Processing method, chip manufacturing method, and dressing member

Abstract

The present invention provides a processing method, a chip manufacturing method, and a dressing component that enable the dressing step to be performed without requiring extra effort. [Solution] The processing method comprises a holding step S11 in which the wafer 1 is held on the holding surface of the chuck table 10, a cutting step S12 in which the wafer 1 is cut by the cutting blade 23, and a dressing step S13 in which a dressing member 31 containing abrasive grains and stretched in a linear shape is brought into contact with the cutting blade 23 while being fed in the stretching direction to dress the cutting blade 23.

Description

Technical Field

[0001] The present invention relates to a processing method, a method for manufacturing a chip, and a dressing member.

Background Art

[0002] A wafer on which a plurality of devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are partitioned by a dicing line and formed on the surface is divided into individual device chips by a cutting device and used in electric devices such as mobile phones and personal computers.

[0003] For example, a cutting device includes a chuck table for holding a wafer, cutting means rotatably provided with a cutting blade for cutting the wafer held by the chuck table, and feeding means for relatively feeding the chuck table and the cutting means, and divides the wafer into individual device chips (see, for example, Patent Documents 1 and 2).

[0004] In such a cutting device, when the cutting ability of the cutting blade decreases, dressing including dressing and shaping of the cutting blade is performed.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] The cutting apparatus described in Patent Document 1 has the problem that dressing the cutting blade is time-consuming because it is necessary to load and unload the dressing board to and from the chuck table. The cutting apparatus described in Patent Document 2 also has the problem that dressing the cutting blade is time-consuming because it is necessary to replace the dressing board as needed.

[0007] One of the objectives of the present invention is to provide a processing method, a chip manufacturing method, and a dressing member that can perform the dressing step without requiring much effort. [Means for solving the problem]

[0008] The present invention A holding step in which the workpiece is held on the holding surface of the holding table, A machining step of machining the workpiece with a grinding wheel tool, The processing method comprises a dressing step, in which a dressing member containing abrasive grains and stretched in a linear shape is brought into contact with the grinding tool while being fed in the stretching direction to dress the grinding tool.

[0009] Furthermore, the present invention is A method for manufacturing chips, which divides a substrate, in which devices are formed in each region partitioned by multiple division lines, into multiple chips, A holding step of holding the substrate with a holding table, A cutting step in which the substrate is cut along the planned division line using a cutting blade having a grinding wheel portion, The system includes a dressing step in which a dressing member containing abrasive grains and stretched in a linear shape is fed in the stretching direction, and the dressing member is brought into contact with the cutting blade to dress it.

[0010] Furthermore, the present invention is A method for manufacturing chips, which divides a substrate, in which devices are formed in each region partitioned by multiple division lines, into multiple chips, A holding step of holding the substrate by a holding table; A grinding step of grinding the substrate with a grinding wheel having a grindstone part; A dressing step of dressing the grinding wheel by bringing a dressing member containing abrasive grains and linearly extended in an extension direction into contact with the grinding wheel while feeding the dressing member in the extension direction; A cutting step of cutting along a planned dividing line of the substrate with a cutting blade, and the method includes these steps.

[0011] In addition, the present invention is A dressing member for dressing a grindstone tool, At least the outer surface contains abrasive grains and has a linearly extended shape, The outer surface is brought into contact with the grindstone tool to dress the grindstone tool.

Advantages of the Invention

[0012] According to the present invention, the dressing step can be carried out without much labor.

Brief Description of the Drawings

[0013] [Figure 1] FIG. 1 is a perspective view of a wafer having a plurality of devices formed on its surface. [Figure 2] FIG. 2 is a view showing a state of cutting a wafer by a cutting device. [Figure 3] FIG. 3 is a flowchart showing an example of a processing method according to the first embodiment. [Figure 4] FIG. 4 is a view for explaining an example of a dressing step for a cutting blade. [Figure 5] FIG. 5 is a view for explaining another example of a dressing step for a cutting blade. [Figure 6] FIG. 6 is a perspective view of a cutting device provided with a dressing mechanism according to a modification. [Figure 7] FIG. 7 is a view showing a state of grinding a wafer by a grinding device. [Figure 8]FIG. 8 is a flowchart showing an example of the processing method of the second embodiment. [Figure 9] FIG. 9 is a diagram for explaining an example of a dressing step for a grinding wheel.

Embodiments for Carrying Out the Invention

[0014] Hereinafter, each embodiment of the processing method, the chip manufacturing method, and the dressing member of the present invention will be described based on the accompanying drawings.

[0015] [First Embodiment] The first embodiment of the processing method of the present invention will be described. The processing method of the first embodiment performs cutting on a workpiece, and by performing the cutting, the workpiece is divided to manufacture chips.

[0016] First, the wafer 1 (an example of a workpiece) that is the processing target in the processing method will be described. FIG. 1 is a perspective view of the wafer 1 on which a plurality of devices D are formed on the surface 1a.

[0017] The wafer 1 is a substrate made of, for example, a material such as silicon, SiC (silicon carbide), or other semiconductors, or a material such as sapphire, glass, or quartz.

[0018] The surface of the wafer 1 is partitioned into a plurality of regions by a plurality of division planned lines (streets) L that intersect, and devices D such as IC (Integrated Circuit) and LSI (Large Scale Integration) are formed in each of the partitioned regions. Finally, by dividing the wafer 1 along the division planned line L, individual chips are formed.

[0019] A tape T is adhered to a metal frame F on the back surface 1b of the wafer 1. The wafer 1 is cut in a state of a frame unit integrated with the tape T and the frame F.

[0020] Figure 2 shows the cutting process of wafer 1 by cutting device 2. Cutting device 2 comprises a chuck table 10 that holds wafer 1 in frame unit form, a cutting unit 20 having a cutting blade 23 that cuts wafer 1 held in the chuck table 10 to divide it into multiple chips, a dressing mechanism 30 that dresses the cutting blade 23, and a controller 50 that controls each element of cutting device 2.

[0021] The chuck table 10 has a disc-shaped holding surface on its upper surface for holding wafers 1, and the wafers 1 placed on the holding surface are held in place by a suction source (not shown). Around the chuck table 10, a plurality of clamp units 15 (four in the illustrated example) are arranged at equal intervals along the circumferential direction of the chuck table 10. Each clamp unit 15 secures a frame F placed on the chuck table 10.

[0022] The chuck table 10 is rotatable around a central axis extending perpendicular to the holding surface (vertical direction) by means of a spindle and motor, etc. The chuck table 10 is also movable, for example, in the X direction (horizontal direction) as shown in the figure, by means of a ball screw and motor, etc. The chuck table 10 may also be movable along the Y direction (horizontal direction perpendicular to the X direction) and the Z direction (vertical direction) as shown in the figure.

[0023] The cutting unit 20 includes a spindle housing 21, a spindle 22 supported inside the spindle housing 21, and a cutting blade 23 mounted on the tip of the spindle 22.

[0024] The spindle housing 21 has a cylindrical shape and is positioned so that its longitudinal direction is horizontal. The tip of the spindle housing 21 is open, and the tip of the spindle 22 protrudes from it.

[0025] The spindle 22 has a cylindrical shape and is positioned so that its longitudinal direction is horizontal. The spindle 22 is rotatably housed in the spindle housing 21. A rotational drive source, such as a motor, is provided near the base end of the spindle 22.

[0026] The cutting blade 23 has a cutting edge (grinding wheel portion) on its outer circumference in which abrasive grains made of diamond or CBN (Cubic Boron Nitride), etc., are dispersed and fixed with a binder made of resin or metal such as nickel. The cutting blade 23 is an example of a grinding tool. The cutting blade 23 may be configured as a hub blade having a hub base, or as a hubless blade without a hub base. Although not shown in the figures, the cutting device 2 is provided with cutting fluid supply nozzles that supply cutting fluid to the front and back sides of the cutting blade 23, and cutting fluid is supplied during the cutting process.

[0027] The cutting unit 20 is provided to be movable along the Y and Z directions in the figure, for example, by means of a ball screw and a motor. The cutting unit 20 may also be provided to be movable along the X direction in the figure.

[0028] When performing cutting, the cutting unit 20 uses a moving mechanism to position the cutting blade 23 on the extension of the planned division line L on the wafer 1, and rotates the cutting blade 23 while supplying cutting fluid. In this state, as the chuck table 10 moves along the X direction, the cutting blade 23 cuts the wafer 1 along the planned division line L. When cutting along one planned division line L is completed, the cutting unit 20 moves the cutting blade 23 in the Y direction (indexing feed direction) to position it on the extension of the adjacent planned division line L, and cuts the wafer 1 along the planned division line L.

[0029] The dressing mechanism 30 dresses the cutting blade 23 by bringing a dressing member 31, which contains abrasive grains and is stretched in a linear shape, into contact with the cutting blade 23 while feeding it in the stretching direction.

[0030] The dressing mechanism 30 of this embodiment includes a storage section 33 for storing a fluid 32 formed by mixing abrasive particles with a fluid binder, a flow path 34 such as a tube connected to the storage section 33, an on / off valve 35 and a pump 36 provided on the flow path 34, and a dressing member generation section 37 for generating a dressing member 31 from the fluid 32 discharged from the storage section 33.

[0031] The binder used to form the fluid 32 can be selected from, for example, a thermoplastic resin or a gelling agent.

[0032] As the thermoplastic resin, it is preferable to use any of the following, for example: polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyvinyl acetate, polyurethane, ABS resin, AS resin, acrylic resin, polylactic acid, polyetherimide, polyamide nylon, polyacetal, polycarbonate, modified polyphenylene ether, polyethylene terephthalate, polybutylene terephthalate, cyclic polyolefin, polyphenylene sulfide, polytetrafluoroethylene, polysulfone, polyethersulfone, amorphous polyarylate, liquid crystal polymer, polyetheretherketone, thermoplastic polyimide, or polyamideimide.

[0033] As a gelling agent, it is preferable to use one of the following, for example, pectin, guar gum, xanthan gum, tamarind gum, carrageenan, propylene glycol, carboxymethylcellulose, gelatin, or agar.

[0034] The abrasive particles contained in the fluid 32 can be selected from, for example, silicon carbide, alumina, or diamond.

[0035] The storage section 33 is equipped with a heating heater (e.g., a Peltier element) 33a for heating the stored fluid 32 and a vibrator (e.g., a piezoelectric element) 33b for vibrating the storage section 33 to agitate the fluid 32, as needed, in order to properly maintain the fluidity of the stored fluid 32.

[0036] The fluid 32 stored in the storage section 33 is pumped to the dressing member generation section 37 when the pump 36 operates and the on-off valve 35 opens. The timing and flow rate of the pumped fluid 32 can be set arbitrarily. The configuration for sending the fluid 32 from the storage section 33 to the dressing member generation section 37 is not limited to this, and for example, the pump 36 may not be provided in the flow path 34. Specifically, the fluid 32 may be sent from the storage section 33 to the dressing member generation section 37 by sealing the storage section 33 and installing an air pump to introduce high-pressure air inside the storage section 33.

[0037] The dressing member generation unit 37 is located downstream of the pump 36 on the flow path 34 and generates a dressing member 31 that is stretched into a linear shape (in other words, a wire shape) by cooling and solidifying the fluid 32 sent out from the storage unit 33. The dressing member generation unit 37 is composed of, for example, a Peltier element.

[0038] The dressing member 31 produced by the dressing member generation unit 37 is formed containing abrasive grains on at least its outer surface (the outer peripheral surface 31a and tip 31b, which will be described later). Furthermore, since the dressing member 31 is made of a flexible material, it is configured to be deformable.

[0039] The dressing member 31 generated in the dressing member generation unit 37 is guided to the cutting blade 23 via a guide mechanism such as a roller (not shown). Since the dressing member 31 is deformable, there is a high degree of freedom in arranging the dressing member 31 from the dressing member generation unit 37 to the cutting blade 23.

[0040] The dressing member 31, which is guided to the cutting blade 23, is appropriately tensioned, and the dressing member 31 comes into contact with the cutting blade 23 while under tension.

[0041] It is preferable that the dressing member 31 is movable integrally with the cutting unit 20. With this configuration, the dressing member 31 can move in conjunction with the movement of the cutting unit 20 in the Y and Z directions. Furthermore, with this configuration, the dressing member 31 can move while maintaining contact with the cutting blade 23.

[0042] Thus, since the cutting device 2 is equipped with a dressing mechanism 30, there is no need to load or unload the dressing board to or from the cutting device 2 when dressing the cutting blade 23. Therefore, the cutting blade 23 can be dressed without any extra effort.

[0043] The controller 50 includes, for example, a processor (e.g., a central processing unit (CPU)) and a storage device including main memory (e.g., volatile memory) and auxiliary storage device (e.g., non-volatile memory). The controller 50 controls the operation of the components of the cutting device 2 by operating the processor according to a pre-stored program.

[0044] Figure 3 is a flowchart showing an example of a processing method according to the first embodiment. The processing method according to the first embodiment includes a holding step S11 in which the wafer 1 is held on the holding surface of the chuck table 10, a cutting step S12 in which the wafer 1 is cut along the planned division line L with a cutting blade 23 to divide the plurality of devices D formed on the wafer 1 into a plurality of chips, and a dressing step S13 in which the cutting blade 23 is brought into contact with a dressing member 31 to dress the cutting blade 23.

[0045] The dressing step S13 brings the linearly stretched dressing member 31 into contact with the cutting blade 23 while feeding it in the stretching direction.

[0046] Figure 4 is a diagram illustrating an example of the dressing step S13. In the example shown in Figure 4, the dressing step S13 brings the outer peripheral surface 31a of the dressing member 31, which extends in the extension direction, into contact with the cutting blade 23. The dressing member 31 extends along the tangential direction of the cutting blade 23 and contacts the cutting blade 23. With this configuration, a relatively large contact area can be obtained between the dressing member 31 and the cutting blade 23, so that stable dressing can be performed on the cutting blade 23.

[0047] In the example shown in Figure 4, it is preferable that the direction in which the dressing member 31 is fed at the contact point between the dressing member 31 and the cutting blade 23 is set to be opposite to the rotational direction of the cutting blade 23. This improves the dressing performance.

[0048] Figure 5 illustrates another example of the dressing step S13. In the example shown in Figure 5, the dressing step S13 brings the tip 31b of the dressing member 31 into contact with the cutting blade 23. The dressing member 31 is guided to the cutting blade 23, for example, through a pipe 38 that is routed to the vicinity of the cutting blade 23.

[0049] Thus, since the dressing step S13 dresses the cutting blade 23 while feeding the dressing member 31 in the stretching direction, it is less troublesome to replace the dressing member 31 compared to when dressing is performed by loading and unloading a dressing board. In addition, the dressing process on the cutting blade 23 can always be performed with a new dressing member 31.

[0050] Furthermore, since the dressing step S13 brings the linearly stretched dressing member 31 into contact with the cutting blade 23 while feeding it in the stretching direction, the dressing step S13 can be performed while the cutting step S12 is being carried out. Therefore, the time required to dress the cutting blade 23 can be made virtually zero.

[0051] If the dressing step S13 is performed while the cutting step S12 is being carried out, the feed rate of the dressing member 31 may be changed in the dressing step S13 based on the processing status of the cutting step S12. For example, if clogging occurs in the cutting blade 23 during the dressing step S13 and cutting step S12, and the drive current value for rotating the cutting blade 23 increases, the controller 50 can change the feed rate of the dressing member 31 to resolve the clogging of the cutting blade 23. In this way, appropriate dressing can be performed on the wafer 1 based on the processing status of the cutting step S12, and processing quality can be kept constant.

[0052] During the dressing step S13, some of the dressing material 31 may be scattered, but it is washed away and recovered by the cutting fluid sprayed from a cutting fluid supply nozzle (not shown).

[0053] (modified version) Figure 6 is a perspective view of the cutting apparatus 2 equipped with a modified dressing mechanism 30. The configuration of the chuck table 10, cutting unit 20, and controller 50 is the same as in the example described above, so a description is omitted.

[0054] The modified dressing mechanism 30 includes a reel 41 on which the dressing member 31 is wound, and a feeding unit 42 that feeds the dressing member 31 from the reel 41. The dressing member 31, as in the example described above, contains abrasive grains and has a linearly elongated shape. In this modified version, the dressing member 31, which is pre-produced at a location different from the cutting device 2, is attached to the cutting device 2 while wound on the reel 41.

[0055] As mentioned above, the dressing member 31 is made of a flexible material and is configured to be deformable, so the dressing member 31 can be managed while wound around the reel 41.

[0056] The feed unit 42 includes a drive motor 43, a drive roller 44 disposed at the tip of the rotating shaft of the drive motor 43, and a guide roller 45 that rotates in contact with the drive roller 44. The dressing member 31 pulled out from the reel 41 is fed in the extension direction by the drive roller 44 and the guide roller 45, and is guided to the cutting blade 23 via a guide mechanism such as a roller (not shown).

[0057] To explain in more detail, the dressing member 31 pulled out from the reel 41 is held between the drive roller 44 and the guide roller 45. When the dressing member 31 is fed in the stretching direction, the controller 50 operates the drive motor 43 to rotate the drive roller 44 in the direction indicated by arrow R1. When the drive roller 44 rotates in the direction indicated by arrow R1, the guide roller 45 rotates in the direction indicated by arrow R2, and the dressing member 31 is fed toward the cutting blade 23.

[0058] Even with this modified dressing mechanism 30, the cutting blade 23 is dressed while the dressing member 31 is fed in the stretching direction, so there is no hassle in replacing the dressing member 31. In addition, the dressing process on the cutting blade 23 can always be performed with a new dressing member 31.

[0059] [Second Embodiment] A second embodiment of the processing method of the present invention will now be described. The processing method of the second embodiment involves thinning a workpiece. Thinning includes grinding and / or polishing, but here we will describe grinding as an example.

[0060] Figure 7 shows the process of grinding a wafer using the grinding apparatus 6. The grinding apparatus 6 includes, for example, a chuck table 60 that holds the wafer 1 on its holding surface with the back surface 1b facing upwards, a spindle 62 that extends vertically and is rotatable by a drive source such as a motor, a disc-shaped mount 63 fixed to the lower end of the spindle 62, and a grinding wheel 64 fixed to the lower end of the mount 63. The spindle 62 is provided so as to be able to move up and down vertically relative to the chuck table 60.

[0061] The grinding wheel 64 has, for example, an annular wheel base 65 made of a metal material such as stainless steel or aluminum, and a plurality of grinding wheel portions 66 arranged in an annular pattern on the lower surface of the wheel base 65. The grinding wheel portions 66 include, for example, a binder made of ceramics, resin, metal material, etc., and countless abrasive grains such as diamond dispersed and fixed in the binder. The grinding wheel 64 is an example of a grinding tool.

[0062] Furthermore, the grinding device 6 is further equipped with the aforementioned dressing mechanism 30 and controller 50, and the dressing mechanism 30 dresses the grinding wheel portion 66 of the grinding wheel 64. Since the grinding device 6 is equipped with the dressing mechanism 30, there is no need to load or unload the dressing board to or from the grinding device 6 when dressing the grinding wheel 64. Therefore, the grinding wheel 64 can be dressed without any extra effort.

[0063] Figure 8 is a flowchart showing an example of a processing method according to the second embodiment. The processing method according to the second embodiment comprises a holding step S21 in which the wafer 1 is held on the holding surface of the chuck table 60, a grinding step S22 in which the wafer 1 is ground with a grinding wheel 64, and a dressing step S23 in which the grinding wheel 64 is dressed.

[0064] As shown in Figure 9, grinding step S22 involves grinding the back surface 1b of the wafer 1 held by the chuck table 60 with the grinding wheel portion 66 of the grinding wheel 64 to thin the wafer 1. Grinding step S22 is performed, for example, by infeed grinding. In infeed grinding, the positional relationship between the chuck table 60 and the grinding wheel 64 is adjusted so that the center of the wafer 1 held by the chuck table 60 coincides with the trajectory of the grinding wheel portion 66. Then, infeed grinding is performed by rotating the chuck table 60 and the grinding wheel 64 respectively, while lowering the grinding wheel 64 along the processing feed direction (vertical direction) parallel to the rotation axis of the spindle 62. As a result, the lower surface of the grinding wheel portion 66 comes into contact with the back surface 1b (upper surface) of the wafer 1, and the wafer 1 is ground.

[0065] The dressing step S23 dresses the grinding wheel 64 by bringing the dressing member 31, which contains abrasive grains and is stretched in a linear shape, into contact with the grinding wheel 64 while feeding it in the stretching direction. Specifically, the dressing member 31 extends horizontally and is positioned so as not to overlap with the holding surface of the chuck table 60 when viewed from above. The outer peripheral surface 31a of the dressing member 31, which extends in the stretching direction, contacts the grinding wheel portion 66 from below.

[0066] Thus, the dressing step S23 dresses the grinding wheel 64 while feeding the dressing member 31 in the extension direction, which reduces the effort required to replace the dressing member 31 compared to the case where a dressing board is brought in and out for dressing. In addition, the dressing process on the grinding wheel 64 can always be performed with a new dressing member 31.

[0067] Furthermore, since the dressing step S23 brings the linearly stretched dressing member 31 into contact with the grinding wheel 64 while feeding it in the stretching direction, the dressing step S23 can be performed while the grinding step S22 is being carried out. Therefore, the time required for the dressing step S23 can be made virtually zero.

[0068] In the dressing step S23, the feed rate of the dressing member 31 may be changed based on the processing status of the grinding step S22. For example, if clogging occurs in the grinding wheel 64 during the execution of the grinding step S22 and the dressing step S23, and the drive current value for rotating the grinding wheel 64 increases, the controller 50 can change the feed rate of the dressing member 31 to resolve the clogging of the grinding wheel 64. In this way, appropriate dressing can be performed on the wafer 1 based on the processing status of the grinding step S22, and processing quality can be kept constant.

[0069] After grinding, wafer 1 is transported to cutting machine 2, where it is divided into multiple chips. This process manufactures chips.

[0070] In the second embodiment described above, the outer peripheral surface 31a of the dressing member 31 contacts the grinding wheel portion 66 from below. However, as in the modified example of the first embodiment described above, the tip 31b of the dressing member 31 may contact the grinding wheel portion 66 from below.

[0071] Although embodiments of the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to these embodiments. It is clear to those skilled in the art that various modifications or alterations can be conceived within the scope of the claims, and these will naturally also fall within the technical scope of the present invention. Furthermore, the components of the above embodiments may be combined in any way without departing from the spirit of the invention.

[0072] For example, in the embodiments described above, the dressing steps S13 and S23 were performed during the cutting step S12 or grinding step S22, but this is not limited to that. For example, the dressing steps S13 and S23 may be performed at any timing before or after the cutting step S12 or grinding step S22.

[0073] This specification includes at least the following: The components and other elements corresponding to those in the embodiments described above are shown in parentheses as examples, but are not limited thereto.

[0074] (1) Holding steps (holding steps S11, S21) in which the workpiece (wafer 1) is held on the holding surface of the holding table (chuck table 10, 60), The process involves machining the workpiece using a grinding tool (cutting blade 23, grinding wheel 64) in a cutting step (cutting step S12, grinding step S22), The system includes a dressing step (dressing step S13, S23) which dresses the grinding wheel tool by bringing a linearly stretched dressing member (dressing member 31) containing abrasive grains into contact with the grinding wheel tool while feeding it in the stretching direction. Processing method.

[0075] According to (1), the dressing step dresses the grinding tool by bringing the linearly extended dressing member into contact with the grinding tool while feeding it in the direction of extension, thus eliminating the need to load and unload the dressing board.

[0076] (2) The processing method described in (1), The dressing step is performed during the execution of the processing step. Processing method.

[0077] According to (2), since the dressing step is performed during the processing step, the time required for the dressing step can be made virtually zero.

[0078] (3) The processing method described in (2), The dressing step changes the feed rate of the dressed member based on the processing status of the processing step. Processing method.

[0079] According to (3), appropriate dressing can be performed on the workpiece based on the processing status of the processing steps, and processing quality can be kept consistent.

[0080] (4) A processing method described in any of (1) to (3), The dressing step dresses the grinding tool by bringing the outer peripheral surface (outer peripheral surface 31a) of the dressing member extending in the extension direction into contact with the grinding tool. Processing method.

[0081] According to (4), a relatively large contact area can be made between the dressing member and the grinding tool, so that stable dressing can be performed on the grinding tool.

[0082] (5) A method for manufacturing chips, which divides a substrate (wafer 1) into multiple chips, each of which a device (device D) is formed in a region partitioned by a plurality of division lines (division lines L), The holding step (holding step S11) involves holding the substrate with a holding table (chuck table 10), A cutting step (cutting step S12) in which a cutting blade (cutting blade 23) having a grinding wheel portion cuts along the planned division line of the substrate, The system includes a dressing step (dressing step S13) in which a dressing member (dressing member 31) containing abrasive grains and stretched in a linear shape is fed in the stretching direction, and the dressing member is brought into contact with the cutting blade to dress it. A method for manufacturing chips.

[0083] According to (5), the dressing step dresses the cutting blade by bringing the linearly stretched dressing member into contact with the cutting blade while feeding it in the stretching direction, thus eliminating the need to load and unload the dressing board. As a result, the productivity of the final chip can be improved.

[0084] (6) A method for manufacturing chips, comprising dividing a substrate (wafer 1) into multiple chips, wherein each region partitioned by multiple division lines (division lines L) has a device (device D) formed on it, The holding step (holding step S21) involves holding the substrate with a holding table (chuck table 60), A grinding step (grinding step S22) is performed by grinding the substrate with a grinding wheel (grinding wheel 64) having a grinding wheel portion, A dressing step (dressing step S23) involves feeding a dressing member (dressing member 31), which is contained in abrasive grains and stretched in a linear shape, in the stretching direction, while bringing the dressing member into contact with the grinding wheel to dress it. The system includes a cutting step (cutting step S12) in which a cutting blade (cutting blade 23) cuts along the planned division line of the substrate, A method for manufacturing chips.

[0085] According to (6), the dressing step dresses the grinding wheel by bringing the linearly stretched dressing member into contact with the grinding wheel while feeding it in the stretching direction, thus eliminating the need to load and unload the dressing board. As a result, the productivity of the final chip can be improved.

[0086] (7) A dressing member (dressing member 31) for dressing a grinding tool (cutting blade 23, grinding wheel 64), It contains abrasive grains on at least its outer surface (outer surface 31a, tip 31b) and has a linearly elongated shape. The outer surface is brought into contact with the grinding wheel tool to dress the grinding wheel tool. Dress components.

[0087] According to (7), grinding tools can be dressed using a linear dressing member without having to load or unload dressing boards to or from the processing equipment.

[0088] (8) The dress member described in (7), It is made of a flexible material and is deformable. Dress components.

[0089] According to (8), the dress components can be managed while rolled up. In addition, the degree of freedom in arranging the dress components can be increased. [Explanation of Symbols]

[0090] 1. Wafer (workpiece, substrate) 10. Chuck table (holding table) 23 Cutting blades (grinding tools) 31 Dress components 31a Outer surface 60 Chuck Table (Holding Table) 64 Grinding Wheels (Grinding Tools) S11 Holding step S12 Cutting step (machining step) S13 Dress Step S21 Holding step S22 Grinding step (machining step) S23 Dress Step D Device L division planned line

Claims

1. A holding step in which the workpiece is held on the holding surface of the holding table, A machining step of machining the workpiece with a grinding wheel tool, The system includes a dressing step, which involves bringing a dressing member containing abrasive grains and stretched in a linear shape into contact with the grinding tool while feeding it in the stretching direction to dress the grinding tool, Processing method.

2. The processing method according to claim 1, The dressing step is performed during the execution of the processing step. Processing method.

3. The processing method according to claim 2, The dressing step changes the feed rate of the dressed member based on the processing status of the processing step. Processing method.

4. A processing method according to any one of claims 1 to 3, The dressing step dresses the grinding tool by bringing the outer peripheral surface of the dressing member extending in the extension direction into contact with the grinding tool. Processing method.

5. A method for manufacturing chips, which divides a substrate, in which devices are formed in each region partitioned by multiple division lines, into multiple chips, A holding step of holding the substrate with a holding table, A cutting step in which the substrate is cut along the planned division line using a cutting blade having a grinding wheel portion, The system includes a dressing step in which a dressing member containing abrasive grains and stretched in a linear shape is fed in the stretching direction, and the dressing member is brought into contact with the cutting blade to dress it. A method for manufacturing chips.

6. A method for manufacturing chips, which divides a substrate, in which devices are formed in each region partitioned by multiple division lines, into multiple chips, A holding step of holding the substrate with a holding table, A grinding step of grinding the substrate with a grinding wheel having a grinding wheel portion, A dressing step in which a dressing member containing abrasive grains and stretched in a linear shape is fed in the stretching direction and the dressing member is brought into contact with the grinding wheel to dress it, The cutting step includes cutting the substrate along the planned division line using a cutting blade, A method for manufacturing chips.

7. A dressing member for dressing grinding tools, It contains abrasive grains on at least its outer surface and has a linearly elongated shape, The outer surface is brought into contact with the grinding wheel tool to dress the grinding wheel tool. Dress components.

8. The dress member according to claim 7, It is made of a flexible material and is deformable. Dress components.

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