Electronic components and mounting structures for electronic components

Abstract

Prevents connection problems caused by the tombstone phenomenon. [Solution] An electronic component mounted on the surface of a wiring board comprises a substantially rectangular parallelepiped chip body having a bottom surface facing the surface of the wiring board, a top surface which is the surface opposite to the bottom surface, a first end surface which is the surface between the bottom surface and the top surface, a second end surface which is the surface opposite to the first end surface, and a side surface between the first end surface and the second end surface; an electrical element formed inside the chip body; a first electrode provided on the bottom surface, the top surface and the side surface so as to surround the first end surface; and a second electrode provided on the bottom surface, the top surface and the side surface so as to surround the second end surface, wherein no electrodes are provided on the first end surface and the second end surface.

Description

Technical Field

[0001] The present invention relates to electronic components and a mounting structure for electronic components.

Background Art

[0002] An electronic component mounted on a substrate surface is disclosed in Patent Document 1. In the electronic component disclosed in Patent Document 1, one electrode is connected to a land of a transmission line, and the other electrode is connected to a land of a ground pattern.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When an electronic component is mounted on a substrate surface, connection failure due to the tombstone phenomenon may occur. For example, when the area of the land of the transmission line to which one electrode of the electronic component is connected is different from the area of the land of the ground pattern to which the other electrode is connected, connection failure due to the tombstone phenomenon may occur. Note that the tombstone phenomenon is that when a metal bonding material such as solder melts once and then solidifies, the electronic component rises so that one electrode separates from the substrate surface.

[0005] The present disclosure has been made in view of the above, and an object thereof is to provide an electronic component and a mounting structure for an electronic component that can prevent connection failure due to the tombstone phenomenon.

Means for Solving the Problems

[0006] An electronic component according to one aspect of the present disclosure is an electronic component mounted on the surface of a wiring board, comprising: a substantially rectangular parallelepiped chip body having a bottom surface facing the surface of the wiring board; a top surface which is the surface opposite to the bottom surface; a first end surface which is the surface between the bottom surface and the top surface; a second end surface which is the surface opposite to the first end surface; and a side surface between the first end surface and the second end surface; an electrical element formed inside the chip body; a first electrode provided on the bottom surface, the top surface and the side surface so as to surround the first end surface; and a second electrode provided on the bottom surface, the top surface and the side surface so as to surround the second end surface, wherein no electrodes are provided on the first end surface and the second end surface.

[0007] An electronic component mounting structure according to one aspect of the present disclosure is an electronic component mounting structure in which an electronic component is mounted on the surface of a wiring board, wherein the electronic component comprises a substantially rectangular parallelepiped chip body having a bottom surface facing the surface of the wiring board, a top surface which is the surface opposite to the bottom surface, a first end surface which is the surface between the bottom surface and the top surface, a second end surface which is the surface opposite to the first end surface, and a side surface between the first end surface and the second end surface, an electrical element formed inside the chip body, a first electrode provided on the bottom surface, the top surface and the side surface so as to surround the first end surface, and a second end The device comprises a second electrode provided on the bottom surface, the top surface, and the side surface so as to surround the surface, the first end surface and the second end surface are not provided with electrodes, the first electrode and the second electrode are used for bonding to the wiring board, the wiring board comprises a first land provided on the main surface of the board and having a predetermined area when viewed in the direction perpendicular to the main surface of the board, and a second land provided on the main surface of the board and having a larger area than the first land, the first electrode is bonded to the first land and the second electrode is bonded to the second land. [Effects of the Invention]

[0008] According to this disclosure, connection failures caused by the tombstone phenomenon can be prevented. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a perspective view of electronic components using comparative examples. [Figure 2] Figure 2 shows the mounting structure for mounting the comparative electronic components onto a wiring board. [Figure 3] Figure 3 shows a first embodiment of the present disclosure. [Figure 4] Figure 4 shows a second embodiment of the present disclosure. [Figure 5] Figure 5 shows an example of an electronic component in which the electrical element inside the chip body is an inductor. [Figure 6A] Figure 6A shows a partial cross-section of the electronic component shown in Figure 5. [Figure 6B] Figure 6B shows a partial cross-section of the electronic component shown in Figure 5. [Figure 6C] Figure 6C shows a partial cross-section of the electronic component shown in Figure 5. [Figure 7] Figure 7 shows an example of an electronic component in which the electrical element inside the chip is a capacitor. [Figure 8A] Figure 8A shows a partial cross-section of the electronic component shown in Figure 7. [Figure 8B] Figure 8B shows a partial cross-section of the electronic component shown in Figure 7. [Figure 8C] Figure 8C shows a partial cross-section of the electronic component shown in Figure 7. [Figure 8D] Figure 8D shows a partial cross-section of the electronic component shown in Figure 7. [Figure 9] Figure 9 shows another example of an electronic component in which the electrical element inside the chip is a capacitor. [Figure 10A] Figure 10A shows a partial cross-section of the electronic component shown in Figure 9. [Figure 10B] Figure 10B shows a partial cross-section of the electronic component shown in Figure 9. [Figure 10C] Figure 10C shows a partial cross-section of the electronic component shown in Figure 9. [Figure 10D] Figure 10D shows a partial cross-section of the electronic component shown in Figure 9.

Best Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described in detail based on the drawings. In the description of each of the following embodiments, the same or equivalent components as those in other embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted. The present invention is not limited by each embodiment. Also, the components of each embodiment include those that can be replaced and are easy for those skilled in the art, or those that are substantially the same. The configurations described below can be combined as appropriate. Omissions, substitutions, or changes in the configuration can be made without departing from the gist of the invention.

[0011] Hereinafter, for ease of understanding of the embodiments, a comparative example will be described first.

[0012] (Comparative Example) FIG. 1 is a perspective view of an electronic component according to a comparative example. As shown in FIG. 1, the electronic component 101 according to the comparative example has a chip body 100, a first electrode 10a, and a second electrode 20a.

[0013] The shape of the chip body 100 is a substantially rectangular parallelepiped. The chip body 100 has a bottom surface S2 that faces the surface of the wiring board when mounted, an upper surface S1 that is the opposite surface of the bottom surface S2, a first end surface T1 that is a surface between the bottom surface S2 and the upper surface S1, a second end surface T2 that is the opposite surface of the first end surface, and side surfaces S3 and S4 between the first end surface T1 and the second end surface T2. The surface opposite to the side surface S3 is the side surface S4. Electrical elements such as an inductor and a capacitor are formed inside the chip body 100.

[0014] In Figure 1, the direction from the front to the back of the first end face T1 and second end face T2 of the electronic component 101 is defined as the X-axis direction, the direction from the first end face T1 to the second end face T2 of the electronic component 101 is defined as the Y-axis direction, and the height direction from the bottom to the top of the first end face T1 and second end face T2 of the electronic component 101 is defined as the Z-axis direction. In the diagrams referenced in the following explanation, the direction from the front to the back of electronic component 101 may be referred to as the positive X-axis direction or positive side, the direction from the back to the front of electronic component 101 may be referred to as the negative X-axis direction or negative side, the direction from the first end face T1 to the second end face T2 of electronic component 101 may be referred to as the positive Y-axis direction or positive side, the direction from the second end face T2 to the first end face T1 of electronic component 1 may be referred to as the negative Y-axis direction or negative side, the direction from the bottom to the top of the first end face T1 and second end face T2 of electronic component 101 may be referred to as the positive Z-axis direction or positive side, and the direction from the top to the bottom of the first end face T1 and second end face T2 of electronic component 101 may be referred to as the negative Z-axis direction or negative side. The same applies to other diagrams referenced in the following explanation.

[0015] The first electrode 10a covers the first end face T1 and is further provided continuously on the top surface S1, bottom surface S2, side surfaces S3 and S4 so as to surround the first end face T1. The first electrode 10a includes an electrode portion 10T provided on the first end face T1, an electrode portion 11a provided on the top surface S1, an electrode portion 12a provided on the bottom surface S2, an electrode portion 13a provided on the side surface S3, and an electrode portion 14a provided on the side surface S4.

[0016] The second electrode 20a covers the second end face T2 and is further provided continuously on the top surface S1, bottom surface S2, side surfaces S3 and S4 so as to surround the second end face T2. The second electrode 20a includes an electrode portion 20T provided on the first end face T1, an electrode portion 21a provided on the top surface S1, an electrode portion 22a provided on the bottom surface S2, an electrode portion 23a provided on the side surface S3, and an electrode portion 24a provided on the side surface S4.

[0017] When mounting the electronic component 101 onto a wiring board, the first electrode 10a and the second electrode 20a are used for electrical connection to the wiring board via a metal bonding material such as solder. When mounting the electronic component 1 onto the wiring board with the top surface S1 as the top surface and the electrode portion 11a of the first electrode 10a facing the top surface, the bottom surface S2 becomes the bottom surface facing the surface of the wiring board, and the electrode portion 12a provided on the bottom surface S2 contacts the wiring board. At this time, the electrode portion 21a of the second electrode 20a becomes the top surface, and the electrode portion 22a provided on the bottom surface S2 contacts the wiring board.

[0018] When the electronic component 101 is joined in this state, for example, the joining materials f1 and f2 melt once and adhere in a fillet shape. The joining materials f1 and f2 are metals with a lower melting point than the first electrode 10a and the second electrode 20a. The first electrode 10a and the second electrode 20a are, for example, Sn alloys. Therefore, the joining material f1 adheres in a fillet shape, spanning from the side of the electrode portion 14a provided on the side surface S4 that is close to the electrode portion 12a, to the side of the electrode portion 10T provided on the first end face T1 that is close to the electrode portion 12a, and further to the side of the electrode portion 13a provided on the side surface S3 that is close to the electrode portion 12a. Furthermore, the bonding material f2 adheres in a fillet shape, spanning from the side of the electrode portion 24a on the side surface S4 that is closer to the electrode portion 22a, to the side of the electrode portion 20T on the second end surface T2 that is closer to the electrode portion 22a, and further across to the side of the electrode portion 23a on the side surface S3 that is closer to the electrode portion 22a.

[0019] Figure 2 shows a mounting structure for mounting the comparative electronic component on a wiring board. Figure 2 is a plan view of the electronic component 101 and the wiring board 201 as seen from the positive side of the Z axis. In Figure 2, the comparative electronic component 101 is mounted on the surface of the wiring board 201. The wiring board 201 includes a signal line pattern 5 and a ground pattern 6. The signal line pattern 5 extends from the negative side of the X axis to the positive side of the X axis. Lands 50 are provided on the signal line pattern 5. The width W50 of the land in the Y axis direction is greater than the width W51 of the signal line pattern 5 in the Y axis direction.

[0020] The ground pattern 6 is provided in the vicinity of the signal line pattern 5. The ground pattern 6 and the signal line pattern 5 are not electrically connected. The ground pattern 6 has portions 61a and 61b that are close to the signal line pattern 5 and parallel to the signal line pattern 5. The ground pattern 6 also has a recess 61c that is away from the signal line pattern 5 on the negative side of the Y axis. A land 60 is provided in the recess 51c of the ground pattern 6 that protrudes on the positive side of the Y axis.

[0021] When the electronic component 101 is mounted on the wiring board 201, the first electrode 10a of the electronic component 101 is connected to the land 60 by bonding material f1. This electrically connects the first electrode 10a and the land 60. Also, when the electronic component 101 is mounted, the second electrode 20a of the electronic component 101 is connected to the land 50 by bonding material f2. This electrically connects the second electrode 20a and the land 50.

[0022] Here, as the bonding materials f1 and f2 solidify, negative Z-axis stress is generated in the first electrode 10a and the second electrode 20a, respectively. If the area of ​​land 50 and the area of ​​land 60 are different, the negative Z-axis stress will be different. When the negative Z-axis stress is different, for example, the second electrode 20a on the land 50 side may rise in the positive Z-axis direction (i.e., a tombstone phenomenon). When this tombstone phenomenon occurs, land 50 and the second electrode 20a may separate, and they may become electrically disconnected.

[0023] (First Embodiment) (composition) Figure 3 shows a first embodiment of the present disclosure. Figure 3 is a perspective view of an electronic component according to the first embodiment. As shown in Figure 3, the electronic component 1 according to the first embodiment includes a chip body 100, a first electrode 10, and a second electrode 20. Unlike the comparative example electronic component 101, the electronic component 1 according to the first embodiment shown in Figure 3 does not have electrodes provided on the first end face T1 and the second end face T2.

[0024] The shape of the chip element 100 is approximately a rectangular parallelepiped, similar to the comparative example. Specifically, the chip element 100 has a bottom surface S2 that faces the surface of the wiring board when mounted, a top surface S1 which is the opposite side of the bottom surface S2, a first end surface T1 which is the surface between the bottom surface S2 and the top surface S1, a second end surface T2 which is the opposite side of the first end surface, and sides S3 and S4 between the first end surface T1 and the second end surface T2. The surface opposite side surface S3 is side surface S4. Electrical elements, which will be described later, are formed inside the chip element 100.

[0025] The first electrode 10 is provided continuously on the top surface S1, bottom surface S2, side surfaces S3 and S4 so as to surround the first end surface T1. The first electrode 10 includes an electrode portion 11 provided on the top surface S1, an electrode portion 12 provided on the bottom surface S2, an electrode portion 13 provided on the side surface S3, and an electrode portion 14 provided on the side surface S4. No electrode is provided on the first end surface T1. Therefore, the chip body 100 is exposed on the first end surface T1.

[0026] The second electrode 20 is provided on the bottom surface S2, the top surface S1, and the sides S3 and S4 so as to surround the second end surface T2. The second electrode 20 includes an electrode portion 21 provided on the top surface S1, an electrode portion 22 provided on the bottom surface S2, an electrode portion 23 provided on the side surface S3, and an electrode portion 24 provided on the side surface S4. No electrode is provided on the second end surface T2. Therefore, the chip body 100 is exposed on the second end surface T2.

[0027] The first electrode 10 and the second electrode 20 are formed by printing, sputtering, or other methods. It is preferable to use materials such as Ag or Cu for the first electrode 10 and the second electrode 20, and to perform plating treatment with Ni or Sn.

[0028] Note that the line A-A' in Figure 3 passes through the midpoint of the length of electrode portion 12 in the X-axis direction and the midpoint of the length of electrode portion 22 in the X-axis direction. Electronic component 1 has a shape that is symmetrical with respect to the line A-A' as the axis of symmetry.

[0029] When mounting electronic component 1 to the surface of a wiring board, the first electrode 10 and the second electrode 20 are used for bonding to the wiring board. When mounting electronic component 1 to the wiring board with the top surface S1 as the top surface and the electrode portion 11 of the first electrode 10 facing the top surface, the bottom surface S2 becomes the bottom surface facing the surface of the wiring board, and the electrode portion 12 provided on the bottom surface S2 contacts the wiring board. At this time, the electrode portion 21 of the second electrode 20 becomes the top surface, and the electrode portion 22 provided on the bottom surface S2 contacts the wiring board.

[0030] When the bonding process is performed in this state, for example, the bonding material f11 adheres in a fillet shape to the side of the electrode portion 14 on the side surface S4 that is closer to the electrode portion 12. Similarly, the bonding material f12 adheres in a fillet shape to the side of the electrode portion 13 on the side surface S3 that is closer to the electrode portion 12. In addition, the bonding material f21 adheres in a fillet shape to the side of the electrode portion 24 on the side surface S4 that is closer to the electrode portion 22. Similarly, the bonding material f22 adheres in a fillet shape to the side of the electrode portion 23 on the side surface S3 that is closer to the electrode portion 22. Since electrodes are not provided on the first end face T1 and the second end face T2, the bonding material does not adhere to them.

[0031] (effect) Here, as the bonding materials f11, f12, f21, and f22 solidify, negative stress in the Z-axis direction is generated in the first electrode 10 and the second electrode 20, respectively. However, since electrodes are not provided on the first end face T1 and the second end face T2, the generated stress is smaller than in the comparative example. Therefore, the tombstone phenomenon can be suppressed. Consequently, the electrical connection between the land 50 and the second electrode 20 can be maintained.

[0032] (Second Embodiment) (composition) Figure 4 shows a second embodiment of the present disclosure. Figure 4 shows a mounting structure for an electronic component according to the second embodiment. Figure 4 is a plan view of the electronic component 1 and the wiring board 200 as seen from the positive Z-axis side. The difference between the mounting structure shown in Figure 4 and that in Figure 2 is that the length of one side of the substantially rectangular land 51 is different. That is, the length of one side of the substantially rectangular land 51 provided on the signal line pattern 5, i.e., the width W51 in the Y-axis direction, is the same as the width W51 of the signal line pattern 5 in the Y-axis direction. In other words, the width of the land 51 in the Y-axis direction is the same as the width W51 of the signal line pattern 5 in the Y-axis direction. Note that even if there is a difference in width, if the difference is within the range of error that occurs during the manufacturing of the signal line pattern 5 and the land 51, the width is considered to be the same.

[0033] Here, the area of ​​land 60 is larger than the area of ​​land 51. Land 51 corresponds to the first land in this disclosure. Land 60 corresponds to the second land in this disclosure. Electrode 10, which is the first electrode, is joined to land 51. Electrode 20, which is the second electrode, is joined to land 60.

[0034] (effect) By making the width of the signal line pattern 5 and the width of the land 51 the same, the width can be made uniform. This makes it less likely for characteristic impedance mismatch to occur, and good high-frequency characteristics (e.g., S21 characteristics) can be maintained.

[0035] Furthermore, the inventors compared the stress applied to the land 51 side of the chip body 100 and the stress applied to the land 60 side of the chip body 100 for electronic component 1 and comparative example electronic component 101 through simulation. As a result, when using comparative example electronic component 101 (see Figure 1), the stress on the land 51 side is large, and the resulting stress difference is approximately 25%. In contrast, when using electronic component 1, the stress on the land 51 side is large, and the resulting stress difference is approximately 4%. Therefore, the tombstone phenomenon can be suppressed. Consequently, the electrical connection state between the land 51 and the second electrode 20 can be maintained.

[0036] (Electrical elements inside the chip body) As described above, in the first and second embodiments, electrical elements are provided inside the chip body 100. Examples of electrical elements will be described below.

[0037] (Inductor) Figure 5 shows an example of an electronic component 1a in which the electrical element inside the chip body 100 is an inductor. Figure 5 shows an example of a cross-section of the electronic component 1a cut along the line A-A' in Figure 3. The chip body 100 is formed from a magnetic material such as ferrite.

[0038] The electronic component 1a shown in Figure 5 includes a via hole 31, a via hole 32, and conductors 41, 42, and 43. Via hole 31 connects electrode portion 11 and electrode portion 12. Via hole 32 connects electrode portion 21 and electrode portion 22. Via holes 31 and 32 extend in the Z-axis direction. Conductors 41, 42, and 43 extend in the Y-axis direction. Conductor 41 is electrically connected to via hole 32. Conductor 43 is electrically connected to via hole 31. Via holes 31 and 32, as well as conductors 41, 42, and 43, can be formed, for example, by a lamination method.

[0039] Figures 6A to 6C show partial cross-sections of the electronic component 1a shown in Figure 5. Figure 6A shows an example of a cross-section cut along the line B1-B1' in Figure 5. Figure 6B shows an example of a cross-section cut along the line B2-B2' in Figure 5. Figure 6C shows an example of a cross-section cut along the line B3-B3' in Figure 5.

[0040] As shown in Figure 6A, one end of conductor 41 is connected to via hole 32. The other end of conductor 41 is connected to via hole 33. Conductor 41 extends in the positive and negative directions of the X-axis and the positive and negative directions of the Y-axis, and extends clockwise from via hole 32 to via hole 33.

[0041] As shown in Figure 6B, one end of the conductor 42 is connected to via hole 33. The other end of the conductor 42 is connected to via hole 34. The conductor 42 extends in the positive and negative directions of the X-axis and the positive and negative directions of the Y-axis, and extends clockwise from via hole 33 to via hole 34.

[0042] As shown in Figure 6C, one end of conductor 43 is connected to via hole 34. The other end of conductor 43 is connected to via hole 31. Conductor 43 extends in the positive and negative directions of the X-axis and the positive and negative directions of the Y-axis, and extends clockwise from via hole 34 to via hole 31.

[0043] According to the configuration shown in Figures 6A to 6C, an inductor is formed between electrode portions 11 and 12 and electrode portions 21 and 22 in Figure 5. Therefore, an inductor, which is an electrical element, is formed inside the chip body 100.

[0044] As shown in Figures 5 and 6A to 6C, the inductor in this example is formed by three conductors 41, 42, and 43, but an inductor may also be formed by stacking a larger number of conductors.

[0045] (Capacitor) Figure 7 shows an example of an electronic component 1b in which the electrical element inside the chip body 100 is a capacitor. Figure 7 shows an example of a cross-section of the electronic component 1b cut along the line A-A' in Figure 3. The chip body 100 is formed of, for example, a dielectric material.

[0046] The electronic component 1b shown in Figure 7 includes conductors 45, 46, 47, and 48, and via holes 31a, 31b, 32a, and 32b. Conductors 45, 46, 47, and 48 are flat and extend in the X-axis and Y-axis directions. Inside the chip body 100, the main surface 451 of conductor 45 and the main surface 461 of conductor 46 partially face each other, the main surface 462 of conductor 46 and the main surface 471 of conductor 47 partially face each other, and the main surface 472 of conductor 47 and the main surface 481 of conductor 48 partially face each other.

[0047] Via hole 31a connects electrode portion 11 and conductor 45. Via hole 31b connects electrode portion 12 and conductor 47. Via hole 32a connects electrode portion 21 and conductor 46. Via hole 32b connects electrode portion 22 and conductor 48. Via holes 31a, 31b, 32a and 32b, as well as conductors 45, 46, 47 and 48, can be formed, for example, by a lamination method.

[0048] Figures 8A to 8D show partial cross-sections of electronic component 1b shown in Figure 7. Figure 8A shows an example of a cross-section cut along the line C1-C1' in Figure 7. Figure 8B shows an example of a cross-section cut along the line C2-C2' in Figure 7. Figure 8C shows an example of a cross-section cut along the line C3-C3' in Figure 7. Figure 8D shows an example of a cross-section cut along the line C4-C4' in Figure 7.

[0049] As shown in Figure 8A, conductor 45 is rectangular when viewed from the negative side of the Z-axis towards the positive side. A via hole 31a is electrically connected to conductor 45. As shown in Figure 8B, conductor 46 is rectangular when viewed from the negative side of the Z-axis towards the positive side. A via hole 32a is electrically connected to conductor 46. As shown in Figure 8C, conductor 47 is rectangular when viewed from the positive side of the Z-axis towards the negative side. A via hole 31b is electrically connected to conductor 47. As shown in Figure 8D, conductor 48 is rectangular when viewed from the positive side of the Z-axis towards the negative side. A via hole 32b is electrically connected to conductor 48.

[0050] According to the configuration shown in Figures 8A to 8D, capacitors are formed between electrode portions 11 and 12 and electrode portions 21 and 22 by conductors 45, 46, 47, and 48 in Figure 7. Therefore, an electrical element, a capacitor, is formed inside the chip body 100.

[0051] As shown in Figures 7 and 8A to 8D, the capacitor in this example is formed by four conductors 45, 46, 47, and 48, but a larger number of conductors may be stacked to form the capacitor.

[0052] The conductor and the electrode may be electrically connected without providing via holes. Figure 9 shows another example of an electronic component in which the electrical element inside the chip body 100 is a capacitor. Figure 9 shows an example of an electronic component 1c in which the electrical element is a capacitor. Figure 9 shows an example of a cross-section of the electronic component 1c cut along the line A-A' in Figure 3. The chip body 100 is formed of, for example, a dielectric material.

[0053] The electronic component 1c shown in Figure 9 comprises conductors 45a, 46a, 47a, and 48a, which have different conductor shapes from the electronic component 1b described with reference to Figure 7. Furthermore, unlike the electronic component 1b described with reference to Figure 7, electronic component 1c does not have via holes. Conductors 45a, 46a, 47a, and 48a can be formed, for example, by a lamination method.

[0054] Figures 10A to 10D show partial cross-sections of the electronic component 1c shown in Figure 9. Figure 10A shows an example of a cross-section cut along the line C1-C1' in Figure 9. Figure 10B shows an example of a cross-section cut along the line C2-C2' in Figure 9. Figure 10C shows an example of a cross-section cut along the line C3-C3' in Figure 9. Figure 10D shows an example of a cross-section cut along the line C4-C4' in Figure 9.

[0055] As shown in Figure 10A, the conductor 45a is approximately rectangular when viewed from the negative side of the Z-axis towards the positive side. The portion of the conductor 45a closest to the electrode 13 extends in the negative direction of the X-axis, and this extension 45a3 is electrically connected to the electrode 13. In addition, the portion of the conductor 45a closest to the electrode 14 extends in the positive direction of the X-axis, and this extension 45a4 is electrically connected to the electrode 14.

[0056] As shown in Figure 10B, the conductor 46a is approximately rectangular when viewed from the negative side of the Z-axis towards the positive side. The portion of the conductor 46a closest to the electrode 23 extends in the negative direction of the X-axis, and this extension 46a3 is electrically connected to the electrode 23. In addition, the portion of the conductor 46a closest to the electrode 24 extends in the positive direction of the X-axis, and this extension 46a4 is electrically connected to the electrode 24.

[0057] As shown in Figure 10C, the conductor 47a is approximately rectangular when viewed from the positive side of the Z-axis towards the negative side. The portion of the conductor 47a closest to the electrode 13 extends in the negative direction of the X-axis, and this extension 47a3 is electrically connected to the electrode 13. In addition, the portion of the conductor 47a closest to the electrode 14 extends in the positive direction of the X-axis, and this extension 47a4 is electrically connected to the electrode 14.

[0058] As shown in Figure 10D, the conductor 48a is approximately rectangular when viewed from the positive side of the Z-axis towards the negative side. The portion of the conductor 48a closest to the electrode 24 extends in the positive direction of the X-axis, and this extension 48a3 is electrically connected to the electrode 24. In addition, the portion of the conductor 48a closest to the electrode 23 extends in the negative direction of the X-axis, and this extension 48a4 is electrically connected to the electrode 23.

[0059] According to the configuration shown in Figures 10A to 10D, capacitors are formed between electrode portions 11 and 12 and electrode portions 21 and 22 by the conductors 45a, 46a, 47a, and 48a in Figure 9. Therefore, an electrical element, a capacitor, is formed inside the chip body 100.

[0060] According to Figures 9 and 10A to 10D, the capacitor in this example is formed by four conductors 45a, 46a, 47a, and 48a, but a larger number of conductors may be stacked to form the capacitor. In Figures 9 and 10A to 10D, extensions 45a3, ..., and 48a4 are provided instead of via holes 31a, ..., and 32b, but each extension may be provided together with each via hole. [Explanation of Symbols]

[0061] 1, 1a, 1b, 101 Electronic Components 5 Signal Line Patterns 6 Ground Patterns 10, 10a 1st electrode 10T, 11, 11a, 12, 12a, 13, 13a, 14, 14a, 20T, 21, 21a, 22, 22a, 23, 23a, 24, 24a Electrode section 20, 20a 2nd electrode 31, 31a, 31b, 32, 32a, 32b, 33, 34 Beer Hall 41, 42, 43, 45, 46, 47, 48, 45a, 46a, 47a, 48a Conductors 45a3, 45a4, 46a3, 46a4, 47a3, 47a4, 48a3, 48a4 extension 50, 51, 60 rand 100 chip base 200, 201 Wiring board 451, 461, 462, 471, 472, 481 Main surface f1, f2, f11, f12, f21, f22 bonding material S1 top S2 bottom S3, S4 side T1 1st end surface T2 2nd end face W50, W51 width

Claims

1. An electronic component mounted on the surface of a wiring board, A substantially rectangular parallelepiped chip element having a bottom surface facing the surface of the wiring board, a top surface which is the surface opposite to the bottom surface, a first end surface which is the surface between the bottom surface and the top surface, a second end surface which is the surface opposite to the first end surface, and a side surface between the first end surface and the second end surface, An electrical element formed inside the chip body, A first electrode is provided on the bottom surface, the top surface, and the side surface so as to surround the first end surface, A second electrode is provided on the bottom surface, the top surface, and the side surface so as to surround the second end surface, Equipped with, No electrodes are provided on the first end face and the second end face. Electronic components.

2. The aforementioned electrical element is an inductor, The first terminal of the inductor is electrically connected to the first electrode. The second terminal of the inductor is electrically connected to the second electrode. The electronic component according to claim 1.

3. The aforementioned electrical element is a capacitor, The first terminal of the capacitor is electrically connected to the first electrode. The second terminal of the capacitor is electrically connected to the second electrode. The electronic component according to claim 1.

4. An electronic component mounting structure in which electronic components are mounted on the surface of a wiring board, The aforementioned electronic component is A substantially rectangular parallelepiped chip element having a bottom surface facing the surface of the wiring board, a top surface which is the surface opposite to the bottom surface, a first end surface which is the surface between the bottom surface and the top surface, a second end surface which is the surface opposite to the first end surface, and a side surface between the first end surface and the second end surface, An electrical element formed inside the chip body, A first electrode is provided on the bottom surface, the top surface, and the side surface so as to surround the first end surface, A second electrode is provided on the bottom surface, the top surface, and the side surface so as to surround the second end surface, Equipped with, No electrodes are provided on the first end face and the second end face. The first electrode and the second electrode are used for bonding to the wiring board. The aforementioned wiring board is A first land is provided on the main surface of the substrate and has a predetermined area when viewed in the direction perpendicular to the main surface of the substrate, A second land is provided on the main surface of the substrate and has a larger area than the area of ​​the first land, Equipped with, The first electrode is bonded to the first land, The second electrode is joined to the second land. The mounting structure of electronic components.

5. The aforementioned wiring board is provided with a signal line pattern extending in a predetermined direction, The first land is provided in the signal line pattern, The first land is approximately rectangular in shape, The length of one side of the first land is the same as the length in the direction perpendicular to the direction in which the signal line pattern extends. The mounting structure for electronic components according to claim 4.

6. The aforementioned electrical element is an inductor, The first terminal of the inductor is electrically connected to the first electrode. The second terminal of the inductor is electrically connected to the second electrode. The mounting structure for electronic components according to claim 4 or claim 5.

7. The aforementioned electrical element is a capacitor, The first terminal of the capacitor is electrically connected to the first electrode. The second terminal of the capacitor is electrically connected to the second electrode. The mounting structure for electronic components according to claim 4 or claim 5.

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