Silicon photonic test insertion / removal module and silicon photonic test equipment

Abstract

This disclosure provides a silicon photonic test insertion / removal module and a silicon photonic test device. [Solution] A silicon photonic test insertion / extraction module comprising a carrier plate, a floating mover movably mounted on the carrier plate, a floating connector mounted within the floating mover, and a housing provided adjacent to the carrier plate and used to fix a silicon photonic device, wherein the facing connector is automatically aligned with the silicon photonic device connector of the silicon photonic device. It is also disclosed herein that the silicon photonic test equipment includes the silicon photonic test insertion / extraction module.

Description

Technical Field

[0001] The present invention relates to a silicon photonics test plug-in module. In particular, it relates to a silicon photonics test device having a silicon photonics test plug-in module.

Background Art

[0002] With the increasing progress of science and technology, silicon photonics has rapidly become the focus of the industry due to its characteristics such as high efficiency, low power consumption, and small size. Silicon photonics refers to a technology that incorporates photonic elements capable of modulating photons in a silicon-based semiconductor, enabling the simultaneous cooperation of the functions of an electronic integrated circuit (Electronic IC; EIC) and a photonic integrated circuit (Photonic IC; PIC) within a chip or a system.

[0003] Most of the currently mass-produced silicon photonics products are long-distance communication transceivers that include functional elements for the transmission / reception of electrical signals / optical signals and the conversion and processing of messages.

[0004] Currently, co-packaged optics (CPO: Co-Packaged Optics) can directly package a silicon chip for computing and an optical transceiver module with advanced packaging to reduce the element size, power consumption, and improve the optoelectronic conversion efficiency and accuracy.

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, when testing silicon photonic elements, optical connectors are used as the interface for the silicon photonic chips, and if there is a misalignment error in the butt joint of the optical connectors, it is likely to cause abnormalities or errors in the test. When testing silicon photonic chips in an unpackaged state, the connection between the optical connector and the processing integrated circuit is only made of optical fiber, and when performing pick-and-place testing of the elements, the optical fiber is easily pulled and damaged.

[0006] Developing solutions to address the shortcomings and inconveniences mentioned above is one of the critical issues that the relevant businesses cannot afford to delay. [Means for solving the problem]

[0007] One objective of the present invention is to provide a silicon photonic test insertion / extraction module that can stably and accurately align an optical connector and a corresponding connector, thereby improving the accuracy of silicon photonic element testing.

[0008] According to one embodiment disclosed in the present invention, a silicon photonic test insertion / extraction module includes a carrier plate, a floating mover movably mounted on the carrier plate, a floating connector mounted within the floating mover, and a housing adjacent to the carrier plate and used to fix a silicon photonic device, wherein the facing connector is automatically aligned with the silicon photonic device connector of the silicon photonic device.

[0009] In some embodiments, the floating mobile includes a mobile frame, a plurality of floating support devices provided within the mobile frame for clamping the opposing connector, and a plurality of elastic devices mounted between the mobile frame and the floating support devices so that the opposing connector can be displaced within the mobile frame.

[0010] In some embodiments, the floating mover further includes positioning pins, and the carrier plate includes positioning holes to rudimentarily align the opposing connector with the silicon photonic device connector.

[0011] In some embodiments, the housing includes a movable positioner to position a silicon photonic device on the housing.

[0012] In some embodiments, the housing seat further includes a third suction nozzle to secure a silicon photonic device on the housing seat.

[0013] In some embodiments, the accommodating seat further includes a first pressure sensor provided relative to the movable positioner, and the silicon photonic device is sandwiched between the movable positioner and the first pressure sensor.

[0014] In some embodiments, a second pressure sensor is further included, which is mounted between the carrier plate and the floating mover to measure the insertion force when the opposing connector is abutted against the silicon photonic device connector.

[0015] In some embodiments, the system comprises a silicon photonic test machine and a classifier electrically connected to the silicon photonic test machine, the classifier including a silicon photonic test insertion / extraction module, a test stand for testing silicon photonic devices, a loading module for accommodating a plurality of silicon photonic devices awaiting test, an ejection module for accommodating a plurality of tested silicon photonic devices, a silicon photonic pick-and-place device provided between the silicon photonic test insertion / extraction module, the loading module and the ejection module for moving the silicon photonic devices awaiting test and the tested silicon photonic devices, and a moving module to which the silicon photonic test insertion / extraction module is attached for moving the silicon photonic test insertion / extraction module and the silicon photonic devices on the silicon photonic test insertion / extraction module to the position on the test stand.

[0016] In some embodiments, the moving module includes a first moving device, a second moving device mounted perpendicular to the first moving device, and a third moving device mounted perpendicular to the first and second moving devices.

[0017] In some embodiments, the third mobile device includes a mobile device having two degrees of freedom.

[0018] In some embodiments, the silicon photonic test equipment further includes a first optical recognition device mounted on the side of the insertion module closer to the silicon photonic test insertion / removal module, which recognizes the orientation and identification code of the silicon photonic device.

[0019] In some embodiments, the silicon photonic test apparatus further includes a second optical recognition device mounted on a test stand that recognizes the structure and position of the silicon photonic apparatus before and after testing.

[0020] In some embodiments, the silicon photonic test equipment further includes a third optical recognition device provided adjacent to the discharge module for detecting the underside and four sides of the chip of the silicon photonic device.

[0021] In some embodiments, the silicon photonic test apparatus further includes a fourth optical recognition device and an optical recognition device holder for fixing the fourth optical recognition device to a third mobile device to detect the position of the test terminals of the test head of the test stand and to adjust the position of the silicon photonic apparatus.

[0022] In some embodiments, the silicon photonic test apparatus further includes a fifth optical recognition device located above the input module, which guides the silicon photonic pick-and-place device to attract the silicon photonic apparatus.

[0023] In some embodiments, the silicon photonic pick-and-place apparatus includes at least one adsorption nozzle for attracting the silicon photonic apparatus.

[0024] In some embodiments, the suction nozzle includes a first suction nozzle for sucking the silicon photonics device connector of the silicon photonics device and a second suction nozzle for sucking the silicon photonics chip of the silicon photonics device.

[0025] In some embodiments, the silicon photonics device further includes a substrate and an application-specific integrated circuit, and the application-specific integrated circuit and the silicon photonics chip are fixed on the substrate.

[0026] In some embodiments, the silicon photonics test plug-in module further includes a plurality of probes so as to be electrically connected to the application-specific integrated circuit.

[0027] In some embodiments, the silicon photonics test plug-in module further includes a pressing plate that is pressed against the silicon photonics device.

Advantages of the Invention

[0028] In short, the above silicon photonics test plug-in module and silicon photonics test equipment can conveniently and stably perform silicon photonics device tests. Whether before or after packaging of the silicon photonics device, they can accurately connect the optical connector and the mating connector of the silicon photonics device, reduce damage to the optical fiber, and improve the quality of the test.

Brief Description of the Drawings

[0029] To make the above and other objects, features, advantages and embodiments of the present disclosure clearer and more understandable, the description of the accompanying drawings is as follows. [Figure 1] It is a perspective schematic diagram of a silicon photonics test equipment according to an embodiment of the present invention. [Figure 2] It is a perspective schematic diagram of a silicon photonics test plug-in module of a silicon photonics test equipment according to an embodiment of the present invention. [Figure 3] This is a schematic front view of the floating mover of the silicon photonic test insertion / removal module of a silicon photonic test apparatus according to one embodiment of the present invention. [Figure 4] This is a schematic side view of some elements of a silicon photonic test apparatus according to one embodiment of the present invention. [Figure 5A] This is a schematic diagram of a silicon photonic test device according to one embodiment of the present invention, showing the test head and chip terminals before electrical connection. [Figure 5B] This is a schematic diagram showing the electrical connection between the test head and the chip terminal of a silicon photonic test device according to one embodiment of the present invention. [Figure 6] This is a schematic side view of a silicon photonic test insertion / removal module of a silicon photonic test apparatus according to one embodiment of the present invention. [Figure 7] This is a schematic side view of a silicon photonic test insertion / removal module of a silicon photonic test apparatus according to another embodiment of the present invention. [Figure 8] Figure 1 is a schematic plan view of the silicon photonic test equipment. [Modes for carrying out the invention]

[0030] The following examples will be described in detail with reference to the drawings, but the provided examples are not intended to limit the scope of the disclosure, and the descriptions of structure and operation are not intended to limit the order of their execution. Any structure in which elements are recombined, and any device having equivalent effects as a result, is included within the scope of the disclosure. The drawings are for illustrative purposes only and are not drawn to actual dimensions. For ease of understanding, identical or similar elements in the following description will be denoted by the same reference numeral.

[0031] Furthermore, unless otherwise specified, the terms used throughout the specification and claims have the general meanings used in the art and within the scope of the disclosed and specific content. Some of the terms used to describe this disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art regarding the description of this disclosure.

[0032] The terms "first," "second," etc., used herein do not specifically indicate order or rank, nor are they used to limit the present invention; they are merely used to distinguish between elements and operations described using the same technical terminology.

[0033] Furthermore, the terms "include," "equip," "possess," and "contain" used in this specification are all open terms, meaning that "include" does not necessarily mean "not limited to these."

[0034] Figure 1 is a schematic perspective view of the silicon photonic test equipment, Figure 2 is a schematic perspective view of the silicon photonic test insertion / removal module, Figure 3 is a schematic front view of the floating mover of the silicon photonic test insertion / removal module of the silicon photonic test equipment, Figure 4 is a schematic side view of a partial element of the silicon photonic test equipment, and Figures 5A and 5B are schematic diagrams of the silicon photonic test equipment before and after electrical connection between the test head and chip terminals. Figure 6 is a schematic side view of the silicon photonic test insertion / removal module of the silicon photonic test equipment according to one embodiment of the present invention, and Figure 7 is a schematic side view of the silicon photonic test insertion / removal module of the silicon photonic test equipment according to another embodiment of the present invention. Figure 8 is a schematic plan view of the silicon photonic test equipment of Figure 1.

[0035] Referring to Figures 1 and 8, as shown in the figures, the silicon photonic testing equipment 100 includes a silicon photonic tester 600 and a classifier 300. The classifier 300 is electrically connected to the silicon photonic tester 600.

[0036] The sorting machine 300 includes an input module 310, an output module 330, a silicon photonic pick-and-place device 700, a test stand 350, a silicon photonic test insertion / removal module 200, and a transfer module 340. The input module 310 is used to accommodate multiple silicon photonic devices 500 awaiting test, and the output module 330 is used to accommodate and sort multiple tested silicon photonic devices 500.

[0037] The silicon photonic pick-and-place device 700 is installed between the silicon photonic test insertion / removal module 200, the input module 310, and the discharge module 330, and is used to move the silicon photonic devices 500 awaiting test and the silicon photonic devices 500 that have been tested.

[0038] The test stand 350 is used to test the silicon photonic device 500, and the silicon photonic test insertion / removal module 200 houses the silicon photonic device 500 and is used to connect the silicon photonic device connector 510 of the silicon photonic device 500 to the corresponding connector 260 on the silicon photonic test insertion / removal module 200.

[0039] The silicon photonic test insertion module 200 is mounted on the mobile module 340. The mobile module 340 is used to move the silicon photonic test insertion module 200 and the silicon photonic device 500 mounted on the silicon photonic test insertion module 200 to the position on the test stand 350 in order to test the silicon photonic device 500.

[0040] The distance between the test stand 350, input module 310, and output module 330 of the sorting machine 300 is included, and by installing the transport module 340, the silicon photonic device 500 is transported and tested, enabling the testing and transport of different silicon photonic devices 500, and effectively improving testing efficiency.

[0041] The silicon photonic test machine 600 includes an optical signal generator and an optical switch, and transmits an optical signal to the silicon photonic device 500 via an optical fiber connection connector 260. The silicon photonic device 500 performs photoelectric conversion and then transmits the electrical signal to the test stand 350, which then sends it back to the silicon photonic test machine 600, where the silicon photonic device 500 makes a judgment on the test signal.

[0042] Referring further to Figure 2, as shown in the figure, the silicon photonic test insertion / removal module 200 includes a carrier plate 210, a floating mover 220, a facing connector 260, and a housing seat 230.

[0043] The floating mobile unit 220 is movably mounted on the carrier plate 210, and the opposing connector 260 is mounted floating within the floating mobile unit 220. The housing seat 230 is provided adjacent to the carrier plate 210 and is used to secure the silicon photonic device 500. The opposing connector 260 may automatically align with the silicon photonic device connector 510 of the silicon photonic device 500.

[0044] In some embodiments, the carrier plate 210 is provided with a groove 290, and the floating mobile 220 is movably mounted within the groove 290 of the carrier plate 210, but the present invention is not limited thereto. Furthermore, the housing seat 230 is provided with a housing groove 232, and the silicon photonic device 500 is fixed within the housing groove 232 of the housing seat 230, without departing from the spirit and scope of protection of the present invention.

[0045] In some embodiments, the carrier plate 210 and the seat 230 may be fabricated separately and then mounted, or they may be fabricated and molded from a single base material, neither of which deviates from the spirit and scope of protection of the present invention.

[0046] In some embodiments, referring simultaneously to Figure 3, the floating mobile 220 includes a movable outer frame 222, a plurality of floating support devices 224, and a plurality of elastic devices 226, as shown in the figure. The floating support devices 224 are provided within the movable outer frame 222 and are used to clamp the opposing connectors 260, and the elastic devices 226 are mounted between the movable outer frame 222 and the floating support devices 224 so that the opposing connectors 260 can be displaced within the movable outer frame 222. In some embodiments, the movable outer frame 222 of the floating mobile 220 further includes intermediate partition plates 223 that divide the movable outer frame 222 into a plurality of blocks, each to which a plurality of floating support devices 224 and a plurality of elastic devices 226 are mounted, and which further clamp a plurality of opposing connectors 260. The elastic device 226 is installed between the movable outer frame 222 or the intermediate partition plate 223 and the floating support device 224 so that multiple opposing connectors 260 can be displaced within the movable outer frame 222.

[0047] Preferably, the floating support device 224 surrounds the four sides of the opposing connector 260, and the elastic device 226 is provided around the four sides of the opposing connector 260 and is located between the movable outer frame 222 and the floating support device 224, effectively providing the clamping force necessary to clamp the opposing connector 260, allowing the opposing connector 260 to be displaced within the movable outer frame 222, utilizing the guide structure on the opposing connector 260 and the silicon photonic device connector 510, and further aligning the opposing connector 260 with the silicon photonic device connector 510, thereby improving the stability and accuracy of the connection.

[0048] Therefore, the floating support devices 224 and elastic devices 226 may be provided in proportion to the number of opposing connectors 260 so that the opposing connectors 260 can float independently, thereby providing a larger alignment range, which in turn allows the opposing connectors 260 to precisely abut the silicon photonic device connectors 510 of the silicon photonic device 500 and accommodates packaging errors of the silicon photonic device connectors 510.

[0049] In some embodiments, the floating mobile 220 further includes a positioning pin 270, and the carrier plate 210 includes a positioning hole 280, and as the floating mobile 220 moves to the housing seat 230 on the carrier plate 210, the positioning pin 270 is inserted into the positioning hole 280, thereby allowing the opposing connector 260 mounted inside the floating mobile 220 to be initially aligned with the silicon photonic device connector 510.

[0050] In some embodiments, the housing seat 230 includes a movable positioner 240 located on one side of the silicon photonic device 500, which lightly pushes the silicon photonic device 500 as it moves from the loading module 310 to the housing seat 230, pressing the silicon photonic device 500 into contact with the movable positioner 240, thereby positioning the silicon photonic device 500 in a specific position on the housing seat 230, preferably positioning the silicon photonic device 500 in the housing groove 232 of the housing seat 230, for example, positioning the silicon photonic device 500 on one side of the housing groove 232, and the movable positioner 240 can more effectively fix the position of the silicon photonic device 500 within the housing groove 232 by pressing the silicon photonic device 500 into contact with one side of the housing groove 232.

[0051] In some embodiments, the accommodating seat 230 further includes a first pressure sensor 250 provided for the movable positioner 240, and the silicon photonic device 500 is sandwiched between the movable positioner 240 and the first pressure sensor 250. The first pressure sensor 250 measures the force that the movable positioner 240 applies to the silicon photonic device 500 to confirm that the silicon photonic device 500 is sandwiched between the movable positioner 240 and the first pressure sensor 250, thereby preventing damage to the silicon photonic device 500 due to excessive pressure. In some embodiments, the pressure that the movable positioner 240 applies to the silicon photonic device 500 is less than about 20 grams, for example between 10 grams and 20 grams, but the present invention is not limited thereto.

[0052] In some embodiments, the receiving seat 230 further includes a third suction nozzle 490, which may be single-hole or porous in design, and which adsorbs and fixes the silicon photonic device 500 on the receiving seat 230, ensuring that the silicon photonic device 500 remains stably positioned on the receiving seat 230 without displacement when the silicon photonic device 500 is transported and tested between the input module 310, the discharge module 330, and the test stand 350.

[0053] In some embodiments, the silicon photonic test insertion / removal module 200 further includes a second pressure sensor 252 mounted between the carrier plate 210 and the floating mover 220 to measure the insertion force when the opposing connector 260 is abutted against the silicon photonic device connector 51. The insertion force is preferably about 20 to 30 Newtons (N), but the present invention is not limited thereto.

[0054] In some embodiments, the moving module 340 further includes a first mover 342, a second mover 344, and a third mover 346. Preferably, the first mover 342, the second mover 344, and the third mover 346 are arranged perpendicular to each other, but the present invention is not limited thereto.

[0055] In some embodiments, the first mover 342 and the second mover 344 are linear movers, and the third mover 346 is preferably a mover with two degrees of freedom, which can move along one vertical direction and rotate along one plane at the same time.

[0056] Referring to Figures 1 and 8, when multiple sets of the first mobile units 342 are provided, different sets of the first mobile units 342 can simultaneously transport and test the silicon photonic apparatus 500, significantly reducing the waiting time for transporting the silicon photonic apparatus 500 and improving test efficiency. In order to effectively improve the test efficiency of the silicon photonic apparatus 500 by setting the distance, the silicon photonic apparatus 500 can be pre-connected to the third mobile unit 346 using the connecting connector 260.

[0057] In one embodiment, when testing a silicon photonic apparatus 500 on a test stand 350, the first mover 342, second mover 344, and third mover 346 can simultaneously transport silicon photonic apparatus 500 that are not being tested from the input module 310 to the test stand 350 or the like to have them await testing, or transport tested silicon photonic apparatus 500 from the test stand 350 to the discharge module 330 for classification, thereby enabling simultaneous testing and transport of different silicon photonic apparatus 500 and significantly improving testing efficiency.

[0058] In some embodiments, the silicon photonic test apparatus 100 includes an optical recognition module 400, for example, a first optical recognition unit 410, a second optical recognition unit 420, a third optical recognition unit 430, a fourth optical recognition unit 440, and / or a fifth optical recognition unit 450, but the present invention is not limited thereto.

[0059] In some embodiments, the first optical recognition unit 410 is preferably mounted on the side of the insertion module 310 closer to the silicon photonic test insertion / removal module 200, recognizes the orientation and identification code of the silicon photonic device 500, and further determines whether the orientation of the silicon photonic device 500 is correct, and adjusts the position in which the silicon photonic device 500 is placed in the housing seat 230.

[0060] In some embodiments, the second optical recognition unit 420 is preferably mounted on the test stand 350 to recognize the structure and position of the silicon photonic apparatus 500 before and after testing, and further adjusts the position of the silicon photonic apparatus 500 using the movement module 340.

[0061] In some embodiments, the third optical recognition unit 430 is preferably located adjacent to the ejection module 330 and detects whether there are defects in the appearance of the bottom surface and four sides of the chip of the silicon photonic device 500.

[0062] In some embodiments, referring simultaneously to Figures 5A and 5B, the silicon photonic test apparatus 100 further includes an optical recognition holder 442. The optical recognition holder 442 fixes a fourth optical recognition 440 on a third mover 346 and moves the fourth optical recognition 440 and the third mover 346 synchronously. The fourth optical recognition 440 detects the position of the test terminal 354 of the test head 352 of the test stand 350 and is used to precisely adjust the position of the silicon photonic apparatus 500 to align the chip terminal 532 on the silicon photonic apparatus 500 with the test terminal 354 of the test head 352 of the test stand 350 that is being detected. Then, referring to Figure 5B, the third mover 346 moves upward to electrically connect the test head 352 to the chip terminal 532.

[0063] In some embodiments, referring to Figure 4, as shown in the figure, a fifth optical recognition unit 450 of the silicon photonic test apparatus 100 is preferably located above the loading module 310 and uses a suction nozzle to suck up the silicon photonic device 500, guides the silicon photonic pick-and-place device 700 to move the silicon photonic device 500 from the loading module 310 to the silicon photonic test insertion / removal module 200, and uses a third suction nozzle 490 to fix the silicon photonic device 500 on the housing seat 230.

[0064] In some embodiments, the suction nozzles of the silicon photonic pick-and-place device 700 may include one or more suction nozzles. If the silicon photonic device 500 is a packaged silicon photonic element, the silicon photonic device 500 may be picked up and moved using a single or multiple suction nozzles. If the silicon photonic device 500 is an unpackaged silicon photonic element, the silicon photonic pick-and-place device 700 may use multiple suction nozzles to pick up each component of the silicon photonic device 500. For example, the silicon photonic device 500 shown in Figure 4 includes at least one silicon photonic device connector 510, a silicon photonic chip 530, and an optical fiber 520. The optical fiber 520 is connected between the silicon photonic device connector 510 and the silicon photonic chip 530.

[0065] In some embodiments, the first suction nozzle 470 of the silicon photonic pick-and-place device 700 is used to pick up the silicon photonic device connector 510 of the silicon photonic device 500, and the second suction nozzle 480 of the silicon photonic pick-and-place device 700 is used to pick up the silicon photonic tip 530 of the silicon photonic device 500 and to stably aspirate the mobile silicon photonic device 500.

[0066] In some embodiments, referring simultaneously to Figures 5A and 5B, after the fourth optical recognition unit 440 detects the position image of the test terminal 354 of the test head 352 on the test stand 350, the third mobile unit 346 moves to the test stand 350, and the second optical recognition unit 420, which is provided on the test stand 350, takes an image of the contact packaging on the silicon photonic device 500 and matches the position of the test terminal 354 of the test head 352 and the contact packaging on the silicon photonic device 500 through calculations. At this time, the first mobile unit 342 provides, for example, movement alignment in the X direction, the second mobile unit 344 provides, for example, movement alignment in the Y direction, and the third mobile unit 346 provides, for example, rotation alignment on the XY plane. After the alignment on the XY plane is completed, the third mobile unit 346 adjusts the silicon photonic test insertion / removal module 200, for example, adjusting the height in the Z direction. In other words, the third mobile device 346 can provide degrees of freedom in the XY plane and the Z direction, and the silicon photonic test insertion / removal module 200 can simultaneously have degrees of freedom in the X, Y, Z, and XY planes, and furthermore, the chip terminal 532 can be aligned with the test terminal 354 to achieve accurate electrical connection.

[0067] Therefore, the contacts on the silicon photonic apparatus 500 employ microbump (μ-bump) packaging. Since the microbumps have a small surface area and are densely arranged, higher precision probe contact is required. However, because the cross-sectional area of ​​the probe on the test head 352 is minute, it can accurately contact the contacts on the silicon photonic apparatus 500. Compared with conventional test seats, the test head 352 of the present invention provides more accurate electrical connections and can further improve the accuracy of test results.

[0068] Referring simultaneously to Figure 6, as shown in the figure, the silicon photonic device 500 moves from the insertion module 310 to the silicon photonic test insertion / removal module 200, and after the contact connector 260 is abutted against the silicon photonic device connector 510, the moving module 340 moves the silicon photonic device 500, electrically connecting the chip terminal 532 on the silicon photonic device 500 to the test terminal 354 of the test head 352 on the test stand 350 (referring simultaneously to Figures 5A and 5B), and then transmits the test signal using the optical fiber 680, converts it to an electrical signal via the silicon photonic device 500 along the signal path 601, and transmits it to the silicon photonic test machine 600 via the chip terminal 532 on the silicon photonic device 500 to perform a signal test of the silicon photonic device 500.

[0069] Referring to Figure 7, in some embodiments, the silicon photonic apparatus 500 shown in the drawing further includes a silicon photonic apparatus connector 710, a silicon photonic chip 730, an application-specific integrated circuit (ASIC) 740, and a substrate 760. The application-specific integrated circuit 740 and the silicon photonic chip 730 are fixed on the substrate 760.

[0070] In some embodiments, the silicon photonic test insertion / extraction module 200 further includes a plurality of probes 770 and a retaining plate 750. The probes 770 are used to be electrically connected to an application-specific integrated circuit 740, and the retaining plate 750 is used to press the silicon photonic device 500 so that the recon photonic device 500 is stably electrically connected to the probes 770.

[0071] The silicon photonic device 500 moves from the insertion module 310 to the silicon photonic test insertion / removal module 200, and after the pairing connector 260 is matched with the silicon photonic device connector 710, a test signal is transmitted using the optical fiber 780, converted into an electrical signal via the silicon photonic device 500 along the signal path 701, and then transmitted to the silicon photonic test machine 600 via the probe 770 through the terminals on the substrate 760 of the silicon photonic device 500 to perform a signal test of the silicon photonic device 500.

[0072] In some embodiments, the silicon photonic device connector may be a multi-fiber push-on connector (MPO connector), or, for example, a multi-fiber termination push-on connector (MTP connector), neither of which deviates from the spirit and scope of the present invention.

[0073] In short, the silicon photonic test insertion / removal module and silicon photonic test equipment disclosed in the present invention enable convenient and stable testing of silicon photonic devices, accurately connecting the optical connector and the corresponding connector of the silicon photonic device, whether before or after packaging, reducing damage to the optical fiber, and improving the quality of the test.

[0074] While the embodiments of this disclosure are disclosed as described above, these embodiments are not intended to limit the disclosure and various modifications and alterations are possible without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure is limited to that set forth in the claims appended thereto. [Explanation of Symbols]

[0075] 100: Silicon Photonic Test Equipment 200: Silicon Photonic Test Insertion and Extraction Module 210: Carrier plate 220: Floating Transfer Device 222: Movable outer frame 223: Intermediate partition plate 224: Floating support device 226: Elastic device 230: Seat 232: Storage groove 240: Moving positioning device 250: First pressure sensor 252: Second pressure sensor 260: Pairing connector 270: Positioning pin 280: Positioning hole 290: Groove 300: Classifier 310: Input Module 330: Emission Module 340: Mobile module 342: First mobile device 344: Second mobile device 346: Third Mobile Unit 350: Test bench 352: Test head 354: Test terminal 400: Optical recognition module 410: 1st optical recognizer 420:Second optical recognizer 430: Third optical recognizer 440: 4th optical recognizer 442: Optical Recognition Holder 450: 5th optical recognizer 470: First suction nozzle 480: Second suction nozzle 490: Third suction nozzle 500: Silicon photonic device 510: Silicon Photonic Device Connector 520: Fiber Optic 530: Silicon Photonic Chip 532: Chip terminal 600: Silicon Photonic Test Machine 601: Signaling Path 680: Fiber Optic 700: Silicon Photonic Pick-and-Place Device 701: Signaling Path 710: Silicon Photonic Device Connector 730: Silicon Photonic Chip 740: Application-Specific Integrated Circuits 750: Pressing plate 760: Circuit board 770: probe 780: Fiber Optic

Claims

1. Carrier plate and A floating mover that is movably mounted on the carrier plate, A paired connector is mounted in a floating manner within the aforementioned floating mobile device, A housing seat provided adjacent to the carrier plate and used to fix the silicon photonic device, wherein the opposing connector is automatically aligned with the silicon photonic device connector of the silicon photonic device, A silicon photonic test insertion / extraction module including a silicon photonic test insertion / extraction module.

2. The floating mobile device is, A movable outer frame and A plurality of floating support devices are provided within the movable outer frame for clamping the opposing connector, Multiple elastic devices are attached between the movable outer frame and the multiple floating support devices so that the opposing connector can be displaced within the movable outer frame, A silicon photonic test insertion / extraction module according to claim 1, comprising:

3. The silicon photonic test insertion / extraction module according to claim 2, wherein the floating mover further includes a positioning pin, and the carrier plate includes a positioning hole for preliminary alignment of the opposing connector with the silicon photonic device connector.

4. The silicon photonic test insertion / extraction module according to claim 1, wherein the receiving seat includes a movable positioning device for positioning the silicon photonic device on the receiving seat.

5. The silicon photonic test insertion / extraction module according to claim 4, further comprising a third adsorption nozzle so as to fix the silicon photonic device on the receiving seat.

6. The silicon photonic test insertion / removal module according to claim 5, wherein the receiving seat further includes a first pressure sensor provided for the movable positioner, and the silicon photonic device is sandwiched between the movable positioner and the first pressure sensor.

7. The silicon photonic test insertion / extraction module according to claim 1, further comprising a second pressure sensor mounted between the carrier plate and the floating mover for measuring the insertion force when the opposing connector is abutted against the silicon photonic device connector.

8. Silicon photonic test machine and A classifier electrically connected to the aforementioned silicon photonic tester, Equipped with, The aforementioned classifier is A silicon photonic test insertion / removal module according to any one of claims 1 to 7, A test stand for testing the aforementioned silicon photonic device, A loading module for accommodating multiple silicon photonic devices awaiting testing, An ejection module for housing multiple tested silicon photonic devices, A silicon photonic pick-and-place device is provided between the silicon photonic test insertion / removal module, the input module, and the discharge module for moving the plurality of silicon photonic devices awaiting test and the plurality of tested silicon photonic devices, The silicon photonic test insertion module is attached, and a moving module is provided for moving the silicon photonic test insertion module and the silicon photonic device on the silicon photonic test insertion module to the position of the test stand. Silicon photonic test equipment, including...

9. The aforementioned mobile module is First mobile device, A second moving device is provided perpendicular to the first moving device, A third moving device is provided perpendicular to the first moving device and the second moving device, A silicon photonic test apparatus according to claim 8, including the following:

10. The silicon photonic test apparatus according to claim 9, wherein the third mobile device includes a mobile device having two degrees of freedom.

11. The silicon photonic test apparatus according to claim 10, further comprising a first optical recognition device attached to the side of the input module closest to the silicon photonic test insertion / removal module, which recognizes the orientation and identification code of the silicon photonic apparatus.

12. The silicon photonic testing apparatus according to claim 11, further comprising a second optical recognition device attached to the test stand for recognizing the structure and position of the silicon photonic apparatus before and after testing.

13. The silicon photonic test apparatus according to claim 12, further comprising a third optical recognition device provided adjacent to the discharge module for detecting the lower surface and four sides of the chip of the silicon photonic apparatus.

14. The fourth optical recognition device, The optical recognition holder is fixed to the third mobile device to detect the position of the test terminals of the test head on the test stand and to adjust the position of the silicon photonic device, The silicon photonic test apparatus according to claim 13, further comprising:

15. The silicon photonic testing apparatus according to claim 14, further comprising a fifth optical recognition device provided above the input module for guiding the silicon photonic pick-and-place device to attract the silicon photonic device.

16. The silicon photonic pick-and-place apparatus according to claim 15, comprising at least one adsorption nozzle for aspirating the silicon photonic apparatus.

17. The at least one adsorption nozzle is A first adsorption nozzle that adsorbs the silicon photonic device connector of the silicon photonic device, A second adsorption nozzle for adsorbing the silicon photonic chip of the silicon photonic apparatus, A silicon photonic test apparatus according to claim 16, including the following:

18. The silicon photonic test apparatus according to claim 17, further comprising a substrate and an application-specific integrated circuit, wherein the application-specific integrated circuit and the silicon photonic chip are fixed on the substrate.

19. The silicon photonic test apparatus according to claim 18, further comprising a plurality of probes to be electrically connected to the application-specific integrated circuit, the silicon photonic test insertion module.

20. The silicon photonic test apparatus according to claim 19, further comprising a pressing plate pressed onto the silicon photonic apparatus, the silicon photonic test insertion / removal module.

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