Light source modules and lighting fixtures
The light source module stabilizes temperature flux changes by using a cooling member and heating element to manage temperature differences between LED packages, reducing chromaticity shifts and maintaining consistent light color.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
- Filing Date
- 2024-12-25
- Publication Date
- 2026-07-07
Smart Images
Figure 2026113145000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure generally relates to a light source module and a lighting fixture. More specifically, the present disclosure relates to a light source module including a plurality of LED packages and a lighting fixture.
Background Art
[0002] Patent Document 1 discloses a projector having a plurality of light source units and a cooling unit. The plurality of light source units supply illumination light. The amounts of illumination light that change corresponding to temperature changes of the light source units are different from each other among the plurality of light source units. The cooling unit cools the light source units so that the amount of illumination light falls within a predetermined range based on the amount of illumination light when each of the plurality of light source units is at a reference temperature.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] In a light source module including a plurality of types of light source units (LED packages) as in the above-described projector, the total luminous flux of the light source units changes corresponding to the ambient temperature depending on the type of the light source unit, that is, the temperature-total luminous flux characteristics are different. For this reason, in the above light source module, the light color immediately after lighting may be different from the light color when the temperature is stable. That is, in the above light source module, a chromaticity shift may occur from immediately after lighting until the temperature becomes stable.
[0005] An object of the present disclosure is to provide a light source module and a lighting fixture capable of suppressing a chromaticity shift that occurs from immediately after lighting until the temperature becomes stable.
Means for Solving the Problems
[0006] A light source module according to one aspect of the present disclosure comprises a first LED package, a second LED package, a circuit component, a mounting substrate, and a cooling member. The first LED package emits first light. The second LED package emits second light different from the first light and has a smaller rate of change in temperature-total luminous flux characteristics than the first LED package. The circuit component constitutes a lighting circuit for controlling the lighting of the first LED package and the second LED package. The mounting substrate has a first surface and a second surface facing each other along the thickness direction, with the first LED package and the second LED package mounted on the first surface and the circuit component mounted on the second surface. The cooling member dissipates or absorbs heat generated by the first LED package. The cooling member is positioned on the second surface at a location where the heat is transferred.
[0007] A light source module according to one aspect of the present disclosure comprises a first LED package, a second LED package, a circuit component, a mounting substrate, and a heating element. The first LED package emits first light. The second LED package emits second light different from the first light, and its rate of change in temperature-total luminous flux characteristics is smaller than that of the first LED package. The circuit component controls the lighting of the first LED package and the second LED package. The mounting substrate has a first surface and a second surface facing each other along the thickness direction, with the first LED package and the second LED package mounted on the first surface and the circuit component mounted on the second surface. The heating element applies heat to the second LED package. The heating element is positioned on the second surface so that the heat is transferred to the second LED package.
[0008] A lighting fixture according to one aspect of this disclosure comprises the light source module and a fixture body. The fixture body houses the light source module. [Effects of the Invention]
[0009] According to this disclosure, there is an advantage in that it is possible to suppress the chromaticity shift that occurs from immediately after lighting up until the temperature stabilizes. [Brief explanation of the drawing]
[0010] [Figure 1] Figure 1 is a side view of the main part of the light source module according to this embodiment. [Figure 2] Figure 2 is a perspective view of the lighting fixture according to this embodiment. [Figure 3] Figure 3 is an exploded perspective view of the same lighting fixture. [Figure 4] Figure 4 is a cross-sectional view of the same lighting fixture. [Figure 5] Figure 5 is a top view of the same light source module. [Figure 6] Figure 6 is a side view of the main part of the light source module according to the first modified example shown above. [Figure 7] Figure 7 is a top view of the main part of the light source module according to the second modified example shown above. [Figure 8] Figure 8 is a cross-sectional view of the main part of the light source module according to the second modified example shown above, along the line VIII-VIII in Figure 7. [Figure 9] Figure 9 is a cross-sectional view of the main part of the light source module according to the third modified example shown above. [Figure 10] Figure 10 is a side view of the main part of the light source module according to the fourth modified example shown above. [Figure 11] Figure 11 is a side view of the main part of the light source module according to the fifth modified example shown above. [Modes for carrying out the invention]
[0011] The embodiments and modifications described below are merely examples of the present disclosure. This disclosure is not limited to these embodiments and modifications, and various modifications are possible depending on the design, etc., as long as they do not depart from the technical idea of the present disclosure. The figures described in the embodiments and modifications below are schematic diagrams, and the ratios of the size and thickness of each component in the figures do not necessarily reflect the actual dimensional ratios.
[0012] (Embodiment) (1) Overview Hereinafter, the overview of the light source module 20 according to the present embodiment will be described with reference to FIG. 1.
[0013] As shown in FIG. 1, the light source module 20 according to the present embodiment includes a first LED package L1, a second LED package L2, a circuit component 6, a mounting substrate 22, and a cooling member X1.
[0014] The first LED package L1 emits first light. The second LED package L2 emits second light different from the first light, and has a smaller rate of change in temperature-total luminous flux characteristics than the first LED package L1. Here, the "temperature-total luminous flux characteristics" referred to in the present disclosure indicates the characteristics in which the total luminous flux changes corresponding to the ambient temperature. That is, the second LED package L2 has a smaller change amount of the total luminous flux corresponding to the same change in ambient temperature than the first LED package L1. That is, the change amount of the total luminous flux in the second LED package L2 corresponding to a certain change in ambient temperature is smaller than the change amount of the total luminous flux in the first LED package L1 corresponding to the above change in ambient temperature.
[0015] The circuit component 6 constitutes a lighting circuit that controls the lighting of the first LED package L1 and the second LED package L2. The mounting substrate 22 has a first surface 221 and a second surface 222 that face each other along the thickness direction D1. The first LED package L1 and the second LED package L2 are mounted on the first surface 221 of the mounting substrate 22, and the circuit component 6 is mounted on the second surface 222 of the mounting substrate 22. The cooling member X1 radiates or absorbs the heat generated by the first LED package L1. The cooling member X1 is disposed at a position on the second surface 222 of the mounting substrate 22 where the heat generated by the first LED package L1 is transmitted.
[0016] In the light source module of the comparative example, on the substrate surface of the mounting substrate, a cooling member is not disposed at a position where heat generated by the first LED package is transmitted. Therefore, in the light source module of the comparative example, the ambient temperature in each of the first LED package and the second LED package rises similarly from immediately after lighting until the temperature stabilizes. As a result, since the change rate of the temperature-total luminous flux characteristic of the first LED package L1 is larger than that of the second LED package, the change amount of the total luminous flux of the first LED package from immediately after lighting until the temperature stabilizes may be larger than the change amount of the total luminous flux of the second LED package. From the above, in the light source module of the comparative example, a chromaticity shift may occur from immediately after lighting until the temperature stabilizes. As an example, in the light source module of the comparative example, when the junction temperature in each of the first LED package and the second LED package changes from 25 degrees to 60 degrees, the light emitted by the light source module has a color temperature shift of about 1000K.
[0017] On the other hand, in the light source module 20 of the present embodiment, the cooling member X1 is disposed on the second surface 222 of the mounting substrate 22 at a position where heat generated by the first LED package L1 is transmitted. Therefore, the ambient temperature of the first LED package L1 rises gently from immediately after lighting until the temperature stabilizes as compared with the ambient temperature of the second LED package L2. As a result, since the change rate of the temperature-total luminous flux characteristic of the first LED package L1 is larger than that of the second LED package L2, the difference between the change amount of the total luminous flux of the first LED package L1 and the change amount of the total luminous flux of the second LED package L2 from immediately after lighting until the temperature stabilizes can be suppressed. From the above, the light source module 20 of the present embodiment has an advantage that it can suppress the chromaticity shift generated from immediately after lighting until the temperature stabilizes.
[0018] (2) Detailed Configuration (2-1) Lighting Fixture Hereinafter, the detailed configuration of the lighting fixture 5 of the present embodiment will be described with reference to FIGS. 1 to 5.
[0019] As shown in Figures 2 to 4, the lighting fixture 5 of this embodiment comprises a light-emitting device 1 and a fixture body 50.
[0020] As shown in Figures 2 and 3, the fixture body 50 is formed in the shape of a long rectangular parallelepiped with the left-right direction as its longitudinal direction. As shown in Figure 3, the fixture body 50 has a rectangular rear wall 51, a front wall 52, an upper wall 53, and a lower wall 54. The upper wall 53 connects the upper end of the rear wall 51 and the upper end of the front wall 52. The lower wall 54 connects the lower end of the rear wall 51 and the lower end of the front wall 52. The fixture body 50 further has a square left side wall 55 and a right side wall 56. The left side wall 55 is connected to the left end of each of the rear wall 51, front wall 52, upper wall 53, and lower wall 54. The right side wall 56 is connected to the right end of each of the rear wall 51, front wall 52, upper wall 53, and lower wall 54. However, a rectangular opening 520 is provided in the front wall 52. It is preferable that the fixture body 50 be made of metal plate.
[0021] As shown in Figure 4, the light-emitting device 1 comprises a light source module 20, a light distribution control member 3, a housing 23 that houses the light source module 20, and a cover 24 that closes a window 233 provided in the housing 23.
[0022] In the following explanation, unless otherwise specified, the directions indicated by the front / back, up / down, and left / right arrows in Figures 1 and 2 are defined as the front / back, up / down, and left / right directions of the lighting fixture 5 and the light source module 20, respectively.
[0023] (2-2) Light source module As shown in Figures 1 and 5, the light source module 20 comprises a plurality of red LED packages 21A, a plurality of blue LED packages 21B, a plurality of green LED packages 21C, a mounting board 22, and circuit components 6.
[0024] (LED package) The red LED package 21A, the blue LED package 21B, and the green LED package 21C emit light of different colors from each other. Specifically, each of the multiple red LED packages 21A emits red light, each of the multiple blue LED packages 21B emits blue light, and each of the multiple green LED packages 21C emits green light.
[0025] Each of the multiple red LED packages 21A has a light-emitting element 211A, a reflector 212A, and an encapsulation material 213A, as shown in Figure 1. The light-emitting element 211A is an LED element whose light source color is red. The reflector 212A reflects the light emitted from the light-emitting element 211A forward. The reflector 212A is made of a metal material or has a reflective coating on its surface. The encapsulation material 213A covers and seals the light-emitting element 211A. The encapsulation material 213A is, for example, silicone resin, epoxy resin, or acrylic resin.
[0026] Each of the multiple blue LED packages 21B comprises a light-emitting element 211B, a reflector 212B, and an encapsulation material 213B. The light-emitting element 211B is an LED element whose light source color is blue. The reflector 212B and the encapsulation material 213B are configured similarly to the reflector 212A and the encapsulation material 213A, so a detailed explanation is omitted. The encapsulation material 213B may contain a yellow phosphor as a wavelength conversion material and have the function of converting the blue light emitted from the light-emitting element 211B into white light.
[0027] Similarly, each of the multiple green LED packages 21C has a light-emitting element 211C, a reflector 212C, and an encapsulation material 213C. The light-emitting element 211C is an LED element whose light source color is green. Note that the reflector 212C and the encapsulation material 213C have the same configuration as the reflector 212A and the encapsulation material 213A, so a detailed explanation is omitted.
[0028] Each of the multiple red LED packages 21A has a greater rate of change in temperature-total luminous flux characteristics than each of the multiple blue LED packages 21B and the multiple green LED packages 21C. In short, the amount of change in total luminous flux in each of the multiple red LED packages 21A in response to a certain change in ambient temperature is greater than the amount of change in total luminous flux in each of the multiple blue LED packages 21B and the multiple green LED packages 21C in response to the same change in ambient temperature.
[0029] As a concrete example, if we assume that the junction temperature of each of the multiple red LED packages 21A changes from 25 degrees to 60 degrees, the relative luminous flux ratio for each of the multiple red LED packages 21A is 0.78. On the other hand, if we assume that the junction temperature of each of the multiple blue LED packages 21B changes from 25 degrees to 60 degrees, the relative luminous flux ratio for each of the multiple blue LED packages 21B is 0.98. Similarly, if we assume that the junction temperature of each of the multiple green LED packages 21C changes from 25 degrees to 60 degrees, the relative luminous flux ratio for each of the multiple green LED packages 21C is 0.96. Here, "relative luminous flux ratio" refers to the ratio of the total luminous flux when the junction temperature is 60 degrees to the total luminous flux when the junction temperature is 25 degrees. In other words, the "relative luminous flux ratio" indicates the amount of change in total luminous flux when the junction temperature changes from 25 degrees to 60 degrees. Specifically, a "relative luminous flux ratio" closer to 1 indicates a smaller change in total luminous flux when the junction temperature changes from 25 degrees to 60 degrees, while a "relative luminous flux ratio" farther from 1 indicates a larger change in total luminous flux when the junction temperature changes from 25 degrees to 60 degrees.
[0030] The second LED package L2 in this disclosure has a smaller rate of change in temperature-total luminous flux characteristics than the first LED package L1. For this reason, the first LED package L1 in this disclosure is each of the multiple red LED packages 21A. On the other hand, the second LED package L2 in this disclosure is each of the multiple blue LED packages 21B and the multiple green LED packages 21C.
[0031] (Circuit components) Circuit component 6 constitutes a lighting circuit that controls the lighting of multiple red LED packages 21A, multiple blue LED packages 21B, and multiple green LED packages 21C. Specifically, the lighting circuit controls the lighting of the first LED package L1 and the second LED package L2.
[0032] The above lighting circuit comprises a first lighting circuit, a second lighting circuit, a third lighting circuit, and a control circuit. The first lighting circuit supplies direct current to multiple red LED packages 21A to light them up. Similarly, the second lighting circuit supplies direct current to multiple blue LED packages 21B to light them up, and the third lighting circuit supplies direct current to multiple green LED packages 21C to light them up. The control circuit controls the first lighting circuit, the second lighting circuit, and the third lighting circuit. The control circuit is configured to adjust the output current (direct current) of the first lighting circuit, the second lighting circuit, and the third lighting circuit (direct current) individually in response to a control signal given from outside the lighting fixture 5, thereby dimming and adjusting the color of the light emitted from the light source module 20.
[0033] (Platform) As shown in Figures 1 and 4, the mounting substrate 22 has a first surface 221 and a second surface 222 that face each other along the thickness direction D1. The thickness direction D1 of the mounting substrate 22 is aligned with the front-to-back direction. Therefore, in the mounting substrate 22, the first surface 221 is the front surface and the second surface 222 is the rear surface. The mounting substrate 22 is formed in a long rectangular shape.
[0034] Multiple red LED packages 21A, multiple blue LED packages 21B, and multiple green LED packages 21C are mounted on the first side 221 of the mounting board 22. On the other hand, circuit components 6 are mounted on the second side 222 of the mounting board 22.
[0035] As shown in Figure 5, the multiple red LED packages 21A, multiple blue LED packages 21B, and multiple green LED packages 21C are mounted on the first surface 221 in a line along the longitudinal direction (i.e., left-right direction) of the mounting substrate 22. More specifically, the multiple red LED packages 21A, multiple blue LED packages 21B, and multiple green LED packages 21C are mounted on the first surface 221 in a line along the center line CL1 of the mounting substrate 22 (the axis of symmetry of the rectangle that is the outer shape of the mounting substrate 22). In this embodiment, the multiple red LED packages 21A, multiple blue LED packages 21B, and multiple green LED packages 21C are mounted on the first surface 221 in a repeating order of blue LED package 21B, green LED package 21C, and red LED package 21A.
[0036] The mounting substrate 22 of this embodiment is formed of a metallic material. Here, "metallic material" refers to, for example, iron, aluminum, copper, and stainless steel (SUS). This configuration has the advantage that heat generated in the first LED package L1 (each of the multiple red LED packages 21A) is more easily transferred to the cooling member X1, which will be described later and mounted on the second surface 222 of the mounting substrate 22. Furthermore, the heating member Y1, which will be described later and mounted on the second surface 222 of the mounting substrate 22, is more easily transferred to the second LED package L2 (each of the multiple blue LED packages 21B and multiple green LED packages 21C). It is desirable that the first surface 221 and the second surface 222 are insulated.
[0037] (Cooling component) The light source module 20 includes a cooling member X1 that dissipates or absorbs heat generated in the first LED package L1 (each of the multiple red LED packages 21A). The cooling member X1 is positioned on the second surface 222 of the mounting substrate 22 at a location to which heat generated in the first LED package L1 is transferred. The light source module 20 of this embodiment includes multiple cooling members X1. The multiple cooling members X1 correspond one-to-one with the multiple first LED packages L1 and are positioned at a location to which heat generated in the corresponding first LED package L1 is transferred.
[0038] In this disclosure, the "location to which heat generated in the first LED package L1 is transferred" is preferably a location that overlaps with at least a portion of the first LED package L1 in the thickness direction D1 (front-to-back direction) of the mounting substrate 22. However, the "location to which heat generated in the first LED package L1 is transferred" is not limited to a location that overlaps with at least a portion of the first LED package L1, but is sufficient if it is a location to which at least a portion of the heat generated in the first LED package L1 is transferred to the cooling member X1 via the mounting substrate 22.
[0039] The cooling element X1 of this embodiment consists of a metal block 7 that dissipates the heat generated in the first LED package L1 and a Peltier module 8 that absorbs the heat. With this configuration, the ambient temperature of the first LED package L1 rises more gradually than the ambient temperature of the second LED package L2 from immediately after lighting until the temperature stabilizes. As a result, the light source module 20 of this embodiment can further suppress the difference between the change in total luminous flux of the first LED package L1 and the change in total luminous flux of the second LED package L2 from immediately after lighting until the temperature stabilizes. Thus, the light source module 20 of this embodiment has the advantage of being able to further suppress the chromaticity shift that occurs from immediately after lighting until the temperature stabilizes.
[0040] The metal block 7 has a higher thermal conductivity than the first LED package L1. The metal block 7 dissipates the heat generated in the first LED package L1 and conducted to the metal block 7 by conducting it to the side opposite to the side mounted on the mounting substrate 22 (the rear side). More specifically, the metal block 7 dissipates the heat generated in the first LED package L1 and conducted to the metal block 7 to the inside of the housing 23 (see Figure 4). The metal block 7 is made of materials such as aluminum, copper, and stainless steel (SUS). As an example, the metal block 7 is formed in the shape of a rectangular plate.
[0041] The Peltier module 8 absorbs heat generated in the first LED package L1 when powered. For example, the Peltier module 8 has multiple Peltier elements and a heat-absorbing electrode, and when the multiple Peltier elements are energized, the heat-absorbing electrode which is thermally coupled to the multiple Peltier elements is cooled, and the heat generated in the first LED package L1 is absorbed.
[0042] (Heating component) The light source module 20 includes a heating element Y1 that applies a second heat, different from the first heat generated in the first LED package L1, to each of the second LED packages L2 (each of the multiple blue LED packages 21B and the multiple green LED packages 21C). The heating element Y1 is positioned on the second surface 222 of the mounting substrate 22 so that the second heat is transmitted to the second LED package L2. The light source module 20 of this embodiment includes multiple heating elements Y1. The multiple heating elements Y1 correspond one-to-one with the multiple second LED packages L2 and are positioned so that the second heat is transmitted to the corresponding second LED package L2.
[0043] In this disclosure, the "position where the above-mentioned second heat is transmitted to the second LED package L2" is preferably a position that overlaps with at least a portion of the second LED package L2 in the thickness direction D1 (front-to-back direction) of the mounting substrate 22. However, the "position where the above-mentioned second heat is transmitted to the second LED package L2" in this disclosure is not limited to a position that overlaps with at least a portion of the second LED package L2, but is only required to be a position where at least a portion of the above-mentioned second heat is transmitted to the second LED package L2 via the mounting substrate 22.
[0044] As shown in Figure 1, the heating element Y1 in this embodiment is at least one heat-generating component, such as a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) 61, a resistor 62, and a winding 63, which are used as part of the circuit component 6. The heating element Y1 in this embodiment adds the heat generated when controlling the lighting of the first LED package L1 and the second LED package L2 as the second heat described above to the second LED package L2. This configuration has the advantage that it does not require the use of a component different from the circuit component 6 as the heating element Y1, and the number of components mounted on the mounting board 22 can be reduced.
[0045] (2-3) Casing, cover As shown in Figure 3, the housing 23 has a cylindrical main body portion 230 and side portions (first side portion 231 and second side portion 232) attached to both ends of the main body portion 230 in the longitudinal direction (axial direction).
[0046] The main body 230 is formed in a hollow cylindrical shape from, for example, an extruded aluminum or aluminum alloy. A rectangular window 233 is open on the front surface of the main body 230. Also, as shown in Figure 4, one groove 234 is provided on each front end of the inner surface of the main body 230. The light source module 20 is supported by the main body 230 by fitting both ends (upper and lower ends) of the mounting substrate 22 along the longitudinal direction into these pair of grooves 234. The light source module 20 is supported by the main body 230 such that the first surface 221 (front) of the mounting substrate 22 faces the window 233 of the main body 230.
[0047] As shown in Figure 3, the first side portion 231 and the second side portion 232 are each formed in a flat plate shape from aluminum or an aluminum alloy. The first side portion 231 is screwed to one end (left end) in the longitudinal direction of the main body portion 230. The second side portion 232 is screwed to the other end (right end) in the longitudinal direction of the main body portion 230. In other words, both ends in the longitudinal direction of the main body portion 230 are closed by the first side portion 231 and the second side portion 232.
[0048] As shown in Figures 3 and 4, the cover 24 is formed from a material that is transparent to visible light (for example, inorganic glass such as quartz glass, or organic glass such as acrylic resin or polycarbonate resin), and is shaped as if a part of the cylinder has been cut out along the axial direction of the cylinder. The cover 24 is attached to the housing 23 so as to block the window 233. The light emitted from the light source module 20 passes through the cover 24 and is emitted out of the housing 23. Since the red LED package 21A, the blue LED package 21B, and the green LED package 21C are wide-angle light distribution LED packages, the light emitted from the light source module 20 is emitted from almost the entire surface (front) of the cover 24.
[0049] As shown in Figure 4, the light source unit 2 is housed inside the fixture body 50 with its cover 24 facing the opening 520 in the front wall 52. Here, recesses 235 are provided on the upper and lower surfaces of the housing 23 of the light source unit 2. On the other hand, a pair of protrusions 57 are provided on the right side of the left wall 55 and the left side of the right wall 56 of the fixture body 50. As shown in Figures 3 and 4, the pair of protrusions 57 provided on the left wall 55 and the right wall 56 fit into the recesses 235 on the upper and lower surfaces of the housing 23, thereby positioning the housing 23 relative to the fixture body 50.
[0050] (2-4) Light distribution control member The light distribution control member 3 is housed inside the fixture body 50. As shown in Figure 4, the light distribution control member 3 is mounted on the rear surface of the front wall 52 with its first surface 301 facing the light source unit 2 and its opening 520 closed by the base plate 30. The light distribution control member 3 is fixed to the fixture body 50 so that the optical axis of the lens 31 aligns with the optical axes (centers of the light-emitting elements 211A, 211B, and 211C) of the multiple LED packages (red LED package 21A, blue LED package 21B, and green LED package 21C) in the light source module 20. The light-emitting device 1 achieves a narrow-angle light distribution characteristic by focusing the light emitted from the light source module 20 at a wide angle with the lens 31 of the light distribution control member 3.
[0051] (3) Advantages The light source module 20 of this embodiment comprises a first LED package L1, a second LED package L2, a circuit component 6, a mounting substrate 22, and a cooling member X1. The first LED package L1 emits first light. The second LED package L2 emits second light different from the first light, and has a smaller rate of change in temperature-total luminous flux characteristics than the first LED package L1. The circuit component 6 constitutes a lighting circuit that controls the lighting of the first LED package L1 and the second LED package L2. The mounting substrate 22 has a first surface 221 and a second surface 222 that face each other along the thickness direction D1. The first LED package L1 and the second LED package L2 are mounted on the first surface 221 of the mounting substrate 22, and the circuit component 6 is mounted on the second surface 222. The cooling member X1 dissipates or absorbs heat generated by the first LED package L1. The cooling element X1 is positioned on the second surface 222 of the mounting substrate 22 at a location where heat generated by the first LED package L1 is transferred. As a result, the ambient temperature of the first LED package L1 rises more gradually than the ambient temperature of the second LED package L2 from immediately after lighting until the temperature stabilizes. Consequently, the light source module 20 of this embodiment can suppress the difference between the change in total luminous flux of the first LED package L1 and the change in total luminous flux of the second LED package L2 from immediately after lighting until the temperature stabilizes. Therefore, the light source module 20 of this embodiment has the advantage of being able to suppress the chromaticity shift that occurs from immediately after lighting until the temperature stabilizes.
[0052] In the light source module 20 of this embodiment, the cooling member X1 is a metal block 7 that has a higher thermal conductivity than the first LED package L1 and dissipates the heat generated in the first LED package L1. As a result, the ambient temperature of the first LED package L1 rises more gradually from immediately after lighting up until the temperature stabilizes, compared to the ambient temperature of the second LED package L2. Consequently, the light source module 20 of this embodiment can further suppress the difference between the change in total luminous flux of the first LED package L1 and the change in total luminous flux of the second LED package L2 from immediately after lighting up until the temperature stabilizes. Therefore, the light source module 20 of this embodiment has the advantage of being able to further suppress the chromaticity shift that occurs from immediately after lighting up until the temperature stabilizes.
[0053] In the light source module 20 of this embodiment, the cooling member X1 is a Peltier module 8 that absorbs heat generated by the first LED package L1. As a result, the ambient temperature of the first LED package L1 rises more gradually than the ambient temperature of the second LED package L2 from immediately after lighting until the temperature stabilizes. Consequently, the light source module 20 of this embodiment can further suppress the difference between the change in total luminous flux of the first LED package L1 and the change in total luminous flux of the second LED package L2 from immediately after lighting until the temperature stabilizes. Therefore, the light source module 20 of this embodiment has the advantage of being able to further suppress the chromaticity shift that occurs from immediately after lighting until the temperature stabilizes.
[0054] In the light source module 20 of this embodiment, the mounting substrate 22 is made of a metal material. This has the advantage that the heat generated in the first LED package L1 (each of the multiple red LED packages 21A) is more easily transferred to the cooling member X1 mounted on the second surface 222 of the mounting substrate 22. Furthermore, this has the advantage that the heating member Y1 mounted on the second surface 222 of the mounting substrate 22 is more easily transferred to the second LED package L2 (each of the multiple blue LED packages 21B and the multiple green LED packages 21C).
[0055] The light source module 20 of this embodiment includes a heating element Y1 that applies a second heat, different from the first heat generated in the first LED package L1, to the second LED package L2. The heating element Y1 is positioned on the second surface 222 of the mounting substrate 22 so that the second heat is transferred to the second LED package L2. As a result, the ambient temperature of the first LED package L1 rises more gradually than the ambient temperature of the second LED package L2 from immediately after lighting until the temperature stabilizes. Consequently, the light source module 20 of this embodiment can further suppress the difference between the change in total luminous flux of the first LED package L1 and the change in total luminous flux of the second LED package L2 from immediately after lighting until the temperature stabilizes.
[0056] In the light source module 20 of this embodiment, the heating element Y1 is at least one heat-generating component, such as a MOSFET 61, a resistor 62, and a winding 63, which are used as part of the circuit component 6. The heat generated when controlling the lighting of the first LED package L1 and the second LED package L2 is added to the second LED package L2 as the second heat. This eliminates the need to use a component different from the circuit component 6 as the heating element Y1, which has the advantage of reducing the number of components mounted on the mounting board 22.
[0057] (4) Variations The embodiments described above are merely one of many embodiments of this disclosure. The embodiments described above can be modified in various ways depending on the design, etc., as long as the objectives of this disclosure are achieved. The following modifications may be implemented by combining them as appropriate. Components similar to those in the embodiments described above are denoted by the same reference numerals and their description is omitted.
[0058] (4-1) First variation In the light source module 20 of the above-described embodiment, the heating element Y1 is at least one heat-generating component, such as a MOSFET 61, a resistor 62, and a winding 63, which are used as part of the circuit component 6. However, in the first modified light source module 20a shown in Figure 6, the heating element Y1 consists of at least one heat-generating component, such as a MOSFET 61, a resistor 62, and a winding 63, which are used as part of the circuit component 6, and a heater module 9. Note that the heating element Y1 may consist only of the heater module 9.
[0059] Compared to the MOSFET 61, resistor 62, or winding 63 used as part of the circuit components 6, the heater module 9 has fewer constraints on wiring and other aspects, thus offering greater flexibility when mounting it on the mounting board 22. Therefore, the configuration of the light source module 20a in the first modified example has the advantage of making it easier to position the heater module 9, which is the heating element Y1, in a location where heat is transferred to the second LED package L2.
[0060] The heater module 9, when powered, generates heat (second heat, which is different from the first heat generated in the first LED package L1) that is applied to the second LED package L2. The heater module 9, which is the heating element Y1, is positioned on the second surface 222 of the mounting substrate 22 so that the second heat is transferred to the second LED package L2.
[0061] The heater module 9 shown in Figure 6 is mounted on the second surface 222 in a position that overlaps with at least a portion of each of the blue LED package 21B and the green LED package 21C mounted adjacent to each other on the first surface 221. In other words, the heater module 9 is mounted on the second surface 222 so as to be located between the blue LED package 21B and the green LED package 21C mounted adjacent to each other on the first surface 221 in the left-right direction. Therefore, the heater module 9 applies the second heat described above to both the blue LED package 21B and the green LED package 21C.
[0062] Furthermore, in the first modified light source module 20a, the heating element Y1, which is the MOSFET 61, is mounted on the second surface 222 in a position that overlaps with at least a portion of each of the blue LED package 21B and the green LED package 21C, which are mounted adjacent to each other on the first surface 221. That is, the MOSFET 61 of the first modified example is mounted on the second surface 222 so as to be located between the blue LED package 21B and the green LED package 21C, which are mounted adjacent to each other on the first surface 221, in the left-right direction. Therefore, the MOSFET 61 of the first modified example adds the heat generated when controlling the lighting as the second heat mentioned above to both the blue LED package 21B and the green LED package 21C.
[0063] Similarly, the heating element Y1, which is the winding 63, is mounted on the second surface 222 in a position that overlaps with at least a portion of each of the blue LED package 21B and the green LED package 21C, which are mounted adjacent to each other on the first surface 221. That is, in the first modified example, the winding 63 is mounted on the second surface 222 so as to be located between the blue LED package 21B and the green LED package 21C, which are mounted adjacent to each other on the first surface 221, in the left-right direction. Therefore, the winding 63 in the first modified example adds the heat generated when controlling the lighting as the second heat to both the blue LED package 21B and the green LED package 21C.
[0064] Furthermore, in the first modified light source module 20a, the Peltier module 8, which is the cooling element X1, is mounted in a position that overlaps with at least a portion of each of the two red LED packages 21A mounted adjacent to each other on the first surface 221. That is, in the first modified example, the Peltier module 8 is mounted on the second surface 222 so as to be located between the two red LED packages 21A mounted adjacent to each other on the first surface 221 in the left-right direction. As a result, the Peltier module 8 absorbs the heat generated by each of the two red LED packages 21A.
[0065] In the first modified light source module 20a, the metal block 7, which is the cooling element X1, is mounted in a position that overlaps with at least a portion of one red LED package 21A. Alternatively, the metal block 7 may be mounted in a position that overlaps with at least a portion of each of two adjacent red LED packages 21A. In this case, similarly, the metal block 7 dissipates the heat generated in each of the two red LED packages 21A.
[0066] (4-2) Second variation In the second modified light source module 20b shown in Figures 7 and 8, the mounting substrate 22 is provided with vias B1 that are thermally coupled to the cooling member X1 and penetrate the mounting substrate 22 in the thickness direction D1. This configuration has the advantage that, regardless of the material of the mounting substrate 22, the heat generated in the first LED package L1 (each of the multiple red LED packages 21A) is more easily transferred to the cooling member X1 mounted on the second surface 222 of the mounting substrate 22. For example, even if the mounting substrate 22 is made of a resin material with low thermal conductivity, the heat generated in the first LED package L1 is more easily transferred to the cooling member X1.
[0067] In the second modified light source module 20b shown in Figure 7, the mounting substrate 22 is provided with a plurality (8) of vias B1. The 8 vias B1 are formed to surround the first LED package L1. Two of the 8 vias B1 are formed on the upper side of the first LED package L1, and two of the 8 vias B1 are formed on the lower side of the first LED package L1. Similarly, two of the 8 vias B1 are formed on the left side of the first LED package L1, and two of the 8 vias B1 are formed on the right side of the first LED package L1.
[0068] As shown in Figure 8, each of the eight vias B1 penetrates the mounting substrate 22 in the thickness direction D1 of the mounting substrate 22. A metal foil 223 is provided between the second surface 222 of the mounting substrate 22 and the cooling member X1, and the rear end of each of the eight vias B1 is connected to the metal foil 223. In other words, each of the eight vias B1 is thermally bonded to the cooling member X1. The metal foil 223 is, for example, copper foil.
[0069] The front end of each of the eight vias B1 is not connected to the first LED package L1. Therefore, heat generated in the first LED package L1 is transferred to each of the eight vias B1 through the space between each of the eight vias B1 and the first LED package L1. However, the front end of each of the eight vias B1 may be insulated and connected to the first LED package L1.
[0070] (4-3) Third variation In the third modified light source module 20c shown in Figure 9, the mounting substrate 22 is provided with vias B2 that are thermally coupled to the heating element Y1 and penetrate the mounting substrate 22 in the thickness direction D1. This configuration has the advantage that, regardless of the material of the mounting substrate 22, the heating element Y1 mounted on the second surface 222 of the mounting substrate 22 can more easily transfer heat to the second LED package L2. For example, even if the mounting substrate 22 is made of a resin material with low thermal conductivity, the heating element Y1 can more easily transfer heat to the second LED package L2.
[0071] In the third modified light source module 20c, similar to the multiple vias B1 in the second modified light source module 20b (see Figure 7), the mounting substrate 22 is provided with multiple (eight) vias B2. The eight vias B2 are formed to surround the second LED package L2. Two of the eight vias B2 are formed on the upper side of the second LED package L2, and two of the eight vias B2 are formed on the lower side of the second LED package L2. Similarly, two of the eight vias B2 are formed on the left side of the second LED package L2, and two of the eight vias B2 are formed on the right side of the second LED package L2.
[0072] As shown in Figure 9, each of the eight vias B2 penetrates the mounting substrate 22 in the thickness direction D1 of the mounting substrate 22. A metal foil 223 is provided between the second surface 222 of the mounting substrate 22 and the heating element Y1, and the rear end of each of the eight vias B2 is connected to the metal foil 223. That is, each of the eight vias B2 is thermally coupled to the heating element Y1. The metal foil 223 is, for example, copper foil. It is desirable that the surface 224 (rear surface) of the metal foil 223 that is in contact with the heating element Y1 be insulated.
[0073] The front end of each of the eight vias B2 is not connected to the second LED package L2. Therefore, heat generated in the second LED package L2 is transferred to each of the eight vias B2 through the space between each of the eight vias B2 and the second LED package L2. However, the front end of each of the eight vias B2 may be insulated and connected to the second LED package L2.
[0074] (4-4) Fourth variation The light source module 20 in the above-described embodiment includes a cooling member X1 and a heating member Y1. However, as shown in Figure 10, the light source module 20d of the fourth modified example includes only the cooling member X1 and does not include the heating member Y1. In other words, the light source module 20 may include only the cooling member X1.
[0075] In the fourth modified light source module 20d, the cooling member X1 is positioned on the second surface 222 of the mounting substrate 22 at a location where heat generated by the first LED package L1 is transferred. More specifically, in the fourth modified light source module 20d, at least one of the cooling member X1, a metal block 7 and a Peltier module 8, is positioned on the second surface 222 of the mounting substrate 22 at a location that overlaps with at least a portion of the first LED package L1. In the fourth modified light source module 20d shown in Figure 10, the cooling member X1, a metal block 7 or a Peltier module 8, is positioned on the second surface 222 of the mounting substrate 22 at a location that overlaps with at least a portion of the first LED package L1.
[0076] On the other hand, in the fourth modified light source module 20d, the heating element Y1 is not positioned on the second surface 222 of the mounting substrate 22 at a location where heat is transferred to the second LED package L2. More specifically, in the fourth modified light source module 20d, the heating element Y1, which is the MOSFET 61, resistor 62, winding 63, or heater module 9, is not positioned on the second surface 222 of the mounting substrate 22 at a location that overlaps with at least a portion of the second LED package L2.
[0077] (4-5) Fifth variation The light source module 20 in the above-described embodiment includes a cooling member X1 and a heating member Y1. However, as shown in Figure 11, the light source module 20e of the fifth modification includes only the heating member Y1 and does not include the cooling member X1. In other words, the light source module 20 may include only the heating member Y1.
[0078] In the fifth modified light source module 20e, the heating element Y1 is positioned on the second surface 222 of the mounting substrate 22 at a location where heat is transferred to the second LED package L2. More specifically, in the fifth modified light source module 20e, at least one of the heating element Y1, consisting of a MOSFET 61, a resistor 62, a winding 63, and a heater module 9, is positioned on the second surface 222 of the mounting substrate 22 at a location overlapping with at least a portion of the second LED package L2. In the fifth modified light source module 20e shown in Figure 11, the heating element Y1, consisting of a MOSFET 61, a resistor 62, a winding 63, or a heater module 9, is positioned on the second surface 222 of the mounting substrate 22 at a location overlapping with at least a portion of the second LED package L2.
[0079] On the other hand, in the fifth modified light source module 20e, the cooling member X1 is not placed on the second surface 222 of the mounting substrate 22 at a location where heat generated by the first LED package L1 is transferred. More specifically, in the fifth modified light source module 20e, the metal block 7 or Peltier module 8, which is the cooling member X1, is not placed on the second surface 222 of the mounting substrate 22 at a location that overlaps with at least a portion of the first LED package L1.
[0080] (4-6) Other modifications The following lists other modifications of the embodiments described above.
[0081] In the above-described embodiment, the multiple cooling members X1 correspond one-to-one with the multiple first LED packages L1 and are positioned to receive heat generated by the corresponding first LED packages L1. However, the cooling members X1 may correspond one-to-one with any of the multiple first LED packages L1 and be positioned to receive heat generated by the corresponding first LED packages L1. In other words, at least one of the multiple first LED packages L1 do not correspond to the cooling member X1, and the cooling member X1 does not need to be positioned to receive heat generated by the above-mentioned at least one first LED package L1.
[0082] Similarly, in the above-described embodiment, the multiple heating members Y1 correspond one-to-one with the multiple second LED packages L2 and are positioned so that heat is transferred to the corresponding second LED packages L2. However, the heating members Y1 may also correspond one-to-one with any of the multiple second LED packages L2 and be positioned so that heat is transferred to the corresponding second LED package L2. In other words, at least one of the multiple second LED packages L2 does not correspond to the heating member Y1, and the heating member Y1 does not have to be positioned so that heat is transferred to the above-described at least one second LED package L2.
[0083] In the above-described embodiment, the mounting substrate 22 is formed of a metal material, but it may also be formed of a resin material.
[0084] (summary) The light source module (20, 20a~20d) of the first embodiment comprises a first LED package (L1), a second LED package (L2), a circuit component (6), a mounting substrate (22), and a cooling member (X1). The first LED package (L1) emits first light. The second LED package (L2) emits second light different from the first light, and has a smaller rate of change in temperature-total luminous flux characteristics than the first LED package (L1). The circuit component (6) constitutes a lighting circuit that controls the lighting of the first LED package (L1) and the second LED package (L2). The mounting substrate (22) has a first surface (221) and a second surface (222) facing each other along the thickness direction (D1), with the first LED package (L1) and the second LED package (L2) mounted on the first surface (221) and the circuit component (6) mounted on the second surface (222). The cooling element (X1) dissipates or absorbs heat generated in the first LED package (L1). The cooling element (X1) is positioned on the second surface (222) where heat is transferred.
[0085] This embodiment has the advantage of being able to suppress the chromaticity shift that occurs from immediately after lighting until the temperature stabilizes.
[0086] In the light source modules (20, 20a~20d) of the second embodiment, the cooling member (X1) is a metal block (7) that has a higher thermal conductivity than the first LED package (L1) and dissipates heat, as in the first embodiment.
[0087] This embodiment has the advantage of being able to further suppress the chromaticity shift that occurs from immediately after lighting until the temperature stabilizes.
[0088] In the third embodiment of the light source module (20, 20a~20d), the cooling member (X1) is a Peltier module (8) that absorbs heat, as in the first embodiment.
[0089] This embodiment has the advantage of being able to further suppress the chromaticity shift that occurs from immediately after lighting until the temperature stabilizes.
[0090] In the fourth embodiment of the light source module (20, 20a to 20d), in any one of the first to third embodiments, the mounting substrate (22) is formed of a metallic material.
[0091] This embodiment has the advantage that the heat generated in the first LED package (L1) is more easily transferred to the cooling element (X1).
[0092] In the fifth embodiment of the light source module (20, 20a to 20d), in any one of the first to fourth embodiments, the mounting substrate (22) is provided with vias (B1) that are thermally coupled to a cooling member (X1) and penetrate the mounting substrate (22) in the thickness direction (D1).
[0093] This embodiment has the advantage that the heat generated in the first LED package (L1) is more easily transferred to the cooling element (X1).
[0094] The light source module (20, 20a to 20d) of the sixth embodiment further comprises a heating element (Y1) that, in any one of the first to fifth embodiments, applies a second heat, which is different from the first heat, to the second LED package (L2). The heating element (Y1) is positioned on the second surface (222) at a location where the second heat is transferred to the second LED package (L2).
[0095] This embodiment has the advantage of being able to further suppress the chromaticity shift that occurs from immediately after lighting until the temperature stabilizes.
[0096] In the light source module (20, 20a~20d) of the seventh embodiment, the heating element (Y1) is a heater module, as in the sixth embodiment.
[0097] This embodiment has the advantage of making it easier to position the heating element (Y1) in a location where the second heat is transferred to the second LED package (L2).
[0098] In the eighth embodiment of the light source module (20, 20a to 20d), in the sixth embodiment, the heating element (Y1) is at least one heat-generating component of a MOSFET (61), a resistor (62), and a winding (63) used as part of the circuit component (6). The heating element (Y1) adds the heat generated when controlling the lighting of the first LED package (L1) and the second LED package (L2) as second heat to the second LED package (L2).
[0099] According to this embodiment, there is no need to use a component different from the circuit component (6) as the heating element (Y1), and there is an advantage in that the number of components mounted on the mounting board (22) can be reduced.
[0100] In the light source module (20, 20a~20d) of the ninth embodiment, in any one of the sixth to eighth embodiments, the mounting substrate (22) is provided with vias (B2) that are thermally coupled to the heating element (Y1) and penetrate the mounting substrate (22) in the thickness direction (D1).
[0101] This embodiment has the advantage that the heating element (Y1) can more easily transfer heat to the second LED package (L2).
[0102] The tenth embodiment of the light source module (20, 20a~20c, 20e) comprises a first LED package (L1), a second LED package (L2), a circuit component (6), a mounting substrate (22), and a heating element (Y1). The first LED package (L1) emits first light. The second LED package (L2) emits second light different from the first light, and its rate of change in temperature-total luminous flux characteristics is smaller than that of the first LED package (L1). The circuit component (6) controls the lighting of the first LED package (L1) and the second LED package (L2). The mounting substrate (22) has a first surface (221) and a second surface (222) facing each other along the thickness direction (D1), with the first LED package (L1) and the second LED package (L2) mounted on the first surface (221) and the circuit component (6) mounted on the second surface (222). The heating element (Y1) applies heat to the second LED package (L2). The heating element (Y1) is positioned on the second surface (222) so that heat is transferred to the second LED package (L2).
[0103] This embodiment has the advantage of being able to suppress the chromaticity shift that occurs from immediately after lighting until the temperature stabilizes.
[0104] In the 11th embodiment of the light source module (20, 20a to 20c, 20e), the heating element (Y1) is a heater module, as in the 10th embodiment.
[0105] This embodiment has the advantage of making it easier to position the heating element (Y1) in a location where heat is transferred to the second LED package (L2).
[0106] In the twelfth embodiment of the light source module (20, 20a to 20c, 20e), in the tenth embodiment, the heating element (Y1) is at least one heat-generating component of a MOSFET (61), a winding (63), and a resistor (62) used as part of the circuit component (6). The heating element (Y1) applies the heat generated when controlling the lighting of the first LED package (L1) and the second LED package (L2) to the second LED package (L2).
[0107] According to this embodiment, there is no need to use a component different from the circuit component (6) as the heating element (Y1), and there is an advantage in that the number of components mounted on the mounting board (22) can be reduced.
[0108] In the light source module of the 13th embodiment (20, 20a to 20c, 20e), in any one of the 10th to 12th embodiments, the mounting substrate (22) is provided with vias (B2) that are thermally connected to the heating element (Y1) and penetrate the first surface (221) and the second surface (222).
[0109] This embodiment has the advantage that the heating element (Y1) can more easily transfer heat to the second LED package (L2).
[0110] In the light source module (20, 20a to 20c, 20e) of the 14th embodiment, in any one of the 10th to 13th embodiments, the mounting substrate (22) is formed of a metallic material.
[0111] This embodiment has the advantage that the heating element (Y1) can more easily transfer heat to the second LED package (L2).
[0112] The 15th embodiment of the lighting fixture (5) comprises a light source module (20, 20a to 20c, 20e) relating to any one of the 1st to 14th embodiments, and a fixture body (50). The fixture body (50) houses the light source module (20, 20a to 20c, 20e).
[0113] This embodiment has the advantage of being able to suppress the chromaticity shift that occurs from immediately after lighting until the temperature stabilizes. [Explanation of Symbols]
[0114] 20, 20a~20e Light source module 22 Implemented circuit board 221 Page 1 222 2nd page 5 Lighting fixtures 50 Main body of the device 6 Circuit Components 61 MOSFET 62 resistors 63 Winding 7 Metal Blocks 8 Peltier modules B1 Beer B2 Beer D1 Thickness direction L1 1st LED Package L2 2nd LED Package X1 Cooling component Y1 Heating element
Claims
1. A first LED package that emits first light, A second LED package that emits a second light different from the first light, and has a smaller rate of change in temperature-total luminous flux characteristics than the first LED package, Circuit components constituting a lighting circuit for controlling the lighting of the first LED package and the second LED package, A mounting substrate having a first surface and a second surface facing each other along the thickness direction, wherein the first LED package and the second LED package are mounted on the first surface and the circuit components are mounted on the second surface, The first LED package comprises a cooling member that dissipates or absorbs heat generated in the first LED package, The cooling member is positioned on the second surface at a location where the heat is transferred. Light source module.
2. The cooling member is a metal block that has a higher thermal conductivity than the first LED package and dissipates the heat. The light source module according to claim 1.
3. The cooling element is a Peltier module that absorbs the heat. The light source module according to claim 1.
4. The aforementioned mounting substrate is made of a metal material. A light source module according to any one of claims 1 to 3.
5. The mounting substrate is provided with vias that are thermally bonded to the cooling member and penetrate the mounting substrate in the thickness direction. A light source module according to any one of claims 1 to 3.
6. The heating element further provides a second heat, which is different from the first heat, to the second LED package. The heating element is positioned on the second surface such that the second heat is transferred to the second LED package. A light source module according to any one of claims 1 to 3.
7. The heating element is a heater module. The light source module according to claim 6.
8. The heating element is At least one heat-generating component used as part of the aforementioned circuit component is a MOSFET, resistor, and winding. The heat generated when controlling the lighting of the first LED package and the second LED package is added to the second LED package as the second heat. The light source module according to claim 6.
9. The mounting substrate is provided with vias that are thermally bonded to the heating element and penetrate the mounting substrate in the thickness direction. The light source module according to claim 6.
10. A first LED package that emits first light, A second LED package that emits a second light different from the first light, and whose temperature-total luminous flux characteristic change rate is smaller than that of the first LED package, A circuit component for controlling the lighting of the first LED package and the second LED package, A mounting substrate having a first surface and a second surface facing each other along the thickness direction, wherein the first LED package and the second LED package are mounted on the first surface and the circuit components are mounted on the second surface, The second LED package is equipped with a heating element that applies heat to the LED package, The heating element is positioned on the second surface so that the heat is transferred to the second LED package. Light source module.
11. The heating element is a heater module. The light source module according to claim 10.
12. The heating element is At least one heat-generating component, such as a MOSFET, winding, and resistor, used as part of the aforementioned circuit components, The heat generated when controlling the lighting of the first LED package and the second LED package is applied to the second LED package. The light source module according to claim 10.
13. The mounting substrate is provided with vias that are thermally connected to the heating element and penetrate the first and second surfaces. A light source module according to any one of claims 10 to 12.
14. The aforementioned mounting substrate is made of a metal material. A light source module according to any one of claims 10 to 12.
15. A light source module according to claim 1 or claim 10, The fixture comprises a fixture body that houses the aforementioned light source module, Lighting fixtures.