Forming method

Abstract

The objective is to provide a molding method that reduces the decrease in the yield of molded products. [Solution] A molding method according to one embodiment of the present disclosure includes a mold including a first mold having a first opposing surface and a second mold having a second opposing surface facing the first opposing surface in a first direction and including a first recess; a film having a first surface and a second surface opposite to the first surface in a first direction, wherein the first surface is in contact with the first opposing surface and the second surface is in contact with the second opposing surface, and the second surface is in contact with the inner surface of the first recess, and the first surface defines the second recess; an uncured intermediate member disposed in the second recess and in contact with the first surface; a step of curing the intermediate member to form a molded body; and a step of separating the second mold and the film while the molded body, the first mold, and a part of the first surface are in contact.

Description

Technical Field

[0001] The present disclosure relates to a molding method.

Background Art

[0002] Patent Document 1 discloses a resin molding method using a mold in which a cavity is provided in at least one of a first mold and a second mold arranged opposite to each other, and includes a step of feeding a film using a first roller between the first mold and the second mold, and a step of winding up the film using a second roller from between the first mold and the second mold.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide a molding method for reducing a decrease in the yield of a molded body.

Means for Solving the Problems

[0005] A molding method according to one embodiment of the present disclosure includes a mold comprising: a first mold having a first opposing surface; a second mold having a second opposing surface facing the first opposing surface in a first direction and including a first recess; a film having a first surface and a second surface opposite to the first surface in a first direction, wherein the first surface is in contact with the first opposing surface and the second surface is in contact with the second opposing surface, and the second surface is in contact with the inner surface of the first recess, with the first surface defining the second recess; and an uncured intermediate member disposed in the second recess and in contact with the first surface; a step of curing the intermediate member to form a molded body; and a step of separating the second mold and the film while the molded body, the first mold, and a part of the first surface are in contact. [Effects of the Invention]

[0006] According to one embodiment of the present disclosure, the decrease in the yield of molded articles can be reduced. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic cross-sectional view showing a molding apparatus according to the first embodiment. [Figure 2] This is a partial cross-sectional view of the molding apparatus, showing an enlarged view of region II in Figure 1. [Figure 3] This is a schematic cross-sectional view illustrating an example of a molding method according to the first embodiment. [Figure 4] This is a schematic cross-sectional view illustrating an example of a molding method according to the first embodiment. [Figure 5] This is a schematic cross-sectional view illustrating an example of a molding method according to the first embodiment. [Figure 6] This is a schematic cross-sectional view illustrating an example of a molding method according to the first embodiment. [Figure 7] This is a schematic cross-sectional view illustrating an example of a molding method according to the second embodiment. [Figure 8] This is a schematic cross-sectional view illustrating an example of a molding method according to the second embodiment. [Figure 9]This is a schematic cross-sectional view illustrating an example of a molding method according to the second embodiment. [Figure 10] This is a schematic cross-sectional view illustrating an example of a molding method according to the second embodiment. [Figure 11] This is a schematic cross-sectional view illustrating an example of a molding method according to the second embodiment. [Figure 12] This is a schematic cross-sectional view illustrating an example of a molding method according to the third embodiment. [Figure 13] This is a schematic cross-sectional view illustrating an example of a molding method according to the third embodiment. [Figure 14] This is a schematic cross-sectional view showing a molded body according to an embodiment. [Figure 15] This is a schematic perspective view showing a molded body according to an embodiment. [Modes for carrying out the invention]

[0008] Hereinafter, a molding method and a molding apparatus for carrying out the molding method according to the embodiments of this disclosure will be described in detail with reference to the drawings. However, the embodiments shown below are illustrative examples of molding methods and molding apparatus for realizing the technical concept of the embodiments and are not limited thereto. Furthermore, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of this disclosure to those described therein, unless otherwise specified, but are merely illustrative examples. Note that the size, positional relationships, etc. of the members shown in each drawing may be exaggerated for clarity of explanation. Also, in the following description, the same name and reference numerals indicate the same or similar members, and detailed explanations will be omitted as appropriate. In some cases, end view diagrams showing only the cut surface will be used as cross-sectional views.

[0009] In the figures shown below, the directions may be indicated by the X-axis, Y-axis, and Z-axis. The X-axis, Y-axis, and Z-axis are directions that are orthogonal to each other. In the X-axis direction, the direction in which the arrow points is denoted as the +X direction or the +X side, and the opposite direction of the +X direction or the +X side is denoted as the -X direction or the -X side. In the Y-axis direction, the direction in which the arrow points is denoted as the +Y direction or the +Y side, and the opposite direction of the +Y direction or the +Y side is denoted as the -Y direction or the -Y side. In the Z-axis direction, the direction in which the arrow points is denoted as the +Z direction or the +Z side, and the opposite direction of the +Z direction or the +Z side is denoted as the -Z direction or the -Z side. Also, in the terms of the embodiments, the top view means viewing the object from the +Z direction or the +Z side. However, these do not limit the orientation during the use of the molding method and the molding apparatus. In the embodiments shown below, orthogonal may include an error within ±5° with respect to 90°. Also, in this specification, "parallel" includes not only the case where two straight lines, sides, surfaces, etc. do not intersect even when extended, but also the case where the angle formed by two straight lines, sides, surfaces, etc. intersects within a range of 10° or less.

[0010] Also, in the present disclosure, unless otherwise specified, regarding polygons such as rectangles, those having shapes subjected to processing such as rounding, chamfering, or corner cutting at the corners of the polygon are also referred to as polygons. Also, not limited to the corners (i.e., the ends of the sides), those having shapes subjected to processing in the middle part of the sides are similarly referred to as polygons. That is, shapes with partial processing while leaving the polygon as a base are included in the interpretation of the "polygon" described in the present disclosure.

[0011] Also, the same applies to terms representing specific shapes such as trapezoids, circles, and concavities and convexities, not limited to polygons. The same also applies to terms regarding each side forming the shape. That is, even if a side has been processed at a corner or in the middle part, the processed part is included in the interpretation of the "side".

[0012] Also, "arrange" includes not only the case of direct contact but also the case of arranging indirectly, for example, via other members.

[0013] [First Embodiment] <Forming device 1> The forming method according to the first embodiment can be implemented using the forming device 1. As a premise for explaining an example of the forming method according to the first embodiment, an example of the configuration of the forming device 1 will be described with reference to FIGS. 1 and 2. FIG. 1 is a cross-sectional view schematically showing a cross-section of the forming device 1. FIG. 2 is a partial cross-sectional view of the forming device 1 in which the region II shown in FIG. 1 is enlarged. The cross-sections shown in FIGS. 1 and 2 are cross-sections of the forming device 1 when the forming device 1 is cut in the XZ plane defined by the X-axis direction and the Z-axis direction.

[0014] In explaining the forming method and the forming device 1 according to the first embodiment, the first direction is the +Z direction. Also, the second direction is the -Z direction. Furthermore, the third direction is the -X direction. However, the third direction may be any direction that intersects the first direction and the second direction.

[0015] As shown in FIG. 1, the forming device 1 includes a mold 10 and a film 40. Also, the forming device 1 can include a first member 51, a second member 52, guide rollers 55a, 55b, 55c, 55d, a winding unit 61, a feeding unit 62, a first platen 71, and a second platen 72. The forming device 1 can include, for example, a mechanism for moving at least one of the first platen 71 and the second platen 72 in the first direction (+Z) or the second direction (-Z), a mechanism for carrying the structure 3 into the mold 10, and a mechanism for carrying out the formed body 4 to the outside of the mold 10, which will be described later.

[0016] In the example shown in Figure 1, the first member 51 and the second member 52, together with the guide rollers 55a, 55b, 55c, and 55d, are in contact with the film 40. The first member 51, the second member 52, and the guide roller 55a can be positioned, for example, so as not to overlap with the mold 10 in a top view. In the example shown in Figure 1, the first member 51, the second member 52, and the guide roller 55a are located outside the mold in the third direction (-X). The guide rollers 55b, 55c, and 55d can also be located on the opposite side of the mold 10 from the first member 51, the second member 52, and the guide roller 55a in the X-axis direction. However, unlike the example shown in Figure 1, the first member 51, the second member 52, and the guide roller 55a may be located +X side of the mold 10, and the guide rollers 55b, 55c, and 55d may be located -X side of the mold 10.

[0017] The winding unit 61 and the feeding unit 62 hold the film 40 in contact with the first member 51, the second member 52, and the guide rollers 55a, 55b, 55c, and 55d. The winding unit 61 is equipped with a drive unit such as a motor. The winding unit 61 can wind up the film 40 in accordance with the operation of the drive unit. However, the winding unit 61 can rotate in the opposite direction to the winding direction of the film 40. Therefore, the winding unit 61 can rotate in the opposite direction to the winding direction in response to an external force different from the force from the drive unit, and feed out the film 40.

[0018] The feeding unit 62, like the winding unit 61, is equipped with a drive unit such as a motor. The feeding unit 62 feeds out the film 40 in accordance with the operation of the drive unit. However, the feeding unit 62 can rotate in the opposite direction to the film 40's feeding direction. Therefore, the feeding unit 62 can rotate in the opposite direction to the film 40's feeding direction in response to an external force different from the force from the drive unit, and wind up the film 40.

[0019] The first member 51, the second member 52, the guide rollers 55a, 55b, 55c, 55d, the winding section 61, and the delivery section 62 can each operate independently of each other. The first member 51 and the second member 52 are each configured to be movable by a mechanism capable of translational movement, such as an actuator and a motor. The winding section 61, the delivery section 62, and the guide rollers 55a, 55b, 55c, 55d may each be fixed in a predetermined position, or they may be configured to be movable by a mechanism capable of translational movement, such as an actuator and a motor.

[0020] In this embodiment, a molded body 4 can be formed by curing an uncured intermediate member 2 using a molding apparatus 1. An example of the configuration of the intermediate member 2, structure 3, and molded body 4 will be described below with reference to Figures 1, 4, 14, and 15. In this specification, "uncured" refers to the state before the curing reaction proceeds, that is, the state before any operation is performed to advance the curing reaction. Examples of operations to advance the curing reaction include heating, cooling, or light irradiation. Note that the curing reaction may proceed slightly before any operation is performed to advance the curing reaction, but the uncured state includes such a state. Furthermore, if the intermediate member 2 is a sheet-like, tablet-like, or powder-like meltable material, the uncured state includes the sheet-like, tablet-like, or powder-like state before melting, as well as the state in which they are melted. In this specification, "cured" refers to a state in which the molded body 4 can be removed from the molding apparatus 1 while maintaining its shape.

[0021] <Intermediate member 2> In this embodiment, an uncured intermediate member 2 is cured using a molding apparatus 1 to form a molded body 4. In the example shown in Figure 1, the intermediate member 2 is placed on the structure 3. As the intermediate member 2, a resin member such as a thermosetting resin, thermoplastic resin, or photocurable resin, or an inorganic member such as glass can be used. Examples of resin members include epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, urethane resin, and fluororesin. The intermediate member 2 has light-transmitting properties that allow light from a light-emitting element 3a such as an LED (Light Emitting Diode) and an LD (Laser Diode) to pass through. The intermediate member 2 may also contain a phosphor or light scattering material that is excited by light from the light-emitting element 3a and converted into light of a different wavelength. As the intermediate member 2, for example, a resin member in the form of a liquid, a semi-solid with fluidity, a sheet, a tablet, or a powder can be used.

[0022] <Structure 3> In the example shown in Figure 14, the structure 3 is composed of, for example, a light-emitting element 3a, a package 3c on which the light-emitting element 3a is arranged, and a sealing member 3b that seals the light-emitting element 3a. However, the structure 3 is not limited to the above, and may consist only of, for example, a plate-shaped conductive member. Also, the structure 3 does not have to constitute a part of the molded body 4, and may be, for example, a film-like member. Furthermore, the intermediate member 2 may be arranged so as to be in contact with the first opposing surface 21 of the first mold 20, which will be described later, without going through the structure 3.

[0023] <Molded body 4> The molded body 4 is formed by curing the intermediate member 2. In the example shown in Figure 4, the intermediate member 2 is placed on the structure 3 and cured to form a molded body 4 including the structure 3 and the cured intermediate member 2A. Specifically, as shown in Figure 14, the molded body 4 is an optical member such as a lens, which is the cured intermediate member 2A, placed on the structure 3. The molded body 4 may also be a package comprising a structure 3 which is a plate-shaped conductive member and a resin member which is the cured intermediate member 2A, and having a recess on which the light-emitting element 3a can be placed. In the example shown in Figure 14, the molded body 4 includes a structure 3 which includes the light-emitting element 3a, a package 3c on which the light-emitting element 3a is placed, and a sealing member 3b which seals the light-emitting element 3a, and the cured intermediate member 2A. The molded body 4 shown in Figures 14 and 15 represents a single light-emitting device. However, if the structure 3 is a film-like component that is later peeled off from the molded body 4, or if the intermediate member 2 is placed in contact with the first opposing surface 21 of the first mold 20 (described later) without going through the structure 3 and then cured, the molded body 4 does not have to include the structure 3. An example of a case where the structure 3 does not constitute a part of the molded body 4 is an optical component such as a lens that is formed solely from the cured product 2A of the intermediate member 2.

[0024] In the first embodiment, the molding apparatus 1 can compress and mold an intermediate member 2 to form a molded body 4. The individual components constituting the molding apparatus 1 will be described below.

[0025] (Mold 10) As shown in Figure 1, the mold 10 includes a first mold 20 and a second mold 30. The first mold 20 and the second mold 30 face each other in a first direction. The first mold 20 is positioned on the second direction side opposite to the first direction relative to the second mold 30. In the example shown in Figure 1, the first mold 20 is positioned on the first direction side surface of the first platen 71, and the second mold 30 is positioned on the second direction side surface of the second platen 72. At least one of the first mold 20 and the second mold 30 can be heated by a heating mechanism such as a heater located inside or outside at least one of the first mold 20 and the second mold 30.

[0026] The first mold 20 has a first opposing surface 21 that faces the second mold 30. The first opposing surface 21 may be a flat surface that is flat in the XY plane, or it may have a concave portion 22 for arranging the structure 3, as shown in Figure 1. The first mold 20 may also have an adsorption mechanism, such as vacuum adsorption, for adsorbing a member to be placed on the first opposing surface 21 to the first opposing surface 21.

[0027] The second mold 30 has a second opposing surface 31 that faces the first opposing surface 21 of the first mold 20 in the first direction. As shown in Figures 1 and 2, the second opposing surface 31 of the second mold 30 is in contact with the second surface 42 of the film 40. The second opposing surface 31 of the second mold 30 also includes a first recess 32 that is recessed toward the first direction. The intermediate member 2 is positioned so as to overlap with the first recess 32 when viewed from above.

[0028] The second mold 30 may have an adsorption mechanism, such as vacuum adsorption, for adsorbing a member that is in contact with the inner surface 32i of the first recess 32 to the inner surface 32i.

[0029] Referring to Figure 2, an example of the configuration of the first recess 32 will be described. As shown in Figure 2, the first recess 32 includes a plurality of recesses 321 and wall portions 322 located between adjacent recesses 321. In other words, the first recess 32 includes a plurality of recesses 321 and a plurality of wall portions 322. In the example shown in Figure 2, the plurality of recesses 321 and the plurality of wall portions 322 are aligned in the X-axis direction. The plurality of recesses 321 and the plurality of wall portions 322 may also be aligned in the Y-axis direction, or in directions other than the X-axis and Y-axis directions. Furthermore, the number of recesses 321 and wall portions 322 is not limited to the example shown in Figure 2.

[0030] The recess 321 is defined by a bottom surface 321a, a side surface 321b, and a curved surface 321c on the inner surface 32i of the first recess 32. In a top view, the bottom surface 321a is, for example, circular. In the example shown in Figure 2, the bottom surface 321a is a flat surface parallel to the X-axis and Y-axis directions. The bottom surface 321a may be a curved surface continuous with the curved surface 321c. The side surface 321b is also the side surface of the wall portion 322 located next to the recess 321. The side surface 321b connects the bottom surface 321a and the highest point 321b1 of the side surface 321b. The curved surface 321c connects the bottom surface 321a and the side surface 321b. However, the configuration of the recess 321 is not limited to the example shown in Figure 2. The recess 321 may, for example, be parabolic in cross-sectional view, or it may have a shape in which the bottom surface 321a and the side surface 321b form an angle and are continuous without a curved surface 321c. In this embodiment, the shapes of the bottom surface 321a, side surface 321b, curved surface 321c of the recess 321, and the top surface 322a of the wall portion 322 correspond to the shapes of the top surface 4a, side surface 4b, curved surface 4c connecting the top surface 4a and the side surface 4b, and flange portion 4d of the hardened product 2A of the intermediate member 2 in the molded body 4 shown in Figures 14 and 15.

[0031] In a cross-sectional view, the recess 321 has an opening width W1 in the X-axis direction and a depth D1 in the Z-axis direction, and the aspect ratio D1 / W1 of the recess 321 can be, for example, 0.1 or more and 5.0 or less. The opening width W1 of the recess 321 is the distance in the X-axis direction between the highest points 321b1 of the two sides 321b of one recess 321, and the depth D1 of the recess 321 is the distance in the Z-axis direction between the highest point 321b1 of the side 321b of the recess 321 and the bottom surface 321a.

[0032] Furthermore, in cross-sectional view, the radius of curvature of the curve corresponding to the curved surface 321c can be 0.005 mm or more and 30 mm or less.

[0033] Furthermore, in a cross-sectional view, the width W2 of the top surface 322a of the wall portion 322 in the X-axis direction is shorter than the opening width W1 of the recess 321 in the X-axis direction. In other words, the distance between adjacent recesses 321 is shorter than the opening width W1 of the recess 321 in the X-axis direction.

[0034] (Film 40) As shown in Figure 1, the film 40 is positioned between the first mold 20 and the second mold 30, in contact with the first member 51, the second member 52, and the guide rollers 55a, 55b, 55c, 55d, and held by the winding unit 61 and the feeding unit 62. The length of the film 40 located between the winding unit 61 and the feeding unit 62 can be adjusted according to the operation of the first member 51, the second member 52, the guide rollers 55a, 55b, 55c, 55d, the winding unit 61, and the feeding unit 62.

[0035] The film 40 is, for example, a release film comprising a base material and a release layer. Examples of materials constituting the base material include polyester resins such as polyethylene terephthalate and polyethylene naphthalate, and polyolefin resins such as polyethylene and polypropylene. Examples of materials constituting the release layer include silicone resin, melamine resin, and fluororesin.

[0036] The film 40 has a first surface 41 and a second surface 42 opposite to the first surface 41. In this specification, the first surface 41 and the second surface 42 of the film 40 refer to the portion of the film 40 located between the guide roller 55a and the guide roller 55d in the third direction. The first surface 41 of the film 40 includes the surface facing the first mold 20, and the second surface 42 of the film 40 includes the surface facing the second mold 30. In the example shown in Figure 1, the first surface 41 of the film 40 is the -Z side surface, and the second surface 42 of the film 40 is the +Z side surface. An example of the thickness of the film 40 is 0.02 mm or more and 0.15 mm or less. Here, the thickness of the film 40 is the shortest distance connecting the first surface 41 and the second surface 42 in the first direction. However, the thickness of the film 40 is not limited to the above range. In the example shown in Figure 1, the second surface 42 of the film 40 is in contact with the second opposing surface 31 of the second mold 30.

[0037] The second surface 42 is in contact with the inner surface 32i of the first recess 32. Furthermore, the portion of the first surface 41 located inside the first recess 32 forms the second recess 43. In other words, a part of the first surface 41 defines the second recess 43.

[0038] (First member 51) The first member 51 is a member that applies tension to the film 40 while in contact with the film 40. The first member 51 can apply tension to the film 40 by, for example, contacting the second surface 42 of the film 40 held by the winding section 61 and the feeding section 62. If the molding apparatus 1 does not have a winding section 61, the first member 51 may have the function of the winding section 61. In this case, the first member 51 can apply tension by winding up the film 40 held by the feeding section 62. The first member 51 is located outside the first recess 32 in the third direction. In the example shown in Figure 1, the first member 51 does not overlap with the mold 10 in a top view. The first member 51 can move in the first and second directions. The first member 51 may also be configured to move in directions different from those described above.

[0039] In the example shown in Figure 1, the first member 51 is in contact with the second surface 42 of the film 40. Specifically, the first member 51 is in contact with a portion of the second surface 42 that is located outside the mold 10 in the third direction. Alternatively, the first member 51 may be positioned to be in contact with the portion of the second surface 42 that overlaps with the mold 10 when viewed from above.

[0040] In the example shown in Figure 1, the first member 51 is, for example, a guide roller extending in the Y-axis direction. In this specification, "guide roller" is a cylindrical member having a rotation mechanism that can rotate according to the direction of movement of the film 40 it is in contact with. Preferably, the width of the first member 51 in the Y-axis direction is longer than the width of the film 40 in the Y-axis direction. By having the width of the first member 51 in the Y-axis direction be longer than the width of the film 40 in the Y-axis direction, the occurrence of wrinkles in the film 40 can be reduced. However, the first member 51 is not limited to a guide roller, and may be, for example, a cylindrical member without a rotation mechanism, a member that grips the film 40, etc.

[0041] (Second member 52) The second member 52 is located outside the first recess 32 in the third direction (-X). In the example shown in Figure 1, the second member 52 is in contact with the first surface 41 of the film 40 and does not overlap with the mold 10 in a top view. The second member 52 can move in the first and second directions, similar to the first member 51. Furthermore, while in contact with the first surface 41 of the film 40, the second member 52 can move closer to the intermediate member 2 or the molded body 4 described later. In the example shown in Figure 1, the second member 52 is positioned on the opposite side of the film 40 from the first member 51 in the first direction. However, the positional relationship between the first member 51 and the second member 52 in the Z-axis direction is not limited to the above.

[0042] As the second member 52, for example, the same member as the one given in the example of the first member 51 above can be used. In the example shown in Figure 1, the second member 52 is, for example, a guide roller extending in the Y-axis direction.

[0043] <Forming method> Next, an example of a molding method according to the first embodiment will be described with reference to Figures 1 and 3 to 6. Figures 3 to 6 are schematic cross-sectional views illustrating an example of a molding method according to the first embodiment.

[0044] The molding method according to the first embodiment includes the steps of preparing a mold 10, a film 40, and an intermediate member 2; curing the intermediate member 2 to form a molded body 4; and separating the second mold 30 and the film 40. Hereinafter, the "step of preparing the mold 10, the film 40, and the intermediate member 2" will be referred to as the "preparation step." The "step of curing the intermediate member 2 to form a molded body 4" will be referred to as the "forming step." The "step of separating the second mold 30 and the film 40" will be referred to as the "separation step."

[0045] The molding method according to the first embodiment may further include the steps of arranging the intermediate member 2 and peeling the film 40 from the molded body 4. The step of arranging the intermediate member 2 is performed before the preparation step. The step of peeling the film 40 from the molded body 4 is performed after the separation step. Hereinafter, the "step of arranging the intermediate member 2" will be referred to as the "arranging step," and the "step of peeling the film 40 from the molded body 4" will be referred to as the "peeling step."

[0046] (Placement process) In the molding method according to the first embodiment, the first step is to place the intermediate member 2. As shown in Figure 1, in the placement step, the first surface 41 of the film 40 and the first mold 20 are separated, that is, the first mold 20 and the film 40 and the second mold 30 are separated, and the intermediate member 2 is placed between the second recess 43 and the first mold 20. In the example shown in Figure 1, the intermediate member 2 is placed between the second recess 43 and the structure 3 placed in the concave portion 22 of the first mold 20. Alternatively, the placement step may be performed by placing the intermediate member 2 in the second recess 43 while the first surface 41 of the film 40 and the first mold 20 are separated.

[0047] (Preparation process) Next, a preparation process can be carried out. As shown in Figure 3, the preparation process may include bringing the first mold 20 and the second mold 30 closer together so that the first opposing surface 21 of the first mold 20 is in contact with the first surface 41 of the film 40, and positioning the first mold 20 on the second side relative to the second mold 30. By performing the step of positioning the first mold 20 on the second side relative to the second mold 30, the first mold 20 and the second mold 30 face each other in the Z-axis direction with the film 40 in between.

[0048] Herein, in this specification, "bringing the first mold 20 and the second mold 30 closer together" means reducing the relative distance between the first mold 20 and the second mold 30 in the Z-axis direction. Therefore, "bringing the first mold 20 and the second mold 30 closer together" includes moving the first mold 20 and / or the second mold 30 in the Z-axis direction such that the relative distance between the first mold 20 and the second mold 30 in the Z-axis direction is reduced.

[0049] As described with reference to Figure 1, the mold 10 includes a first mold 20 having a first opposing surface 21, and a second mold 30 having a second opposing surface 31 facing the first opposing surface 21 in a first direction and including a first recess 32. The film 40 has a first surface 41 and a second surface 42 opposite to the first surface 41 in a first direction.

[0050] As shown in Figure 3, in the preparation process, the first surface 41 of the film 40 is in contact with the first opposing surface 21 of the first mold 20, and the second surface 42 of the film 40 is in contact with the second opposing surface 31. At this time, the second surface 42 of the film 40 is in contact with the inner surface 32i of the first recess 32. By the second surface 42 of the film 40 being in contact with the inner surface 32i of the first recess 32, the first surface 41 of the film 40 defines the second recess 43. Of the first surface 41 of the film 40 defining the second recess 43, the portion that overlaps with the top surface 322a of the wall portion 322 in the first recess 32 when viewed from above may be in contact with the structure 3 and / or the first opposing surface 21 of the first mold 20, as shown in Figure 3, or it may not be in contact with the structure 3 and / or the first opposing surface 21 of the first mold 20, as shown in Figure 12. The first surface 41 of the film 40 may be adsorbed to the first opposing surface 21 of the first mold 20 by an adsorption mechanism of the first mold 20. The second surface of the film 40 may also be adsorbed to the inner surface 32i of the first recess 32 of the second mold 30 by an adsorption mechanism of the second mold 30. The formation of the second recess 43 by the second surface 42 of the film 40 contacting the inner surface 32i of the first recess 32 may be performed earlier than the preparation step, for example, in the placement step.

[0051] As shown in Figure 3, during the preparation process, the intermediate member 2 is placed within the second recess 43. Specifically, the intermediate member 2 is in contact with the first surface 41 of the film 40 that defines the second recess 43. A portion of the intermediate member 2 may be placed outside the second recess 43.

[0052] (Formation process) The forming process can be carried out after the preparation process described above. As shown in Figure 3, in the forming process, a treatment is performed to cure the uncured intermediate member 2 located in the second recess 43.

[0053] The forming process, as shown in Figure 3, may include a step of pressurizing the intermediate member 2 while the first surface 41 of the film 40 is in contact with the first opposing surface 21 of the first mold 20 and the second surface 42 of the film 40 is in contact with the second opposing surface 31 of the second mold 30. By pressurizing the intermediate member 2, the second recess 43 can be filled with the intermediate member 2. In this specification, "filling" is not limited to cases where the space is completely filled, but also includes cases where areas remain unfilled due to air bubbles, etc.

[0054] The forming process involves curing the uncured intermediate member 2 to form the molded body 4. As a method for curing the intermediate member 2, for example, if the intermediate member 2 contains a thermosetting resin, a heating mechanism such as a heater provided inside or outside at least one of the first mold 20 and the second mold 30 can be used to heat the intermediate member 2. The method for curing the intermediate member 2 is appropriately selected from methods known in the art, depending on the curing conditions of the material contained in the intermediate member 2.

[0055] (The process of separating) Next, a separation process can be performed. The separation process can be performed after the forming process. As shown in Figure 4, in the separation process, the molded body 4 and the first mold 20 are separated from the film 40 while a portion of the first surface 41 of the film 40 is in contact with the second mold 30. This separates the molded body 4 and the film 40 from the second mold 30. By performing the separation process, the second surface 42 of the film 40 separates from the second opposing surface 31 of the second mold 30.

[0056] In this specification, "separating the second mold 30 from the film 40" means increasing the relative distance between the second mold 30 and the film 40 in the Z-axis direction so that the second mold 30 and the film 40 are not in contact. In other words, "separating the second mold 30 from the film 40" includes moving the first mold 20 and / or the second mold 30 so that the distance between the first mold 20 and the film 40 in contact with the first mold 20 and the second mold 30 in the Z-axis direction is increased. At this time, the film 40 is in contact with the first mold 20 and the molded body 4. In other words, during the separation process, the molded body 4 is pressed against the first mold 20 by contacting the film 40.

[0057] In the conventional molding method, after forming the molded body 4, when separating the first mold 20 and the second mold 30, the film 40 separates from the first mold 20 together with the second mold 30. That is, in the conventional molding method, when the first mold 20 and the second mold 30 separate, the film 40 separates from the molded body 4 and the first mold 20. However, in the conventional molding method, when the first mold 20 and the second mold 30 separate, part or all of the molded body 4 may separate from the first mold 20 together with the film 40 and the second mold 30. As a result, for example, part or all of the molded body 4 that has separated from the first mold 20 may fall onto the first opposing surface 21 of the first mold 20, causing damage to the molded body 4 and / or the first mold 20. Consequently, the yield of the molded body 4 may decrease in the conventional molding method.

[0058] In contrast, according to the first embodiment, in the separation process, the second mold 30 and the film 40 can be separated while the molded body 4 and the first mold 20 are in contact with a part of the first surface 41 of the film 40. That is, according to the first embodiment, in the separation process, the molded body 4 is pressed against the first mold 20 by contacting the film 40, so the possibility of the molded body 4 separating from the first mold 20 together with the second mold 30 can be reduced. As a result, the decrease in the yield of the molded body 4 can be reduced.

[0059] Furthermore, in conventional molding methods, with the shape of the recess 321 as described with reference to Figure 2, when the first mold 20 and the second mold 30 separate, part or all of the molded body 4 tends to separate from the first mold 20 together with the film 40 and the second mold 30. On the other hand, according to this embodiment, in the separation process, the molded body 4 is pressed against the first mold 20 by contacting the film 40, thus reducing the possibility that the molded body 4 separates from the first mold 20 together with the second mold 30. In other words, according to this embodiment, a molded body 4 with a shape that makes it easy for part or all of the molded body 4 to separate from the first mold 20 together with the second mold 30 can be formed with a higher yield compared to conventional molding methods.

[0060] As shown in Figure 4, the separation step may include positioning the first member 51, which is located outside the second recess 43 in the third direction and applies tension to the film 40 while in contact with the film 40, on the same plane as the first opposing surface 21 or on the second side of the first opposing surface 21. This allows the first member 51 to press the molded body 4 toward the first mold 20 via the film 40 during the separation step. As a result, the possibility of the molded body 4 separating from the first mold 20 together with the second mold 30 can be reduced.

[0061] Furthermore, during the separation process, for example, the guide roller 55c, which is located on the side opposite to the third direction (+X) from the mold 10, can be positioned on the same plane as the first opposing surface 21 or on the side of the first opposing surface 21 in the second direction, similar to the first member 51. This allows the guide roller 55c to press the molded body 4 toward the first mold 20 via the film 40 during the separation process. As a result, the possibility of the molded body 4 separating from the first mold 20 together with the second mold 30 can be reduced.

[0062] As shown in Figure 4, the first surface 41 of the film 40 to which tension is applied by the first member 51 includes, in addition to the portion 411 that contacts the molded body 4, a first portion 412 that contacts the first opposing surface 21 of the first mold 20, and a second portion 413 that is continuous with the first portion 412 and extends to the first member 51. The angle θ1 between the first portion 412 and the second portion 413 is 180° or less. As a result, the first member 51 can press the molded body 4 toward the first mold 20 side via the film 40.

[0063] In the example shown in Figure 4, the first member 51 moves toward the second direction, applying tension to the film 40. Alternatively, during the release process, the first mold 20 may move toward the first direction, thereby applying tension to the film 40. The method of applying tension to the film 40 is not limited to the above; for example, tension can be applied to the film 40 by adsorption using the suction mechanism of the first opposing surface 21 of the first mold, without using the first member 51.

[0064] (The peeling process) Next, a peeling step can be performed. The peeling step can be performed after the separation step, and the film 40 is peeled off the molded body 4. As shown in Figure 5, the peeling step may include moving the first member 51 in a first direction. By moving the first member 51 in a first direction while the first member 51 is in contact with the film 40, a force is applied to the film 40 that causes it to move away from the molded body 4 and the first mold 20. As a result, the film 40 can be peeled off from the first opposing surface 21 and the molded body 4. Alternatively, the first mold 20 may be moved in a second direction to increase the distance between the first member 51 and the first mold 20 in the Z-axis direction, thereby peeling the film 40 off the molded body 4.

[0065] Furthermore, the peeling process may include a step of moving the second member 52, which is in contact with the first surface 41 of the film 40. At this time, the second member 52 is moved in a fourth direction D4 that intersects with the imaginary line L1 connecting the first contact point 451 where the film 40 and the first member 51 are in contact and the second contact point 452 where the film 40 and the molded body 4 are in contact. In the example shown in Figure 5, the fourth direction D4 corresponds to the +X direction. However, the fourth direction D4 is not limited to the +X direction and only needs to intersect with the imaginary line L1.

[0066] The timing at which the second member 52 moves in the fourth direction D4 may be simultaneous with or after the timing at which the first member 51 moves in the first direction. Furthermore, during the peeling process, the first member 51 and the second member 52 may move alternately repeatedly.

[0067] Similar to the separation process, in the peeling process, when the molded body 4 separates from the first mold 20 together with the film 40, part or all of the molded body 4 that has separated from the first mold 20 may fall onto the first opposing surface 21 of the first mold 20, potentially damaging the molded body 4 and / or the first mold. In this embodiment, by moving the first member 51 in the first direction and the second member 52 in the fourth direction D4, the film 40 can be peeled more easily from the first opposing surface 21 and the molded body 4. This reduces the possibility that the molded body 4 will separate from the first mold 20 together with the film 40 when peeling the film 40 from the molded body 4. As a result, the yield of the molded body 4 can be reduced.

[0068] Furthermore, as shown in Figure 6, the peeling step may include moving the second member 52 in a fourth direction D4 so that it passes between the first surface 41 of the film 40 and the molded body 4. In the example shown in Figure 6, the second member 52, which was located on the -X side of the molded body 4 in Figure 5, is moved in the fourth direction D4 so that it is located on the +X side of the molded body 4. This makes it easier to peel the film 40 from the entire surface area of ​​the molded body 4. Therefore, when peeling the film 40 from the molded body 4, the possibility of the molded body 4 separating from the first mold 20 together with the film 40 can be further reduced. As a result, the decrease in the yield of the molded body 4 can be reduced.

[0069] However, the peeling process is not limited to the examples shown in Figures 5 and 6. For example, in the peeling process, air can be blown between the first surface 41 of the film 40 and the surface of the molded body 4 to peel the film 40 from the molded body 4. Alternatively, in the peeling process, the film 40 can be peeled from the molded body 4 using, for example, a member that grips the film 40. Furthermore, in the peeling process, the film 40 can be vibrated in predetermined directions such as the X-axis, Y-axis, and Z-axis to peel the film 40 from the molded body 4.

[0070] The molded body 4 can be formed through these steps. However, the molding method according to this disclosure may further include steps different from those described above. For example, a step of loading the structure 3 into the mold 10 before the preparation step, and a step of loading the molded body 4 out of the mold 10 after the peeling step may be performed.

[0071] [Second Embodiment] Next, an example of a molding method according to the second embodiment will be described with reference to Figures 7 to 11. Figures 7 to 11 are schematic cross-sectional views illustrating an example of a molding method according to the second embodiment. The molding method according to the second embodiment may include, like the first embodiment, a placement step, a preparation step, a forming step, a separation step, and a peeling step. In the second embodiment, parts that are the same as in the first embodiment are denoted by the same reference numerals, and their descriptions are omitted as appropriate.

[0072] The molding method according to the second embodiment can be carried out using the molding apparatus 1A. In describing the molding method and molding apparatus 1A according to the second embodiment, the first direction is the -Z direction. The second direction is the +Z direction. Furthermore, the third direction is the -X direction. However, the third direction may be any direction that intersects the first and second directions.

[0073] As shown in Figure 7, in the second embodiment, in the mold 10 provided by the molding apparatus 1A, the first mold 20 is positioned on the second direction (+Z) side, and the second mold 30 is positioned on the first direction (-Z) side. In other words, in the molding apparatus 1A of the second embodiment, the positional relationship between the first mold 20 and the second mold 30 of the molding apparatus 1 of the first embodiment is reversed in the Z-axis direction. Also, in the second embodiment, the point in which the first member 51 contacts the first surface 41 of the film 40 differs from that of the first embodiment. That is, as shown in Figure 7, the first member 51 and the second member 52 contact the first surface 41 of the film 40. The first surface 41 of the film 40 includes the surface facing the first mold 20, and the second surface 42 of the film 40 includes the surface facing the second mold 30. In the example shown in Figure 7, the first surface 41 of the film 40 is the surface on the +Z side, and the second surface 42 of the film 40 is the surface on the -Z side.

[0074] In the second embodiment as well, the first member 51 can move in the first and second directions. Therefore, even if the first mold 20 is positioned on the second direction (+Z) side and the second mold 30 is positioned on the first direction (-Z) side, the same molding method as in the first embodiment can be implemented. An example of the molding method according to the second embodiment will be described below.

[0075] First, the placement process can be carried out. As shown in Figure 7, in the placement process, the intermediate member 2 can be placed in the second recess 43 while the first surface 41 of the film 40 and the first mold 20 are separated, that is, while the first mold 20, the film 40 and the second mold 30 are separated. In the example shown in Figure 7, the intermediate member 2 is placed between the second recess 43 and the structure 3 placed in the concave portion 22 of the first mold 20. The structure 3 is fixed to the concave portion 22 of the first mold 20, for example, by vacuum suction. Note that the placement process is not limited to the above placement location, and can be carried out in the same way as in the first embodiment, by placing the intermediate member 2 between the second recess 43 and the first mold 20.

[0076] Next, as shown in Figure 8, a preparation step can be performed. After the preparation step, a forming step can be performed. Furthermore, after the forming step, a separation step can be performed as shown in Figure 9. As shown in Figure 9, in the separation step of the second embodiment, the second mold 30 and the film 40 can be separated while the molded body 4 and the first mold 20 and a part of the first surface 41 of the film 40 are in contact. Note that the preparation step, forming step, and separation step are the same as in the first embodiment, so a detailed explanation is omitted.

[0077] Next, as shown in Figures 10 and 11, a peeling step can be performed. As shown in Figure 10, the peeling step of the second embodiment may include a step of moving the first member 51 in a first direction. The peeling step of the second embodiment may also include a step of moving the second member 52, which is in contact with the first surface 41 of the film 40. Furthermore, as shown in Figure 11, the peeling step of the second embodiment may include a step of moving the second member 52 in a fourth direction D4 so that it passes between the first surface 41 of the film 40 and the molded body 4.

[0078] According to the second embodiment, in the separation process, the second mold 30 and the film 40 can be separated while the molded body 4 and the first mold 20 are in contact with a part of the first surface 41 of the film 40. That is, in the separation process, the molded body 4 is pressed against the first mold 20 by contacting the film 40, so the possibility of the molded body 4 separating from the first mold 20 together with the second mold 30 can be reduced. As a result, for example, it becomes difficult to unload the molded body 4 that has separated from the first mold 20, and the decrease in the yield of the molded body 4 can be reduced. Note that other effects of the second embodiment may be the same as those of the first embodiment.

[0079] [Third Embodiment] Next, an example of a molding method according to the third embodiment will be described with reference to Figures 12 and 13. Figures 12 and 13 are schematic cross-sectional views illustrating an example of a molding method according to the third embodiment. In the third embodiment, the step of arranging the intermediate member 2 differs from that of the first embodiment. On the other hand, other configurations in the third embodiment can be the same as those in the first embodiment. Therefore, in the third embodiment, only the step of arranging the intermediate member 2 will be described, and the descriptions of other steps will be omitted.

[0080] The molding method according to the third embodiment can be carried out using the molding apparatus 1B. In describing the molding method and molding apparatus 1B according to the third embodiment, the first direction is the +Z direction. The second direction is the -Z direction. Furthermore, the third direction is the -X direction. However, the third direction may be any direction that intersects the first and second directions.

[0081] As shown in Figure 13, the molding apparatus 1B can form a molded body 4 on the intermediate member 2 by, for example, performing a transfer molding method. As shown in Figure 12, the molding apparatus 1B may be equipped with a plunger 27 that applies pressure to the uncured intermediate member 2 placed in the input section 25 of the first mold 20B. The input section 25 is a recessed portion of the first mold 20B that extends in the second direction (-Z) toward the plunger 27 from the first opposing surface 21B. In addition, the molding apparatus 1B may further be equipped with a resin flow path 35 in the second recess 43B. As shown in Figure 12, the input section 25 and the resin flow path 35 overlap in a top view.

[0082] The placement process can be performed before the preparation process. The placement process may also include bringing the first mold 20B and the second mold 30B closer together, as shown in Figure 12, so that the first opposing surface 21B of the first mold 20B is in contact with the first surface 41 of the film 40, and positioning the first mold 20B on the second side relative to the second mold 30B. The placement process may also include placing the intermediate member 2 in the second recess 43B while the first surface 41 of the film 40 and the first mold 20B are in contact, as shown in Figure 13. Specifically, in the placement process, with the first surface 41 of the film 40 and the first opposing surface 21B of the first mold 20B in contact, and the second surface 42 of the film 40 and the second opposing surface 31B of the second mold 30B in contact, the intermediate member 2 located in the input section 25 is pressurized by the plunger 27. As a result, the intermediate member 2 is placed in the second recess 43B through the resin flow path 35.

[0083] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0084] The aspects of this disclosure are, for example, as follows: <Item 1> A mold comprising: a first mold having a first opposing surface; a second mold having a second opposing surface facing the first opposing surface in a first direction and including a first recess; a film having a first surface and a second surface opposite to the first surface in a first direction, wherein the first surface is in contact with the first opposing surface and the second surface is in contact with the second opposing surface, and the second surface is in contact with the inner surface of the first recess, and the first surface defines the second recess; and an uncured intermediate member disposed in the second recess and in contact with the first surface; The process of curing the intermediate member to form a molded body, The process of separating the second mold and the film while the molded body and the first mold and a part of the first surface are in contact, A molding method including <Item 2> The preparation step includes the step of positioning the first mold on the second direction side opposite to the first direction relative to the second mold, The separation step includes positioning the first member, which is located outside the second recess in a third direction intersecting the first and second directions and applies tension to the film while in contact with the film, on the same plane as the first opposing surface or on the second direction side of the first opposing surface. The molding method described in item 1. <Item 3> The process further includes, after the separation step, peeling the film from the molded body, The peeling step includes moving the first member in the first direction. The molding method described in item 2. <Clause 4> The peeling step further includes moving the first member in the first direction to peel off the first portion of the first surface of the film that is in contact with the first opposing surface of the first mold from the first opposing surface, and then moving the second member, which is in contact with the first surface, in a fourth direction that intersects with a virtual line connecting the first contact point where the film and the first member are in contact and the second contact point where the film and the molded body are in contact. The molding method described in item 3. <Clause 5> The peeling step includes moving the second member in the fourth direction so that it passes between the first surface and the molded body. The molding method described in item 4. <Clause 6> Prior to the preparation step, the intermediate member is placed in the second recess or between the second recess and the first mold while the first surface and the first mold are separated. A molding method described in any one of items 1 to 5. <Clause 7> Prior to the preparation step, the step includes placing the intermediate member in the second recess with the first surface and the first mold in contact, A molding method described in any one of items 1 to 5. [Explanation of Symbols]

[0085] 1,1A,1B Molding equipment 2 Intermediate members 2A Cured intermediate component 3 structure 3a Light-emitting element 3b Sealing member 3c package 4 Molded body 10,10B mold 20,20B First mold 21,21B 1st facing surface 30,30B Second mold 31,31B 2nd opposing surface 32 First recess 32i Inner surface of the first recess 40 film 41 Page 1 42 Side 2 412 Part 1 413 Part 2 451 First contact point 452 Second contact point 43,43B Second recess 51 First Member 52 Second Member 55a~55d Guide rollers D4 4th direction L1 virtual line

Claims

1. A mold comprising: a first mold having a first opposing surface; a second mold having a second opposing surface facing the first opposing surface in a first direction and including a first recess; a film having a first surface and a second surface opposite to the first surface in a first direction, wherein the first surface is in contact with the first opposing surface and the second surface is in contact with the second opposing surface, and the second surface is in contact with the inner surface of the first recess, and the first surface defines the second recess; and an uncured intermediate member disposed in the second recess and in contact with the first surface; The process of curing the intermediate member to form a molded body, The process of separating the second mold and the film while the molded body and the first mold and a part of the first surface are in contact, A molding method including

2. The preparation step includes the step of positioning the first mold on the second direction side opposite to the first direction relative to the second mold, The separation step includes positioning the first member, which is located outside the second recess in a third direction intersecting the first and second directions and applies tension to the film while in contact with the film, on the same plane as the first opposing surface or on the second direction side of the first opposing surface. The molding method according to claim 1.

3. The process further includes, after the separation step, peeling the film from the molded body, The peeling step includes moving the first member in the first direction. The molding method according to claim 2.

4. The peeling step further includes moving the first member in the first direction to peel off the first portion of the first surface of the film that is in contact with the first opposing surface of the first mold from the first opposing surface, and then moving the second member, which is in contact with the first surface, in a fourth direction that intersects with an imaginary line connecting the first contact point where the film and the first member are in contact and the second contact point where the film and the molded body are in contact. The molding method according to claim 3.

5. The peeling step includes moving the second member in the fourth direction so that it passes between the first surface and the molded body. The molding method according to claim 4.

6. Prior to the preparation step, the intermediate member is placed in the second recess or between the second recess and the first mold while the first surface and the first mold are separated. The molding method according to claim 1 or claim 2.

7. Prior to the preparation step, the process includes placing the intermediate member in the second recess while the first surface and the first mold are in contact. The molding method according to claim 1 or claim 2.

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