Stable composition for catalytic deposition of silver
By using a stable composition containing metal salts, reducing agents, and stabilizers, the problems of stability and deposition quality of electroplated silver solutions were solved, achieving high-quality, low-cost electroplated silver deposition.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- スイストゥトゥウェルヴ·ソシエテ·アノニム
- Filing Date
- 2026-03-30
- Publication Date
- 2026-07-07
AI Technical Summary
In existing technologies, the stability of electroplating silver solutions is poor, resulting in uneven metal deposition and insufficient thickness, and the cost is high, making it difficult to achieve high-quality electroplating silver deposition.
Silver electroplating is performed using a stable composition containing metal salts, reducing agents, and stabilizers via a non-electrochemical method. Specific formulations and controlled parameters ensure long-term stability of the solution and high-quality deposition.
It achieves long-term stability and high-quality deposition of electroplated silver solution, with a deposition thickness of more than 1 micrometer, reduces costs, and improves the uniformity and thickness of deposition.
Smart Images

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