Endpoint detection system to enhance spectral data acquisition
The endpoint detection system with an optical bundle and achromatic lenses addresses precision and uniformity challenges in semiconductor manufacturing by enhancing spectral data acquisition, ensuring accurate substrate process monitoring and improved device quality.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2026-03-27
- Publication Date
- 2026-07-07
AI Technical Summary
Existing optical systems for endpoint control in semiconductor manufacturing fail to meet the increasing demands for precision and uniformity in substrate processes due to variations in etching speed and uniformity, leading to substandard devices.
An endpoint detection system with an optical bundle and collimator assembly that uses achromatic lenses to transmit and receive multiple incident and reflected light signals without beam splitters, enabling accurate spectral data acquisition for precise substrate profiling.
Enhances spectral data collection efficiency, reducing signal loss and providing more accurate substrate process monitoring, thereby improving device quality and uniformity.
Smart Images

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