Temperature measuring sheet, heat treatment apparatus, method for measuring the temperature of a heat treatment plate, and heat treatment method.

Abstract

The present invention provides a temperature measuring sheet, a heat treatment apparatus, a method for measuring the temperature of a heat treatment plate, and a heat treatment method, all of which enable highly accurate measurement of the temperature of a desired portion of a treatment surface. [Solution] There is a heat treatment plate 110 having a processing surface 11. The heat treatment plate 110 performs heat treatment on a substrate W placed on the processing surface 11. A temperature measuring sheet 200 is used to measure the temperature of the heat treatment plate. The temperature measuring sheet 200 comprises a sheet member provided on the processing surface 11 and one or more temperature sensors provided on the sheet member.

Description

Technical Field

[0001] The present invention relates to a temperature measurement sheet for measuring the temperature of a heat treatment plate that performs heat treatment on a substrate, a heat treatment apparatus, a method for measuring the temperature of a heat treatment plate, and a heat treatment method.

Background Art

[0002] In order to perform various processes on substrates such as semiconductor substrates, FPD (Flat Panel Display) substrates such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates, a heat treatment apparatus is used.

[0003] Patent Document 1 describes an example of a heat treatment apparatus that performs heat treatment on a substrate. The heat treatment apparatus includes a heat treatment plate, a plurality of temperature sensors, a plurality of heaters, and a control unit. The heat treatment plate has a flat upper surface as a processing surface for processing the substrate. On the processing surface, a plurality of proximity balls that support the lower surface of the substrate are dispersedly arranged.

[0004] The plurality of temperature sensors and the plurality of heaters are provided inside the heat treatment plate. The plurality of temperature sensors respectively detect the temperatures of a plurality of parts of the heat treatment plate. The plurality of heaters respectively heat a plurality of parts of the heat treatment plate. The control unit controls the driving states of the plurality of heaters based on the plurality of temperatures detected by the plurality of temperature sensors. Thereby, the temperature of the processing surface of the heat treatment plate is maintained at a predetermined target temperature value.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] To perform heat treatment of a substrate with high precision, it is preferable to more accurately detect the temperature of multiple parts of the treatment surface of the heat treatment plate. However, the heat treatment apparatus described in Patent Document 1 has limitations in the detection accuracy that can be achieved for the temperature of each part of the treatment surface. Furthermore, in that heat treatment apparatus, the layout of multiple temperature sensors on the heat treatment plate may be limited by other components such as heaters and wiring.

[0007] The object of the present invention is to provide a temperature measuring sheet, a heat treatment apparatus, a method for measuring the temperature of a heat treatment plate, and a heat treatment method that enable high-precision measurement of the temperature of a desired portion of a treatment surface. [Means for solving the problem]

[0008] (a) The heat treatment plate has a treatment surface and performs heat treatment on a substrate placed on the treatment surface. In the heat treatment plate, multiple components such as heating elements and wiring are provided inside or below the exterior member including the treatment surface.

[0009] To perform high-quality heat treatment on a substrate, the temperature of the treatment surface of the heat treatment plate is measured using one or more temperature sensors. When one or more temperature sensors are to be embedded in the heat treatment plate, it is necessary to create a housing space for the temperature sensors (for example, a vertical hole opening downwards) in the outer casing by processing the outer casing.

[0010] To detect the temperature of the processing surface with high accuracy, it is preferable to place the housing space as close to the processing surface as possible. However, reducing the distance between the housing space and the processing surface is limited to some extent by processing errors in the exterior components, etc.

[0011] Furthermore, in the exterior components, the housing space must be formed in a location that does not interfere with multiple components such as the heating element and wiring. Therefore, the layout of one or more temperature sensors is often limited.

[0012] The inventors focused on these problems and devised the following temperature measuring sheet, heat treatment apparatus, temperature measuring method for heat treatment plate, and heat treatment method.

[0013] (b) A temperature measuring sheet according to one aspect of the present invention is a temperature measuring sheet for measuring the temperature of a heat treatment plate having a treatment surface and being disposed on the treatment surface for performing heat treatment on a substrate, comprising a sheet member provided on the treatment surface and one or more temperature sensors provided on the sheet member.

[0014] (c) A heat treatment apparatus according to another aspect of the present invention comprises a heat treatment plate having a treatment surface and performing heat treatment on a substrate placed on the treatment surface, a temperature measuring sheet provided on the treatment surface, and a temperature control unit that controls the temperature of the heat treatment plate based on the temperature measurement results from the one or more temperature sensors provided on the temperature measuring sheet.

[0015] (d) A heat treatment apparatus according to yet another aspect of the present invention comprises a heat treatment plate having a treatment surface and performing heat treatment on a substrate placed on the treatment surface, a plurality of support members provided on the treatment surface of the heat treatment plate and each supporting the lower surface of the substrate, and a temperature measuring sheet placed on the treatment surface. The temperature measuring sheet is placed on the treatment surface, and in the portion of the sheet member that overlaps with the plurality of support members when the temperature measuring sheet is placed on the treatment surface, a plurality of through holes corresponding to the plurality of support members are formed, respectively. The heat treatment apparatus further includes a temperature information storage unit that stores as reference temperature information information regarding the temperature change of the treatment surface from the time a sample substrate of the same type as the substrate is placed on the plurality of support members while the temperature of the treatment surface is adjusted to a predetermined treatment temperature, until a certain period of time has elapsed without the sample substrate contacting the temperature measuring sheet; and a contact determination unit that, when the substrate is placed on the plurality of support members while the temperature of the treatment surface is adjusted to the treatment temperature, acquires the temperature change of the treatment surface from the time the substrate is placed until the certain period of time has elapsed based on the temperature measurement results of the one or more temperature sensors provided on the temperature measuring sheet, and determines whether or not a portion of the substrate that is distorted downwards is in contact with the temperature measuring sheet based on the acquired temperature change of the treatment surface and the reference temperature information.

[0016] (e) A heat treatment apparatus according to yet another aspect of the present invention comprises a heat treatment plate having a treatment surface and performing heat treatment on a substrate placed on the treatment surface, and a temperature measuring sheet placed on the treatment surface. The temperature measuring sheet is placed on the treatment surface and has a lower surface that contacts the treatment surface when the temperature measuring sheet is placed on the treatment surface, and an upper surface facing in the opposite direction from the lower surface, and the upper surface has a plurality of protrusions that support the lower surface of the substrate. The heat treatment apparatus further includes a temperature information storage unit that stores as reference temperature information information regarding the temperature change of the treatment surface from the time a sample substrate of the same type as the substrate is placed on the plurality of protrusions on the temperature measuring sheet, when the temperature of the treatment surface is adjusted to a predetermined treatment temperature, until a certain period of time has elapsed without the sample substrate contacting the portion of the upper surface of the temperature measuring sheet on which the plurality of protrusions are not formed, while the temperature of the treatment surface is adjusted to the treatment temperature, until the substrate has been placed on the plurality of protrusions, based on the temperature measurement results from the one or more temperature sensors on the temperature measuring sheet, and a contact determination unit that determines whether or not a portion of the substrate that is distorted downwards is in contact with the portion of the upper surface of the temperature measuring sheet on which the plurality of protrusions are not formed, based on the acquired temperature change of the treatment surface and the reference temperature information.

[0017] (f) A method for measuring the temperature of a heat treatment plate according to yet another aspect of the present invention is a method for measuring the temperature of a heat treatment plate having a treatment surface and performing heat treatment on a substrate placed on the treatment surface, comprising the steps of: preparing a temperature measuring sheet including a sheet member and one or more temperature sensors provided on the sheet member; placing the temperature measuring sheet on the treatment surface of the heat treatment plate; and measuring the temperature of one or more portions of the treatment surface using the one or more temperature sensors.

[0018] (g) A heat treatment method according to yet another aspect of the present invention comprises a heat treatment plate having a treatment surface and being disposed on the treatment surface for heat treatment of the substrate, a temperature measuring sheet provided on the treatment surface, and a temperature control unit that controls the temperature of the heat treatment plate based on the temperature measurement results from the one or more temperature sensors provided on the temperature measuring sheet.

[0019] (h) A heat treatment method according to yet another aspect of the present invention is a heat treatment method for performing heat treatment on a substrate using a heat treatment apparatus, the heat treatment apparatus includes a heat treatment plate having a treatment surface and being placed on the treatment surface for performing heat treatment on the substrate, a plurality of support members provided on the treatment surface of the heat treatment plate and each supporting the lower surface of the substrate, and a temperature measuring sheet placed on the treatment surface, the temperature measuring sheet comprising a sheet member provided on the treatment surface and one or more temperature sensors provided on the sheet member, wherein a plurality of through holes corresponding to the plurality of support members are formed in the portion of the temperature measuring sheet that overlaps with the plurality of support members when the temperature measuring sheet is placed on the treatment surface, and the heat treatment method is performed from the time when a sample substrate of the same type as the substrate is placed on the plurality of support members until a certain period of time has elapsed without the sample substrate coming into contact with the temperature measuring sheet, with the temperature of the treatment surface adjusted to a predetermined treatment temperature. The process includes the steps of: storing information relating to the process as reference temperature information;, after the storage step, placing the substrate on the plurality of support members with the temperature of the processing surface adjusted to the processing temperature;, after the placement step, performing heat treatment on the substrate supported by the plurality of support members on the processing surface by adjusting the temperature of the processing surface to the processing temperature; measuring the temperature of the portion of the processing surface not provided with the plurality of support members using the one or more temperature sensors provided on the temperature measuring sheet; and, when the substrate is placed on the plurality of support members with the temperature of the processing surface adjusted to the processing temperature, acquiring the temperature change of the processing surface from the time the substrate is placed until a certain period of time has elapsed based on the temperature measurement results from the one or more temperature sensors, and determining whether a portion of the substrate that is distorted downwards is in contact with the temperature measuring sheet based on the acquired temperature change of the processing surface and the reference temperature information.

[0020] (i) A heat treatment method according to yet another aspect of the present invention is a heat treatment method for performing heat treatment on a substrate using a heat treatment apparatus, the heat treatment apparatus includes a heat treatment plate having a treatment surface and being placed on the treatment surface for performing heat treatment on the substrate, and a temperature measuring sheet placed on the treatment surface, the temperature measuring sheet having a lower surface that contacts the treatment surface when the temperature measuring sheet is placed on the treatment surface, and an upper surface facing in the opposite direction from the lower surface, and includes a sheet member provided on the treatment surface, and one or more temperature sensors provided on the sheet member, the upper surface having a plurality of protrusions that each support the lower surface of the substrate, and the heat treatment method is performed from the time when a sample substrate of the same type as the substrate is placed on the plurality of protrusions of the temperature measuring sheet, while the temperature of the treatment surface is adjusted to a predetermined treatment temperature, until a certain period of time has elapsed without the sample substrate contacting the portion of the upper surface of the temperature measuring sheet where the plurality of protrusions are not formed, the temperature of the treatment surface The process includes the steps of: storing information relating to temperature changes as reference temperature information;, after the storage step, placing the substrate on the plurality of protrusions when the temperature of the processing surface has been adjusted to the processing temperature;, after the placement step, performing heat treatment on the substrate supported by the plurality of protrusions on the processing surface by adjusting the temperature of the processing surface to the processing temperature; measuring the temperature of the processing surface using the one or more temperature sensors provided on the temperature measuring sheet; and, when the substrate is placed on the plurality of protrusions when the temperature of the processing surface has been adjusted to the processing temperature, acquiring the temperature change of the processing surface from the time the substrate was placed until a certain period of time has elapsed based on the temperature measurement results from the one or more temperature sensors, and determining whether a portion of the substrate that is distorted downwards is in contact with the portion of the upper surface of the temperature measuring sheet where the plurality of protrusions are not formed, based on the acquired temperature change of the processing surface and the reference temperature information. [Effects of the Invention]

[0021] According to the present invention, it becomes possible to measure the temperature of a desired portion of the processing surface with high accuracy.

Brief Description of the Drawings

[0022] [Figure 1] It is a diagram for explaining the basic configuration of a heat treatment apparatus according to the first embodiment. [Figure 2] It is a schematic plan view of the heat treatment plate of FIG. 1. [Figure 3] It is a diagram for explaining the configuration of the temperature measurement sheet of FIG. 1 according to the first embodiment. [Figure 4] It is a diagram for explaining the distance between the temperature sensor and the processing surface of the plate member. [Figure 5] It is a diagram for explaining the configuration of the temperature measurement sheet according to the second embodiment. [Figure 6] It is a schematic side view of a heat treatment plate showing a state where the temperature measurement sheet of FIG. 5 is provided on a plate member according to the second embodiment. [Figure 7] It is a diagram for explaining the configuration of the temperature measurement sheet according to the third embodiment. [Figure 8] It is a schematic side view of a heat treatment plate showing a state where the temperature measurement sheet of FIG. 7 is provided on a plate member according to the third embodiment. [Figure 9] It is a diagram for explaining the configuration of the temperature measurement sheet according to the fourth embodiment. [Figure 10] It is a schematic side view of a heat treatment plate showing a state where the temperature measurement sheet of FIG. 9 is provided on a plate member according to the fourth embodiment. [Figure 11] It is a diagram for explaining the basic configuration of a heat treatment apparatus according to the fifth embodiment. [Figure 12] It is a schematic plan view of the temperature measurement sheet of FIG. 11 according to the fifth embodiment. [Figure 13] It is a diagram showing an estimation example of temperature changes acquired by the first to sixth sensors when normal heat treatment is performed. [Figure 14]This figure shows an example of temperature change estimation obtained by the first to sixth sensors when a portion of the substrate is in contact with the temperature measurement sheet. [Figure 15] This is a flowchart showing an example of contact detection processing. [Figure 16] This is a schematic plan view of a temperature measuring sheet according to the sixth embodiment. [Figure 17] This is a schematic block diagram showing an example of a substrate processing apparatus equipped with a temperature measuring sheet according to one of the first to sixth embodiments. [Figure 18] This is a schematic cross-sectional view showing an example of the configuration of a temperature measuring sheet according to another embodiment. [Figure 19] This is a schematic cross-sectional view showing another example of the configuration of a temperature measuring sheet according to another embodiment. [Modes for carrying out the invention]

[0023] The following describes a temperature measuring sheet, a heat treatment apparatus, a method for measuring the temperature of a heat treatment plate, and a heat treatment method according to one embodiment of the present invention, with reference to the drawings. The temperature measuring sheet described below is used to measure the temperature of a heat treatment plate that performs heat treatment on a substrate. In the following description, "substrate" refers to a substrate for a Flat Panel Display (FPD) used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, a semiconductor substrate, a substrate for an optical disc, a substrate for a magnetic disc, a substrate for a magneto-optical disc, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. Furthermore, the substrate described below is a substrate whose outer edge has a circular shape in at least a part thereof, and specifically, a circular substrate in which a positioning notch or orientation flat is formed on a part of the outer edge.

[0024] 1. First Embodiment <1> Basic configuration of heat treatment equipment Figure 1 is a diagram illustrating the basic configuration of a heat treatment apparatus according to the first embodiment. As shown in Figure 1, the heat treatment apparatus 100 mainly comprises a heat treatment plate 110, a temperature measuring sheet 200, a lifting device 40, a suction device 80, and a control device 90.

[0025] The heat treatment plate 110 includes a plate member 10 and a heating device 20. The plate member 10 is a heat transfer plate having a predetermined thickness. The plate member 10 has a flat processing surface 11 facing upward and a mounting surface 12 facing downward. The processing surface 11 of the plate member 10 has an outer shape larger than the substrate W to be heat treated.

[0026] A temperature measuring sheet 200 is placed on the processing surface 11 of the heat treatment plate 110. When placed on the processing surface 11 of the heat treatment plate 110, the temperature measuring sheet 200 covers almost the entire processing surface 11. Details of the temperature measuring sheet 200 will be described later.

[0027] Figure 2 is a schematic plan view of the heat treatment plate 110 shown in Figure 1. As shown by the thick dashed line in Figure 2, a circular substrate treatment area PR is defined on the treatment surface 11 where the substrate W should be placed during heat treatment. Multiple support members 13 (21 in this example) and multiple guide members 19 (4 in this example) are provided on the treatment surface 11 so as to protrude upward. In Figure 1, some of the multiple support members 13 and some of the multiple guide members 19 are shown together with the plate member 10 in a schematic side view. In the subsequent plan views from Figure 2 onward, the multiple support members 13 are indicated by black dots.

[0028] Each support member 13 is a spherical proximity ball that supports the lower surface of the substrate W, and is made of, for example, ceramic. Multiple support members 13 are dispersed on the substrate processing area PR of the processing surface 11.

[0029] Each guide member 19 is made of a resin with high heat resistance, such as PEEK (polyether ether ketone). As shown in Figure 2, multiple guide members 19 are provided on the periphery of the processing surface 11, surrounding the substrate processing area PR. The upper half of each guide member 19 has a frustoconical shape, with the diameter gradually decreasing towards the upper end. As a result, the outer circumferential surface of the upper half of each guide member 19 guides the outer edge of the substrate W to the substrate processing area PR on the processing surface 11 when the substrate W is placed on the multiple support members 13 by multiple lifting pins 41, which will be described later.

[0030] The plate member 10 has multiple through holes 14 and 15 that penetrate vertically. The heating device 20 has multiple openings that open the internal spaces of the multiple through holes 14 and 15 downwards. The multiple (three in this example) through holes 14 are formed so that multiple (three in this example) lifting pins 41, which will be described later, can be inserted into each of them, and are arranged at equal angular intervals on a circle with respect to the center CA of the substrate processing area PR. On the other hand, the multiple (two in this example) through holes 15 are formed at positions spaced apart from each other within the substrate processing area PR. As shown in Figure 1, the portions of the plate member 10 where each through hole 15 is formed are connected to the suction device 80 through piping.

[0031] The suction device 80 includes an aspirator, a vacuum pump, or a control valve connected to the exhaust power equipment in the factory, and sucks the atmosphere from the internal space of the multiple through holes 15 through piping. When the temperature measuring sheet 200 is placed on the processing surface 11 of the heat treatment plate 110, the openings at the upper ends of the multiple through holes 15 are closed by the temperature measuring sheet 200. Therefore, the temperature measuring sheet 200 is held in place by suction on the processing surface 11 when the suction device 80 is in operation.

[0032] Figure 3 is a diagram illustrating the configuration of the temperature measuring sheet 200 of Figure 1 according to the first embodiment. In Figure 3, the upper section shows a schematic plan view of the temperature measuring sheet 200, and the lower section shows a schematic cross-sectional view of the temperature measuring sheet 200 along the JJ line in the upper section. As shown in the upper section of Figure 3, the temperature measuring sheet 200 has the same outer shape as the processing surface 11 of the heat treatment plate 110 in Figure 2, and basically has a structure in which multiple resin films are laminated. The temperature measuring sheet 200 also has a thickness greater than 0 and less than 100 μm.

[0033] The temperature measuring sheet 200 has multiple through holes h13, h14, and h19 that penetrate vertically. As described above, the temperature measuring sheet 200 is placed on the processing surface 11 of the heat treatment plate 110. The multiple (21 in this example) through holes h13 are formed in multiple parts of the temperature measuring sheet 200 that overlap with the multiple support members 13 when the temperature measuring sheet 200 is placed on the processing surface 11. Each through hole h13 is slightly larger than the support member 13 in a plan view.

[0034] On the other hand, multiple (three in this example) through holes h14 are formed in multiple parts of the temperature measuring sheet 200 that overlap each of the multiple through holes 14 when the temperature measuring sheet 200 is placed on the processing surface 11. Each through hole h14 is the same size as or slightly larger than the through hole 14 in a plan view.

[0035] On the other hand, the multiple (four in this example) through holes h19 are formed in multiple parts of the temperature measuring sheet 200 that overlap with the multiple guide members 19 when the temperature measuring sheet 200 is placed on the processing surface 11. Each through hole h19 is slightly larger than the guide member 19 in a plan view.

[0036] Due to the multiple through holes h13 and h19 described above, when the temperature measuring sheet 200 is placed on the processing surface 11, each of the multiple support members 13 and the multiple guide members 19 is inserted into the corresponding through holes h13 and h19. Therefore, the lower surface of the temperature measuring sheet 200 contacts the processing surface 11 without interfering with the multiple support members 13 and the multiple guide members 19.

[0037] The temperature measuring sheet 200 has a structure in which multiple resin films are laminated in the thickness direction. Furthermore, the temperature measuring sheet 200 has a structure in which multiple (six in this example) temperature sensors TS0 and multiple wirings WL are sandwiched between any two adjacent resin films in the thickness direction. In the temperature measuring sheet 200, the multiple temperature sensors TS0 are distributed in a plane perpendicular to the thickness direction of the temperature measuring sheet 200. In other words, the multiple temperature sensors TS0 are distributed in a plan view.

[0038] Multiple temperature sensors TS0 are temperature detection elements having characteristic values ​​that change according to the temperature of the processing surface 11 of the plate member 10. The temperature detection elements may be thermocouples, resistance thermometers, or other elements. If the temperature detection element is a thermocouple, the characteristic value is the potential difference (thermoelectromotive force), and if the temperature detection element is a resistance thermometer, the characteristic value is the electrical resistance. Each temperature sensor TS0 outputs a detection value based on the characteristic value corresponding to the temperature of the processing surface 11.

[0039] As shown in the lower part of Figure 3, the temperature measuring sheet 200 in this example includes a lower protective layer 211, a lower fusion layer 212, an upper fusion layer 213, and an upper protective layer 214, which are layers of resin film. The lower protective layer 211, the lower fusion layer 212, the upper fusion layer 213, and the upper protective layer 214 are laminated in this order, from bottom to top.

[0040] The lower protective layer 211 and the upper protective layer 214 are made of a resin film having high rigidity and high heat resistance. As such a resin film, for example, UPE Corporation's polyimide film, UPILEX®-S, can be used.

[0041] On the other hand, the lower fusion layer 212 and the upper fusion layer 213 are made of a resin film with adhesive properties on both sides. As such a resin film, for example, UPE Corporation's polyimide film, UPILEX®-VT, can be used. UPILEX-VT is easily heat-sealed on both sides of the film.

[0042] Each temperature sensor TS0 and the wiring WL extending from it are sandwiched (embedded) between the lower fusion layer 212 and the upper fusion layer 213. Multiple wirings WL extending from multiple temperature sensors TS0 are brought out to the outside of the temperature measuring sheet 200 through the space between the lower fusion layer 212 and the upper fusion layer 213 and connected to the control device 90 shown in Figure 1.

[0043] The above-mentioned temperature measuring sheet 200 can be manufactured, for example, as follows: First, a first resin film constituting the lower protective layer 211, a second resin film constituting the lower fusion layer 212, a third resin film constituting the upper fusion layer 213, and a fourth resin film constituting the upper protective layer 214 are prepared.

[0044] Next, the second resin film is bonded to one surface of the first resin film by heat fusion. Furthermore, the third resin film is bonded to one surface of the fourth resin film by heat fusion.

[0045] Subsequently, multiple temperature sensors TS0 are placed on predetermined portions of the exposed surface of the second resin film (or third resin film). Furthermore, the wiring WL extending from each temperature sensor TS0 is arranged on the exposed surface of the second resin film (or third resin film) along a predetermined pattern.

[0046] Next, the second resin film and the third resin film are bonded together by heat fusion, sandwiching multiple temperature sensors TS0 and multiple wirings WL. Then, the laminate of the first to fourth resin films is cut to match the shape of the processing surface 11 of the heat treatment plate 110. In addition, multiple through holes h13, h14, h19 are formed in the circular laminate obtained by cutting, for example, by punching. This completes the temperature measuring sheet 200.

[0047] Furthermore, the process of providing multiple temperature sensors TS0 and multiple wirings WL on the second resin film (or third resin film) can be carried out using, for example, a printed circuit board manufacturing method. Specifically, the temperature sensors TS0 and multiple wirings WL may be formed by forming a conductive layer of a predetermined pattern on the resin film using an additive method or a subtractive method.

[0048] As shown in Figure 1, a heating device 20 is provided on the mounting surface 12 of the plate member 10. The heating device 20 includes multiple heating elements, each corresponding to a portion of the substrate processing area PR of the processing surface 11. Each heating element is composed of, for example, a mica heater or a Peltier element. A heating drive circuit 21 is connected to each heating element. The heating drive circuit 21 drives the heating device 20 based on the control of a temperature control unit 91, which will be described later. As a result, each of the multiple heating elements of the heating device 20 generates heat when the substrate W is heated.

[0049] In this embodiment, the multiple positions on the temperature measuring sheet 200 where the multiple temperature sensors TS0 (Figure 2) are arranged when viewed from above correspond to (overlap with) the multiple positions on the heating device 20 where the multiple heating elements are provided when viewed from above. Furthermore, each of the multiple temperature sensors TS0 is used to control the driving state of the corresponding heating element.

[0050] As shown in Figure 1, the lifting device 40 includes a plurality of (three in this example) lifting pins 41 and a connecting member 42. The lifting device 40 further includes a motor and a motor drive circuit, etc., which are not shown. Each of the plurality of lifting pins 41 is a rod-shaped member, formed of, for example, ceramic. The plurality of lifting pins 41 are connected to each other by the connecting member 42. The plurality of lifting pins 41 are held so as to extend in the vertical direction with a portion of each lifting pin 41 inserted into a plurality of through holes 14 in the plate member 10 and a plurality of openings in the heating device 20, respectively.

[0051] In the lifting device 40, a motor (not shown) operates based on the control of a lifting control unit 92 (described later), causing the connecting member 42 to move vertically. As a result, the multiple lifting pins 41 move between an upper position where the upper ends of the multiple lifting pins 41 are above the upper ends of the multiple guide members 19, and a lower position where the upper ends of the multiple lifting pins 41 are below the processing surface 11 of the plate member 10.

[0052] With this configuration, the lifting device 40 receives the substrate W handed over from a robot outside the heat treatment apparatus 100 and places it on the multiple support members 13. The lifting device 40 also raises the substrate W supported on the multiple support members 13 and hands it over to the robot outside the heat treatment apparatus 100. The control device 90 controls the operation of the heat generation drive circuit 21 and the lifting device 40, etc. Details of the control device 90 will be described later.

[0053] <2> Distance between the temperature sensor TS0 and the processing surface 11 of the plate member 10 Figure 4 is a diagram illustrating the distance between the temperature sensor TS0 and the processing surface 11 of the plate member 10. In Figure 4, the upper section shows a schematic side view of the heat treatment plate 110 of Figure 1 on which the substrate W is placed. The lower section shows a schematic cross-sectional view of a part of the schematic side view in the upper section within a dashed-dotted callout. Note that in the schematic cross-sectional view of Figure 4, the individual resin films constituting the temperature measuring sheet 200 are not shown.

[0054] As shown in the schematic cross-sectional view in the lower part of Figure 4, the lower surface of the substrate W placed on the heat treatment plate 110 during heat treatment is supported by a plurality of support members 13. Here, with respect to the treatment surface 11 of the plate member 10, the support members 13 have a height of, for example, 100 μm. On the other hand, as described above, the temperature measuring sheet 200 according to this embodiment has a thickness greater than 0 and less than 100 μm. The temperature measuring sheet 200 is held by adsorption so that its lower surface is in contact with the treatment surface 11. As a result, the distance d1 between the temperature sensor TS0 built into the temperature measuring sheet 200 and the treatment surface 11 becomes less than 100 μm. Furthermore, with the substrate W placed on the heat treatment plate 110, a gap GA is formed between the lower surface of the substrate W and the upper surface of the temperature measuring sheet 200.

[0055] In particular, when the lower protective layer 211, lower fusion layer 212, upper fusion layer 213, and upper protective layer 214 in Figure 3 are each made of a resin film with a thickness of 12.5 μm, the thickness of the temperature measuring sheet 200 will be approximately 50 μm. In this case, the distance d1 between the temperature sensor TS0 and the processing surface 11 will be approximately 25 μm. Also, a gap GA of approximately 50 μm will be formed between the lower surface of the substrate W and the upper surface of the temperature measuring sheet 200.

[0056] Incidentally, conventionally, in order to measure the temperature of the processing surface 11, a configuration has been adopted in which a vertical hole vh opening downwards is formed in the plate member 10, and multiple temperature sensors TS0 are installed in the vertical hole vh (see the dotted line portion in the lower part of Figure 4).

[0057] However, when forming a vertical hole vh by machining, it is difficult to reduce the distance between the bottom of the vertical hole vh and the processed surface 11 to less than 2.0 mm due to machining errors and other factors. Furthermore, it is not easy to accurately position and attach each temperature sensor TS0 to the bottom of the vertical hole vh. Therefore, when multiple temperature sensors TS0 are provided inside the plate member 10, the distance d2 between the processed surface 11 and the temperature sensors TS0 could not be reduced to less than 2 mm.

[0058] In contrast, the temperature measuring sheet 200 according to this embodiment allows multiple temperature sensors TS0 to be placed closer to the processing surface 11 compared to the conventional configuration in which the temperature sensor TS0 is built into the plate member 10. Therefore, it is possible to measure the temperature of the processing surface 11 with high accuracy using multiple temperature sensors TS0.

[0059] <3> Control system of the heat treatment apparatus 100 shown in Figure 1 The control device 90 in Figure 1 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read-Only Memory), and a storage device. The RAM is used as the CPU's workspace. The ROM stores the system program. The storage device stores the heating treatment program for heating the substrate W.

[0060] Here, the heat treatment program may be provided on a recording medium such as a CD-ROM 909 and installed in the ROM or storage device of the control device 90. Alternatively, the heat treatment program may be distributed from an external server to the heat treatment apparatus 100 via a communication network and installed in the ROM or storage device.

[0061] As shown in Figure 1, the control device 90 includes a temperature control unit 91, a lifting / lowering control unit 92, and a temperature acquisition unit 93 as functional units for controlling the operation of each part of the heat treatment apparatus 100 and for performing predetermined processing. Multiple functional units of the control device 90 are realized by the CPU executing a heat treatment program stored in a memory device on RAM. Some or all of the multiple functional units of the control device 90 may be realized by hardware such as electronic circuits.

[0062] The lifting control unit 92 controls the lifting device 40 so that the multiple lifting pins 41 move from an upper position to a lower position when placing a substrate W, which is brought in from outside the heat treatment apparatus 100, onto the processing surface 11 of the plate member 10. The lifting control unit 92 also controls the lifting device 40 so that the multiple lifting pins 41 move from a lower position to an upper position when transferring the substrate W, which is placed on the processing surface 11, to a robot outside the heat treatment apparatus 100.

[0063] The temperature acquisition unit 93 acquires the temperature of the portion (multiple portions of the processing surface 11) where each temperature sensor TS0 is installed, based on the detected values ​​output from the multiple temperature sensors TS0. The temperature acquisition unit 93 also provides the temperature control unit 91 with the acquired multiple temperatures, i.e., the measurement results of the temperatures of the multiple portions of the processing surface 11.

[0064] The temperature control unit 91 provides feedback control to the heat generation drive circuit 21 based on the temperature provided by the temperature acquisition unit 93, so that each part of the processing surface 11 is maintained at a predetermined processing temperature. Specifically, in this embodiment, the temperature control unit 91 controls the heat generation drive circuit 21 based on the temperature (temperature measurement result) acquired by each temperature sensor TS0. In this case, for example, the temperature of one heat generation element corresponding to one temperature sensor TS0 is appropriately adjusted within a predetermined temperature range that includes the processing temperature. As a result, the temperature of the part of the processing surface 11 located near one temperature sensor TS0 is accurately and quickly adjusted to the processing temperature.

[0065] <4> Effects of the first embodiment (a) The temperature measuring sheet 200 is provided on the processing surface 11 of the heat treatment plate 110. In the temperature measuring sheet 200, multiple temperature sensors TS0 are provided between two adjacent layers of the multiple laminated resin film layers (211, 212, 213, 214). In this case, by reducing the thickness of the temperature measuring sheet 200, each temperature sensor TS0 can be positioned closer to the processing surface 11 compared to when each temperature sensor TS0 is built into the heat treatment plate 110.

[0066] Furthermore, since the temperature measurement sheet 200 is placed on the processing surface 11 of the heat treatment plate 110, it does not interfere with multiple components within the heat treatment plate 110 (for example, multiple heating elements and the wiring connected to them). Therefore, there is greater flexibility in the layout of each temperature sensor TS0 compared to when each temperature sensor TS0 is built into the heat treatment plate 110. In addition, since it is not necessary to install each temperature sensor TS0 inside the heat treatment plate 110, the decrease in measurement accuracy caused by mounting errors of the temperature sensors TS0 is suppressed.

[0067] As a result, it is possible to measure the temperature of a desired portion of the processing surface 11 with high accuracy.

[0068] (b) The temperature measuring sheet 200 described above is mainly formed of multiple laminated resin film layers (211, 212, 213, 214). Multiple temperature sensors TS0 and multiple wirings WL connected to them are sandwiched between the lower fusion layer 212 and the upper fusion layer 213.

[0069] This configuration facilitates the fabrication of the temperature measuring sheet 200. Furthermore, multiple temperature sensors TS0 are embedded within multiple layers of resin film (211, 212, 213, 214). This protects each temperature sensor TS0 from the multiple resin films, thereby improving the reliability of the temperature measuring sheet 200.

[0070] (c) As described above, the temperature measuring sheet 200 has multiple through holes h13, h19. This prevents interference between the temperature measuring sheet 200 and the multiple support members 13 and the multiple guide members 19 when the temperature measuring sheet 200 is placed on the processing surface 11. Also, the lower surface of the temperature measuring sheet 200 is in contact with the processing surface 11. Therefore, multiple temperature sensors TS0 can be brought close to the processing surface 11 with a simple configuration.

[0071] (d) In the heat treatment apparatus 100 described above, the heat generation drive circuit 21 is feedback controlled based on the temperature measurement results of the processing surface 11 by multiple temperature sensors TS0 on the temperature measuring sheet 200. As a result, the temperature of each part of the processing surface 11 is adjusted to the processing temperature. This makes it possible to apply high-quality heat treatment to the substrate W.

[0072] 2. Second Embodiment The differences between the heat treatment apparatus 100 according to the second embodiment and the heat treatment apparatus 100 according to the first embodiment will be explained. In the heat treatment plate 110 according to the second embodiment, a plurality of support members 13 are not provided on the treatment surface 11 of the plate member 10. Therefore, the temperature measuring sheet 200 according to the second embodiment has a configuration that functions as a plurality of support members 13 as shown in Figure 1.

[0073] Figure 5 is a diagram illustrating the configuration of the temperature measuring sheet 200 according to the second embodiment. In Figure 5, the upper section shows a schematic plan view of the temperature measuring sheet 200, and the lower section shows a schematic cross-sectional view of the temperature measuring sheet 200 along the KK line in the upper section.

[0074] As shown in Figure 5, in this example, the temperature measuring sheet 200 has protrusions p13 formed in place of the multiple through holes h13 in the temperature measuring sheet 200 according to the first embodiment (Figure 3). In Figure 5, the multiple protrusions p13 are highlighted with thick solid lines. The protrusions p13 protrude upward from the upper surface of the temperature measuring sheet 200 to a predetermined height (for example, several tens of μm). The protrusions p13 are formed, for example, by selectively wet etching a portion of the upper fusion layer 213 and the upper protective layer 214 that constitute the temperature measuring sheet 200. The thickness of the portion of the temperature measuring sheet 200 in which each protrusion p13 is formed is equal to or approximately equal to the height of the support member 13 with respect to the processing surface 11 (see Figure 4).

[0075] Figure 6 is a schematic side view of a heat treatment plate 110 showing the state in which the temperature measuring sheet 200 of Figure 5 is provided on the plate member 10 according to the second embodiment. In Figure 6, the substrate W placed on the heat treatment plate 110 is indicated by a dashed line.

[0076] As shown in Figure 6, the lower surface of the substrate W placed on the processing surface 11 is supported by a plurality of protrusions p13 of the temperature measuring sheet 200 according to the second embodiment. This reduces the number of parts and simplifies the structure of the heat treatment plate 110.

[0077] 3. Third Embodiment The differences between the heat treatment apparatus 100 according to the third embodiment and the heat treatment apparatus 100 according to the first embodiment will now be explained. The heat treatment plate 110 according to the third embodiment has an adsorption and holding function that adsorbs and holds the substrate W placed on the heat treatment plate 110. Therefore, the temperature measuring sheet 200 according to the third embodiment has a configuration that corresponds to the adsorption and holding function of the heat treatment plate 110.

[0078] In the heat treatment plate 110 according to this embodiment, in addition to the multiple through holes 14 and 15 shown in Figure 1, a plurality of through holes 16 (Figure 8), described later, are formed in the plate member 10. The plurality of through holes 16 penetrate the plate member 10 in the vertical direction. Furthermore, the plurality of through holes 16 are used to draw air from the gap GA (Figure 4) between the substrate W supported on the plurality of support members 13 and the upper surface of the temperature measuring sheet 200. For this reason, the portion of the plate member 10 where each through hole 16 is formed is connected to the suction device 80 (Figure 1) through piping, similar to the portion where the plurality of through holes 15 are formed.

[0079] Figure 7 is a diagram illustrating the configuration of the temperature measuring sheet 200 according to the third embodiment. In Figure 7, the upper section shows a schematic plan view of the temperature measuring sheet 200, and the lower section shows a schematic cross-sectional view of the temperature measuring sheet 200 along the LL line in the upper section. Note that in the schematic cross-sectional view of Figure 7, the individual resin films constituting the temperature measuring sheet 200 are not shown.

[0080] As shown in Figure 7, the temperature measuring sheet 200 in this example has a configuration that adds a plurality of through holes h16 to the configuration of the temperature measuring sheet 200 according to the first embodiment (Figure 3). Furthermore, the temperature measuring sheet 200 in this example has a flat portion 230 and an annular projection 240 on its upper surface. In Figure 7, the plurality of through holes h16 and the annular projection 240 are highlighted with thick solid lines.

[0081] On the upper surface of the temperature measuring sheet 200, the flat portion 230 includes the central part of the temperature measuring sheet 200 and has a flat circular shape with respect to the center of the temperature measuring sheet 200. The outer diameter of the flat portion 230 is smaller than the inner diameter of the substrate processing area PR in Figure 2.

[0082] The annular projection 240 has a ring shape that surrounds the flat portion 230 and protrudes upward from the flat portion 230 to a predetermined height (for example, several tens of micrometers). The thickness of the portion of the temperature measuring sheet 200 in which the annular projection 240 is formed is equal to or approximately equal to the height of the support member 13 with respect to the processing surface 11 (see Figure 4).

[0083] Multiple (four in this example) through-holes h16 are formed to be dispersed across the flat portion 230. The multiple through-holes h16 are formed in multiple parts of the temperature measuring sheet 200 that overlap with the multiple through-holes 16 (Figure 8), which will be described later, when the temperature measuring sheet 200 is placed on the processing surface 11. Each through-hole h16 is the same size as or slightly larger than the through-holes 16 in a plan view.

[0084] The multiple through holes h16 are formed, like the other through holes h13, h14, and h19, for example by punching. On the other hand, the flat portion 230 and the annular projection 240 are formed by selectively wet etching a portion of the upper fusion layer 213 (Figure 3) and the upper protective layer 214 (Figure 3) that constitute the temperature measuring sheet 200.

[0085] Figure 8 is a schematic side view of a heat treatment plate 110 showing the state in which the temperature measuring sheet 200 of Figure 7 is provided on the plate member 10 according to the third embodiment. In Figure 8, the substrate W placed on the heat treatment plate 110 is indicated by a dashed line.

[0086] As shown in Figure 8, the plate member 10 according to the third embodiment has multiple through holes 14, 15, as well as multiple through holes 16. With the temperature measuring sheet 200 placed on the processing surface 11, the upper openings of the through holes 16 are open to the space above the temperature measuring sheet 200 through the multiple through holes h16 of the temperature measuring sheet 200.

[0087] When the substrate W is placed on the heat treatment plate 110, multiple portions of the lower surface of the substrate W are supported by multiple support members 13. In addition, the peripheral portion of the lower surface of the substrate W is supported by annular projections 240. As a result, a substantially sealed space is formed in the gap GA between the substrate W and the flat portion 230 of the temperature measuring sheet 200.

[0088] In this state, the suction device 80 sucks the atmosphere from the internal space of the multiple through holes 16. As a result, the atmosphere between the substrate W and the flat portion 230 of the temperature measuring sheet 200 flows to the suction device 80 through the multiple through holes h16 of the temperature measuring sheet 200 and the multiple through holes 16 of the plate member 10. Consequently, the pressure in the gap GA decreases, and the substrate W is adsorbed and held on the heat treatment plate 110.

[0089] In the temperature measuring sheet 200 according to this embodiment, a plurality of annular protrusions may be formed on the flat portion 230, each locally surrounding a plurality of through holes h13 and h14. In this case, when the substrate W is placed on the heat treatment plate 110, the lower surface of the substrate W comes into contact with the annular protrusions 240 and the plurality of annular protrusions, thereby improving the degree of sealing of the space formed in the gap GA. Therefore, the substrate W can be firmly held by suction.

[0090] 4. Fourth Embodiment The differences between the heat treatment apparatus 100 according to the fourth embodiment and the heat treatment apparatus 100 according to the first embodiment will now be explained. The heat treatment plate 110 according to the fourth embodiment does not have a plurality of support members 13 on the treatment surface 11 of the plate member 10, similar to the example of the heat treatment plate 110 according to the second embodiment. Furthermore, the heat treatment plate 110 according to the fourth embodiment has an adsorption and holding function that adsorbs and holds the substrate W placed on the heat treatment plate 110, similar to the example of the heat treatment plate 110 according to the third embodiment.

[0091] Therefore, the temperature measuring sheet 200 according to the fourth embodiment has a configuration that functions as a plurality of support members 13 in Figure 1, and also has a configuration that corresponds to the adsorption and holding function of the heat treatment plate 110. Specifically, the temperature measuring sheet 200 according to this embodiment has a plurality of protrusions p13 in Figure 5 according to the second embodiment, and a plurality of through holes h16, flat portions 230 and annular protrusions 240 in Figure 7 according to the third embodiment.

[0092] Figure 9 is a diagram illustrating the configuration of the temperature measuring sheet 200 according to the fourth embodiment. In Figure 9, the upper section shows a schematic plan view of the temperature measuring sheet 200, and the lower section shows a schematic cross-sectional view of the temperature measuring sheet 200 along the MM line in the upper section. In Figure 9, multiple protrusions p13, multiple through holes h16, and annular projections 240 are highlighted with thick solid lines. In the schematic cross-sectional view in the lower section of Figure 9, only some of the protrusions p13 are shown to make the shape of the upper surface of the temperature measuring sheet 200 easier to understand. Also, in the schematic cross-sectional view of Figure 9, the individual illustrations of the multiple resin films constituting the temperature measuring sheet 200 are omitted.

[0093] Figure 10 is a schematic side view of a heat treatment plate 110 showing the state in which the temperature measuring sheet 200 shown in Figure 9 is provided on the plate member 10 according to the fourth embodiment. In Figure 10, the substrate W placed on the heat treatment plate 110 is indicated by a dashed line.

[0094] As shown in Figure 10, the lower surface of the substrate W placed on the processing surface 11 is supported by a plurality of protrusions p13 of the temperature measuring sheet 200 according to the fourth embodiment. In addition, the peripheral portion of the lower surface of the substrate W is supported by an annular projection 240. As a result, a substantially sealed space is formed in the gap GA between the substrate W and the flat portion 230 of the temperature measuring sheet 200. In this state, the suction device 80 sucks the atmosphere from the internal space of the plurality of through holes 16. As a result, the pressure in the gap GA is reduced, and the substrate W is adsorbed and held on the heat treatment plate 110.

[0095] In the temperature measuring sheet 200 according to this embodiment, a plurality of annular protrusions may be formed on the flat portion 230, each locally surrounding a plurality of through holes h14. In this case, when the substrate W is placed on the heat treatment plate 110, the lower surface of the substrate W comes into contact with the annular protrusions 240 and the plurality of annular protrusions, thereby improving the degree of sealing of the space formed in the gap GA. Therefore, the substrate W can be firmly held by suction.

[0096] 5. Fifth Embodiment <1> Basic configuration of the heat treatment apparatus 100 The differences between the heat treatment apparatus 100 according to the fifth embodiment and the heat treatment apparatus 100 according to the first embodiment will be explained. Figure 11 is a diagram illustrating the basic configuration of the heat treatment apparatus 100 according to the fifth embodiment. As shown in Figure 11, the heat treatment apparatus 100 according to this embodiment includes an operation unit 98 and a display device 99 in addition to the configuration of the heat treatment apparatus 100 according to the first embodiment. In Figure 11, the illustration of the multiple through holes 15 formed in the plate member 10 of the heat treatment plate 110 is omitted. Also in Figure 11, the substrate W supported by multiple support members 13 on the plate member 10 is shown by a dashed line.

[0097] The operating unit 98 includes, for example, a keyboard and a pointing device, and is configured to be operable by the user. The presentation device 99 includes a display and an audio output device (not shown).

[0098] Figure 12 is a schematic plan view of the temperature measuring sheet 200 of Figure 11 according to the fifth embodiment. Inside the temperature measuring sheet 200 according to this embodiment, a plurality of temperature sensors TS1 (six in this example) are provided so as to be arranged at equal intervals on a virtual circle vc with respect to the center CB of the temperature measuring sheet 200. Each temperature sensor TS1 is appropriately spaced apart from a plurality of through holes h13. In addition, one temperature sensor TS2 is provided near the center CB of the temperature measuring sheet 200.

[0099] The temperature measuring sheet 200 according to this embodiment has a structure in which multiple resin films (see the lower part of Figure 3) are laminated, similar to the temperature measuring sheet 200 according to the first embodiment. Each of the multiple temperature sensors TS1 and TS2 is sandwiched between two of the multiple resin films, similar to the temperature sensor TS0 according to the first embodiment.

[0100] Here, depending on the type and thickness of the substrate W to be processed, a portion of the substrate W may be significantly distorted. When a substrate W with significant distortion is placed on the heat treatment plate 110 of the heat treatment apparatus 100, a portion of the substrate W that is distorted downwards may come into contact with the temperature measuring sheet 200. When the substrate W before heat treatment comes into contact with the treatment surface 11, which has been adjusted to the treatment temperature, via the temperature measuring sheet 200, the temperature of the contacted portion of the treatment surface 11 changes locally. As a result, if there is a large variation in the degree of heat treatment of multiple parts of the substrate W, a heat treatment defect of the substrate W will occur.

[0101] Therefore, in the temperature measuring sheet 200 according to the fifth embodiment, the multiple temperature sensors TS1 are used to determine whether or not the substrate W is in contact with the temperature measuring sheet 200. On the other hand, the temperature sensor TS2 is used to control the driving state of the multiple heating elements of the heating device 20.

[0102] <2> Determination of whether the substrate W is in contact with the temperature measurement sheet 200. (1) Temperature changes obtained by multiple temperature sensors TS1 To distinguish between the multiple temperature sensors TS1 in Figure 12, the temperature sensor TS1 located at the very top of Figure 12 will be referred to as the first sensor. Furthermore, the multiple temperature sensors TS1 arranged clockwise from the first sensor on the virtual circle vc in Figure 12 will be referred to as the second sensor, third sensor, fourth sensor, fifth sensor, and sixth sensor, respectively.

[0103] Figure 13 shows an example of estimated temperature changes obtained by the first to sixth sensors when a normal heat treatment is performed. In Figure 13, six graphs are shown from the top to the bottom showing an example of estimated temperature changes obtained by the first to sixth sensors when a normal heat treatment is performed. In each graph, the vertical axis represents the temperature of the part of the processing surface 11 where the sensor corresponding to that graph is located, and the horizontal axis represents time.

[0104] Assume that the substrate W is placed on multiple support members 13 at time t1 while the temperature of the processing surface 11 is maintained at processing temperature α. When normal heat treatment is performed, the temperature changes acquired by the first to sixth sensors are expected to be roughly consistent, as shown in the six graphs in Figure 13. In the example in Figure 13, the temperature of each part of the processing surface 11 decreases sharply from processing temperature α to temperature β from time t1 to time t2, and then gradually increases from temperature β to processing temperature α from time t2 to time t3.

[0105] Figure 14 shows an example of temperature change estimation obtained by the first to sixth sensors when a portion of the substrate W is in contact with the temperature measurement sheet 200. In Figure 14, six graphs are shown from the top to the bottom showing an example of temperature change estimation obtained by the first to sixth sensors when a portion of the substrate W is in contact with the temperature measurement sheet 200. Similar to the example in Figure 13, in each graph, the vertical axis represents the temperature of the portion of the processing surface 11 where the sensor corresponding to that graph is located, and the horizontal axis represents time.

[0106] The substrate W is placed on the multiple support members 13 at time t1 while the temperature of the processing surface 11 is maintained at the processing temperature α. Furthermore, when the substrate W is placed, a portion of the substrate W is in contact with the temperature measuring sheet 200 at a position that overlaps with the third sensor.

[0107] In this case, a large variation occurs among the multiple temperature changes corresponding to each of the first to sixth sensors. Specifically, from time t1 to time t2, the temperature measured by the third sensor decreases significantly more than the temperatures obtained by the other sensors. Also, the temperatures measured by the second and fourth sensors adjacent to the third sensor decrease somewhat more than the temperatures measured by the other sensors. On the other hand, the temperatures measured by the first, fifth, and sixth sensors, which are located relatively far from the third sensor, decrease to the same level as when normal heat treatment is performed.

[0108] Considering the temperature changes of each part of the processing surface 11 estimated as described above, whether or not the substrate W is in contact with the temperature measuring sheet 200 is determined, for example, by the first determination method and the second determination method shown below.

[0109] (2) First determination method As described above, when a normal heating process is performed, the temperature change of the processed surface 11 acquired by multiple temperature sensors TS1 from the time the substrate W is placed on the substrate until a certain time has elapsed (for example, 10 seconds or 20 seconds) will be almost the same.

[0110] Therefore, before the actual substrate W is heat-treated, a sample substrate of the same type as the substrate W is prepared. It is preferable to select a substrate that exhibits almost no distortion as this sample substrate.

[0111] Next, the prepared sample substrate is placed on a plurality of support members 13 and subjected to heat treatment. At this time, one of the plurality of temperature sensors TS1 is used to acquire the temperature change of the treatment surface 11 until a certain period of time has elapsed without the sample substrate coming into contact with the temperature measurement sheet 200. Then, based on the acquired temperature change, a first threshold value corresponding to the amount of temperature change of the treatment surface 11 from the time the sample substrate is placed until a certain period of time has elapsed is determined.

[0112] The first threshold is set to a temperature change that is slightly larger than, for example, the temperature change of the sample substrate. Then, during the actual heating process of the substrate W, it is determined whether the actual temperature change measured by each temperature sensor TS1 during the period from the time the substrate W is placed until a certain amount of time has elapsed is greater than the first threshold. If the actual temperature change is greater than the first threshold, it is determined that a portion of the substrate W that is distorted downwards is in contact with the temperature measuring sheet 200.

[0113] According to the first determination method described above, it becomes possible to determine whether or not the substrate W is in contact with the temperature measuring sheet 200 without requiring complicated processing. In addition, if multiple substrates W are continuously heated in the heat treatment apparatus 100, other substrates W that have been heated before the heating of one substrate W may be considered as sample substrates. In this case, the first threshold value to be used when heating one substrate W is determined based on the temperature change obtained when the other substrates W considered as sample substrates are heated.

[0114] (3) Second determination method As described above, when a normal heating process is performed, the temperature changes of the processing surface 11 acquired by multiple temperature sensors TS1 from the time the substrate W is placed until a certain time (for example, 10 seconds or 20 seconds) has elapsed will be almost the same. In contrast, when a part of the substrate W is in contact with the processing surface 11, as shown in the example in Figure 14, a large variation occurs among the multiple temperature changes acquired by the multiple temperature sensors TS1.

[0115] Therefore, in the second determination method, a second threshold is determined to determine whether the variation in multiple temperatures measured by multiple temperature sensors TS1 from the time the substrate W is placed until a certain time has elapsed is within the range corresponding to normal heat treatment. The second threshold is determined, for example, based on experiments using a sample substrate, to be the maximum value that can guarantee normal heat treatment. Then, during the actual heat treatment of the substrate W, it is determined whether the magnitude of the variation in multiple temperatures measured by multiple temperature sensors TS1 from the time the substrate W is placed until a certain time has elapsed is greater than the second threshold. If the magnitude of the variation in multiple temperatures measured by multiple temperature sensors TS1 is greater than the second threshold, it is determined that a portion of the substrate W that is distorted downwards is in contact with the temperature measurement sheet 200.

[0116] According to the second determination method described above, it becomes possible to appropriately determine whether or not the substrate W is in contact with the temperature measuring sheet 200, regardless of the processing temperature. Furthermore, if multiple substrates W are continuously heated in the heat treatment apparatus 100, other substrates W that have been heated before one substrate W may be considered as sample substrates. In this case, a second threshold value to be used during the heating of one substrate W is determined based on the multiple temperature variations measured during the heating of the other substrates W considered as sample substrates.

[0117] <3> Control system for heat treatment apparatus 100 The control device 90 in Figure 11 includes a CPU, RAM, ROM, and storage device, similar to the control device 90 in Figure 1. The storage device in this example stores a heat treatment program for performing heat treatment on the substrate W, as well as a contact determination program for determining whether or not the substrate W and the temperature measurement sheet 200 are in contact.

[0118] Here, the heat treatment program and the contact detection program may be provided stored on a recording medium such as a CD-ROM 909 and installed in the ROM or storage device of the control device 90. Alternatively, the heat treatment program and the contact detection program may be distributed from a server outside the heat treatment apparatus 100 via a communication network and installed in the ROM or storage device.

[0119] As shown in Figure 11, the control device 90 includes a temperature control unit 91, a lifting / lowering control unit 92, a temperature acquisition unit 93, a temperature information setting unit 94, a temperature information storage unit 95, and a contact determination unit 96 as functional units for controlling the operation of each part of the heat treatment apparatus 100 and for performing predetermined processing. Multiple functional units of the control device 90 are realized by the CPU executing a heat treatment program and a contact determination program stored in a memory device on RAM. Some or all of the multiple functional units of the control device 90 may be realized by hardware such as electronic circuits.

[0120] The lifting control unit 92 controls the operation of the lifting device 40, similar to the lifting control unit 92 in the first embodiment. The temperature acquisition unit 93 in Figure 11 acquires the temperature of the portion (multiple portions of the processing surface 11) where each of the multiple temperature sensors TS1 and TS2 is installed, based on the detected values ​​output from the multiple temperature sensors TS1 and TS2. The temperature acquisition unit 93 also provides the multiple temperatures acquired based on the output of the multiple temperature sensors TS1 to the contact determination unit 96, and provides the temperature acquired based on the output of the temperature sensor TS2 to the temperature control unit 91.

[0121] The temperature control unit 91 provides feedback control to the heat generation drive circuit 21 based on the temperature supplied by the temperature acquisition unit 93, so that the processing surface 11 is maintained at a predetermined processing temperature. Specifically, in this embodiment, the temperature control unit 91 controls the heat generation drive circuit 21 based on the temperature (temperature measurement result) acquired by a single temperature sensor TS2. In this case, based on the temperature measurement result from the single temperature sensor TS2, the temperatures of the multiple heating elements of the heating device 20 are appropriately adjusted within a predetermined temperature range that includes the processing temperature. As a result, the temperature of the entire processing surface 11 is accurately and quickly adjusted to the processing temperature.

[0122] The user can input information as reference temperature information to determine whether or not the substrate W and the processing surface 11 are in contact by operating the operation unit 98. The reference temperature information may be the first threshold value of the first determination method described above, or the second threshold value of the second determination method described above. When reference temperature information is input, the temperature information setting unit 94 accepts the input reference temperature information. The accepted reference temperature information is stored in the temperature information storage unit 95.

[0123] For example, during the heating of a sample substrate, multiple temperatures acquired by multiple temperature sensors TS1 may be provided from the temperature acquisition unit 93 to the temperature information setting unit 94. In this case, the temperature information setting unit 94 may automatically generate reference temperature information (for example, a first threshold or a second threshold) based on the multiple temperatures provided from the temperature acquisition unit 93.

[0124] When the substrate W is subjected to heat treatment, the contact determination unit 96 determines whether a portion of the substrate W that is distorted downwards is in contact with the temperature measuring sheet 200, based on reference temperature information stored in the temperature information storage unit 95 and multiple temperatures provided by the temperature acquisition unit 93. The contact determination unit 96 also outputs the determination result to the display device 99.

[0125] The display device 99 includes a display and an audio output device as described above. The display shows the judgment result provided by the contact judgment unit 96. The audio output device outputs the judgment result provided by the contact judgment unit 96 as an audio signal. This allows the user to easily determine whether the heating process is being performed correctly. Furthermore, the user can immediately recognize the occurrence of a processing defect if contact occurs between the substrate W and the temperature measuring sheet 200.

[0126] <4> Contact detection process In the control device 90 shown in Figure 11, the CPU executes a contact determination program stored in the memory to perform a contact determination process that determines whether or not the substrate W is in contact with the temperature measurement sheet 200. Figure 15 is a flowchart showing an example of the contact determination process. The contact determination process starts when the power to the heat treatment device 100 is turned on. In this example, it is assumed that no reference temperature information is stored in the temperature information storage unit 95 shown in Figure 1 at the start of the contact determination process. It is also assumed that the control device 90 has a built-in timer.

[0127] As shown in Figure 15, when the contact detection process is started, the temperature information setting unit 94 determines whether or not reference temperature information has been input based on the user's operation of the operation unit 98 (step S11). In this example, the reference temperature information is assumed to be information determined in advance by the user through various experiments using a sample substrate, etc.

[0128] If no reference temperature information is entered, the process in step S11 is repeated. On the other hand, if reference temperature information is entered, the temperature information setting unit 94 receives the entered reference temperature information and stores the received reference temperature information in the temperature information storage unit 95 (step S12).

[0129] Next, the temperature information setting unit 94 determines whether or not reference temperature information has been entered based on the user's operation of the operation unit 98, similar to the process in step S11 (step S13). If reference temperature information is entered, the process returns to step S12. In this case, in step S12, the reference temperature information previously stored in the temperature information storage unit 95 is updated with the newly entered reference temperature information.

[0130] If no reference temperature information is input in step S13, the temperature acquisition unit 93 determines whether or not a substrate W has been placed on the processing surface 11 (step S14). The process in step S14 can be performed, for example, based on the control timing of the lifting device 40 when placing the substrate W on the processing surface 11.

[0131] If no substrate W is placed on the processing surface 11, the process returns to step S13. On the other hand, if a substrate W is placed on the processing surface 11, the temperature acquisition unit 93 resets the timer of the control device 90 and starts measuring time using the timer (step S15). The temperature acquisition unit 93 also starts acquiring temperature changes of multiple parts of the processing surface 11 based on the detected values ​​output from the multiple temperature sensors TS1 (step S16).

[0132] Next, the temperature acquisition unit 93 determines whether a predetermined time has elapsed since the start of time measurement by the timer (step S17). The predetermined time is predetermined by the user and may be, for example, 10 seconds, 20 seconds, or 60 seconds. If the predetermined time has not elapsed, the process in step S17 is repeated. On the other hand, once the predetermined time has elapsed, the contact determination unit 96 determines whether a portion of the substrate W that is distorted downwards is in contact with the temperature measuring sheet 200, based on the reference temperature information and the multiple temperature changes acquired by the temperature acquisition unit 93 (step S18). The contact determination unit 96 also outputs the determination result to the display device 99 (step S19). After that, the process returns to step S13.

[0133] In the above series of processes, the contact determination unit 96 may stop the operation of the heat treatment apparatus 100 if it determines in step S18 that the substrate W is in contact with the temperature measuring sheet 200. Alternatively, the contact determination unit 96 may, for example, use a printing device to mark the substrate W that has come into contact with the temperature measuring sheet 200 to indicate that a processing defect has occurred. In these cases, the user can quickly identify the substrate W that has a processing defect and remove it from the production line.

[0134] Furthermore, in this example, reference temperature information is stored in the temperature information storage unit 95 based on the user's input, but the present invention is not limited thereto. The temperature acquisition unit 93 may acquire temperature changes of multiple parts of the processing surface 11 based on the output of multiple temperature sensors TS1 when the sample substrate is heated. In addition, the temperature information setting unit 94 may generate reference temperature information based on the temperature changes of multiple parts of the processing surface 11 acquired when the sample substrate is heated, and store it in the temperature information storage unit 95.

[0135] Furthermore, if multiple substrates W are continuously heated in the heat treatment apparatus 100, reference temperature information may be generated based on multiple temperature changes obtained during the heating of other substrates W by considering other substrates W that have been heated before the heating of one substrate W as sample substrates.

[0136] <5> Effects of the Fifth Embodiment In the heat treatment apparatus 100 according to this embodiment, when a substrate W is placed on a plurality of support members 13 with the temperature of the processing surface 11 adjusted to the processing temperature, a plurality of temperature sensors TS1 acquire multiple temperature changes of multiple parts of the processing surface 11 from the time the substrate W is placed until a certain time has elapsed.

[0137] Based on the acquired temperature changes and the reference temperature information stored in the temperature information storage unit 95, it is determined whether or not the substrate W is in contact with the temperature measuring sheet 200. This makes it possible to quickly determine whether or not a heat treatment defect has occurred due to a portion of the substrate W that is distorted downwards coming into contact with the temperature measuring sheet 200 after the heating process of the substrate W has started.

[0138] In this case, substrates W that have not undergone the desired heat treatment can be removed from the production line at the appropriate time. As a result, the manufacturing yield of semiconductor products using heat-treated substrates W is improved.

[0139] 6. Sixth Embodiment The differences between the heat treatment apparatus 100 according to the sixth embodiment and the heat treatment apparatus 100 according to the fifth embodiment will be explained. In the heat treatment plate 110 according to the sixth embodiment, a plurality of support members 13 are not provided on the treatment surface 11 of the plate member 10. Therefore, the temperature measuring sheet 200 according to the sixth embodiment has a configuration that functions as a plurality of support members 13, similar to the example of the temperature measuring sheet 200 according to the second embodiment.

[0140] Figure 16 is a schematic plan view of the temperature measuring sheet 200 according to the sixth embodiment. As shown in Figure 16, in the temperature measuring sheet 200 according to this embodiment, a protrusion p13 is formed in place of the multiple through holes h13 (Figure 12) of the temperature measuring sheet 200 according to the fifth embodiment.

[0141] With this configuration, it is possible to determine whether a portion of the substrate W placed on the multiple protrusions p13 has come into contact with a portion of the temperature measuring sheet 200 other than the multiple protrusions p13, based on the temperatures of multiple portions of the processing surface 11 measured by multiple temperature sensors TS1.

[0142] 7. Seventh Embodiment Figure 17 is a schematic block diagram showing an example of a substrate processing apparatus equipped with a temperature measuring sheet 200 according to any of the first to sixth embodiments. As shown in Figure 17, the substrate processing apparatus 800 is provided adjacent to the exposure apparatus 890 and includes a control device 810, a transport device 820, a coating processing unit 830, a developing processing unit 840, and a heat processing unit 850.

[0143] The control device 810 includes, for example, a CPU and memory, or a microcomputer, and controls the operation of the transport device 820, the coating processing unit 830, the developing processing unit 840, and the heat processing unit 850.

[0144] The transport device 820 transports the substrate W between the coating processing unit 830, the developing processing unit 840, the heat processing unit 850, and the exposure device 890. The coating processing unit 830 forms a resist film on one surface of the untreated substrate W (coating process). After the coating process, the substrate W with the resist film formed is subjected to exposure processing in the exposure device 890. The developing processing unit 840 develops the substrate W by supplying a developer solution to the substrate W after exposure processing by the exposure device 890.

[0145] The heat treatment unit 850 includes a plurality of heat treatment devices 100. Each heat treatment device 100 performs heat treatment on the substrate W before and after the coating process by the coating treatment unit 830, the developing process by the developing treatment unit 840, and the exposure process by the exposure device 890.

[0146] The coating processing unit 830 may also form an anti-reflective film on the substrate W. In this case, the heat processing unit 850 may be provided with a processing unit for performing adhesion strengthening treatment to improve the adhesion between the substrate W and the anti-reflective film. The coating processing unit 830 may also form a resist cover film on the substrate W to protect the resist film formed on the substrate W.

[0147] In the substrate processing apparatus 800, each heat processing apparatus 100 in the heat processing apparatus 850 is provided with a temperature measuring sheet 200 according to any of the first to sixth embodiments. This allows the temperature of a desired portion of the processing surface 11 to be measured with high accuracy. Therefore, high-quality heat treatment can be applied to the substrate W.

[0148] 8. Other Embodiments (a) Figure 18 is a schematic cross-sectional view showing one example of the configuration of a temperature measuring sheet 200 according to another embodiment. Figure 18 shows an enlarged cross-sectional view of a part of the temperature measuring sheet 200.

[0149] As shown in Figure 18, the temperature measuring sheet 200 may have a configuration in which a temperature sensor TS3 and its corresponding wiring WL are provided on the upper surface of a resin film 250. Here, the temperature sensor TS3 in Figure 18 corresponds to any of the temperature sensors TS0, TS1, or TS2 according to the first to sixth embodiments.

[0150] In this case, it is preferable that the upper end surfaces of the temperature sensor TS3 and the wiring WL are flush with the upper surface of the resin film 250. This suppresses the occurrence of irregularities on the upper surface of the temperature measuring sheet 200 caused by the temperature sensor TS3 and the wiring WL. Therefore, it becomes easier to wipe the upper surface of the temperature measuring sheet 200 with a cloth or the like, improving the maintainability of the temperature measuring sheet 200.

[0151] (b) Figure 19 is a schematic cross-sectional view showing another configuration example of the temperature measuring sheet 200 according to another embodiment. In Figure 19, similar to the example in Figure 18, an enlarged cross-sectional view of a part of the temperature measuring sheet 200 is shown.

[0152] As shown in Figure 19, the temperature measuring sheet 200 may have a configuration in which a temperature sensor TS3 and its corresponding wiring WL are provided on the lower surface of a resin film 250. Here, the temperature sensor TS3 in Figure 19 corresponds to any of the temperature sensors TS0, TS1, or TS2 according to the first to sixth embodiments.

[0153] In this case, it is preferable that the lower end surfaces of the temperature sensor TS3 and the wiring WL are flush with the lower surface of the resin film 250. This suppresses the occurrence of irregularities on the lower surface of the temperature measuring sheet 200 caused by the temperature sensor TS3 and the wiring WL. Therefore, when the temperature measuring sheet 200 is placed on the processing surface 11 of the heat treatment plate 110, no gap is created between the temperature measuring sheet 200 and the processing surface 11. Thus, the installation state of the temperature measuring sheet 200 on the processing surface 11 becomes stable. In addition, since the temperature sensor TS3 is in direct contact with the processing surface 11, it becomes possible to measure the temperature of each part of the processing surface 11 more accurately.

[0154] (c) The temperature measuring sheet 200 according to the above embodiment and the temperature measuring sheet 209 in Figures 18 and 19 include one or more layers of resin film, but the present invention is not limited thereto.

[0155] The temperature measuring sheet 200 may include one or more layers of glass. For example, the temperature measuring sheet 200 may have a configuration in which one or more temperature sensors and one or more wirings are provided on a single glass substrate. Alternatively, the temperature measuring sheet 200 may have a configuration in which one or more temperature sensors and one or more wirings are provided on the top surface, bottom surface, or interior of a laminate of multiple stacked glass substrates. Even in these configurations, it is preferable that the temperature measuring sheet 200 has a thickness greater than 0 and less than 100 μm.

[0156] (d) The heat treatment apparatus 100 according to the above embodiment performs heat treatment on the substrate W, but the present invention is not limited thereto. The heat treatment apparatus 100 may be configured to perform cooling treatment on the substrate W as an example of heat treatment. In this case, a cooling body is provided on the mounting surface 12 of the plate member 10 instead of the heating device 20, for example. The cooling body may be composed of a Peltier element. Alternatively, the heat treatment apparatus 100 may be configured to selectively perform heat treatment and cooling treatment on the substrate W.

[0157] (e) In the heat treatment apparatus 100 according to the fifth embodiment, the heat treatment plate 110 may have an adsorption and holding function for adsorbing and holding the substrate W. In this case, the temperature measuring sheet 200 in Figure 12 according to the fifth embodiment will be provided with a plurality of through holes h16, as well as a flat portion 230 and an annular projection 240, similar to the example in Figure 7 according to the third embodiment.

[0158] (f) In the heat treatment apparatus 100 according to the sixth embodiment, the heat treatment plate 110 may have an adsorption and holding function for adsorbing and holding the substrate W. In this case, the temperature measuring sheet 200 in Figure 16 according to the sixth embodiment will be provided with a plurality of through holes h16, as well as a flat portion 230 and an annular projection 240, similar to the example in Figure 9 according to the fourth embodiment.

[0159] (g) In the heat treatment apparatus 100 according to the fifth and sixth embodiments, one temperature sensor TS2 is provided on the plate member 10 to control the driving state of the heating device 20, but the present invention is not limited thereto. The plate member 10 may be provided with multiple temperature sensors TS2 corresponding to multiple heating elements of the heating device 20. In this case, similar to the example of the heat treatment apparatus 100 according to the first embodiment, the temperature of the processing surface 11 of the plate member 10 can be divided into multiple regions and controlled.

[0160] (h) In the heat treatment apparatus 100 according to the above embodiment, the number of each of the multiple through holes 14, 15, 16 formed in the plate member 10 of the heat treatment plate 110 is not limited to the above example.

[0161] The number of through-holes 14 is determined according to the number of lifting pins 41 of the lifting device 40. Therefore, if the number of lifting pins 41 of the lifting device 40 is 4, the number of through-holes 14 will be 4. Also, if the number of lifting pins 41 of the lifting device 40 is 5, the number of through-holes 14 will be 5. Furthermore, the number of through-holes 15 is not limited to 2; it may be 3, 4, or 5 or more. Similarly, the number of through-holes 16 is not limited to 4; it may be 5, or 6 or more.

[0162] (i) In the heat treatment apparatus 100 according to the above embodiment, the substrate W to be heat-treated is a circular substrate, but the present invention is not limited thereto. The substrate W to be heat-treated is not limited to a circular shape, but may also be rectangular. In this case, a rectangular substrate processing area PR is set on the processing surface 11 of the plate member 10. In addition, a plurality of guide members 19 are provided on the processing surface 11 so as to surround the substrate processing area PR. Furthermore, a plurality of support members 13 or protrusions p13 of the temperature measuring sheet 200 are distributed within the substrate processing area PR.

[0163] 9. Correspondence between each part of the embodiment and each component of the claim The following describes examples of the correspondence between each component of the claim and each component of the embodiment. Various other elements having the configuration or function described in the claim can also be used as each component of the claim.

[0164] In the above embodiment, the processing surface 11 is an example of a processing surface, the heat treatment plate 110 is an example of a heat treatment plate, the temperature measuring sheet 200 is an example of a temperature measuring sheet, the lower protective layer 211, the lower fusion layer 212, the upper fusion layer 213, the upper protective layer 214, the resin film 250 and a glass substrate that replaces these are examples of sheet-like members, the temperature sensors TS0, TS1, and TS2 are examples of one or more temperature sensors, the lower protective layer 211 and the lower fusion layer 212 are examples of a first sheet member, and the upper fusion layer 213 and the upper protective layer 214 are examples of a second sheet member.

[0165] Furthermore, the multiple support members 13 are examples of multiple support members, the multiple through holes h13 are examples of multiple through holes, the lower surface of the temperature measuring sheet 200 is an example of the lower surface of the temperature measuring sheet, the upper surface of the temperature measuring sheet 200 is an example of the upper surface of the temperature measuring sheet, the multiple protrusions p13 are examples of multiple protrusions, the temperature control unit 91 and the heat generation drive circuit 21 are examples of the temperature control unit, and the heat treatment device 100 is an example of the heat treatment device.

[0166] Furthermore, the temperature information storage unit 95 is an example of a temperature information storage unit, the contact determination unit 96 is an example of a contact determination unit, the temperature measuring sheet 200 in Figure 12 according to the fifth embodiment is an example of a temperature measuring sheet described in claim 3, and the temperature measuring sheet 200 in Figure 16 according to the sixth embodiment is an example of a temperature measuring sheet described in claim 4.

[0167] 10. Summary of Embodiments (Paragraph 1) The temperature measuring sheet relating to Paragraph 1 is A temperature measuring sheet for measuring the temperature of a heat treatment plate that has a processing surface and is used to measure the temperature of a substrate that is subjected to heat treatment, A sheet member provided on the processing surface, The sheet member comprises one or more temperature sensors.

[0168] The sheet material of the temperature measuring sheet is placed on the processing surface of the heat treatment plate. One or more temperature sensors are provided on the sheet material. In this case, by reducing the thickness of the sheet material, each temperature sensor can be positioned closer to the processing surface compared to when each temperature sensor is built into the heat treatment plate.

[0169] Furthermore, since the temperature measurement sheet is placed on the processing surface of the heat treatment plate, it does not interfere with multiple components within the heat treatment plate. Therefore, there is greater flexibility in the layout of each temperature sensor compared to when each temperature sensor is built into the heat treatment plate. In addition, since it is not necessary to install each temperature sensor inside the heat treatment plate, the decrease in measurement accuracy caused by mounting errors of the temperature sensors is suppressed.

[0170] These results make it possible to measure the temperature of a desired portion of the processing surface with high accuracy.

[0171] (Paragraph 2) In the temperature measurement sheet relating to Paragraph 1, The aforementioned sheet member is A first sheet member provided on the processing surface, This includes a second sheet member laminated on the first sheet member, The one or more temperature sensors may be sandwiched between the first sheet member and the second sheet member.

[0172] In this case, the fabrication of the temperature measuring sheet becomes easier. Furthermore, one or more temperature sensors are embedded within the sheet material. This protects each temperature sensor from the sheet material, thus improving the reliability of the temperature measuring sheet.

[0173] (Article 3) In the temperature measuring sheet relating to Article 1 or Article 2, The heat treatment plate is provided with a plurality of support members that support the lower surface of the substrate, The temperature measuring sheet is placed on the processing surface, In the sheet member, the portion where the temperature measuring sheet overlaps with the plurality of support members when placed on the processing surface may have a plurality of through holes corresponding to each of the plurality of support members.

[0174] In this case, the temperature measuring sheet is placed on the processing surface with multiple support members inserted into multiple through-holes. This makes it possible to bring the temperature measuring sheet into contact with the processing surface without interfering with the multiple support members. Therefore, it becomes possible to bring one or more temperature sensors close to the processing surface with a simple configuration.

[0175] (Article 4) In the temperature measuring sheet relating to Article 1 or Article 2, The aforementioned temperature measuring sheet is It is placed on the aforementioned processing surface, The temperature measuring sheet is placed on the processing surface, and its lower surface comes into contact with the processing surface. It has an upper surface facing in the opposite direction to the lower surface, Multiple protrusions may be formed on the upper surface, each supporting the lower surface of the substrate.

[0176] In this case, since each of the multiple protrusions supports the underside of the substrate, there is no need to provide any other members on the processing surface to support the underside of the substrate.

[0177] (Article 5) In a temperature measuring sheet relating to any one of paragraphs 1 to 4, The one or more temperature sensors are a plurality of temperature sensors, The plurality of temperature sensors may be distributed in a plane perpendicular to the thickness direction of the sheet member. In this case, the temperature of multiple parts of the processed surface can be measured.

[0178] (Article 6) In a temperature measuring sheet relating to any one of paragraphs 1 to 5, The sheet member may be made of resin or glass. If the sheet member is made of resin, the temperature measuring sheet is flexible. On the other hand, if the sheet member is made of glass, the temperature measuring sheet is not flexible.

[0179] (Paragraph 7) The heat treatment apparatus relating to Paragraph 7 is: A heat treatment plate having a processing surface and on which a substrate is placed to perform heat treatment, A temperature measuring sheet according to any one of paragraphs 1 to 6 provided on the processing surface, The system includes a temperature control unit that controls the temperature of the heat treatment plate based on the temperature measurement results from the one or more temperature sensors provided on the temperature measuring sheet.

[0180] In this heat treatment apparatus, the temperature of the heat treatment plate is controlled based on the temperature measurement results from one or more temperature sensors on the temperature measuring sheet mentioned above. This makes it possible to adjust the temperature of one or more parts of the treatment surface with high precision. As a result, it becomes possible to apply high-quality heat treatment to the substrate.

[0181] (Paragraph 8) The heat treatment apparatus relating to Paragraph 8 is: A heat treatment plate having a processing surface and on which a substrate is placed to perform heat treatment, A plurality of support members are provided on the processing surface of the heat treatment plate and each supports the lower surface of the substrate, A temperature measuring sheet as described in paragraph 3, which is placed on the processing surface, A temperature information storage unit stores information regarding the temperature change of the processing surface as reference temperature information from the time when a sample substrate of the same type as the substrate is placed on the plurality of support members, while the temperature of the processing surface is adjusted to a predetermined processing temperature, until a certain period of time has elapsed without the sample substrate coming into contact with the temperature measuring sheet. When the substrate is placed on the plurality of support members with the temperature of the processing surface adjusted to the processing temperature, the temperature change of the processing surface from the time the substrate is placed until a certain period of time has elapsed is acquired based on the temperature measurement results of the one or more temperature sensors provided on the temperature measuring sheet, and a contact determination unit determines whether or not a portion of the substrate that is distorted downwards is in contact with the temperature measuring sheet based on the acquired temperature change of the processing surface and the reference temperature information.

[0182] In this heat treatment apparatus, multiple support members are provided on the treatment surface of the heat treatment plate. Once the temperature of the treatment surface is adjusted to the treatment temperature, the substrate is placed on the multiple support members. As a result, heat treatment is performed on the substrate.

[0183] Furthermore, in the heat treatment apparatus described above, the temperature measuring sheet is placed on the treatment surface. When the temperature of the treatment surface is adjusted to the treatment temperature and the substrate is placed on multiple support members, the temperature change of the treatment surface from the time the substrate is placed until a certain period of time has elapsed is acquired based on the temperature measurement results from one or more temperature sensors. Based on the acquired temperature change of the treatment surface and the reference temperature information stored in the temperature information storage unit, it is determined whether or not a portion of the substrate that is distorted downwards is in contact with the temperature measuring sheet. This makes it possible to quickly determine whether or not a heat treatment defect has occurred due to the substrate coming into contact with the temperature measuring sheet after the heat treatment of the substrate has started.

[0184] In this case, substrates that have not undergone the desired heat treatment can be removed from the production line at the appropriate time. As a result, the manufacturing yield of semiconductor products using heat-treated substrates is improved.

[0185] (Paragraph 9) The heat treatment apparatus relating to Paragraph 9 is: A heat treatment plate having a processing surface and on which a substrate is placed to perform heat treatment, A temperature measuring sheet as described in item 4, which is placed on the processing surface, A temperature information storage unit stores, as reference temperature information, information regarding the temperature change of the processing surface from the time a sample substrate of the same type as the substrate is placed on the plurality of protrusions on the temperature measuring sheet, while the temperature of the processing surface is adjusted to a predetermined processing temperature, until a certain period of time has elapsed without the sample substrate contacting the portion of the upper surface of the temperature measuring sheet where the plurality of protrusions are not formed, When the substrate is placed on the plurality of protrusions while the temperature of the processing surface has been adjusted to the processing temperature, the temperature change of the processing surface from the time the substrate is placed until a certain period of time has elapsed is acquired based on the temperature measurement results of the one or more temperature sensors provided on the temperature measuring sheet, and a contact determination unit determines whether or not a portion of the substrate that is distorted downwards is in contact with the portion of the upper surface of the temperature measuring sheet where the plurality of protrusions are not formed, based on the acquired temperature change of the processing surface and the reference temperature information.

[0186] In this heat treatment apparatus, the temperature measuring sheet is placed on the treatment surface of the heat treatment plate. Multiple protrusions are formed on the upper surface of the temperature measuring sheet. When the temperature of the treatment surface is adjusted to the treatment temperature, the substrate is placed on the multiple protrusions of the temperature measuring sheet. As a result, heat treatment is performed on the substrate.

[0187] Furthermore, in the heat treatment apparatus described above, when a substrate is placed on multiple protrusions after the temperature of the treatment surface has been adjusted to the treatment temperature, the temperature change of the treatment surface from the time the substrate is placed until a certain period of time has elapsed is acquired based on the temperature measurement results from one or more temperature sensors. Based on the acquired temperature change of the treatment surface and the reference temperature information stored in the temperature information storage unit, it is determined whether or not a portion of the substrate that is distorted downwards is in contact with the part of the upper surface of the temperature measuring sheet where multiple protrusions are not formed. This makes it possible to quickly determine whether or not a heat treatment defect has occurred due to the substrate coming into contact with parts of the temperature measuring sheet other than the multiple protrusions after the heat treatment of the substrate has started.

[0188] In this case, substrates that have not undergone the desired heat treatment can be removed from the production line at the appropriate time. As a result, the manufacturing yield of semiconductor products using heat-treated substrates is improved.

[0189] (Paragraph 10) The method for measuring the temperature of the heat-treated plate relating to Paragraph 10 is: A temperature measurement method for measuring the temperature of a heat treatment plate having a processing surface and being placed on the processing surface for performing heat treatment on a substrate, The steps include: preparing a sheet member and a temperature measuring sheet including one or more temperature sensors provided on the sheet member; The steps include: providing the temperature measuring sheet on the processing surface of the heat treatment plate; The process includes the step of measuring the temperature of one or more portions of the processing surface using the one or more temperature sensors.

[0190] The sheet material of the temperature measuring sheet is placed on the processing surface of the heat treatment plate. One or more temperature sensors are provided on the sheet material. In this case, by reducing the thickness of the sheet material, each temperature sensor can be positioned closer to the processing surface compared to when each temperature sensor is built into the heat treatment plate.

[0191] Furthermore, since the temperature measurement sheet is placed on the processing surface of the heat treatment plate, it does not interfere with multiple components within the heat treatment plate. Therefore, there is greater flexibility in the layout of each temperature sensor compared to when each temperature sensor is built into the heat treatment plate. In addition, since it is not necessary to install each temperature sensor inside the heat treatment plate, the decrease in measurement accuracy caused by mounting errors of the temperature sensors is suppressed.

[0192] In this method for measuring the temperature of the heat-treated plate, the temperature of one or more parts of the treated surface is measured using the temperature-measuring sheet described above. This makes it possible to measure the temperature of a desired part of the treated surface with high accuracy.

[0193] (Paragraph 11) The heat treatment method relating to Paragraph 11 is: A heat treatment method for performing heat treatment on a substrate using a heat treatment apparatus, The heat treatment apparatus includes a heat treatment plate having a treatment surface and being placed on the treatment surface to perform heat treatment on the substrate, The aforementioned heat treatment method is The steps include: preparing a sheet member and a temperature measuring sheet including one or more temperature sensors provided on the sheet member; The steps include: providing the temperature measuring sheet on the processing surface of the heat treatment plate; The steps include measuring the temperature of one or more parts of the processing surface using the one or more temperature sensors, The process includes the step of controlling the temperature of the heat treatment plate based on the temperature measurement results from the one or more temperature sensors provided on the temperature measuring sheet.

[0194] The sheet material of the temperature measuring sheet is placed on the processing surface of the heat treatment plate. One or more temperature sensors are provided on the sheet material. In this case, by reducing the thickness of the sheet material, each temperature sensor can be positioned closer to the processing surface compared to when each temperature sensor is built into the heat treatment plate.

[0195] Furthermore, since the temperature measurement sheet is placed on the processing surface of the heat treatment plate, it does not interfere with multiple components within the heat treatment plate. Therefore, there is greater flexibility in the layout of each temperature sensor compared to when each temperature sensor is built into the heat treatment plate. In addition, since it is not necessary to install each temperature sensor inside the heat treatment plate, the decrease in measurement accuracy caused by mounting errors of the temperature sensors is suppressed.

[0196] In this heat treatment method, the temperature of the heat treatment plate is controlled based on the temperature measurement results from one or more temperature sensors on the temperature measurement sheet described above. This makes it possible to adjust the temperature of one or more parts of the treatment surface with high precision. As a result, it becomes possible to apply high-quality heat treatment to the substrate.

[0197] (Paragraph 12) The heat treatment method relating to Paragraph 12 is: A heat treatment method for performing heat treatment on a substrate using a heat treatment apparatus, The heat treatment apparatus is A heat treatment plate having a processing surface and being placed on the processing surface to perform heat treatment on the substrate, A plurality of support members are provided on the processing surface of the heat treatment plate and each supports the lower surface of the substrate, The process includes a temperature measuring sheet placed on the processing surface, The aforementioned temperature measuring sheet is A sheet member provided on the processing surface, The sheet member comprises one or more temperature sensors, In the portion of the temperature measuring sheet that overlaps with the plurality of support members when placed on the processing surface, a plurality of through holes corresponding to each of the plurality of support members are formed. The aforementioned heat treatment method is The steps include: storing information regarding the temperature change of the processing surface as reference temperature information from the time when a sample substrate of the same type as the substrate is placed on the plurality of support members, while the temperature of the processing surface is adjusted to a predetermined processing temperature, until a certain period of time has elapsed without the sample substrate coming into contact with the temperature measuring sheet; After the storage step, the substrate is placed on the plurality of support members with the temperature of the processing surface adjusted to the processing temperature, After the step of placing the substrate, the step of performing heat treatment on the substrate supported by the plurality of support members on the processing surface by adjusting the temperature of the processing surface to the processing temperature, The steps include measuring the temperature of the portion of the processing surface in which the plurality of support members are not provided using the one or more temperature sensors provided on the temperature measuring sheet, When the substrate is placed on the plurality of support members with the temperature of the processing surface adjusted to the processing temperature, the temperature change of the processing surface from the time the substrate is placed until a certain period of time has elapsed is obtained based on the temperature measurement results of the one or more temperature sensors, and the step of determining whether a portion of the substrate that is distorted downwards is in contact with the temperature measuring sheet is based on the obtained temperature change of the processing surface and the reference temperature information.

[0198] The heat treatment apparatus used in this heat treatment method has a configuration in which multiple support members are provided on the treatment surface of the heat treatment plate. A temperature measuring sheet is also placed on the treatment surface of the heat treatment plate. In this state, the multiple support members are each inserted into multiple through holes. This makes it possible to bring the temperature measuring sheet into contact with the treatment surface without interfering with the multiple support members. Therefore, since one or more temperature sensors on the temperature measuring sheet can be brought close to the treatment surface, it becomes possible to measure the temperature of a desired part of the treatment surface with high accuracy.

[0199] In the heat treatment method described above, information regarding the temperature change of the treatment surface is stored as reference temperature information from the moment a sample substrate of the same type as the substrate is placed on multiple support members while the temperature of the treatment surface is adjusted to a predetermined treatment temperature, until a certain period of time has elapsed without the sample substrate coming into contact with the temperature measurement sheet.

[0200] Subsequently, with the temperature of the processing surface adjusted to a predetermined processing temperature, the substrate is placed on multiple support members. The temperature of the processing surface is adjusted to the processing temperature. This then heat-treats the substrate.

[0201] As described above, when a substrate is placed on multiple support members with the temperature of the processing surface adjusted to the processing temperature, the temperature change of the processing surface from the time the substrate is placed until a certain period of time has elapsed is acquired based on the temperature measurement results from one or more temperature sensors. Based on the acquired temperature change of the processing surface and the stored reference temperature information, it is determined whether or not a portion of the substrate that is distorted downwards is in contact with the temperature measurement sheet. This makes it possible to quickly determine whether or not a heat treatment defect has occurred due to the substrate coming into contact with the temperature measurement sheet after the heat treatment of the substrate has started.

[0202] In this case, substrates that have not undergone the desired heat treatment can be removed from the production line at the appropriate time. As a result, the manufacturing yield of semiconductor products using heat-treated substrates is improved.

[0203] (Paragraph 13) The heat treatment method relating to Paragraph 13 is: A heat treatment method for performing heat treatment on a substrate using a heat treatment apparatus, The heat treatment apparatus is A heat treatment plate having a processing surface and being placed on the processing surface to perform heat treatment on the substrate, The process includes a temperature measuring sheet placed on the processing surface, The aforementioned temperature measuring sheet is The temperature measuring sheet has a lower surface that contacts the processing surface when placed on the processing surface, and an upper surface that faces in the opposite direction to the lower surface. The sheet member provided on the processing surface, and one or more temperature sensors provided on the sheet member, Multiple protrusions are formed on the upper surface, each supporting the lower surface of the substrate. The aforementioned heat treatment method is The steps include storing information regarding the temperature change of the processing surface as reference temperature information from the time a sample substrate of the same type as the substrate is placed on the plurality of protrusions on the temperature measuring sheet, while the temperature of the processing surface is adjusted to a predetermined processing temperature, until a certain period of time has elapsed without the sample substrate contacting the portion of the upper surface of the temperature measuring sheet where the plurality of protrusions are not formed; After the storage step, the substrate is placed on the plurality of protrusions with the temperature of the processing surface adjusted to the processing temperature, After the step of placing the substrate, the step of performing heat treatment on the substrate supported by the plurality of protrusions on the processing surface by adjusting the temperature of the processing surface to the processing temperature, The steps include measuring the temperature of the processing surface using the one or more temperature sensors provided on the temperature measuring sheet, The process includes the step of, when the substrate is placed on the plurality of protrusions with the temperature of the processing surface adjusted to the processing temperature, acquiring the temperature change of the processing surface from the time the substrate is placed until a certain period of time has elapsed based on the temperature measurement results from the one or more temperature sensors, and determining whether a portion of the substrate that is distorted downwards is in contact with the portion of the upper surface of the temperature measuring sheet where the plurality of protrusions are not formed, based on the acquired temperature change of the processing surface and the reference temperature information.

[0204] In the heat treatment apparatus used in this heat treatment method, a temperature measuring sheet is placed on the treatment surface. Therefore, since one or more temperature sensors on the temperature measuring sheet can be brought close to the treatment surface, it becomes possible to measure the temperature of a desired part of the treatment surface with high accuracy. Multiple protrusions are formed on the upper surface of the temperature measuring sheet.

[0205] In the heat treatment method described above, information regarding the temperature change of the treatment surface is stored as reference temperature information from the moment a sample substrate of the same type as the substrate is placed on the multiple protrusions of the temperature measuring sheet, after the temperature of the treatment surface has been adjusted to a predetermined treatment temperature, until a certain period of time has elapsed without the sample substrate coming into contact with the portion of the upper surface of the temperature measuring sheet where the multiple protrusions are not formed.

[0206] Subsequently, with the temperature of the processing surface adjusted to a predetermined processing temperature, the substrate is placed on multiple protrusions. The temperature of the processing surface is adjusted to the processing temperature. This then heat-treats the substrate.

[0207] As described above, when a substrate is placed on multiple protrusions with the temperature of the processing surface adjusted to the processing temperature, the temperature change of the processing surface from the time the substrate is placed until a certain period of time has elapsed is acquired based on the temperature measurement results from one or more temperature sensors. Based on the acquired temperature change of the processing surface and the stored reference temperature information, it is determined whether or not a portion of the substrate that is distorted downwards is in contact with the part of the upper surface of the temperature measurement sheet where multiple protrusions are not formed. This makes it possible to quickly determine whether or not a heat treatment defect has occurred due to the substrate coming into contact with the part of the upper surface of the temperature measurement sheet where multiple protrusions are not formed after the heat treatment of the substrate has started.

[0208] In this case, substrates that have not undergone the desired heat treatment can be removed from the production line at the appropriate time. As a result, the manufacturing yield of semiconductor products using heat-treated substrates is improved. [Explanation of Symbols]

[0209] 10...Plate member, 11...Processing surface, 12...Mounting surface, 13...Support member, 14, 15, 16...Through hole, 19...Guide member, 20...Heating device, 21...Heating drive circuit, 40...Lifting device, 41...Lifting pin, 42...Connecting member, 80...Suction device, 90...Control device, 91...Temperature control unit, 92...Lifting control unit, 93...Temperature acquisition unit, 94...Temperature information setting unit, 95...Temperature information storage unit, 96...Contact determination unit, 98...Operation unit, 99...Display device, 100...Heat treatment device, 110...Heat treatment plate, 200...Temperature measurement sheet, 211...Lower protective layer, 2 12…Lower fusion layer, 213…Upper fusion layer, 214…Upper protective layer, 230…Flat section, 240…Annular projection, 250…Resin film, 800…Substrate processing device, 810…Control device, 820…Transport device, 830…Coating processing section, 840…Developing processing section, 850…Heat processing section, 890…Exposure device, 909…CD-ROM, CA, CB…Center, GA…Gap, PR…Substrate processing area, TS0, TS1, TS2, TS3…Temperature sensor, W…Substrate, WL…Wiring, h13, h14, h16, h19…Through hole, p13…Convex section, vc…Virtual circle, vh…Vertical hole

Claims

1. A temperature measuring sheet for measuring the temperature of a heat treatment plate that has a processing surface and is used to measure the temperature of a substrate that is subjected to heat treatment, A sheet member provided on the processing surface, A temperature measuring sheet comprising one or more temperature sensors provided on the sheet member.

2. The aforementioned sheet member is A first sheet member provided on the processing surface, This includes a second sheet member laminated on the first sheet member, The temperature measuring sheet according to claim 1, wherein the one or more temperature sensors are sandwiched between the first sheet member and the second sheet member.

3. The heat treatment plate is provided with a plurality of support members that support the lower surface of the substrate, The temperature measuring sheet is placed on the processing surface, The temperature measuring sheet according to claim 1 or 2, wherein, of the sheet member, a plurality of through holes corresponding to the plurality of support members are formed in the portion where the temperature measuring sheet overlaps the plurality of support members when placed on the processing surface.

4. The aforementioned temperature measuring sheet is It is placed on the aforementioned processing surface, The temperature measuring sheet is placed on the processing surface, and its lower surface comes into contact with the processing surface. It has an upper surface facing in the opposite direction to the lower surface, The temperature measuring sheet according to claim 1 or 2, wherein a plurality of protrusions are formed on the upper surface, each supporting the lower surface of the substrate.

5. The one or more temperature sensors are multiple temperature sensors, The temperature measuring sheet according to claim 1 or 2, wherein the plurality of temperature sensors are dispersed in a plane perpendicular to the thickness direction of the sheet member.

6. The sheet member is made of resin or glass, and is a temperature measuring sheet according to claim 1 or 2.

7. A heat treatment plate having a processing surface and on which a substrate is placed to perform heat treatment, A temperature measuring sheet according to claim 1 or 2 is provided on the processing surface, A heat treatment apparatus comprising: a temperature control unit that controls the temperature of a heat treatment plate based on the temperature measurement results from one or more temperature sensors provided on the temperature measuring sheet.

8. A heat treatment plate having a processing surface and on which a substrate is placed to perform heat treatment, A plurality of support members are provided on the processing surface of the heat treatment plate and each supports the lower surface of the substrate, A temperature measuring sheet according to claim 3, which is placed on the processing surface, A temperature information storage unit stores information regarding the temperature change of the processing surface as reference temperature information from the time when a sample substrate of the same type as the substrate is placed on the plurality of support members, while the temperature of the processing surface is adjusted to a predetermined processing temperature, until a certain period of time has elapsed without the sample substrate coming into contact with the temperature measuring sheet. A heat treatment apparatus comprising: when the temperature of the processing surface is adjusted to the processing temperature and the substrate is placed on the plurality of support members, a contact determination unit that, based on the temperature measurement results of the one or more temperature sensors provided on the temperature measuring sheet, acquires the temperature change of the processing surface from the time the substrate is placed until a certain period of time has elapsed, and determines whether or not a portion of the substrate that is distorted downwards is in contact with the temperature measuring sheet based on the acquired temperature change of the processing surface and the reference temperature information.

9. A heat treatment plate having a processing surface and on which a substrate is placed to perform heat treatment, A temperature measuring sheet according to claim 4, which is placed on the processing surface, A temperature information storage unit stores, as reference temperature information, information regarding the temperature change of the processing surface from the time a sample substrate of the same type as the substrate is placed on the plurality of protrusions on the temperature measuring sheet, while the temperature of the processing surface is adjusted to a predetermined processing temperature, until a certain period of time has elapsed without the sample substrate contacting the portion of the upper surface of the temperature measuring sheet where the plurality of protrusions are not formed, A heat treatment apparatus comprising: when the temperature of the processing surface is adjusted to the processing temperature and the substrate is placed on the plurality of protrusions, a contact determination unit that, based on the temperature measurement results of the one or more temperature sensors provided on the temperature measuring sheet, acquires the temperature change of the processing surface from the time the substrate is placed until a certain period of time has elapsed, and determines whether or not a portion of the substrate that is distorted downwards is in contact with the portion of the upper surface of the temperature measuring sheet where the plurality of protrusions are not formed.

10. A temperature measurement method for measuring the temperature of a heat treatment plate having a processing surface and being placed on the processing surface for performing heat treatment on a substrate, The steps include: preparing a sheet member and a temperature measuring sheet including one or more temperature sensors provided on the sheet member; The steps include: providing the temperature measuring sheet on the processing surface of the heat treatment plate; A method for measuring the temperature of a heat-treated plate, comprising the step of measuring the temperature of one or more portions of the treatment surface using the one or more temperature sensors.

11. A heat treatment method for performing heat treatment on a substrate using a heat treatment apparatus, The heat treatment apparatus includes a heat treatment plate having a treatment surface and being placed on the treatment surface to perform heat treatment on the substrate, The aforementioned heat treatment method is The steps include: preparing a sheet member and a temperature measuring sheet including one or more temperature sensors provided on the sheet member; The steps include: providing the temperature measuring sheet on the processing surface of the heat treatment plate; The steps include measuring the temperature of one or more parts of the processing surface using the one or more temperature sensors, A heat treatment method comprising the step of controlling the temperature of the heat treatment plate based on the temperature measurement results from the one or more temperature sensors provided on the temperature measuring sheet.

12. A heat treatment method for performing heat treatment on a substrate using a heat treatment apparatus, The heat treatment apparatus is A heat treatment plate having a processing surface and being placed on the processing surface to perform heat treatment on the substrate, A plurality of support members are provided on the processing surface of the heat treatment plate and each supports the lower surface of the substrate, The process includes a temperature measuring sheet placed on the processing surface, The aforementioned temperature measuring sheet is A sheet member provided on the processing surface, The sheet member comprises one or more temperature sensors, In the portion of the temperature measuring sheet that overlaps with the plurality of support members when placed on the processing surface, a plurality of through holes corresponding to each of the plurality of support members are formed. The aforementioned heat treatment method is The steps include: storing information regarding the temperature change of the processing surface as reference temperature information from the time when a sample substrate of the same type as the substrate is placed on the plurality of support members, while the temperature of the processing surface is adjusted to a predetermined processing temperature, until a certain period of time has elapsed without the sample substrate coming into contact with the temperature measuring sheet; After the storage step, the substrate is placed on the plurality of support members with the temperature of the processing surface adjusted to the processing temperature, After the step of placing the substrate, the step of performing heat treatment on the substrate supported by the plurality of support members on the processing surface by adjusting the temperature of the processing surface to the processing temperature, The steps include measuring the temperature of the portion of the processing surface in which the plurality of support members are not provided using the one or more temperature sensors provided on the temperature measuring sheet, A heat treatment method comprising the steps of: when the substrate is placed on the plurality of support members with the temperature of the treatment surface adjusted to the treatment temperature, acquiring the temperature change of the treatment surface from the time the substrate is placed until a certain period of time has elapsed based on the temperature measurement results of the one or more temperature sensors, and determining whether a portion of the substrate that is distorted downwards is in contact with the temperature measuring sheet based on the acquired temperature change of the treatment surface and the reference temperature information.

13. A heat treatment method for performing heat treatment on a substrate using a heat treatment apparatus, The heat treatment apparatus is A heat treatment plate having a processing surface and being placed on the processing surface to perform heat treatment on the substrate, The process includes a temperature measuring sheet placed on the processing surface, The aforementioned temperature measuring sheet is The temperature measuring sheet has a lower surface that contacts the processing surface when placed on the processing surface, and an upper surface that faces in the opposite direction to the lower surface. The sheet member provided on the processing surface, and one or more temperature sensors provided on the sheet member, Multiple protrusions are formed on the upper surface, each supporting the lower surface of the substrate. The aforementioned heat treatment method is The steps include storing information regarding the temperature change of the processing surface as reference temperature information from the time a sample substrate of the same type as the substrate is placed on the plurality of protrusions on the temperature measuring sheet, while the temperature of the processing surface is adjusted to a predetermined processing temperature, until a certain period of time has elapsed without the sample substrate contacting the portion of the upper surface of the temperature measuring sheet where the plurality of protrusions are not formed; After the storage step, the substrate is placed on the plurality of protrusions with the temperature of the processing surface adjusted to the processing temperature, After the step of placing the substrate, the step of performing heat treatment on the substrate supported by the plurality of protrusions on the processing surface by adjusting the temperature of the processing surface to the processing temperature, The steps include measuring the temperature of the processing surface using the one or more temperature sensors provided on the temperature measuring sheet, A heat treatment method comprising the steps of: when the temperature of the treatment surface is adjusted to the treatment temperature and the substrate is placed on the plurality of protrusions, acquiring the temperature change of the treatment surface from the time the substrate is placed until a certain period of time has elapsed based on the temperature measurement results of the one or more temperature sensors, and determining whether a portion of the substrate that is distorted downwards is in contact with the portion of the upper surface of the temperature measuring sheet where the plurality of protrusions are not formed, based on the acquired temperature change of the treatment surface and the reference temperature information.

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