electronic machines

Abstract

This suppresses changes in the relative position or orientation between two circuit boards. [Solution] An electronic device comprising a first substrate, a second substrate, and a connecting component for connecting the first substrate and the second substrate and for transmitting electrical signals between the first substrate and the second substrate, wherein the second substrate is supported by an electrically insulating clay-like support column relative to the first substrate.

Description

Technical Field

[0001] The present invention relates to an electronic device.

Background Art

[0002] In recent years, electronic devices having a plurality of circuit boards have become widespread. In such an electronic device, for example, it may be necessary to remove one of the plurality of circuit boards from the electronic device. For this reason, various electronic devices that can remove one of the plurality of circuit boards from the electronic device have been proposed conventionally. For example, Patent Document 1 discloses an electronic device in which one circuit board is connected to a board on the main body side of the electronic device by a detachable connection component such as a connector, and the one circuit board can be removed from the electronic device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when two circuit boards are connected by a connection component such as a connector, a relative position or posture change may occur between the two circuit boards due to vibration of the electronic device or the like. And when a relative position or posture change occurs between the two circuit boards, surface damage may occur between the circuit board and the connection component. And due to the surface damage between the circuit board and the connection component, fragments may separate from one or both of the circuit board and the connection component, and a defect may occur in the electronic device due to the separated fragments.

Means for Solving the Problems

[0005] To solve the above problems, the electronic device according to the present invention comprises a first substrate, a second substrate, and a connecting component for connecting the first substrate and the second substrate and transmitting electrical signals between the first substrate and the second substrate, wherein the second substrate is supported by an electrically insulating clay-like support column relative to the first substrate. [Brief explanation of the drawing]

[0006] [Figure 1] This is a perspective view showing an example of the schematic external configuration of an inkjet printer 1 according to the first embodiment of the present invention. [Figure 2] This is a perspective view showing an example of the general external configuration of inkjet printer 1. [Figure 3] This block diagram shows an example of the configuration of inkjet printer 1. [Figure 4] This is a perspective view showing an example of the general internal structure of inkjet printer 1. [Figure 5] This is a cross-sectional view showing an example of the structure of the discharge section D[m]. [Figure 6] This block diagram shows an example of the configuration of head unit 3. [Figure 7] This is a timing chart showing an example of the signals supplied to head unit 3. [Figure 8] This is an explanatory diagram showing an example of an individual designation signal Sd[m]. [Figure 9] This is a block diagram showing an example of the configuration of the drive signal generation circuit 40. [Figure 10] This is an exploded perspective view showing an example of the structure of the drive control unit 5 and the wireless communication unit 6. [Figure 11] This is a cross-sectional view showing an example of the structure of the drive control unit 5 and the wireless communication unit 6. [Figure 12] This is a schematic diagram illustrating an example of a support column CY. [Figure 13] This is a cross-sectional view showing an example of the structure of an inkjet printer 1Z related to proportionality. [Figure 14]It is a perspective view showing an example of a schematic external appearance configuration of a smartphone 1B according to a second embodiment of the present invention. [Figure 15] It is a block diagram showing an example of the configuration of the smartphone 1B. [Figure 16] It is a cross-sectional view showing an example of the structure of the smartphone 1B. [Figure 17] It is a cross-sectional view showing an example of the structure of an inkjet printer 1C according to Modification 1 of the present invention.

Mode for Carrying Out the Invention

[0007] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, in each figure, the dimensions and scales of each part are appropriately different from the actual ones. Further, the embodiments described below are preferred specific examples of the present invention, and thus various technically preferable limitations are imposed. However, the scope of the present invention is not limited to these embodiments unless there is a description specifically limiting the present invention in the following description.

[0008] <<A. First Embodiment>> In the first embodiment, an inkjet printer 1 that ejects ink to form an image on a recording paper PP will be exemplified to explain the printing apparatus.

[0009] <<A.1. Outline of Inkjet Printer 1>> Hereinafter, an example of the configuration of the inkjet printer 1 according to the first embodiment will be described while referring to FIGS. 1 to 5.

[0010] FIGS. 1 and 2 are external perspective views showing an example of the appearance of the inkjet printer 1.

[0011] As shown in FIGS. 1 and 2, the inkjet printer 1 is a mobile printer that can be carried by a user of the inkjet printer 1, and includes a housing 100, an openable and closable cover member 160, a paper feed port PPF for supplying recording paper PP to the inside of the inkjet printer 1, and a paper discharge port PPD for discharging the recording paper PP from the inkjet printer 1.

[0012] Hereinafter, the front direction of the inkjet printer 1 is referred to as the X1 direction, the back direction of the inkjet printer 1 is referred to as the X2 direction, and the X1 direction and the X2 direction are collectively referred to as the X-axis direction. Also, when looking at the inkjet printer 1 in the X2 direction, the right direction of the inkjet printer 1 is referred to as the Y1 direction, the left direction of the inkjet printer 1 is referred to as the Y2 direction, and the Y1 direction and the Y2 direction are collectively referred to as the Y-axis direction. Further, the downward direction of the inkjet printer 1 is referred to as the Z1 direction, the upward direction is referred to as the Z2 direction, and the Z1 direction and the Z2 direction are collectively referred to as the Z-axis direction. In the present embodiment, as an example, the case where the X-axis direction, the Y-axis direction, and the Z-axis direction are orthogonal to each other will be assumed and described. However, the present invention is not limited to such an aspect. The X-axis direction, the Y-axis direction, and the Z-axis direction only need to intersect each other.

[0013] FIG. 3 is a functional block diagram showing an example of the configuration of the inkjet printer 1.

[0014] As shown in FIG. 3, image data Img indicating an image to be formed by the inkjet printer 1 is supplied to the inkjet printer 1 from a host computer such as a personal computer or a digital camera. The inkjet printer 1 executes a printing process of forming an image indicated by the image data Img supplied from the host computer on the recording paper PP.

[0015] As shown in Figure 3, the inkjet printer 1 comprises a print control unit 2 that controls various parts of the inkjet printer 1, a head unit 3 equipped with an ejection unit D that ejects ink onto recording paper PP, a drive signal generation unit 4 equipped with a drive signal generation circuit 40 that generates a drive signal Com for driving the ejection unit D, a wireless communication unit 6 that acquires image data Img via wireless communication, and a transport unit 9 for transporting the head unit 3 and the recording paper PP. In this embodiment, the inkjet printer 1 is an example of a "printing device" and "electronic device," the head unit 3 is an example of a "print head" and "drive device," the image data Img is an example of "image information" and "instruction information," the recording paper PP is an example of a "medium," and the transport unit 9 is an example of a "transport mechanism." Furthermore, the configuration including the print control unit 2 and the drive signal generation unit 4 will be referred to as the "drive control unit 5" below.

[0016] In this embodiment, we assume that the inkjet printer 1 has one or more head units 3. Specifically, in this embodiment, as an example, we assume that the inkjet printer 1 has four head units 3. For the sake of explanation, in the following, we may focus on one of the four head units 3, as shown in Figure 3.

[0017] Furthermore, in this embodiment, as an example, we assume that the drive signal generation unit 4 is equipped with one drive signal generation circuit 40 corresponding to one head unit 3. That is, in this embodiment, we assume that the drive signal generation unit 4 is equipped with four drive signal generation circuits 40 corresponding to four head units 3. However, the present invention is not limited to this embodiment. The drive signal generation unit 4 may be equipped with two or more drive signal generation circuits 40 corresponding to one head unit 3. For the sake of explanation, in the following, as shown in Figure 3, we may focus on one of the four drive signal generation circuits 40 in the explanation.

[0018] The print control unit 2 is comprised of a print control circuit 21 and a memory circuit 22. The memory circuit 22 is configured to include volatile memory such as RAM (Random Access Memory) and non-volatile memory such as ROM (Read Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or PROM (Programmable ROM), and stores various information such as the control program for the inkjet printer 1. The printing control circuit 21 is configured to include one or more CPUs (Central Processing Units). However, the printing control circuit 21 may include a programmable logic device such as an FPGA (field-programmable gate array) instead of a CPU, or in addition to a CPU. The printing control circuit 21 executes the control program for the inkjet printer 1 stored in the memory circuit 22 and controls each part of the inkjet printer 1 by operating according to the control program. Specifically, the printing control circuit 21 generates signals for controlling the operation of each part of the inkjet printer 1, such as a designation signal SI, a waveform designation signal dCom, a carriage transport control signal SH1, and a media transport control signal SH2.

[0019] Here, the waveform specification signal dCom is a digital signal that defines the waveform of the drive signal Com. The drive signal Com is an analog signal for driving the ejection unit D. The specification signal SI (an example of a "control signal") is a digital signal that specifies the type of operation of the ejection unit D. Specifically, the specification signal SI specifies whether or not to supply the drive signal Com to the ejection unit D, thereby specifying the type of operation of the ejection unit D, such as whether or not ink is ejected from the ejection unit D. The carriage transport control signal SH1 and the media transport control signal SH2 are signals for controlling the transport unit 9.

[0020] When printing is performed, the print control unit 2 generates signals to control the head unit 3, such as a specified signal SI, based on the image data Img. The print control unit 2 also generates signals to control the drive signal generation unit 4, such as a waveform specified signal dCom, when printing is performed. The print control unit 2 also generates signals to control the transport unit 9, such as a carriage transport control signal SH1 and a media transport control signal SH2, when printing is performed. As a result, during printing, the print control unit 2 controls the transport unit 9 to move the head unit 3 and the recording paper PP, while adjusting the presence or absence of ink ejection from the ejection unit D and the timing of ink ejection, thereby controlling each part of the inkjet printer 1 so that an image corresponding to the image data Img is formed on the recording paper PP.

[0021] As shown in Figure 1, the head unit 3 comprises a supply circuit 31 and a head section 32.

[0022] The print head 32 is equipped with M ejection units D. Here, the value M is a natural number satisfying "M≧1". In the following, the m-th ejection unit D among the M ejection units D provided in the print head 32 may be referred to as ejection unit D[m]. Here, the variable m is a natural number satisfying "1≦m≦M". Furthermore, in the following, if a component or signal of the inkjet printer 1 corresponds to ejection unit D[m] among the M ejection units D, the subscript [m] may be added to the code used to represent that component or signal. The supply circuit 31 switches whether or not to supply the drive signal Com to the discharge unit D[m] based on the specified signal SI. Hereinafter, the drive signal Com supplied to the discharge unit D[m] may be referred to as the supply drive signal Vin[m].

[0023] Figure 4 is a perspective view showing an example of the schematic internal structure of inkjet printer 1.

[0024] As shown in Figure 4, in this embodiment, we assume that the inkjet printer 1 is a serial printer. Specifically, when the inkjet printer 1 performs a printing process, it transports the recording paper PP in the X1 direction while moving the head unit 3 in the Y1 or Y2 direction, ejecting ink from the head unit 3 to form an image corresponding to the image data Img on the recording paper PP.

[0025] As shown in Figure 4, the inkjet printer 1 according to this embodiment comprises a housing 100 and a carriage 110 that can reciprocate within the housing 100 in the Y-axis direction.

[0026] As shown in Figure 4, this embodiment assumes that the carriage 110 is equipped with four ink cartridges 120, each corresponding one-to-one with four inks: cyan, magenta, yellow, and black. Furthermore, this embodiment assumes that the carriage 110 is equipped with four head units 3, each corresponding one-to-one with the four ink cartridges 120. Each ejection unit D[m] receives ink from the ink cartridge 120 corresponding to the head unit 3 on which the ejection unit D[m] is provided. As a result, each ejection unit D[m] fills itself with the supplied ink, and the ink filled inside the ejection unit D[m] can be ejected from the nozzle N provided in the ejection unit D[m]. Note that the ink cartridges 120 may be provided outside the carriage 110.

[0027] As described above, the inkjet printer 1 according to this embodiment includes a transport unit 9. As shown in Figure 4, the transport unit 9 includes a carriage transport motor 91, a media transport motor 92, a media transport mechanism 93, a platen 95, a carriage guide shaft 96, and a belt 97. The carriage transport motor 91 drives the belt 97 based on the carriage transport control signal SH1. The belt 97 (an example of a "head transport mechanism") transports the carriage 110 in the Y-axis direction based on the drive of the carriage transport motor 91. The carriage guide shaft 96 supports the carriage 110 so that it can reciprocate in the Y-axis direction. The media transport motor 92 drives the media transport mechanism 93 based on the media transport control signal SH2. The media transport mechanism 93 transports the recording paper PP in the X1 direction by rotating based on the drive of the media transport motor 92. The platen 95 is provided in the Z1 direction of the carriage 110 and supports the recording paper PP being transported by the media transport mechanism 93. Thus, when printing is performed, the transport unit 9 uses the carriage transport motor 91 to reciprocate the head unit 3 and the carriage 110 together along the carriage guide axis 96 in the Y-axis direction, and the medium transport motor 92 transports the recording paper PP on the platen 95 in the X1 direction, thereby changing the relative position of the recording paper PP with respect to the head unit 3 and enabling ink to be deposited on the entire recording paper PP. In other words, in this embodiment, the head unit 3 is an example of a "displacement part".

[0028] As shown in Figure 4, this embodiment assumes that the drive control unit 5 is equipped with a control board 500 and the wireless communication unit 6 is equipped with a communication board 600. The control board 500 (an example of the "first board") is a circuit board fixed to the housing 100. The control board 500 is provided with a printing control circuit 21 and a memory circuit 22 provided by the printing control unit 2, and a drive signal generation circuit 40 provided by the drive signal generation unit 4. Hereinafter, the circuits provided on the control board 500, namely the printing control circuit 21, the memory circuit 22, and the drive signal generation circuit 40, may be referred to as the drive control circuit 50 (an example of the "control circuit"). The communication board 600 (an example of the "second board") is a circuit board connected to the control board 500. The communication board 600 is equipped with an antenna 61 and a communication control circuit 62, which are part of the wireless communication unit 6. The antenna 61 and the communication control circuit 62 will be described later.

[0029] Figure 5 is a schematic partial cross-sectional view of the head portion 32, which has been cut to include the discharge portion D [m].

[0030] As shown in Figure 5, the ejection unit D[m] comprises a piezoelectric element PZ[m], a cavity CV[m] filled with ink, a nozzle N[m] communicating with the cavity CV[m], and a diaphragm 321. The ejection unit D[m] ejects ink from the cavity CV[m] through the nozzle N[m] when the piezoelectric element PZ[m] is driven by a supply drive signal Vin[m]. The cavity CV[m] is a space partitioned by a cavity plate 324, a nozzle plate 323 on which the nozzle N[m] is formed, and the diaphragm 321. The cavity CV[m] communicates with a reservoir 325 via an ink supply port 326. The reservoir 325 communicates with an ink cartridge 120 corresponding to the ejection unit D[m] via an ink intake port 327. The piezoelectric element PZ[m] has an upper electrode Zu[m], a lower electrode Zd[m], and a piezoelectric body Zm[m] provided between the upper electrode Zu[m] and the lower electrode Zd[m]. The lower electrode Zd[m] is electrically connected to a power supply line LD set to a predetermined potential VBS. When a supply drive signal Vin[m] is supplied to the upper electrode Zu[m] and a voltage is applied between the upper electrode Zu[m] and the lower electrode Zd[m], the piezoelectric element PZ[m] is displaced in the Z1 and Z2 directions according to the applied voltage, and as a result the piezoelectric element PZ[m] vibrates. The lower electrode Zd[m] is joined to the diaphragm 321. Therefore, when the piezoelectric element PZ[m] is driven by the supply drive signal Vin[m] and vibrates, the diaphragm 321 also vibrates. Then, the vibration of the diaphragm 321 changes the volume of cavity CV[m] and the pressure inside cavity CV[m], causing the ink filled in cavity CV[m] to be ejected from nozzle N[m].

[0031] <<Configuration and Operation of Head Unit 3>> Hereinafter, an example of the configuration and operation of the head unit 3 will be described while referring to FIGS. 6 to 8.

[0032] FIG. 6 is a block diagram showing an example of the configuration of the head unit 3.

[0033] As shown in FIG. 6, the head unit 3 includes a supply circuit 31 and a head unit 32. Further, the head unit 3 includes a wiring LC to which a drive signal Com is supplied from the drive signal generation unit 4.

[0034] As shown in FIG. 6, the supply circuit 31 includes M ejection units D[1] to D[M], M switches WS[1] to WS[M] corresponding one-to-one to the ejection units, and a connection state specifying circuit 310 for specifying the connection state of each switch. The connection state specifying circuit 310 generates a connection state specifying signal QS[m] for specifying the on / off of the switch WS[m] based on at least some of the signals of the specifying signal SI, latch signal LAT, change signal CH, and clock signal CLK supplied from the print control unit 2. The switch WS[m] switches between conduction and non-conduction between the wiring LC and the upper electrode Zu[m] of the piezoelectric element PZ[m] provided in the ejection unit D[m] based on the connection state specifying signal QS[m]. In the present embodiment, the switch WS[m] turns on when the connection state specifying signal QS[m] is at a high level and turns off when it is at a low level. When the switch WS[m] is on, the drive signal Com supplied to the wiring LC is supplied as a supply drive signal Vin[m] to the upper electrode Zu[m] of the ejection unit D[m].

[0035] FIG. 7 is a timing chart showing an example of various signals such as the drive signal Com supplied to the head unit 3.

[0036] As shown in Figure 7, when the inkjet printer 1 performs a printing process, one or more unit periods TP are set as the operating period of the inkjet printer 1. In this embodiment, the inkjet printer 1 can drive each ejection unit D[m] for the printing process during each unit period TP.

[0037] As shown in Figure 7, the print control unit 2 outputs a latch signal LAT which has a pulse PLL. This allows the print control unit 2 to define a unit period TP as the period from the rising edge of one pulse PLL to the rising edge of the next. The print control unit 2 also outputs a change signal CH which has a pulse PLC during the unit period TP. The print control unit 2 then divides the unit period TP into a drive period TQ1, from the rising edge of the pulse PLL to the rising edge of the pulse PLC, and a drive period TQ2, from the rising edge of the pulse PLC to the rising edge of the pulse PLL.

[0038] As shown in Figure 7, the designation signal SI includes M individual designation signals Sd[1] to Sd[M] that correspond one-to-one with M ejection units D[1] to D[M]. The individual designation signals Sd[m] specify the mode of operation of the ejection units D[m] in each unit period TP when the inkjet printer 1 performs printing. Prior to each unit period TP, the print control unit 2 supplies the designation signal SI, which includes the M individual designation signals Sd[1] to Sd[M], to the connection state designation circuit 310 in synchronization with the clock signal CLK. The connection state designation circuit 310 then generates a connection state designation signal QS[m] based on the individual designation signals Sd[m] in the unit period TP.

[0039] In this embodiment, it is assumed that during a unit period TP in which the printing process is performed, the ejection unit D[m] is capable of forming any of the following dots: a large dot made of ink with an ink amount ξ1, a medium dot made of ink with an ink amount ξ2 less than ξ1, and a small dot made of ink with an ink amount ξ3 less than ξ2.

[0040] Figure 8 is an explanatory diagram illustrating an example of an individual designation signal Sd[m].

[0041] As shown in Figure 8, in this embodiment, the individual designation signal Sd[m] can take any one of four values ​​during the unit period TP in which the printing process is performed: a value of "1" which designates the ejection unit D[m] as the large dot forming ejection unit DP-1, a value of "2" which designates the ejection unit D[m] as the medium dot forming ejection unit DP-2, a value of "3" which designates the ejection unit D[m] as the small dot forming ejection unit DP-3, and a value of "4" which designates the ejection unit D[m] as the non-dot forming ejection unit DP-4. Here, the large dot-forming discharge section DP-1 is the discharge section D that forms large dots in a unit period TP. The medium dot-forming discharge section DP-2 is the discharge section D that forms medium dots in a unit period TP. The small dot-forming discharge section DP-3 is the discharge section D that forms small dots in a unit period TP. The non-dot-forming discharge section DP-4 is the discharge section D that does not form dots in a unit period TP.

[0042] Return to the explanation in Figure 7. As shown in Figure 7, in this embodiment, the drive signal Com has a waveform PA1 provided during the drive period TQ1 and a waveform PA2 provided during the drive period TQ2. Of these, waveform PA1 is a waveform that returns to potential V0, passing through potential VL1 which is lower than potential V0, and potential VH1 which is higher than potential V0. When a supply drive signal Vin[m] having waveform PA1 is supplied to the ejection unit D[m], waveform PA1 is defined so that ink equivalent to ink amount φ1 is ejected from the ejection unit D[m]. Waveform PA2 is a waveform that returns to potential V0, passing through potential VL2 which is lower than potential V0, and potential VH2 which is higher than potential V0. When a supply drive signal Vin[m] having waveform PA2 is supplied to the ejection unit D[m], waveform PA2 is defined so that ink equivalent to ink amount φ2 is ejected from the ejection unit D[m]. In this embodiment, it is assumed that ink quantity ξ1 corresponds to the sum of ink quantity φ1 and ink quantity φ2, ink quantity ξ2 corresponds to ink quantity φ1, and ink quantity ξ3 corresponds to ink quantity φ2.

[0043] Furthermore, in this embodiment, as an example, we assume that when the potential of the supply drive signal Vin[m] supplied to the ejection unit D[m] is high, the volume of the cavity CV[m] in the ejection unit D[m] becomes smaller compared to when the potential is low. Therefore, when the ejection unit D[m] is driven by a supply drive signal Vin[m] having a waveform PA1 or the like, the ink in the ejection unit D[m] is ejected from the nozzle N[m] as the potential of the supply drive signal Vin[m] changes from low to high.

[0044] As shown in Figure 8, when the individual designation signal Sd[m] indicates a value of "1" which designates the ejection unit D[m] as the large dot forming ejection unit DP-1 during the unit period TP, the connection state designation circuit 310 sets the connection state designation signal QS[m] to a high level during the drive period TQ1 and the drive period TQ2. In this case, the switch WS[m] is turned on during the drive period TQ1 and the drive period TQ2. Therefore, during the unit period TP, the ejection unit D[m] is driven by the supply drive signal Vin[m] which has waveforms PA1 and PA2, and ejects ink with an ink amount ξ1 corresponding to a large dot. Also, when the individual designation signal Sd[m] indicates the value "2" that designates the ejection unit D[m] as the medium dot formation ejection unit DP-2 in the unit period TP, the connection state designation circuit 310 sets the connection state designation signal QS[m] to the high level in the drive period TQ1. In this case, the switch WS[m] turns on in the drive period TQ1. Therefore, the ejection unit D[m] is driven by the supply drive signal Vin[m] having the waveform PA1 in the unit period TP, and ejects ink with an ink amount ξ2 corresponding to a medium dot. Also, when the individual designation signal Sd[m] indicates the value "3" that designates the ejection unit D[m] as the small dot formation ejection unit DP-3 in the unit period TP, the connection state designation circuit 310 sets the connection state designation signal QS[m] to the high level in the drive period TQ2. In this case, the switch WS[m] turns on in the drive period TQ2. Therefore, the ejection unit D[m] is driven by the supply drive signal Vin[m] having the waveform PA2 in the unit period TP, and ejects ink with an ink amount ξ3 corresponding to a small dot. Also, when the individual designation signal Sd[m] indicates the value "4" that designates the ejection unit D[m] as the non-dot formation ejection unit DP-4 in the unit period TP, the connection state designation circuit 310 sets the connection state designation signal QS[m] to the low level throughout the unit period TP. In this case, the switch WS[m] turns off throughout the unit period TP. Therefore, the ejection unit D[m] is not driven by the supply drive signal Vin[m] in the unit period TP and does not eject ink.

[0045] <<A.3. Configuration of Drive Signal Generation Circuit 40>> Hereinafter, an example of the configuration of the drive signal generation circuit 40 provided in the drive signal generation unit 4 will be described while referring to FIG. 9.

[0046] FIG. 9 is a block diagram showing an example of the circuit configuration of the drive signal generation circuit 40.

[0047] As shown in Figure 9, the drive signal generation circuit 40 is a Class D amplifier circuit that comprises an integrated circuit 41, an amplification circuit 43, a smoothing circuit 44, a pull-up circuit 45, a filter circuit 46, and an electrolytic capacitor Cd, and generates a drive signal Com based on a waveform specification signal dCom.

[0048] The integrated circuit 41 is, for example, a Large Scale Integration (LSI) and generates gate signals SGH and SGL based on a waveform specification signal dCom supplied to terminal tIN via node nIN. The integrated circuit 41 includes an analog conversion circuit 412, a subtractor 414, an adder 416, an attenuator 418, an integral attenuator 422, a comparator 424, and a gate driver 426.

[0049] The analog conversion circuit 412 is a DAC (digital to analog converter) that converts the digital waveform specification signal dCom into an analog signal Aa. The voltage amplitude of signal Aa is, for example, about 0 to 2 volts, and the drive signal Com is obtained by amplifying this voltage by about 20 times. In other words, signal Aa is the signal before amplification of the drive signal Com. The integrating attenuator 422 outputs a signal Ax obtained by attenuating the signal SN1 input to terminal t1 (described later) and then integrating it. The subtractor 414 outputs a signal Ab, which represents the potential obtained by subtracting the potential of signal Aa from the potential of signal Ax. The attenuator 418 outputs a signal Ay, which is the signal SN2 input to terminal t2 (described later) with its high-frequency components attenuated. The adder 416 outputs a signal As, which represents the potential obtained by adding the potentials of signal Ab and signal Ay. Comparator 424 outputs a modulated signal Ms obtained by pulse-modulating signal As. Specifically, comparator 424 outputs a modulated signal Ms that becomes high level when signal As's voltage rises above threshold voltage Vth1, and low level when signal As's voltage falls below threshold voltage Vth2. The threshold voltages Vth1 and Vth2 are set to the relationship 'Vth1 > Vth2'.

[0050] The power supply voltage for the circuit from the analog conversion circuit 412 to the comparator 424 is a low voltage, such as 3.3 volts. In contrast, the drive signal Com has a large amplitude, sometimes exceeding 40 volts. Therefore, the integrating attenuator 422 attenuates the signal SN1, which has an amplitude corresponding to the drive signal Com, to match the amplitude range of the signal Ax to the amplitude range of the signal in the circuit from the analog conversion circuit 412 to the comparator 424. Furthermore, although a digital signal is used as an example to describe the waveform specification signal dCom in this embodiment, the waveform specification signal dCom can be any signal that defines the target value for generating the drive signal Com. For example, an analog signal Aa may be used as the waveform specification signal dCom. If signal Aa is the waveform specification signal dCom, the integrated circuit 41 may be configured without including the analog conversion circuit 412.

[0051] The gate driver 426 outputs a gate signal SGH, which is obtained by converting the modulated signal Ms to a specific amplitude, to node nH via terminal tH. The gate driver 426 also outputs a gate signal SGL, which is obtained by converting the inverted logic level of the modulated signal Ms to a specific amplitude, to node nL via terminal tL.

[0052] The amplification circuit 43 includes, for example, transistors TrH and TrL, and generates an amplified signal Az, which is a signal obtained by amplifying the modulated signal Ms, based on the gate signals SGH and SGL output from the integrated circuit 41. In this embodiment, as an example, it is assumed that transistors TrH and TrL are field-effect transistors. More specifically, in this embodiment, it is assumed that N-channel type metal-oxide-semiconductor field-effect transistors (MOSFETs) are used as transistors TrH and TrL.

[0053] The gate signal SGH, output from gate driver 426 to terminal tH, is input to the gate gate gt of transistor TrH via node nH and resistor RGH. Similarly, the gate signal SGL, output from gate driver 426 to terminal tL, is input to the gate gate gt of transistor TrL via node nL and resistor RGL. The logic levels of gate signals SGH and SGL are mutually exclusive. Here, "mutually exclusive" means that the signal level of gate signal SGH supplied to the gate gate gt of transistor TrH and the signal level of gate signal SGL supplied to the gate gate gt of transistor TrL can never be high at the same time; in other words, transistors TrH and TrL can never be turned on at the same time. Transistor TrH turns on when the potential of its gate gate gt is high, and turns off when the potential of its gate gate gt is low. The transistor TrL turns on when the potential of its gate electrode gt is high, and turns off when the potential of its gate electrode gt is low.

[0054] The drain electrode dt of transistor TrH is electrically connected to node nV, which is set to the high-potential power supply potential VHV, and the source electrode st is electrically connected to node nD. Similarly, the source electrode st of transistor TrL is electrically connected to node nG, which is set to ground potential, and the drain electrode dt is electrically connected to node nD. Alternatively, the source electrode of transistor TrL may be electrically connected to the power supply line LD, which is set to potential VBS.

[0055] As described above, transistor TrH turns on when the gate signal SGH supplied to the gate electrode gt is high level and turns off when it is low level. Transistor TrL turns on when the gate signal SGL supplied to the gate electrode gt is high level and turns off when it is low level. Therefore, the node nD that electrically connects the source electrode st of transistor TrH and the drain electrode dt of transistor TrL outputs an amplified signal Az, which is the modulated signal Ms amplified.

[0056] An electrolytic capacitor Cd is connected to node nV, to which the power supply potential VHV is supplied. One end of the electrolytic capacitor Cd is electrically connected to node nV, and the other end is electrically connected to node nG, which is set to ground potential. In this embodiment, the electrolytic capacitor Cd is, for example, a large-capacity aluminum electrolytic capacitor, which suppresses potential fluctuations at node nV and stabilizes the power supply potential VHV.

[0057] The smoothing circuit 44 is an LPF (Low Pass Filter) that smooths the amplified signal Az to generate the drive signal Com. The smoothing circuit 44 comprises an inductor L0 and a capacitor C0. One end of the inductor L0 is electrically connected to node nD, and the other end is electrically connected to node nX. One end of the capacitor C0 is electrically connected to node nX, and the other end is electrically connected to node nG, which is set to ground potential.

[0058] The pull-up circuit 45 feeds back the signal SN1, which is the drive signal Com output to node nX, to terminal t1. The pull-up circuit 45 includes a resistor R1, one end of which is electrically connected to node nX and the other end of which is electrically connected to terminal t1, and a resistor R2, one end of which is electrically connected to terminal t1 and the other end of which is electrically connected to node nV, which is set to the power supply potential VHV.

[0059] The filter circuit 46 is a Band Pass Filter (BPF) and feeds back a signal SN2, which is obtained by cutting the DC component from the frequency components of a predetermined band of the drive signal Com, to terminal t2. The filter circuit 46 comprises a resistor R3, a capacitor C1 with one end electrically connected to node nX and the other end electrically connected to one end of resistor R3, a resistor R4 with one end electrically connected to one end of resistor R3 and the other end electrically connected to node nG which is set to ground potential, a capacitor C2 with one end electrically connected to the other end of resistor R3 and the other end electrically connected to node nG which is set to ground potential, and a capacitor C3 with one end electrically connected to the other end of resistor R3 and the other end electrically connected to terminal t2. Of these, capacitor C1 and resistor R4 function as a High Pass Filter (HPF) that allows high-frequency components of the drive signal Com above the cutoff frequency to pass through. Furthermore, resistor R3 and capacitor C2 function as an LPF (Low Pass Filter) that allows low-frequency components of the drive signal Com below the cutoff frequency to pass through. In this embodiment, the cutoff frequency of the HPF is set lower than the cutoff frequency of the LPF in the filter circuit 46. Therefore, the filter circuit 46 allows frequency components of the drive signal Com that are above the cutoff frequency of the HPF and below the cutoff frequency of the LPF to pass through. In addition, because the filter circuit 46 is equipped with capacitor C3, the signal from which the DC component has been cut off from the frequency components of the drive signal Com that have passed through the HPF and LPF is fed back to terminal t2.

[0060] In this way, the drive signal generation circuit 40 generates the drive signal Com by smoothing the amplified signal Az at the node nD with the smoothing circuit 44. The drive signal Com is integrated and subtracted by the integrator / damper 422 and then fed back to the subtracter 414. Therefore, self-oscillation occurs at a frequency determined by the delay in the smoothing circuit 44, the delay in the integrator / damper 422, and the feedback transfer function. However, since the delay amount of the feedback path via the terminal t1 is large, the self-oscillation frequency cannot be increased to such an extent that the accuracy of the waveform of the drive signal Com can be sufficiently ensured only by the feedback via the terminal t1. In contrast, in the present embodiment, a path for feeding back the high-frequency component of the drive signal Com via the terminal t2 is provided separately from the path via the terminal t1, so that the delay of the feedback in the entire drive signal generation circuit 40 can be reduced. That is, in the present embodiment, the frequency of the signal As obtained by adding the signal Ay, which is the high-frequency component of the drive signal Com, to the signal Ab can be increased as compared with the case where there is no path via the terminal t2, so that the accuracy of the drive signal Com can be sufficiently ensured.

[0061] Note that in the present embodiment, the electrolytic capacitor Cd included in the drive signal generation circuit 40 of the drive control circuit 5 is an example of an "electronic component".

[0062] <<A.4. Configuration of the Drive Control Unit 5 and the Wireless Communication Unit 6>> Hereinafter, the configurations of the drive control unit 5 and the wireless communication unit 6 will be described while referring to FIGS. 10 to 12.

[0063] FIG. 10 is an exploded perspective view showing an example of the configuration including the drive control unit 5 and the wireless communication unit 6. FIG. 11 is a cross-sectional view showing an example of the configuration including the drive control unit 5 and the wireless communication unit 6.

[0064] As shown in FIGS. 10 and 11, the inkjet printer 1 includes a drive control unit 5, a wireless communication unit 6, a board-to-board connector CN, and a support column CY.

[0065] As described above, the wireless communication unit 6 comprises a communication board 600, an antenna 61 and a communication control circuit 62 provided on the communication board 600.

[0066] The communication board 600 has a lower surface 6001 (an example of a "first surface") facing in the Z1 direction, and an upper surface 6002 (an example of a "second surface") which is the opposite side of the lower surface 6001 and faces in the Z2 direction. The antenna 61 is an element for transmitting and receiving signals via wireless communication and is provided on the upper surface 6002. The communication control circuit 62 (an example of a "communication circuit") is a circuit for controlling the execution of wireless communication using the antenna 61, and is provided on the lower side surface 6001.

[0067] As described above, the drive control unit 5 comprises a control board 500 and a drive control circuit 50 provided on the control board 500.

[0068] The control board 500 has a lower surface 5001 facing in the Z1 direction and an upper surface 5002 on the opposite side from the lower surface 5001, facing in the Z2 direction. In this embodiment, the upper surface 5002 of the control board 500 and the lower surface 6001 of the communication board 600 face each other.

[0069] As described above, the drive control circuit 50 includes a printing control circuit 21, a memory circuit 22, and a drive signal generation circuit 40. The drive signal generation circuit 40 includes an amplification circuit 43 including transistors TrH and TrL, a smoothing circuit 44 including an inductor L0 and a capacitor C0, and an electrolytic capacitor Cd. In this embodiment, the drive control circuit 50 is provided on the upper surface 5002.

[0070] In this embodiment, it is assumed that the height Hd of the electrolytic capacitor Cd in the Z-axis direction is greater than the height HT of transistors TrH and TrL in the Z-axis direction, the height HL of inductor L0 in the Z-axis direction, and the height HC of capacitor C0 in the Z-axis direction. Furthermore, in this embodiment, it is assumed that the volume of the electrolytic capacitor Cd is larger than that of the other electronic components constituting the drive control circuit 50.

[0071] A board-to-board connector CN (an example of a "connecting component") connects the control board 500 and the communication board 600. Specifically, the board-to-board connector CN comprises a connector component CN1 fixed to the upper surface 5002 of the control board 500, and a connector component CN2 fixed to the lower surface 6001 of the communication board 600 and capable of mating with connector component CN1. Connector component CN1 is, for example, a male connector, and connector component CN2 is, for example, a female connector. The board-to-board connector CN connects the control board 500 and the communication board 600 by mating connector component CN1 and connector component CN2, enabling the transmission of signals between the control board 500 and the communication board 600.

[0072] Figure 12 is a schematic diagram showing an example of a support column CY.

[0073] As shown in Figure 12, the support column CY includes a base material SL and thermal conductive particles PT.

[0074] The base material SL is a clay-like substance with electrical insulating properties. For example, clay composed of silicone can be used as the base material SL. The thermal conductive particles PT are particles made of materials with high thermal conductivity, such as diamond, gold, silver, and copper, and are dispersed within the substrate SL. In this embodiment, the thermal conductive particles PT are arranged such that their diameter is sufficiently small compared to the spacing of the wiring in the drive control circuit 50. Therefore, even when a conductive material is used as the thermal conductive particles PT in this embodiment, the support column CY is prevented from electrically connecting two components in the drive control circuit 50, and the electrical insulation of the support column CY as a whole can be maintained.

[0075] As shown in Figures 10 and 11, the support column CY is provided between the upper surface 5002 of the control board 500 and the lower surface 6001 of the communication board 600, so as to support the communication board 600 relative to the control board 500.

[0076] Specifically, in this embodiment, the support column CY is provided such that, when the drive control unit 5 and the wireless communication unit 6 are viewed in a plan view in the Z1 direction, it covers part or all of the electrolytic capacitor Cd and part or all of the communication control circuit 62. In other words, in this embodiment, the support column CY is provided such that, when the drive control unit 5 and the wireless communication unit 6 are viewed in a plan view in the Z1 direction, it overlaps part or all of the electrolytic capacitor Cd and part or all of the communication control circuit 62. However, the present invention is not limited to these embodiments. When the drive control unit 5 and the wireless communication unit 6 are viewed in plan in the Z1 direction, the support column CY may be provided so as not to overlap with the communication control circuit 62. Also, when the drive control unit 5 and the wireless communication unit 6 are viewed in plan in the Z1 direction, the support column CY may be provided so as not to overlap with the electrolytic capacitor Cd.

[0077] Also, in the present embodiment, the communication substrate 600 includes an end region Ar1, an end region Ar2, and an intermediate region Ar0. Here, the end region Ar1 (an example of the "first region") is a region including the end Eg1 of the communication substrate 600 in the Y2 direction when the communication substrate 600 is viewed in plan in the Z1 direction, and is a region near the end Eg1. The end region Ar2 (an example of the "second region") is a region including the end Eg2 of the communication substrate 600 in the Y1 direction when the communication substrate 600 is viewed in plan in the Z1 direction, and is a region near the end Eg2. The intermediate region Ar0 is a region between the end region Ar1 and the end region Ar2 when the communication substrate 600 is viewed in plan in the Z1 direction. ]] And, in the present embodiment, the connector component CN2 is fixed to the lower surface 6001 in the end region Ar1 of the communication substrate 600, and the support column CY is provided to support the lower surface 6001 in the end region Ar2 of the communication substrate 600.

[0078] <<A.5. Comparative example>> Hereinafter, in order to clarify the effects of the present embodiment, the inkjet printer 1Z according to the comparative example will be described while referring to FIG. 13.

[0079] FIG. 13 is a cross-sectional view showing an example of the configuration of the inkjet printer 1Z according to the comparative example.

[0080] As shown in FIG. 13, the inkjet printer 1Z according to the comparative example is configured in the same manner as the inkjet printer 1 according to the embodiment, except that it does not include the support column CY.

[0081] In proportional operation, vibrations occur in the inkjet printer 1Z due to the transport of the recording paper PP by the transport unit 9, the transport of the carriage 110 by the transport unit 9, and the transport of the inkjet printer 1Z by the user. When vibrations occur in the inkjet printer 1Z, minute changes occur in the relative position of the control board 500 and the communication board 600, and minute changes may occur in the relative orientation of the control board 500 and the communication board 600. When changes occur in the relative position or orientation of the control board 500 and the communication board 600, loads are placed between the board-to-board connector CN and the control board 500, and between the board-to-board connector CN and the communication board 600, which may cause so-called fretting, where at least a portion of the surface of the board-to-board connector CN, the control board 500, and the communication board 600 is damaged. When surface damage occurs on at least a portion of the board-to-board connector CN, the control board 500, and the communication board 600, minute fragments may be scraped off from these parts. Furthermore, fragments generated during surface damage can oxidize, and these oxidized fragments may come into contact with the joint between the substrate-to-substrate connector CN and the substrate (control board 500, communication board 600), potentially causing poor contact between the substrate-to-substrate connector CN and the substrate. Alternatively, oxidized fragments may come into contact with circuits such as the drive control circuit 50, potentially causing poor contact in those circuits. This is known as fretting corrosion.

[0082] In contrast, in the present embodiment, the communication board 600 is supported by the support column CY in addition to being connected to the control board 500 by the board-to-board connector CN. Therefore, according to the present embodiment, when vibration occurs in the inkjet printer 1 as compared with the proportional example, the degree of change in the relative position and orientation between the control board 500 and the communication board 600 can be reduced. For this reason, according to the present embodiment, as compared with the proportional example, the possibility of damage occurring on at least a part of the surfaces of the board-to-board connector CN, the control board 500, and the communication board 600 can be reduced, and the possibility of the generation of fragments due to surface damage in these components can be reduced. Therefore, according to the present embodiment, as compared with the proportional example, the contact failure between the board-to-board connector CN and the boards (control board 500, communication board 600) due to the fragments generated along with the surface damage, and the contact failure inside the circuit such as the drive control circuit 50 due to the fragments generated along with the surface damage can be suppressed. That is, according to the present embodiment, as compared with the proportional example, the degree of damage due to fretting can be reduced, and thereby the possibility of occurrence of problems due to fretting corrosion can be reduced.

[0083] <<Summary of the First Embodiment of A.6.>> As described above, according to the present embodiment, the communication board 600 is supported by the support column CY in addition to being connected to the control board 500 by the board-to-board connector CN. Therefore, as compared with the aspect not provided with the support column CY, the degree of change in the relative position and orientation between the control board 500 and the communication board 600 can be reduced, and the possibility of the generation of fragments due to surface damage in at least a part of the board-to-board connector CN, the control board 500, and the communication board 600 can be reduced. Therefore, according to the present embodiment, as compared with the aspect not provided with the support column CY, the possibility of occurrence of problems due to fretting corrosion can be reduced.

[0084] Furthermore, according to this embodiment, the support column CY is provided so as to cover the electrolytic capacitor Cd. Compared to an embodiment in which the support column CY is directly placed on the upper surface 5002 of the control board 500 without covering the electrolytic capacitor Cd, the height of the clay-like, low-rigidity support column CY in the Z-axis direction is reduced, making it possible to support the communication board 600 more stably with respect to the control board 500.

[0085] Furthermore, according to this embodiment, the support column CY is provided so as to cover the communication control circuit 62. Compared to an embodiment in which the support column CY does not cover the communication control circuit 62 but directly supports the lower surface 6001 of the communication board 600, the height of the support column CY in the Z-axis direction is reduced, making it possible to support the communication board 600 more stably with respect to the control board 500.

[0086] Furthermore, according to this embodiment, the antenna 61 is provided on the upper surface 6002. Therefore, according to this embodiment, compared to the configuration in which the antenna 61 is provided on the lower surface 6001, the possibility that the communication board 600 or the support column CY may interfere with the transmission and reception of signals at the antenna 61 can be reduced.

[0087] Furthermore, according to this embodiment, the communication board 600 is provided separately from the control board 500. Therefore, according to this embodiment, compared to the configuration in which the communication board 600 and the control board 500 are provided as a single board, it becomes easier to remove the communication board 600 from the inkjet printer 1. Thus, according to this embodiment, for example, when the inkjet printer 1 is discarded, it becomes possible to reduce the cost associated with reusing the communication board 600, thereby reducing the environmental impact of the inkjet printer 1. In addition, according to this embodiment, for example, when the communication method used by the inkjet printer 1 is changed, it becomes easy to replace the communication board 600 with one that corresponds to the communication method that the inkjet printer 1 is scheduled to use, enabling the use of the inkjet printer 1 in a wider variety of environments. Note that the support column CY preferably has a color different from at least one of the colors of the control board 500 and the communication board 600. In the present embodiment, it is assumed that the support column CY has a color different from that of the control board 500 and a color different from that of the communication board 600.

[0088] Further, according to the present embodiment, since the support column CY contacts the control board 500 and the communication board 600, it is possible to dissipate heat generated in the drive control circuit 50 through the support column CY and the communication board 600.

[0089] Further, according to the present embodiment, since the board-to-board connector CN is fixed to the communication board 600 in the end region Ar1 and the support column CY supports the communication board 600 in the end region Ar2, it is possible to more stably support the communication board 600 with respect to the control board 500 as compared with a mode in which one or both of the board-to-board connector CN and the support column CY are provided in the intermediate region Ar0.

[0090] <<B. Second Embodiment>> In the second embodiment, the electronic device will be described by exemplifying the smartphone 1B while referring to FIGS. 14 to 16. Note that, for elements in each of the embodiments exemplified below whose operations and functions are the same as those in the first embodiment, the reference numerals used in the description of the first embodiment are reused and the detailed description of each is appropriately omitted.

[0091] FIG. 14 is an external perspective view showing an example of the appearance of the smartphone 1B.

[0092] As shown in FIG. 14, the smartphone 1B is an electronic device that can be carried by a user of the smartphone 1B, and includes a housing 100B and a display unit 3B.

[0093] FIG. 15 is a functional block diagram showing an example of the configuration of the smartphone 1B.

[0094] As shown in Figure 15, the smartphone 1B is supplied with video data Vd from a host computer such as a personal computer or digital camera, which indicates the image that the smartphone 1B should display. The smartphone 1B displays the image indicated by the video data Vd supplied from the host computer on the display unit 3B.

[0095] As shown in Figure 15, the smartphone 1B includes a wireless communication unit 6 that acquires video data Vd via wireless communication, a display control unit 5B that generates a display control signal Ctr based on the video data Vd, and a display unit 3B that displays the video indicated by the video data Vd based on the display control signal Ctr. In this embodiment, the smartphone 1B is an example of an "electronic device," the display unit 3B is an example of a "driving device," the display control signal Ctr is an example of a "control signal," and the video data Vd is an example of "instruction information."

[0096] The display control unit 5B includes a display control circuit 51 that generates a display control signal Ctr based on video data Vd supplied from the wireless communication unit 6, and a storage circuit 52 that stores various information such as the control program for the smartphone 1B. Hereinafter, the circuit including the display control circuit 51 and the storage circuit 52 will be referred to as the drive control circuit 50B.

[0097] Figure 16 is a cross-sectional view showing an example of the configuration of a smartphone 1B, including a display control unit 5B and a wireless communication unit 6.

[0098] As shown in Figure 16, the smartphone 1B includes a display control unit 5B, a wireless communication unit 6, a board-to-board connector CN, and a support column CY.

[0099] The wireless communication unit 6, similar to the first embodiment, includes a communication board 600, an antenna 61 and a communication control circuit 62 provided on the communication board 600.

[0100] The display control unit 5B comprises a control board 500B and a drive control circuit 50B provided on the control board 500B.

[0101] The control board 500B (another example of the "first board") has a lower surface 5001B facing in the Z1 direction and an upper surface 5002B on the opposite side from the lower surface 5001B, facing in the Z2 direction. In this embodiment, the upper surface 5002B of the control board 500B and the lower surface 6001 of the communication board 600 face each other.

[0102] The drive control circuit 50B includes an electrolytic capacitor Cd in addition to the display control circuit 51 and memory circuit 52 described above. In this embodiment, the drive control circuit 50B is provided on the upper surface 5002B.

[0103] In this embodiment, it is assumed that the height Hd of the electrolytic capacitor Cd in the Z-axis direction is greater than the height of the display control circuit 51 and the memory circuit 52 in the Z-axis direction. Furthermore, in this embodiment, it is assumed that the electrolytic capacitor Cd has a larger volume than the other electronic components constituting the drive control circuit 50B. In this embodiment, the electrolytic capacitor Cd is an example of a "first electronic component," and the communication control circuit 62 is an example of a "second electronic component."

[0104] In this embodiment, the board-to-board connector CN connects the control board 500B and the communication board 600. Specifically, in this embodiment, connector component CN1 of the board-to-board connector CN is fixed to the upper surface 5002B of the control board 500B, and connector component CN2 of the board-to-board connector CN is fixed to the lower surface 6001 of the communication board 600. The board-to-board connector CN connects the control board 500B and the communication board 600 by fitting connector component CN1 and connector component CN2 together, enabling the transmission of signals between the control board 500B and the communication board 600.

[0105] As described above, according to the present embodiment, in addition to being connected to the control board 500B by the board-to-board connector CN, the communication board 600 is supported by the support column CY. Therefore, compared with an aspect without the support column CY, it is possible to reduce the degree of change in the relative position and orientation between the control board 500B and the communication board 600, and it is possible to reduce the possibility of generation of fragments associated with surface damage in at least a part of the board-to-board connector CN, the control board 500B, and the communication board 600. Thus, according to the present embodiment, it is possible to reduce the possibility of occurrence of defects due to fretting corrosion compared with an aspect without the support column CY.

[0106] In the present embodiment, the communication board 600 may be a board with one side being 1 inch or less. Specifically, for example, the communication board 600 may be a Wi-Fi (registered trademark) chip with one side being 1 inch or less.

[0107] Also, in the present embodiment, similar to the first embodiment, the connector component CN2 is fixed to the lower surface 6001 in the end region Ar1 of the communication board 600, and the support column CY is provided to support the lower surface 6001 in the end region Ar2 of the communication board 600.

[0108] <<C. Modified Example>> Each of the above embodiments can be variously modified. Specific modification aspects are exemplified below. Two or more aspects arbitrarily selected from the following examples can be appropriately combined within a range that does not conflict with each other. For elements in the modified examples exemplified below whose actions and functions are equivalent to those in the embodiment, the reference numerals referred to in the above description are reused, and the detailed description of each is appropriately omitted.

[0109] <<Modified Example 1>> In the first and second embodiments described above, the support column CY was described as being provided to cover only the electrolytic capacitor Cd of the drive control circuit 50 or the drive control circuit 50B, but the present invention is not limited to this embodiment. The support column CY may be provided to cover electronic components other than the electrolytic capacitor Cd of the drive control circuit 50 or the drive control circuit 50B. In this case, the support column CY may be provided to cover the electrolytic capacitor Cd, or it may be provided not to cover the electrolytic capacitor Cd.

[0110] Figure 17 is a cross-sectional view showing an example of the configuration of an inkjet printer 1C according to Modification 1.

[0111] As shown in Figure 17, the inkjet printer 1C is configured similarly to the inkjet printer 1 according to the first embodiment, except that the support column CY is provided to broadly cover the electrolytic capacitor Cd, as well as the transistor TrH, the transistor TrL, the inductor L0, and a portion of the capacitor C0.

[0112] According to this modified configuration, since the support column CY stably supports the communication board 600, it becomes possible to suppress changes in the relative position and orientation between the control board 500 and the communication board 600 in the inkjet printer 1C, thereby suppressing the occurrence of malfunctions due to fretting corrosion.

[0113] Furthermore, according to this modified configuration, the transistors TrH and TrL and inductor L0, which are electronic components that become hot when the drive signal generation circuit 40 generates the drive signal Com, are covered by the support column CY. Therefore, compared to the configuration in which they are not covered by the support column CY, it becomes possible to efficiently cool these high-temperature electronic components.

[0114] In this modified example, it is assumed that the inductor L0 covered by the support column CY comprises a coil and a shield covering the coil. Therefore, according to this modified example, compared to the embodiment in which the inductor L0 does not have a shield, the inductor L0 has a surface shape with fewer irregularities, thus reducing the possibility of a gap forming between the support column CY and the inductor L0, and enabling stable support of the communication board 600 by the support column CY. Furthermore, according to this modified example, compared to the embodiment in which the inductor L0 does not have a shield, it becomes easier to separate the silicone clay provided on the support column CY from the inductor L0, thereby increasing the reusability of the inductor L0.

[0115] <<Modification 2>> In the first and second embodiments and Modification 1 described above, the control board 500 (or control board 500B) and the communication board 600 were described as being connected by a board-to-board connector CN, but the present invention is not limited to such embodiments. For example, the control board 500 (or control board 500B) and the communication board 600 may be connected by a pin header. Here, a pin header is another example of a "connecting component" and comprises an insertion pin member having a plurality of insertion pins formed of metal and a holding portion that holds the plurality of insertion pins in an insulated state from each other, and a pin socket having a plurality of insertion holes provided corresponding to the plurality of insertion pins.

[0116] In this modified example, we assume that the insertion pin member of the pin header is fixed to the lower surface 5001 of the control board 500, and the pin socket of the pin header is fixed to the upper surface 6002 of the communication board 600. The pin header connects the control board 500 and the communication board 600 by fitting the insertion pin member and the pin socket together, and transmits signals between the control board 500 and the communication board 600.

[0117] <<Modification 3>> In the above-described first and second embodiments and Modifications 1 and 2, the column CY has been described by way of example as including the heat-conductive particles PT in addition to the base material SL made of silicone clay. However, the present invention is not limited to such an aspect. The column CY may be configured without including the heat-conductive particles PT. For example, the column CY may be silicone clay. Further, for example, the column CY may be made of a clay-like substance having electrical insulation properties other than silicone clay.

[0118] <<Modification 4>> In the above-described first and second embodiments and Modifications 1 to 3, the inkjet printer and the smartphone have been described by way of example as electronic devices. However, the present invention is not limited to such an aspect. The electronic device according to the present invention may be, for example, any electronic device having two or more circuit boards, and may be an electronic device other than an inkjet printer and a smartphone, such as a digital camera, a projector, etc. In this case, the first substrate may be a substrate provided in the main body of the electronic device, and the second substrate may be a substrate provided separately from the first substrate.

[0119] <<D. Supplementary Note>> Aspects related to the above description are appended below. For ease of understanding of each aspect, the reference signs in the drawings are appended in parentheses for convenience below, but this is not intended to limit the present invention to the illustrated aspects.

[0120] <<D.1. Supplementary Note 1>> Hereinafter, the inkjet printer 1 according to Supplementary Note 1 will be described.

[0121] <<Supplementary Note 1-1>> The inkjet printer 1 according to Appendix 1-1 comprises a head unit 3 that forms an image on recording paper PP based on a specified signal SI, a communication board 600 provided with a communication control circuit 62 that receives image data Img representing the image via wireless communication, a control board 500 provided with a drive control circuit 50 that generates a specified signal SI based on the image data Img, and a board-to-board connector CN that connects the communication board 600 and the control board 500, wherein the communication board 600 is supported by electrically insulating clay-like pillars CY relative to the control board 500.

[0122] According to Appendix 1-1, the communication board 600 and the control board 500 are connected by a board-to-board connector CN, and the communication board 600 is supported by a support column CY relative to the control board 500. Therefore, compared to an embodiment without the support column CY, changes in the relative position and orientation between the communication board 600 and the control board 500 can be suppressed. Accordingly, according to Appendix 1-1, surface damage to the communication board 600 and the control board 500 caused by changes in the relative position and orientation of the communication board 600 and the control board 500 can be suppressed, and the possibility of fretting corrosion caused by surface damage to the communication board 600 and the control board 500 can be reduced.

[0123] <<Note 1-2>> The inkjet printer 1 according to Appendix 1-2 is the inkjet printer 1 according to Appendix 1-1, and is characterized in that it includes a transport unit 9 that includes a belt 97 for transporting a head unit 3 and a media transport mechanism 93 for transporting recording paper PP, and the drive control circuit 50 controls the transport unit 9 and the head unit 3 so that the head unit 3 forms an image on the recording paper PP while the head unit 3 is transported by the belt 97.

[0124] According to Appendix 1-2, even if vibration occurs when the head unit 3 is transported by the transport unit 9, the communication board 600 is supported by the support column CY, thus suppressing changes in the relative position and orientation of the communication board 600 and the control board 500.

[0125] <<Appendix 1-3>> The inkjet printer 1 according to Appendix 1-3 is an inkjet printer 1 according to Appendix 1-1 or Appendix 1-2, characterized in that the communication board 600 has a lower side surface 6001 supported by a support column CY and an upper side surface 6002 opposite to the lower side surface 6001, and an antenna 61 for wireless communication is provided on the upper side surface 6002.

[0126] According to Appendix 1-3, the possibility of interference with signal transmission and reception at antenna 61 can be reduced.

[0127] <<Notes 1-4>> The inkjet printer 1 described in Appendix 1-4 is the inkjet printer 1 described in Appendix 1-1 to Appendix 1-3, characterized in that the support column CY overlaps with the electronic components of the drive control circuit 50 when the communication board 600 is viewed in plan.

[0128] According to Appendix 1-4, compared to the configuration in which the support column CY is provided so as not to overlap with electronic components, the height of the support column CY can be reduced, enabling stable support of the communication board 600 by the support column CY.

[0129] <<Appendix 1-5>> The inkjet printer 1 described in Appendix 1-5 is the inkjet printer 1 described in Appendix 1-1 to Appendix 1-4, characterized in that the support column CY includes a base material SL made of silicone clay that has thermal conductivity, and thermal conductive particles PT added to the base material SL.

[0130] According to Appendix 1-5, the heat generated from the drive control circuit 50, which is provided on the control board 500, can be efficiently dissipated via the support column CY.

[0131] <<Notes 1-6>> The inkjet printer 1 described in Appendix 1-6 is the inkjet printer 1 described in Appendix 1-1 to Appendix 1-4, characterized in that the support column CY is made of silicone clay.

[0132] According to Appendix 1-6, changes in the relative position and orientation between the communication board 600 and the control board 500 can be suppressed.

[0133] <<Appendix 1-7>> The inkjet printer 1 described in Appendix 1-7 is the same as the inkjet printer 1 described in Appendix 1-4, and is characterized in that the electronic component is an electrolytic capacitor Cd such as an aluminum electrolytic capacitor.

[0134] According to Appendix 1-7, compared to the configuration in which the support column CY is provided so as not to overlap with the electrolytic capacitor Cd, the height of the support column CY is reduced, enabling stable support of the communication board 600 by the support column CY. Furthermore, according to Appendix 1-7, since the support column CY is provided so as to overlap with the electrolytic capacitor Cd, which has a simpler shape compared to other electronic components, the possibility of a gap occurring between the support column CY and the electrolytic capacitor Cd is reduced compared to the configuration in which the support column CY is provided so as to overlap with other electronic components, enabling stable support of the communication board 600 by the support column CY.

[0135] <<Appendix 1-8>> The inkjet printer 1 described in Appendix 1-8 is the same as the inkjet printer 1 described in Appendix 1-4, characterized in that the electronic component is an inductor L0 covered with a shield.

[0136] According to Supplementary Note 1-8, compared with the aspect where the inductor L0 does not have a shield, the inductor L0 has a surface shape with fewer irregularities, so the possibility of a gap occurring between the support column CY and the inductor L0 can be reduced, and stable support of the communication substrate 600 by the support column CY can be achieved. Also, according to Supplementary Note 1-8, compared with the aspect where the inductor L0 does not have a shield, the separation between the support column CY and the inductor L0 becomes easier, and the reusability of the inductor L0 can be increased.

[0137] <<Supplementary Note 1-9>> The inkjet printer 1 according to Supplementary Note 1-9 is the inkjet printer 1 according to Supplementary Notes 1-1 to 1-8, and is characterized by being portable.

[0138] According to Supplementary Note 1-9, even when vibrations occur due to the portability of the inkjet printer 1, since the communication substrate 600 is supported by the support column CY, changes in the relative position and orientation of the communication substrate 600 and the control substrate 500 can be suppressed.

[0139] <<Supplementary Note 1-10>> The inkjet printer 1 according to Supplementary Note 1-10 is the inkjet printer 1 according to Supplementary Notes 1-1 to 1-9, and is characterized in that the color of the support column CY is different from at least one of the colors of the communication substrate 600 and the control substrate 500.

[0140] According to Supplementary Note 1-10, since the workload of at least one of the operations of separating the support column CY from the control substrate 500 and the operation of separating the support column CY from the communication substrate 600 can be reduced, the reuse of at least one of the control substrate 500 and the communication substrate 600 can be facilitated, and the environmental load of the inkjet printer 1 can be reduced.

[0141] <<D.2. Supplementary Note 2>> Hereinafter, the smartphone 1B according to Supplementary Note 2 will be described.

[0142] <<Note 2-1>> The smartphone 1B according to Appendix 2-1 comprises a control board 500B, a communication board 600, and a board-to-board connector CN for connecting the control board 500B and the communication board 600 and for transmitting electrical signals between the control board 500B and the communication board 600, wherein the communication board 600 is supported by electrically insulating clay-like pillars CY relative to the control board 500B.

[0143] According to Appendix 2-1, the communication board 600 and the control board 500B are connected by a board-to-board connector CN, and the communication board 600 is supported by a support column CY relative to the control board 500B. Therefore, compared to an embodiment without the support column CY, changes in the relative position and orientation between the communication board 600 and the control board 500B can be suppressed. Accordingly, according to Appendix 2-1, surface damage to the communication board 600 and the control board 500B caused by changes in the relative position and orientation of the communication board 600 and the control board 500B can be suppressed, and the possibility of fretting corrosion caused by surface damage to the communication board 600 and the control board 500B can be reduced.

[0144] <<Note 2-2>> The smartphone 1B according to Appendix 2-2 is the smartphone 1B according to Appendix 2-1, wherein the communication board 600, when viewed from above, comprises an end region Ar1 including one end Eg1 of the communication board 600, an end region Ar2 including the other end Eg2 of the communication board 600, and an intermediate region Ar0 between the end region Ar1 and the end region Ar2, wherein the board-to-board connector CN is connected to the communication board 600 in the end region Ar1, and the support column CY supports the communication board 600 in the end region Ar2.

[0145] According to Appendix 2-2, since the board-to-board connector CN is connected to the communication board 600 in the end region Ar1 and the support column CY supports the communication board 600 in the end region Ar2, it is possible to support the communication board 600 more stably with respect to the control board 500B compared to a configuration in which one or both of the board-to-board connector CN and the support column CY are provided in the intermediate region Ar0.

[0146] <<Note 2-3>> The smartphone 1B relating to Appendix 2-3 is the smartphone 1B relating to Appendix 2-1 or Appendix 2-2, characterized in that the support column CY is provided in a position that overlaps with the electrolytic capacitor Cd provided on the control board 500B when the control board 500B is viewed in plan.

[0147] According to Appendix 2-3, compared to the configuration in which the support column CY is provided so as not to overlap with the electrolytic capacitor Cd, the height of the support column CY can be reduced, enabling stable support of the communication board 600 by the support column CY.

[0148] <<Note 2-4>> The smartphone 1B described in Appendix 2-4 is the same as the smartphone 1B described in Appendix 2-3, characterized in that the electrolytic capacitor Cd is larger than other electronic components located on the control board 500B in a position that does not overlap with the support column CY, when the control board 500B is viewed in plan.

[0149] According to Appendix 2-4, compared to the configuration in which the electrolytic capacitor Cd is smaller than other electronic components, the height of the support column CY can be reduced, enabling stable support of the communication board 600 by the support column CY.

[0150] <<Note 2-5>> The smartphone 1B described in Appendix 2-5 is the same as the smartphone 1B described in Appendix 2-3, characterized in that the support column CY is provided in a position that overlaps with the communication control circuit 62 provided on the communication board 600 when the communication board 600 is viewed in plan.

[0151] According to Appendix 2-5, compared to the configuration in which the support column CY is provided so as not to overlap with the communication control circuit 62, the height of the support column CY can be reduced, enabling stable support of the communication board 600 by the support column CY.

[0152] <<Note 2-6>> The smartphone 1B described in Appendix 2-6 is the smartphone 1B described in Appendix 2-1 to Appendix 2-5, characterized in that the support column CY includes a base material SL made of silicone clay that has thermal conductivity, and thermal conductive particles PT added to the base material SL.

[0153] According to Appendix 2-6, the heat generated from the drive control circuit 50B, which is located on the control board 500B, can be efficiently dissipated via the support column CY.

[0154] <<Note 2-7>> The smartphone 1B described in Appendix 2-7 is the smartphone 1B described in Appendix 2-1 to Appendix 2-5, and is characterized in that the support column CY is made of silicone clay.

[0155] According to Appendix 2-7, changes in the relative position and orientation between the communication board 600 and the control board 500B can be suppressed.

[0156] <<Note 2-8>> The smartphone 1B described in Appendix 2-8 is the smartphone 1B described in Appendix 2-1 to Appendix 2-7, and is characterized by being portable.

[0157] According to Appendix 2-8, even if vibration occurs when carrying the smartphone 1B, the communication board 600 is supported by the support column CY, thus suppressing changes in the relative position and orientation of the communication board 600 and the control board 500B.

[0158] <<Note 2-9>> The smartphone 1B described in Appendix 2-8 is the smartphone 1B described in Appendix 2-1 to Appendix 2-8, characterized in that the communication board 600 has a side length of 1 inch or less, and the communication board 600 is provided with a communication control circuit 62 that performs wireless communication.

[0159] According to Appendix 2-9, even when vibration occurs in the smartphone 1B, the small size of the communication board 600 supported by the support column CY makes it possible to suppress changes in the relative position and orientation of the communication board 600 and the control board 500B. [Explanation of Symbols]

[0160] 1...Inkjet printer, 1B...Smartphone, 2...Print control unit, 3...Head unit, 3B...Display unit, 4...Drive signal generation unit, 5...Drive control unit, 5B...Display control unit, 6...Wireless communication unit, 21...Print control circuit, 22...Memory circuit, 41...Integrated circuit, 43...Amplifier circuit, 44...Smoothing circuit, 51...Display control circuit, 52...Memory circuit, 61...Antenna, 62...Communication control circuit, 500...Control board, 500B...Control board, 600...Communication board, Cd...Electrolytic capacitor, CN...Board-to-board connector, CY...Support column, L0...Inductor, PT...Thermal conductive particle, SL...Substrate, TrH...Transistor, TrL...Transistor.

Claims

1. First circuit board and The second circuit board and A connecting component for connecting the first board and the second board, and for transmitting electrical signals between the first board and the second board, Equipped with, The second substrate is supported by electrically insulating clay-like pillars relative to the first substrate. An electronic device characterized by the following features.

2. The aforementioned second substrate is When the second substrate is viewed in plan view, A first region including one end of the second substrate, A second region including the other end of the second substrate, The region comprises an intermediate region between the first region and the second region, The aforementioned connecting component is connected to the second substrate in the first region, The support column supports the second substrate in the second region. The electronic device according to claim 1, characterized in that...

3. The support column is positioned so as to overlap with the first electronic component provided on the first substrate when viewed in plan. The electronic device according to claim 1, characterized in that...

4. The first electronic component is larger than other electronic components located on the first substrate in a position that does not overlap with the support column, when the first substrate is viewed in plan. The electronic device according to claim 3, characterized in that

5. The support column is positioned so as to overlap with the second electronic component provided on the second substrate when viewed from above. The electronic device according to claim 3, characterized in that

6. The aforementioned support column has thermal conductivity, A base material made of silicone clay and heat-conducting particles added to the base material, The electronic device according to claim 1, characterized in that...

7. The aforementioned support column is made of silicone clay. The electronic device according to claim 1, characterized in that...

8. The aforementioned electronic device is portable. The electronic device according to claim 1, characterized in that...

9. The second substrate has a side length of 1 inch or less. The second board is provided with a communication circuit for performing wireless communication. The electronic device according to claim 1, characterized in that...

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