Cooling devices and electronic components

Abstract

To provide a cooling device that enables improved cooling performance and miniaturization. [Solution] The cooling device comprises a first cold plate for cooling a first heat-generating component, a second cold plate for cooling a second heat-generating component, a radiator provided on the second cold plate for cooling a refrigerant, a first refrigerant passage connecting the first cold plate and the second cold plate and allowing the refrigerant, which has received heat from the first heat-generating component, to flow from the first cold plate to the second cold plate, and a second refrigerant passage connecting the second cold plate and the radiator and allowing the refrigerant, which has received heat from the second heat-generating component, to flow from the second cold plate to the radiator.

Description

Technical Field

[0001] The present invention relates to a cooling device and an electronic component.

Background Art

[0002] A cooling device that cools heat-generating components using a refrigerant is known. For example, a cooling device capable of cooling a plurality of heat-generating components is known (for example, Patent Documents 1-4).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0004] As a cooling method with excellent cooling characteristics, boiling cooling that utilizes the latent heat of vaporization of a refrigerant is known. The refrigerant that has become a gas-liquid mixture by boiling cooling is sent to a radiator, cooled, and returned to a liquid. It is desirable for the cooling device to utilize boiling cooling to improve the cooling performance. On the other hand, miniaturization is also desired so that it can be arranged in a limited space for miniaturization of electronic components and the like.

[0005] On one side, it aims to enable improvement of cooling performance and miniaturization.

Means for Solving the Problems

[0006] In one embodiment, the cooling device comprises a first cold plate for cooling a first heat-generating component, a second cold plate for cooling a second heat-generating component, a radiator provided on the second cold plate for cooling a refrigerant, a first refrigerant passage connecting the first cold plate and the second cold plate and allowing the refrigerant, which has received heat from the first heat-generating component, to flow from the first cold plate to the second cold plate, and a second refrigerant passage connecting the second cold plate and the radiator and allowing the refrigerant, which has received heat from the second heat-generating component, to flow from the second cold plate to the radiator.

[0007] In one embodiment, the electronic component comprises a substrate, a first heat-generating component provided on the substrate, a second heat-generating component provided on the substrate, and a cooling device provided on the substrate, wherein the cooling device comprises a first cold plate for cooling the first heat-generating component, a second cold plate for cooling the second heat-generating component, a radiator provided on the second cold plate for cooling a refrigerant, a first refrigerant passage connecting the first cold plate and the second cold plate and allowing the refrigerant, which has received heat from the first heat-generating component, to flow from the first cold plate to the second cold plate, and a second refrigerant passage connecting the second cold plate and the radiator and allowing the refrigerant, which has received heat from the second heat-generating component, to flow into the radiator. [Effects of the Invention]

[0008] One aspect of this is that it enables improved cooling performance and miniaturization. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a perspective view of the cooling device according to Example 1. [Figure 2] Figure 2 is an exploded perspective view of the cooling device according to Example 1. [Figure 3] Figures 3(a) and 3(b) are perspective views (part 1) showing the refrigerant flow of the cooling device according to Example 1. [Figure 4] FIG. 4 is a perspective view (part 2) showing the refrigerant flow of the cooling device according to Embodiment 1. [Figure 5] FIG. 5 is a diagram showing the effect of the cooling device according to Embodiment 1. [Figure 6] FIG. 6(a) is a perspective view of the cooling device according to the comparative example, and FIG. 6(b) is a perspective view of the lower member of the cold plate in the comparative example. [Figure 7] FIGS. 7(a) and 7(b) are schematic plan views when the cooling devices according to the comparative example and Embodiment 1 are arranged on the first heat-generating component and the second heat-generating component. [Figure 8] FIG. 8 is a perspective view of the cooling device according to Embodiment 2. [Figure 9] FIGS. 9(a) and 9(b) are perspective views showing the refrigerant flow of the cooling device according to Embodiment 2. [Figure 10] FIG. 10 is a diagram showing the effect of the cooling device according to Embodiment 2. [Figure 11] FIGS. 11(a) and 11(b) are perspective views of the lower member of the second cold plate in Embodiment 3 and a modified example of Embodiment 3. [Figure 12] FIG. 12 is a perspective view of the cooling device according to Embodiment 4. [Figure 13] FIG. 13(a) is a perspective view of the cooling device according to Embodiment 5 as viewed from the -Y direction, and FIG. 13(b) is a perspective view as viewed from the +Y direction. [Figure 14] FIG. 14(a) is a perspective view of the cooling device according to the modified example of Embodiment 5 as viewed from the -Y direction, and FIG. 14(b) is a perspective view as viewed from the +Y direction. [Figure 15] FIG. 15(a) is an external perspective view of the electronic component according to Embodiment 6, and FIG. 15(b) is a plan view of the substrate provided inside the housing.

BEST MODE FOR CARRYING OUT THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Embodiment

[0011] FIG. 1 is a perspective view of a cooling device 100 according to Embodiment 1. FIG. 2 is an exploded perspective view of the cooling device 100 according to Embodiment 1. As shown in FIGS. 1 and 2, the cooling device 100 according to Embodiment 1 includes a first cold plate 10, a second cold plate 20, a radiator 30, and a first member 40 and a second member 50 that sandwich the radiator 30. Directions orthogonal to each other are illustrated as the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0012] The first cold plate 10 includes a lower member 11 having a groove 13 and an upper member 12 that contacts the upper surface of the lower member 11 and covers the groove 13. The groove 13 is provided over most of the lower member 11 and has a substantially rectangular shape in plan view. The groove 13 serves as a flow path 15 through which a refrigerant that cools a first heat-generating component disposed below the first cold plate 10 flows. The refrigerant is, for example, a coolant such as cooling water or an ethanol aqueous solution. A plurality of fins 14 are provided in the groove 13. The region where the fins 14 are provided is a heat-receiving region 18 where the refrigerant receives heat from the first heat-generating component. A through hole 16 is provided at the +Y-direction end of the upper member 12, and a through hole 17 is provided at the -Y-direction end. The through holes 16 and 17 are located above the groove 13 and communicate with the groove 13. A pipe 60 is connected to the through hole 16, and a pipe 61 is connected to the through hole 17. The first cold plate 10 is formed of a metal such as copper, aluminum, or stainless steel. The pipes 60 and 61 may be formed of a metal such as copper or aluminum, or may be formed of a non-metal such as resin.

[0013] The second cold plate 20 comprises a lower member 21 having a groove 23 and an upper member 22 that contacts the upper surface of the lower member 21 and covers the groove 23. The groove 23 includes a passage section 72, an inlet section 73, and an outlet section 74. The inlet section 73 is provided at the -Y end of the lower member 21, extending in the X-axis direction. The outlet section 74 is provided at the +Y end of the lower member 21, extending in the X-axis direction. The passage section 72 is provided to connect the inlet section 73 and the outlet section 74. The groove 23 becomes a passage path 25 through which a refrigerant flows to cool the second heat-generating component located below the second cold plate 20. The passage section 72 is substantially rectangular in plan view and is provided with a plurality of fins 24. The area where the fins 24 are provided is a heat-receiving area 28 where the refrigerant receives heat from the second heat-generating component. The upper member 22 is provided with a through hole 26 located above the inlet 73 and communicating with the inlet 73, and a through hole 27 located above the outlet 74 and communicating with the outlet 74, and which is elongated in the X-axis direction. The second cold plate 20 is made of a metal such as copper, aluminum, or stainless steel.

[0014] The radiator 30 is mounted on the second cold plate 20. When viewed from the +Z direction, the radiator 30 is smaller than the second cold plate 20 and fits inside the upper surface of the second cold plate 20. The radiator 30 has the function of cooling the refrigerant flowing through the groove 13 of the first cold plate 10 and the groove 23 of the second cold plate 20 by exchanging heat with air.

[0015] The first member 40 and the second member 50 are provided on the second cold plate 20, sandwiching the radiator 30 in the Y-axis direction. The first member 40 and the second member 50 are, for example, plate-shaped members. The first member 40 is connected to the -Y direction end of the radiator 30, and the second member 50 is connected to the +Y direction end of the radiator 30. For example, the radiator 30 is supported by the first member 40 and the second member 50, and a gap is formed between the radiator 30 and the second cold plate 20. The first member 40 and the second member 50 may be made of a metal such as copper or aluminum, or of a non-metal such as resin.

[0016] A pipe 61 is connected to the -X end of the first member 40. A pipe 62 is connected to the +X end of the first member 40.

[0017] Figures 3(a), 3(b), and 4 are perspective views showing the flow of refrigerant 70 in the cooling device 100 according to Embodiment 1. Figure 3(a) is a perspective view of the cooling device 100 according to Embodiment 1 from the -Y direction, and Figure 3(b) is a perspective view from the +Y direction. Figure 4 is a perspective view of the lower member 21 of the second cold plate 20 in Embodiment 1. Figure 3(a) shows a transparent view of the inside of the first member 40 and the first cold plate 10, and Figure 3(b) shows a transparent view of the inside of the second member 50 and the first cold plate 10. As shown in Figure 3(a), the inside of the first member 40 is divided into space 41 and space 42. As shown in Figure 3(b), the inside of the second member 50 is one space 51.

[0018] As shown in Figure 3(a), the refrigerant 70 (indicated by the arrow) supplied to one end of the pipe 60 flows through the pipe 60 and into the first cold plate 10 to which the other end of the pipe 60 is connected. The refrigerant 70 that has flowed into the first cold plate 10 flows through the groove 13 of the lower member 11 from the +Y direction to the -Y direction.

[0019] Since piping 61 is connected to the -Y end of the first cold plate 10, the refrigerant 70 flowing through the groove 13 in the -Y direction flows into piping 61. Piping 61 is also connected to the space 41 of the first member 40. Therefore, the refrigerant 70 that flows into piping 61 flows into the space 41 of the first member 40. The space 41 communicates with a through hole 26 provided in the upper member 22 of the second cold plate 20. Therefore, as shown in Figures 3(a) and 4, the refrigerant 70 that flows into the space 41 flows through the through hole 26 into the inlet 73 of the lower member 21 of the second cold plate 20. The refrigerant 70 that flows into the inlet 73 flows through the passage section 72 from the -Y direction to the +Y direction.

[0020] As shown in Figures 3(b) and 4, the space 51 of the second member 50 is in communication with a through hole 27 provided in the upper member 22 of the second cold plate 20. Therefore, the refrigerant 70 that flows through the passage section 72 in the +Y direction flows from the outlet section 74 into the space 51 of the second member 50 through the through hole 27.

[0021] As shown in Figures 3(a) and 3(b), one end of the tube 31 of the radiator 30 is connected to space 51. The other end of the tube 31 is connected to space 42 of the first member 40. Therefore, the refrigerant 70 flows from space 51 of the second member 50 through the radiator 30 from the +Y direction to the -Y direction and into space 42 of the first member 40. One end of the pipe 62 is connected to space 42. Therefore, the refrigerant 70 that has flowed into space 42 flows through pipe 62 and is discharged from the other end of pipe 62.

[0022] Figure 5 shows the effect of the cooling device 100 according to Example 1. As shown in Figure 5, the first cold plate 10 is used to cool the first heat-generating component 81, and the second cold plate 20 is used to cool the second heat-generating component 82. For example, the amount of heat generated by the second heat-generating component 82 is greater than the amount of heat generated by the first heat-generating component 81. The refrigerant 70 that flows into the first cold plate 10 from the piping 60 rises in temperature by receiving heat from the first heat-generating component 81. After receiving heat from the first heat-generating component 81, the refrigerant 70 flows from the first cold plate 10 through the piping 61 and the first member 40 and flows into the second cold plate 20.

[0023] The refrigerant 70 receives heat from the second heat-generating component 82 in the second cold plate 20, causing its temperature to rise further. As a result, boiling is more likely to occur in the refrigerant 70 in the second cold plate 20. The gas generated by the boiling of the refrigerant 70 is shown as gas 71. In this way, the refrigerant 70, whose temperature has risen due to receiving heat from the first heat-generating component 81, flows into the second cold plate 20, causing its temperature to rise further in the second cold plate 20 due to heat received from the second heat-generating component 82. This promotes boiling in the refrigerant 70 in the second cold plate 20, improving the cooling performance for the second heat-generating component 82 through boiling cooling using the latent heat of vaporization.

[0024] The refrigerant 70, which has become a gas-liquid mixture, flows into the radiator 30 on the second cold plate 20 and is cooled, returning to a liquid state. Because the radiator 30 that cools the gas-liquid mixture of refrigerant 70 is located on the second cold plate 20, the cooling device 100 can be made smaller compared to when the radiator 30 is located elsewhere.

[0025] [Comparative Example] Figure 6(a) is a perspective view of the cooling device 1000 according to the comparative example, and Figure 6(b) is a perspective view of the lower member 91 of the cold plate 90 in the comparative example. In Figure 6(a), the inside of member 94 is shown as a transparent view. Also, in Figures 6(a) and 6(b), the flow of the refrigerant 70 is shown with arrows. As shown in Figures 6(a) and 6(b), the cooling device 1000 according to the comparative example comprises a cold plate 90, a plurality of radiators 93, and members 94 and 95 that sandwich the plurality of radiators 93. The plurality of radiators 93 are provided on the cold plate 90.

[0026] The cold plate 90 comprises a lower member 91 having a plurality of grooves 96, and an upper member 92 that contacts the upper surface of the lower member 91 and covers the grooves 96. The grooves 96 serve as flow paths 97 through which the refrigerant 70 flows. The refrigerant 70 flows from member 94 into the grooves 96 and flows through the grooves 96 from the -Y direction to the +Y direction. The refrigerant 70 that has flowed through the grooves 96 in the +Y direction flows into member 95. The refrigerant 70 that has flowed into member 95 flows through a plurality of radiators 93 and then flows into member 94, from which it is discharged to the outside.

[0027] Figure 7(a) is a schematic plan view of the cooling device 1000 according to the comparative example when it is arranged on the first heat-generating component 81 and the second heat-generating component 82, and Figure 7(b) is a schematic plan view of the cooling device 100 according to Example 1 when it is arranged on the first heat-generating component 81 and the second heat-generating component 82. As shown in Figure 7(a), in the comparative example, a large cold plate 90 is provided from the first heat-generating component 81 to the second heat-generating component 82 in order to cool the first heat-generating component 81 and the second heat-generating component 82. On the other hand, in Example 1, as shown in Figure 7(b), a first cold plate 10 for cooling the first heat-generating component 81 is provided on the first heat-generating component 81. A second cold plate 20 for cooling the second heat-generating component 82 is provided on the second heat-generating component 82. As a result, the total volume of the first cold plate 10 and the second cold plate 20 can be made smaller than that of the cold plate 90. Therefore, the cooling device 100 of Example 1 is lighter than the cooling device 1000 of the comparative example. Furthermore, the first member 40 and the second member 50 in Example 1 are shorter than the members 94 and 95 in the Comparative Example. In this respect as well, the cooling device 100 of Example 1 is lighter than the cooling device 1000 of the Comparative Example.

[0028] As described above, according to Embodiment 1, as shown in Figures 1 and 5, the first cold plate 10 for cooling the first heat-generating component 81 and the second cold plate 20 for cooling the second heat-generating component 82 are connected by piping 61 and the first member 40. As shown in Figures 3(a) and 4, the refrigerant 70 that has received heat from the first heat-generating component 81 flows from the first cold plate 10 to the second cold plate 20 through the space 41 of piping 61 and the first member 40. As a result, the refrigerant 70, whose temperature has risen in the first cold plate 10 due to receiving heat from the first heat-generating component 81, further rises in temperature in the second cold plate 20 due to receiving heat from the second heat-generating component 82. Therefore, the boiling phenomenon of the refrigerant 70 is promoted in the second cold plate 20, and the second heat-generating component 82 can be cooled by boiling cooling utilizing the latent heat of vaporization of the refrigerant 70. Thus, the cooling performance for the second heat-generating component 82 can be improved. The space 41 between the piping 61 and the first component 40 is a first refrigerant passage that allows the refrigerant 70, which has received heat from the first heat-generating component 81, to flow from the first cold plate 10 to the second cold plate 20.

[0029] Furthermore, as shown in Figure 1, the radiator 30 is provided on the second cold plate 20. The second cold plate 20 and the radiator 30 are connected by a second member 50. As shown in Figures 3(b) and 4, the refrigerant 70 that has received heat from the second heat-generating component 82 on the second cold plate 20 flows from the second cold plate 20 through the space 51 of the second member 50 into the radiator 30. In this way, by providing the radiator 30 that cools the refrigerant 70 on the second cold plate 20, the cooling device 100 can be miniaturized. The space 51 of the second member 50 is a second refrigerant passage that allows the refrigerant 70 that has received heat from the second heat-generating component 82 to flow from the second cold plate 20 into the radiator 30.

[0030] Furthermore, in Embodiment 1, as shown in Figure 1, the first member 40 and the second member 50 are provided sandwiching the radiator 30. As shown in Figure 3(a), the first member 40 has a space 41 (first refrigerant passage) through which the refrigerant 70 flows from the first cold plate 10 to the second cold plate 20, and a space 42 (third refrigerant passage) through which the refrigerant 70 flows from the radiator 30. The second member 50 has a space 51 (second refrigerant passage) through which the refrigerant 70 flows from the second cold plate 20 to the radiator 30. This makes it possible to obtain a configuration in which the refrigerant 70 flows through the radiator 30 on the second cold plate 20 while suppressing an increase in the size of the cooling device 100.

[0031] Furthermore, in Embodiment 1, as shown in Figure 1, a pipe 61 is provided connecting the first cold plate 10 and the first member 40. The first refrigerant passage, which allows the refrigerant 70 to flow from the first cold plate 10 to the second cold plate 20, is formed by the space 41 between the pipe 61 and the first member 40. By connecting the first cold plate 10 and the first member 40 with the pipe 61, the size of the first cold plate 10 can be appropriately set according to the amount of heat generated by the first heat-generating component 81. For this reason, if the amount of heat generated by the first heat-generating component 81 is small, the first cold plate 10 can be made smaller, and the cooling device 100 can be made smaller and lighter.

[0032] In Example 1, it is preferable that the first cold plate 10, the second cold plate 20, the first member 40, the second member 50, the piping 60, the piping 61, and the piping 62 are all made of a metal such as copper or aluminum. In this case, the airtightness of the flow path through which the refrigerant 70 flows can be improved, and the refrigerant 70 can be sealed in the flow path under reduced pressure. This makes it easier for the boiling phenomenon of the refrigerant 70 to occur. [Examples]

[0033] Figure 8 is a perspective view of the cooling device 200 according to Embodiment 2. As shown in Figure 8, in the cooling device 200 according to Embodiment 2, the first member 40a and the second member 50a are provided extending from the second cold plate 20 to the first cold plate 10. Therefore, there is no piping connecting the first cold plate 10 and the first member 40a. The other configurations are the same as in Embodiment 1, so their description is omitted.

[0034] Figures 9(a) and 9(b) are perspective views showing the flow of refrigerant 70 in the cooling device 200 according to Embodiment 2. Figure 9(a) is a perspective view of the cooling device 200 according to Embodiment 2 viewed from the -Y direction, and Figure 9(b) is a perspective view viewed from the +Y direction. Figure 9(a) shows a transparent view of the inside of the first member 40a and the inside of the first cold plate 10. Figure 9(b) shows a transparent view of the inside of the second member 50a and the inside of the first cold plate 10. As shown in Figure 9(a), the inside of the first member 40a is divided into space 41 and space 42. As shown in Figure 9(b), the inside of the second member 50a is divided into space 51 and space 52.

[0035] As shown in Figure 9(a), the refrigerant 70 (indicated by the arrow) supplied to one end of the pipe 60 flows through the pipe 60 and into the first cold plate 10 to which the other end of the pipe 60 is connected. The refrigerant 70 that flows in from the pipe 60 flows through the groove 13 of the lower member 11 of the first cold plate 10 from the +Y direction to the -Y direction.

[0036] The first member 40a is provided extending from the second cold plate 20 to the first cold plate 10, and the groove 13 and the space 41 of the first member 40a are in communication. Therefore, the refrigerant 70 flowing through the groove 13 in the -Y direction flows into the space 41 of the first member 40a. The space 41 is also in communication with the inlet 73 (see also Figure 4) of the lower member 21 of the second cold plate 20. Therefore, the refrigerant 70 that has flowed into the space 41 flows into the inlet 73. The refrigerant 70 that has flowed into the inlet 73 flows through the passage section 72 from the -Y direction to the +Y direction.

[0037] As shown in Figures 9(b) and 4, the space 51 of the second member 50a is in communication with the outlet 74 of the lower member 21 of the second cold plate 20. Therefore, the refrigerant 70 that flows through the passage section 72 in the +Y direction flows from the outlet 74 into the space 51 of the second member 50a. The refrigerant 70 does not flow into the space 52 of the second member 50a. Alternatively, the refrigerant 70 may flow through the partitioned space within the second member 50a instead of the piping 60 and flow into the first cold plate 10 via the space 52.

[0038] As shown in Figures 9(a) and 9(b), one end of the tube 31 of the radiator 30 is connected to space 51. The other end of the tube 31 is connected to space 42 of the first member 40a. Therefore, the refrigerant 70 flows from space 51 of the second member 50a through the radiator 30 from the +Y direction to the -Y direction and into space 42 of the first member 40a. One end of the pipe 62 is connected to space 42. Therefore, the refrigerant 70 that has flowed into space 42 flows through pipe 62 and is discharged from the other end of pipe 62.

[0039] Figure 10 shows the effect of the cooling device 200 according to Example 2. As shown in Figure 10, similar to Example 1, the refrigerant 70 that flows from the piping 60 into the first cold plate 10 rises in temperature by receiving heat from the first heat-generating component 81. After receiving heat from the first heat-generating component 81, the refrigerant 70 flows from the first cold plate 10 through the first member 40a and into the second cold plate 20. The refrigerant 70 receives heat from the second heat-generating component 82 and its temperature rises further. As a result, the boiling phenomenon of the refrigerant 70 is promoted in the second cold plate 20, and the cooling performance for the second heat-generating component 82 is improved by boiling cooling utilizing the latent heat of vaporization of the refrigerant 70.

[0040] According to Example 2, the refrigerant 70, which receives heat from the first heat-generating component 81, flows into the second cold plate 20 through the space 41 of the first member 40a. As a result, the refrigerant 70, whose temperature has risen due to receiving heat from the first heat-generating component 81, receives further heat from the second heat-generating component 82 in the second cold plate 20, causing its temperature to rise further and promoting boiling in the second cold plate 20. Therefore, the cooling performance for the second heat-generating component 82 can be improved by boiling cooling utilizing the latent heat of vaporization of the refrigerant 70. In addition, since the radiator 30 for cooling the refrigerant 70 is provided on the second cold plate 20, the cooling device 200 can be miniaturized.

[0041] In Embodiment 2, the first member 40a and the second member 50a are provided extending from the second cold plate 20 to the first cold plate 10. The first refrigerant passage, which allows refrigerant 70 to flow from the first cold plate 10 to the second cold plate 20, is formed by the space 41 of the first member 40a. With this configuration, the number of parts can be reduced because piping connecting the first cold plate 10 and the first member 40a is unnecessary. In addition, the first member 40a and the second member 50a, which are provided extending from the first cold plate 10 to the second cold plate 20, can function as ducts that allow air to flow toward the radiator 30. Therefore, the cooling performance of the refrigerant 70 in the radiator 30 can be improved. [Examples]

[0042] Figure 11(a) is a perspective view of the lower member 21a of the second cold plate 20 in Embodiment 3, and Figure 11(b) is a perspective view of the lower member 21b of the second cold plate 20 in a modified example of Embodiment 3. Figures 11(a) and 11(b) also illustrate the flow of the refrigerant 70, as well as the second heat-generating component 82 and the third heat-generating component 83 that are cooled by the second cold plate 20.

[0043] As shown in Figure 11(a), in Embodiment 3, the groove 23 provided in the lower member 21a has an inlet 73a near the center in the X-axis direction through which the refrigerant 70 flows in from the first member 40. The passage sections 72a and 72b each separate from the inlet 73a and merge at the outlet 74a. The passage section 72a has a main section 75 which is substantially rectangular in plan view and is provided with a plurality of fins 24a, and a connecting section 76 which connects the main section 75 and the inlet 73a. The region where the fins 24a are provided is a heat receiving region 28a in which the refrigerant 70 receives heat from the second heat-generating component 82. Similarly, the passage section 72b has a main section 77 which is substantially rectangular in plan view and is provided with a plurality of fins 24b, and a connecting section 78 which connects the main section 77 and the inlet 73a. The region where the fins 24b are provided is a heat-receiving region 28b where the refrigerant 70 receives heat from the third heat-generating component 83. The connecting portion 76 and the connecting portion 78 differ in at least one of their dimensions, such as length and width. The other configurations are the same as in Embodiment 1 and will not be described.

[0044] As shown in Figure 11(b), in the modified example of Embodiment 3, two grooves 23a and 23b are provided in the lower member 21b. Groove 23a includes a passage section 72c, an inlet section 73c, and an outlet section 74c. The passage section 72c has a main section 75a that is substantially rectangular in plan view and is provided with a plurality of fins 24a, and a connecting section 76a that connects the main section 75a and the inlet section 73c. ​​The area where the fins 24a are provided is a heat receiving area 28a where the refrigerant 70 receives heat from the second heat-generating component 82. Groove 23b includes a passage section 72d, an inlet section 73d, and an outlet section 74d. The passage section 72d has a main section 77a that is substantially rectangular in plan view and is provided with a plurality of fins 24b, and a connecting section 78a that connects the main section 77a and the inlet section 73d. The region where the fins 24b are provided is a heat-receiving region 28b where the refrigerant 70 receives heat from the third heat-generating component 83. The refrigerant 70 flows from the first member 40 into the inlet sections 73c and 73d, respectively, and flows through the passage sections 72c and 72d. The refrigerant 70 that has flowed through the passage sections 72c and 72d flows out to the second member 50 from the outlet sections 74c and 74d, respectively. The connecting section 76a and the connecting section 78a differ in at least one of their dimensions, for example, length and width. The other configurations are the same as in Embodiment 1, so their description is omitted.

[0045] In Embodiment 3, the lower member 21a of the second cold plate 20 has a passage section 72a (first groove) and a passage section 72b (second groove). In a modified example of Embodiment 3, the lower member 21b of the second cold plate 20 has a passage section 72c (first groove) and a passage section 72d (second groove). The passage sections 72a and 72c have a heat receiving region 28a (first heat receiving region) that receives heat from the second heat-generating component 82. The passage sections 72b and 72d have a heat receiving region 28b (second heat receiving region) that receives heat from the third heat-generating component 83. In Embodiment 3, the refrigerant 70 flowing in from the first member 40 flows in parallel through the passage sections 72a and 72b toward the heat receiving region 28a and the heat receiving region 28b. In the modified example of Embodiment 3, the refrigerant 70 flowing in from the first member 40 flows in parallel through the passage sections 72c and 72d toward the heat receiving region 28a and the heat receiving region 28b. As a result, the refrigerant 70 is divided and flows through the passage sections 72a and 72b, or through the passage sections 72c and 72d, thus reducing the flow rate of the refrigerant 70 in the heat receiving region 28a and the heat receiving region 28b, respectively. Therefore, the boiling phenomenon of the refrigerant 70 can be promoted in the heat receiving regions 28a and 28b, and the cooling performance for the second heat-generating component 82 and the third heat-generating component 83 can be improved.

[0046] Furthermore, in Embodiment 3, as shown in Figure 11(a), the lower member 21a of the second cold plate 20 has an inlet 73a (third groove) into which the refrigerant 70 flows from the first member 40. The passage sections 72a and 72b are connected to the inlet 73a, so that the refrigerant 70 flows in parallel toward the heat receiving regions 28a and 28b. As a result, the flow rate of the refrigerant 70 decreases in the heat receiving regions 28a and 28b, which can promote the boiling phenomenon.

[0047] Furthermore, in Embodiment 3, as shown in Figure 11(a), the length and width of the connecting portion 76 and the connecting portion 78 are different. In a modified example of Embodiment 3, as shown in Figure 11(b), the length and width of the connecting portion 76a and the connecting portion 78a are different. In this way, by making at least one of the length and width of the flow path that the refrigerant 70 flowing in from the first member 40 reaches the heat receiving regions 28a and 28b different, the pressure loss in the flow path can be adjusted. This makes it possible to adjust the flow rate of the refrigerant 70 flowing through the heat receiving regions 28a and 28b. Note that the length and width of the connecting portion 76 and the connecting portion 78 may be the same as a result of adjusting the pressure loss in the flow path. Similarly, the length and width of the connecting portion 76a and the connecting portion 78a may also be the same. [Examples]

[0048] Figure 12 is a perspective view of the cooling device 400 according to Embodiment 4. As shown in Figure 12, in Embodiment 4, a pump 65 is connected to pipes 60 and 62. As a result, the pump 65 can draw in the refrigerant 70 that has passed through the radiator 30 via the first component 40 and pipe 62, and allow it to flow into the first cold plate 10 via pipe 60. Therefore, the refrigerant 70 can be circulated between the pump 65, the first cold plate 10, the second cold plate 20, and the radiator 30. The other configurations are the same as in Embodiment 1, so their explanation is omitted. Note that the number of pumps 65 is not limited to one, and multiple pumps may be provided. [Examples]

[0049] Figure 13(a) is a perspective view of the cooling device 500 according to Embodiment 5, viewed from the -Y direction, and Figure 13(b) is a perspective view viewed from the +Y direction. Figure 13(a) shows a transparent view of the inside of the first member 40 and the first cold plate 10, and Figure 13(b) shows a transparent view of the inside of the second member 50 and the first cold plate 10. The flow of the refrigerant 70 is also shown with arrows. As shown in Figures 13(a) and 13(b), in Embodiment 5, a plurality of radiators 30a and 30b are arranged in the X-axis direction on the second cold plate 20. Here, one radiator is a block in which fins and tubes are integrally formed. The refrigerant 70 discharged from the second cold plate 20 flows from the space 51 of the second member 50 into the tubes 31a and 31b of the radiators 30a and 30b. The refrigerant 70 flows through radiators 30a and 30b and then flows out through tubes 31a and 31b into the space 42 of the first member 40. The other configurations and the flow of the refrigerant 70 are the same as in Example 1, so their description is omitted.

[0050] Figure 14(a) is a perspective view of the cooling device 510 according to a modified example of Embodiment 5, viewed from the -Y direction, and Figure 14(b) is a perspective view viewed from the +Y direction. Figure 14(a) shows a transparent view of the interior of the first member 40b and the first cold plate 10, and Figure 14(b) shows a transparent view of the interior of the second member 50b and the first cold plate 10. The flow of the refrigerant 70 is also shown with arrows. As shown in Figure 14(a), the interior of the first member 40b is divided into space 41, space 42 and space 43. As shown in Figure 14(b), the interior of the second member 50b is divided into space 51 and space 52.

[0051] As shown in Figures 14(a) and 14(b), in the modified example of Embodiment 5, a plurality of radiators 30a, 30b, and 30c are arranged in the X-axis direction on the second cold plate 20. The refrigerant 70 discharged from the second cold plate 20 flows from the space 51 of the second member 50b into the tube 31a of the radiator 30a. After flowing through the radiator 30a, the refrigerant 70 flows out from the tube 31a into the space 42 of the first member 40b. The tube 31b of the radiator 30b is also connected to the space 42. Therefore, the refrigerant 70 flows from the space 42 into the tube 31b of the radiator 30b.

[0052] The refrigerant 70 flows through the radiator 30b and then flows out of tube 31b into the space 52 of the second component 50b. The tube 31c of the radiator 30c is also connected to space 52. Therefore, the refrigerant 70 flows from space 52 into tube 31c of the radiator 30c. After flowing through the radiator 30c, the refrigerant 70 flows out of tube 31c into the space 43 of the first component 40b. One end of pipe 62 is connected to space 43. Therefore, the refrigerant 70 that flows into space 43 flows through pipe 62 and is discharged from the other end of pipe 62. The other configurations and the flow of the refrigerant 70 are the same as in Embodiment 1, so their explanation is omitted.

[0053] In Example 5 and its modified form, a plurality of radiators 30a to 30c are provided on the second cold plate 20, arranged in the X-axis direction (one direction). It can be difficult to place a large radiator 30 on the second cold plate 20 from a manufacturing standpoint or other reasons. In such cases, it is preferable to provide a plurality of radiators 30a to 30c on the second cold plate 20 in order to effectively utilize the space on the second cold plate 20 to cool the refrigerant 70.

[0054] Furthermore, in a modified example of Example 5, as shown in Figures 14(a) and 14(b), the multiple radiators 30a to 30c are arranged in a direction perpendicular to the direction in which the refrigerant 70 flows through the second cold plate 20 (Y-axis direction) (X-axis direction). The refrigerant 70 flows sequentially through the multiple radiators 30a to 30c arranged in the X-axis direction. This improves the cooling effect on the refrigerant 70.

[0055] In Example 5 and its modified form, the number of radiators is not limited to two or three, but may be four or more. [Examples]

[0056] Figure 15(a) is an external perspective view of the electronic component 600 according to Embodiment 6, and Figure 15(b) is a plan view of the circuit board 84 located inside the housing 80. As shown in Figures 15(a) and 15(b), the electronic component 600 according to Embodiment 6 has a circuit board 84 provided inside the housing 80. The electronic component 600 is, for example, a PCIe (Peripheral Component Interconnect Express) card and is removable from a slot 85 of an electronic device such as a computer. Note that the electronic component 600 may be other expansion cards or even something other than an expansion card.

[0057] A first heat-generating component 81, a second heat-generating component 82, and a pump 65 are provided on a substrate 84. The substrate 84 is, for example, a printed circuit board. The second heat-generating component 82 is, for example, a component that generates more heat than the first heat-generating component 81. For example, the first heat-generating component 81 is an optical component, and the second heat-generating component 82 is an electronic circuit component such as an LSI (Large Scale Integration). A cooling device 100 for cooling the first heat-generating component 81 and the second heat-generating component 82 is arranged on the substrate 84. Therefore, the cooling device 100 is housed together with the substrate 84 in the housing 80. Piping 60 and 62 are connected to the pump 65 provided on the substrate 84. The cooling device 100 has been described in Embodiment 1, so its description is omitted here.

[0058] In Example 6, a first heat-generating component 81, a second heat-generating component 82, and a cooling device 100 for cooling the first heat-generating component 81 and the second heat-generating component 82 are provided on a substrate 84. The cooling device 100 has a radiator 30 provided on a second cold plate 20. As such, the cooling device 100 is small and can be placed on the substrate 84. Furthermore, as described in Example 1, the refrigerant 70, whose temperature rises after receiving heat from the first heat-generating component 81 on the first cold plate 10, further rises in temperature after receiving heat from the second heat-generating component 82 on the second cold plate 20. As a result, the boiling phenomenon of the refrigerant 70 is promoted on the second cold plate 20, improving the cooling performance for the second heat-generating component 82.

[0059] In Example 6, the electronic component 600 is an electronic component that can be inserted into and removed from a slot 85 of an electronic device. The slot 85 is, for example, a PCIe slot. The cooling device 100 is small, lightweight, and has excellent cooling performance, so it can be applied to such an electronic component 600.

[0060] In addition, in Example 6, a pump 65 is provided on the substrate 84 to draw in the refrigerant 70 that has passed through the radiator 30 and flow it into the first cold plate 10. Because the cooling device 100 is small, the pump 65 can be provided on the substrate 84.

[0061] Furthermore, in Example 6, the second heat-generating component 82 generates more heat than the first heat-generating component 81. For example, the first heat-generating component 81 is an optical component that generates little heat. In this case, boiling of the refrigerant 70 is suppressed at the first cold plate 10, and boiling at the second cold plate 20 is promoted. Therefore, the cooling performance for the second heat-generating component 82, which generates more heat, is improved.

[0062] In Example 6, the cooling device provided on the substrate 84 is not limited to the cooling device 100 of Example 1, but may also be the cooling device of other examples and modified versions.

[0063] Although embodiments of the present invention have been described in detail above, the present invention is not limited to these specific embodiments, and various modifications and changes are possible within the scope of the gist of the present invention as described in the claims.

[0064] Furthermore, the following additional information is disclosed regarding the above explanation. (Note 1) A cooling device comprising: a first cold plate for cooling a first heat-generating component; a second cold plate for cooling a second heat-generating component; a radiator provided on the second cold plate for cooling a refrigerant; a first refrigerant passage connecting the first cold plate and the second cold plate, which allows the refrigerant, which has received heat from the first heat-generating component, to flow from the first cold plate to the second cold plate; and a second refrigerant passage connecting the second cold plate and the radiator, which allows the refrigerant, which has received heat from the second heat-generating component, to flow from the second cold plate to the radiator. (Note 2) The cooling device according to Note 1, comprising a first member and a second member provided on either side of the radiator, wherein the first member has a first refrigerant passage and a third refrigerant passage through which the refrigerant flows in from the radiator, and the second member has a second refrigerant passage. (Note 3) The cooling device according to Note 2, comprising piping connecting the first cold plate and the first member, wherein the first refrigerant passage is formed by the piping and the space within the first member. (Note 4) The cooling device according to Note 2, wherein the first member and the second member are provided extending from the second cold plate to the first cold plate, and the first refrigerant passage is formed by the space within the first member. (Note 5) The cooling device according to Note 1 or 2, wherein the second cold plate cools the second heat-generating component and the third heat-generating component, and has first grooves and second grooves through which the refrigerant flows in parallel toward a first heat-receiving region that receives heat from the second heat-generating component and a second heat-receiving region that receives heat from the third heat-generating component. (Note 6) The cooling device according to Note 5, wherein the second cold plate has a third groove into which the refrigerant flows, and the refrigerant flows in parallel toward the first heat receiving region and the second heat receiving region by the connection of the first groove and the second groove with the third groove. (Note 7) The cooling device according to Note 1 or 2, further comprising a pump that draws in the refrigerant that has passed through the radiator and flows it into the first cold plate. (Note 8) The cooling device according to Note 1 or 2, wherein the radiators are arranged in a plurality on the second cold plate. (Note 9) The cooling device described in Note 8, wherein the refrigerant flows sequentially through the plurality of radiators. (Note 10) The cooling device according to Note 1 or 2, wherein the refrigerant is used to boil-cool the second heat-generating component in the second cold plate. (Note 11) An electronic component comprising a substrate, a first heat-generating component provided on the substrate, a second heat-generating component provided on the substrate, and a cooling device provided on the substrate, wherein the cooling device comprises a first cold plate for cooling the first heat-generating component, a second cold plate for cooling the second heat-generating component, a radiator provided on the second cold plate for cooling a refrigerant, a first refrigerant passage connecting the first cold plate and the second cold plate and allowing the refrigerant, which has received heat from the first heat-generating component, to flow from the first cold plate to the second cold plate, and a second refrigerant passage connecting the second cold plate and the radiator and allowing the refrigerant, which has received heat from the second heat-generating component, to flow into the radiator. (Note 12) The electronic component described in Note 11, which is insertable into and removeable from a slot in an electronic device. (Note 13) The electronic component according to Note 11 or 12, comprising a pump provided on the substrate for drawing in the refrigerant that has passed through the radiator and flowing it into the first cold plate. (Note 14) The aforementioned slot is a PCIe slot, as described in Note 12. (Note 15) The second heat-generating component is an electronic component described in Note 11 or 12, wherein the second heat-generating component generates more heat than the first heat-generating component. (Note 16) The first heat-generating component is an optical component, an electronic component as described in Note 15. [Explanation of symbols]

[0065] 10...First cold plate, 11...Lower member, 12...Upper member, 13...Groove, 14...Fin, 15...Flow path, 16...Through hole, 17...Through hole, 18...Heat receiving area, 20...Second cold plate, 21, 21a, 21b...Lower member, 22...Upper member, 23, 23a, 23b...Groove, 24, 24a, 24b...Fin, 25...Flow path, 26...Through hole, 27...Through hole, 28, 28a, 28b...Heat receiving area, 30, 30a, 30b, 30c...Radiator, 31, 31a, 31b, 31c...Tube, 40, 40a, 40b...First member, 41...Space, 42...Space, 43...Space, 50, 50a, 50b...Second member, 51...Space, 52...Space, 60...Piping, 61...Piping, 62...Piping, 65...Pump, 70...Refrigerant, 71...Gas, 72, 72a, 72b, 72c, 72d...Flow passage, 73, 73a, 73c, 73d...Inlet, 74, 74a, 74c, 74d...Outlet, 75, 75a...Main part, 76, 76a...Connection part, 77, 77a...Main part, 78, 78a...Connection part, 80...Housing, 8 1…First heat-generating component, 82…Second heat-generating component, 83…Third heat-generating component, 84…Circuit board, 85…Slot, 90…Cold plate, 91…Lower member, 92…Upper member, 93…Radiator, 94…Component, 95…Component, 96…Groove, 97…Flow path, 100, 200, 400, 500, 510, 1000…Cooling device, 600…Electronic component

Claims

1. A first cold plate for cooling the first heat-generating component, A second cold plate for cooling the second heat-generating component, A radiator is provided on the second cold plate to cool the refrigerant, A first refrigerant passage connects the first cold plate and the second cold plate, and allows the refrigerant, which has received heat from the first heat-generating component, to flow from the first cold plate to the second cold plate. A cooling device comprising a second refrigerant passage that connects the second cold plate and the radiator, and allows the refrigerant, which has received heat from the second heat-generating component, to flow from the second cold plate to the radiator.

2. The radiator is flanked by a first member and a second member, The first member has a first refrigerant passage and a third refrigerant passage through which the refrigerant flows in from the radiator. The cooling device according to claim 1, wherein the second member has the second refrigerant passage.

3. The system includes piping connecting the first cold plate and the first member, The cooling device according to claim 2, wherein the first refrigerant passage is formed by the piping and the space within the first member.

4. The first member and the second member are provided extending from the second cold plate to the first cold plate, The cooling device according to claim 2, wherein the first refrigerant passage is formed by a space within the first member.

5. The cooling device according to claim 1 or 2, wherein the second cold plate has first grooves and second grooves through which the refrigerant flows in parallel toward a first heat receiving region that receives heat from the second heat receiving region and a second heat receiving region that receives heat from the third heat receiving region.

6. The cooling device according to claim 1 or 2, wherein a plurality of radiators are arranged in a row on the second cold plate.

7. The cooling device according to claim 1 or 2, wherein the refrigerant is used to boil-cool the second heat-generating component in the second cold plate.

8. circuit board and A first heat-generating component provided on the substrate, A second heat-generating component provided on the substrate, The substrate includes a cooling device provided on the substrate, The cooling device, A first cold plate for cooling the first heat-generating component, A second cold plate for cooling the second heat-generating component, A radiator is provided on the second cold plate to cool the refrigerant, A first refrigerant passage connects the first cold plate and the second cold plate, and allows the refrigerant, which has received heat from the first heat-generating component, to flow from the first cold plate to the second cold plate. An electronic component comprising: a second refrigerant passage that connects the second cold plate and the radiator, and allows the refrigerant, which has received heat from the second heat-generating component, to flow into the radiator.

9. The electronic component according to claim 8, wherein the electronic component is insertable into and removeable from a slot in an electronic device.

10. The electronic component according to claim 8 or 9, further comprising a pump provided on the substrate for drawing in the refrigerant that has passed through the radiator and flowing it into the first cold plate.

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