the housing member. On the surface of the substrate, components such as brackets for holding electronic components connected to the connectors are fixed. For example, Patent Document 1 discloses a configuration in which this component is screwed to a stud component mounted on the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] [[ID=于34]]<于 [[ID=于35]]Conventionally, dedicated stud components have been mounted on the substrate to screw the above components. That is, the substrate is deprived of mounting space by the number of mounted stud components. For this reason, conventionally, it has been necessary to increase the substrate area according to the number of mounted stud components, and the component cost has increased. [[ID=于36]]<于 [[ID=于37]]<于

[0005] [[ID=于38]]<于 [[ID=于39]]The present invention has been made in consideration of the above problems of the prior art, and an object thereof is to provide an electronic device capable of reducing component costs. [[ID=于40]]<于 [[ID=于41]]

Means for Solving the Problems

[0006] [[ID=于45]]<于 It should be noted that there are some unclear symbols in the original text (such as "<于 " etc.), and the translation is based on the best understanding. If there are specific requirements or corrections for these unclear parts, it may need to be adjusted accordingly.An electronic device according to one aspect of the present invention comprises a housing member, a substrate having a first surface and a second surface and provided with mounting holes penetrating in the thickness direction, a support surface that supports the first surface of the substrate, a boss portion provided to protrude from the inner surface side of the housing member and having screw holes through which screws passed from the second surface side toward the first surface side are tightened, a stud component mounted on the second surface of the substrate so as to cover the mounting holes and having through holes arranged coaxially with the screw holes and through which the screws pass, and a substrate fixing component fixed to the stud component by screws tightened into the screw holes. [Effects of the Invention]

[0007] According to the above-described embodiment of the present invention, component costs can be reduced. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic plan view of an electronic device according to one embodiment, viewed from above. [Figure 2] Figure 2 is a schematic plan view showing the internal structure of the enclosure. [Figure 3] Figure 3 is a schematic side cross-sectional view of the fastening structure. [Figure 4] Figure 4 is an exploded view of the fastening structure shown in Figure 3. [Figure 5] Figure 5 is a schematic side cross-sectional view of a modified fastening structure. [Figure 6] Figure 6 is a schematic side cross-sectional view of a fastening structure relating to another modified example. [Figure 7] Figure 7 is a schematic side cross-sectional view showing the fixing structure of the substrate and substrate fixing component according to the comparative example. [Modes for carrying out the invention]

[0009] Hereinafter, preferred embodiments of the electronic device according to the present invention will be described in detail with reference to the attached drawings.

[0010] Figure 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in Figure 1, the electronic device 10 in this embodiment is a clamshell-type notebook PC. The electronic device 10 has a configuration in which a lid 11 and a housing 12 are connected by a hinge 14 so that they can rotate relative to each other. In this embodiment, a notebook PC electronic device 10 is used as an example, but the electronic device may be other than a notebook PC, for example, a desktop PC, a display device, a tablet PC, a smartphone, or a portable game console.

[0011] The lid 11 is a thin, flat, box-shaped enclosure. The lid 11 houses a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0012] The enclosure 12 is a thin, flat box. The keyboard device 18 and touchpad 19 face the top surface (surface 12a) of the enclosure 12. Hereinafter, the enclosure 12 and each component mounted thereon will be described using the operator's posture when operating the keyboard device 18 as the reference point, with the width direction (left and right) of the enclosure 12 being referred to as the X1 and X2 directions, the depth direction (front and back) of the enclosure 12 being referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the enclosure 12 being referred to as the Z1 and Z2 directions. The X1 and X2 directions may also be collectively referred to as the X direction, and similarly, the Y1 and Y2 directions and the Z1 and Z2 directions may be referred to as the Y direction and Z direction. For the sake of explanation, the Z1 direction may also be referred to as down and the opposite direction (Z2 direction) as up in the thickness direction of the enclosure 12 (see Figure 3, etc.). These directions are defined for the sake of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0013] The housing 12 is composed of a housing member 20 that forms the top surface and the four sides, and a cover material 21 that forms the bottom surface. The housing member 20 has vertical walls 20B formed on the four edges of a cover plate 20A that forms the surface 12a of the housing 12. As a result, the housing member 20 has a roughly bathtub shape with an open bottom. The cover material 21 has a roughly flat shape and serves as a lid that closes the bottom opening of the housing member 20. The housing member 20 and the cover material 21 are overlapped in the thickness direction and are detachably connected to each other. The vertical walls 20B may also be formed on the cover material 21. In this case, the housing member 20 may consist only of the cover plate 20A.

[0014] The hinge 14 is installed in a concave hinge arrangement groove 12b formed on the rear edge of the housing 12, connecting the housing 12 and the lid 11. The hinge 14 has a structure in which, for example, a hinge shaft that serves as the axis of rotation is supported at both ends in the longitudinal direction of the hinge housing.

[0015] Figure 2 is a schematic plan view showing the internal structure of the housing 12. Figure 2 is a view of the inside of the housing member 20 from the bottom side after removing the cover material 21.

[0016] As shown in Figure 2, the housing 12 contains a thermal module 24, a circuit board 25, and a battery device 26. Various other electronic and mechanical components are also installed inside the housing 12.

[0017] The circuit board 25 is the main board (motherboard) of the electronic device 10. The circuit board 25 is located near the Y2 side of the enclosure 12 and extends in the X direction. The battery device 26 is a rechargeable battery that powers the electronic device 10. The battery device 26 is located near the Y1 side of the circuit board 25 and extends in the X direction.

[0018] The substrate 25 of this embodiment mounts a CPU (Central Processing Unit) 25a. In addition to the CPU 25a, the substrate 25 can mount various electronic components such as a GPU. For example, the first surface 25A on the Z1 side of the substrate 25 serves as an attachment surface to the housing member 20 and the keyboard device 18, and the second surface 25B on the Z2 side serves as a mounting surface for the CPU 25a and the like. The first surface 25A of the substrate 25 is fixed to the inner surface (Z2 side surface) of the housing member 20 using, for example, screws 27. Furthermore, the first surface 25A is also fixed to the bottom surface (Z2 side surface) of the keyboard device 18 using a fastening structure 52 described later.

[0019] The thermal module 24 can absorb and diffuse the heat generated by the CPU 25a, which is a heat-generating body, and discharge it outside the housing 12. The thermal module 24 may be configured to cool heat-generating bodies other than the CPU 25a, such as a GPU. As shown in FIG. 2, the thermal module 24 can include a heat diffusion member 32 including a metal plate 30, a pressing component 34, and a pair of left and right fans 36, 36.

[0020] The heat diffusion member 32 can absorb and diffuse the heat of the CPU 25a. The heat diffusion member 32 is provided so as to cover a part of the second surface 25B of the substrate 25 together with the CPU 25a. The metal plate 30 is a thin metal plate-shaped member formed of a material with high thermal conductivity such as copper or aluminum. The metal plate 30 of this embodiment is a copper plate. The heat diffusion member 32 can laminate a heat transport device such as a heat pipe or a vapor chamber on the Z1 side surface of the metal plate 30. The heat pipe is formed by flattening a metal pipe thinly into an elliptical cross-section and enclosing a working fluid in the inner sealed space. The vapor chamber is formed by enclosing a working fluid in a sealed space formed between two metal plates.

[0021] The pressing component 34 is a component for pressing the heat diffusion member 32 against the CPU 25a. The pressing component 34 constantly biases the heat diffusion member 32 toward the second surface 25B of the substrate 25. The pressing component 34 has a pair of leaf spring members 34a, 34a in the Y direction. The leaf spring members 34a are connected, for example, to a thin metal frame whose central portion is fixed to the Z1 side of the heat diffusion member 32, and press the heat diffusion member 32 against the CPU 25a via this metal frame. This metal frame is provided so as to surround the CPU 25a inside the frame and is fixed to the Z1 side surface of the heat diffusion member 32 by soldering or the like. Both ends of each leaf spring member 34a are fastened and fixed to a stud component 42 mounted on the second surface 25B of the substrate 25 using screws 44. The stud component 42 has a female screw hole into which the screws 44 can be fastened and protrudes from the second surface 25B.

[0022] As shown in Figure 2, the left and right fans 36 are arranged side by side in the X direction, straddling the heat diffusion member 32 between them, and facing each other. Each fan 36 has an outlet 36b on a side 36a facing each other. The outlets 36b of the left and right fans 36 face each other with the heat diffusion member 32 in between. This allows each fan 36 to discharge air toward the thermal module 24. Each fan 36 has an intake port 36c on at least the Z2 side end face of the upper and lower end faces facing the Z direction. An intake port 36c can also be provided on the Z1 side end face. The intake port 36c can draw in outside air (cold air) from, for example, a vent formed on the bottom surface of the housing 12. The fan 36 can be a centrifugal fan in which an impeller housed inside the housing is rotated by a motor. The fan 36 can discharge air drawn in from the intake port 36c through the outlet port 36b.

[0023] The housing 12 is provided with an exhaust port 46 formed in the vertical wall 20B of its rear edge (Y2 side edge). The exhaust port 46 is a vent that can discharge air (warm air) that has been discharged from the discharge port 36b of each fan 36 and flowed around the substrate 25 and thermal module 24 to the outside of the housing 12. Multiple fins are formed upright on the Z2 side surface 30a of the metal plate 30 to increase the heat exchange area.

[0024] As shown in Figure 2, the second surface 25B of the substrate 25 is mounted with, for example, a connector 25b, an electronic component 25c, and an external connection port 25d.

[0025] The connector 25b is connected to the cable 48. The cable 48 is provided in pairs, for example, one on the left and one on the right. One cable 48 is, for example, wiring that connects the display 16 mounted on the cover 11 to the circuit board 25. The other cable 48 is, for example, wiring that connects the camera 17 (see Figure 1) mounted on the cover 11 to the circuit board 25. Each cable 48 can be made of, for example, a flexible printed circuit board (FPC). The connector 25b is a so-called BtoB connector (board-to-board connector). The connector 25b is provided in pairs, one on the left and one on the right, to correspond to the left and right cables 48. The connector 25b can be provided, for example, near both ends of the leaf spring member 34a on the Y2 side.

[0026] The connection between the cable 48 and the connector 25b is held in place by a bracket 50. The bracket 50 can be made of a metal plate, such as stainless steel (SUS). As shown in Figure 2, the left and right brackets 50 can be used by arranging identical parts symmetrically. The bracket 50 is positioned to straddle the cable 48 in the width direction and holds the cable 48 by pressing it down from above the connector 25b. This prevents the cable 48 from coming loose from the connector 25b. One end of the bracket 50 in the direction that straddles the cable 48 (X direction) is fixed to the base plate 25 using a fastening structure 52, which will be described later. The other end of the bracket 50 is supported, for example, by the end of the leaf spring member 34a on the Y2 side. The fastening structure 52 may also be applied to the other end of the bracket 50.

[0027] The electronic component 25c is, for example, a communication module compatible with SSDs or WWANs. The electronic component 25c is connected to the circuit board 25 via a connector 25c1. The end of the electronic component 25c opposite to the connector 25c1 is fixed to the second surface 25B with a screw 25c2. The external connection port 25d is an I / O port such as USB or LAN. The external connection port 25d is integrally provided on a metal bracket fixed to the second surface 25B with a screw 25d1, for example.

[0028] As shown in Figure 2, the battery device 26 may have mounting pieces 26a protruding from the edge on the Y2 side. For example, a pair of mounting pieces 26a are provided on the left and right sides. The mounting pieces 26a are positioned on top of the second surface 25B of the substrate 25 and are fixed to the substrate 25 using a fastening structure 52 similar to that of the bracket 50. The edge of the battery device 26 on the Y1 side is connected to the housing member 20 by, for example, a hook structure.

[0029] Next, the fastening structure 52 will be described.

[0030] Figure 3 is a schematic side cross-sectional view of the fastening structure 52. Figure 4 is an exploded view of the fastening structure 52 shown in Figure 3.

[0031] As shown in Figures 2 and 3, the fastening structure 52 can integrally fix the circuit board 25 to the keyboard device 18 supported by the housing member 20 and fix predetermined components to the circuit board 25. The components fixed to the circuit board 25 are, for example, the bracket 50 and the mounting piece 26a (battery device 26). Hereinafter, such components may be collectively referred to as "circuit board fixing components 53".

[0032] The keyboard device 18 occupies a large area on the inner surface of the housing member 20. The keyboard device 18 has a metal base plate 18a that supports, for example, keycaps, a scissor mechanism, a rubber dome, and a membrane sheet (see Figure 3). In this embodiment, a fastening structure 52 is provided that fixes the substrate 25 to the base plate 18a.

[0033] The fastening structure 52 can also be used to directly fix the substrate 25 to the inner surface of the housing member 20. In this case, for example, as shown by the reference numerals 20 and 20A in parentheses in Figure 3, the fastening structure 52 may be applied to the cover plate 20A of the housing member 20 instead of the base plate 18a. The object to which the substrate (substrate 25) is fixed by the fastening structure 52 may be a member other than the housing member 20 or the keyboard device 18, such as a predetermined metal bracket supported by the housing member 20.

[0034] As shown in Figures 3 and 4, the fastening structure 52 comprises a boss portion 54, a stud component 56, and a screw 58.

[0035] The boss portion 54 is provided so as to protrude in the Z2 direction on the inner surface side of the housing member 20. The boss portion 54 is a part for fixing the substrate 25 to the base plate 18a. The boss portion 54 can be made up of a cylindrical member that stands upright from the base plate 18a toward the substrate 25 side (Z2 side). The boss portion 54 may be fixed to the base plate 18a by screws or welding, or it may be formed integrally with the base plate 18a. If the housing member 20 is provided with the boss portion 54, if the housing member 20 is made of metal, it may be formed integrally with the housing member 20. If the housing member 20 is made of resin, it is preferable to use an insert nut. Of the multiple fastening structures 52, some of the boss portions 54 may be provided on the keyboard device 18, and other boss portions 54 may be provided on the housing member 20.

[0036] The boss portion 54 may have a support surface 54a, a protruding portion 54b, and a screw hole 54c.

[0037] The support surface 54a is the surface that supports the first surface 25A of the substrate 25. The support surface 54a is a flange-shaped portion formed in a ring shape around the protrusion 54b and the screw hole 54c. The support surface 54a is preferably brought into contact with the ground pattern 60a provided on the first surface 25A. This makes it easy to frame-gland the substrate 25. The ground pattern 60a is formed in a ring shape surrounding the mounting hole 25C of the substrate 25. The mounting hole 25C is a through hole that penetrates the substrate 25 in the thickness direction.

[0038] The protruding portion 54b is a cylindrical part that protrudes upward (towards Z2) from the center of the support surface 54a. The protruding portion 54b is passed through the mounting hole 25C. In the configuration example shown in Figure 3, the protruding portion 54b extends through the mounting hole 25C to the second surface 25B side.

[0039] The screw hole 54c is a hole into which the screw 58 is tightened, and an internal thread is formed on its inner circumferential surface. The screw hole 54c is located inside the projection 54b and opens at the top surface (projecting end face 54b1) of the projection 54b. The depth of the screw hole 54c should be sufficient to securely tighten the screw 58. In the example configuration shown in Figure 3, the screw hole 54c extends from the projecting end face 54b1 to approximately the middle of the height of the boss portion 54.

[0040] The stud component 56 is a component for connecting the substrate fixing component 53 to the substrate 25. The stud component 56 is mounted on the second surface 25B of the substrate 25 and can be made up of a cylindrical metal component that rises up from the second surface 25B toward the Z2 side. The stud component 56 is fixed to the ground pattern 60b provided on the second surface 25B by soldering or the like. The ground pattern 60b is formed in a ring shape surrounding the mounting hole 25C.

[0041] The stud component 56 may have a through hole 56a, a fixing surface 56b, and a relief hole 56c.

[0042] The through hole 56a is located coaxially with the screw hole 54c and is a through hole in the Z direction through which the screw 58 passes. The inner diameter of the through hole 56a is smaller than the head 58a of the screw 58 and larger than the threaded portion (shaft portion) 58b.

[0043] The fixing surface 56b is the surface that supports the substrate fixing component 53. The fixing surface 56b is a flange-shaped portion provided on the top surface of the stud component 56 and is formed to be lower than the peripheral edge of the through hole 56a. The substrate fixing component 53 has, for example, a fixing hole 53a. The fixing hole 53a is a hole that penetrates the plate-shaped bracket 50 or mounting piece 26a in the thickness direction. The central part of the top surface of the stud component 56 is inserted into the fixing hole 53a. The peripheral edge of the fixing hole 53a of the substrate fixing component 53 is placed on the fixing surface 56b. As a result, the substrate fixing component 53 is sandwiched between the head 58a and the fixing surface 56b and fixed to the stud component 56 and the substrate 25.

[0044] The relief hole 56c is a concave hole formed on the fixing surface (Z1 side) of the stud component 56 relative to the second surface 25B, and is coaxially connected to the through hole 56a. The inner diameter of the relief hole 56c is larger than that of the through hole 56a, and is also larger than the outer diameter of the projection 54b. The depth of the relief hole 56c is greater than the projection height of the projection 54b from the second surface 25B. As a result, the upper part (Z2 side portion) of the projection 54b, including the projection end face 54b1, is inserted into the relief hole 56c, preventing interference with the stud component 56.

[0045] Next, a procedure for fixing the substrate 25 and the substrate fixing component 53 using the fastening structure 52 will be described.

[0046] As shown in Figures 3 and 4, first the stud component 56 is mounted on the second surface 25B of the substrate 25 via the ground pattern 60b. The mounting of the stud component 56 can be performed by reflow at the same time as other components mounted on the substrate 25 (e.g., the CPU 25a).

[0047] Next, the circuit board 25 on which the stud components 56 are mounted is fixed to the keyboard device 18 and the housing member 20. The boss portion 54 has its protruding portion 54b passed through the mounting hole 25C and its support surface 54a in contact with the first surface 25A (ground pattern 60a). Following this, the circuit board 25 is fixed to the housing member 20 with screws 27 (see Figure 2).

[0048] The circuit board fixing component 53 is placed on the fixing surface 56b of the stud component 56. Next, the screw 58 is tightened into the screw hole 54c. The screw 58 is tightened into the screw hole 54c by inserting the threaded portion 58b through the fixing hole 53a and the through hole 56a. As a result, the circuit board fixing component 53 is fastened to the stud component 56 by the screw 58, and the circuit board fixing component 53 is fixed to the circuit board 25 on the second surface 25B side. At the same time, the circuit board 25 and the stud component 56 mounted on it are also fastened to the boss portion 54 by the screw 58. In other words, the circuit board 25 and the circuit board fixing component 53 are fixed to the keyboard device 18. As a result, the circuit board 25 and the circuit board fixing component 53 are fixed to the housing member 20 by a fastening structure 52 using a single screw 58.

[0049] As described above, the electronic device 10 of this embodiment comprises a housing member 20 and a substrate 25 provided with mounting holes 20C. Furthermore, the electronic device 10 comprises a boss portion 54, a stud component 56, and a substrate fixing component 53. The boss portion 54 has a support surface 54a that supports the first surface 25A of the substrate 25 and a screw hole 54c through which a screw 58 passed from the second surface 25B side toward the first surface 25A side is tightened, and is provided so as to protrude from the inner surface side of the housing member 20. The stud component 56 is arranged coaxially with the screw hole 54c and has a through hole 56a through which a screw 58 passes, and is mounted on the second surface 25B so as to cover the mounting holes 25C. The substrate fixing component 53 is fixed to the stud component 56 by a screw 58 tightened through the screw hole 54c.

[0050] Thus, the electronic device 10 integrates a boss portion 54 that directly or indirectly fixes the circuit board 25 to the housing member 20, and a stud portion 56 that fixes the circuit board fixing component 53 to the circuit board 25. In other words, the fastening structure 52 uses the mounting holes 25C and screws 58 that fix the circuit board 25 to the housing member 20, etc., for the fixing of the circuit board fixing component 53 to the circuit board 25. As a result, the circuit board 25 does not need to secure a dedicated mounting space for the stud portion 56. That is, the fastening structure 52 can fix the circuit board fixing component 53 using the dead space above the boss portion 54. As a result, the electronic device 10 can reduce the area of ​​the circuit board 25, reduce component costs, and also become lighter. Because the circuit board 25 is smaller and there is more space inside the housing 12, the electronic device 10 can also increase the capacity of the thermal module 24 and make the housing 12 smaller. The housing member to which the fastening structure 52 is applied may also be a member that makes up the bottom surface of the housing 12.

[0051] In the electronic device 10, a through-hole 56a of the stud component 56 is positioned above the screw hole 54c. This ensures that after the screw 58 is removed from the screw hole 54c, the threaded portion 58b catches on the through-hole 56a, holding it in place and preventing it from easily falling out. As a result, the worker can easily grasp the screw 58 with their fingertips and pull it up. Thus, the through-hole 56a also functions as a gripping point for holding the screw 58 after it has been removed from the screw hole 54c.

[0052] The boss portion 54 may have a projection 54b that protrudes from the support surface 54a and passes through the mounting hole 30C, with a screw hole 54c opening at its protruding end face 54b1. This makes it easy to form a screw hole 54c with a depth that allows for more secure tightening of the screw 58. In other words, the projection 54b can extend the depth of the screw hole 54c. In this case, the height of the boss portion 54 can also be reduced, as shown in Figure 5.

[0053] Figure 5 is a schematic side cross-sectional view of a modified fastening structure 52A. The fastening structure 52A shown in Figure 5 is a configuration example in which the height H1 from the base plate 18a (cover plate 20A) to the first surface 25A of the substrate 25 is lower, compared to the fastening structure 52 shown in Figure 3. In other words, the boss portion 54 of the fastening structure 52A is lower in height than the boss portion 54 of the fastening structure 52 shown in Figure 3. In the fastening structure 52A, the height H2 from the second surface 25B of the substrate 25 to the head 58a of the screw 58 is the same as or approximately the same as the fastening structure 52 shown in Figure 3.

[0054] In this way, the fastening structures 52 and 52A are equipped with protruding portions 54b, which allows for a reduction in the height of the boss portion 54 while ensuring sufficient engagement of the screw 58. As a result, the height H1 from the base plate 18a (cover plate 20A) to the substrate 25 of the electronic device 10 can be reduced, enabling further thinning of the housing 12.

[0055] The protruding portion 54b can be omitted, or it can be configured to a height that does not penetrate the mounting hole 25C. In this case, the height of the stud component 56 can also be reduced, as shown in Figure 6.

[0056] Figure 6 is a schematic side cross-sectional view of a fastening structure 52B according to another modified example. Compared to the fastening structure 52 shown in Figure 3, the fastening structure 52B shown in Figure 6 is an example of a configuration in which the protruding portion 54b is eliminated and the height H2 from the second surface 25B to the head 58a of the screw 58 is made lower, by H2a. In other words, the stud component 56 of the fastening structure 52B does not require a relief hole 56c to accommodate the protruding portion 54b, so its height can be lower than that of the stud component 56 of the fastening structure 52 shown in Figure 3. As shown by the dashed line in Figure 6, the fastening structure 52B may also have a protruding portion 54b that does not penetrate the mounting hole 25C.

[0057] In this way, the fastening structure 52B eliminates the need for a relief hole 56c by omitting the protruding portion 54b or making it lower than the second surface 25B, thereby reducing the height of the stud component 56. On the other hand, even in the fastening structure 52B, by ensuring the height H1 of the boss portion 54, sufficient depth of the screw hole 54c necessary for secure tightening of the screw 58 can be secured. As a result, the electronic device 10 can reduce the height H2 from the substrate 25 to the substrate fixing component 53, enabling further thinning of the housing 12.

[0058] Next, as a comparative example, an example of the fixing structure of the substrate 25 and substrate fixing component 53 according to a conventional configuration will be described. Figure 7 is a schematic side cross-sectional view showing the fixing structure of the substrate 25 and substrate fixing component 53 according to the comparative example.

[0059] In the comparative example shown in Figure 7, the boss portion 70 that fixes the substrate 25 to the base plate 18a (cover plate 20A) and the stud portion 72 that fixes the substrate fixing component 53 to the substrate 25 are located in different positions. Therefore, the substrate 25 is fixed to the boss portion 70 with screws 74, and the substrate fixing component 53 is fixed to the stud portion 72 with screws 76. Consequently, in the configuration shown in Figure 7, the screws 74 and 76 are located in different positions on the substrate 25, occupying a large installation space on the substrate 25.

[0060] Furthermore, the substrate 25 needs to have a hole 78 for the screw 74 and a hole 80 for fitting the stud component 72 at different positions. The hole 80 is a relief hole for extending a part of the stud component 72 in the Z1 direction. The extension of the stud component 72 to the hole 80 is a necessary structure to secure a screw hole 72a of sufficient depth to reliably fasten the screw 76 while suppressing the protrusion height of the stud component 72 from the second surface 25B. The height of the boss portion 70 also needs to be sufficient to secure a screw hole 72a of sufficient depth to reliably fasten the screw 74.

[0061] Therefore, in the comparative example shown in Figure 7, it is necessary to provide two holes 78, 80 and two screws 74, 76 in the substrate 25. For this reason, the area of ​​the substrate 25 needs to be increased. In addition, the height of the boss portion 70 and the stud component 72 must be sufficient to fasten the screws 74, 76, and it is difficult to make it thinner, as shown in the configuration examples in Figures 5 and 6, which will be described later. Furthermore, in the comparative example shown in Figure 7, there is no configuration similar to the through hole 56a, so the screws 74, 76 lose their support immediately after being removed from the screw holes 70a, 72a, resulting in poor workability.

[0062] It should be noted that the present invention is not limited to the embodiments described above, and can be freely modified without departing from the spirit of the invention.

[0063] In the above example, fastening structures 52, 52A, and 52B were used to fix the bracket 50 and the battery device 26, but fastening structures 52, etc. may also be applied to other fastening parts such as screws 25c2, 25d1, 27, 44, etc. [Explanation of Symbols]

[0064] 10 Electronic equipment 11 Lid 12 cabinets 18 Keyboard device 20 Housing components 24 Thermal Modules 25 circuit boards 25a CPU 25c2,25d1,44,58,76 screws 42, 56, 72 Stud parts 52, 52A, 52B fastening structure 53 Circuit board fixing components 54,70 Boss section 54a Support surface 54b Protrusion 56a Through hole 56c Escape Hole

Claims

1. It is an electronic device, Housing components, A substrate having a first surface and a second surface, and provided with mounting holes that penetrate in the thickness direction, The housing member has a support surface that supports the first surface of the substrate, and a screw hole through which a screw passed from the second surface side toward the first surface side is tightened, and a boss portion that protrudes from the inner surface side of the housing member, A stud component is mounted on the second surface of the substrate so as to cover the mounting hole, having a through hole through which the screw passes, and positioned coaxially with the screw hole. A substrate fixing component that is fixed to the stud component by the screw that is tightened into the screw hole, Equipped with An electronic device characterized by the following features.

2. The electronic device according to claim 1, The boss portion has a projection that protrudes from the support surface, passes through the mounting hole, and has a screw hole formed therein. An electronic device characterized by the following features.

3. The electronic device according to claim 2, The aforementioned protrusion extends through the mounting hole onto the second surface of the substrate. The stud component has a relief hole into which the protrusion is inserted, The aforementioned relief hole is coaxial with and communicates with the through hole, and has a larger diameter than the through hole. An electronic device characterized by the following features.

4. An electronic device according to any one of claims 1 to 3, The substrate fixing component includes any of the following: a bracket for holding down a cable connected to a connector mounted on the second surface; a battery device for powering the electronic device; a thermal module for cooling a heat-generating element mounted on the second surface; an electronic component mounted on the second surface; and an external connection port mounted on the second surface. An electronic device characterized by the following features.

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